Motor drive system with correction function for temperature deviation of an IGBT module

Abstract

A motor drive system (100) having a correction function for a temperature deviation of an IGBT module (130), comprising: a gate board (120) that detects a plurality of temperature detection information by scanning the IGBT module (130), detects a difference value between maximum temperature information among the plurality of temperature detection information and at least one temperature detection information, and corrects and outputs the at least one temperature detection information using the detected difference value, and a motor controller (110) that calculates final temperature information of the IGBT module (130) using the corrected temperature detection information and reference temperature information of the IGBT module (130).

Description

TECHNICAL FIELDThe present invention relates to a motor drive system and, as an example, to a motor drive system having a correction function of a temperature deviation of an IGBT module.PRIOR ARTInsulated gate bipolar transistors (IGBT) devices are often used as a circuit of a drive unit that uses many high voltage signals such as motor drive or high voltage conversion of an electric vehicle and a hybrid system, because eco-friendly vehicles such as electric vehicles, hybrid vehicles, and fuel cell vehicles are increasing.Since the IGBT device is a semiconductor module used in a vehicle, there are a lot of safety requirements. In particular, there is a possibility that the IGBT device malfunctions when a temperature rises to an allowable maximum junction temperature or higher, and as a result, damage such as human accidents may occur, and thus a sensor technology for the temperature of the IGBT device is very important.Referring to FIG. 1, a motor drive system having a temperature sensing function in the related art can be confirmed.The motor drive system in the related art includes a motor controller (ECU) 10 including a main microcomputer (uC) 11, a gate board 20 including a plurality of integrated circuits IC 1, IC 2, IC 3, IC 4, IC 5, and IC 6, an IGBT module 30 including a plurality of switching elements S 1, S 2, S 3, S 4, S 5, and S 6, and temperature detection diodes D 1, D 2, D 3, D 4, D 5, and D 6, and a motor 40 formed by a 3-phase coil.The main micom (μC) 11 calculates current information of the motor 40 and temperature information of the IGBT module 30 to generate a control signal for controlling the motor drive.The plurality of integrated circuits IC 1, IC 2, IC 3, IC 4, IC 5, and IC 6 turn on / off a corresponding one of the plurality of switching elements S 1, S 2, S 3, S 4, S 5, and S 6 according to the control signal of the main microcomputer (μC).The plurality of integrated circuits IC 1, IC 2, IC 3, IC 4, IC 5, and IC 6 acquire the temperature information by monitoring a corresponding temperature detection diode among the plurality of temperature detection diodes D 1, D 2, D 3, D 4, D 5, and D 6.The plurality of switching elements S 1, S 2, S 3, S 4, S 5, and S 6 may perform the switching operation according to the control of the plurality of integrated circuits IC 1, IC 2, IC 3, IC 4, IC 5, and IC 6. Thereby, the motor 40 can be driven.Meanwhile, the gate board 20 may monitor a state of the switching element of the IGBT module 30, and may include a submicom (sub μC) 21 that transmits a monitor value to a control board and a storage unit 23.The submicom 21 receives the temperature information of the plurality of temperature detection diodes D 1, D 2, D 3, D 4, D 5, and D 6 from the plurality of integrated circuits IC 1, IC 2, IC 3, IC 4, IC 5, and IC 6. The submicom 21 calculates a deviation between a plurality of pieces of temperature information. The submicom 21 corrects the temperature information of the IGBT module 30 using a calculated temperature deviation. The submicom 21 transmits the maximum temperature information of the IGBT module 30 provided by the correction to the main micom 11.The storage unit 23 stores the calculated temperature deviation and the maximum temperature information of the IGBT module 30.In the related art, there is a problem in that, in order to correct the temperature deviation for each switching element during a control production process, related circuits such as the submicom 21 that sequentially performs a temperature deviation correction task and the memory 23 are added, thereby increasing the complexity of the circuit and the cost.Since there is no step of considering a characteristic change of the IGBT module 30 depending on aging of a control product, temperature deviation correction depending on occurrence of additional temperature deviation is not performed.A motor drive device that drives a motor as a three-phase motor and measures the temperatures of switching elements is known from US 2017 / 0 288 595 A1, for example.SUMMARY OF THE INVENTIONThe present invention has been made in an effort to provide a motor drive system having a temperature deviation correction function of an IGBT module that corrects the temperature deviation for each switching element of the IGBT module without adding a separate control element.An exemplary