Electronic component and method for manufacturing an electronic component

Abstract

Electronic component (1) comprising a substrate (2) on which an organic electronic functional area (3) is arranged and a cover (4) extending over the organic electronic functional area, wherein the cover is connected to the substrate via an electrically conductive solder layer (5), wherein a) a bonding layer (6, 7) is arranged between the solder layer and the cover or b) between the solder layer and the substrate, to which the solder layer is connected, wherein the solder material of the solder layer (5) bonds better with the bonding layer than with the material offered on the side of the bonding layer (6, 7) facing away from the solder layer, and wherein the bonding layer (6, 7) extends over the organic electronic functional area (3).

Description

The present disclosure relates to an electronic component and a method for manufacturing an electronic component.The publication US 2010 / 0 225 231 A1 relates to a hermetic seal.The document EP 2 141 963 A1 discloses an organic EL screen and a method for producing the same.U.S. Pat. No. 7,078,726 B2 is directed to a seal of an electronic element using an absorbent layer for an adhesive line.The publication DE 10 2011 014 584 A1 discloses a connection carrier for semiconductor chips and a semiconductor component.The document WO 2010 / 125 494 A1 describes a circuit of an organic light-emitting diode with a cover.The publication DE 10 2011 005 612 A1 discloses an organic optoelectronic component and a method for producing an organic optoelectronic component.One object to be achieved is to specify a new, in particular improved, electronic component or a new, in particular improved, production method for an electronic component.This object is achieved by the subject matters of the independent claims. Further advantageous embodiments are evident from the following description and the dependent claims.An electronic component is specified, having a substrate on which an electronic functional region is arranged. The component further comprises a cover which extends over the organic, electronic functional region. The cover is connected to the substrate via an electrically conductive solder layer, which may contain or consist of a solder material. Features described below in connection with a solder layer can therefore also relate to an electrically conductive layer without this layer having to be embodied as a solder layer.By means of the solder layer, the substrate can be mechanically stable and preferably permanently connected to the cover. The cover can thus protect the functional region, optionally in combination with the substrate, for example from the action of force, gases or liquids. By means of an electrically conductive solder layer, the cover and the substrate can be joined to one another in a simplified, sealed manner, for example in comparison with electrically insulating glass solders which are often used for the joining of two glasses but require a complicated process procedure or are only usable for a few material combinations, or in comparison with plastic adhesive layers which regularly exhibit a lower tightness, in particular with respect to water, than electrically conductive solder layers.The penetration of foreign influences, such as gas, liquid or moisture, for example oxygen, sulfur or water, into the component in the connection region between the cover and substrate and the penetration thereof up to the electronic functional region can be reduced or avoided by means of the electrically conductive solder layer. The electronic functional region can thus be reliably protected and the risk of malfunctions of the component can be reduced. Electrically conductive solder materials, such as metal solders or metal alloy solders, are particularly suitable for forming a solder layer suitable for a tight connection of the substrate to the cover.Organic electronic functional regions are usually particularly sensitive to environmental influences and must be comparatively tightly encapsulated so that they do not degrade very quickly. For this purpose, a sealed connection, which is simple to realize, between the cover and the substrate, such as with the electrically conductive solder layer, is particularly advantageous.An electrically conductive solder layer additionally has the advantage that the layer can be involved in the electrical contacting of the component. Compared to electrically insulating connections, such as organic adhesives or glass solders, an electrically conductive solder layer can therefore assume a plurality of functions.Between the solder layer and the cover or between the solder layer and the substrate, a connection layer is arranged to which the solder layer is connected, for example directly. The connecting layer can in turn be connected, in particular directly, to the cover or the substrate. The connecting layer is expediently connected mechanically stably to the respective connection partner.By providing a connecting layer, a material can be offered for the solder layer, with which the solder material connects well. The degrees of freedom in the selection of material for the substrate or the cover are increased in this way, since it is not necessary to take care in the selection of material that the solder layer connects well to the cover or to the substrate, but rather the connecting layer can be provided for this purpose. Thus, for the solder material of the solder layer, a material may be selected which does not bond to the cover or the substrate as well as to the bond layer. The, preferably frame-like, connection region in which the solder layer connects the cover and the substrate can be defined via the connection layer.In a preferred configuration, the connection layer is arranged between the solder layer and the substrate and a further connection layer is arranged between the solder layer and the cover. The solder layer is expediently arranged between the connection layer and the further connection layer and is connected, preferably directly, to the respective connection layer.If two connecting layers are provided, the degrees of freedom increase both in the selection of the cover and in the selection of the substrate. At the same time, a solder layer which is particularly suitable for a tight connection can be used. For the cover and / or the substrate, for example, a flexible or rigid configuration, electrically conductive or electrically insulating material, each with a coating or without a coating, can be used. If only one connection layer is provided, the element arranged on the side of the solder layer facing away from the connection layer, for example the cover or the substrate, is preferably itself made of a material which connects well to the solder material of the solder layer.Embodiments further above and below with respect to the connection layer can also relate in particular to the further connection layer.In a preferred embodiment, the connecting layer is electrically conductive. The connection layer can be electrically conductively