Method for manufacturing a sensor housing and sensor housing

Abstract

Method for manufacturing a sensor housing 1 with a contact adapter 2, wherein the contact adapter 2 is connected to the sensor housing 1 by means of an adhesive bond using adhesive 4, characterized in that the adhesive 4 has magnetizable additives 6 or dipole additives 10, wherein energy is supplied to the adhesive 4 without contact, thereby curing the adhesive 4, thereby fixing the contact adapter 2 in the sensor housing 1, wherein a magnetic field is generated by means of an arc-shaped field coil 7, wherein the adhesive 4 is detected by the magnetic field of the arc-shaped field coil 7, and wherein the contact adapter 2 is rotated in the magnetic field of the arc-shaped field coil 7.

Description

[0001] The present invention relates to a method for manufacturing a sensor housing with a contact adapter according to the preamble of claim 1 and a sensor housing according to claim 5.

[0002] The present invention relates to a sensor housing of a sensor which is designed as an optoelectronic sensor, for example as a light barrier or light switch, or which also operates according to another sensor principle, for example as an inductive or capacitive sensor.

[0003] Sensor housings, for example, have a contact adapter for a plug connection or for a cable with a plug.

[0004] The contact adapter provides, for example, a power supply and / or a communication interface for the sensor.

[0005] The contact adapter is fixed in the sensor, for example, via a material-bonded connection, such as an adhesive bond.

[0006] DE 10 2006 007 563 A1 discloses an adhesive containing nanoscale superparamagnetic, ferromagnetic, ferrimagnetic or paramagnetic particles coated with poly(meth)acrylates.

[0007] EP 0 498 998 A2 discloses a method for remotely heating a polymer material to a selected temperature, wherein particulate ferromagnetic material with a Curie temperature corresponding to the selected heating temperature is dispersed over the polymer material to form a composite, and microwave energy is applied to the resulting composite. Preferably, the particulate ferromagnetic material constitutes only about 2% by weight of the total composite. The polymer material can be a compliant, thermosetting plastic, and the Curie temperature of the particulate ferromagnetic material dispersed therein can advantageously be above the curing temperature of the polymer, so that a beam of microwave energy can be used to construct surfaces or joints in composite structures.

[0008] US Patent 4,762,864 A discloses an adhesive composition that can be cured by electromagnetic induction heating when applied to various substrates, wherein the adhesive comprises a mixture of an epoxy resin component and a hardener component and 2 to 60 wt.%.

[0009] DE 35 18 946 A1 discloses a device for joining parts by means of a thermally activatable adhesive, with a frequency generator and an induction coil connected thereto, which serves for inductively heating metallic surfaces of the parts or a metallic adhesive carrier in contact with the adhesive and to which a ferrite body for magnetic field shaping is assigned, wherein the ferrite body and the induction coil are inserted into a housing made of insulating material and together with this form a freely handleable, preferably ergonomically shaped working device.

[0010] The object of the present invention is to provide the simplest possible cable fixing, socket fixing, plug fixing or contact adapter fixing on a sensor housing, which is sealed according to the requirements of protection class IP67, whereby this sealing should also be guaranteed after aging, or in the case of high temperature changes and after a tensile load on the contact adapter.

[0011] The problem is solved according to claim 1 by a method for manufacturing a sensor housing with a contact adapter, wherein the contact adapter is connected to the sensor housing by means of an adhesive bond using an adhesive, wherein the adhesive has magnetizable additives or dipole additives, wherein energy is supplied to the adhesive without contact, thereby curing the adhesive, thereby fixing the contact adapter in the sensor housing, wherein a magnetic field is generated by means of an arc-shaped field coil, wherein the adhesive is detected by the magnetic field of the arc-shaped field coil, and wherein the contact adapter is rotated in the magnetic field of the arc-shaped field coil.

[0012] Furthermore, the problem according to claim 5 is solved with a sensor housing which is manufactured according to a method according to at least one of claims 1 to 4.