embodiment of the present invention provides a motor drive system having a temperature deviation correction function of an IGBT module, including: a gate board that acquires a plurality of temperature detection information by sensing the IGBT module, acquires a difference value between maximum temperature information among the plurality of temperature detection information and at least one temperature detection information, and corrects and outputs the at least one temperature detection information using the acquired difference value.The motor drive system further includes a motor controller (ECU) that calculates final temperature information of the IGBT module using the corrected temperature detection information and the reference temperature information of the IGBT module.The reference temperature information may be acquired from an NTC of the IGBT module.The IGBT module may include a plurality of IGBT elements for motor driving, the gate board may include a plurality of integrated circuit units respectively connected to the plurality of IGBT elements, and the plurality of integrated circuit units may acquire the temperature detection information from the respective IGBT elements.Each of the plurality of integrated circuit units may include a temperature detection unit that detects the temperature detection information from a detection diode disposed around each of the IGBT elements, a signal processing unit that converts a shape of the temperature detection information detected by the temperature detection unit and outputs the shape as a strobe pulse, and a deviation detection unit that calculates a difference value between the maximum temperature information and the temperature detection information corresponding to the strobe pulse output by the signal processing unit.The motor drive system may further include an average calculation unit that calculates an average of the difference value calculated by the deviation detection unit.The signal processing unit may output the corrected duty pulse by adding the difference value to the duty pulse according to the acquired temperature information.The corrected duty pulses output from the respective integrated circuit units may have the same duty ratio.The gate board may correct an OC detection level of the IGBT module by using the reference temperature information and the maximum temperature information.The gate board may include an OC detection unit that subtracts a compensation voltage depending on the reference temperature information and the maximum temperature information from the reference voltage and compares a subtraction result and the OC voltage depending on the current of the IGBT module.According to an exemplary embodiment of the present invention, in a motor drive system having a correction function of a temperature deviation of an IGBT module, the temperature deviation is corrected for each switching element of the IGBT module without a separate control element such as a micom to achieve an economical effect by shortening the manufacturing time of control and eliminating an associated circuit.A feature deviation that changes according to product aging is optimized at each start of a vehicle, which even contributes to improvement in product performance.The foregoing summary is exemplary only and is not intended to be limiting in any way. In addition to the above-described exemplary aspects, embodiments, and features, other aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description.BRIEF DESCRIPTION OF THE DRAWINGSFIG. 1 is a configuration block diagram of a motor drive system in the related art. FIG. 2 is a configuration block diagram of a motor drive system having a correction function of a temperature deviation of an IGBT module according to an exemplary embodiment of the present invention. FIG. 3 is a block diagram illustrating a configuration of an integrated circuit unit of FIG. 2. FIG. 4 is a diagram for describing a strobe generation method of a signal processing unit of FIG. 3. FIG. 5 is a diagram illustrating an input signal and an output signal of a deviation detection unit of FIG. 3. FIG. 6 is a diagram for describing a temperature characteristic deviation between temperature detection diodes. FIG. 7 is a diagram for describing a final temperature information calculation method of an ECU. FIG. 8 is a diagram illustrating a strobe pulse output from an integrated circuit unit and a strobe pulse calculated by a main micom. FIG. 9 is a configuration block diagram of a motor drive system having a correction function of a temperature deviation of an IGBT module according to another exemplary embodiment of the present invention. FIG. 10 is a block diagram illustrating a configuration of an integrated circuit unit of FIG. 9. FIG. 11 is a diagram illustrating a detailed configuration of an OC detection unit of FIG. 10. FIG. 12 is a diagram illustrating a detection deviation of an integrated circuit unit depending on a temperature and a deviation of a temperature detection diode as an example. FIG. 13 is a diagram for describing correction of a detection deviation of an integrated circuit unit. FIG. 14 is a flowchart of a method for correcting a temperature