Thermoelectric generator devices, each with a heat pipe assembly, and methods for operating the thermoelectric generator devices.

Abstract

Thermoelectric generator device comprising a thermoelectric module (32; 138; 214), a hot heat transfer device (34; 140; 140'; 216) and a cold heat transfer device (36; 142; 218) which are in thermal contact with the thermoelectric module (32; 138; 214), wherein the hot heat transfer device (34; 140; 140'; 216) and / or the cold heat transfer device (36; 142; 218) comprises a heat pipe device (178; 273) with at least one heat pipe, characterized in that a longitudinal axis (276a, 276b) of at least one heat pipe of the heat pipe device (178; 273) extends along a main flow direction (128, 130; 268, 272) of a flow path through the hot heat transfer device (34; 140; 140'; 216) and / or the medium flow guided through the cold heat transfer device (36; 142; 218) and that a longitudinal axis (276a, 276b) of at least one further heat pipe of the heat pipe device (178;273) transversely and in particular perpendicularly to a main flow direction (128, 130; 268, 272) of the medium flow guided through the hot heat transfer device (34; 140; 140'; 216) and / or through the cold heat transfer device (36; 142; 218).;

Description

[0001] The invention relates to thermoelectric generator devices, each comprising a thermoelectric module device, a hot heat transfer device and a cold heat transfer device, which are in thermal contact with the thermoelectric module device, wherein the hot heat transfer device and / or the cold heat transfer device comprises a heat pipe device with at least one heat pipe.

[0002] The invention further relates to methods for operating thermoelectric generator devices.

[0003] A thermoelectric generator device is known from DE 10 2010 042 603 A1. The thermoelectric generator device comprises a fluid-tight first housing, at least one fluid-tight second housing arranged within the first housing, wherein a first medium flow is conducted between the first housing and the at least one second housing, a fluid-tight third housing arranged within the at least one second housing, wherein a second medium flow is conducted in the third housing, and at least one thermoelectric module arranged between the at least one second housing and the third housing. The at least one thermoelectric module is in thermal contact with the second housing at one side and with the third housing at the other.

[0004] From DE 10 2013 112 911 A1, a thermoelectric generator device is known, comprising a housing and at least one combination with the components first cold heat exchanger, second cold heat exchanger, first thermoelectric layer, second thermoelectric layer and hot heat exchanger, wherein in the at least one combination the hot heat exchanger is arranged between the first thermoelectric layer and the second thermoelectric layer, the first cold heat exchanger is arranged at the first thermoelectric layer and the second cold heat exchanger is arranged at the second thermoelectric layer, and wherein the at least one combination is positioned in the housing.In the thermoelectric generator device, it is provided that a first inner surface of a first wall of the housing is in direct planar mechanical contact with the first cold heat exchanger of the at least one combination, or that the first wall forms a wall of the first cold heat exchanger; that a second inner surface of a second wall of the housing, opposite the first inner surface, is in direct planar mechanical contact with the second cold heat exchanger of the at least one combination or a further combination, or forms a wall of the second cold heat exchanger; and that the housing provides a contact pressure by means of positive locking at least at one operating point or operating point range of the thermoelectric generator device, which clamps the components of the at least one combination against each other and secures them in the housing.

[0005] From DE 10 2008 005 334 A1, a thermoelectric generator for an exhaust gas stream connected to an exhaust duct is known. The thermoelectric generator comprises at least one thermoelectric converter element, which converts thermal energy into electrical energy, and a heat exchanger element, which is located at least partially on a surface of the thermoelectric converter element and at least partially in the exhaust duct. At least one heat pipe is arranged in the exhaust duct, which conducts the thermal energy of the exhaust gas stream to the surface of the thermoelectric converter element.

[0006] A thermoelectric device is known from DE 10 2006 040 853 B3. The thermoelectric device comprises a thermoelectric generator which is thermally connected on one side to a heat source and on the other side to a heat sink. The thermoelectric device also includes means for temperature limiting the thermoelectric generator. These means comprise a first chamber filled with a fusible working medium, which is connected over a large area to the heat source or to a second chamber filled with a vaporizable working medium. This second chamber is connected to the thermoelectric generator on its side facing away from the first chamber. The working media have a predetermined melting point or boiling point to prevent permanent damage to the thermoelectric generator.The thermoelectric device is particularly suitable for motor vehicles with internal combustion engines.

[0007] From DE 10 2013 105 294 A1, a heat exchanger with at least one heat transfer element is known. The at least one heat transfer element is made of a metallic material and heat can be transferred through it. An electrical insulating layer is bonded to the at least one heat transfer element, through which a heat flow can pass.

[0008] From US patent 2007 / 0095379A1, a thermoelectric power supply unit is known which comprises at least one thermoelectric device. The device may further comprise several heat pipes which are arranged to focus thermal energy from a fluid flowing on a first side of the thermoelectric device.

[0009] From DE 10 2011 103 109 A1, an exhaust system for an internal combustion engine is known, which has a heat storage housing and an exhaust pipe, wherein heat transfer of the thermal energy contained in the exhaust gas takes place via heat pipes. The exhaust pipe is surrounded by the heat storage housing, wherein the heat pipes are arranged in the heat storage housing.

[0010] From US patent 2015 / 0083180A1, methods and devices for converting various forms of energy into thermal energy are known. The thermal energy can be stored and then converted into electrical energy.

[0011] From DE 10 2013 201 233 A1 a heat exchanger for utilizing waste heat from hot fluids for combined use with an energy converter is known, wherein energy can be transferred from a fluid contacting the heat exchanger to the heat exchanger and is directed from the fluid to at least one contact surface of the energy converter.

[0012] From DE 10 2010 054 640 A1, a heat exchanger for installation on a motor vehicle is known, which has a cooling channel, a heating channel and heat pipes. The heat pipes thermally couple the cooling channel to the heating channel, with a thermoelectric generator being arranged on at least one heat pipe.

[0013] The invention is based on the objective of increasing the efficiency of a thermoelectric generator device while improving heat transfer.

[0014] This problem is solved according to the invention in that a longitudinal axis of at least one heat pipe of the heat pipe device lies longitudinally to a main flow direction of a medium flow guided through the hot heat transfer device and / or through the cold heat transfer device, and that a longitudinal axis of at least one further heat pipe of the heat pipe device lies transversely and in particular perpendicularly to a main flow direction of the medium flow guided through the hot heat transfer device and / or through the cold heat transfer device.

[0015] The aforementioned problem is further solved by ensuring that at least one heat pipe is a flat heat pipe.

[0016] During operation of the thermoelectric generator device, the hot heat transfer unit is subjected to a flow of hot medium, such as exhaust gas from a combustion plant. The cold heat transfer unit is subjected to a flow of cold medium. Cooling water, for example, can be used as the cold medium. This creates a temperature gradient across the thermoelectric module, from which a usable electrical current is generated via the Seebeck effect.

[0017] The hot heat transfer device and / or the cold heat transfer device comprises a heat pipe assembly with at least one heat pipe. The heat pipe assembly allows heat to be efficiently transferred from the hot heat transfer device and / or the cold heat transfer device to the thermoelectric module assembly and / or removed from the thermoelectric module assembly. This enables improved heat transfer between the thermoelectric module assembly and / or the hot heat transfer device and / or the cold heat transfer device.

