Supply system for chemical liquids and method for supplying chemical liquids

The chemical fluid testing and supply system addresses real-time monitoring and control of chemical liquids in semiconductor manufacturing, enhancing process stability and reducing defects by automatically assessing liquid quality before use.

DE102020130415B4Active Publication Date: 2025-01-09TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
DE102020130415
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Priority Date
2020-04-01
Filing Date
2020-11-18
Publication Date
2025-01-09
Estimated Expiration
2040-11-18

AI Technical Summary

Technical Problem

Existing semiconductor manufacturing processes face challenges in real-time monitoring and control of chemical liquids, leading to potential defects and quality issues due to improper distribution and quality assessment of chemicals, which can affect the performance and yield of semiconductor wafers.

Method used

A chemical fluid testing and supply system with real-time feedback control, utilizing a chemical liquid testing and supply system that includes a liquid monitoring module, imaging, and scanning modules to automatically assess the quality of chemical liquids before use, ensuring proper distribution and reducing defects.

Benefits of technology

The system enables real-time quality control of chemical liquids, reducing defects and improving the stability and efficiency of semiconductor manufacturing processes by ensuring only acceptable chemicals are supplied to processing tools.

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Abstract

Method (S80) for processing a semiconductor wafer (95), comprising: Connecting (S806) a barrel (60) in which a chemical liquid (65) is stored to a test tube (71); Directing the chemical liquid (65) stored in the barrel (60) into the test tube (71); Determining (S811) the properties of the chemical liquid (65) in the test tube (71); Determine (S812) whether the quality of the chemical liquid (65) is acceptable; and if the quality of the chemical liquid (65) is acceptable, supply (S813) the chemical liquid (65) to a processing tool (9) on which the semiconductor wafer (95) is processed; wherein The connection (S806) of a barrel (60) in which a chemical liquid (65) is stored to a test tube (71) comprises: Moving (S803) the barrel (60) into a chamber (43) in which the barrel (60) is connected to the test tube (71); Taking a picture in relation to an outlet nozzle (61) and an inlet nozzle (62) of the barrel (60); Rotating an inlet port (442) and an outlet port (441) connected to the test tube (71) to align the inlet nozzle (62) and the outlet nozzle (61) based on the image; and after rotating the inlet port (442) and outlet port (441) of the test tube (71), connecting the inlet port (442) to the inlet nozzle (62) and connecting the outlet port (441) to the outlet nozzle (61).
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Description

STATE OF THE ART

[0001] The semiconductor integrated circuit (semiconductor IC) industry has experienced exponential growth in recent times. Technological advances in IC materials and design have produced generations of ICs in which each generation features smaller and more complex circuits than the previous generation. As ICs have evolved, functional density (i.e., the number of interconnected components per chip area) has generally increased, while geometric size (i.e., the smallest component (or circuit) that can be created using a manufacturing process) has decreased. This downsizing process typically provides benefits by increasing production efficiency and reducing associated costs. However, such downsizing has also increased the complexity of IC processing and manufacturing.

[0002] During semiconductor device manufacturing, various processing steps are used to fabricate integrated circuits on a semiconductor wafer. Wet chemical treatment or cleaning is widely used in the semiconductor industry. A chemical liquid is introduced into a chamber and rinsed onto the substrate. To properly treat or clean the substrate, a sufficient amount of a chemical solution is distributed over the substrate. If the chemical solution is not distributed properly, the chemical or physical reaction, such as particle removal, wettability enhancement, or development, cannot be achieved, resulting in serious defects that can affect product quality.

[0003] Although existing methods and devices for performing the processing steps have generally been sufficient for their intended purposes, they have not been entirely satisfactory in all respects. Consequently, it would be desirable to provide a solution for process control of semiconductor manufacturing operations.

[0004] KR 10 2019 0 053 325 A describes a monitoring system for chemical liquids in semiconductor manufacturing. US 6 523 861 B1 shows various fluid coupling mechanisms. US 2004 / 0 100 860 A1 describes a process control system for mixing liquids. US 2014 / 0 206 110 A1 discusses various etchants for etching semiconductor devices. US 2007 / 0 069 885 A1 discloses a system for monitoring liquids in mobile containers. US 2006 / 0 283 932 A1 proposes monitoring liquids using RFID tags. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Aspects of the present disclosure are best understood by reference to the following detailed description when taken in conjunction with the accompanying drawings. It should be noted that, in accordance with industry practice, various features are not drawn to scale. Indeed, the dimensions of various features may be arbitrarily exaggerated or reduced for clarity of illustration. Fig. 1 shows a schematic representation of a manufacturing facility in accordance with some embodiments. Fig. 2 shows a schematic representation of a sub-device in a manufacturing facility in accordance with some embodiments. Fig. 3 shows a schematic representation of a chemical liquid supply system in accordance with some embodiments. Fig. 4 shows a schematic representation of sub-elements in a chemical liquid supply system in accordance with some embodiments. Fig. 5 shows a schematic representation of sub-elements in a chemical liquid supply system and a machining tool connected to the chemical liquid supply system in accordance with some embodiments. Fig. 6 shows a concept for a liquid testing method in accordance with some embodiments. Fig. 7 shows a flow diagram illustrating a method for supplying a chemical liquid in a semiconductor manufacturing tool in accordance with some embodiments. Fig. 8 shows a schematic view of a phase of a method for testing a chemical liquid in a semiconductor manufacturing facility in which a number of drums are conveyed to a front door of a chemical liquid supply system, in accordance with some embodiments. Fig. 9 shows a schematic view of a phase of a method for testing a chemical liquid in a semiconductor manufacturing facility in which a front door of a chemical liquid supply system is opened, in accordance with some embodiments. Fig. 10 shows a schematic view of a phase of a method for testing a chemical liquid in a semiconductor manufacturing facility in which a number of drums are conveyed through a front door into a chemical liquid supply system, in accordance with some embodiments. Fig. 11 shows a schematic view of a phase of a method for testing a chemical liquid in a semiconductor manufacturing facility in which a number of drums have been transferred into a chemical liquid supply system and a front door of the chemical liquid supply system is closed, in accordance with some embodiments. Fig. 12 shows a schematic view of a phase of a method for testing a chemical liquid in a semiconductor manufacturing facility in which identities and images are produced with respect to a number of drums, in accordance with some embodiments. Fig. 13 shows a schematic view of a phase of a method for testing a chemical liquid in a semiconductor manufacturing facility in which a number of drums are connected to an input port and an output port for supplying the chemical liquid, in accordance with some embodiments. Fig. 14 shows a schematic view of a phase of a method for testing a chemical liquid in a semiconductor manufacturing facility in which the chemical liquid is circulated in a number of drums, in accordance with some embodiments. Fig. 15 shows a schematic view of a phase of a method for testing a chemical liquid in a semiconductor manufacturing facility in which a condition of the chemical liquid is monitored, in accordance with some embodiments. Fig. 16 shows a flow diagram illustrating a method of processing a semiconductor wafer in accordance with some embodiments. Fig. 17 shows a block diagram of a control module of a chemical liquid supply system in accordance with some embodiments. DETAILED DESCRIPTION

[0006] The following disclosure provides many different embodiments, or examples, for implementing various features of the provided subject matter. Specific examples of components and arrangements are described below. For example, the formation of a first feature over or on top of a second feature in the following description may include embodiments in which the first and second features are formed in direct contact with each other, but may also include embodiments in which additional features may be formed between the first feature and the second feature such that the first and second features may not be in direct contact with each other. Furthermore, the present disclosure may repeat reference numbers and / or characters in the various examples.This repetition is for the purpose of simplicity and clarity, and does not in itself prescribe any relationship between the various embodiments and / or configurations discussed.