deviation of an IGBT module according to an exemplary embodiment of the present invention. FIG. 15 is a flowchart of a method for correcting a temperature deviation of an IGBT module according to another exemplary embodiment of the present invention.It should be understood that the appended drawings are not necessarily to scale, presenting a somewhat simplified representation of various features illustrative of the basic principles of the invention. The specific design features of the present invention as disclosed herein, including, for example, specific dimensions, orientations, locations, and shapes will be determined in part by the particular intended application and use environment.In the figures, reference numerals refer to the same or equivalent parts of the present invention throughout the several figures of the drawing.DETAILED DESCRIPTIONHereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. First, it should be noted that, when reference numerals refer to components of the individual drawings, the same components are denoted by the same reference numerals as much as possible, even though they are illustrated in different drawings. Hereinafter, the preferred embodiment of the present invention will be described, but the technical spirit of the present invention is not limited thereto or limited thereby, and the embodiments may be modified and executed in various ways by those skilled in the art.FIG. 2 is a configuration block diagram of a motor drive system having a correction function of a temperature deviation of an IGBT module according to an exemplary embodiment of the present invention.Referring to FIG. 2, a motor drive system 100 having a correction function of a temperature deviation of an IGBT module according to an exemplary embodiment of the present invention includes a motor controller (ECU) 110, a gate board 120, an IGBT module 130, and a motor 140.The motor controller 110 includes a main microcomputer 111 that generates a control signal for controlling the motor drive. The main micom 111 transmits the control signal to the gate board 120 to control the motor drive via the gate board 120. The main micom 111 may receive various information required for generation of the control signal from the gate board 120 and the IGBT module 130.The main micom 111 may receive, from the gate board 120, a duty out (duty out) signal related to the temperature sensing information of the IGBT module 130. In addition, the main micom 111 may receive reference temperature information (reference temp) from a negative temperature coefficient (NTC) of the IGBT module 130.The main micom 111 stores the received strobe pulse (duty out) and the reference temperature information in a separate register. The main micom 111 may calculate a difference between the duty pulse and the reference temperature information. The main micom 111 may calculate final temperature information of the IGBT module 130 according to a calculated temperature difference. The main micom 111 may determine whether the IGBT module 130 is usable based on the final temperature information.The main micom 111 may transmit a synchronization signal Sync for synchronization between a plurality of strobe pulses to the gate board 120 when the strobe pulse is generated in each integrated circuit unit of the gate board 120.The gate board 120 may include a plurality of integrated circuit units that control the turn-on or turn-off of the IGBT device of the IGBT module according to the control signal transmitted from the motor controller 110. The plurality of integrated circuit units may include a first integrated circuit unit IC 1, a second integrated circuit unit IC 2, a third integrated circuit unit IC 3, a fourth integrated circuit unit IC 4, a fifth integrated circuit unit IC 5, and a sixth integrated circuit unit IC 6.The plurality of integrated circuit units may respectively control the turn-on or turn-off of the corresponding IGBT elements of the IGBT module 130. The plurality of integrated circuit units may acquire the temperature detection information from the corresponding IGBT elements of the IGBT module 130. Each of the plurality of integrated circuit units may transmit temperature sensing information having the same temperature information to the main mic 111 in the form of the strobe pulse by appropriate correction.The IGBT module 130 may include a plurality of IGBT elements that turn on or off according to the driving voltage of the gate board 120. The plurality of IGBT elements may include a first IGBT element S 1, a second IGBT element S 2, a third IGBT element S 3, a fourth IGBT element S 4, a fifth IGBT element S 5, and a sixth IGBT element S 6.A gate terminal of each of the plurality of IGBT elements may be connected to a corresponding integrated circuit unit of the gate board 120. Each of the plurality of IGBT elements may be turned on or off by the corresponding integrated circuit unit of the gate board 120.The first IGBT element S 1 and the second IGBT element S 2 may be connected to a first phase of the motor 140. The third IGBT element S 3 and the fourth IGBT element S 4 may be connected to a second phase of the motor 140. The fifth IGBT element S 5 and the