Device and method for treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for EUV lithography masks

Abstract

Device (12) for treating pot-shaped hollow bodies (10), in particular transport containers for semiconductor wafers or for EUV lithography masks, comprising - a wall (14) which encloses an interior space (16), - a gripping and moving device (17) arranged in the interior (16) for moving the hollow body (10) within the interior (16), and - a wall opening (26) formed by the wall (14), which can be closed by a closing element (28) and through which the interior (16) is accessible, wherein the closing element (28) ◯ is movably mounted in the device (12) by means of a fastening unit (30), and ◯ has a receiving section (34) with which the hollow body (10) can be detachably connected to the closure body (28), characterized in that the hollow body (10) - a first gripping section (46) and - has a second gripping section (48), wherein - the receiving section (34) has locking means (36) with which the locking body (28) can interact with the hollow body (10) using the first gripping section (46), and - the gripping and moving device (17) has gripping means (50) with which the gripping and moving device (17) can interact with the hollow body (10) using the second gripping section (48).

Description

[0001] The present invention relates to a device for treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for EUV lithography masks. The invention further relates to a corresponding method.

[0002] The production of highly integrated electronic circuits and other sensitive semiconductor components now takes place in factories where semiconductor wafers undergo a multitude of processing steps. A large portion of these steps are carried out in cleanrooms, which are meticulously kept free of contaminants, especially particles. Such elaborate processing is necessary because particles that come into contact with the semiconductor material of the wafers can affect the material properties of the wafers to such an extent that an entire production batch becomes defective and unusable and must be rejected.

[0003] Since cleanliness becomes increasingly important with the increasing integration density of semiconductor circuits, and the effort required for cleanliness rises exponentially with the size of cleanrooms, semiconductor wafers are not transported "openly" from one processing station to the next. Instead, special transport containers (so-called FOUPs, Front Opening Unified Pods) are used. These are box-shaped transport containers into which a large number of semiconductor wafers are inserted. The FOUPs are usually closed with a removable lid. Without the lid, the FOUPs have a pot-shaped base with a rectangular footprint. When the FOUPs are closed with their lids, the inserted semiconductor wafers can be transported from one cleanroom to another, protected from the environment. Once the FOUPs reach a processing station, they are opened, the semiconductor wafers are removed, and the necessary processing takes place.After processing, the semiconductor wafers are transported back into the FOUPs and then moved to the next processing station.

[0004] Due to the high production downtime caused by semiconductor wafer contamination, it is necessary to clean the FOUPs periodically. The FOUPs are particularly susceptible to contamination from semiconductor wafer abrasion during insertion into and removal from the FOUPs.

[0005] The same principle applies to transport containers for EUV lithography masks (extreme ultraviolet radiation). EUV lithography masks are used to manufacture very small integrated circuits. Like semiconductors, EUV lithography masks also need to be transported, resulting in a similar situation. Therefore, when FOUPs are mentioned below, the statements regarding them apply equally to transport containers for EUV lithography masks.

[0006] Devices for cleaning FOUPs are known, for example, from US 5,238,703 A, WO 2005 / 001888 A2, and EP 1 899 084 B1. EP 1 899 084 B1, in particular, shows that such devices have several treatment units in which different treatment steps for cleaning the FOUPs are carried out. The FOUPs are transported from one treatment unit to the next by means of a gripping and moving device, which may, for example, be designed as a gripping robot.

[0007] A device for cleaning and disinfecting medical containers is known from DE 195 14 468 C1.

[0008] As mentioned earlier, the FOUPs include a lid that seals the hollow interior. While cleaning only the outer surface of the FOUPs does contribute to reducing defective semiconductor wafers, this contribution is significantly less compared to cleaning the inner surface. However, to clean the inner surface, the lid must be removed, requiring the gripping and moving device to perform comparatively complex movements. Since the FOUPs are typically in a fixed position during the cleaning process, the gripping and moving device must have a relatively long reach to grasp and move them. Furthermore, the gripping and moving device cannot always operate at full speed.

[0009] The devices used to clean the FOUPs typically have a wall with an opening through which the interior formed by the wall is accessible. Inserting the FOUPs into and removing them from this interior is also a time-consuming step.

[0010] Due to the aforementioned circumstances, the gripping and moving devices used are expensive, and the cleaning process takes a relatively long time due to the complex movement sequences.

[0011] The object of one embodiment of the present invention is to propose a device for treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers, with which it is possible to shorten the duration of the cleaning process using simple and cost-effective means.