connected to the solder layer. The connection layer can be involved in particular in the electrical contacting of the component, for example, in that it forms a conductive connection between the solder layer and the functional region or is involved in such a connection.The solder material of the solder layer connects better to the connection layer than to the material which is offered on the side of the connection layer facing away from the solder layer, for example material of the cover or of the substrate.In a preferred embodiment, the material of the connection layer connects better to the material arranged on the side of the connection layer facing away from the solder layer than the material of the solder layer.In a preferred embodiment, the connecting layer is suitable as a wetting layer for the solder material of the solder layer.The wetting layer can be readily wettable with the solder material of the solder layer in liquid form, in particular better than the material offered on the side of the connecting layer facing away from the solder layer, such as, for example, that of the cover or of the substrate.According to a further embodiment, a method for producing an electrical component is specified.First, a substrate is provided on which an electronic functional region is arranged. Subsequently, a cover is provided. The cover and the substrate are arranged relative to each other such that the cover extends over the electronic functional region. Between the substrate and the cover, for example, next to the functional region, an intermediate space is formed in this case.A liquid solder material is then introduced into the intermediate space, so that the intermediate space is filled with liquid solder material in places, preferably only in places and / or circumferentially. The liquid solder material is preferably mechanically bonded both to the cover and to the substrate.Subsequently, the solder material may be cured, for example by cooling, to form a solder layer via which the cover is connected to the substrate. The component is then finished.A connecting layer can be provided on the substrate and / or the cover, which defines the wetting region with the liquid solder material. Preferably, the wetting area of the substrate or of the cover with the solder material is limited to the connecting layer. The bonding layers preferably overlap. Expediently, solder material is arranged continuously between the substrate and the cover only in the overlap region between the two connection layers.By means of the described method, the component described further above and below can be produced or produced. Features described further above and in the following for the component can accordingly also be used for the method and vice versa.If the solder material is already introduced in liquid form, steps for melting, for example by means of a laser, a solder material introduced in the solid state between two elements are no longer required. Separate curing steps, such as, for example, by means of irradiation, for example with laser radiation and / or UV radiation, which are often necessary in the case of adhesives, are also dispensed with, since the solder material cures in a simple manner by cooling. A separate post-treatment is not necessary. Furthermore, the liquid solder material can be applied locally, so that the components for the component are only heated locally. A hot process, in which the component has to be heated over a large area, such as for example during glass soldering, is not required, so that the risk of heat-induced damage to the electronic functional region is reduced.In comparison with plastic adhesives, a denser connection can be formed by means of the solder layer. In addition, electrically conductive solder materials, in particular metal solders or metal alloy solders, are generally more cost-effective than special plastic adhesives.In a preferred embodiment, the solder layer has one side surface, preferably two opposite side surfaces. A side surface may be remote from the electronic functional region. The other side surface may face the electronic functional region. The respective side surface can be curved, for example convexly curved when viewed from the outside. At least the outer side surface of the solder layer is preferably curved. The curvature can be defined by the surface tension of the liquid or liquefied solder material of the solder layer. Alternatively, the side surface-the outer or the inner-or both side surfaces can be concavely curved.In a preferred embodiment, the liquid solder material is introduced into the intermediate space, preferably between the two connecting layers, by means of bath soldering, selective wave soldering or flow soldering, or dip soldering.In one configuration, the solder material of the solder layer contains or consists of a metal or an alloy with one or more metals.In a preferred embodiment, the material of the connecting layer contains or consists of a metal or an alloy with one or more metals.In a preferred embodiment, the solder material is a soft solder. For example, the soft solder may contain tin and silver or tin and bismuth. Soft solders in general and among them in particular the stated solders are distinguished by a particularly low melting temperature. The risk of damage to the functional region caused by temperature during soldering is thus reduced.In a preferred embodiment, the solder material of the solder layer is selected from the following group: BiSn, AgSn.In a preferred embodiment, the connecting layer contains or consists of copper.In a preferred embodiment, the connecting layer is directly connected to the cover or the substrate.In a preferred embodiment, the solder layer is tightly connected to the connecting layer. The connection can be gas-tight and / or liquid-tight. The connection can be hermetically sealed. The hermetically sealed connection can be so tight that the permeability of the connection to water is less than 10 -1 g / (m 2 d), preferably less than 10 -3 g / (m 2 d), particularly preferably less than 10 -6 g / (m 2 d), wherein d represents a day. If a hermetic element or a hermetic tight connection is mentioned further above and below, this can mean that the respective element or the connection has a permeability for water which is lower than the above-mentioned value.In a preferred embodiment, the connecting layer is connected to the cover or the substrate in a sealed, preferably hermetically sealed manner.In a preferred configuration, the solder material of the solder layer and / or the material of the connection layer is selected such that it is suitable for forming at least a part of a preferably dense, in particular hermetically dense, encapsulation for the electronic functional region.In a preferred configuration, the electronic component has an encapsulation, preferably a hermetic encapsulation, of the functional region. The encapsulation may involve: the solder layer, the connection layer, the further connection layer, the cover and / or the substrate. The encapsulation can surround the functional region, preferably