sixth IGBT element S 6 may be connected to a third phase of the motor 140. Each of the plurality of IGBT elements turns on or off and applies battery voltage VBAT to rotate motor 140.The IGBT module 130 may include a plurality of temperature sensing diodes that measure ambient temperature information of each of the plurality of IGBT elements. The plurality of temperature sensing diodes may include a first temperature sensing diode D 1, a second temperature sensing diode D 2, a third temperature sensing diode D 3, a fourth temperature sensing diode D 4, a fifth temperature sensing diode D 5, and a sixth temperature sensing diode D 6.The first temperature sensing diode D 1 may be disposed around the first IGBT element S 1. The first temperature sensing diode D 1 may be connected to the first integrated circuit unit IC 1.The second temperature sensing diode D 2 may be disposed around the second IGBT element S 2. The second temperature sensing diode D 2 may be connected to the second integrated circuit unit IC 2.The third temperature sensing diode D 3 may be disposed around the third IGBT element S 3. The third temperature sensing diode D 3 may be connected to the third integrated circuit unit IC 3.The fourth temperature sensing diode D 4 may be disposed around the fourth IGBT element S 4. The fourth temperature sensing diode D 4 may be connected to the fourth integrated circuit unit IC 4.The fifth temperature sensing diode D 5 may be disposed around the fifth IGBT element S 5. The fifth temperature sensing diode D 5 may be connected to the fifth integrated circuit unit IC 5.The sixth temperature sensing diode D 6 may be disposed around the sixth IGBT element S 6. The sixth temperature sensing diode D 6 may be connected to the sixth integrated circuit unit IC 6.In each of the plurality of temperature detection diodes, the temperature information may be detected by the corresponding integrated circuit unit of the gate board 120. Since the temperature information of each of the plurality of temperature detection diodes includes the deviation, each integrated circuit unit may correct the deviation of the temperature information and transmit the corrected deviation to the main microcomputer 111.The motor 140 may be a motor for vehicle propulsion. The motor 140 may rotate by the current applied to a 3-phase coil.FIG. 3 is a block diagram showing a configuration of an integrated circuit unit of FIG. 2.Referring to FIG. 3, a detailed configuration of the integrated circuit unit can be confirmed. The integrated circuit unit of FIG. 3 corresponds to any one of the first to sixth integrated circuit units IC 1, IC 2, IC 3, IC 4, IC 5, and IC 6. The first to sixth integrated circuit units IC 1, IC 2, IC 3, IC 4, IC 5, and IC 6 may be connected to each other via a duty-out terminal Duty Out.The integrated circuit unit may include a temperature detection unit 210, a signal processing unit 220, a switch driving unit 230, a deviation detection unit 240, and an averaging unit 250.The temperature detection unit 210 may detect the temperature information of the corresponding IGBT element. The temperature sensing unit 210 may sense the voltage of the temperature sensing diode around the corresponding IGBT element. That is, the temperature detection unit 210 may estimate the temperature information of the corresponding IGBT element about the voltage of the temperature detection diode.The signal processing unit 220 may receive the synchronization signal Sync from the main mic 111. The signal processing unit 220 may receive the temperature detection information of the corresponding IGBT element from the temperature detection unit 210. The signal processing unit 220 may convert the shape of the temperature detection information of the corresponding IGBT element into the strobe pulse. A method in which the shape of the temperature detection information is converted into the shape of the strobe pulse can be confirmed by FIG. 4.Referring to FIG. 4, the signal processing unit 220 compares the diode voltage V_diode corresponding to the temperature information of the IGBT element and a SAW waveform to generate the duty pulse Duty pulses. To this end, the signal processing unit 220 may include a wave generating unit (not shown) that generates the SAW waveform and a comparator (not shown).Referring to FIG. 3, the signal processing unit 220 may output the strobe pulse in accordance with a rising edge of the synchronization signal.The switch driving unit 230 may turn on the corresponding IGBT element by applying the voltage to the gate terminal of the corresponding IGBT element according to the control signal of the main micom 111.A maximum duty pulse feedback having maximum duty among the duty pulses output from the plurality of integrated circuit units may be input to the deviation detection unit 240. The maximum strobe pulse may be generated when the plurality of strobe pulses pass through an OR gate (not shown).The duty pulse output from the signal processing unit 220 may be directly input to the deviation detection unit 240. The deviation detection unit 240 compares the maximum duty pulse and the duty pulse output from the signal processing unit 220 to detect