Solder joint inspection apparatus (LQ-TG001)

CN309594285SActive Publication Date: 2025-11-11DONGGUAN LEIQSUN LIGHT TECH
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Patent Information

Application Number
CN202530183929.1
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2025-04-08
Publication Date
2025-11-11
Estimated Expiration
2040-04-08

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Abstract

1. The name of the design product: solder joint detection equipment (LQ-TG001). 2. The use of the design product: for high-end precision connector chip / wire harness integrated board solder joint detection. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.
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