on all sides. The functional region is preferably arranged in an encapsulated interior space of the component defined by the encapsulation.In a preferred embodiment, the solder layer and / or the connecting layer surrounds the electronic functional region in a frame-like manner, in particular as viewed in plan view of the functional region. Forming an encapsulant is thus facilitated.In a preferred embodiment, the component has at least two electrodes for the electronic functional region. The electrodes can be part of the electronic functional area. The functional region can be electrically conductively connected to external connections of the component via the electrodes. The component can be electrically contacted, for example conductively connected to an external power source, via the external connections. The two electrodes are expediently separated from one another in such a way that no short circuit arises.In a preferred embodiment, the solder layer is electrically conductively connected to the electronic functional region. The solder layer can be electrically conductively connected to one of the electrodes. In this way, the external electrical contacting of the component can take place via the solder layer. The solder layer can serve as an external electrical terminal of the component.In a preferred embodiment, the solder layer is electrically insulated or separated from one of the electrodes. The solder layer may be insulated or separated from both electrodes or only from one of the electrodes.In a preferred configuration, the component has an electrically insulating layer. The electrical separation or electrical insulation of the solder layer from one of the electrodes can be achieved via the electrically insulating layer. The electrically insulating layer is expediently arranged between the solder layer and a conductor connected to this electrode. An electrical separation of the solder layer from one of the electrodes is particularly expedient if the solder layer is electrically conductively connected to the other electrode.In a preferred embodiment, the electrically insulating layer has anti-sticking properties with respect to the solder material of the solder layer, for example in its liquid form. The adhesion of, in particular liquid, solder material to the electrically insulating layer during the production of the component can thus be avoided. The solder material can thus be concentrated in a simplified manner to the desired region, for example the region of the connection layer.In a preferred configuration, the connection layer is arranged between the electrically insulating layer and the solder layer.In a preferred embodiment, the electrically insulating layer is embodied as a thin-film layer.In a preferred embodiment, the electrically insulating layer extends over the functional region. The electrically insulating layer can extend starting from the substrate along one side surface of the functional region over the side of the functional region facing away from the substrate back to the substrate along another side surface of the functional region. In particular, the electrically insulating layer can be part of an additional encapsulation for the electronic functional region. The functional region can thus already be protected by the electrically insulating layer before the formation and also precisely during the formation of the encapsulation of the component. For electrical contact formation to the functional region, the electrically insulating layer may be recessed.In a preferred configuration, the electrically insulating layer is arranged between the substrate and the solder layer. The connection layer is expediently arranged between the electrically insulating layer and the solder layer. The connection layer may be adjacent to the electrically insulating layer. Starting from a region between the solder layer and the substrate, the electrically insulating layer can extend over the functional region and extend again between the solder layer and the substrate on the side of the functional region facing away from the starting point.In a preferred embodiment, the solder layer is arranged next to the functional region, as viewed in a plan view of the electronic functional region. The risk of damage to the functional region by the solder layer, in particular when applying the solder material in the liquid phase, can thus be reduced.In a preferred configuration, the component is a, preferably organic, optoelectronic component, for example a light-emitting diode such as an organic light-emitting diode (OLED).The electronic functional region is an organic functional region. Organic materials are particularly sensitive to external influences such as gases or moisture, so that a solder layer for the connection between the cover and the substrate is particularly advantageous for this purpose. "Organic functional region" can mean that at least the material relevant to the electronic function of the component, for example a light-generating layer or layer sequence, contains or consists of an organic material. Not all materials in the functional area necessarily have to be organic. Electrodes can be provided which contain or consist of an inorganic material, for example ITO.In a preferred embodiment, in particular as viewed in plan view, in addition to a luminous surface of the component, that is to say the surface from which radiation exits, only one or preferably no electrical connection of the component is arranged.In a preferred embodiment, viewed in a plan view of the cover and / or the substrate, no electrical connection for electrically contacting the component is arranged on the cover or the substrate next to the cover or the substrate. The substrate and / or the cover may define the luminous surface of the component.In a preferred embodiment, the substrate and the cover have the same dimensions. In particular, the substrate and the cover may have the same size. In the case of optoelectronic components, in particular radiation-emitting components, a large luminous area without visible external contacting can thus be produced in a simplified manner. A plurality of components can also be arranged next to one another and form a continuous luminous surface without electrical connections or the like being visible on the side of the luminous surface.In a preferred embodiment, the solder layer protrudes laterally beyond the substrate and / or the cover. This is expedient in particular when the solder layer is involved in the electrical contacting of the component, since an electrical connection between these components can then be produced by mechanically contacting the solder layer with the solder layer of a further, preferably identically formed, electronic component.In a preferred embodiment, the connecting layer has a thickness of 10 nm or less.In a preferred embodiment, the connecting layer is significantly larger than the solder layer.The connection layer extends over the electronic functional region. The connecting layer can extend in particular starting from a region between the solder layer and the