[0007] Furthermore, terms of spatial relationships such as "beneath," "below," "low," "above," "upper," and the like may be used herein for the purpose of more conveniently describing the relationship of one element or feature illustrated in the figures to another element or feature. The terms of spatial relationships are intended to encompass various orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be arranged in a different orientation (rotated 90 degrees or in other orientations), and the terms of spatial relationships used herein may thus be interpreted accordingly.

[0008] Typically, a single chemical is used for multiple manufacturing processes in semiconductor manufacturing, such as ultrapure water in a wafer cleaning process, acid or alkali in a wet etching process, slurry in a CMP (chemical mechanical polishing) process, and photoresist in a lithography process. In some manufacturing processes, the chemical is applied directly to the wafer surface to be processed. The quality of the chemical influences the performance of the manufacturing process, for example, with regard to process defects and removal rate. The quality of the stored chemical is analyzed by an offline monitoring device, but not in real time.In other words, the chemical liquid abnormality may not be detected in time and may cause damage to the wafer surface during the manufacturing process before being detected by the offline monitoring device, resulting in deterioration of the manufacturing process performance.

[0009] Embodiments of the present disclosure are directed to providing a chemical liquid inspection and supply system and a method for feedback control of the supply of the chemical liquid used for a manufacturing process in real time. In this method, a chemical liquid is first sampled in the chemical liquid inspection and supply system to obtain a sample of the chemical liquid, and then a parameter of the sampled chemical liquid is measured, and the supply of the chemical liquid is controlled based on this parameter. In the embodiments of the present disclosure, the parameter of the sampled chemical liquid is measured in real time.Thus, automatic and dynamic control of the chemical liquid supply is carried out to improve the supply quality and stability of the chemical liquid, which can reduce process defects.

[0010] Fig. 1 shows a schematic representation of a manufacturing facility 1 in accordance with some embodiments. In the present disclosure, the manufacturing facility 1 is located in a hazardous process materials (HPM) building connected to a fabrication facility (FAB) and configured to store or use chemical liquid for semiconductor wafer manufacturing. In some embodiments, the manufacturing facility 1 includes a storage system 2, a rail-guided vehicle (RGV) system 3, and a number of chemical liquid supply systems 4. Additional features may be added to the manufacturing facility 1. Some of the features described below may be substituted or omitted for additional embodiments of the manufacturing facility 1.

[0011] In some embodiments, the storage system 2 is an automated storage and retrieval system (AS / RS) and is configured to place or remove drums 60 from defined positions. In some embodiments, the storage system 2 comprises a rack 20, a number of storage racks 22, a conveying mechanism 23, and a number of loading hatches 24 and 25. The storage racks 22 are configured to enable the storage of the drums 60 within the rack 20. In some embodiments, the storage racks 22 are arranged on two parallel side walls of the rack 20. In some embodiments, each of the storage racks 22 is configured to support four drums 60 arranged on a pallet 69. It should be noted that Fig. 1 illustrates storage racks 22 each supporting four barrels 60, but storage racks 22 may also have a larger area for storing any number of barrels 60, and that these barrels 60 may be arranged on the same pallet 69 or on different pallets 69.

[0012] The conveying mechanism 23 is configured to move the drums 60 within the storage system 2. In some embodiments, the conveying mechanism 23 includes a removal device. The conveying mechanism 23 moves along the rail 21 between the two columns of the storage racks 22, pulls the requested drums 60 from their position, and brings them to an access point, such as the dispensing hatch 25. In some embodiments, the conveying mechanism 23 also moves vertically via a lift (not shown in the figures) to reach upper storage racks 22 within the rack 20.

[0013] The input hatch 24 and the output hatch 25 are configured to support and dock the drums 60 to facilitate insertion and removal of the drums 60 into and from the rack 20 of the storage system 2. In some embodiments, the input hatch 24 and the output hatch 25 are arranged along the rail 21. The input hatch 24 is used to position the drums 60 thereon on the conveying mechanism 23, and the output hatch 25 is used to receive the drums 60 transported by the conveying mechanism 23. With the automated storage and retrieval system, personnel required to transport the drums 60 can be eliminated. In a simulated result, the required personnel number can be reduced by 30%.

[0014] The RGV system 3 is configured to transport the drums 60 over a specific distance in the manufacturing facility 1, for example, between the storage system 2 and the chemical liquid supply systems 4. In some embodiments, the RGV system 3 comprises a rail 31, a shuttle 33, an input station 34, an output station 35, and a number of conveyors 36. The rail 31 extends in a longitudinal direction L. The shuttle 33 moves along the rail 31. The input station 34 and the output station 35 are positioned to correspond to the input hatch 24 and the output hatch 25 of the storage system 2 for transporting the drums 60 to and from the storage system 2. The chemical liquid supply systems 4 are arranged along the longitudinal direction L.The conveyors 36 are arranged between the rail 31 and the chemical liquid supply systems 4 in order to transport the barrels 60 between the shuttle car 33 and the chemical liquid supply systems 4.

[0015] Fig. 2 shows a schematic representation of a sub-device in the manufacturing facility 1 in accordance with some embodiments. In some embodiments, the manufacturing facility 1 comprises a number of shelves, such as shelves 11 and 12, arranged on different levels. The chemical liquid supply systems are arranged on both the shelf 11 and the shelf 12. In such an embodiment, the manufacturing facility 1 may further comprise another RGV system 3 corresponding to the chemical liquid supply systems 4 arranged on different levels, and the storage system 2 may also comprise another input hatch 24 and the output hatch 25 for transporting drums to and from the additional RGV system 3. Due to the double-deck design (i.e., with multiple shelves 11 and 12), the number of chemical liquid supply systems 4 in a unit floor area increases.In a simulated result, 25% of the valuable floor space within Production Plant 1 could be saved.

[0016] Fig. 3 shows a schematic representation of a chemical liquid supply system 4 in accordance with some embodiments. In some embodiments, the chemical liquid supply system 4 includes a housing 41 and a front door 42. The front door 42 is located near the conveyors 36. Through the front door 42, the drums 60 can be brought into the chamber 43 within the housing 41. In some embodiments, the front door 42 is an automatic door. The chamber 43 can be sealed by a number of hollowed-out sealing elements (not shown in the figures) attached to an outer edge of the front door 42 to form an airtight cavity in the chamber 43. Consequently, the gas produced by leakage of liquid from the drums 60 can be contained within the chamber 43, thereby protecting personnel from safety and health hazards caused by hazardous substances.

