Test device for testing electrical components, method for testing electrical components using the test device and use of the test device

Abstract

Test device (10) for testing electrical components, comprising: - a printed circuit board (16); - an airtight sealable chamber (12) arranged on an arrangement side (14) of the circuit board (16), wherein the chamber (12) has a first chamber section (28) and a second chamber section (30) which are designed to be movable relative to one another, wherein the first chamber section (28) is arranged on the arrangement side of the circuit board, and wherein the chamber (12) has an internal cavity (18); - a component receiving unit (20) arranged in the cavity (18) and in the first chamber section (28) for receiving a component to be tested, wherein the component receiving unit (20) has electrical contacting means (24) for electrically contacting the component to be tested and the electrical contacting means is electrically connected to a contact (26) arranged outside the chamber, and wherein the test device (10) has at least one control means (36) for controlling at least one test parameter within the cavity (18).

Description

[0001] The invention relates to a test device for testing electrical components, a use of the test device for testing an electrical component and a method for testing an electrical component by means of the test device.

[0002] Conventional test fixtures typically have a component receiving unit into which an electrical component to be tested, such as a semiconductor component or microchip, is inserted. Using electrical contacting means provided on the component receiving unit, the component to be tested can be electrically connected to a test fixture connected to the test fixture. An input signal can be applied to the component to be tested via the test fixture, and the test fixture then receives a corresponding output signal from the component to be tested. The output signal can be compared with a reference signal to verify the functionality of the component to be tested.

[0003] Furthermore, the functionality of the component under test is also tested under various test parameters, such as different temperatures and / or air pressures. For this purpose, the test device is usually placed in a test chamber in which the desired test parameters are simulated.

[0004] However, the preparation and execution of tests in appropriate test chambers is very time-consuming and complex.

[0005] Furthermore, DE 10 2007 032 557 A1 relates to a device for testing electronic components, in particular ICs. Under certain pressure conditions, the pressure test chamber has contact elements, which are connected to an electronic test device on the one hand and extend into a cavity of the pressure test chamber on the other. An airtight sealing board is arranged within the cavity of the pressure test chamber. This sealing board extends transversely across the contact elements and is sealed at the edges to an associated pressure chamber half. The sealing board separates first contact element sections from second contact element sections in an airtight manner, yet maintains an electrically conductive connection.

[0006] Furthermore, US 2010 / 0125377 A1 relates to an apparatus for testing semiconductor devices. The apparatus comprises a chamber defining an interior for receiving a plurality of semiconductor devices, a temperature control device connected to the chamber and configured to heat or cool the chamber to a predetermined level, and a control module for sending an electrical signal to the temperature control device to heat or cool an interior of the chamber. As a result, the semiconductor devices can be exposed to heating and cooling environments in which test temperature values ​​are set to selectively perform a test.

[0007] It is therefore an object of the present invention to provide a test device which enables simple testing under different test parameters, a corresponding method for testing an electrical component and a use of this test device for testing an electrical component.

[0008] This object is achieved by the subject matter of the independent claims. Preferred embodiments are defined in the dependent claims.

[0009] One aspect of the invention relates to a test device for testing electrical components, comprising: a printed circuit board, an airtight sealable chamber arranged on an arrangement side of the printed circuit board, which has an internal cavity, a component receiving unit arranged in the cavity for receiving a component to be tested, wherein the component receiving unit has electrical contacting means for electrically contacting the component to be tested and the electrical contacting means is electrically connected to a contact arranged outside the chamber, and wherein the test device has at least one control means for controlling at least one test parameter within the cavity.

[0010] Advantageously, the test device allows the component to be tested, for example a semiconductor component or microchip, to be arranged within the cavity, where the component to be tested is directly exposed to the controlled test parameter. By designing the chamber to be airtight, the test parameter can be set and easily maintained within the cavity or chamber, so that the test of the component to be tested can be carried out under the desired or defined test conditions and / or test parameters. Preferably, the chamber can be closed in a fluid-tight manner. Designing the chamber to be airtight or fluid-tight further ensures that the cavity is airtight or fluid-tight. In other words, no gas or fluid can penetrate into the cavity from outside the chamber and / or no gas or fluid can escape from the cavity (except via means provided for this purpose).

