Method for manufacturing an organic electronic component

Abstract

Method for manufacturing an organic electronic device (10) comprising the steps: A) Application of organic material (20) to form at least one organic functional layer (2) on a substrate (1), B) structured application of an electrode material (30) onto the at least one organic functional layer (2) by means of a first mask (4), wherein the electrode material (30) is applied with the existing first mask (4) in such a way that a structure of the electrode material (30) according to the first mask (4) is formed during the application, C) Removal of organic material (20) in areas that are free of the electrode material (30), wherein the electrode material (30) is a material for electrically contacting the at least one organic functional layer (2).

Description

[0001] A method for manufacturing an organic electronic component is described.

[0002] Organic electronic devices, such as organic light-emitting diodes (OLEDs), are typically fabricated as an assembly of multiple components on a common substrate. The individual components are then obtained by cutting this assembly. Therefore, a structured application of the individual component layers, such as electrodes and organic layers, is necessary, for which different masks are usually required.

[0003] However, the use of masks carries the risk that the image may be inaccurate due to potential under-vaporization of the mask, which could result in, for example, organic layers extending beyond the designated areas. Even slight warping and / or inaccuracies in the masks can lead to under-vaporization. Furthermore, masks are expensive and require maintenance, for example, due to particle contamination and scratching. Additionally, masks must be aligned with the substrate, and the tolerances involved can limit design freedom and packing density—that is, the number of components on a single substrate and thus the component area per substrate area.

[0004] The use of masks can therefore lead to poor or defective components, in addition to the associated costs and handling effort. For example, organic residues between electrode and conductive trace structures can cause high intermediate resistances, leading to a loss of efficiency and potential damage due to localized heat input and / or a reduction in layer adhesion and layer delamination. However, defective components are difficult to identify after manufacturing. Therefore, it is common practice to implement extensive quality control of the masks and masking processes to prevent defects such as warping, distortion, or misalignment of the masks, which can, among other things, promote under-vaporization. For example, special mask materials, such as Invar, and / or stepped masks are used. However, such measures are complex and costly.

[0005] Document US 2008 / 0 042 139 A1 describes an organic light-emitting diode display and a method for its manufacture.

[0006] Publication US 6 468 819 B1 describes a method for structuring organic thin-film components.

[0007] Document US 2009 / 0 184 636 A1 describes an LED device with improved power distribution.

[0008] Document US 2014 / 0 151 679 A1 describes a method for manufacturing a top-gate transistor.

[0009] At least one function of certain embodiments is to specify a method for manufacturing an organic electronic component.

[0010] This problem is solved by methods according to independent claims 1 and 2. Advantageous embodiments and further developments of the method are characterized in the dependent claims and are further described in the following description and drawings.

[0011] In a process for manufacturing an organic electronic component, a substrate is provided. Organic material is applied to the substrate to form at least one organic functional layer.

[0012] The substrate can, for example, consist of one or more materials selected from glass, plastic, ceramic, metal, and semiconductor materials. In particular, the substrate can also be designed and configured for the fabrication of multiple components. A specific area on the substrate can be designated for each component, corresponding to the final component. In other words, organic and other materials are applied to adjacent areas on the substrate to fabricate multiple organic electronic components. It is also possible for one or more materials to be applied over a large area and then structured according to the designated areas.Although the following description refers to a single organic electronic component, the described features and embodiments also apply to a plurality of components manufactured together on the substrate.

[0013] The organic electronic device can be, for example, an organic optoelectronic device such as an organic light-emitting diode or an organic photodiode. In this case, the at least one organic functional layer can comprise one, more, or all layers of an organic functional layer sequence and, in particular, at least one organic optoelectronic layer, i.e., an organic light-emitting layer or an organic light-detecting layer. Furthermore, the organic functional layer sequence, and thus the at least one organic functional layer, can comprise at least one or more organic electronic layers, which can be selected from charge carrier injection layers, charge carrier transport layers, and charge carrier blocking layers.Preferably, the organic functional layer described here and below, and thus the organic material described, comprises at least one organic functional layer sequence and therefore all organic electronic and optoelectronic layers. Alternatively, instead of an optoelectronic component, the organic electronic component can also be configured without optoelectronic functionality, i.e., with purely electronic functionality. In this case, the organic electronic component can, for example, be configured as an organic transistor.