[0012] Furthermore, one embodiment of the present invention is based on the objective of providing a method for treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers, with which the device can be operated.

[0013] This problem is solved by the features specified in claims 1 and 10. Advantageous embodiments are the subject of the dependent claims.

[0014] The present invention is described below using hollow bodies as an example, since the invention is not limited to FOUPs or to transport containers for EUV lithography masks.

[0015] One embodiment of the invention relates to a device for treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for EUV lithography masks, comprising - a wall that encloses an interior space, - a gripping and moving device arranged inside the interior for moving the hollow body within the interior, and - a wall opening formed by the wall, which can be closed by a closing element and through which the interior is accessible, wherein the closing element ◯ is movably mounted in the device by means of a fastening unit and ◯ has a receiving section with which the hollow body can be detachably connected to the closure body.

[0016] The hollow body can be connected to, moved from, and detached from the closure body. The closure body simultaneously serves to close the wall opening.

[0017] The hollow body is connected to the locking body in two steps: First, the hollow body is placed onto the locking body, which can be done manually. Then, the hollow body is locked, which is done automatically.

[0018] The closure body is then moved into a position where the opening is closed, and the hollow body is connected to it in such a way that it can be grasped by the gripping and movement device and subsequently moved within the interior. The closure body is integrated into the movement sequence that the hollow body undergoes during treatment, whereby the hollow body, together with the closure body, is inserted into and removed from the interior.

[0019] According to the invention, the hollow body - a first gripping section and - a second gripping section, whereby - the receiving section has locking means by which the locking body can interact with the hollow body using the first gripping section, and - the gripping and moving device has gripping means with which the gripping and moving device can interact with the hollow body using the second gripping section.

[0020] In this embodiment according to the invention, the hollow body has a first gripping section and a second gripping section. Consequently, it is possible to attach the hollow body, at least temporarily, to both the locking body and the gripping and movement device. For example, the locking means can only be released when the gripping means are fully engaged with the hollow body. On the one hand, the two gripping sections can be arranged so that both are easily accessible even when, for example, the locking body is connected to the first gripping section. On the other hand, it can be ensured that the hollow body is securely connected to at least the gripping and movement device or to the locking body, thereby preventing uncontrolled movement of the hollow body.It is not necessary to lower the hollow body inside, which might be required so that the gripping and movement device can switch from the first gripping section to the second gripping section, thus saving time.

[0021] According to another embodiment, the fastening unit is designed as a hinge with which the locking element is rotatably attached to the wall. In principle, the fastening unit can dictate any desired movement of the locking element; for example, a parallelogram linkage can be provided. However, the use of a fastening unit designed as a hinge involves minimal technical effort. In particular, hinges can easily interact with a drive mechanism. Furthermore, hinges are characterized by high reliability.

[0022] In a further developed embodiment, the locking body can be movable between a first position and a second position, wherein the locking body closes the wall opening in the first position and in the second position.

[0023] The locking mechanism can be L-shaped and have two arms that meet at the pivot point. In the first position, the hollow body is connected to the receiving section of the locking mechanism located on the second arm, with the hollow body positioned outside the interior. The first arm closes the wall opening. In the second position, the hollow body is positioned inside the interior, with the wall opening being closed by the second arm. Since both the first and second positions can be chosen so that the locking mechanism is easily accessible, the movement sequence is simple and quick. A complicated transfer through the wall opening is eliminated. Moving the locking mechanism from the first to the second position also closes the interior. No additional step is required.

[0024] In a further developed embodiment, the device can include an additional gripping and moving device for feeding the hollow body to the closure body and for removing the hollow body from the closure body. As mentioned above, the hollow body can be manually placed onto the closure body in its first position and automatically locked and connected to it. The same applies to releasing and removing the hollow body. With the additional gripping and moving device, which is typically located outside the interior and can, for example, be designed as an overhead transport system (OHT), feeding the hollow body to and removing it from the closure body can be automated. The OHT system can also handle the further transport of the hollow bodies with inserted semiconductor wafers within a cleanroom or between several cleanrooms.Consequently, the present device can also be integrated into an OHT system according to this embodiment.