[0018] The heat pipe system enables heat transfer with a higher heat flux density between the thermoelectric module and / or the hot heat transfer unit and / or the cold heat transfer unit. This allows the thermoelectric generator to be designed more compactly and increases its efficiency.

[0019] Furthermore, the heat pipe system limits the heat flow to the thermoelectric module, as the design of the heat pipes restricts the heat flow to a defined maximum. This prevents damage to the thermoelectric module due to excessive heat flow, for example, in the event of excessive heat output from the hot heat transfer unit.

[0020] In particular, at least one heat pipe is a heat tube. This allows for the simple implementation of the thermoelectric generator device.

[0021] In one embodiment, the at least one heat pipe is a flat heat pipe, which in particular has a rectangular cross-sectional area. This allows the heat pipe assembly to be designed compactly. A simple design of the thermoelectric generator device is thus enabled.

[0022] In an alternative embodiment, a longitudinal axis of at least one heat pipe of the heat pipe assembly lies parallel to a main flow direction of a medium flow passing through the hot heat transfer device and / or the cold heat transfer device. This improves heat conduction in a direction parallel to the main flow direction of the medium flow. Temperature fluctuations in the direction parallel to the main flow direction of the medium flow are avoided or at least reduced.

[0023] The longitudinal axis of at least one additional heat pipe lies transversely and, in particular, perpendicularly to the main flow direction of a medium flow passing through the hot heat transfer device and / or the cold heat transfer device. This improves heat conduction transversely to the main flow direction of the medium flow. Temperature fluctuations in a direction transverse to the main flow direction of the medium flow are avoided or at least reduced.

[0024] In one embodiment, the heat pipe assembly comprises a heat-conducting medium that surrounds the at least one heat pipe. This allows for simple thermal contact between the at least one heat pipe and components of the hot heat transfer unit and / or the cold heat transfer unit.

[0025] The heat transfer medium is, for example, a metallic material.

[0026] It is advantageous if the heat transfer medium is a phase-change medium. During periods of high heat output from the hot medium flow passing through the heat transfer device, the phase-change medium can store heat and release the stored heat during periods of low heat output. This reduces fluctuations in the heat flow at the thermoelectric module and thus increases the efficiency of the thermoelectric generator.

[0027] In particular, the heat pipe assembly is arranged between a heat absorption surface and a heat emission surface of the hot heat transfer device. This allows the heat pipe assembly to be easily integrated into the hot heat transfer device. This enables the heat pipe assembly to be used as a heat flow concentrator, increasing the heat flux density of the heat flow out through the heat emission surface compared to the heat flux density of the heat flow in through the heat absorption surface. The thermoelectric generator can then be designed more compactly, thus increasing its efficiency.

[0028] According to the invention, a method for operating a thermoelectric generator device is provided in which a thermal contact is established between a thermoelectric module device, a hot heat transfer device and a cold heat transfer device, wherein heat is supplied to the hot heat transfer device via a heat absorption surface, a heat flux density of the heat is increased via a heat pipe device and the heat is transferred to the thermoelectric module device via a heat emission surface, and wherein the heat pipe device comprises at least one heat pipe.a longitudinal axis of at least one heat pipe of the heat pipe assembly lies longitudinally to a main flow direction of a medium flow guided through the hot heat transfer device and / or through the cold heat transfer device, and a longitudinal axis of at least one further heat pipe of the heat pipe assembly lies transversely and in particular perpendicularly to a main flow direction of the medium flow guided through the hot heat transfer device and / or through the cold heat transfer device.

[0029] The method according to the invention has the advantages already explained in connection with the thermoelectric generator device according to the invention.

[0030] In particular, the method according to the invention can be carried out with the thermoelectric generator device according to the invention.

[0031] Furthermore, according to the invention, a method for operating a thermoelectric generator is provided in which a thermal contact is established between a thermoelectric module device, a hot heat transfer device and a cold heat transfer device, wherein heat is supplied to the hot heat transfer device via a heat absorption surface, a heat flux density of the heat is increased via a heat pipe device and the heat is transferred to the thermoelectric module device via a heat emission surface, and wherein the heat pipe device has at least one heat pipe, and the at least one heat pipe is a flat heat pipe.

[0032] The following description of preferred embodiments, in conjunction with the drawings, serves to explain the invention in more detail.

[0033] They show: Fig. 1 a schematic representation of an embodiment of a heat flow concentrator device; Fig. 2 a schematic sectional view of an embodiment of a thermoelectric generator device; Fig. 3 a schematic sectional view of another embodiment of a thermoelectric generator device; Fig. 4 a schematic sectional view of section A of the thermoelectric generator device according to Fig. 3; Fig. 5 a schematic sectional view of another embodiment of a thermoelectric generator device; Fig. 6 a schematic sectional view of a section of an embodiment of a thermoelectric generator device with a heat pipe device; Fig. 7 a schematic sectional view of an embodiment of the heat pipe device according to Fig. 6; Fig. 8 a sectional view of the heat pipe system according to Fig. 7 along line 2-2; Fig. 9 a schematic sectional view of a further embodiment of the heat pipe device according to Fig. 6; Fig. 10 a sectional view of the heat pipe system according to Fig. 9 along line 4-4; Fig. 11 a schematic sectional view of yet another embodiment of the heat pipe device according to Fig. 6; Fig. 12 a sectional view of the heat pipe system according to Fig. 11 along line 6-6; and Fig. 13 a schematic sectional view of an embodiment of a thermoelectric module.

[0034] An exemplary embodiment of an idealized heat flow concentrator device, which is located in Fig. Figure 1, shown schematically and designated there with reference numeral 10, comprises a heat absorption device 12 and a heat emission device 14. The heat absorption device 12 and the heat emission device 14 are in thermal contact with a heat conduction device 16. The heat absorption device 12 has a heat absorption surface 18, through which heat is supplied to the heat flow concentrator device 10 by an incoming heat flow 20. The heat emission device 14 has a heat emission surface 22, through which the absorbed heat is released from the heat flow concentrator device 10 by an outgoing heat flow 24.

[0035] The incoming heat flow 20 is perpendicular to the heat absorption surface 18. The outgoing heat flow 24 is perpendicular to the heat emission surface 22.

[0036] Furthermore, the heat absorption surface 18 lies perpendicular to the heat emission surface 22.

[0037] The heat conducting device 16 establishes a thermal contact between the heat absorption device 12 and the heat emission device 14.

[0038] For this purpose, the heat conducting device 16 includes a heat conducting medium 26. The heat conducting medium 26 has a high thermal conductivity.

[0039] Heat is supplied to the heat flow concentrator 10 via the heat absorption surface 18 by the incoming heat flow 20. The heat absorption surface 18 has an area A1. The heat absorbed by the heat absorption surface 18 is conducted via the heat conduction device 16 to the heat emission surface 22 and released there by an outgoing heat flow 24. The heat emission surface 22 has an area A2, which is smaller than the area A1.

[0040] The incoming heat flux density Q1 of the incoming heat flux 20 is the quotient of the incoming heat flux 20 and the area A1 of the heat absorption surface 18. The outgoing heat flux density Q2 of the outgoing heat flux 24 is the quotient of the outgoing heat flux 24 and the area A2 of the heat emission surface 22.

[0041] In an ideal heat flow concentrator device 10, the incoming heat flow 20 equals the outgoing heat flow 24. Since the area of ​​the heat dissipation surface 22 is smaller than the area of ​​the heat absorption surface 18, the heat flow concentrator device 10 acts as a "concentrator" for the incoming heat flow 20. The outgoing heat flux density Q2 is increased compared to the incoming heat flux density Q1.