[0017] In some embodiments, a platform 13 is disposed on one side of the enclosure 41 opposite the front door 42. Personnel can stand on the platform 13 to operate the chemical liquid supply system 4 using the control module 50. However, it should be understood that numerous variations and modifications may be made to embodiments of the disclosure. In some other embodiments, the platform 13 is replaced by an additional conveyor (not shown in the figures), and empty drums are removed from the chamber 43 through a rear door (not shown in the figures) disposed near the additional conveyor.

[0018] Fig. Fig. 4 shows a schematic representation of sub-elements in a chemical liquid supply system 4 in accordance with some embodiments. In some embodiments, the chemical liquid supply system 4 further comprises a number of connection modules 44, a number of rollers 45 ( Fig. 9 shows this feature more clearly), an imaging module 46, a scanning module 47, and a drive module 48. The connection modules 44 are arranged on a top wall 412 of the housing 41 and are arranged within the chamber 43. The connection modules 44 are each adapted to connect the drums 60 to a liquid monitoring module 70 (see Fig. 5) to connect.

[0019] The number of connection modules 44 corresponds to the number of drums 60 that can be conveyed in the chamber 43 at the same time. In one exemplary embodiment, the chemical liquid supply system 4 conveys four drums 60 supported by a pallet 69 for supplying chemical liquids through four independent connection modules 44. However, it should be understood that numerous variations and modifications may be made to embodiments of the disclosure. Depending on the number of drums 60 to be conveyed during each run, the chamber 43 may have any suitable width or length.

[0020] In some embodiments, each of the connection modules 44 includes an output port 441, an input port 442, a support head 443, and an actuator 444. The output port 441 and the input port 442 are connected to two ends of a test tube 71 ( Fig. 5) and configured to engage the outlet nozzle 61 and the inlet nozzle 62, respectively, of the barrel 60 arranged below. In some embodiments, the output port 441 and the input port 442 are attached to a bottom side of the carrier head 443. The carrier head 443 is configured such that it can be rotated by the actuator 444 around a rotational axis (indicated by the Fig. 4). Alternatively or additionally, the carrier head 443 is designed to move in a vertical direction with respect to the barrels 60, as shown in Fig. 4. The carrier head 443 can be moved in accordance with control signals transmitted from the control module 50 to the actuator 444.

[0021] The rollers 45 are configured to move the pallet 69 together with the drums 60 horizontally within the chamber 43. In some embodiments, the rollers 45 are arranged side by side, and each of the rollers 45 extends in a direction parallel to the front door 42. Two ends of each of the rollers 45 are rotatably connected to a side wall 415 of the housing 41. In some embodiments, as in Fig. As shown in Figure 4, at least one of the rollers 45 is an active element and has an end portion 451 that penetrates the side wall 415 of the housing 41 and is located outside the chamber 43. A wheel 452, such as a gear or pulley, is connected to the end portion 451.

[0022] In some embodiments, the drive module 48 includes a motor 481 and a transmission element 482. The transmission element 482 is connected to an output shaft (not shown in the figures) of the motor 481 and a wheel 452 connected to the end portion 451 of the roller 45. During operation, the transmission element 482 transmits a mechanical force from the motor 481 to the roller 45 to drive the movement of the pallet 69 and the drums 60 arranged on the pallet 69 in the chamber 43. The transmission element 482 can be a belt or a chain. It should be noted that due to the fact that the wheel 452 connected to the transmission element 482 is arranged outside the chamber 43, the wheel 452 is prevented from being exposed to liquid corrosion in cases where liquid leaks from the drums 60. The motor 481 can be driven by control signals output from the control module 50.

[0023] The imaging module 46 is configured to capture an image of the interior environment of the chamber 43. In one example embodiment, the imaging module 46 is configured to capture an image of the outlet nozzle 61 and the inlet nozzle 62 of the barrels 60 disposed in the chamber 43. In some embodiments, the imaging module 46 includes a wide-angle camera to display an image of all of the barrels 60 disposed in the chamber 43 on a single screen. In some other embodiments, the imaging module 46 includes a number of cameras disposed at different positions in the chamber 43, and each of the cameras is used to capture an image of one of the barrels 60 disposed in the chamber 43.In some embodiments, the imaging module 46 is configured to take an image of the bottom wall 411 of the housing 41 to determine if there is any residue of a chemical liquid leaked from the drums 60.

[0024] The imaging module 46 can output raw or processed data representing the images within the chamber 43 to the control module 50. For example, the imaging module 46 outputs the signal directly from an image sensor, and the analysis of the images is performed externally (for example, by a control module 50). In the image analysis, the images of the barrels 60 are analyzed to determine the position of the outlet nozzle 61 and the inlet nozzle 62 of each of the barrels 60 to enable subsequent engagement with the output port 441 and the input port 442. Alternatively, the imaging module 46 includes a special-purpose processor or special-purpose hardware for performing the image analysis and outputs a digital or analog signal indicating the position of the outlet nozzle 61 and the inlet nozzle 62 of each of the barrels 60.

[0025] The scanning module 47 is configured to identify the drums 60 being conveyed into the chamber 43. In some embodiments, the scanning module 47 includes a scanner to read a tag 63 attached to the drums 60. The tag 63 may be a radio frequency identification (RFID) and contain electronically stored information related to the drum 60. The tag 63 may be a passive tag and may draw power from a nearby scanning module 47 that interrogates radio waves. The radio waves have frequencies of at least 30 Hz to at most 300 GHz. The scanning module 47 outputs data indicating the identity of the drum 60 to the control module 50, and the control module 50 compares the identity of the drum 60 and data representing the drum to determine which chemical liquid 65 is stored in the drum 60.

[0026] In some embodiments, as in Fig. 4, a gas outlet 416 is connected to the side wall 415 of the housing 41. The gas outlet 416 is configured to direct an exhaust gas from the chamber 43 to a gas treatment system (not shown in the figures). The exhaust gas may be extracted by a pump (not shown in the figures) connected to the gas outlet 416 or by negative pressure created in the gas treatment system. In some embodiments, a gas detector 49 is connected to the gas outlet 416 and configured to detect at least one characteristic related to the exhaust gas flowing into the gas outlet 416. For example, the gas detector 49 is configured to measure a concentration of the exhaust gas in the gas outlet 416 and output signals related to the measurement results to the control module 50 for further processing.

[0027] Fig. 5 shows a schematic representation of sub-elements in the chemical liquid supply system 4 and a processing tool 9 connected to the chemical liquid supply system 4 in accordance with some embodiments. In some embodiments, the chemical liquid supply system 4 further comprises a liquid monitoring module 70. The liquid monitoring module 70 is configured to take a sample of the chemical liquid 65 stored in the drum 60 and generate data representing at least one quality of the chemical liquid 65 for the control module 50. In some embodiments, the liquid monitoring module 70 comprises a test tube 71, a filter 72, a pump 73, and a liquid detection assembly 74. The filter 72, the pump 73, and the liquid detection assembly 74 are arranged sequentially along the test tube 71.

[0028] In particular, the test tube 71 includes a number of segments, such as segment 711, segment 712, segment 713, and segment 714. One end of segment 711 is connected to the output port 441, and the other end of segment 711 is connected to the filter 72. One end of segment 712 is connected to the filter 72, and the other end of segment 712 is connected to the pump 73. One end of segment 713 is connected to the pump 73, and the other end of segment 713 is connected to the liquid detection assembly 74. One end of segment 714 is connected to the liquid detection assembly 74, and the other end of segment 714 is connected to the input port 442.