[0025] In another embodiment, the additional gripping and moving device can have further gripping means with which it can interact with the hollow body using the second gripping section. As mentioned, the additional gripping and moving device is typically arranged outside the interior, while the gripping and moving device is usually arranged inside the interior. Since the two gripping and moving devices are separated from the wall of the device in this case, and the transfer of the hollow body into the interior is handled by the closing body, the two gripping and moving devices never come into contact with the hollow body simultaneously. Therefore, with the proposed device, it is possible to use the second gripping section of the hollow body for two different gripping and moving devices.Consequently, the design of the hollow body can be kept simple, as no third gripping section is required. Furthermore, the gripping elements of the gripping and moving device and the additional gripping elements of the further gripping and moving device can be identical in design, resulting in cost advantages.

[0026] A further developed embodiment in which the hollow body - form a base wall and one or more side walls, - an opening opposite the floor wall, and - which has a lid with which the opening can be closed, is characterized in that the device has at least one lid handling unit which can be detachably connected to the lid.

[0027] As mentioned, cleaning the hollow bodies, especially the FOUPS, only on their outer surface contributes significantly less to reducing defective semiconductor wafers compared to cleaning their inner surface. Cleaning the inner surface requires opening the hollow body, which necessitates removing the lid, a process that can be automated using the lid handling unit. Consequently, the device according to the present embodiment also enables cleaning of the inner surface with the advantages mentioned above.

[0028] According to a further embodiment - the device includes at least one treatment unit with which the hollow body can be treated and a lid handling unit, wherein - the treatment unit has a process chamber in which the hollow body can be treated, - the process room is accessible through a process room opening, and - the lid handling unit is movably mounted in the device by means of a further fastening device between an open position, in which the lid handling unit releases the process chamber opening, and a closed position, in which the lid handling unit closes the process chamber opening.

[0029] As mentioned, the lid is detachably connected to the lid handling unit. Similar to the closure body, the lid handling unit is integrated into the handling of the hollow body, in this case, the handling of the lid of the hollow body. The lid is inserted into the processing unit by moving the lid handling unit from the open position to the closed position and vice versa. This again eliminates the need for complicated insertion into and removal from the process chamber.

[0030] Another embodiment is characterized by the fact that the device includes a first treatment unit, which is designed as a cleaning device for cleaning the hollow body and / or the lid. As mentioned, cleaning the hollow bodies plays a crucial role in reducing defective semiconductor wafers. This embodiment takes the importance of cleaning into account. It is worth noting here that the lid can be cleaned separately from the rest of the hollow body. In particular, the inner surface of the lid can also be cleaned. A cleaning fluid is typically used for this purpose.

[0031] In a further embodiment, the device can include a second treatment unit, which is designed as an evacuation device for creating a vacuum in the hollow body and / or on the lid. Creating a vacuum serves to remove residual cleaning fluid that remains on the surface of the hollow body and the lid after cleaning in the cleaning unit. Due to capillary action, moisture also diffuses into microscopically small pores on the surface of the hollow body and the lid. This moisture can also be removed by the vacuum, thus enabling drying even at a microscopic level.

[0032] Therefore, it is advisable to first feed the hollow body to the cleaning device and then to the evacuation device.

[0033] One embodiment of the invention relates to a method for treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for EUV lithography masks, with a device according to one of the previous embodiments, comprising the following steps: - Moving the shutter body to the first position in which the receiving section is located outside the interior, - Feeding the hollow body to the receiving section and activating the receiving section to connect the hollow body to the closure body, and - Moving the locking body into the second position, in which the locking body closes the wall opening.

[0034] The technical effects and advantages achievable with the proposed method correspond to those discussed for the present device for treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers. In summary, it should be noted that this method requires the gripping and moving device to perform simpler movements compared to methods known from the prior art and therefore allows for a simpler design. Furthermore, the movements can be performed more quickly, thus reducing the duration of the treatment process.

[0035] In a further embodiment, in which the hollow body has a first gripping section and a second gripping section, the method comprises the following steps: - Feeding the hollow body to the closure body by means of a further gripping and moving device, which has further gripping means with which the further gripping and moving device is connected to the hollow body using the second gripping section, - Activating the locking means of the receiving section to connect the hollow body to the locking body using the first gripping section, - Detaching the further gripping and movement device from the second gripping section, - Moving the locking body into the closed position, in which the locking body closes the wall opening, - Connecting the hollow body to the gripping and moving device using the second gripping section, and - Detaching the hollow body from the closure body by deactivating the intake section.

[0036] The feeding of the hollow body to and the removal from the closure body can be automated.