[0042] An embodiment of a thermoelectric generator device is described in Fig. Figure 2 shows the thermoelectric generator device 30 schematically in a sectional view and is labelled therein as 30. The thermoelectric generator device 30 comprises a thermoelectric module 32, a hot heat transfer device 34, and a cold heat transfer device 36.

[0043] The thermoelectric module arrangement 32 comprises a first thermoelectric module layer 38 and a second thermoelectric module layer 40.

[0044] The cold heat transfer device 36 comprises a first cold heat exchanger 42 and a second cold heat exchanger 44.

[0045] The hot heat transfer device 34 is located between the first thermoelectric layer 38 and the second thermoelectric layer 40, wherein the first thermoelectric layer 38 thermally contacts the hot heat exchanger 34, and the second thermoelectric layer 40 thermally contacts the hot heat exchanger 34. The component combination of the first thermoelectric layer 38, the hot heat transfer device 34, and the second thermoelectric layer 40 is located between the first cold heat exchanger 42 and the second cold heat exchanger 44. The first cold heat exchanger 42 thermally contacts the first thermoelectric layer 38, and the second cold heat exchanger 44 thermally contacts the second thermoelectric layer 40.

[0046] The hot heat transfer device 34 has a heat flow concentrator device 46, which comprises the following components of the hot heat transfer device 34: a heat absorption device 48, a heat emission device 50 and a heat conduction device 52.

[0047] The heat conducting device 52 establishes a thermal contact between the heat absorption device 48 and the heat emission device 50.

[0048] The heat absorption device 48 has a heat absorption housing 54. The heat absorption housing 54 has a first wall 56 and a second wall 58 opposite the first wall 56. The first wall 56 and the second wall 58 are connected to each other via a first transverse wall 60 and a second transverse wall 62 spaced apart from the first transverse wall 60. A receiving chamber 64 is formed in the heat absorption housing 54 between the first wall 56, the second wall 58, the first transverse wall 60, and the second transverse wall 62.

[0049] The first wall 56 and the second wall 58 are parallel to each other. The first transverse wall 60 and the second transverse wall 62 are also parallel to each other.

[0050] The first wall 56 and the second wall 58 are each in thermal contact with the first transverse wall 60 and the second transverse wall 62.

[0051] A surface-enhancing structure 66, through which a flow can pass, is arranged in the receiving chamber 64. The surface-enhancing structure 66 has flow-through spaces and, in particular, flow-through channels 68, through which a hot medium flow 74 passes.

[0052] The surface-enhancing structure 66 is in thermal contact with the first wall 56 and the second wall 58. The surface-enhancing structure 66 is made of a material with high thermal conductivity, and in particular, metallic thermal conductivity. It is specifically made of a metallic material.

[0053] The surface area enlargement structure 66 comprises a rib structure 70, which has spaced-apart ribs 72. Flow channels 68 are formed between the ribs 72. The ribs 72 lie parallel to the first transverse wall 60 and the second transverse wall 62.

[0054] The hot medium flow 74 is guided through the heat absorption housing 54. The heat absorption housing 54 can absorb heat via this hot medium flow 74.

[0055] The first wall 56, the second wall 58, the first transverse wall 60, and the second transverse wall 62 each have an inner surface 76a, 76b, 76c, 76d. The surfaces of the inner surfaces 76a, 76b, 76c, 76d, together with the surface of the surface-enhancing structure 66, form a heat-absorbing surface 78. The hot medium flow 74 can transfer heat to the heat-absorbing housing 54 via the heat-absorbing surface 78.

[0056] The first wall 56, the second wall 58, the first transverse wall 60, and the second transverse wall 62 each have an outer surface 80a, 80b, 80c, 80d, which is in thermal contact with the heat conducting device 52. The heat-absorbing housing 54 can transfer heat to the heat conducting device 52 via the surfaces of the outer surfaces 80a, 80b, 80c, 80d.

[0057] The heat dissipation device 50 of the hot heat transfer device 34 has a heat dissipation housing 82. The heat absorption housing 54 is arranged inside the heat dissipation housing 82. Between the heat dissipation housing 82 and the heat absorption housing 54 is a receiving chamber 84 in which the heat conduction device 52 is arranged.

[0058] The heat conducting device 52 thermally contacts the heat dissipation housing 82 and the heat absorption housing 54. The heat conducting device 52 comprises a thermal conducting medium 86. The thermal conducting medium 86 is a material with high, and in particular metallic, thermal conductivity. It is, in particular, a phase-change medium. The thermal conducting medium 86 establishes thermal contact between the heat dissipation housing 82 and the heat absorption housing 54.

[0059] The heat dissipation housing 82 has a first wall 88 and a second wall 90 opposite the first wall 88. The first wall 88 and the second wall 90 are connected to each other via a first transverse wall 92 and a second transverse wall 94 spaced apart from the first transverse wall 92.

[0060] The first wall 88 and the second wall 90 are parallel to each other. The first transverse wall 92 and the second transverse wall 94 are also parallel to each other. Furthermore, the first wall 88 and the second wall 90 of the heat dissipation housing 82 are parallel to the first wall 56 and the second wall 58 of the heat absorption housing 54. The first transverse wall 92 and the second transverse wall 94 of the heat dissipation housing 82 are also parallel to the first transverse wall 60 and the second transverse wall 62 of the heat absorption housing 54.

[0061] The first wall 88, the second wall 90, the first transverse wall 92 and the second transverse wall 94 of the heat dissipation housing 82 form an outer boundary of the receiving space 84. The first wall 56, the second wall 58, the first transverse wall 60 and the second transverse wall 62 of the heat receiving housing 54 form an inner boundary of the receiving space 84.

[0062] The first transverse wall 92 and the second transverse wall 96 are made of a material with high, and in particular metallic, thermal conductivity.

[0063] The first transverse wall 92 establishes a thermal contact between the hot heat transfer device 34 and the first thermoelectric module layer 38. The second transverse wall 94 establishes a thermal contact between the hot heat transfer device 34 and the second thermoelectric module layer 40.

[0064] The first transverse wall 92 and the second transverse wall 94 each have an outer surface 96a, 96b. The thermoelectric module 32 is arranged on these outer surfaces 96a, 96b. The surfaces of the outer surfaces 96a, 96b form a heat dissipation surface 98 of the heat absorption device 48.

[0065] Heat can be transferred from the hot heat transfer device 34 to the thermoelectric module device 32 via the heat emission surface 98.

[0066] The first cold heat exchanger 42 of the cold heat transfer device 36 has a cold heat exchanger housing 100, wherein a receiving chamber 102 is formed inside the cold heat exchanger housing 100. A cold medium flow 104 is guided through this receiving chamber 102.

[0067] The cold heat exchanger housing 100 has a wall 106 which establishes thermal contact between the first cold heat exchanger 42 and the first thermoelectric module layer 38. The first wall 106 is made of a material with high, and in particular metallic, thermal conductivity.

[0068] The second cold heat exchanger 44 is fundamentally identical in design to the first cold heat exchanger 42. The second cold heat exchanger 44 has a cold heat exchanger housing 108 with a wall 110. The wall 110 establishes thermal contact between the second cold heat exchanger 44 and the second thermoelectric module layer 40.

