Solid state relay shield (SAP)
CN309792779SActive Publication Date: 2026-02-13JIANGSU GOLD ELECTRIC CONTROL TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202530432173.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-23
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2040-07-23
Smart Images
Figure 000005_ABST
Abstract
1. The name of the design product: solid state relay cover (SAP). 2. The use of the design product: for protecting and fixing signal line, protecting and fixing load line. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: design 1 top view. 5. Design 1 is designated as the basic design.
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