[0013] Because the hardening process only occurs when energy is applied, the bonding process can be timed. This allows for adjustments between the sensor housing and the contact adapter before the energy is applied, without the adhesive having yet reacted.

[0014] By curing with non-contact energy application, the adhesive bond can be hardened very quickly. For example, it is possible for the bond to be load-bearing after approximately 30 seconds of processing time. This allows the sensor housing to be processed further immediately. As a result, the sensor and sensor housing can be manufactured more efficiently and quickly.

[0015] The non-contact energy application does not require a direct line of sight to the bonding surface, as is necessary with UV bonding, for example. This non-contact energy application also allows adhesive to be cured on surfaces that are not visually obscured.

[0016] For example, the adhesive can be designed as a hot melt adhesive, so that this adhesive is liquid when heated and can be applied to the bonding area, for example, by spraying it through a nozzle when heated.

[0017] Furthermore, it is possible to compact the adhesive after application. This can be achieved, for example, by applying the adhesive into a filling chamber or adhesive cavity between the sensor housing and the contact adapter, and then joining the sensor housing and the contact adapter. The joining process can optionally compact the adhesive in the filling chamber. Compacting the adhesive minimizes or even eliminates any adverse shrinkage effect.

[0018] The joining process can also be carried out during the activation of the adhesive bond by the energy supply.

[0019] According to the invention, the bonding can also be carried out on a finished sensor housing. For example, a final, desired contact adapter can be bonded to the sensor housing. This allows the sensor variant to be formed very late in the production process, thereby reducing storage costs and inventory, resulting in cost savings.

[0020] In a further development of the invention, the adhesive has magnetizable additives and the adhesive is heated by means of induction, whereby the adhesive is hardened, thereby fixing the contact adapter in the sensor housing.

[0021] An adhesive with magnetizable additives, which is activated by induction, is known, for example, from DE 3240319 A1 or DE 3233837 A1.

[0022] For example, the adhesive is a thermosetting acrylate-epoxy resin composition with magnetizable additives.

[0023] The invention relates, for example, to an adhesive solvent-free composition that is used as an adhesive and is heat-curable in a very short time.

[0024] Energy is induced in the magnetic additives of the adhesive using a magnetic field from a field coil. This heats, or rather, energizes only the adhesive. As a result, surrounding components, such as plastic parts, and especially the sensor housing itself, are not exposed to energy, thus preventing any adverse effects. Because only the adhesive is energized, the bonding process can be carried out precisely, and the bonding time can be precisely controlled.

[0025] Furthermore, the contact adapter is easier to handle if it is magnetic. This allows the contact adapter to be positioned using magnetic guides.

[0026] According to the invention, a magnetic field is generated by means of an arc-shaped, horseshoe-shaped or U-shaped field coil, wherein the adhesive is captured by the magnetic field of the arc-shaped field coil.

[0027] This makes it possible to guide the assembly to be glued laterally into the magnetic field or to guide the field coil laterally onto the assembly to be glued.

[0028] According to the invention, a magnetic field is generated by means of an arc-shaped field coil, wherein the contact adapter is rotated in the magnetic field of the arc-shaped field coil.

[0029] The adhesive is activated evenly by rotating the assembly or the field coil.

[0030] In a further development of the invention, the magnetic field is aligned by means of field direction elements.

[0031] The field direction elements can be, for example, arranged ferritic shields. The field direction elements can be movable. The field direction elements can have a geometric shape to provide the directionality characteristic. For example, the field direction elements can have a U-shaped cross-section.

[0032] In an alternative embodiment of the invention, the adhesive has dipole additives, wherein the adhesive is heated by means of microwaves, thereby hardening the adhesive and securing the contact adapter in the sensor housing.

[0033] An adhesive with added dipoles, which is heated by microwaves, is known from DE 102006059462 A1.

[0034] For example, a non-reactive thermoplastic hot melt adhesive that can be heated by microwave radiation can be used. For example, it contains at least 50 wt% of the base polymers of a thermoplastic polymer made from ethylene-vinyl acetate, and optionally additional thermoplastic polymers containing polar groups, as well as 0.5 to 15 wt% of polyols with a boiling point above 120°C.