[0069] The first thermoelectric layer 38 can transfer heat to the first cold heat exchanger 42 via the wall 106. The second thermoelectric layer 40 can transfer heat to the second cold heat exchanger 44 via the wall 110.

[0070] Walls 106 and 110 are parallel to each other. Walls 106 and 110 are also parallel to the first transverse wall 92 and the second transverse wall 94 of the heat dissipation housing 82.

[0071] Walls 106, 110, as well as the first transverse wall 92 and the second transverse wall 94, have flat sides.

[0072] The first thermoelectric layer 38, which is arranged between the first cold heat exchanger 42 and the hot heat transfer device 34, has a plurality of thermoelectric modules 112 (compare Fig. 13) on. In one embodiment, a thermoelectric module 112 comprises a first housing element 114 and an opposing second housing element 116. The first housing element 114 makes surface contact with the wall 106 of the first cold heat exchanger 42. The second housing element 116 makes surface contact with the first transverse wall 92 of the heat dissipation housing 82. The first housing element 114 and the second housing element 116 are made of a material with high, and in particular metallic, thermal conductivity.

[0073] The first housing element 114 and the second housing element 116 have flat sides.

[0074] The first housing element 114 and the second housing element 116 are made of an electrically insulating material or an electrical insulation is arranged in an interior space 118 between the first housing element 114 and the second housing element 116.

[0075] For example, in the interior space 118, p-conductors 120 and n-conductors 122 are positioned alternately, with adjacent p-conductors 120 and n-conductors 122 being electrically connected to each other via an electrically conductive bridge 124. The bridge 124 is, for example, made of a metallic material.

[0076] During operation, a heat flow 126 is generated between the hot heat transfer device 34 and the first cold heat exchanger 42. This heat flow 126 is present at the thermoelectric module 112 of the first thermoelectric layer 38. The heat flow 126 is also present between the first housing element 114 and the second housing element 116. A usable electrical current can be generated from this via the Seebeck effect.

[0077] The first thermoelectric layer 38 comprises a plurality of thermoelectric modules 112, which are connected in series. The second thermoelectric layer 40 is basically constructed in the same way as the first thermoelectric layer 38.

[0078] The thermoelectric generator device 30 functions as follows: During operation of the thermoelectric generator device 30, the hot heat transfer device 34 is supplied with a hot medium flow 74, such as the exhaust gas of a combustion plant. A main flow direction 128 of the hot medium flow 74 when passing through the heat absorption device 48 and when passing through the flow channels 68 is parallel to the inner sides 76a, 76b, 76c, 76d of the heat absorption housing 54.

[0079] For example, a main flow direction 130 of the cold medium flow 104, which flows through the first cold heat exchanger 42 and the second cold heat exchanger 44, is antiparallel to the main flow direction 128 of the hot medium flow.

[0080] The flow of hot medium 74 through the hot heat transfer device 34 and the flow of cold medium 104 through the cold heat transfer device 36 creates a temperature gradient across the thermoelectric module 32, which in turn generates the heat flow 126. This, in turn, generates a usable electrical current via the Seebeck effect.

[0081] The heat flow concentrator device 46 of the hot heat transfer device 34 has essentially the same operating principle as the heat flow concentrator device 10 described above. Heat is transferred from the hot medium flow 74 to the heat absorption surface 78 of the heat absorption device 48, resulting in an incoming heat flow 132. This incoming heat flow 132 is guided via the heat conduction device 52 to the heat emission device 50. At the heat emission device 50, the heat is transferred via an outgoing heat flow 134 to the thermoelectric module device 32.

[0082] The area of ​​the heat absorption surface 78 is larger than the area of ​​the heat emission surface 98. This increases the heat flux density of the outgoing heat flow 134 compared to the heat flux density of the incoming heat flow 132.

[0083] The heat flow concentrator device 46 enables the hot heat transfer device 34 to absorb heat via the heat absorption surface 78 and to release the heat via the heat emission surface 98, which has a smaller area than the heat absorption surface 78. This reduces the manufacturing effort of the thermoelectric generator device 30, since the spatial dimensions of the components cold heat transfer device 36, thermoelectric module device 32, and heat emission device 50 can be significantly smaller than the spatial dimensions of the heat absorption device 48.

[0084] The heat flow concentrator 46 also increases the heat flux density of the heat flow 126 at the thermoelectric modules 112 of the thermoelectric module assembly 32. Due to the higher heat flux density, the same heat flow can be conveyed through the thermoelectric module assembly 32 with smaller spatial dimensions. This increases the efficiency of the thermoelectric generator assembly 30.

[0085] Due to heat transfer from the hot medium flow 74 to the heat absorption device 48, a temperature drop occurs along the main flow direction 128 of the hot medium flow 74. This temperature drop can be significantly reduced by the thermal conductivity medium 86 of the heat conduction device 52. The thermal conductivity medium 86 largely compensates for temperature differences along the main flow direction 128. This further increases the efficiency of the thermoelectric generator device 30. Furthermore, the manufacturing effort of the thermoelectric generator device 30 is significantly reduced, as no temperature-specific structural modifications to components of the thermoelectric generator device 30 are required along the main flow direction 128.

[0086] The hot medium flow 74 is, for example, an exhaust gas flow from an internal combustion engine. In this case, the hot medium flow 74 can be subject to temperature fluctuations over time. This causes the incoming heat flow 132 to increase or decrease depending on the time. This, in turn, leads to fluctuations in the heat flow 126 at the thermoelectric modules 112 of the thermoelectric module assembly 32. However, the optimal efficiency of the thermoelectric module assembly 32 is only achieved, due to its design, if the heat flow 126 has a certain magnitude. Therefore, if the heat flow 126 is too high or too low, the efficiency of the thermoelectric generator assembly 30 decreases. Furthermore, if the heat flow 126 is too high, for example, caused by an excessively hot hot medium flow 74, the maximum operating temperature of the thermoelectric module assembly 32 may be exceeded.

[0087] By using a phase-change medium as the heat transfer medium 86 of the heat conduction device 52, fluctuations in the heat output of the hot heat transfer device 34 to the thermoelectric module device 32 are reduced. The phase-change medium can store heat during periods of high heat output from the hot medium flow 74 and release the stored heat again during periods of low heat output from the hot medium flow 74. In the case of a fluctuating temperature of the hot medium flow 74, this increases the efficiency of the thermoelectric generator device 30.

[0088] Another embodiment of a thermoelectric generator device 136 ( Fig. 3) comprises a thermoelectric module 138, a hot heat transfer unit 140, and a cold heat transfer unit 142. The thermoelectric module 138 has a first thermoelectric layer 144 and a second thermoelectric layer 146. The cold heat transfer unit 142 comprises a first cold heat exchanger 148 and a second cold heat exchanger 150.

[0089] The hot heat transfer device 140 is located between the first thermoelectric layer 144 and the second thermoelectric layer 146, wherein the first thermoelectric layer 144 and the second thermoelectric layer 146 are in thermal contact with the hot heat transfer device 140. The component combination of the first thermoelectric layer 144, the hot heat transfer device 140, and the second thermoelectric layer 146 is in turn located between the first cold heat exchanger 148 and the second cold heat exchanger 150. The first cold heat exchanger 148 is in thermal contact with the first thermoelectric layer 144, and the second cold heat exchanger 150 is in thermal contact with the second thermoelectric layer 146.

