Device and method for the inductive curing of a thermoset plastic component and thermoset plastic component produced therewith
The inductive curing method addresses inefficiencies in existing thermosetting plastic curing processes by using an integrated coil to generate heat from within the component, resulting in rapid, efficient, and pore-free curing.
Patent Information
- Application Number
- DE102018202229
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2018-02-14
- Publication Date
- 2025-04-30
- Estimated Expiration
- 2038-02-14
AI Technical Summary
Existing methods for curing thermosetting plastic components require additional devices such as heating belts, ovens, or heatable tools, which are not efficient and can lead to issues like reduced viscosity, escape of impregnating agents, void formation, and porosity between the coil and surrounding material.
The use of an inductive curing method where a coil integrated within the thermosetting plastic component acts as a contactless heating element, utilizing an alternating current applied to an inductor to induce eddy currents and generate heat for curing.
This method achieves rapid and efficient curing with shorter times and higher energy efficiency, eliminates the need for electrical contacting during curing, and ensures a pore-free connection between the coil and surrounding material.
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Abstract
Description
[0001] The invention relates to a device for the inductive curing of a thermoset plastic component. The invention further relates to a method for the inductive curing of a thermoset plastic component and a thermoset plastic component produced therein. State of the art
[0002] Various methods are known for impregnating and curing an electrically insulating resin, i.e., a thermosetting plastic or thermoset, by means of electrical windings as a result of an electric current through the windings and the associated heating.
[0003] DE 10 2011 076 463 B4 describes a repair method for a thermoset molded part in which a repair element is applied and bonded by the application of heat. The heat is generated by a heating element in the form of a plate made of an electrically conductive ferromagnetic material, by subjecting the heating element to an alternating magnetic field.
[0004] DE 2927866 discloses a method for bonding coils with thermoplastic polymer sheathing by means of time-limited current pulses with constant voltage to generate so-called heating current pulses depending on the heating of the coil.
[0005] DE 3323154 discloses a method for impregnating electrical windings, which utilizes the electrical heat in the conductor of the electrical winding for the crosslinking reaction of the resins used and for drying the winding after impregnation.
[0006] DE 19644187 describes a process for preheating, impregnating and curing impregnating agents in individual winding components and their assemblies of electrical machines, wherein the process is carried out in several stages.
[0007] A disadvantage of the aforementioned methods is that resin curing usually requires additional equipment such as heating bands, ovens, or heated tools. Therefore, separate facilities are needed for impregnating and curing assemblies with thermosetting plastics and / or electrical windings.
[0008] Furthermore, there is a possibility that heat will cause a decrease in viscosity, which promotes the leakage of the impregnating agent. Additionally, there is a possibility of the formation of cavities within the thermosetting plastic, which reduces the resin's dielectric strength.
[0009] Furthermore, the aforementioned methods are generally not suitable for manufacturing entire components from thermosetting plastic. During the curing phase, an electric current must flow through the winding; that is, the windings must be in contact.
[0010] Therefore, there is a need to provide an improved method for curing a thermoset component. Disclosure of the invention
[0011] The present invention provides a device for the inductive curing of a thermoset plastic component, comprising a coil arranged in the thermoset plastic component with at least a first intermediate layer, with at least a second intermediate layer and with at least one coil carrier comprising at least one coil winding, wherein respective winding ends of the coil are electrically connected to each other, with an inductor arranged adjacent to the thermoset plastic component, wherein the device is configured to cure the thermoset plastic component by means of a heat input generated by applying an alternating current to the inductor to induce eddy currents in the thermoset plastic component.
[0012] The present invention further provides a method for the inductive curing of a thermoset plastic component. The method comprises providing an uncrosslinked thermoset plastic component, which includes a coil with at least one first intermediate layer, with at least one second intermediate layer, and with at least one coil carrier having at least one coil winding.
[0013] The process further includes providing an inductor arranged adjacent to the thermoset plastic component.
[0014] The process also includes electrically connecting the respective winding ends of the coil to form an induction coil.
[0015] The process also includes curing the thermoset plastic component by means of heat input generated by applying an alternating current to the inductor to induce eddy currents in the thermoset plastic component.
[0016] The invention further relates to a thermosetting plastic component produced by the inventive method, wherein the thermosetting plastic component has a pore-free connection between the coil and the surrounding material.
[0017] One idea of the present invention is that by applying alternating electromagnetic fields to components made of a thermosetting plastic which have a component-integrated coil, after electrical contacting the winding ends of the coil, this can be used as a non-contact heating element for the heat input required for curing.
[0018] Therefore, an induction unit with an integrated coil can be advantageously used for curing thermoset plastic components. The inductive curing of thermoset plastic components advantageously generates a high heat input and rapid heating, resulting in shorter curing times and higher energy efficiency of the curing process.