[0035] Potential non-crosslinking hot melt adhesives typically contain 15 to 80 wt% of thermoplastic base polymers, which impart the adhesive's fundamental properties, such as melt viscosity and melting behavior, adhesion, and stability. It is possible for at least 50 wt% of the base polymers to consist of ethylene vinyl acetate copolymers. Hot melt adhesives containing at least 70 wt% thermoplastic EVA polymers, based on the amount of base polymers, are particularly suitable.

[0036] The advantages mentioned above for magnetizable additives also apply to dipole additives.

[0037] The invention is further explained below with regard to its advantages and features, using exemplary embodiments and the accompanying drawing. The figures in the drawing show: Fig. 1a a sensor housing according to the invention; Fig. 1b a contact adapter; Fig. 1c Contacts of the contact adapter; Fig. 2, Fig. 3, Fig. 4, Fig. 5 to Fig. 6 each a sensor housing with one contact adapter.

[0038] In the following figures, identical parts are labelled with identical reference symbols.

[0039] Fig. Figure 1a shows a sensor housing 1 of a sensor that is designed as an optoelectronic sensor, for example as a light barrier or light switch, or that operates according to another sensor principle, for example as an inductive or capacitive sensor. The sensor is connected via a plug or socket, primarily for power supply, but also for data or signal transmission. The sensor housing 1 can also have other housing shapes and, in particular, can be designed to be especially small as a miniature sensor.

[0040] The sensor housing 1 according to Fig. 1a is produced, for example, according to the method according to the invention.

[0041] Fig. Figure 1b shows a contact adapter 2 which is inserted into the sensor housing 1 according to Fig. 1a is arranged. The contact adapter 2, which encloses the contacts 11, is preferably made of plastic.

[0042] Fig. Figure 1c shows metallic contacts 11 which are in the contact adapter 2 according to Fig. 1b are arranged. The contacts 11, for example, are designed as pin contacts.

[0043] Fig. Figure 2 shows a method for manufacturing a sensor housing 1 with a contact adapter 2, wherein the contact adapter 2 is connected to the sensor housing 1 by means of an adhesive connection 3 using adhesive 4, wherein the adhesive 4 has additives 5, wherein energy is supplied to the adhesive 4 without contact, thereby curing the adhesive 4, thereby fixing the contact adapter 2 in the sensor housing 1.

[0044] According to Fig. The contact adapter 2 is formed by a pre-molded part on the cable or conductor 15 and a sleeve 13. The adhesive 4 is arranged in an adhesive chamber 17 between the contact adapter 2 or the sleeve 13 and the sensor housing 1. The contact adapter 2 is inserted into the sensor housing 1 in the insertion direction 14. In this example, the insertion direction 14 is from the inside of the sensor housing outwards in the direction of the conductor 15, thereby applying pressure to the adhesive joint.

[0045] This makes it possible to compact the adhesive 4 after application. This is achieved by applying the adhesive 4 into a filling space or adhesive chamber 17 between the sensor housing 1 and the contact adapter 2, and then joining the sensor housing 1 and the contact adapter 2. During the joining process, the adhesive 4 in the adhesive chamber 17 can optionally be compacted. Compacting the adhesive 4 minimizes or even completely eliminates any adverse shrinkage effect.

[0046] The joining process can also be carried out during the activation of the adhesive bond by the energy supply.

[0047] According to Fig. The contact adapter 2 is formed by a pre-molded part on the cable or conductor 15 and a sleeve 13. The adhesive 4 is arranged in an adhesive chamber 17 between the contact adapter 2 or the sleeve 13 and the sensor housing 1. The contact adapter 2 is conically shaped. The contact adapter 2 is inserted into the sensor housing 1 in the joining direction. In this example, the joining direction is from the outside into the sensor housing 1 towards the inside, thereby applying pressure to the adhesive joint.

[0048] According to Fig. 2 and Fig. 3 the adhesive 4 has magnetizable additives 6 and the adhesive 4 is heated by induction, thereby hardening the adhesive 4, which secures the contact adapter 2 in the sensor housing 1.