[0090] The cold heat transfer device 142 is basically designed the same as the cold heat transfer device 36. Likewise, the thermoelectric module device 138 is basically designed the same as the thermoelectric module device 32.

[0091] The hot heat transfer device 140 comprises a heat flow concentrator device 152, which includes a heat absorption device 154, a heat emission device 156, and a heat conduction device 158. The heat flow concentrator device 152 has essentially the same operating principle as the heat flow concentrator device 10 according to Fig. 1 on.

[0092] The heat absorption device 154 comprises several heat absorption housings 160a, 160b, 160c. The heat absorption housings 160a, 160b, 160c are basically each designed identically to the heat absorption housing 54 according to [reference to relevant document]. Fig. 2.

[0093] The heat absorption housing 160a has walls 162a, 162b and transverse walls 164a, 164b. The heat absorption housing 160b has walls 162c, 162d and transverse walls 164c, 164d. The heat absorption housing 160c has walls 162e, 162f and transverse walls 164e, 164f.

[0094] The heat absorption housings 160a, 160b, 160c each have a heat absorption surface 166a, 166b, 166c, as explained in connection with the heat absorption housing 54. A heat absorption surface 168 of the heat absorption device 154 corresponds to the totality of all heat absorption surfaces 166a, 166b, 166c of the heat absorption housings 160a, 160b, 160c.

[0095] The hot heat transfer device 140 comprises a heat dissipation housing 170, which is essentially identical in design to the heat dissipation housing 82. Within the heat dissipation housing 170, the heat receiving housings 160a, 160b, 160c are arranged at intervals from one another. A receiving chamber 172 is formed between the heat dissipation housing 170 and the heat receiving housings 160a, 160b, 160c.

[0096] The heat dissipation housing 170 comprises a first transverse wall 174 and a second transverse wall 176.

[0097] The transverse walls 164a, 164b, 164c, 164d, 164e, 164f of the heat absorption housings 160a, 160b, 160c are parallel to the first transverse wall 174 and the second transverse wall 176.

[0098] The receiving chamber 172 is airtight and fluid-tight. The heat conduction device 158, which includes a heat pipe assembly 178, is arranged within this chamber. This assembly establishes thermal contact between the heat receiving housings 160a, 160b, 160c and the heat dissipation housing 170. For this purpose, the heat pipe assembly 178 comprises flat heat pipes 180a, 180b, 180c, 180d, 180e, 180f. The flat heat pipes 180a, 180c, 180e are arranged between the transverse walls 164a, 164c, 164e of the heat receiving housings 160a, 160b, 160c and the first transverse wall 174. The flat heat pipes 180b, 180d, 180f are arranged between the transverse walls 164b, 164d, 164e and the second transverse wall 176 of the heat dissipation housing 170.

[0099] The flat heat pipe 180a includes a working medium 182 ( Fig. 4), which can be evaporated by heat absorption at a hot side 184 and condensed by heat release at a cold side 186. The flat heat pipe 180a further comprises a return structure 188 through which working medium 182, condensed at the cold side 186, can be returned to the hot side 184. The return structure 188 is, in particular, a capillary structure through which condensed working medium 182 can be returned to the hot side 184 via capillary action. At the hot side 184, the returned condensed working medium 182 can be evaporated again by heat absorption.

[0100] During operation of the thermoelectric generator device 136, the heat-absorbing housings 160a, 160b, 160c are heated by a hot medium flow 190. Consequently, the transverse walls 164a, 164b, 164c, 164d, 164e, 164f of the heat-dissipating housings 160a, 160b, 160c are heated. The hot sides 184 of the flat heat pipes 180a, 180b, 180c, 180d, 180e, 180f are therefore located in a region close to the transverse walls 164a, 164b, 164c, 164d, 164e, 164f. The heat absorbed by the working medium 182 at the hot sides 184 is transferred to the cold sides 186. The cold sides 186 are each formed in an area near the first transverse wall 174 or near the second transverse wall 176. In this way, thermal contact is established between the heat-absorbing housings 160a, 160b, 160c and the first transverse wall 174 and the second transverse wall 176 of the heat-dissipating housing 170.

[0101] It is intended that the heat absorbed by the hot heat transfer device 140 is transferred via the heat emission device 156 to the thermoelectric module device 138.

[0102] The heat dissipation device 156 comprises the first transverse wall 174 and the second transverse wall 176, through whose outer surfaces 192a, 192b heat is dissipated to the thermoelectric module device 138. The surfaces of the outer surfaces 192a, 192b form a heat dissipation surface 194 of the heat dissipation device 156.

[0103] In the embodiment of a thermoelectric generator device described below, those components that are identical to components of the thermoelectric generator device 136 of the embodiment described above are designated with the same reference numerals. With regard to these components, the description of the embodiment described above also applies to the embodiment described below.

[0104] In one embodiment of a thermoelectric generator device 136', it is provided that a heat dissipation device 156' of a hot heat transfer device 140' comprises a heat storage device 196 ( Fig. 5) The heat storage device 196 comprises a first heat storage element 198 and a second heat storage element 200. The first heat storage element 198 is arranged between the first transverse wall 174 and the first thermoelectric layer 144. The second heat storage element 200 is arranged between the second transverse wall 176 and the second thermoelectric layer 146. The first heat storage element 198 is in thermal contact with the first transverse wall 174 and the first thermoelectric layer 144. The second heat storage element 200 is in thermal contact with the second transverse wall 176 and the second thermoelectric layer 146.

[0105] The first heat storage element 198 has a first housing element 202 and an opposing second housing element 204. The first housing element 202 makes surface contact with a housing element 206 of the first thermoelectric layer 144. The second housing element 204 makes surface contact with the first transverse wall 174 of the heat dissipation housing 170. The first housing element 202 and the second housing element 204 are made of a material with high, and in particular metallic, thermal conductivity.

[0106] The first housing element 202 and the second housing element 204 have flat sides.

[0107] The first heat storage element 198 has a thermal conductivity medium 208, which is arranged between the first housing element 202 and the second housing element 204 and establishes thermal contact between the first housing element 202 and the second housing element 204. The thermal conductivity medium 208 is, in particular, a phase-change medium. It can store heat during periods of high heat output from the hot medium flow 190 and release this heat again during periods of low heat output from the hot medium flow 190.

[0108] The second heat storage unit 200 is basically constructed in the same way as the first heat storage unit 198.

[0109] The thermoelectric generator device 136, 136' has essentially the same operating principle as the thermoelectric generator device 30. During operation of the thermoelectric generator device 136, 136', heat is absorbed in the hot heat transfer device 140 via the hot medium flow 190 and the heat is conducted via the flat heat pipes 180a, 180b, 180c, 180d, 180e, 180f to the heat dissipation surface 194.

[0110] The flat heat pipes 180a, 180b, 180c, 180d, 180e, 180f facilitate heat transfer between the heat absorption surface 168 and the heat emission surface 194 with an increased heat flux density.

[0111] The flat heat pipes 180a, 180b, 180c, 180d, 180e, 180f limit the heat flow at the thermoelectric module device 138, since, due to their design, only a defined maximum heat flow can be transferred through the flat heat pipes 180a, 180b, 180c, 180d, 180e, 180f.

[0112] The heat storage device 196 of the thermoelectric generator device 136' with the heat transfer medium 208 reduces fluctuations in the heat flow at the thermoelectric generator device 136 over time. This results in the advantages described in connection with the heat transfer medium 86 of the thermoelectric generator device 30.