[0037] According to a further developed design, in which the hollow body - a base wall and one or more side walls, - an opening opposite the floor wall, and - which has a lid with which the opening can be closed, the procedure comprises the following steps: - Feeding the hollow body to the lid handling unit using the gripping and moving device, - Connecting the lid to the lid handling unit, and - Separating the lid from the hollow body using the lid handling unit and / or the gripping and moving device.

[0038] In this embodiment of the process, the hollow body can be opened by removing the lid using the lid handling unit, allowing the inner surface of the hollow body to be treated. The lid can also be treated.

[0039] A further developed version of the procedure, in which - the device comprises at least one treatment unit with which the hollow body can be treated, wherein the treatment unit interacts with the lid handling unit, and wherein - the treatment unit has a process chamber in which the hollow body can be treated, and - the process room is accessible through a process room opening, specifies the following steps: - Moving the lid handling unit into an open position in which the lid handling unit releases the process chamber opening, - Connecting the lid to the lid handling unit, and separating the lid from the hollow body using the lid handling unit and / or the gripping and moving device, and - Moving the lid handling unit into the closing position, in which the lid handling unit closes the process chamber opening.

[0040] In this embodiment of the process, the lid handling unit is used not only to separate the lid from the hollow body, but also to insert the lid into the process chamber. This again eliminates the need for the complicated insertion and removal of the lid from the process chamber.

[0041] Exemplary embodiments of the invention are explained in more detail below with reference to the accompanying drawings. These show Fig. 1A to 1T various steps of a proposed method for treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for EUV lithography masks, with an embodiment of a proposed device, Fig. 2 a treatment unit designed as a cleaning device, and Fig. 3. A treatment unit designed as an evacuation facility, each illustrated by basic sectional views.

[0042] In the Fig. Figures 1A to 1T show various steps of a proposed method for treating pot-shaped hollow bodies 10, in particular transport containers for semiconductor wafers, by means of principle sectional views. Fig. Figure 1A also shows a device 12 according to the invention, with which the proposed method can be carried out. The hollow bodies 10 are also referred to as FOUPs.

[0043] The device 12 according to the invention comprises a wall 14 which encloses an interior space 16. A gripping and moving device 17 is provided in the interior space 16, with which the hollow bodies 10 to be treated can be moved within the interior space 16. Furthermore, two treatment units 18 are located in the interior space 16, namely a first treatment unit 181, which is designed as a cleaning device 20 and which is located in the Fig. 2 is shown in detail, and a second treatment unit 182, which is designed as an evacuation facility 22 and is located in the Fig. 3 is shown in more detail.

[0044] Furthermore, the device 12 is equipped with an additional gripping and moving device 24, with which the hollow bodies 10 can be moved outside the interior. The additional gripping and moving device 24 is designed in the manner of an overhead transport system (OHT), in which the hollow bodies 10 are transported near the ceiling.

[0045] The wall 14 forms a wall opening 26, which can be closed by a locking element 28 and through which the interior 16 is accessible. The locking element 28 is movably mounted in the device 12 by means of a fastening unit 30. In this case, the fastening unit 30 is designed as a hinge 32, with which the locking element 28 is rotatably attached to the wall 14 in the manner of a flap. The locking element 28 is movable between a first position and a second position.

[0046] Furthermore, the locking body 28 has a receiving section 34 with which the hollow body 10 can be detachably attached to the locking body 28. In the illustrated embodiment, suitably designed locking means 36 are provided in the receiving section 34 for this purpose.

[0047] In the illustrated embodiment, the locking body 28 is L-shaped and has a first leg 33 and a second leg 35, which form an angle of 90° to each other and are each connected at the hinge 32. The receiving section 34 is arranged on the first leg 33, which in the first position is located outside the interior 16. The second leg 35 closes the opening 26 when the locking body 28 is in the first position, with the second leg 35 bearing against a seal 37 that surrounds the opening 26.

[0048] To move the locking body 28 into the second position, it is rotated by 90° (see Fig. 1B). In the second position, the first leg 33 rests against the seal 37, so that the opening 26 is closed by the first leg 33. Consequently, the opening 26 is only open when the closure body 26 is moved between the first and second positions.

[0049] The hollow body 10 is essentially cuboid in shape and comprises a bottom wall 38 and four side walls 40, an opening 42 opposite the bottom wall 38, and a lid 44 with which the opening 42 can be closed. Furthermore, the hollow body 10 is provided with a first gripping section 46 and a second gripping section 48, each arranged on one of the side walls 40. The first gripping section 46 is designed to interact with the locking means 36 of the receiving section 34 of the closure body 28, thereby allowing the hollow body 10 to be detachably connected to the closure body 28. The second gripping section 48 has a T-shaped cross-section and is therefore also referred to as a "mushroom".

