Bluetooth headset circuit board version (TL016)
CN309926985SActive Publication Date: 2026-04-17SHENZHEN XINYUNSEN IND CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHENZHEN XINYUNSEN IND CO LTD
- Filing Date
- 2025-09-15
- Publication Date
- 2026-04-17
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Figure 000001_ABST
Abstract
1. Name of the product in this design: Bluetooth headset circuit board (TL016). 2. Application of this design: Circuit board for headphones. 3. The key design feature of this product is its shape. 4. The picture or photo that best illustrates the design points: the main view of Suite 1. 5. As shown in the perspective drawings of kits 1 to 3, the left, right, and tilt views of kits 1 to 3 are omitted. 6. Other situations requiring explanation: Kit 1 is the headphone control mainboard, Kits 2 and 3 are the circuit boards for the left and right headphones, and Kit 4 is the pins for the left and right headphones.
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