[0113] Another embodiment of a thermoelectric generator device is described section by section in Fig. Figure 6 shows and is designated there as 212. The thermoelectric generator device 212 comprises a thermoelectric module 214, a hot heat transfer device 216, and a cold heat transfer device 218. The thermoelectric module 214 has a first thermoelectric layer 220 and a second thermoelectric layer 222. The cold heat transfer device 218 comprises a first cold heat exchanger 224 and a second cold heat exchanger 226.

[0114] The hot heat transfer device 216 is located between the first thermoelectric layer 220 and the second thermoelectric layer 222, wherein the first thermoelectric layer 220 thermally contacts the hot heat transfer device 216 and the second thermoelectric layer 222 thermally contacts the hot heat transfer device 216. The component combination of the first thermoelectric layer 220, the hot heat transfer device 216, and the second thermoelectric layer 222 is in turn located between the first cold heat exchanger 224 and the second cold heat exchanger 226. The first cold heat exchanger 224 thermally contacts the first thermoelectric layer 220, and the second cold heat exchanger 226 thermally contacts the second thermoelectric layer 222.

[0115] The thermoelectric generator device 212 can comprise several combinations consisting of a thermoelectric module 214, a hot heat transfer device 216, and a cold heat transfer device 218, which are arranged sequentially and are in thermal contact with one another. For example, the first cold heat exchanger 224 is in thermal contact with both the first thermoelectric layer 220 of a first combination 228 and a second thermoelectric layer 222' of a second combination. The second cold heat exchanger 226 is in thermal contact with both the second thermoelectric layer 222 of the first combination 228 and a first thermoelectric layer 220' of a third combination.

[0116] The hot heat transfer device 216 comprises a heat flow concentrator device 230, which includes a heat absorption device 232, a heat emission device 234 and a heat conduction device 236.

[0117] The heat absorption device 232 comprises a heat absorption housing 238, which is basically designed the same way as the heat absorption housing 54 according to Fig. 2. The heat absorption housing 238 comprises a first wall 240 and a second wall 242 opposite the first wall 240.

[0118] The heat conducting device 236 comprises a first heat conducting layer 244 and a second heat conducting layer 246. The first heat conducting layer 244 is located between the first wall 240 and the first thermoelectric layer 220. The second heat conducting layer 246 is located between the second wall 242 and the second thermoelectric layer 222.

[0119] The first thermally conductive layer 244 establishes a thermal contact between the first wall 240 and the first thermoelectric layer 220. The second thermally conductive layer 246 establishes a thermal contact between the second wall 242 and the second thermoelectric layer 222.

[0120] The first thermal conductivity layer 244 has a thermal conductivity layer housing 248 (compare Fig. 7 and Fig. 8) The heat-conducting coating housing 248 has a first wall 250 and a second wall 252 opposite the first wall 250. The first wall 250 and the second wall 252 are connected to each other by spaced-apart transverse walls 254 and 256. A receiving space 258 is formed in the heat-conducting coating housing 248 between the first wall 250, the second wall 252 and the transverse walls 254, 256.

[0121] The first wall 250 and the second wall 252 are parallel to each other. The transverse walls 254 and 256 are also parallel to each other.

[0122] The first wall 250 and the second wall 252 are made of a material with high, and in particular metallic, thermal capacity.

[0123] A thermal conductivity medium 259 is arranged in the receiving chamber 258. The thermal conductivity medium 259 is made of a material with high, and in particular metallic, thermal conductivity. It is, for example, a metal material. It thermally contacts the first wall 250 and the second wall 252.

[0124] The first wall 250 has an outer surface 260a and the second wall 252 has an outer surface 260b.

[0125] The outer surface 260b of the second wall 252 makes surface contact with the first wall 240 of the heat-absorbing housing 238. A section of the outer surface 260a of the first wall 250 makes surface contact with a housing element 262 of the first thermoelectric layer 220.

[0126] The second thermal conducting layer 246 is designed in the same way as the first thermal conducting layer 244.

[0127] A cross-section of the thermoelectric generator device 212 has a transverse axis 264, which runs perpendicular to the first wall 240 and the second wall 242 of the heat absorption housing 238 ( Fig. 6) The transverse axis 264 also runs perpendicular to a hot medium flow 266 with a main flow direction 268, which is guided through the heat absorption housing 238, and to a cold medium flow 270 with a main flow direction 272, which is guided through the first cold heat exchanger 224 and the second cold heat exchanger 226.

[0128] For example, the main flow direction 268 is antiparallel to the main flow direction 272.

[0129] The cross-section of the heat-conducting layer housing 248 extends in particular axially symmetrically to the transverse axis 264. The first thermoelectric layer 220 and the second thermoelectric layer 222 as well as the first cold heat exchanger 224 and the second cold heat exchanger 226 also extend axially symmetrically to the transverse axis 264 in the cross-section.

[0130] The heat-absorbing housing 238 and the heat-conducting layer housing 248 have an identical cross-sectional length L1 perpendicular to the transverse axis 264. The thermoelectric layers 220, 222 and the cold heat exchangers 224, 226 have a cross-sectional length L2 perpendicular to the transverse axis 264, which is smaller than the cross-sectional length L1.

[0131] The first heat-conducting layer 244 comprises a heat pipe assembly 273, which is arranged in the receiving space 258 of the heat-conducting layer housing 248.

[0132] The heat pipe assembly 273 comprises at least one heat pipe, which is specifically designed as a heat pipe. The heat pipe is embedded in the material of the thermal conductivity medium 259. For example, it is soldered into the material. This establishes thermal contact between the heat pipe and the thermal conductivity medium 259.

[0133] In one embodiment, the heat pipe assembly 273 comprises at least one heat pipe 274a and at least one heat pipe 274b. The heat pipes 274a and 274b are, in particular, hollow cylindrical in shape. The heat pipe 274a has a longitudinal axis 276a, and the heat pipe 274b has a longitudinal axis 276b. The heat pipes 274a and 274b function essentially the same way as the flat heat pipe 180 described above. The heat pipes 274a and 274b comprise a working medium 278, which can be evaporated at a hot side 280 and condensed at a cold side 282. It further comprises a return structure 284 through which working medium 278, condensed at the cold side 282, can be returned to the hot side 280. In this way, heat can be transferred from the hot side 280 to the cold side 282.

[0134] During operation of the thermoelectric generator device 212, the heat-absorbing housing 238 is heated by the hot medium flow 266. Consequently, the first wall 240 of the heat-dissipating housing 238 heats up, which thermally contacts the second wall 252 of the heat-conducting layer housing 248. The hot sides 280 of the heat pipe 274a and the heat pipe 274b are therefore each located in a region near the second wall 252. The heat absorbed by the working medium 278 at the hot sides 280 is transferred to the cold sides 282. The cold sides 282 are each located in a region near the first wall 250. In this way, thermal contact is established via the first heat-conducting layer 244 between the heat-absorbing housing 238 and the first thermoelectric layer 220.

[0135] Within recording chamber 258 lies heat pipe 274a (compare Fig. 8) with its longitudinal axis 276a located centrally between the transverse walls 254, 256. The longitudinal axis 276a lies parallel to the transverse walls 254, 256. In particular, the longitudinal axis 276a lies parallel to the main flow direction 268 of the hot medium flow 266. The heat pipe 274a extends along the main flow direction 268.