[0050] The gripping and movement device 17 has gripping means 50 and the further gripping and movement device 24 has further gripping means 52, which are essentially identical in design and can interact with the second gripping section 48 of the hollow body 10, so that the hollow body 10 can be gripped.

[0051] With reference to the Fig. Sections 1A to 1T describe a method by which the device 12 can be operated. The following are described in the Fig. Sections 1B to 1T show only the components of the device 12 that are directly involved in the process, with the representation being partially simplified for the sake of clarity.

[0052] The hollow body 10 is gripped at the second gripping section 48 by the further gripping means 52 of the further gripping and moving device 24 (not explicitly shown) and transported towards the device 12. After the hollow body 10 has reached the correct position, it is lowered by the further gripping and moving device 24 and placed onto the locking body 28, which is in the first position, in particular on the receiving section 34, so that the hollow body 10 can be attached to the locking body 28 by the locking means 36 ( Fig. 1A). The additional gripping means 52 are released and the additional gripping and moving device 24 is removed from the hollow body 10 (not shown). The closure body 28 is now moved into the second position, for which it is rotated by approximately 90° by a drive unit (not shown) ( Fig. 1B). The wall opening 26 is closed and the hollow body 10 is inserted into the interior 16. Subsequently, the hollow body 10 is grasped at the second gripping section 48 by the gripping means 50 of the gripping and moving device 17 ( Fig. 1C) and then the locking means 36 of the locking body 28 are released. The hollow body 10 can now be removed from the locking body 28 using the gripping and moving device 17 ( Fig. 1D) and can be moved within the interior 16. From Fig. As can be seen in Figure 1E, the hollow body 10 is now moved to a lid handling unit 54, which is movably mounted in the cleaning device 20 by means of a further fastening device 57 (see Figure 1E). Fig. 2) The operation of the lid handling unit 54 will be explained in more detail later. The lid handling unit 54 can be detachably connected to the lid 44 of the hollow body 10. For this purpose, the hollow body 10 with the lid 44 is placed on the lid handling unit 54 and connecting means 55 (see Fig. 2) activated, with which the lid 44 can be detachably connected to the lid handling unit 54. Subsequently, the hollow body 10 with the gripping and movement device 17 is removed from the lid handling unit 54, whereby the lid 44 remains on the lid handling unit 54 (see Fig. 1F). The opened hollow body 10 is then transported by the gripping and moving device 17 into the cleaning device 20 ( Fig. 1G), where the hollow body 10 is placed on a support wall 62 of the cleaning device 20, on which the hollow body 10 is fixed with fixing agents 63 (see Fig. 2) is attached. The support wall 62 has a through-opening 58 which is adapted to the size of the hollow body 10. The hollow body 10 is, as shown from Fig. 1H is attached to the support wall 62 in such a way that the through-opening 58 is approximately flush with the side walls 40 of the hollow body 10. The gripping and moving device 17 is detached from the hollow body 10 and the inner surface of the hollow body 10 is cleaned by adding a cleaning fluid, as described in Fig. 1H is indicated by the arrows P. After cleaning is complete, the hollow body 10 is again gripped by the gripping and moving device 17 and removed from the support wall 62 ( Fig. 1I). The hollow body 10 is now moved back to the lid handling unit 54 of the cleaning device 20 ( Fig. 1J) and the lid 44 is reconnected to the hollow body 10 ( Fig. 1K).

[0053] The hollow body 10 is then transported with the gripping and moving device 17 to the evacuation device 22, which also has a lid handling unit 102 that is essentially identical in construction to the lid handling unit 54 of the cleaning device 20. The lid 44 is again connected to the lid handling unit 102 of the evacuation device 22 and detached from the hollow body 10 ( Fig. 1L). Subsequently, the hollow body 10 is moved towards a support wall 62 of the evacuation device 22 ( Fig. 1M) and placed on this ( Fig. 1N). Subsequently, a vacuum pump 64, which is connected to a vacuum port 66 of the evacuation device 22, is used ( Fig. 3), a negative pressure was built up in the interior 16 of the hollow body 10, which in Fig. 1N is symbolized by Δp. The gripping and moving device 17 is separated from the hollow body 10 during this time.