substrate along the substrate as far as over a side of the functional region facing away from the substrate and back again in the direction of the substrate as far as a point between the solder layer and the substrate. A complicated structuring of the connecting layer can thus be avoided. The connecting layer can be applied over the full surface or almost over the full surface.In a preferred embodiment, a free space is formed between the electronic functional region and the cover. The risk of damage to the functional region due to mechanical contact with the cover can thus be reduced. A protective layer, for example a mechanical protective layer, can be arranged between the free space and the electronic functional region. The protective layer can form the functional region.In a preferred embodiment, the cover is mechanically connected to the electronic functional region. In particular, at least in regions, no free space is then preferably present between the electronic functional region and the cover. Between the electronic functional region and the cover, an intermediate layer may be arranged, which is connected to the cover. Expediently, the intermediate layer is also connected to the functional region. The intermediate layer may be an adhesion promoting layer. During the production of the component, the adjustment of the substrate and the cover relative to one another can be simplified by means of the adhesion-promoting layer, since the substrate and the cover can already be fastened to one another in an adjusted manner via the adhesion-promoting layer and the encapsulation can subsequently be effected by means of the solder layer without the elements having to be held in a specific position and in an adjusted manner relative to one another. The manufacturing process can thus be simplified.Further features, advantages and functionalities emerge from the following description of the examples and exemplary embodiments in conjunction with the figures. FIG. 1A shows a schematic sectional illustration of an example of an electronic component and FIG. 1B shows the associated plan view of the component. FIGS. 2 and 4 to 6 each show a schematic sectional view of another example of an electronic component. FIGS. 3 and 3A each show a schematic sectional illustration of an embodiment of an electronic component. FIG. 7 shows an example of a method for producing an electronic component on the basis of a schematic view.Identical, similar and identically acting elements are provided with the same reference numerals in the figures. Furthermore, for improved understanding, individual elements may be represented with an exaggerated size relative to others, so that the representation in the figures is not necessarily to scale.FIG. 1A shows a schematic sectional illustration of an example of an electronic component. FIG. 1B shows the associated plan view of the component, in particular a plan view of the cover.The electronic component 1, for example an OLED, comprises a substrate 2. An electronic functional region 3 is arranged on the substrate 2, which functional region is expediently carried by the substrate 2. The functional region 3 can be an organic functional region. The electronic functional region 2 can be arranged on the substrate at a distance from an edge of the substrate, for example centrally. The functional region 3 is preferably spaced circumferentially from the edge of the substrate. The component 1 furthermore has a cover 4. The cover 4 extends over the electronic functional region 3. the cover 4 can protect the electronic functional region 3 from harmful external influences, such as from mechanical loading, from gases and / or from moisture. Alternatively or additionally, the substrate 2 can be designed to protect the functional region from harmful external influences, such as from mechanical loading, from gases and / or from moisture. The cover 4 preferably completely covers the electronic functional region 3. The cover 4 can also extend over a large area over the substrate. In particular, the cover 4 can have the same or approximately the same dimensions as the substrate 2. the substrate 2 and the cover 4 are mechanically stable, sealed, for example liquid-sealed or gas-tight, and preferably permanently connected to one another. A solder layer 5 is arranged between the cover and the substrate. The substrate 2 is connected to the cover 4 via the solder layer 5.A first connection layer 6 is arranged between the solder layer 5 and the substrate 2. The first connection layer 6 directly adjoins the substrate 2 and / or directly adjoins the solder layer 5. The connection layer 6 can produce a mechanically stable connection between the substrate 2 and the solder layer 5. The solder material of the solder layer preferably bonds to the material of the connecting layer better than to the material offered on the side of the substrate. By providing the connecting layer, the mechanical connection of the solder layer to the substrate can thus be improved. A "better connection" can comprise here, further above and below, that the still liquid solder material forms a lower contact angle when the connection layer is wetted than when the material offered on the side of the substrate is wetted. Wetting with the solder material can thus be improved by the connecting layer. Alternatively or additionally, the connection to the connection layer can be formed more quickly than to the material offered on the side of the substrate.Furthermore, a second connecting layer 7 is arranged between the cover 4 and the solder layer 5. As a result, the connection between the solder layer and the cover can be improved in accordance with the above explanations for connection to the substrate. The solder layer 5 and / or the cover 4 expediently directly adjoins the second connection layer 7.The solder layer 5, the first connection layer 6 and / or the second connection layer 7 can completely surround the electronic functional region 3 as viewed in plan view (see FIG. 1B ). The solder layer 5 can be arranged in particular next to the electronic functional region 3. A solder frame can thus run around the functional region.The solder layer 5 defines, together with the substrate 2 and the cover 4, an interior 8 of the component 1. the interior 8 can surround the electronic functional region 3 and in particular be arranged between the cover and the functional region 3 and / or between side surfaces of the functional region 3 and the solder layer 5.The electronic functional region 3 is encapsulated in a sealed manner, in particular hermetically sealed, with respect to the environment by the substrate, the cover 4, the solder layer 5, the first connection layer 6 and the second connection layer 7. The functional region 3 can thus be efficiently encapsulated against harmful external influences such as gases, for example oxygen or sulfur, or moisture, which could penetrate into the interior 8 without corresponding encapsulation. The respective materials or elements are expediently formed or selected for the encapsulation in such a way that a density, in