[0019] Furthermore, improved handling and greater flexibility of the curing process can be ensured by eliminating the need for electrical contact with the coil during curing. Additionally, porosity between the coil and surrounding material is avoided, as the inductive curing of the thermoset plastic component occurs from the inside out.
[0020] Advantageous embodiments and further developments are described in the dependent claims and in the description with reference to the figures.
[0021] According to a preferred embodiment, the first intermediate layer is arranged on a shield of the coil, the second intermediate layer is arranged on the first intermediate layer, and the coil support is arranged on the second intermediate layer.
[0022] The layered structure advantageously allows the coil to be freely positioned.
[0023] According to a further preferred embodiment, ferrites are arranged in the first intermediate layer. The ferrites advantageously guide the magnetic field close to the coil when they are positioned near the coil. This also advantageously results in a more compact design compared to a conventional design using separately arranged ferrites.
[0024] According to a further preferred embodiment, the second intermediate layer is formed by a thermally conductive, electrically insulating material, in particular a polymer. The electrically insulating second intermediate layer, combined with its heat conduction function, advantageously results in a compact structure and enables uniform heat distribution within the thermoset component.
[0025] According to a further preferred embodiment, the thermoset plastic component is arranged in a housing, the housing being made of a thermoset material. The housing advantageously protects the coil from mechanical damage and from corrosive media.
[0026] According to a further preferred embodiment, the coil, the first intermediate layer, and the second intermediate layer are surrounded by a thermoset filler material, wherein the thermoset filler material, the first intermediate layer, and the second intermediate layer are inductively curable. Thus, inductive curing of all materials of the thermoset plastic component can advantageously be carried out.
[0027] According to a further preferred embodiment, a plurality of second intermediate layers are formed, each arranged adjacent to and substantially parallel to the at least one coil winding. This layered arrangement of the plurality of second intermediate layers on, between, and below the at least one coil winding thus advantageously results in improved heat input or heat distribution in the thermoset plastic component.
[0028] According to a further preferred embodiment, the second intermediate layer is formed by a thermally conductive, electrically insulating material, in particular by a polymer, which distributes heat generated by induction in the thermoset plastic component essentially uniformly in the thermoset plastic component.
[0029] This allows for an advantageous improvement in the material properties of the cured thermoset plastic component.
[0030] According to a further preferred embodiment, the inductive curing of the thermoset plastic component bonds a material surrounding the coil to the coil without creating pores. The aforementioned advantage is achieved by using inductive curing, i.e., curing from the inside out. Furthermore, the use of the thermally conductive, electrically insulating polymer enables rapid heat distribution within the component and thus the curing of thick-walled components without the risk of thermal damage to the component surface.
[0031] The described configurations and training programs can be combined in any way desired.
[0032] Further possible embodiments, developments and implementations of the invention also include combinations of features of the invention described previously or subsequently with regard to the exemplary embodiments that are not explicitly mentioned. Brief description of the drawings
[0033] The accompanying drawings are intended to provide a further understanding of the embodiments of the invention. They illustrate embodiments and, in conjunction with the description, serve to explain the principles and concepts of the invention.
[0034] Other embodiments and many of the aforementioned advantages become apparent with reference to the drawings. The elements depicted in the drawings are not necessarily shown to scale.
[0035] They show: Fig. 1 a sectional view of a device for the inductive curing of a thermoset plastic component according to a preferred embodiment of the invention; and Fig. 2 a flowchart of a method for the inductive curing of a thermoset plastic component according to the preferred embodiment of the invention.
[0036] Fig. Figure 1 shows a sectional view of a device for the inductive curing of a thermosetting plastic component according to a preferred embodiment of the invention.
[0037] The thermoset plastic component 12 to be cured is placed in the device 10 or the tool for inductive curing. The thermoset plastic component 12 has a coil 14 arranged within it, comprising a first intermediate layer 16, a plurality of second intermediate layers 18, and a coil carrier 20 which includes a coil winding 22.
[0038] The respective winding ends of the coil 14 are electrically connected to each other to form an induction coil. Furthermore, the device 10 has an inductor 24 arranged adjacent to the thermoset plastic component 12. The device 10 is designed to cure the thermoset plastic component 12 by means of heat input generated by applying an alternating current to the inductor 24 to induce eddy currents in the thermoset plastic component 12.
[0039] The first intermediate layer 16 is arranged on a shield 26 of the coil. The second intermediate layer 18 is arranged on the first intermediate layer 16. The coil carrier 20 is arranged on the second intermediate layer 18, i.e., on the plurality of second intermediate layers 18.
[0040] Ferrites are arranged in the first intermediate layer 16. The second intermediate layer 18 is formed by a thermally conductive, electrically insulating material, in particular by a polymer.
[0041] The thermoset plastic component 12 is arranged in a housing 28, the housing 28 being made of a thermoset material. Thus, the housing can also be inductively cured.
[0042] The coil 14, the first intermediate layer 16, and the majority of second intermediate layers 18 are surrounded by a thermoset filler material 30. The thermoset filler material 30, the first intermediate layer, and the majority of second intermediate layers are each inductively curable.