[0054] After the evacuation process is completed, the gripping and moving device 17 is reconnected to the hollow body 10 and the hollow body 10 is transported to the lid handling unit 102 of the evacuation device 22 ( Fig. 10 and Fig. 1P). The lid 44 is connected to the hollow body 10 and removed from the lid handling unit 54 ( Fig. 1Q). The hollow body 10 is moved back to the locking body 28, which is in the second position, and placed there on the receiving section 34, so that the hollow body 10 is firmly connected to the locking body 28 as a result of the activation of the locking means 36 ( Fig. 1R). The gripping and moving device 17 is now detached from the hollow body 10 ( Fig. 1S) and the locking body 28 is moved into the first position ( Fig. 1T), in which the hollow body 10 is grasped by the further gripping and moving device 24. The locking means 36 are released and the hollow body 10 is removed from the closing body 28. Now another hollow body 10 can be placed by the further gripping and moving device 24 onto the receiving section 34 and processed in the manner described.

[0055] In Fig. 2 shows the cleaning device 20 in detail, with which the in Fig. The cleaning step shown in Figure 1N can be carried out. The cleaning device 20 has a housing 68, which forms a housing opening 70 that can be closed with a cover 72 that can be removed from the housing 68. Furthermore, the previously described support wall 62 is arranged in the housing 68. The cleaning device 20 forms a process chamber 73, which is bounded by the housing 68 itself and by the cover 72. The support wall 62 forms the previously described through-opening 58, with the previously mentioned fixing means 63 arranged radially outside the through-opening 58. In the illustrated embodiment, two through-bores 78 are provided in the support wall 62 radially outside the fixing means 63.

[0056] The cleaning device 20 has a first cleaning head 80, which protrudes beyond the through-opening 58. The cleaning device 20 also includes a second cleaning head 82, which is essentially U-shaped. The second cleaning head 82 is rotatable about a second axis of rotation D2, the drive mechanism used for this purpose being not shown.

[0057] The housing 68 also forms a process chamber opening 84 through which the process chamber 73 is accessible. The process chamber opening 84 can be closed with the aforementioned cover handling unit 54, which is rotatably attached to the wall section 44 about a first axis of rotation D1 by a further fastening device 57. The cover handling unit 54 can be moved by a drive unit (not shown) between an open position, in which the cover handling unit 54 releases the process chamber opening 84, and a closed position, in which the cover handling unit 54 closes the process chamber opening 84. Fig. 2 is located in the closed position of the lid handling unit 54.

[0058] The cleaning device 20 is also equipped with a further first cleaning head 86, which is located near the lid handling unit 54 when it is in the closed position.

[0059] The cleaning device 20 further comprises a fluid guidance unit 88, with which a first cleaning fluid can be guided, in a manner not shown in detail, to the first cleaning head 80 and to the second first cleaning head 86, and a second cleaning fluid to the second cleaning head 82. The fluid guidance unit 88 further comprises a first discharge channel 90, with which the first cleaning fluid discharged from the first cleaning head 80 and from the second first cleaning head 86 can be discharged again from the process chamber 73.

[0060] Furthermore, the fluid guidance unit 88 has a second discharge channel 92 which communicates with the two through-bores 78. The first cleaning fluid and the second cleaning fluid can therefore be guided separately in the cleaning device 20.

[0061] Referring to the Fig. 1E and Fig. The lid handling unit 54 has already been mentioned in section 1F. The functionality of the lid handling unit 54 will be explained below using the following examples: Fig. 2 is described in more detail. The hollow body 10, with the lid 44 attached, is placed onto the lid handling unit 54 when the latter is in the open position. The lid handling unit 54 includes connecting elements 55, which are now activated so that the lid 44 is attached to the lid handling unit 54. The hollow body 10 is removed from the lid 44 and placed on the support wall 62 with the gripping and moving device 17, the cover 72 being positioned so that it opens the housing opening 72 and consequently provides access to the process chamber 73. The gripping and moving device 17 is then detached from the hollow body 10.

[0062] The lid handling unit 54 is rotated about the first axis of rotation D1 and the process chamber opening 84 is closed. The cover 72 is also positioned as shown in Fig. Figure 2 shows how to close the process chamber 73. The cleaning fluid is now applied to the inner surface of the hollow body with the first cleaning head 80, to the inner surface of the lid with the second cleaning head 86, and to the outer surface of the hollow body with the second cleaning head 82. For this purpose, the first cleaning head 80, the second cleaning head 86, and the second cleaning head 82 each have cleaning nozzles 96.

