Debonding cleaning machine
CN309498994SActive Publication Date: 2025-09-16沈阳芯俐微电子设备有限公司
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Patent Information
- Application Number
- CN202530049031.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-24
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2040-01-24
Smart Images
Figure 000007_ABST
Abstract
1. The name of the product of this design: Debonding and cleaning machine. 2. Purpose of this design product: Used to complete fully automatic wafer debonding and cleaning operations in semiconductor advanced packaging processes. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: Stereoscopic drawing 1.
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