[0014] The organic material used to form at least one organic functional layer can consist of organic polymers, organic oligomers, organic monomers, small organic non-polymeric molecules, or combinations thereof. The application of the organic material can be carried out, for example, by physical vapor deposition (e.g., evaporation) or by liquid phase deposition.

[0015] To electrically contact the at least one organic functional layer, electrode materials are applied, which can form electrode layers or parts of electrode layers. Depending on the design of the organic electronic device, electrode materials can be applied to one side or to different sides of the at least one organic functional layer, and in different regions there. For example, electrode materials can be applied between the substrate and the at least one organic functional layer, as well as on the at least one organic functional layer from the substrate's perspective, or only on the at least one organic functional layer.

[0016] An electrode material is applied to the at least one organic functional layer, i.e., to a side of the organic material facing away from the substrate. The electrode material is applied in a structured manner, meaning it is not applied over a large area covering the entire substrate, but only in predetermined sub-regions, while other sub-regions remain free of the electrode material. For this purpose, the electrode material is applied to the at least one organic functional layer using a first mask. The first mask is particularly preferably a shadow mask, which is positioned above the organic material, preferably at a distance from it, to protect the organic material. The electrode material can be applied, for example, by physical vapor deposition such as evaporation and / or sputtering.

[0017] The electrode material may, for example, comprise or be a metal, preferably selected from aluminum, barium, indium, silver, gold, chromium, titanium, magnesium, calcium, and lithium, as well as compounds, combinations, and alloys with one or more of the aforementioned materials. Furthermore, the electrode material may additionally or alternatively comprise a transparent conductive oxide (TCO), such as zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide, indium tin oxide (ITO), Zn₂SnO₄, CdSnO₃, ZnSnO₃, MgIn₂O₄, GaInO₃, Zn₂In₂O₅, or In₄Sn₃O₄. 12 , as well as mixtures of different transparent conductive oxides.

[0018] Furthermore, prior to the application of the organic material to form the at least one organic functional layer, an additional electrode material can be arranged or applied to the substrate. This electrode material can form an electrode layer that, in the finished device, is located between the substrate and the at least one organic functional layer. In this case, the organic material is thus applied at least to the additional electrode material and can partially or completely cover it. The additional electrode material can comprise one or more of the materials previously described in connection with the electrode material applied to the organic material.

[0019] Furthermore, at least one electrode connector can be applied to the substrate, which allows electrical contact with the electrode material applied to the organic material in the finished component. The electrode connector can have or consist of a single layer. This single layer can, in particular, have the same material as the other electrode material. For example, the at least one electrode connector, or at least one layer thereof, can be applied to the substrate together with the other electrode material before the organic material is applied. The at least one electrode connector can, in particular, be applied spatially separated from the other electrode material. Furthermore, the at least one electrode connector can have multiple layers.Suitable materials for at least one electrode connection piece include the metals and TCOs mentioned in connection with the electrode materials.

[0020] Organic material is removed from areas that are free, i.e., uncovered, by the electrode material applied in a structured manner to the at least one organic functional layer. In this process step, the organic material is thus restructured. Particularly preferably, the organic material can be removed from all areas that are uncovered by the applied electrode material, so that after restructuring, the organic material is only located beneath the electrode material. During the removal of the organic material, the electrode material can therefore serve as a mask, covering those areas of the organic material that are to remain on the substrate. In other words, the structure of the electrode material is thus transferred to the organic material.