[0029] In operation, the pump 73 drives the flow of the chemical liquid 65 from the barrel 60 sequentially through the output port 441, the filter 72, the pump 73, and the liquid detection assembly 74, and returns it to the barrel 60 via the input port 442. In some embodiments, a feed tube 91 is connected to the segment 714 of the test tube 71 and directs the chemical liquid from the test tube 71 to a processing tool 9 on which the semiconductor wafer 95 is processed. A flow control element 92, such as a valve, is connected to the feed tube 91. When the flow control element 92 is switched on, the chemical liquid flowing through the liquid detection assembly 74 enters the feed tube 91 and is directed into the processing tool 9. The operation of the flow control element 92 can be triggered by a control signal output from the control module 50.

[0030] The liquid detection assembly 74 is configured to detect a quality of a chemical liquid 65 flowing through the test tube 71 and produces data indicating the quality of the chemical liquid 65 to the control module 50. In some embodiments, the liquid detection assembly 74 measures at least one quality of the chemical liquid 65 in the test tube 71 using various techniques.

[0031] For example, the liquid detection assembly 74, as shown in Fig. 6, a camera 741 is provided, and the test tube 71 is made of a transparent material, such as glass. Subsequently, the camera 741 creates an image of the chemical liquid 65 in the test tube 71 and transmits data representing the image related to the chemical liquid 65 to the control module 50. The control module 50 then compares the data representing the images with an archive database containing data representing another image showing a standard property of the chemical liquid 65. If the image data differs significantly from the data showing the standard property of the chemical liquid 65, an alarm is issued.

[0032] Alternatively or additionally, the liquid detection assembly 74, as shown in Fig. 6, a light source 742 and a transducer 743, and the test tube 71 is made of a light-transmissive material, such as glass. The light source 742 generates a first light beam 744 to the test tube 71. The first light beam 744 transitions into a second light beam 745 after passing through the test tube 71. A property of the second light beam 745 (e.g., a vibration mode) may be different from that of the first light beam 744. The transducer 743 is configured to detect the second light beam 745 and transmits data representative of the second light beam 745 to the control module 50 for further processing to determine the nature of the chemical liquid 65.

[0033] In an example embodiment of the present disclosure, the control module 50 compares the data representing the second light beam 745 with an archival database containing data representing a standard property of the chemical liquid 65. If the data representing the second light beam 745 differs significantly from the data representing the standard property of the chemical liquid 65, an alarm is issued. In some embodiments, the chemical liquid 65 is being tested using an infrared spectroscopy technique, and the first light beam 744 generated by the light source 742 comprises infrared radiation. Data representing the second light beam 745 includes, for example, a graphical representation of the light transmittance versus the wavenumber of the second light beam 745.It should be understood, however, that numerous variations and modifications may be made to embodiments of the disclosure.

[0034] It should be understood that while the preferred embodiment contemplates using two methodological techniques, such as image analysis and infrared spectroscopy, to measure the nature of the chemical liquid 65, the chemical liquid 65 may be detected using any number of methodological techniques. In some embodiments, the camera 741 is omitted, and the nature of the chemical liquid 65 is detected using infrared spectroscopy.

[0035] Fig. 7 is a flow diagram illustrating a method S80 for supplying a chemical liquid in the semiconductor manufacturing tool 1 in accordance with some embodiments. It is understood that additional operations may be performed. Furthermore, not all operations may be required to practice the disclosure provided herein. Furthermore, some of the operations may be performed simultaneously or in a different order than that described in Fig. 7. In some implementations, one or more operations may be performed in addition to or instead of the operations described herein. For illustrative purposes, method S80 is described with reference to Fig. 1 and 8-15. However, the method S80 is not limited to these embodiments.

[0036] The method S80 begins with operation S801, in which one or more drums 60 are transported from the storage system 2 to a position near the front door 42 of the chemical liquid supply system 4. In some embodiments, as in Fig. 1, four drums 60 are arranged on a pallet 69 and stored on one of the storage racks 22 of the storage system 2. To transport the requested drums 60 from the storage system 2 to the position (for example, the conveyor 36) near the front door 42, the drums 60, together with the pallet 69 arranged underneath, are removed from the storage rack 22 by the conveying mechanism 23 and moved to the discharge hatch 25. Then, the discharge hatch 25 and the discharge station 35 move the drums 60 and the pallet 69 to the shuttle car 33, and the shuttle car 33 transports the drums 60 and the pallet 69 to one of the conveyors 36, which corresponds to one of the chemical liquid supply systems 4, on which the drums 60 are used, as shown in Fig. 8. In some embodiments, operation S801 takes approximately 4 minutes to approximately 6 minutes. In some embodiments, operation S801 takes approximately 5 minutes.

[0037] The method S80 continues with operation S802, in which the front door 42 is opened. In some embodiments, the front door 42 of the chemical liquid supply system 4 opens automatically after the presence of the drums 60 on the conveyors 36 is detected, as shown in Fig. 9. The presence of the drums 60 on the conveyors 36 can be detected using a suitable sensor, for example, a photoelectric sensor. The data representing the presence of the drums 60 is sent to the control module 50, and the control module 50 initiates control signals that control the movement of the front door 42. In some embodiments, operation S802 takes approximately 20 seconds to approximately 40 seconds. In other embodiments, operation S802 takes approximately 30 seconds.

[0038] The method S80 continues with operation S803, in which the drums 60 together with the pallet 69 are moved through the front door 42 into the chamber 43 of the chemical liquid supply system 4. In some embodiments, as in Fig. As shown in Figure 10, the movement of the drums 60 is driven by the conveyor 36 and the rollers 45. Operation S803 may be initiated after the completion of operation S802. In some embodiments, operation S803 takes approximately 30 seconds to approximately 90 seconds. In other embodiments, operation S803 takes approximately 1 minute.

[0039] Once the barrels 60 have been moved into the chamber 43, the method S80 continues with operation S804 to close the front door 42, as shown in Fig. 11. In some embodiments, the front door 42 is actuated to close in response to control signals issued by the control module 50, and the control module 50 issues the control signals after detecting that the drums 60 have been positioned in the chamber 43. The position of the drums 60 in the chamber 43 may be detected using a suitable sensor, for example, a photoelectric sensor.

[0040] Method S80 continues with operation S805, in which an identity of each of the drums 60 is re-established. Once the drums 60 are positioned in the chamber 43, in some embodiments, the sensing module 47 is triggered to emit radio energy. Once the label 63 is activated by the radio energy, the label 63 transmits signals 635 representing information about the drums 60 to which the label 63 is attached to the sensing module 47. The sensing module 47 forwards the data representing information about the drums 60 in the chamber 43 to the control module 50. The information about the drum 60 may include the identity of the drum 60, and the control module 50 compares the identity of the drum 60 to the chemical liquid stored in the particular drum 60 according to a database stored in a memory device of the control module 50.