[0011] The test device is preferably designed such that the electrical contacting means are electrically connected to the contact arranged outside the chamber by means of the circuit board. In particular, the circuit board can have electrical conductors which electrically connect the electrical contacting means to the contact arranged outside the chamber. The test device, in particular the component to be tested, can be electrically connected to a test device via the contact arranged outside the chamber. Furthermore, the test device can be designed to input input signals to the component to be tested and subsequently receive output signals from the component to be tested. The output signals can be compared with reference signals in order to determine the functionality or freedom from defects of the component to be tested.

[0012] The chamber is preferably solid, for example made of a metallic material such as aluminum or steel, to ensure the chamber is as stable as possible. The chamber is designed as a sealable chamber so that it can be opened and closed. To place a component to be tested in the component receiving unit, the chamber must be opened. To carry out a test on a component to be tested, the chamber is preferably closed. In a preferred embodiment, the chamber is designed as a fluid-tight, sealable chamber. In other words, the chamber is gas-tight and liquid-tight so that no gas and / or liquid can penetrate into and / or escape from the chamber.

[0013] Preferably, the test parameter comprises at least one or more of the following parameters: temperature within the cavity, air pressure within the cavity, air humidity within the cavity, or air composition within the cavity.

[0014] For example, the control means can be designed as a heating and / or cooling means arranged on the chamber, which is designed to heat and / or cool a fluid located in the cavity.

[0015] Preferably, the chamber has a plurality of fins arranged on the chamber, which serve to cool the chamber.

[0016] Preferably, the cavity is fluidly coupled to the at least one control means and the at least one control means is designed to exchange a fluid present in the cavity, such as a gas or a liquid.

[0017] Advantageously, the desired test parameter or parameters can be specifically adjusted by exchanging the fluid contained in the cavity. The at least one control means preferably comprises an inlet connection through which a fluid can be supplied to the cavity and an outlet connection through which a fluid can be removed from the cavity. For example, a specific temperature can be achieved as a test parameter within the cavity by supplying a correspondingly tempered fluid, such as air, to the cavity through the inlet connection. Preferably, a fluid, such as air, can be removed from the cavity via the outlet connection until the desired temperature within the cavity is reached.Furthermore, fluid circulation within the cavity can be achieved via the inlet and outlet ports to adjust or maintain the test parameter throughout the entire test of the component under test. Furthermore, fluid circulation ensures that the test parameter is uniform throughout the entire cavity.

[0018] Preferably, a sealing means is arranged between the chamber and the circuit board to connect the chamber to the circuit board in an airtight, preferably fluid-tight, manner. In particular, the cavity of the chamber can extend to the circuit board, so that the cavity is connected to the assembly side of the circuit board.

[0019] Advantageously, the sealing means prevents fluid from escaping from the cavity into the environment of the test device via a contact surface between the chamber and the assembly side of the circuit board and / or fluid from the environment of the test device penetrating into the cavity. The sealing means can be designed, for example, as a sealing ring arranged between the chamber and the assembly side of the circuit board. Preferably, the chamber is secured to the circuit board with securing means such that the sealing ring is crimped to ensure the highest possible tightness. Screws can be used as securing means, for example, to screw the chamber to the circuit board.

[0020] Preferably, a support plate is arranged on a side of the circuit board opposite the assembly side. In other words, the circuit board is arranged between the chamber and the support plate.

[0021] Advantageously, the circuit board is stabilized and supported by the support plate, so that the circuit board is protected from damage, for example, due to bending of the circuit board. Furthermore, the at least one control means can be arranged on the support plate. In particular, the inlet port and the outlet port can be arranged on the support plate, wherein the inlet port and the outlet port are fluidly connected to the cavity.