[0021] According to a further embodiment, the removal of organic material is carried out by means of an etching process. In particular, the electrode material applied to the organic material can serve as a mask for the etching process, as described above. A dry etching process, especially a plasma-assisted dry etching process, is preferably suitable as the etching process, enabling etching of a large area. Furthermore, the etching process can include ablation by the input of radiation energy. For this purpose, an electron beam can be used in particular, so that the etching process can be an electron beam-induced gas-phase etching process, especially an electron beam-induced plasma etching process or a dry etching process.

[0022] According to another embodiment, the organic material is applied over a large area and without structure. In other words, the organic material is applied in a maskless process; no mask is used to structure the organic material during application. Through the previously described restructuring of the organic material, it can be removed from those areas free of the electrode material applied to it and thus structured only after the electrode material has been applied. If components are being manufactured in multiple areas on the substrate, the organic material can be applied, in particular, without structure and over a large area across the entire substrate surface, and thus in and between the areas intended for the components.

[0023] Furthermore, it is also possible that the organic material is applied in a structured manner using the first mask, which is then also used to apply the electrode material. In other words, the same mask, namely the first mask, can be used for both the application of the organic material and the application of the electrode material. By restructuring the organic material using the electrode material as a mask, as described above, any organic material that may have been deposited in areas intended to remain free of organic material due to unwanted vapor deposition of the first mask can be removed.

[0024] According to a further embodiment, a first sublayer of an electrode layer is formed by applying the electrode material to the organic material. After restructuring the organic material with the electrode material, i.e., the first sublayer, as a mask, a further electrode material can be applied to form a second sublayer of the electrode layer. The further electrode material, which may comprise or consist of one of the aforementioned materials and can be applied accordingly, can be applied at least partially or completely to the first sublayer. In particular, the further electrode material, i.e., the second sublayer, can be applied in a structured manner using a second mask. Specifically, the second sublayer can extend laterally beyond the first sublayer, i.e., in a direction parallel to the main plane of extension of the substrate.The additional electrode material of the second sublayer can be applied in an area where organic material has previously been removed. Furthermore, the second sublayer can electrically connect the first sublayer to an electrode terminal on the substrate that is spatially separated from the first sublayer. Alternatively, such an electrical connection can also be made by wire bonding.

[0025] According to a further embodiment, when applying the organic material, organic material is also applied to at least one electrode connection on the substrate. The at least one electrode connection can then be at least partially or completely freed of the organic material by the restructuring of the organic material described above, whereby organic material is removed from the at least one electrode connection by using the electrode material on the organic material as a mask. In this case, the previously described application of a further electrode material as a second sublayer of an electrode layer can advantageously be used for the electrical connection of the electrode material forming the first sublayer of the electrode layer to the at least one electrode connection.Alternatively, prior to the structured application of the electrode material to the organic material, some or all of the organic material can be removed from at least one electrode connector. This can be achieved, for example, by means of a sacrificial layer process, a microplasma, and / or electron beam etching, in particular an electron beam-induced plasma etching process or a dry etching process. The electrode material can then be applied to the organic material in such a structured manner that it directly contacts the at least one electrode connector. In other words, the electrode material is also applied to the area on the at least one electrode connector where the organic material was previously removed.

[0026] The method described here advantageously reduces the number of masks typically used to apply the organic material and the electrode material, thereby reducing costs and potential sources of error. Furthermore, it increases design freedom compared to known methods while maintaining proven process reliability.

[0027] Further advantages, advantageous embodiments and further developments result from the exemplary embodiments described below in conjunction with the figures.

[0028] They show: Fig. 1 a schematic representation of a method for manufacturing an organic electronic component according to an exemplary embodiment, Fig. 2A to 2C schematic representations of process steps of a process according to a further embodiment, Fig. 3A to 3D schematic representations of process steps of a process according to a further embodiment, Fig. 4A to 5 schematic representations of process steps of processes according to further exemplary embodiments, Fig. Figures 6A to 6C are schematic representations of process steps of a process according to a further embodiment and Fig. 7 schematic representations of process steps of a process according to a further embodiment.