[0041] Method S80 continues with operation S806, in which the drums 60 are connected to the liquid monitoring module 70. In some embodiments, prior to performing operation S806, one or more images relating to the outlet nozzle 61 and the inlet nozzle 62 are captured by the imaging module 46. The data representing the images of the outlet nozzle 61 and the inlet nozzle 62 are sent to the control module 50 for image analysis to determine the position of the outlet nozzle 61 and the inlet nozzle 62. The control module 50 outputs control signals to the actuator 444 to rotate the carrier head 443 such that the output port 441 is aligned with the outlet nozzle 61 and the input port 442 is aligned with the inlet nozzle 62. After the alignment process, the control module 50 outputs control signals to the actuator 444 to rotate the carrier head 443 along a path defined by the Fig. 13. Subsequently, the output port 441 is connected to the outlet nozzle 61, and the input port 442 is connected to the inlet nozzle 62.

[0042] The method S80 continues with operation S807, in which an exhaust stream 419 is generated from the chamber 43. In some embodiments, as in Fig. As shown in Figure 13, the exhaust gas stream 419 is directed through the gas outlet 416. Operation S807 may be started during operation S803 and will not be stopped until the barrels 60 have been removed from the chamber 43.

[0043] Method S80 continues with operation S808, in which at least one characteristic of the exhaust stream 419 is monitored. In some embodiments, the concentration of hazardous gas in the exhaust stream 419 is detected by the gas detector 49. If the concentration of hazardous gas in the exhaust stream 419 is below a threshold value, method S80 continues with operation S811; otherwise, an alarm is issued at operation S810. At operation S810, the flow of the chemical liquid 65 stored in the drum 60 into the test tube 71 may be stopped to prevent further liquid leakage.

[0044] In some embodiments, a volatile gas is generated due to fluid leaks caused by damaged drums or due to a faulty connection between the drums 60 and the connection modules 44. By monitoring the nature of the exhaust gas, these problems can be detected at an early stage, and the control module 50 will take immediate action and respond appropriately to the situation, for example, by reconnecting the connection modules 44 to the drums 60.

[0045] In operation S811, at least one quality of the chemical liquid 65 is monitored. In some embodiments, as in Fig. 15, a sample of the chemical liquid 65 in the barrel is taken by the liquid monitoring module 70 after the outlet nozzle 61 and the inlet nozzle 62 are connected to the output port 441 and the input port 442, respectively. Specifically, the pump 73 drives the flow of the chemical liquid 65 in the test tube 71 and recirculates the chemical liquid 65 back into the barrel 60. The flow of the chemical liquid 65 flows through the filter 72 before passing through the liquid detection assembly 74. In some embodiments, operation S811 is not started until the chemical liquid 65 has been circulated for a predetermined time, for example, approximately 1 minute to approximately 3 minutes, to increase the homogeneity of the chemical liquid 65 stored in the barrel 60.

[0046] In some embodiments, at operation S811, the composition of the chemical liquid 65 is measured by the light source 742 and the transducer 743 ( Fig. 6) is measured, and the data representing the composition of the chemical liquid 65 is sent to the control module 50 to determine whether the composition of the chemical liquid 65 is acceptable using an infrared spectroscopy technique (process S812). The data representing the composition of the chemical liquid 65 can be compared with other data representing a composition of a standard chemical liquid.

[0047] Alternatively or additionally, in process S811, the camera 741 ( Fig. 6) An image is captured of the chemical liquid 65. The image of the chemical liquid 65 is sent to the control module 50 for image analysis to determine whether the quality of the chemical liquid 65 is acceptable (operation S812). The image of the chemical liquid 65 can be compared with another image of a standard chemical liquid. For example, if a standard chemical liquid is blue, but the image shows yellow, it has been determined that the quality of the chemical liquid is unacceptable.

[0048] In some embodiments, the image analysis is performed before the infrared spectroscopy technique. If the result of the image analysis is unacceptable, the infrared spectroscopy technique is not used to measure the composition of the chemical liquid 65. Because the infrared spectroscopy technique takes longer than the image analysis, performing the image analysis before the infrared spectroscopy technique can save the time required to test the chemical liquid. In some embodiments, operation S811 takes approximately 5 seconds to approximately 20 seconds. In other embodiments, operation S811 takes approximately 10 seconds to implement the infrared spectroscopy technique.

[0049] If the quality of the chemical liquid 65 is determined to be unacceptable in operation S812, the method S80 continues with operation S816 to remove the drums 60 from the chamber 43. If, however, the quality of the chemical liquid 65 is acceptable, the method S80 continues with operation S813, in which the chemical liquid 65 is supplied to the processing tool 9 on which a semiconductor wafer 95 is being processed.

[0050] In some embodiments, the control module 50 outputs control signals to the flow control element 92 for supplying the chemical liquid 65 to allow a portion of the chemical liquid 65 to flow from the test tube 71 to the supply tube 91. During operation S813, the supply time or the amount of the chemical liquid 65 supplied to the machining tool 9 is recorded by suitable means, such as a measuring device, to determine whether the chemical liquid 65 in the drum 60 has run out (operation S814). If the chemical liquid 65 has run out, the method S80 continues with operation S815 to remove the drums 60 from the chamber 43; otherwise, the supply of the chemical liquid 65 continues.

[0051] In some embodiments, some substances in the chemical liquid 65 degrade over time in the drum 60. If the degraded substances spread onto the semiconductor wafer 95, the process performance of the semiconductor wafer 95 may deteriorate, resulting in rejects. By performing the test process (i.e., operation S811 and operation S812), the semiconductor wafer 95 can be processed using proper chemical liquid, and the product yield of the semiconductor wafer 95 can be significantly improved.

[0052] In operation S815, the test tube 71 of the liquid monitoring module 70 is removed from the drums 60, and the front door 42 is opened. The drums 60 are then removed from the chamber 43 by the rollers 45 and the conveyor 36. The drums 60 can be returned to the storage system 2 by the RGV system 3, and the next requested drums 60 can be sent to the empty chemical liquid supply system 4 for the testing and supply process.

[0053] Fig. 16 is a flow diagram illustrating a method S90 for processing semiconductor wafers 5 using the chemical liquid 65 in accordance with some embodiments. It is understood that additional operations may be performed. Furthermore, not all operations may be required to practice the disclosure provided herein. Furthermore, some of the operations may be performed concurrently or in a different order than that described in Fig. 16. In some implementations, one or more operations may be performed in addition to or instead of the operations described herein. For illustrative purposes, method S90 is described with reference to Fig. 15. However, the method S90 is not limited to these embodiments.

[0054] The method S90 comprises the process S901 in which a semiconductor wafer 95 is inserted into the processing tool 9 ( Fig. 15). The semiconductor wafer 95 may be made of silicon or other semiconductor materials. Alternatively or additionally, the semiconductor wafer 95 may include other elemental semiconductor materials, such as germanium (Ge). In some embodiments, the semiconductor wafer 95 is made of a compound semiconductor, such as silicon carbide (SiC), gallium arsenic (GaAs), indium arsenide (InAs), or indium phosphide (InP). In some embodiments, the semiconductor wafer 95 is made of an alloy semiconductor, such as silicon germanium (SiGe), silicon germanium carbide (SiGeC), gallium arsenic phosphide (GaAsP), or gallium indium phosphide (GaInP). In some embodiments, the semiconductor wafer 95 includes an epitaxial layer. For example, the semiconductor wafer 95 includes an epitaxial layer disposed over a host semiconductor.In some other embodiments, the semiconductor wafer 95 may be a silicon-on-insulator (SOI) substrate or a germanium-on-insulator (GOI) substrate.