[0136] This improves heat conduction along the main flow direction 268 of the hot medium flow 266. In this way, temperature fluctuations in this direction along the main flow direction 268 of the hot medium flow 266 can be avoided or at least reduced.

[0137] Within the receiving space 258, at least one heat pipe 278b is located with its longitudinal axis 276b parallel to the first wall 250 and the second wall 252. Within the heat-conducting layer housing 248, for example, several heat pipes 278b are arranged spaced apart from one another. Their longitudinal axes 276b are, in particular, parallel to one another. Specifically, the cross-sectional length of the heat pipes 278b, in a direction transverse to the transverse axis 264, is less than half or less than a quarter of the distance between the transverse walls 254, 256. For example, the heat pipes 278b are arranged axially symmetrically with respect to the heat pipe 278a. The longitudinal axes 276b are transverse and, in particular, perpendicular to the longitudinal axis 276a. The heat pipes 276b extend transversely to the main flow direction 268.

[0138] The heat pipes 278b improve heat conduction perpendicular to the main flow direction 268. Effective heat conduction is enabled between edge regions of the heat-conducting layer housing 248 near the transverse walls 254, 256 and a region in the middle of the transverse walls 254, 256.

[0139] In an alternative embodiment, the heat pipe assembly 273 comprises a flat heat pipe 286 (compare Fig. 9 and Fig. 10). The flat heat pipe 286 is basically constructed the same way as the flat heat pipe 180. Fig. 3. The flat heat pipe 286 has a rectangular cross-sectional area, particularly when the cross-section is parallel to the walls 250, 252 (compare Fig. 10). It is embedded in particular in the material of the thermal conductivity medium 259.

[0140] The flat heat pipe 286 has a cross-sectional length L3, which is variable, with respect to a cross-section perpendicular to the transverse axis 264. For example, the cross-sectional length L3 decreases monotonically between the second wall 252 and the first wall 250 with respect to the transverse axis 264 (compare Fig. 9).

[0141] Alternatively, the first thermally conductive layer 244 can be formed by the flat heat pipe 286. The flat heat pipe 286 then thermally contacts the first wall 240 of the heat-absorbing housing 238 and the housing element 262 of the first thermoelectric layer 220. In this case, the thermally conductive layer housing 248 and the thermally conductive medium 259 are omitted. As a result, the first thermally conductive layer 244 and the second thermally conductive layer 246 can be designed more compactly and with fewer components.

[0142] In a further alternative embodiment, it is provided that a phase change medium 288 is arranged in the receiving space 258 of the heat-conducting layer housing 248 (compare Fig. 11 and Fig. 12) The phase change medium 288 surrounds the heat pipes 274a, 274b and thus thermally contacts the heat pipes 274. The phase change medium 288 also thermally contacts the first wall 250 and the second wall 252 of the heat-conducting layer housing 248. This improves the heat conduction between the first wall 250 and the second wall 252 and the heat pipes 254.

[0143] The thermal conductivity medium 288 provides the advantages explained in connection with the phase change medium of the thermal conductivity medium 86.

[0144] It can then be provided that a support device 290 is arranged within the receiving space 258 of the heat-conducting layer housing 248. The support device 290 comprises support elements 292, which are arranged, in particular, between the first wall 250 and the second wall 252. The support elements 292 are, in particular, arranged at regular intervals from one another. They are, for example, cylindrical or cuboid in shape.

[0145] The support elements 292 are in particular firmly connected to the first wall 250 and the second wall 252.

[0146] The support device 292 increases the stability of the heat-conducting layer housing 248. This prevents thermal deformation of the heat-conducting layer housing 248.

[0147] The thermoelectric generator device 212 has essentially the same operating principle as the thermoelectric generator device 30. During operation of the thermoelectric generator device 212, heat is absorbed via the heat absorption housing 238 of the heat absorption unit 232. For this purpose, heat is extracted from the hot medium flow 266, which passes through the heat absorption housing 238. The heat absorption housing 238 has, as described above in connection with the heat absorption housing 54, Fig. As explained in section 2, a heat absorption surface 294 is provided, to which the hot medium flow 266 transfers heat. The heat absorbed by the heat absorption housing 238 is transferred to the heat conducting device 236 via the first wall 240 and the second wall 242.

[0148] The heat is transferred from the heat conducting device 236 to the thermoelectric module device 214 via a heat emission surface 296 of the heat emission device 234.

[0149] The heat dissipation surface 296 of the heat dissipation device 234 is formed by a contact surface between the thermoelectric module device 214 and the heat conduction device 236. In the case of the first heat conduction layer 244, the contact surface is the area where the housing element 262 of the first thermoelectric layer 220 contacts the first wall 250 of the first heat conduction layer 244. The contact surface is defined analogously in the case of the second heat conduction layer 246 or the second thermoelectric layer 222. The heat dissipation surface 296 of the heat dissipation device 234 corresponds to the totality of the contact surfaces of the heat dissipation device 234 with the thermoelectric module device 214.

[0150] The heat flow concentrator device 230 comprises the heat absorption device 232, the heat emission device 234, and the heat conduction device 236. The heat absorbed via the heat absorption surface 294 of the heat absorption device 232 is released via the heat emission surface 296 of the heat emission device 234. The area of ​​the heat emission surface 296 is smaller than the area of ​​the heat absorption surface 294. In this way, the heat flux density emanating from the heat emission device 234 is increased compared to the heat flux density entering the heat absorption device 232, as explained above.

[0151] The heat conducting device 236 with the heat pipe device 273 enables the efficient transfer of heat via the heat dissipation device 234, which was absorbed by the heat absorption device 232. The heat pipe device 273 facilitates heat transfer between the heat absorption surface 294 and the heat dissipation surface 296 with an increased heat flux density.