particular hermetically sealed, encapsulation of the electronic functional region 3 is achieved. The respective element itself is expediently tight, in particular hermetically tight. The connection between the respective elements can also be tight, in particular hermetically tight. Organic functional regions are, for example, highly sensitive to moisture, such that a dense encapsulation of the functional region can significantly increase the lifetime of the component 1.By providing the respective connection layer 6, 7, the substrate 2 or the cover 4 can be selected comparatively freely without having to take account of the connection properties with the solder material of the solder layer 5. The good connection or wetting with the solder material of the solder layer 5 is ensured by the respective connection layer 6, 7. If the substrate or the cover already offers a material which connects well to the solder material of the solder layer 5, one or in the extreme case even both connection layers can be dispensed with. At least one connecting layer is advantageous since metals usually bond particularly well to solder materials, but metals often absorb radiation, which is naturally disadvantageous for an OLED in which radiation couples out through the substrate or the cover. Preferably, therefore, a connecting layer is provided on the side of the solder layer 5 facing an output coupling side of the component 1. If the component has two coupling-out sides, two connecting layers are advantageous.The substrate 2 and / or the cover 4 can be formed rigidly or flexibly, for example as a film, electrically conductive, for example made of conductive material such as a metal, or electrically insulating, for example made of electrically insulating material such as a plastic or a glass. For example, the substrate and / or the cover can comprise or consist of a metal foil, in particular a copper foil. The substrate 2 and / or the cover 4 can also contain or consist of a plastic film. The respective film, for example the plastic film, can be provided with an additional barrier layer, which preferably increases the tightness of the substrate 2 or of the cover 4. The substrate 2 and / or the cover 4 can also contain or consist of a glass layer.If substrate 2 and cover 4 are flexible, the entire component can be flexible, so that the possible uses of the component are increased. The component can be curved for the application, for example.For the solder material of the solder layer 5, soft solder materials are suitable, for example. In particular, the solder material of the solder layer 5 can be selected from the following group: AgSn, BiSn.Copper, for example, is suitable for the material of the respective connection layer 6, 7. Copper bonds particularly well to soft solders and in particular to the solders explicitly mentioned above.Furthermore, the respective connecting layer 6, 7 can be designed as a wetting layer for the solder material of the solder layer 5, so that liquid solder material wets the respective connecting layer 6, 7 well. This has advantages in applying the solder material from the liquid phase (compare in this connection the description of the associated method further below). If, for example, copper is offered to the solder material of the solder layer on the substrate side or on the cover side, a connecting layer can be dispensed with. For the soldering, bath soldering, wave soldering or flow soldering, in particular selective wave soldering, such as mini-flow soldering, or dip soldering, can be used.The respective bonding layer may have a thickness of 10 nm or less. Even such small thicknesses are sufficient for good bonding of the solder layer. The respective connecting layer can be applied, for example, by means of vapor deposition, for example by thermal evaporation in a vacuum, or sputtering.A width of the respective connecting layer 6, 7 and / or of the solder layer 5 is expediently selected such that the functional region 3 or the interior 8 is sealingly encapsulated. For example, the solder layer and / or the respective connection layer may have a width that is greater than 10 μm, for example up to 100 μm or more than 100 μm. Even with such small widths, a hermetic seal can be achieved if necessary. The width may be up to 1 mm or up to 2 mm.The solder layer 5 has one, preferably two, for example opposite, side surfaces 9. A side surface 9 is arranged on the side of the solder layer 5 facing away from the functional region 3. A further side surface 9 is arranged on the side of the solder layer 5 facing the functional region 3. The respective side surface can be curved as illustrated. The respective side surface is preferably convexly curved when viewed from the outside. The curvature of the side surface can be achieved by the introduction of the liquid solder material and in particular on account of the surface tension of the solder material.In the example shown, the first connection layer 6, the solder layer 5 and / or the second connection layer 7 is offset inwardly with respect to an edge of the substrate 2 and / or the cover 4. The risk of damage to the encapsulation by external action on the solder layer or the respective connection layer can thus be avoided or at least reduced.The electrical contacting of the component 1 is not always explicitly illustrated in the examples and exemplary embodiments for reasons of clarity. However, the component 1 expediently has two external electrical connections. Each of these connections can be electrically conductively connected to a separate electrode of the electronic functional region 3 (not explicitly illustrated). The conductive connection between the respective terminal and the functional region are expediently electrically separated from one another in order to avoid a short circuit. The component can be electrically contacted, for example conductively connected to an external power source, via the external connections. The two electrodes are expediently separated from one another in such a way that no short circuit arises.In one configuration, the solder layer 5 is electrically conductively connected to the electronic functional region. The solder layer 5 can be electrically conductively connected to one of the electrodes. In particular, the external electrical contacting of the component 1 can thus take place via the solder layer 5. The solder layer can serve in particular as an external electrical connection of the component.In one configuration, the solder layer 5 is electrically insulated or separated from one of the electrodes. The solder layer 5 may be insulated or separated from both electrodes.In one embodiment, an electrically conductive connection between an external terminal and one of the electrodes extends through the substrate 2, which electrode is expediently the one which is not connected to the solder layer 5 if such an electrode connected to the solder layer is provided. The extension of the conductive connection through the substrate 2 can be produced, for example, by selecting the substrate to be electrically conductive. In this case, the