[0055] The semiconductor wafer 95 may include various device elements. Examples of device elements formed in the semiconductor wafer 95 include transistors (e.g., metal-oxide-semiconductor field-effect transistors (MOSFETs), complementary metal-oxide-semiconductor transistors (CMOS transistors), bipolar transistors (BJTs), high-voltage transistors, high-frequency transistors, p-channel and / or n-channel field-effect transistors (PFETs / NFETs), etc.), diodes, and / or other applicable elements. Various processes, such as deposition, etching, implantation, photolithography, annealing, and / or other suitable processes, are performed to form the device elements.

[0056] The processing tool 9 is equipped to perform one or more of numerous processes or processing operations, such as a wafer cleaning process (including pre-cleaning, cleaning and post-cleaning processes), a wet etching process, a CMP process (chemical mechanical polishing process), a lithography process, etc.

[0057] The method S90 also includes the process S902 in which the method S80 of supplying the chemical liquid 65 is carried out, as in Fig. 7. Another local valve (not shown in the figures) of the processing tool 9 is used to control the distribution of the chemical liquid 65 over the semiconductor wafer 95.

[0058] Method S90 also includes operation S903, in which the semiconductor wafer 95 is removed from the processing tool 9. It is understood that fabrication of the semiconductor wafer 95 in accordance with the disclosed methods may include further processes, including, for example, deposition, implantation, or etching operations, to form various features, such as field-effect transistors, capping insulation layers, contacts / vias, silicide layers, interconnect metal layers, dielectric layers, passivation layers, metallization layers with signal lines, etc. In some embodiments, one or more layers of conductive, semiconductor, and insulating materials are formed over the substrate, and a structure is formed in one or more of these layers.

[0059] Fig. 17 shows a block diagram of the control module 50 in accordance with some embodiments. The control module 50 may include any suitable control system (e.g., a workstation and a portable electronic device) configured to store / execute programs for performing / monitoring various operations of the chemical liquid supply system 4. The control module 50 may be any well-known computer capable of performing the functions and operations described herein. For example, but not by way of limitation, the control module 50 may be capable of processing and transmitting signals. For example, the control module 50 may be used to perform one or more operations of the chemical liquid supply system 4, the method S80, and / or the method S90.

[0060] The control module 50 may be configured to communicate (e.g., send instructions and receive data) with other components of the chemical liquid supply system 4 (e.g., the connection module 44, the imaging module 46, the sensing module 47, the drive module 48, the gas detector 49, and the liquid monitoring module 70) via the communication paths 526. The communication paths 526 may include any suitable network connection mechanism, such as a communication bus, a local area network (LAN), and / or a Wi-Fi network. In some embodiments, the control module 50 may update the instructions or stored programs based on data received from other components of the chemical liquid supply system 4 via the communication path 526.

[0061] The control system 50 includes one or more processors (also referred to as central processing units or CPUs), such as a processor 504. The processor 504 is connected to a communications infrastructure or bus 506. The control system 50 also includes one or more input / output devices 503, such as monitors, keyboards, pointing devices, etc., that communicate with communications infrastructure or bus 506 through the input / output interface(s) 502. A control tool can receive instructions to implement functions and operations described herein via the input / output device(s) 503. The control system 50 also includes a main memory 508, such as random access memory (RAM). The main memory 508 may include one or more levels of cache. The main memory 508 has control logic (e.g., computer software) and / or data stored therein.In some embodiments, the control logic (e.g., computer software) and / or data may include one or more of the functions described above with respect to the chemical liquid supply system 4. In some embodiments, the processor 504 may be configured to execute the control logic stored in the main memory 508.

[0062] The control system 50 may also include one or more secondary storage devices 510. The secondary storage devices 510 may include, for example, a hard disk drive 512 and / or a removable storage device 514. The removable storage device 514 may be a floppy disk drive, a magnetic tape drive, a compact disk drive, an optical storage device, a tape backup device, and / or any other storage device / drive.

[0063] The removable storage device 514 may interact with a removable storage unit 518. The removable storage unit 518 comprises a computer-usable or readable storage device having computer software (control logic) and / or data stored thereon. The removable storage unit 518 may be a floppy disk, a magnetic tape, a compact disk, a DVD, an optical disk, and / or any other computer data storage device. The removable storage device 514 reads and / or writes to the removable storage unit 518 in a well-known manner.

[0081] In accordance with some embodiments, the secondary storage 510 may include other mechanisms, executive tools, or other approaches that enable the control system 50 to access computer programs and / or other instructions and / or data.Such mechanisms, executive tools, or other approaches may include, for example, a removable storage unit 522 and an interface 520. Examples of the removable storage unit 522 and the interface 520 may include a program cartridge and cartridge interface (such as those found in video game devices), a removable memory chip (such as an EPROM or a PROM) and associated socket, a memory stick and USB slot, a memory card and associated memory card slot, and / or any other removable storage unit and associated interface. In some embodiments, the secondary storage 510, the removable storage unit 518, and / or the removable storage unit 522 may perform one or more of the functions described above with respect to the chemical liquid supply system 4.

[0064] The control system 50 may further include a communications interface 524. The communications interface 524 enables the control system 50 to communicate and interact with any combination of remote devices, remote networks, remote units, etc. (individually and collectively identified by reference numeral 528). For example, the communications interface 524 may enable the control system 50 to communicate with elements 528 via the communications path 526, which may be wired and / or wireless, and which may include any combination of LANs, WANs, the Internet, etc. Control logic and / or data may be transferred to and from the control system 50 via the communications path 526.

[0065] The functions / acts in the above embodiments can be implemented in a wide variety of designs and architectures. Therefore, some or all of the acts in the above embodiments—for example, the functions of the Fig. 4 - 6 described supply system for chemical liquids 4 and the in Fig.7—may be performed by hardware, software, or both. In some embodiments, a tangible device or article of manufacture comprising a tangible computer-usable or readable medium with control logic (software) stored thereon is also referred to herein as a computer program product or program storage device. This includes the control system 50, the main memory 508, the secondary memory 510, and the removable storage units 518 and 522, as well as tangible articles of manufacture embodying any combination of the foregoing. When executed by one or more computing devices (such as the control system 50), such control logic causes such computing devices to function as described herein.For example, the hardware / equipment may be connected to or be part of element 528 (remote device(s), network(s), unit(s)) of control system 50.

[0066] The various embodiments or examples described herein offer several advantages over the prior art, as set forth above. It should be understood that not all advantages have necessarily been discussed herein, that no particular advantage is required for all embodiments or examples, and that other embodiments or examples may offer different advantages.

[0067] Embodiments of this disclosure provide a chemical liquid supply system with a liquid detection assembly for checking the quality of the chemical liquid contained in drums. The drums are automatically transferred from a storage system to the chemical liquid supply system and automatically connected to an inlet port of a liquid supply line for supplying the chemical liquid. As a result, the need for personnel in preparing the supply of the chemical liquid can be reduced or eliminated. Furthermore, since the chemical liquid is not supplied to a machining tool before the quality of the chemical liquid has been checked, a concern regarding supplying already degrading chemical liquids to the machining tool can be alleviated.