[0043] The majority of the second intermediate layers are arranged adjacent to and essentially parallel to the at least one coil winding 22. In the present embodiment, the respective second intermediate layers 18 are arranged on, between, and below the respective coil windings 22.
[0044] The thermosetting plastic component 12 produced in this way has a pore-free connection between coil 14 and surrounding material.
[0045] Fig. Figure 2 shows a flowchart of a process for the inductive curing of a thermoset plastic component according to the preferred embodiment of the invention.
[0046] The process comprises providing S1 of an uncrosslinked thermoset plastic component, which includes a coil with at least one first intermediate layer, with at least one second intermediate layer and with at least one coil carrier with at least one coil winding.
[0047] The method further includes providing S2 of an inductor arranged adjacent to the thermoset plastic component.
[0048] The method also includes electrically connecting S3 the respective winding ends of the coil to form an induction coil.
[0049] The process also includes curing S4 of the thermoset plastic component by means of heat input generated by applying an alternating current to the inductor to induce eddy currents in the thermoset plastic component.
[0050] Furthermore, it is provided that the second intermediate layer is formed by a thermally conductive, electrically insulating material, in particular by a polymer, which distributes heat generated by induction in the thermoset plastic component essentially uniformly in the thermoset plastic component.
[0051] Furthermore, it is intended that the inductive curing of the thermosetting plastic component will bond a material surrounding the coil to the coil without pores.
[0052] Although the present invention has been described above with reference to preferred embodiments, it is not limited to these embodiments but can be modified in many ways. In particular, the invention can be altered or modified in many ways without deviating from the core of the invention.
[0053] For example, the shape, dimensions and / or properties of the components of the device 10 for inductive curing of the thermosetting plastic component 12 can be modified.
Claims
[1] Device (10) for inductively curing a thermosetting plastic component (12), with a coil (14) arranged in the thermosetting plastic component (12) with at least one first intermediate layer (16), with at least one second intermediate layer (18) and with at least one coil carrier (20) which comprises at least one coil winding (22), wherein respective winding ends of the coil (14) are electrically connected to one another, with an inductor (24) arranged adjacent to the thermosetting plastic component (12), wherein the device (10) is designed to cure the thermosetting plastic component (12) by means of a heat input generated by applying an alternating current to the inductor (24) for inducing eddy currents in the thermosetting plastic component (12). [2] Device according to claim 1, characterized bythat the first intermediate layer (16) is arranged on a shield (26) of the coil (14), wherein the second intermediate layer (18) is arranged on the first intermediate layer (16), and wherein the coil carrier (20) is arranged on the second intermediate layer (18). [3] Device according to claim 1 or 2, characterized by that ferrites are arranged in the first intermediate layer (16). [4] Device according to one of the preceding claims, characterized by that the second intermediate layer (18) is formed by a heat-conducting, electrically insulating material, in particular by a polymer. [5] Device according to one of the preceding claims, characterized by that the thermosetting plastic component (12) is arranged in a housing (28), wherein the housing (28) is formed from a thermosetting plastic material. [6] Device according to one of the preceding claims, characterized bythat the coil (14), the first intermediate layer (16) and the second intermediate layer (18) are surrounded by a thermosetting filling material (30), wherein the thermosetting filling material (30), the first intermediate layer (16) and the second intermediate layer (18) are inductively curable. [7] Device according to one of the preceding claims, characterized by that a plurality of second intermediate layers (18) are formed, which are each arranged adjacent to and substantially parallel to the at least one coil winding (22). [8] Method for inductively curing a thermosetting plastic component (12), comprising the steps: Providing (S1) a non-crosslinked thermosetting plastic component (12) comprising a coil (14) with at least one first intermediate layer (16), with at least one second intermediate layer (18), and with at least one coil carrier (20) with at least one coil winding (22); Providing (S2) an inductor (24) arranged adjacent to the thermosetting plastic component (12); Electrically connecting (S3) respective winding ends of the coil (14) to each other to form an induction coil; and Curing (S4) of the thermosetting plastic component (12) by means of a heat input generated by applying an alternating current to the inductor (24) for inducing eddy currents in the thermosetting plastic component (12). [9] Method according to claim 8, characterized byin that the second intermediate layer (18) is formed by a heat-conducting, electrically insulating material, in particular by a polymer, which distributes heat generated by induction in the thermosetting plastic component (12) substantially uniformly in the thermosetting plastic component (12). [10] Method according to claim 8 or 9, characterized by that the inductive curing of the thermosetting plastic component (12) bonds a material surrounding the coil (14) to the coil (14) in a pore-free manner. [11] Thermosetting plastic component (12) produced by a method according to one of claims 8 to 10, wherein the thermosetting plastic component (12) has a pore-free connection between the coil (14) and the surrounding material.
Citation Information
Patent Citations
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DE102011076463B4
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