solder layer is expediently electrically insulated from the substrate, for example by an electrically insulating layer (see further below). Alternatively, an electrically insulating substrate 2 can be used and a potential feedthrough through the substrate can be provided, for example in the form of a via which is filled with conductive material which electrically contacts an electrode of the functional region arranged on the side of the substrate facing the electronic functional region. Furthermore, the electrically conductive connection to both electrodes can be made through the substrate 2. If the substrate 2 is conductive, a conductor material insulated from the substrate is expediently provided for the second electrode in a via through the substrate. In the case of an insulating substrate 2, two vias which are separate from one another can be provided. Furthermore, the electrically conductive connection to one of the electrodes between the solder layer 5 and the substrate 2 or the cover 4 can extend through the region of the solder layer, and preferably out of the encapsulated region of the component 1. As an alternative or in addition to the substrate 2, the contacting can of course also be effected through the cover 4, which for this purpose can have one or more electrical potential feedthroughs. The above explanations regarding the substrate 2 therefore apply correspondingly to the cover 4.FIG. 2 shows a representation of a further example of an electronic component on the basis of a schematic sectional view.The component 1 corresponds substantially to the component described in connection with FIGS. 1A and 1B. In contrast, in the example according to FIG. 2, an electrically insulating layer 10 is provided. The layer 10 is disposed between the first connection layer 6 and the substrate 2. Accordingly, the electrically insulating layer 10 may electrically separate the first connection layer 6 and the substrate 2 from each other. In the case that the connecting layer 6 or the solder layer 5 connected thereto and the substrate 2 are connected to different electrical potentials, a short circuit of the component can be avoided in this way. The electrically insulating layer 10 can therefore increase the degrees of freedom in the selection of the contacting for the electronic component. In particular, the solder layer 5, for example in the case of an electrically conductive substrate 2 or another electrically conductive element arranged on the side of the insulating layer 10 facing away from the solder layer 5, which element is at a different potential than the solder layer 5 during operation of the component 1, can be involved in the electrical contacting in a simplified manner.The electrically insulating layer 10 can extend over a large area, in particular over the entire surface, over the substrate 2. Preferably, the electrically insulating layer 10 extends not only between the first connection layer 6 and the substrate 2, but also over the electronic functional region 3 of the component 1. The electrically insulating layer 10 can accordingly also protect the functional region 3, namely even before the cover 4 and the solder layer 5 are provided. The electrically insulating layer 10 can accordingly provide a preencapsulation of the functional region 3.The electrically insulating layer 10 may contain, for example, a silicon oxide, a silicon nitride, an aluminum oxide, a zinc oxide, a zirconium oxide, a titanium oxide, a hafnium oxide, a lanthanum oxide or a tantalum oxide.The above-mentioned materials, in particular the oxides such as aluminum oxide, can have anti-adhesion properties with respect to the solder material of the solder layer 5, so that the electrically insulating layer 10 can advantageously be embodied as a solder anti-adhesion layer.The electrically insulating layer 10 can be formed as a thin-film encapsulation of the electronic functional region. It may have a thickness of 10 μm or less, preferably of 1 μm or less. The thin-film encapsulation can have at least one or more thin layers which are applied to the electrodes and the organic functional layer stack by means of a deposition method, preferably by means of a chemical vapor deposition method and / or an atomic layer deposition method. In the present case, an encapsulation formed as a thin-film encapsulation is understood to mean, for example, a device which is suitable for forming a barrier with respect to atmospheric substances, in particular with respect to moisture and oxygen and / or with respect to further damaging substances, such as corrosive gases, for example hydrogen sulfide. In other words, the thin-film encapsulation can be formed in such a way that it can be penetrated by atmospheric substances at most in very small proportions. This barrier effect can be generated during the thin-film encapsulation essentially by barrier layers and / or passivation layers embodied as thin layers, which are part of the encapsulation. The layers of the encapsulation generally have a thickness of less than or equal to a few 100 nm. In particular, the thin-film encapsulation can have or consist of thin layers which are responsible for the barrier effect of the encapsulation. The thin layers can be applied, for example, by means of an atomic layer deposition (ALD) method or molecular layer deposition (MLD) method. Suitable materials for the layers of the encapsulation are, for example, aluminum oxide, zinc oxide, zirconium oxide, titanium oxide, hafnium oxide, lanthanum oxide, tantalum oxide. The encapsulation preferably has a layer sequence with a plurality of the thin layers, each of which has a thickness between an atomic layer and a few 100 nm.For an electrical contact formation to the side of the electronic functional region 3 facing away from the substrate 2, the electrically insulating layer 10 may be recessed (not explicitly shown in FIG. 2 ). In the region in which the electrically insulating layer 10 is cut out, a connecting conductor layer can be arranged, which extends out of the cut out along the electrically insulating layer 10 to the solder layer 5 and is electrically conductively connected thereto, if appropriate via the first connecting layer 6. The solder layer 5 can thus be involved in the electrical contacting of the component 1 and possibly even form an external electrical connection of the component. Alternatively, the external electrical connection can be formed by means of the cover 4, which is electrically conductively connected to the solder layer 5, or by means of a suitable potential feedthrough through the cover. The other external terminal may be formed by the substrate 2, for example, by an electrically conductive substrate.FIG. 3 shows a further exemplary embodiment of an electronic component on the basis of a schematic sectional view.The component according to FIG. 3 corresponds substantially to that shown in FIG. 2. In contrast to this, the first connecting layer 6 extends over a large area, in particular over the full area, over the substrate 2. the connecting layer 6 can be formed in particular as a continuous