[0068] In accordance with some embodiments, a method for processing semiconductor wafers is provided. The method includes connecting a drum in which the chemical liquid is stored to a test tube. The method also includes directing the chemical liquid in the drum into the test tube. Furthermore, the method includes detecting a quality of the chemical liquid in the test tube. The method further includes determining whether the quality of the chemical liquid is acceptable. If the quality of the chemical liquid is acceptable, the chemical liquid is supplied to a processing tool on which a semiconductor wafer is processed.In some embodiments, detecting the nature of the chemical liquid in the test tube comprises: capturing an image related to the chemical liquid in the test tube; analyzing the image to generate data associated with the image; and comparing the data associated with the image with data representing the chemical liquid in a standard state. In some embodiments, detecting the nature of the chemical liquid in the test tube comprises: emitting a first light beam toward the test tube, the first light beam transitioning into a second light beam after passing through the chemical liquid; receiving the second light beam with a transducer; analyzing the second light beam to generate data associated with the second light beam; and comparing the data associated with the second light beam with data representing the chemical liquid in a standard state.In some embodiments, the method further comprises returning the chemical liquid through the test tube to the barrel; and directing a portion of the chemical liquid from the test tube to a supply tube connected to the processing tool. In some embodiments, the method further comprises moving the barrel into a chamber in which the barrel is connected to the test tube; generating an exhaust stream from the chamber; sensing a quality of the exhaust stream; determining whether the quality of the exhaust stream is above a threshold; and, if the quality of the exhaust stream is above the threshold, stopping the flow of the chemical liquid in the barrel into the test tube and issuing an alarm.In some embodiments, the method further comprises moving the barrel into a chamber in which the barrel is connected to the test tube; capturing an image relative to an outlet nozzle and an inlet nozzle of the barrel; rotating an inlet port and an outlet port connected to the test tube to align the inlet nozzle and the outlet nozzle based on the image; and connecting the inlet port to the inlet nozzle and connecting the outlet port to the outlet nozzle after the inlet port and the outlet port of the test tube have been rotated. In some embodiments, the method further comprises moving the barrel into a chamber in which the barrel is connected to the test tube; and, after the barrel is moved into the chamber, closing a front door of the chamber to form an airtight cavity in the chamber.In some embodiments, the method further comprises identifying the drum by scanning an RFID (radio frequency identification) tag attached to the drum to re-regulate which chemical liquid should be stored in the drum.

[0069] In accordance with some embodiments, a method for testing a chemical liquid in a semiconductor manufacturing facility is provided. The method includes moving a drum in which the chemical liquid is stored from a storage system to a position proximate a chemical liquid supply system. The method also includes moving the drum through the front door into a chamber in the chemical liquid supply system. The method further includes connecting the drum to a test tube and directing the chemical liquid in the drum into the test tube. Furthermore, the method includes sensing a quality of the chemical liquid in the test tube. The method further includes determining whether the quality of the chemical liquid is acceptable. And if the quality of the chemical liquid is not acceptable, removing the drum from the chamber of the chemical liquid supply system.In some embodiments, detecting the nature of the chemical liquid in the test tube comprises: capturing an image related to the chemical liquid in the test tube; analyzing the image to generate data associated with the image; and comparing the data associated with the image with data representing the chemical liquid in a standard state. In some embodiments, detecting the nature of the chemical liquid in the test tube comprises: emitting a first light beam toward the test tube, the first light beam transitioning into a second light beam after passing through the chemical liquid; receiving the second light beam with a transducer; analyzing the second light beam to generate data associated with the second light beam; and comparing the data associated with the second light beam with data representing the chemical liquid in a standard state.If the quality of the chemical liquid is acceptable, in some embodiments the method comprises supplying the chemical liquid to a processing tool on which a semiconductor wafer is being processed. In some embodiments the method further comprises generating an exhaust stream from the chamber; sensing a quality of the exhaust stream; determining whether the quality of the exhaust stream is above a threshold; and, if the quality of the exhaust stream is above the threshold, stopping the flow of the chemical liquid in the drum into the test tube and issuing an alarm.In some embodiments, the method further comprises taking an image relative to an outlet nozzle and an inlet nozzle of the barrel; rotating an inlet port and an outlet port connected to the test tube to align the inlet nozzle and the outlet nozzle based on the image; and connecting the inlet port to the inlet nozzle and connecting the outlet port to the outlet nozzle after the inlet port and the outlet port of the test tube have been rotated. In some embodiments, the position is located near the front door of the chemical liquid supply system, and the barrel is moved into the chamber through the front door. The method further comprises: after the barrel is moved into the chamber, closing the front door of the chamber to form an airtight cavity in the chamber.In some embodiments, the method further comprises identifying the drum by scanning an RFID (radio frequency identification) tag attached to the drum to re-regulate which chemical liquid should be stored in the drum.

[0070] In accordance with some embodiments, a chemical liquid supply system is provided. The chemical liquid supply system includes a chamber and a pulley disposed within the chamber. The chemical liquid supply system also includes a connection module disposed within the chamber and above the pulley. The chemical liquid supply system further includes a test tube connected to the connection module. Furthermore, the chemical liquid supply system includes a liquid detection assembly disposed relative to the test tube. The chemical liquid supply system further includes a control module electrically connected to the liquid detection assembly and configured to determine whether the chemical liquid is acceptable or not.In some embodiments, at least a portion of the test tube disposed proximate the liquid detection assembly is formed of a light-transmissive material, and the liquid detection assembly includes a camera or a transducer. In some embodiments, the system further includes a gas detector connected to the chamber and configured to detect a quality of an exhaust gas from the chamber. The control module is electrically connected to the gas detector and configured to issue an alarm when the quality of the gas in the chamber exceeds a threshold. In some embodiments, the system further includes a front door disposed on a side of the chamber. The front door is automatically operated, and when the front door is closed, an airtight cavity is formed in the chamber.