a difference value therebetween. A difference value detection method of the deviation detection unit 240 may be configured by FIG. 5.FIG. 5 is a diagram illustrating an input signal and an output signal of a deviation detection unit of FIG. 3.Referring to FIG. 5, the deviation detection unit 240 may detect a duty difference value of 20% when the maximum duty pulse feedback has a duty of 60% and the duty pulse duty out has a duty of 40%.Referring to FIG. 3, the deviation detection unit 240 may output the detected duty difference value when the deviation detection unit 240 receives a compensation signal compensation as an input from the main mic 111 to be activated.The averaging unit 250 may receive the duty difference value for a predetermined time and calculate an average value of the received duty difference value. Thereby, the noise of the ON-state difference value can be removed. The averaging unit 250 may transmit the duty difference value from which the noise has been removed to the signal processing unit 220.The signal processing unit 220 may output a corrected duty pulse by adding the duty difference value during motor driving. Therefore, the integrated circuit unit can independently correct and output a temperature deviation between the plurality of temperature detection diodes. In addition, the corrected duty pulses output from the respective integrated circuit units may have the same duty.FIG. 6 is a diagram for describing a temperature characteristic deviation between temperature detection diodes.Referring to FIG. 6, a temperature characteristic deviation between temperature detection diodes may be confirmed. In an exemplary embodiment, the first temperature sensing diode D 1 may output a higher voltage value for a temperature than other temperature sensing diodes. Further, the second temperature sensing diode D 2 may output a higher voltage value for temperature than temperature sensing diodes other than the first temperature sensing diode D 1. Further, the third temperature sensing diode D 3 may output a higher voltage value for temperature than other temperature sensing diodes other than the first temperature sensing diode D 1 and the second temperature sensing diode D 2.There is a deviation in acquisition of temperature information acquired from each of the plurality of integrated circuit units according to the temperature characteristic of the temperature detection diode.FIG. 7 is a diagram for describing a final temperature information calculation method of an ECU. Referring to FIG. 7, any engine controller (ECU 1) may calculate the final temperature information by using the corrected temperature detection information transmitted from the integrated circuit unit and the reference temperature information to correct the temperature deviation from other controllers (ECUn) (n is an integer of 2 or more).FIG. 8 is a diagram illustrating a strobe pulse output from an integrated circuit unit and a strobe pulse calculated by a main micom.Referring to FIG. 8, various pulse waveforms in a system standby mode (STBY) depending on an engine off range and various pulse waveforms in a system normal mode (Normal) depending on an engine operating range may be confirmed.Different pulse waveforms may include the synchronization signal (sync), the compensation signal (compensation), and the strobe pulse. Here, the strobe pulse may include a first strobe pulse Duty out# 1 of the first integrated circuit unit IC 1 to a sixth strobe pulse Duty out# 6 of the sixth integrated circuit unit IC 6.In an exemplary embodiment, difference values 5%, 6%, and 4% between duty ratios 55%, 54%, and 56% of the first duty pulse Duty out# 1 and a duty ratio 60% of the maximum temperature information in the motor-off region may be calculated. Furthermore, an average value of 5% can be calculated as a function of the difference values of 5%, 6% and 4%. In the motor operation region, the first duty pulse Duty out#1 may be corrected to have the duty ratio 60% corresponding to the maximum temperature information by adding the average value 5%.In an exemplary embodiment, difference values 20%, 19%, and 21% between duty ratios 40%, 41%, and 39% of the second duty pulse Duty out# 2 and the duty ratio 60% of the maximum temperature information in the motor-off region may be calculated. In addition, an average value 20% can be calculated depending on the difference values 20%, 19% and 21%. In the motor operation region, the second duty pulse Duty out#2 may be corrected to have the duty ratio 60% corresponding to the maximum temperature information by adding the average value 20%.Each of the strobe pulses output from the plurality of integrated circuit units passes through an OR logic gate to be input to the main microcomputer 111 in a state where each strobe pulse has a maximum duty ratio.The main micom 111 may calculate a duty pulse having a duty ratio of 50% by subtracting a duty ratio of 10% corresponding to the reference temperature information from the duty ratio of 60% of the received duty pulse. The duty pulse having the calculated duty ratio of 50% may correspond to the final temperature information.FIG. 9 is a configuration block diagram of a motor drive