[0049] According to Fig. Energy is induced in the magnetizable additives 6 of the adhesive 4 by means of a magnetic field from a field coil 16. This means that only the adhesive 4 is heated or supplied with energy. As a result, surrounding components, such as plastic components, and in particular the sensor housing 1 itself, are not exposed to energy, thus preventing any adverse effects on these components. Because only the adhesive 4 is supplied with energy, the bonding process can be carried out precisely and the bonding time can be precisely controlled.

[0050] Furthermore, according to Fig. 4. Easy handling of the contact adapter 2 is possible if the contact adapter 2 itself is magnetizable. This allows the contact adapter 2 to be positioned by magnetic guides.

[0051] According to Fig. 4 A magnetic field is generated in particular by means of an arc-shaped, horseshoe-shaped or U-shaped field coil 7, wherein the adhesive 4 is captured by the magnetic field of the arc-shaped field coil 7.

[0052] This makes it possible to guide the assembly to be glued laterally into the magnetic field or to guide the field coil 7 laterally onto the assembly to be glued.

[0053] According to Fig. 4 The magnetic field is aligned using field direction elements 9.

[0054] The field direction elements 9 can, for example, be arranged ferritic shields. The field direction elements 9 can be movable. The field direction elements 9 can have a geometric shape to provide the directionality characteristic. For example, the field direction elements 9 can have a U-shaped cross-section.

[0055] According to Fig. 4. A magnetic field is generated by means of an arc-shaped field coil 7, whereby the contact adapter 2 can be rotated in the magnetic field of the arc-shaped field coil 7. By rotating the assembly or the field coil 7, the adhesive is activated uniformly.

[0056] According to the in Fig. In the embodiment shown in Figure 5, a magnetic field is generated by means of a ring-shaped field coil 8, wherein the contact adapter 2 is located in the center of the field coil 8.

[0057] According to the in Fig. In the alternative embodiment shown in Figure 6, the adhesive 4 has dipole additives 10, wherein the adhesive 4 is heated by means of microwaves, thereby hardening the adhesive 4, thereby securing the contact adapter 2 in the sensor housing 1. Reference symbol: 1 Sensor housing 2 contact adapters 3 Adhesive bond 4 Adhesive 5 Additions 6 magnetizable additives 7 arc-shaped field coil 8 ring-shaped field coil 9 field direction elements 10 dipole attachments 11 contacts 12 Pre-sprue 13 Sleeve 14 Leading direction 15 Management 16 Field coil 17 Adhesive chamber

Claims

[1] Method for manufacturing a sensor housing 1 with a contact adapter 2, wherein the contact adapter 2 is connected to the sensor housing 1 by means of an adhesive bond using adhesive 4, characterized by , that the adhesive 4 has magnetizable additives 6 or dipole additives 10, wherein energy is supplied to the adhesive 4 without contact, thereby curing the adhesive 4, thereby securing the contact adapter 2 in the sensor housing 1, wherein a magnetic field is generated by means of an arc-shaped field coil 7, wherein the adhesive 4 is detected by the magnetic field of the arc-shaped field coil 7, and wherein the contact adapter 2 is rotated in the magnetic field of the arc-shaped field coil 7. [2] Method for manufacturing a sensor housing 1 according to claim 1, characterized by, that the adhesive 4 has magnetizable additives 6, wherein the adhesive 4 is heated by induction, thereby hardening the adhesive 4, thereby securing the contact adapter 2 in the sensor housing 1. [3] Method for manufacturing a sensor housing according to claim 1, characterized by , that the magnetic field is aligned by means of field direction elements 9. [4] Method for manufacturing a sensor housing 1 according to claim 1, characterized by , that the adhesive 4 has dipole additives 10, wherein the adhesive 4 is heated by means of microwaves, thereby hardening the adhesive 4, thereby securing the contact adapter 2 in the sensor housing 1. [5] Sensor housing, characterized by that the sensor housing 1 is manufactured according to at least one of claims 1 to 4.

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