Claims

[1] A method (S80) for processing a semiconductor wafer (95), comprising: Connecting (S806) a barrel (60) in which a chemical liquid (65) is stored to a test tube (71); Directing the chemical liquid (65) stored in the barrel (60) into the test tube (71); Detecting (S811) a quality of the chemical liquid (65) in the test tube (71); Determining (S812) whether the quality of the chemical liquid (65) is acceptable; and if the quality of the chemical liquid (65) is acceptable, supplying (S813) the chemical liquid (65) to a processing tool (9) on which the semiconductor wafer (95) is processed; wherein connecting (S806) a barrel (60) in which a chemical liquid (65) is stored to a test tube (71) comprises: Moving (S803) the barrel (60) into a chamber (43) in which the barrel (60) is connected to the test tube (71); Capturing an image with respect to an outlet nozzle (61) and an inlet nozzle (62) of the barrel (60); Rotating an inlet port (442) and an outlet port (441) connected to the test tube (71) to align the inlet nozzle (62) and the outlet nozzle (61) based on the image; and after rotating the inlet port (442) and the outlet port (441) of the test tube (71), connecting the inlet port (442) to the inlet nozzle (62) and connecting the outlet port (441) to the outlet nozzle (61). [2] The method of claim 1, wherein detecting (S811) the nature of the chemical liquid (65) in the test tube (71) comprises: Taking an image with respect to the chemical liquid (65) in the test tube (71); Analyzing the image to generate data related to the image; and Comparing the data associated with the image with data representing the chemical liquid (65) in a standard state. [3] The method of claim 1, wherein detecting (S811) the nature of the chemical liquid (65) in the test tube (71) comprises: Emitting a first light beam (744) to the test tube (71), the first light beam (744) transitioning into a second light beam (745) after passing through the chemical liquid (65); Receiving the second light beam (745) with a transducer (743); analyzing the second light beam (745) to generate data associated with the second light beam (745); and Comparing the data associated with the second light beam (745) with data representing the chemical liquid (65) in a standard state. [4] A method according to any one of the preceding claims, further comprising: Returning the chemical liquid (65) through the test tube (71) into the barrel (60); and Directing a portion of the chemical liquid (65) from the test tube (71) to a feed tube (91) connected to the processing tool (9). [5] A method according to any one of the preceding claims, further comprising: Generating (S807) an exhaust gas stream from the chamber (43); Detecting (S808) a quality of the exhaust gas flow; Determining (S809) whether the quality of the exhaust gas flow is above a limit; and if it has been determined that the quality of the exhaust gas stream is above the limit value, stopping the flow of the chemical liquid (65) in the barrel (60) into the test tube (71) and issuing (S810) an alarm. [6] A method according to any preceding claim, wherein if the nature of the chemical liquid (65) is not acceptable, the barrel (60) is separated from the separation tube (71) and removed from the chamber (43). [7] A method according to any one of claims 1 to 4, further comprising: after the barrel (60) has been moved into the chamber (43), closing (S804) a front door (42) of the chamber (43) to form an airtight cavity in the chamber (43). [8] A method according to any one of the preceding claims, further comprising: Identifying (S805) the barrel (60) by scanning an RFID tag attached to the barrel (60) to re-regulate which chemical liquid (65) is to be stored in the barrel (60). [9] A method for testing a chemical liquid (65) in a manufacturing plant, comprising: Moving (S801) a barrel (60) in which the chemical liquid (65) is stored from a storage system (2) to a position near a supply system (4) for chemical liquids (65); Moving (S803) the barrel (60) through a front door (42) into a chamber (43) in the supply system (4) for chemical liquids (65); Connecting (S806) the barrel (60) to a test tube (71); Directing the chemical liquid (65) stored in the barrel (60) into the test tube (71); Detecting (S811) a quality of the chemical liquid (65) in the test tube (71); Determining (S812) whether the quality of the chemical liquid (65) is acceptable; and if the quality of the chemical liquid (65) is not acceptable, removing (S815) the barrel (60) from the chamber (43) of the supply system (4) for chemical liquids (65), wherein connecting (S806) the barrel (60) to a test tube (71) comprises: Capturing an image with respect to an outlet nozzle (61) and an inlet nozzle (62) of the barrel (60); Rotating an inlet port (442) and an outlet port (441) connected to the test tube (71) to align the inlet nozzle (62) and the outlet nozzle (61) based on the image; and after rotating the inlet port (442) and the outlet port (441) of the test tube (71), connecting the inlet port (442) to the inlet nozzle (62) and connecting the outlet port (441) to the outlet nozzle (61). [10] The method of claim 9, wherein detecting (S811) the nature of the chemical liquid (65) in the test tube (71) comprises: Taking an image with respect to the chemical liquid (65) in the test tube (71); Analyzing the image to generate data related to the image; and Comparing the data associated with the image with data representing the chemical liquid (65) in a standard state. [11] The method according to claim 9 or 10, wherein detecting (S811) the nature of the chemical liquid (65) in the test tube (71) comprises: Emitting a first light beam to the test tube (71), the first light beam (744) transitioning into a second light beam (745) after passing through the chemical liquid (65); Receiving the second light beam (745) with a transducer (743); analyzing the second light beam (745) to generate data associated with the second light beam (745); and Comparing the data associated with the second light beam (745) with data representing the chemical liquid (65) in a standard state. [12] A method according to any one of claims 9 to 11, further comprising: if the quality of the chemical liquid (65) is acceptable, supplying (S813) the chemical liquid (65) to a processing tool (9) on which the semiconductor wafer (95) is processed. [13] A method according to any one of claims 9 to 12, further comprising: Generating (S807) an exhaust gas stream from the chamber (43); Detecting (S808) a quality of the exhaust gas flow; Determining (S808) whether the quality of the exhaust gas flow is above a limit; and if it is determined that the quality of the exhaust gas stream is above the limit value, stopping the flow of the chemical liquid (65) in the barrel (60) into the test tube (71) and issuing (S810) an alarm. [14] A method according to any preceding claim, wherein if the nature of the chemical liquid (65) is not acceptable, the barrel (60) is separated from the separation tube (71) and removed from the chamber (43). [15] A method according to any one of claims 9 to 14, wherein the position is located near the front door (42) of the chemical liquid supply system (4), the barrel (60) is moved through the front door (42) into the chamber (43), and the method further comprises: after the barrel (60) has been moved into the chamber (43), closing the front door (42) of the chamber (43) to form an airtight cavity in the chamber (43). [16] A method according to any one of claims 9 to 15, further comprising: Identifying (S805) the barrel (60) by scanning an RFID label attached to the barrel (60) in order to re-regulate which chemical liquid (65) is to be stored in the barrel (60). [17] Supply system (4) for chemical liquids (65) stored in barrels (60) with an inlet nozzle (62) and an outlet nozzle (61), comprising: a chamber (43); a roller (45) arranged in the chamber (43); a connection module (44) arranged in the chamber (43) and above the roller (45) and having an output port (441) and an input port (442); a test tube (71) connected to the connection module (44); an imaging module (46) configured to capture an image of the inlet nozzle (62) and the outlet nozzle (61) of barrels (60) arranged in the chamber (43) in order to determine, by means of image analysis, the position of the outlet nozzle (61) and the inlet nozzle (62) of each of the barrels (60) and to enable subsequent engagement with the output port (441) and input port (442); a liquid detection assembly (74) arranged relative to the test tube (71); and a control module (50) which is electrically connected to the liquid detection assembly (74) and which is arranged to determine whether the chemical liquid (65) is acceptable or not. [18] Supply system (4) for chemical liquids (65) according to claim 17, wherein at least a portion of the test tube (71) arranged near the liquid detection assembly (74) is formed of a light-transmitting material, and the liquid detection assembly (74) comprises a camera (741) or a transducer (743). [19] Supply system (4) for chemical liquids (65) according to claim 17 or 18, further comprising: a gas detector (49) connected to the chamber (43) and configured to detect a quality of an exhaust gas from the chamber (43); wherein the control module (50) is electrically connected to the gas detector (49) and is arranged to issue an alarm when the quality of the gas in the chamber (43) is above a limit value. [20] Supply system (4) for chemical liquids (65) according to claim 17, 18 or 19, further comprising: a front door (42) arranged on one side of the chamber (43), the front door (42) being automatically operated, and when the front door (42) is closed, an airtight cavity is formed in the chamber (43).

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