system having a correction function for a temperature deviation of an IGBT module according to another exemplary embodiment of the present invention.Referring to FIG. 9, a motor drive system 100 having a temperature deviation correction function of an IGBT module according to another exemplary embodiment of the present invention may additionally include a serial peripheral interface circuit (SPI) connecting the main microcomputer 111 and the plurality of integrated circuit units, as compared with the motor drive system of FIGS. 1 to 8. In addition, the SPI circuit may connect the plurality of integrated circuit units to each other to communicate with each other.The motor drive system 100 having a correction function of a temperature deviation of an IGBT module according to another exemplary embodiment of the present invention corrects a deviation of overcurrent (OC) detection levels of the plurality of IGBT elements.A method of correcting the deviation of the OC detection level in the integrated circuit unit will be described below.FIG. 10 is a block diagram showing a configuration of an integrated circuit unit of FIG. 9.Referring to FIG. 10, the integrated circuit unit may include a temperature detection unit 310, a signal processing unit 320, a deviation detection unit 330, an averaging unit 340, an interface unit 350, and an OC detection unit 360.The temperature detection unit 310, the signal processing unit 320, the deviation detection unit 330, and the averaging unit 340 are components corresponding to the temperature detection unit 210, the signal processing unit 220, the deviation detection unit 240, and the averaging unit 250 described in FIGS. 1 to 8, and a detailed description thereof will be replaced with the description of FIGS. 1 to 8.The interface unit 350 may receive a final compensation signal via the SPI circuit. The interface unit 350 may transmit the final compensation signal to the OC detection unit 360. The OC detection unit 360 may operate according to the final compensation signal.The OC detection unit 360 detects the current flowing through the plurality of IGBT elements to determine whether an overcurrent OC is generated. Here, the current flowing through the plurality of IGBT elements has the deviation depending on the temperature, and the OC detection unit 360 may output the OC detection level by correcting the deviation. Therefore, the plurality of integrated circuit units can transmit the same OC detection level to the main micom 111.FIG. 11 is a diagram illustrating a detailed configuration of an OC detection unit of FIG. 10.Referring to FIG. 11, the OC detection unit 360 may include a comparator 360, a first subtractor 363, a second subtractor 365, and a reference current source 367.The comparator 360 may receive an over-current dependent voltage Voc from the corresponding IGBT element. The comparator 360 may receive the OC compensation voltage Voc_c provided by subtracting the first voltage -KVT from the reference voltage VREF and additionally subtracting the second voltage Vcomp. The comparator 360 compares Voc and Voc_c to output an error compensated OC detection level.The process for calculating the OC compensation voltage is represented by an equation as below.In Equation 1, K represents a constant, the correction value between the integrated circuit units represents a voltage corresponding to the maximum temperature information, and the NTC correction value represents a voltage depending on the reference temperature information.FIG. 12 is a diagram illustrating a measurement deviation of an integrated circuit unit depending on a temperature and a deviation of a temperature sensing diode as an example.Referring to FIG. 12, a measurement deviation of the first integrated circuit unit IC 1 may be represented as 20V and the deviation of the first temperature sensing diode D 1 may be represented as 10V. In this case, the corrected OC detection level VIC 1 of the first integrated circuit unit IC 1 may be represented as VREFT-K (VT)+30V (correction value between integrated circuit units) - 30V (NTC correction value).The variation of the second integrated circuit unit IC 2 may be represented as 20V and the variation of the second temperature sensing diode D 2 may be represented as 25V. In this case, the corrected OC detection level VIC 2 of the second integrated circuit unit IC 2 may be represented as VREFT-K (VT)+45V (correction value between integrated circuit units)+45V (NTC correction value).The measurement deviation of the third integrated circuit unit IC 3 may be represented as 10V and the deviation of the third temperature sensing diode D 3 may be represented as -5V. In this case, the corrected OC detection level VIC 3 of the third integrated circuit unit IC 3 may be represented as VREFT-K (VT)+5V (correction value between integrated circuit units)- 5V (NTC correction value).The variation of the fourth integrated circuit unit IC 4 may be represented as 5V and the variation of the fourth temperature sensing diode D 4 may be represented as 10V. In this case, the corrected OC detection level VIC 4 of the fourth integrated circuit unit IC 4 may be represented as VREFT-K (VT)+15V (correction value