[0152] The features of the embodiments described above can be used in any combination as well as individually. Reference symbol list Q1 Incoming heat flux density Q2 Outgoing heat flux density A1 Area of ​​the heat absorption surface A2 Area of ​​the heat dissipation surface L1 cross-sectional length L2 cross-sectional length L3 cross-sectional length 10 Heat flow concentrator device 12 Heat absorption device 14 Heat output device 16 Heat conduction device 18 Heat absorption area 20 Incoming heat flow 22 Heat emission surface 24 Outgoing heat flow 26 Thermal conductivity 30 Thermoelectric generator device 32 Thermoelectric module device 34 Hot heat transfer device 36 Cold heat transfer device 38 First thermoelectric layer 40 Second thermoelectric layer 42 First cold heat exchanger 44 Second cold heat exchanger 46 Heat flow concentrator device 48 Heat absorption device 50 Heat output device 52 Heat conduction device 54 Heat absorption housings 56 First Wall 58 Second Wall 60 First transverse wall 62 Second transverse wall 64 Recording Room 66 Surface Enlargement Structure 68 flow channels 70 rib structure 72nd rib 74 Hot medium flow 76a Inside 76b Inside 76c inside 76d inside 78 Heat absorption area 80a Outside 80b outside 80°C outside 80d outside 82 Heat dissipation housings 84 Recording Room 86 Thermal conductivity 88 First Wall 90 Second Wall 92 First transverse wall 94 Second transverse wall 96a Outside 96b Outside 98 Heat emission surface 100 cold heat exchanger housings 102 Recording Room 104 Cold medium flow 106 Wall 108 Cold heat exchanger housings 110 wall 112 Thermoelectric module 114 First housing element 116 Second housing element 118 Interior 120 p-conductor 122 n-conductor 124 Bridge 126 Heat flow 128 Main flow direction 130 Main flow direction 132 Incoming heat flow 134 Outgoing heat flow 136 Thermoelectric generator device 136' Thermoelectric generator device 138 Thermoelectric module device 140 Hot heat transfer device 140' Hot heat transfer unit 142 Cold heat transfer device 144 First thermoelectric layer 146 Second thermoelectric layer 148 First cold heat exchanger 150 Second cold heat exchanger 152 Heat flow concentrator device 154 Heat absorption device 156 Heat output device 156' Heat dissipation device 158 Heat conduction device 160a Heat absorption housing 160b Heat absorption housing 160°C heat absorption housing 162a Wall 162b Wall 162c Wall 162d wall 162nd wall 162f Wall 164a Cross wall 164b Cross wall 164c Cross wall 164d transverse wall 164e transverse wall 164f transverse wall 166a Heat absorption area 166b Heat absorption area 166c heat absorption area 168 Heat absorption area 170 Heat dissipation housings 172 Recording room 174 First transverse wall 176 Second transverse wall 178 Heat pipe system 180a Flat Heat Pipe 180b Flat Heat Pipe 180°C Flat Heat Pipe 180d Flat Heat Pipe 180e Flat Heat Pipe 180° Flat Heat Pipe 182 Working medium 184 Hot side 186 Cold side 188 Reintegration structure 190 Hot medium flow 192a Outside 192b Outside 194 Heat emission surface 196 Heat storage device 198 First heat storage 200 Second heat storage 202 First housing element 204 Second housing element 206 Housing element 208 Thermal conductivity 212 Thermoelectric generator device 214 Thermoelectric module device 216 Hot heat transfer device 218 Cold heat transfer device 220 First thermoelectric layer 220' First thermoelectric layer 222 Second thermoelectric layer 222' Second thermoelectric layer 224 First cold heat exchanger 226 Second cold heat exchanger 228 combination 230 Heat flow concentrator device 232 Heat absorption device 234 Heat emission device 236 Heat conduction device 238 Heat absorption housing 240 First Wall 242 Second wall 244 First thermal conductivity layer 246 Second thermal conductivity layer 248 Thermal Conductive Layer Housings 250 First Wall 252 Second wall 254 transverse wall 256 transverse wall 258 Recording room 259 Thermal conductivity 260a Outside 260b outside 262 Housing element 264 Transverse axis 266 Hot medium flow 268 Main flow direction 270 Cold medium flow 272 Main flow direction 273 Heat pipe system 274a Heat-Pipe 274b Heat-Pipe 276a Longitudinal axis 276b Longitudinal axis 278 Working medium 280 Hot side 282 Cold side 284 Return structure 286 Flat Heat Pipe 288 Phase change medium 290 Support device 292 Support element 294 Heat absorption area 296 Heat emission surface

Claims

[1] Thermoelectric generator device comprising a thermoelectric module device (32; 138; 214), a hot heat transfer device (34; 140; 140'; 216) and a cold heat transfer device (36; 142; 218) which are in thermal contact with the thermoelectric module device (32; 138; 214), wherein the hot heat transfer device (34; 140; 140'; 216) and / or the cold heat transfer device (36; 142; 218) comprises a heat pipe device (178; 273) with at least one heat pipe, characterized by, that a longitudinal axis (276a, 276b) of at least one heat pipe of the heat pipe assembly (178; 273) lies longitudinally to a main flow direction (128, 130; 268, 272) of a medium flow guided through the hot heat transfer device (34; 140; 140'; 216) and / or through the cold heat transfer device (36; 142; 218) and that a longitudinal axis (276a, 276b) of at least one further heat pipe of the heat pipe assembly (178; 273) lies transversely and in particular perpendicularly to a main flow direction (128, 130; 268, 272) of the medium flow guided through the hot heat transfer device (34; 140; 140'; 216) and / or through the cold heat transfer device (36; 142; 218) guided medium flow. [2] Thermoelectric generator device comprising a thermoelectric module device (32; 138; 214), a hot heat transfer device (34; 140; 140'; 216) and a cold heat transfer device (36; 142; 218) which are in thermal contact with the thermoelectric module device (32; 138; 214), wherein the hot heat transfer device (34; 140; 140'; 216) and / or the cold heat transfer device (36; 142; 218) comprises a heat pipe device (178; 273) with at least one heat pipe, characterized by , that at least one heat pipe is a flat heat pipe (180a, 180b, 180c, 180d, 180e, 180f; 286). [3] Generator device according to claim 2, characterized by , that the flat heat pipe (180a, 180b, 180c, 180d, 180e, 180f; 286) has a rectangular cross-sectional area. [4] Generator device according to one of the preceding claims, characterized by, that the heat pipe assembly (178; 273) comprises a heat conducting medium (26; 86; 208; 259) which surrounds the at least one heat pipe. [5] Generator device according to claim 4, characterized by , that the thermal conducting medium (26; 86; 208; 259) is a phase change medium (288). [6] Generator device according to one of the preceding claims, characterized by , that the heat pipe device (178; 273) is arranged between a heat absorption surface (18; 78; 166; 294) and a heat emission surface (22; 98; 194; 296) of the hot heat transfer device (34; 140; 140'; 216). [7] A method for operating a thermoelectric generator device, wherein a thermal contact is established between a thermoelectric module device (32; 138; 214), a hot heat transfer device (34; 140; 140'; 216) and a cold heat transfer device (36; 142; 218), wherein heat is supplied to the hot heat transfer device (34; 140; 140'; 216) via a heat absorption surface (18; 78; 166; 294), a heat flux density (Q1, Q2) of the heat is increased via a heat pipe device (178; 273) and the heat is transferred to the thermoelectric module device (32; 138; 214) via a heat emission surface (22; 98; 194; 296), and wherein the heat pipe device (178; 273) comprises at least one heat pipe exhibits a longitudinal axis (276a, 276b) of at least one heat pipe of the heat pipe assembly (178; 273) along a main flow direction (128, 130; 268, 272) of a heat transfer unit (34; 140; 140');216) and / or through the cold heat transfer device (36; 142; 218) and a longitudinal axis (276a, 276b) of at least one further heat pipe of the heat pipe device (178; 273) lies transversely and in particular perpendicular to a main flow direction (128, 130; 268, 272) of the medium flow through the hot heat transfer device (34; 140; 140'; 216) and / or through the cold heat transfer device (36; 142; 218).; [8] A method for operating a thermoelectric generator device, wherein a thermal contact is established between a thermoelectric module device (32; 138; 214), a hot heat transfer device (34; 140; 140'; 216) and a cold heat transfer device (36; 142; 218), wherein heat is supplied to the hot heat transfer device (34; 140; 140'; 216) via a heat absorption surface (18; 78; 166; 294), a heat flux density (Q1, Q2) of the heat is increased via a heat pipe device (178; 273) and the heat is transferred to the thermoelectric module device (32; 138; 214) via a heat emission surface (22; 98; 194; 296), and wherein the heat pipe device (178; 273) comprises at least one heat pipe exhibits, and that at least one heat pipe is a flat heat pipe (180a, 180b, 180c, 180d, 180e, 180f; 286).

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