[0022] Advantageously, arranging the inlet port and the outlet port on the support plate enables a modular design of the test device so that, for example, the chamber can be easily replaced on the test device.

[0023] The support plate is preferably connected to the circuit board in an airtight, preferably fluid-tight, manner. Advantageously, the airtight connection prevents a fluid from escaping from the cavity and / or from penetrating the cavity. In particular, a sealing element, such as a sealing ring, can be arranged between the circuit board and the support plate, with which the airtight, preferably fluid-tight, connection is established.

[0024] Preferably, the component holding unit is replaceable.

[0025] Advantageously, an interchangeable component holding unit allows the chamber to be quickly adapted to other, non-identical components to be tested. For example, the component holding unit has an arrangement area in which the component to be tested can be arranged. The arrangement area can further be adapted to a spatial configuration of the component to be tested, for example, to the shape of the component to be tested. In particular, the component holding unit can be detachably arranged in the chamber, thus ensuring easy replacement of the component holding unit. For example, the component holding unit can be arranged in the chamber with securing means, such as screws.

[0026] The chamber preferably has a first chamber section and a second chamber section, wherein the first chamber section is connected to the circuit board in an airtight, preferably fluid-tight, manner and has the component receiving unit, and wherein the second chamber section is arranged on the first chamber section in such a way that the first chamber section and the second chamber section can be reclosed with one another. In particular, a sealing means can be arranged between the first chamber section and the second chamber section so that, when the chamber is closed, the chamber is sealed in an airtight or fluid-tight manner. The first chamber section and the second chamber section are preferably designed to be movable relative to one another in order to enable the chamber to be opened and / or closed.

[0027] Preferably, the first chamber section and the second chamber section are connected to one another on one side by means of a connecting element, and the second chamber section has an engagement element on a side opposite the first side, which is designed to engage with an engagement arranged on the opposite side of the first chamber section to close the chamber. In particular, the connecting element can be designed as a hinge. Preferably, the connecting element has a holding function, which enables the first chamber section and the second chamber section to be securely held in an open position.

[0028] Preferably, the test device has a lever element arranged on the engagement element for moving the engagement element, wherein upon actuation of the lever element the second chamber section is movable in the direction of the first chamber section.

[0029] Advantageously, the second chamber section can be pressed particularly strongly onto the first chamber section by means of the lever element, so that the chamber can be closed airtight, in particular fluid-tight.

[0030] Preferably, the second chamber section has an elevation on a side opposite the first chamber section, which elevation contacts a component located in the component receiving unit when the chamber is closed.

[0031] Advantageously, the raised portion presses the component to be tested into the component receiving unit, thereby securely electrically connecting the component to be tested to the contacting means. In particular, the contacting means can be designed as spring contact pins, so that pressing through the raised portion causes the spring contact pins to compress.

[0032] Preferably, at least one sensor element for detecting the test parameter can be arranged in the chamber or in the cavity of the chamber. For example, the at least one sensor element can be designed as a temperature sensor or pressure sensor. Preferably, the chamber or cavity has both a temperature sensor and a pressure sensor.

[0033] Advantageously, the sensor element enables the detection of the test parameter within the cavity, so that if the test parameter present in the chamber deviates from a desired test parameter, the test parameter present in the cavity can be adjusted.

[0034] Preferably, the chamber has an external dimension in width of 10 cm to 15 cm, in depth of 6 cm to 10 cm, and in height of 3 cm to 4 cm.

[0035] Advantageously, the chamber has very small dimensions and a small volume, which correspondingly reduces the volume of the cavity. This allows the test parameter to be set or adjusted quickly, resulting in low latency. Furthermore, the chamber requires little energy to maintain the test parameter within the cavity compared to a test chamber in which a conventional test device is placed, since the test parameter only needs to be maintained within the cavity of the chamber.