[0029] In the exemplary embodiments and figures, identical, similar, or similarly functioning elements may be designated with the same reference numerals. The depicted elements and their relative sizes are not to be considered to scale; rather, individual elements, such as layers, components, building elements, and areas, may be exaggerated for clarity and / or better understanding.

[0030] In Fig. Figure 1 shows an embodiment of a method for fabricating an organic electronic device. In a first process step 100, organic material is applied to a substrate to form at least one organic functional layer. In a further process step 200, an electrode material is applied to the at least one functional layer in a structured manner using a first mask. In a further process step 300, organic material is removed from areas free of electrode material. Before, between, and / or after the described process steps, further process steps can be carried out to fabricate additional elements and / or layers of the device and to complete the organic electronic device.For example, in addition to the electrode material applied in process step 200, further electrode material can be applied, particularly to electrically contact the at least one organic functional layer. Furthermore, an encapsulation, for example with or consisting of a thin-film encapsulation and / or with or consisting of a cover, can be applied.

[0031] In conjunction with the following figures, further embodiments and features of the method for manufacturing the organic electronic component are described, including the designs, modifications, and further developments of the method described in Fig. The procedure described in section 1 forms. Fig. Figures 2A to 6C show sections of a substrate 1 with layers applied to it.

[0032] In the Fig. Figures 2A to 2C show process steps of a method according to an exemplary embodiment, in which, as in Fig. As shown in Figure 2A, organic material 20 is applied over a large area and in an unstructured manner to a substrate 1. The substrate 1 can, for example, consist of one or more materials selected from glass, plastic, ceramic, metal, and semiconductor materials and is designed and configured for the fabrication of one or more organic electronic components. In the case of multiple components, an aggregate of the multiple organic electronic components is produced with the substrate 1 as a common substrate. By dividing the aggregate, and in particular by dividing the common substrate 1, the aggregate can be separated into individual components.

[0033] The organic material 20, which, depending on its material composition, can be applied, for example, by vapor deposition or liquid phase deposition as described in the general section, forms at least one organic functional layer 2, which, after application, is deposited on the substrate 1 in a continuous and large-area manner, i.e., in particular, unstructured and preferably over the entire surface. In particular, the organic material 20 can be applied in the form of various organic materials as an organic functional layer sequence, which, according to the functionality of the organic electronic device, can exhibit electronic and / or optoelectronic properties.For example, the organic electronic component can be, as described above in the general section, an organic optoelectronic component, such as an organic light-emitting diode or an organic photodiode, or a purely electronic component, such as an organic transistor.

[0034] After the unstructured application of the organic material 20 without a shadow mask, a further process step is carried out, as described in Fig. As shown in Figure 2B, an electrode material 30 is applied in a structured manner to the organic material 20. For this purpose, a first mask 4 is provided, which can in particular be a shadow mask and has openings over the areas where the electrode material 30 is to be applied. The electrode material 30 can comprise or be made of one or more of the metals and / or TCOs described above in the general section and can be applied, for example, by physical vapor deposition (PVD), such as evaporation and / or sputtering. In the illustrated embodiment, the first mask 4 is thus used for the masked PVD process to apply the electrode material 30, while the application of the organic material 20 is maskless.The electrode material 30 can form an electrode layer 3 on the organic material 20, which, in the operation of the completed organic electronic device, enables electrical contact of the organic material 20 from a side facing away from the substrate 1. Depending on the design of the organic electronic device, the electrode layer 3 can have a desired structure, wherein the in . Fig. The structure shown in 2B is to be understood as purely exemplary.

[0035] In a further procedural step, as described in Fig. As shown in Figure 2C, organic material 20 is removed in areas that are free of electrode material 30 and therefore not covered by the electrode layer 3. Specifically, the organic material 20 can be removed wherever electrode material 30 is not applied, i.e., in all areas free of electrode material 30. In other words, the structure of the electrode material 30 is transferred to the organic material 20 in a subtractive process step, thus structuring the organic material 20. The electrode material 30 therefore serves as a mask for restructuring the organic material 20.The removal of the organic material 20 is carried out by means of an etching process, preferably by means of a dry etching process, in particular a plasma-assisted dry etching process, with which planar etching is possible and / or by ablation by means of radiation energy input, preferably by means of an electron beam, so that in this case the etching process can be an electron beam-induced gas phase etching process.

