Abrasive pad
CN309604094SActive Publication Date: 2025-11-14SHENZHEN SHINYUE SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202530146192.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-24
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2040-03-24
Smart Images
Figure 000011_ABST
Abstract
1. Name of the product in this design: Grinding pad. 2. Purpose of this design: For grinding and processing semiconductor wafers. 3. The key design features of this product are the shape and distribution of the grooves. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
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