[0036] A further aspect of the invention relates to a chamber for testing electrical components, comprising: an internal cavity, a component receiving unit arranged in the cavity for receiving a component to be tested, wherein the component receiving unit has electrical contacting means for electrically contacting the component to be tested and the electrical contacting means is electrically connected to a contact arranged outside the chamber, and wherein the chamber has at least one control means for controlling at least one test parameter of the cavity and the cavity can be closed hermetically.

[0037] Furthermore, the chamber can be designed as described above. In particular, the chamber can be arranged on a circuit board. Alternatively, the chamber can also be electrically connected directly, i.e., without being arranged on a circuit board, to a test device by means of the contact located outside the chamber.

[0038] A further aspect of the invention relates to a use of a test device which can be designed as described above.

[0039] A further aspect of the invention relates to a method for testing electrical components with a test device as described above, comprising: inserting an electrical component into the component receiving unit, closing the chamber, setting a test parameter within the cavity and testing the electrical component.

[0040] An embodiment of the invention is described in more detail below with reference to the accompanying figures. It is understood that the present invention is not limited to this embodiment, and that individual features of the embodiment can be combined to form further embodiments within the scope of the appended claims.

[0041] They show: Fig. 1 a perspective view of a test device with an open chamber; Fig. 2 shows a top view of the test device in the Y direction; Fig. 3 shows a cross-section of the test device; and Fig. Figure 4 shows a perspective view of the test device with the closed chamber.

[0042] Fig. 1 shows a perspective view of a test device 10 for testing electrical components. The test device 10 has a chamber 12 arranged on an arrangement side 14 of a printed circuit board 16. The chamber 12 is designed to be particularly airtight, preferably fluid-tight, and closable. Inside the chamber 12, the chamber 12 has a cavity 18. Arranged in the cavity 18 is a component receiving unit 20 which is designed to receive a component to be tested. In particular, the component receiving unit 20 can have a plurality of arrangement positions 22, each of which can receive an electrical component to be tested. Furthermore, the component receiving unit 20 can be arranged interchangeably in the cavity 18, so that a change of the component receiving unit 20 is possible. For example, the component receiving unit can be secured in the chamber by means of the connecting means 21.The connecting means 21 can be designed, for example, as screws.

[0043] In the chamber 12, contacting means 24 are also arranged (see Fig. 3), which are designed to electrically contact a component to be tested arranged in the component receiving unit 20. Furthermore, the contacting means 24 is designed to connect the component arranged in the component receiving unit 20 with an electrical contact 26 arranged outside the chamber 12 (see Fig. 2) electrically connected. The test device 10 can be coupled to a test device (not shown) using the electrical contact 26.

[0044] The chamber 12 is particularly solid, for example, made of a metal, to ensure particularly high stability. Furthermore, the chamber 12 can be made of a material with high thermal conductivity, such as aluminum or copper. Furthermore, the surfaces of the chamber 12 can be passivated to prevent or slow down corrosion of the chamber 12.

[0045] As in Fig. 1 and Fig. As shown in Figure 4, cooling fins 13 are formed on the chamber 12 to enable good heat dissipation.

[0046] As in Fig. 1, the chamber 12 consists of a first chamber section 28 and a second chamber section 30, which are designed to be movable relative to one another via a connecting element 32 arranged on a first side of the chamber 12. The connecting element 32 can be designed, for example, as a hinge. The first chamber section 28 is arranged on the arrangement side 14 of the circuit board 16. Furthermore, a first sealing element 40 is formed on the first chamber section 28, which, when the chamber is closed, is arranged between the first chamber section 28 and the second chamber section 30. The sealing element 40 enables the chamber 12 to be closed in an airtight, preferably fluid-tight, manner.

[0047] Furthermore, a support plate 34 is arranged on a side of the circuit board 16 opposite the assembly side 14. In particular, the support plate 34 can be attached to the opposite side of the circuit board 16.

