Heat dissipating back clasp (Y08)
CN309537116SActive Publication Date: 2025-10-10SHENZHEN YOUMI INTELLIGENT ELECTRONIC TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202430808299.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2039-12-19
Smart Images
Figure 000004_ABST
Abstract
1. The name of the design product: heat dissipation back clip (Y08). 2. The use of the design product: heat dissipation back clip for electronic products. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.
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