layer in plan view, that is to say as a layer which is not recessed or not structured. The connection layer 6 can extend over the electronic functional region 3. Structuring or a structured application of the connecting layer, which may be necessary in other described exemplary embodiments, can thus be avoided.Alternatively or additionally, the second connecting layer 7 can be arranged on the cover over a large area, in particular over the entire area.If the electrically insulating layer 10 is recessed for contact formation with the electronic functional region 3, the connection layer 6 can extend into the recess and establish the electrical connection between the solder layer 5 and the electronic functional region 3. A corresponding exemplary embodiment is illustrated in FIG. 3A.FIG. 4 shows a further example of an electronic component on the basis of a schematic sectional view.The component corresponds substantially to the component 1 shown in FIG. 2, in contrast to which the first connection layer 6, the second connection layer 7 and / or the solder layer 5 is arranged closer to the edge of the substrate 2 and / or the cover 4. The outer side surface 9 of the solder layer 5 may protrude beyond the substrate 2 or the cover 4. The first connection layer, the second connection layer and the solder layer can be arranged in particular such that a connection region of the solder layer 5 with the respective connection layer 6, 7 or the cover 4 or the substrate 2 is arranged in the overlap region of the solder layer 5 with the substrate 2 or the cover 4, but the side surface 9 of the solder layer protrudes beyond a side surface of the substrate 2 and / or the cover 4 at least in regions.Furthermore, in contrast to the example according to FIG. 2, a mechanical protective layer 11 is provided. The protective layer 11 is arranged to mechanically protect the electronic functional region 3. Compared to the comparatively thin electrically insulating layer, this layer can be mechanically more stable, in particular rigid, and thus prevent mechanical forces acting on the electronic functional region in an improved manner. The mechanical protective layer 11 may be a plastic layer. The mechanical protective layer may be an epoxy or acrylate layer. The protective layer may be UV or thermally curable or cured. Two-component curing material systems and pressure-sensitive adhesives (PSA: Pressure Sensitive Adhesive) are also suitable for the protective layer.The protective layer 11 can protect the functional region 3 from a mechanical force effect, for example by undesired contact with the cover 4, for example during the production of the component 1 or during operation of the component.The protective layer 11 is expediently arranged in such a way that a free space is left between the cover and the side of the protective layer facing away from the electronic functional region 3. The mechanical protective layer 11 is expediently spaced apart from the solder layer 5, preferably circumferentially spaced apart. Any flexibility of the entire component 1 that may be present is thus also not impaired, or is only slightly impaired, by a rigid protective layer 11.FIG. 5 shows a further example of an electronic component on the basis of a schematic sectional view. The component according to FIG. 5 corresponds substantially to the component described in connection with FIG. 4. In contrast to the component according to FIG. 4, no mechanical protective layer is provided. Rather, an adhesion promoting layer 12 is provided. The adhesive layer 12 extends between the cover 4 and the substrate 2. This can facilitate the introduction of a liquid solder material between the connection layers 6, 7. The adhesion promoting layer 12 may be made of adhesive. The cover 4 and the substrate 2 can therefore already be mechanically connected to one another before the solder layer 5 is formed.The adhesion-promoting layer 12 can extend over the electronic functional region 3 and in particular preferably simultaneously serve as a mechanical protective layer for the electronic functional region. The adhesion promoting layer 12 expediently directly adjoins the cover 4. The interior space 8 can extend between the adhesion promoting layer 12 and the solder layer 5. The adhesion promoting layer 12 can be spaced apart circumferentially from the solder layer 5. The materials specified above for the protective layer 11 are also suitable for the adhesion-promoting layer 12.FIG. 6 shows a further example of an electronic component on the basis of a schematic sectional view. The component according to FIG. 6 corresponds substantially to the component described in connection with FIG. 5. In contrast to this, an external electrical terminal 13 is provided on the substrate 2, as viewed in a plan view of the substrate, alongside the cover 4, said external electrical terminal being electrically conductively connected to the side of the electronic functional region 3 facing the substrate 2. For this purpose, an electrically conductive layer 14 is provided, which is arranged between the electrically insulating layer 10 and the substrate 2 and between the substrate and the electronic functional region 3. The external electrical terminal 13 preferably extends through the electrically insulating layer 10 as far as the electrically conductive layer 14 and is connected thereto. The substrate 2 can be electrically insulating in the case shown, since it does not have to be used for contacting. If an electrically conductive substrate is used, an external connection is expediently provided on the side of the substrate facing away from the electronic functional region 3. The layer 14 can then be dispensed with. Likewise, the external terminal 13 arranged on the side of the substrate facing the cover is then expediently dispensed with, since the area of the component would then be unnecessarily enlarged and, in particular, the formation of a large-area homogeneous lighting device having a plurality of densely packed electronic components arranged next to one another would be made more difficult, since no radiation power escapes from the OLED components in the region in which the external terminal 13 is provided.FIG. 7 schematically illustrates an example of a method for producing an electronic component on the basis of a schematic sectional view. The following explanation is made with reference to a device according to FIG. 5 which is produced by means of the method. The method is, of course, suitable for all the components described herein.First, the substrate 2 is provided on which the electronic functional region 3 is arranged. The connection layer 6 is also already arranged on the substrate 2, and the electrically insulating layer 10 is arranged between the connection layer 6 and the substrate. Furthermore, a cover 4 is provided on which the second connection layer 7 is arranged. The cover and the substrate are arranged relative to each other such that the connection layer 6 and the second connection layer 7 face each other and overlap at least in areas. In this position, the cover and