[0048] As in the Fig. 2 and Fig. As shown in Figure 3, two control means 36 are provided on the support plate, which communicate with the cavity 18 of the chamber 12. In particular, the cavity 18 extends in the first chamber section 28 to the assembly side 14 of the circuit board 16. Furthermore, at least one connecting channel 17 is formed in the circuit board 16 to establish a fluid connection between the control means 36 and the cavity 18.

[0049] The control means 36 makes it possible to set or regulate at least one test parameter in the chamber 12 or the cavity 18. The test parameter can include at least one or more of the following parameters: temperature within the cavity, air pressure within the cavity, air humidity within the cavity, or air composition within the cavity.

[0050] For example, one of the control means 36 can be designed as an inlet port, via which a fluid, such as a gas or a liquid, is supplied to the cavity. Furthermore, the other of the control means 36 can be designed as an outlet port to discharge the fluid from the cavity 18. For example, a temperature-controlled gas can be supplied to the cavity 18 via the inlet port in order to control or regulate the temperature within the cavity 18.

[0051] Furthermore, a sensor element 46 can be arranged within the chamber 12 or in the cavity 18 to detect the test parameter. The sensor element 46 can be configured, for example, as a temperature sensor to detect the temperature within the cavity 18. Should the temperature deviate from a predetermined value, the temperature within the cavity 18 can be regulated via the control means 36.

[0052] Furthermore, the sensor element 46 can also be designed as a pressure sensor to detect a pressure within the chamber 12 or within the cavity 18. Preferably, both a temperature sensor and a pressure sensor are arranged within the cavity 18.

[0053] In order to make the test device 10 or the chamber 12 airtight or fluid-tight, the test device 10 has several sealing elements (see Fig.3). As previously described, a first sealing element 40 is formed on the first chamber section 28, so that when the chamber 12 is closed, the first sealing element 40 is arranged between the first chamber section 28 and the second chamber section 30. Furthermore, the test device 10 has a second sealing element 42, which is arranged between the first chamber section 28 and the arrangement side 14 of the circuit board 16. The second sealing element 42 is designed, in particular, to connect the first chamber section 28 to the circuit board 16 in an airtight, preferably fluid-tight, manner.

[0054] Furthermore, a third sealing element 44 is arranged between the circuit board 16 and the support plate 34 to connect the circuit board 16 to the support plate 34 in an airtight, preferably fluid-tight, manner. The first sealing element 40, the second sealing element 42, and the third sealing element 44 are particularly designed to prevent a fluid from escaping from the chamber 12 or the cavity 18 and / or from penetrating the chamber 12 or the cavity 18 when the chamber 12 is closed.

[0055] Furthermore, at least one elevation 48 is formed on the second chamber section 30, which, when the chamber 12 is closed, presses against a component arranged in the component receiving unit 20, so that this component is securely electrically contacted with the contacting means 24. The at least one elevation 48 is formed on a side of the second chamber section 30, which, when the chamber 12 is closed, is in communication with the cavity 18. In particular, the contacting means 24 can be designed as spring contact pins. In the event that the component receiving unit 20 has a plurality of arrangement positions 22, a corresponding elevation 48 can be formed on the second chamber section 30 for each arrangement position 22.

[0056] To securely close the chamber 12, the chamber 12 has a locking mechanism. The locking mechanism comprises an engagement 50 arranged on the first chamber section 28. In particular, the engagement 50 is arranged on a side of the first chamber section 28 that is opposite the arrangement side of the connecting element 32. The engagement 50 can in particular be rigid. Furthermore, the second chamber section 30 has an engagement element 52 that is preferably movable. The engagement element 52 is arranged on a side of the second chamber section 30 that is opposite the arrangement side of the connecting element 32. When the chamber 12 is closed, the engagement 50 and the engagement element 52 are therefore arranged on the same side of the chamber 12.