between integrated circuit units)- 15V (NTC correction value).The variation of the fifth integrated circuit unit IC 5 may be represented as 15V and the variation of the fifth temperature sensing diode D 5 may be represented as 15V. In this case, the corrected OC detection level VIC 5 of the fifth integrated circuit unit IC 5 may be represented as VREFT-K (VT)+30V (correction value between integrated circuit units) - 30V (NTC correction value).The variation of the sixth integrated circuit unit IC 6 may be represented as 10V and the variation of the sixth temperature sensing diode D 6 may be represented as -20V. In this case, the corrected OC detection level VIC 6 of the sixth integrated circuit unit IC 6 may be represented as VREFT-K (VT)+10V (correction value between integrated circuit units)+10V (NTC correction value).Therefore, the first integrated circuit unit IC 1, the second integrated circuit unit IC 2, the third integrated circuit unit IC 3, the fourth integrated circuit unit IC 4, the fifth integrated circuit unit IC 5, and the sixth integrated circuit unit IC 6 may have the same OC detection level.FIG. 13 is a diagram for describing correction of a detection deviation of an integrated circuit unit.Referring to FIG. 13, the first integrated circuit unit IC 1, the fifth integrated circuit unit IC 5, and the sixth integrated circuit unit IC 6 may have different OC voltages Voc 1, Voc 5, and Voc 6 for each temperature Temp 1 and have a target voltage Target by autonomous correction without an additional sub-block. That is, the first integrated circuit unit IC 1, the fifth integrated circuit unit IC 5, and the sixth integrated circuit unit IC 6 may have the same OC detection level. Therefore, the OC detection level is optimized to extend the maximum operating range of the engine. In addition, fuel efficiency is improved by increasing the maximum operating range of the engine.FIG. 14 is a flowchart of a method for correcting a temperature deviation of an IGBT module according to an exemplary embodiment of the present invention.Referring to FIGS. 3 and 14, a method for correcting a temperature deviation of an IGBT module according to an exemplary embodiment of the present invention includes a detection step (S 141) of detecting a plurality of temperature detection information of the IGBT module 130, a detection step (S 1420) of detecting a difference value between the maximum temperature information among the plurality of temperature detection information and at least one temperature detection information, and a correction step (S 1440) of correcting and outputting at least one temperature detection information using the difference value.The method for correcting a temperature deviation of an IGBT module according to an exemplary embodiment of the present invention may further include an average value calculation step (S 1430) of calculating the average value of the difference value, and a final value calculation step (S 1450) of calculating the final temperature information of the IGBT module 130 using the corrected temperature detection information and the reference temperature information of the IGBT module 130.In the correction step (S 1440), at least one temperature detection information may be corrected and output using the average value calculated in the average value calculation step (S 1430).FIG. 15 is a flowchart of a method for correcting a temperature deviation of an IGBT module according to another exemplary embodiment of the present invention.Referring to FIGS. 10 and 15, a method for correcting a temperature deviation of an IGBT module according to another exemplary embodiment of the present invention may further include a voltage detection step (S 151) of detecting the OC voltage depending on the current of the IGBT module, and a level correction step of correcting the level of the detected OC voltage using the reference temperature information and the maximum temperature information. Here, the level correction step may include a subtraction step (S 1520) of subtracting the compensation voltage depending on the reference temperature information and the maximum temperature information from the reference voltage, and a comparison step (S 1530) of comparing a subtraction result and the OC voltage.Meanwhile, the embodiments according to the present invention may be implemented in the form of program instructions executable by computers, and may be recorded in computer readable media. The computer readable media may include program instructions, a data file, a data structure, or a combination thereof. By way of example, and not limitation, computer readable media may include computer storage media and communication media. Computer storage media includes both volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information such as computer readable instructions, data structures, program modules, or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information transmission media. The term "modulated data signal" refers to a signal in which one or more of its characteristics are adjusted or altered to encode information in the signal. By way of example and not limitation, communication media includes wired media such as a wired network or direct-wired connection, and wireless media such as acoustic, RF, infrared, and other wireless media. Combinations of the above should also fall within the scope of computer readable media.As described above, the exemplary embodiments have been described and illustrated in the drawings and the specification. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and their practical application, to thereby enable others skilled in the art to make and use various exemplary embodiments of the present invention, as well as various alternatives and modifications thereof. As will be apparent from the foregoing description, certain aspects of the present invention are not limited by the particular details of the examples set forth herein, and it is therefore contemplated that other modifications and applications or equivalents thereof will occur to those skilled in the art. However, many changes, modifications, variations and other uses and applications of the present construction will become apparent to those skilled in the art upon consideration of the specification and the accompanying drawings. All such changes, modifications, variations and other uses and applications that do not depart from the spirit and scope of the invention are intended to be embraced by the invention, which is limited only by the following claims.

Claims

A motor drive system (100) having a correction function of a temperature deviation of an IGBT module (130), comprising: a gate board (120) that acquires a plurality of temperature detection information by sensing the IGBT module (130), acquires a difference value between maximum temperature information among the plurality of temperature detection information and at least one temperature detection information, and corrects and outputs the at least one temperature detection information using the acquired difference value; and a motor controller (110) that calculates end temperature information of the IGBT module (130) using the corrected temperature detection information and reference temperature information of the IGBT module (130).The motor drive system (100) having a correction function of a temperature deviation of an IGBT module (130) according to claim 1, wherein the reference temperature information is acquired from an NTC of the IGBT module (130).The motor drive system (100) having a temperature deviation correction function of an IGBT module (130) according to any one of the preceding claims, wherein the IGBT module (130) includes a plurality of IGBT elements for motor driving, the gate board (120) includes a plurality of integrated circuit units (IC1 - IC5) each connected to the plurality of IGBT elements, and the plurality of integrated circuit units (IC1 - IC5) acquires the temperature detection information from the respective IGBT elements.The motor drive system (100) having a temperature deviation correction function of an IGBT module (130) according to claim 3, wherein each of the plurality of integrated circuit units (IC1 - IC5) comprises: a temperature detection unit (310) that detects the temperature detection information from a detection diode (D1 - D6) disposed around each of the IGBT elements; a signal processing unit (220) that converts a shape of the temperature detection information detected by the temperature detection unit (310) and outputs the shape as a strobe pulse; and a deviation detection unit (240) that calculates a difference value between the maximum temperature information and the temperature detection information corresponding to the strobe pulse output from the signal processing unit (220).The motor drive system (100) having a temperature deviation correction function of an IGBT module (130) according to claim 4, further comprising: an average calculation unit (250) that calculates an average of the difference value calculated by the deviation detection unit (240).The motor drive system (100) having a correction function of a temperature deviation of an IGBT module (130) according to claim 4, wherein the signal processing unit (220) outputs the corrected duty pulse by adding the difference value to the duty pulse according to the acquired temperature information.The motor drive system (100) having a temperature deviation correction function of an IGBT module (130) according to claim 6, wherein the corrected duty pulses output from the respective integrated circuit units (IC1-IC5) have the same duty ratio.The motor drive system (100) having a correction function of a temperature deviation of an IGBT module (130) according to claim 1, wherein the gate board (120) corrects an OC detection level of the IGBT module (130) using the reference temperature information and the maximum temperature information.The motor drive system (100) having a temperature deviation correction function of an IGBT module (130) according to claim 8, wherein the gate board (120) includes an OC detection unit (360) that subtracts a compensation voltage depending on the reference temperature information and the maximum temperature information from the reference voltage and compares a subtraction result and the OC voltage depending on the current of the IGBT module (130).

Images