[0036] In further process steps (not shown), the organic electronic component can be completed. For example, an encapsulation can be applied over the organic material 20 and the electrode layer 3, which can protect against damaging environmental influences such as oxygen, hydrogen sulfide and moisture, as well as against mechanical damage.

[0037] In the Fig. 2A to 2C as well as in the following Fig. In Figures 3A to 6C, the organic material 20 is shown directly on the substrate 1. Alternatively, prior to the application of the organic material 20 to form the at least one organic functional layer 2, a further electrode material can be applied to the substrate 1. This further electrode material can form a lower electrode layer, which in the finished device is arranged between the substrate 1 and the at least one organic functional layer 2. The further electrode layer can be large-area or structured and, in operation of the finished organic electronic device, enables electrical contact of the at least one organic functional layer 2 from the substrate side. The organic material 20 can partially or completely cover the lower electrode layer.The lower electrode layer can consist of one or more of the materials previously described in connection with the electrode material applied to the organic material. For example, in the case of an organic optoelectronic device, one of the electrode layers is transparent to light. Furthermore, the lower electrode layer can form an anode and the upper electrode layer 3, formed by the electrode material 30, can form a cathode. However, a reversed electrical polarity is also possible.

[0038] In the Fig. Figures 3A to 3D show process steps of a further embodiment, in which, unlike the previous embodiment, at least one electrode connector 5 is applied to the substrate 1 before the organic material 20 is applied. The electrode connector 5 can be single-layered or multi-layered and, for example, comprise the same material as the electrode material 30 and / or an electrode material (not shown) located between the substrate 1 and the organic material 20. For example, the at least one electrode connector 5, or at least one layer thereof, can be applied to the substrate 1 together with another electrode material before the organic material 20 is applied. The organic material 20 is applied over the entire surface and without structure, as in the previous embodiment, so that the at least one electrode connector 5 is also completely covered by the organic material 20.

[0039] As in Fig. As shown in 3B, in a further procedural step before the in Fig. 3C shown structured application of the electrode material 30 through the first mask 4 organic material 20 whole or as in Fig. Figure 3B shows the area partially located in region 21 away from at least one electrode connection piece 5. Such local removal of organic material 20 can be achieved, for example, by means of a sacrificial layer process, a microplasma, and / or electron beam etching.

[0040] As in Fig. As shown in Figure 3C, the electrode material 30 is structured and applied to the organic material 20, and in particular to the exposed area 21 above the at least one electrode connection 5, such that the electrode material 30 directly contacts the at least one electrode connection 5. In a further process step, as shown in Figure 3C, the electrode material 30 is applied to the organic material 20 and, in particular, to the exposed area 21 above the at least one electrode connection 5 in such a way that the electrode material 30 directly contacts the at least one electrode connection 5. In a further process step, as shown in Figure 3C, the electrode material 30 is applied to the organic material 20 and, in particular, to the exposed area 21 above the at least one electrode connection 5. Fig. The 3D figure shows how, in the previous embodiment, the organic material 20 is restructured using the electrode material 30 as a mask.

[0041] In the Fig. Figures 4A to 4C show a further embodiment in which, unlike the previous embodiment, the at least one electrode connection piece 5 is removed after the unstructured application of the organic material 20 and the structured application of the electrode material 30 (see Figures 4A to 4C). Fig. 4A) by removing organic material 20 in the areas that are free of electrode material 30, partially or as described in Fig. As shown in Figure 4B, the electrode material 30 is completely exposed. In this case, it forms a first partial layer 31.

