Leadframe (SSOP-3L-16R)
CN309949659SActive Publication Date: 2026-04-28JIAXING YAXIN MICROELECTRONICS TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- JIAXING YAXIN MICROELECTRONICS TECH CO LTD
- Filing Date
- 2025-10-22
- Publication Date
- 2026-04-28
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Figure 000001_ABST
Abstract
1. The name of the design product: lead frame (SSOP-3L-16R). 2. The use of the design product: chip carrier for integrated circuits. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: design 1 front view. 5. The design product is a thin product, and the design 1 left view, design 1 right view, design 1 top view, design 1 bottom view are omitted; the design product is a thin product, and the design 2 left view, design 2 right view, design 2 top view, design 2 bottom view are omitted. 6. Design 1 is designated as the basic design.
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