[0063] Subsequently, a drying gas is applied through drying nozzles 98 of the first cleaning head 80, the second first cleaning head 86, and the second cleaning head 82 to the inner surface of the hollow body, the inner surface of the lid, and the outer surface of the hollow body in order to remove the cleaning fluid. In addition, the first cleaning head 80, the second first cleaning head 86, and the second cleaning head 82 have infrared diodes 100 which can be used to heat and evaporate any remaining cleaning fluid on the inner surface of the hollow body, the inner surface of the lid, and the outer surface of the hollow body.

[0064] The cover 72 is then removed, the hollow body 10 is connected to the gripping and moving device 17, and the lid handling unit 54 is moved into the open position. The hollow body 10 is lifted from the support wall 62 by means of the gripping and moving device 17 and moved onto the lid handling unit 54. The connecting elements 55 are deactivated. The lid 44 is now reconnected to the hollow body 10 and is moved by the gripping and moving device 17 to the Fig. 3 evacuation facility 22 shown in more detail.

[0065] The evacuation device 22 is essentially constructed like the cleaning device 20, however, it does not have a fluid guidance unit or cleaning heads. Instead, the evacuation device 22 has the aforementioned vacuum connection 66, to which the vacuum pump 64, also mentioned, can be connected, so that a negative pressure can be applied in the process chamber 73.

[0066] The evacuation device 22 is also equipped with a lid handling unit 102, which is essentially identical in construction to the lid handling unit 54. The feeding of the hollow body 10 to the evacuation device 22 is carried out in essentially the same way as described for the cleaning device 20. Fig. 3. The cover 72 is connected to the housing as shown, and the lid handling unit 54 is in the closed position, so that the process chamber 73 is closed. The vacuum pump 64 is now activated, and a negative pressure is created in the process chamber 73. Residues of the cleaning fluid located on the inner surface of the hollow body, the inner surface of the lid, and the outer surface of the hollow body are removed.

[0067] After completion of the evacuation process, the cover 72 is removed, allowing access to the process chamber 73 again. The gripping and moving device 17 is connected to the hollow body 10, and the lid handling unit 54 is moved into the open position, where the lid 44 can be connected to the hollow body 10 as described. The hollow body 10 is now completely cleaned and can be used as described in the Fig. 1R to 1T shown, will be transported further. Reference symbol list 10 hollow bodies 12 Device 14 wall 16 Interior 17 Gripping and movement device 18 treatment units 181 first treatment unit 182 second treatment unit 20 Cleaning equipment 22 Evacuation facility 24 additional gripping and movement devices 26 Wall opening 28 locking bodies 30 fastening unit 32 hinge 34 Recording section 36 locking devices 38 Floor wall 40 side wall 42 Opening 44 lids 46 first gripping section 48 second gripping section 50 gripping tools 52 more gripping devices 54 Lid handling unit 55 Fasteners 57 additional fastening devices 58 Passage opening 62 support wall 63 Fixatives 64 Vacuum pump 66 Vacuum connection 68 cases 70 Case opening 72 Coverage 73 Process room 78 Through hole 80 first cleaning head 82 second cleaning head 84 Process room opening 86 more first cleaning head 88 Fluid guidance unit 90 first drainage channel 92 second drainage channel 96 Cleaning nozzle 98 Drying nozzle 100 infrared diodes 102 Lid handling unit D1 first axis of rotation D2 second axis of rotation P Arrows