[0042] In a further procedural step, as described in Fig. As shown in Figure 4C, a further electrode material 32 in the form of a second sublayer 33 is applied at least partially to the first sublayer 31 and the at least one electrode connection piece 5 by means of a second mask 6. The first and second sublayers 31, 33 together form the upper electrode layer 3, with which the organic material 30 is electrically contacted from the side facing away from the substrate 1 by means of the at least one electrode connection piece 5. The application of the second sublayer 33 can thus be carried out by masked PVD, just like the production of the first sublayer 31. In the illustrated embodiment, the second mask 6, and thus the second sublayer 33, is arranged laterally offset from the first mask 4 and the first sublayer 31, so that the further electrode material 32 forming the second sublayer 33 is also applied, in particular, to areas that were previously covered by organic material 20.Alternatively, the second sublayer 33 can be applied without a mask if there is a suitable underlying structure. The second sublayer 33 can also completely cover the first sublayer 31.

[0043] As an alternative to applying another electrode material 32 to form the second sublayer 33, as shown in Fig. As shown in Figure 5, an electrical connection between the electrode layer 3 arranged on the organic material 20 and the substrate-side electronic structures formed by the at least one electrode connection piece 5 is made by means of wire bonding, for example by means of a bonding wire 7.

[0044] In the Fig. Figures 6A to 6C show process steps of a method according to a further embodiment, in which, as in Fig. As shown in Figure 6A, the organic material 20 is applied in a structured manner using the same first mask 4 that is subsequently used to apply the electrode material 30. The organic material 20 is thus applied essentially in the same areas where the electrode material 30 will later be applied. The application of the organic material 20 and the electrode material 30 is therefore carried out using the same shadow mask. As shown in Fig. As indicated in 6A, the organic material 20 is not sharply defined at the edges of the mask opening, but more or less steeply sloping flanks can form at the organic edges due to under-vaporization of the first mask 4, which can extend laterally under the first mask 4.

[0045] As in the previous embodiments, the electrode material 30 is deposited in a further process step through the first mask 4 onto the organic material 20, whereby a part of the flanks of the organic material 20 is covered with the electrode material 30 and another part of the flanks of the organic material 20, located further out in the lateral direction, remains free of the electrode material 30, as in Fig. 6B is indicated. The subsequent restructuring step of the organic material 20 using the electrode material 30 as a mask, as shown in Fig. As shown in Figure 6C, the portion of the flanks of the organic material 20 not covered by the electrode material 30 is removed, so that, as in the previous embodiments, the organic material 20 is located exclusively below the electrode material 30 and no organic residues are present laterally next to the electrode material 30. Because the organic material 20 has already been applied in a structured manner by the first mask 4, the effort required for the structured removal of the organic material 20 next to the electrode material 30 can be reduced compared to the previous embodiments. The combination of the Fig. The process steps described in sections 6A to 6C can also be combined with the previous embodiments.

[0046] By means of the in conjunction with the Fig. The process steps and combinations thereof described in 1 to 6C can be used as described in Fig. Figure 7 shows, for example, that an organic electronic device 10 configured as an organic light-emitting diode or organic photodiode can be fabricated. For example, the device 10 can be constructed like the one shown in Figure 7. Fig. The embodiment described in Figure 4C has an upper electrode layer 3 formed by a first and second sublayer 31, 33, wherein the second sublayer 33 connects the first sublayer 31 to an electrode terminal 5. For clarity, the first and second masks 4, 6 used to apply the electrode materials 30 and 32 above the organic electrical device are indicated by dashed lines.

[0047] The electrode connector 5 has two sublayers 51, 52, the lower sublayer 51 of which is formed by the same material as a lower electrode layer 8, in particular by a TCO such as ITO, wherein the lower electrode layer 8 is arranged between the substrate 1 and the organic material 20. A further sublayer 52, in particular made of or containing a metal, is applied to the lower sublayer 51. To electrically insulate the electrode connector 5 and the lower electrode layer 8 from each other, an electrically insulating material 9, for example an electrically insulating oxide or nitride or an electrically insulating polymer, is arranged between them on the substrate 1.

