Semiconductor refrigeration package
CN310167025SActive Publication Date: 2026-08-25SHENZHEN SIZHONG ZHIHUI TECH CO LTD
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Patent Information
- Application Number
- CN202630187257.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-20
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2041-04-20
Smart Images
Figure 000007_ABST
Abstract
1. Name of the designed product: semiconductor refrigeration package. 2. Use of the designed product: used for storing food, beverage, medicine, etc. 3. Design points of the designed product: in shape. 4. Picture or photo best indicating the design points: perspective view 1.
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