Method for producing a circuit carrier and circuit carrier

Abstract

Method for producing a circuit carrier (1, 7) having at least one through-hole (4, 8) and electrical conductor tracks (3), comprising at least the steps: - Producing an electrically insulating substrate (2) by means of an injection mold using an injection molding process, wherein at least one metal sleeve (5, 9) whose axial length (l) corresponds to the thickness (d) of the substrate (2) to be produced is arranged in the injection mold such that a longitudinal axis (L) of the metal sleeve (5, 9) is arranged transversely to the substrate (2) to be produced and that axial contact ends (6, 10) of the metal sleeve (5, 9) are flush with opposite sides of the substrate (2) to be produced; and - Arranging the conductor tracks (3) on the substrate (2) such that the axial contact ends (6, 10) of the metal sleeve (5, 9) are physically and electrically connected to the conductor tracks (3).

Description

State of the art

[0001] From the utility model DE 20 2007 002 940 U1 an electronic component with an electrical circuit carrier and a body is known, wherein at least one rivet connection is formed between the electrical circuit carrier and the body.

[0002] US 2018 / 0295711 A1 discloses a method for manufacturing an electronic assembly, comprising obtaining a substrate film for the electronics, providing at least one electrical contact pad, and attaching an electrically conductive element. A material layer is then molded to embed the conductive element with a mold structure defining a cavity, with the conductive element extending through the cavity to contact an element on the opposite side.

[0003] JP S62179792 A discloses the production of a plastic circuit board by overmolding a conductive plastic wiring pattern into an insulating plastic substrate. The terminals of the electrical components, which are also made of conductive plastic, are connected to the wiring pattern and are exposed on the substrate surface.

[0004] DE 102012202342 A1 discloses a lighting device comprising a circuit board and at least one structural component attached thereto. The structural component is made of plastic or metal and is attached to the circuit board either by form-fitting or directly by material bonding. The connection between the circuit board and the structural component can be achieved by riveting or laser welding.

[0005] US 4591220 A discloses a multilayer printed circuit board comprising injection-molded substrate layers with mating interconnect pins and holes connected by an electrically insulating adhesive material. The electrical connection between the circuit layers is made at the interconnect pins, where the conductive materials of the traces extend through the component lead holes arranged axially in the pins and around the outside of the pins, where contact is made with the conductive material coating inside the holes.

[0006] US 5259110 A describes a multilayer microelectronic wiring module formed by laminating individual thermoplastic polymer layers formed by injection molding, compression molding, or other suitable molding techniques. Metal pieces for forming vias are inserted into the molded layers, creating an electrical connection between the top and bottom surfaces of the layers. Disclosure of the invention

[0007] The invention relates to a method for producing a circuit carrier having at least one through-hole and electrical conductor tracks, comprising at least the steps: - Producing an electrically insulating substrate by means of an injection molding tool using an injection molding process, wherein at least one metal sleeve, the axial length of which corresponds to the thickness of the substrate to be produced, is arranged in the injection molding tool such that a longitudinal axis of the metal sleeve is arranged transversely to the substrate to be produced and that axial contact ends of the metal sleeve are flush with opposite sides of the substrate to be produced; and - Arranging the conductor tracks on the substrate such that the axial contact ends of the metal sleeve are physically and electrically connected to the conductor tracks.

[0008] By connecting the metal sleeve to the substrate using an injection molding process, a very robust and permanent connection is created between these components of a circuit carrier. During the injection molding process, the metal sleeve is molded over with the respective injection molding material in a form-fitting manner. The arrangement of the conductor tracks on the substrate following the injection molding process can be carried out in a conventional manner, with the axial contact ends of the metal sleeve being electrically connected to the conductor tracks during the arrangement of the conductor tracks on the substrate. The longitudinal axis of the metal sleeve is preferably arranged perpendicular to the substrate to be produced. The metal sleeve forms a through-hole.

[0009] The method according to the invention is process-reliable and designed for large-scale industrial use, as no manual steps are required to arrange a via on the substrate. Instead, the arrangement of a via on the substrate can be carried out fully automatically and mechanically. In particular, the method according to the invention is suitable for the automated formation of an electrical contact between conductor tracks arranged on a substrate using an MID (molded interconnected device) process. Molded interconnect devices (injection-molded circuit carriers) are electronic components in which metallic conductor tracks are applied to injection-molded plastic carriers.The method according to the invention can be used in the automotive sector for the production of circuit carriers, in particular since a very long-lasting electrical contact between conductor tracks arranged on a substrate can be ensured by means of a through-hole produced according to the method according to the invention.

[0010] According to an advantageous embodiment, a metal sleeve is used that has a circumferential flange section on at least one axial contact end. This further improves the connection between the metal sleeve and the substrate, which has an advantageous effect on the durability of this connection. Preferably, each axial contact end of the metal sleeve has a circumferential flange section.