[0048] At least one (not shown) encapsulation may be applied over the electrode layers 3, 8 and the organic material 20 to protect against damaging external influences.

[0049] The embodiments and features described in connection with the figures can be combined with one another according to further embodiments, even if not all possible combinations are explicitly described. Furthermore, the embodiments described in connection with the figures may have additional or alternative features as described in the general section. Reference symbol list 1 substrate 2 organic functional layer 3 electrode layer 4 first mask 5 electrode connector 6 second mask 7 Bond wire 8 Electrode layer 9 electrically insulating material 10 organic electronic component 20 organic material Area 21 30, 32 Electrode material 31, 33 sub-shift 51, 52 sub-shift 100, 200, 300 process step

Claims

[1] Method for manufacturing an organic electronic device (10) comprising the steps: A) Application of organic material (20) to form at least one organic functional layer (2) on a substrate (1), B) structured application of an electrode material (30) onto the at least one organic functional layer (2) by means of a first mask (4), wherein the electrode material (30) is applied with the existing first mask (4) in such a way that a structure of the electrode material (30) according to the first mask (4) is formed during the application, C) Removal of organic material (20) in areas that are free of the electrode material (30), wherein the electrode material (30) is a material for electrically contacting the at least one organic functional layer (2). [2] Method for manufacturing an organic electronic device (10) comprising the steps: A) Application of organic material (20) to form at least one organic functional layer (2) on a substrate (1), B) structured application of an electrode material (30) onto the at least one organic functional layer (2) by means of a first mask (4), wherein the electrode material (30) is applied with the existing first mask (4) in such a way that a structure of the electrode material (30) according to the first mask (4) is formed during the application, C) Removal of organic material (20) in areas free of electrode material (30), wherein the at least one organic functional layer (2) comprises an organic functional layer stack comprising at least one organic optoelectronic layer and organic electronic layers. [3] Method according to one of the preceding claims, wherein in process step C an etching process is used in which the electrode material (30) serves as a mask. [4] Method according to claim 3, wherein the etching method comprises a dry etching process or an ablation by radiation energy input. [5] Method according to any of the preceding claims, wherein in process step A the organic material (20) is applied in a structured manner using the first mask (4). [6] Method according to any one of claims 1 to 4, wherein in process step A the organic material (20) is applied in an unstructured manner. [7] Method according to one of the preceding claims, wherein in process step B a first partial layer (31) of an electrode layer (3) is formed by applying the electrode material (30) and in process step C a further electrode material (32) is applied to form a second partial layer (33) of the electrode layer (3). [8] Method according to the preceding claim, wherein the further electrode material (32) is applied in a structured manner using a second mask (6). [9] Method according to claim 7 or 8, wherein the second sublayer (33) extends laterally beyond the first sublayer (31). [10] Method according to any one of claims 7 to 9, wherein the further electrode material (32) is applied in an area where organic material (20) has been removed in process step C. [11] Method according to any one of claims 7 to 10, wherein the second sublayer (33) electrically connects the first sublayer (31) to an electrode connection piece (5) on the substrate (1) that is spatially separated from the first sublayer (31). [12] Method according to the previous claim, wherein in process step A organic material (20) is applied to the electrode connector (5) and in process step C organic material (20) is removed from the electrode connector (5). [13] Method according to any one of claims 1 to 6, wherein in process step A organic material (20) is applied to an electrode connection piece (5) on the substrate (1) and before process step B organic material (20) is removed from the electrode connection piece (5). [14] Method according to the previous claim, wherein in process step B the electrode material (30) is additionally applied to the electrode connection piece (5) so that the electrode material (30) contacts the electrode connection piece (5). [15] Method according to one of the preceding claims, wherein a further electrode layer (8) is arranged on the substrate (1) and the organic material (20) is applied at least on the further electrode layer (8) in process step A.

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