substrate are secured by means of the adhesive layer 12. The overlap region of the connection layers 6 and 7 preferably defines the connection region in which the cover and the substrate can be connected by means of a solder layer. A space 15 is formed between the bonding layers 6, 7. A liquid solder material, for example one of the materials mentioned, is introduced into the intermediate space 15. The liquid solder material 16 wets the connection layers 6, 7. adhesion of the solder material 16 to the electrically insulating layer 10 is advantageously avoided if it is formed as a solder anti-adhesion layer. After the liquid solder material has cooled and cured, it forms the solder layer 5 which connects the cover 4 and the substrate 2 to each other.In the present example, selective wave soldering, in particular mini wave soldering, is used for introducing the liquid solder material 16 into the intermediate space 15. A nozzle 17 can be provided in which an inflow channel 18 and an outflow channel 19 for guiding the liquid solder material 16 are defined. The inflow channel 18 is connected to a solder bath (not shown). Solder material from the solder bath is guided, for example pumped, in the direction indicated by the arrow in the inflow channel 18 in the direction of the nozzle end, so that a gush of liquid solder material is formed at the end of the nozzle 17, also called wave. The liquid solder material 16 at the end of the nozzle 17 can enter the intermediate space 15 and onto the connecting layers 6, 7 and wet them. Unused solder material 16 can be supplied to the solder bath again via the outflow channel 19. The nozzle 17 can be guided circumferentially around the substrate 2, so that a circumferential solder layer 5 is formed when the solder material 16 is cooled. Due to the comparatively small solder surge, only very locally heat is introduced into the connection partners and thus the risk of heat-induced damage to the functional region 3 is reduced.The connection of the substrate 2 to the cover 4 by means of solder material 16 introduced in liquid form into the connection region is advantageous compared to a method in which the solder material is introduced as a paste, since energy- and thus heat-intensive steps for melting the solder material are dispensed with.Instead of selective wave soldering, bath soldering or dip soldering can of course also be used for the connection.Features of various examples and exemplary embodiments can, of course, be combined with one another insofar as they are not mutually exclusive. Features from the general part of the description can also be used for the exemplary embodiments and vice versa.

Claims

Electronic component (1) having a substrate (2) on which an organic electronic functional region (3) is arranged, and a cover (4) which extends over the organic electronic functional region, wherein the cover is connected to the substrate via an electrically conductive solder layer (5), wherein a) a connection layer (6, 7) is arranged between the solder layer and the cover or b) a connection layer (6, 7) is arranged between the solder layer and the substrate, to which connection layer the solder layer is connected, wherein the solder material of the solder layer (5) connects better to the connection layer than to the material which is offered on the side of the connection layer (6, 7) remote from the solder layer, and wherein the connection layer (6, 7) extends over the organic electronic functional region (3).Electronic component according to Claim 1, in which the connection layer (6) is arranged between the solder layer (5) and the substrate (2), and a further connection layer (7) is arranged between the solder layer and the cover (4), wherein the solder layer is arranged between the two connection layers and is connected to the respective connection layer.Electronic component according to at least one of the preceding claims, in which the connecting layer (6, 7) is formed to be electrically conductive.Electronic component according to at least one of the preceding claims, in which the solder material of the solder layer (5) is a soft solder and in which the material of the connection layer (6, 7) is copper.Electronic component according to at least one of the preceding claims, in which the solder layer (5) is tightly connected to the connection layer (6, 7) and in which the connection layer is tightly connected to the cover (4) or the substrate (2).Electronic component according to at least one of the preceding claims, in which one, an arbitrarily selected plurality or the totality of the following elements is formed in such a way that the respective element, the plurality of elements or the totality of elements is part of an encapsulation of the organic, electronic functional region: solder layer (5), connection layer (6, 7), cover (4), substrate (2).Electronic component according to at least one of the preceding claims, in which the solder layer (5) is electrically conductively connected to the organic, electronic functional region (3).Electronic component according to at least one of the preceding claims, in which an electrically insulating layer (10) is arranged between the substrate (2) and the solder layer (5).Electronic component according to Claim 8, in which the electrically insulating layer (10) has anti-sticking properties with respect to the solder material of the solder layer (5).Electronic component according to Claim 8 or 9, in which the electrically insulating layer (10) extends over the organic, electronic functional region (3).Electronic component according to at least one of the preceding claims, in which the solder layer (5) is arranged next to the organic electronic functional region, as seen in a plan view of the organic electronic functional region (3).Electronic component according to at least one of the preceding claims, in which a free space (8) is formed between the organic, electronic functional region (3) and the cover (4), and a protective layer (11) is arranged between the free space and the organic, electronic functional region.Electronic component according to at least one of the preceding claims, in which an adhesion-promoting layer (12) is arranged between the organic, electronic functional region (3) and the cover (4), said adhesion-promoting layer being connected to the cover.Method for producing an electronic component (1) according to one of the preceding claims, comprising the steps of: - providing a substrate (2) on which an organic, electronic functional region (3) is arranged; - providing a cover (4); - arranging the cover and the substrate relative to one another in such a way that the cover extends over the organic, electronic functional region and a space (15) is formed between the substrate and the cover; - introducing a liquid solder material (16) into the space, such that the space is filled in places with liquid solder material; - curing the solder material in order to form a solder layer (5) via which the cover is connected to the substrate; - finishing the component.

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