Claims

[1] Device (12) for treating pot-shaped hollow bodies (10), in particular transport containers for semiconductor wafers or for EUV lithography masks, comprising - a wall (14) which encloses an interior space (16), - a gripping and moving device (17) arranged in the interior (16) for moving the hollow body (10) within the interior (16), and - a wall opening (26) formed by the wall (14), which can be closed by a closure body (28) and through which the interior (16) is accessible, wherein the closure body (28) ◯ is movably mounted in the device (12) by means of a fastening unit (30), and ◯ has a receiving section (34) with which the hollow body (10) can be detachably connected to the closure body (28), characterized by that the hollow body (10) - a first gripping section (46) and - has a second gripping portion (48), wherein - the receiving portion (34) has locking means (36) with which the closure body (28) can interact with the hollow body (10) using the first gripping portion (46), and - the gripping and moving device (17) has gripping means (50) with which the gripping and moving device (17) can interact with the hollow body (10) using the second gripping section (48). [2] Device (12) according to claim 1, characterized by that the fastening unit (30) is designed as a hinge (32) with which the closure body (28) is rotatably fastened to the wall (14). [3] Device (12) according to one of claims 1 or 2, characterized bythat the closure body (28) is movable between a first position and a second position, wherein the closure body (28) closes the wall opening (26) in the first position and in the second position. [4] Device (12) according to one of the preceding claims, characterized by that the device (12) has a further gripping and moving device (24) for feeding the hollow body (10) to the closure body (28) and for removing the hollow body (10) from the closure body (28). [5] Device (12) according to claim 4, characterized by that the further gripping and moving device (24) has further gripping means (52) with which the further gripping and moving device (24) can interact with the hollow body (10) using the second gripping section (48). [6] Device (12) according to one of the preceding claims, wherein the hollow body (10) - a bottom wall (38) and one or more side walls (40), - an opening (42) opposite the bottom wall (38), and - has a cover (44) with which the opening (42) can be closed, characterized by that the device (12) has at least one lid handling unit (54, 102) which is detachably connectable to the lid (44). [7] Device (12) according to claim 6, characterized by that the device (12) has at least one treatment unit (18, 181, 182) with which the hollow body (10) can be treated, and a lid handling unit (54, 102), wherein - the treatment unit (18, 181, 182) has a processing chamber (73) in which the hollow body (10) can be treated, - the process chamber (73) is accessible through a process chamber opening (84), and - the lid handling unit (54, 102) is mounted in the device (12) by means of a further fastening device (57) so as to be movable between an open position in which the lid handling unit (54, 102) releases the process chamber opening (84) and a closed position in which the lid handling unit (54, 102) closes the process chamber opening (84). [8] Device (12) according to claim 7, characterized by that the device (12) has a first treatment unit (18, 181, 182) which is designed as a cleaning device (20) for cleaning the hollow body (10) and / or the lid (44). [9] Device (12) according to one of claims 7 or 8, characterized by that the device (12) has a second treatment unit (18, 181, 182) which is designed as an evacuation device (22) for applying a negative pressure in the hollow body (10) and / or on the lid (44). [10] Method for treating pot-shaped hollow bodies (10), in particular transport containers for semiconductor wafers or for EUV lithography masks, with a device (12) according to one of the preceding claims, wherein the hollow body (10) has a first gripping section (46) and a second gripping section (48), comprising the following steps: - moving the closure body (28) into the first position in which the closure body (28) releases the wall opening (26), - feeding the hollow body (10) to the receiving section (34) by means of a further gripping and moving device (24) which has further gripping means (52) with which the further gripping and moving device (24) is connected to the hollow body (10) using the second gripping section (48), and activating the locking means (36) of the receiving section (34) for connecting the hollow body (10) to the closure body (28) using the first gripping section (46), - Detaching the further gripping and moving device (24) from the second gripping section (48), - moving the closure body (28) into the closed position in which the closure body (28) closes the wall opening (26), - connecting the hollow body (10) to the gripping and moving device (17) using the second gripping section (48), and - Detaching the hollow body (10) from the closure body (28) by deactivating the receiving section (34). [11] Method according to claim 10, wherein the hollow body (10) - a bottom wall (38) and one or more side walls (40), - an opening (42) opposite the bottom wall (38) and - a lid (44) with which the opening (42) can be closed, comprising the following steps: - feeding the hollow body (10) to the lid handling unit (54, 102) by means of the gripping and moving device (17), - connecting the lid (44) to the lid handling unit (54, 102), and - Separating the lid (44) from the hollow body (10) by means of the lid handling unit (54, 102) and / or the gripping and moving device (17). [12] The method of claim 11, wherein - the device (12) comprises at least one treatment unit (18, 181, 182) with which the hollow body (10) can be treated, wherein the treatment unit (18, 181, 182) cooperates with the lid handling unit (54, 102), wherein - the treatment unit (18, 181, 182) has a processing chamber (73) in which the hollow body (10) can be treated, and - the process chamber (73) is accessible through a process chamber opening (84), comprising the following steps: - moving the lid handling unit (54, 102) into an open position in which the lid handling unit (54, 102) releases the process chamber opening (84), - connecting the lid (44) to the lid handling unit (54, 102), and separating the lid (44) from the hollow body (10) by means of the lid handling unit (54, 102) and / or the gripping and moving device (17), and - Moving the lid handling unit (54, 102) into the closed position in which the lid handling unit (54, 102) closes the process chamber opening (84).

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