[0057] Furthermore, the locking mechanism has a lever element 54, which is designed to move the engagement element 52. In particular, the lever element 54 enables the second chamber section 30 to be pulled toward the first chamber section 28 when the chamber 12 is closed by actuating the lever element 54. This allows a particularly airtight connection, preferably a fluid-tight connection, to be established between the first chamber section 28 and the second chamber section 30. List of reference symbols 10 Test device 12 chambers 13 cooling fins 14 Layout side of a circuit board 16 circuit board 17 connecting channel 18 cavity 20 Component holding unit 21 connecting devices 22 arrangement positions 24 contact agents 26 Contacting 28 first chamber section 30 second chamber section 32 connecting element 34 Support plate 36 control agents 38 connecting channels 40 first sealing element 42 second sealing element 44 third sealing element 46 Sensor element 48 Survey 50 interventions 52 engagement element 54 Lever element

Claims

[1] Test device (10) for testing electrical components, comprising: - a printed circuit board (16); - an airtight sealable chamber (12) arranged on an arrangement side (14) of the circuit board (16), wherein the chamber (12) has a first chamber section (28) and a second chamber section (30) which are designed to be movable relative to one another, wherein the first chamber section (28) is arranged on the arrangement side of the circuit board, and wherein the chamber (12) has an internal cavity (18); - a component receiving unit (20) arranged in the cavity (18) and in the first chamber section (28) for receiving a component to be tested, wherein the component receiving unit (20) has electrical contacting means (24) for electrically contacting the component to be tested and the electrical contacting means is electrically connected to a contact (26) arranged outside the chamber, and wherein the test device (10) has at least one control means (36) for controlling at least one test parameter within the cavity (18). [2] Test device (10) according to claim 1, wherein the test parameter comprises at least one or more of the following parameters: temperature within the cavity (18), air pressure within the cavity (18), air humidity within the cavity (18), or air composition within the cavity (18). [3] Test device (10) according to claim 1 or 2, wherein the cavity (18) is fluidly coupled to the at least one control means (36) and the at least one control means (36) is designed to exchange a fluid present in the cavity (18). [4] Test device (10) according to one of the preceding claims, wherein a sealing means (42) is arranged between the chamber (12) and the circuit board (16) in order to connect the chamber (12) to the circuit board (16) in an airtight manner. [5] Test device (10) according to one of the preceding claims, wherein a support plate (34) is arranged on a side of the circuit board (16) opposite the arrangement side (14) and the at least one control means (36) is arranged on the support plate (34). [6] Test device (10) according to claim 5, wherein the support plate (34) is hermetically connected to the circuit board (16). [7] Test device (10) according to one of the preceding claims, wherein the component receiving unit (20) is replaceable. [8] Test device (10) according to one of the preceding claims, wherein the first chamber section (28) is connected airtight to the circuit board (16), and wherein the second chamber section (30) is arranged on the first chamber section (28) such that the first chamber section (28) and the second chamber section (30) are resealable with each other. [9] Test device (10) according to claim 8, wherein the first chamber section (28) and the second chamber section (30) are connected to one another on one side by means of a connecting element (32) and the second chamber section (30) has an engagement element (52) on a side opposite the first side, which engagement element is designed to engage with an engagement (50) arranged on the opposite side of the first chamber section (28) to close the chamber (12). [10] Test device (10) according to claim 9, further comprising a lever element (54) arranged on the engagement element (52) for moving the engagement element (52), wherein upon actuation of the lever element (54) the second chamber section (30) is movable in the direction of the first chamber section (28). [11] Test device (10) according to one of the preceding claims 8-10, wherein the second chamber section (28) has, on a side opposite the first chamber section (28), an elevation (48) which, in the closed state of the chamber (12), contacts a component located in the component receiving unit (20). [12] Use of a test device (10) according to one of claims 1-11 for testing an electrical component. [13] Method for testing electrical components with a test device (10) according to one of claims 1-11, comprising: - inserting an electrical component into the component receiving unit (20); - closing the chamber (12); - setting a test parameter within the cavity (18); and - Testing the electrical component.

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