[0011] According to a further advantageous embodiment, the conductor tracks are arranged on the substrate using a plasma structuring process. However, other methods for arranging the conductor tracks on the substrate can also be used, with which electrical contact can be established, particularly in an automated manner, between the conductor tracks and the axial contact ends of the metal sleeve.

[0012] The invention further relates to a circuit carrier with an electrically insulating substrate, conductor tracks arranged on the substrate, and at least one via, characterized in that the via has a metal sleeve connected to the substrate using an injection molding process, the axial length of which corresponds to a thickness of the substrate, wherein a longitudinal axis of the metal sleeve is arranged transversely to the substrate, and wherein axial contact ends of the metal sleeve are flush with opposite sides of the substrate and are electrically conductively connected to the conductor tracks. The advantages mentioned above with reference to the method are correspondingly associated with this circuit carrier. The circuit carrier can be produced in particular according to the above-mentioned method.

[0013] According to an advantageous embodiment, the metal sleeve has a circumferential flange section on at least one axial contact end. This embodiment provides the advantages mentioned above with reference to the corresponding embodiment of the method.

[0014] In the following, the invention is explained by way of example with reference to the attached figures using preferred embodiments, wherein the features presented below can represent an aspect of the invention both individually and in various combinations with one another. Fig. 1: a schematic sectional view of an embodiment of a circuit carrier according to the invention and Fig. 2 a schematic sectional view of a further embodiment of a circuit carrier according to the invention.

[0015] Fig. 1 shows a schematic sectional view of an embodiment of a circuit carrier 1 according to the invention. The circuit carrier 1 comprises an electrically insulating substrate 2, conductor tracks 3 arranged on the substrate 2 and a via 4.

[0016] The via 4 has a metal sleeve 5 connected to the electrically insulating substrate 2 using an injection molding process. The axial length l of the metal sleeve 5 corresponds to the thickness d of the substrate 2. The longitudinal axis L of the metal sleeve 5 is arranged transversely to the substrate 2. The axial contact ends 5 of the metal sleeve 5 are flush with opposite sides of the substrate 2 to be produced and are electrically connected to the conductor tracks 3.

[0017] Fig.2 shows a schematic sectional view of a further embodiment of a circuit carrier 7 according to the invention. The circuit carrier 7 comprises an electrically insulating substrate 2, conductor tracks 3 arranged on the substrate 2 and a via 8.

[0018] The through-hole plating 8 has a metal sleeve 9 connected to the electrically insulating substrate 2 using an injection molding process. The axial length l of the metal sleeve 9 corresponds to the thickness d of the substrate 2. The longitudinal axis L of the metal sleeve 9 is arranged transversely to the substrate 2. The axial contact ends 10 of the metal sleeve 9 are flush with opposite sides of the substrate 2 and are electrically conductively connected to the conductor tracks 3. The metal sleeve 9 has a circumferential flange section 11 at each of the two axial contact ends 10.

Claims

[1] Method for producing a circuit carrier (1, 7) having at least one through-hole (4, 8) and electrical conductor tracks (3), comprising at least the steps: - Producing an electrically insulating substrate (2) by means of an injection mold using an injection molding process, wherein at least one metal sleeve (5, 9) whose axial length (l) corresponds to the thickness (d) of the substrate (2) to be produced is arranged in the injection mold such that a longitudinal axis (L) of the metal sleeve (5, 9) is arranged transversely to the substrate (2) to be produced and that axial contact ends (6, 10) of the metal sleeve (5, 9) are flush with opposite sides of the substrate (2) to be produced; and - Arranging the conductor tracks (3) on the substrate (2) such that the axial contact ends (6, 10) of the metal sleeve (5, 9) are physically and electrically connected to the conductor tracks (3). [2] Method according to claim 1, characterized by that a metal sleeve (5, 9) is used which has a circumferential flange section (11) on at least one axial contact end (6, 10). [3] Method according to claim 1 or 2, characterized by that the conductor tracks (3) are arranged on the substrate (2) using a plasma structuring process. [4] Circuit carrier (1, 7) with an electrically insulating substrate (2), conductor tracks (3) arranged on the substrate (2) and at least one through-contact (4, 8), characterized byin that the through-plating (4, 8) has a metal sleeve (5, 9) which is connected to the substrate (2) using an injection-molding process and whose axial length (l) corresponds to a thickness (d) of the substrate (2), wherein a longitudinal axis (L) of the metal sleeve (5, 9) is arranged transversely to the substrate (2), and wherein axial contact ends (6, 10) of the metal sleeve (5, 9) are flush with opposite sides of the substrate (2) and are electrically conductively connected to the conductor tracks (3). [5] Circuit carrier (1, 7) according to claim 4, characterized by that the metal sleeve (5, 9) has a circumferential flange section (11) on at least one axial contact end (6, 10).

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