HEAT DISPENSING DEVICE AND ELECTRONICS COOLING SYSTEM

Abstract

Heat dissipation device (104) for an electronic cooling system (100) with an electronic component (102) which generates heat in response to receiving an electric current, wherein the heat dissipation device (104) comprises: a housing (106) that is attached to the electronic component (102) and absorbs heat from the electronic component (102), wherein the housing (106) has a surface (108) that defines a chamber (110); a first liquid (116) which is contained in the chamber (110) of the housing (106) and receives heat from the housing (106), wherein the first liquid (116) has a first boiling temperature; a sorption material (120) immersed in the first liquid (116); and a second liquid (124) which is adsorbed by the sorption material (120) and has a second boiling point which is higher than the first boiling point of the first liquid (116); wherein the first liquid (116) evaporates to a first vapor (118) when the first liquid (116) reaches the first boiling temperature; and wherein the second liquid (124) is desorbed from the sorption material (120) when the second liquid (124) and the sorption material (120) reach a desorption temperature below the second boiling temperature, and wherein the second liquid (124) evaporates to a second vapor (120) when the second liquid (124) reaches the second boiling temperature.

Description

[0001] The present description relates generally to the cooling of electronics and in particular to a heat dissipation device with several liquids and a sorption material immersed in one of the liquids to provide multiple cooling stages.

[0002] Electronics can generate heat as a byproduct when powered by electricity. The amount of heat depends on the power consumption, device characteristics, and circuit design. The resistance of processors, driver circuits, power circuits, and memory contributes to some heat and power loss. To prevent circuit failures or malfunctions, electronics must operate within safe operating temperatures. While some circuits do not require additional cooling, others incorporate heat dissipation mechanisms.

[0003] Existing heat pipes for electronics consist of an elongated tube containing a single liquid. The tube has a first end that transfers heat from an electronic component to the liquid, causing the liquid to vaporize when its temperature reaches its boiling point. The heat pipe also includes a second end that transfers heat from the vapor to the surroundings, causing the vapor to condense back into the liquid when its temperature drops below the boiling point. The heat pipe further includes a wick material that connects the first and second ends to return the condensed liquid from the second end to the first.In a drying state, where all the liquid evaporates into vapor, the vapor does not move to the second end to cool, and no condensate forms to flow back to the first end. This adversely affects the heat conduction's ability to cool the electronic component. Furthermore, the existing heat conduction system provides no warning to alert the user that the electronics' temperature is approaching or exceeding a maximum safe operating temperature.

[0004] JP 2000-150 751 A describes an upper chamber in the open section and a lower chamber in the closed section, which are hermetically sealed. Below the lower chamber, several flat semiconductor elements with cooling surfaces on both sides and overlapping cooling fins are alternately laminated. The cooling fins are hermetically sealed to the lower chamber via a cylindrical tube, which is hermetically sealed to each fin. A coolant is enclosed within the interior of the closed chamber, which consists of the upper chamber of the lower chamber and the cooling fin. The interior of the closed chamber is hermetically sealed by the connection between the upper and lower chambers, dividing it into a first chamber (the upper chamber) and a second chamber (shared by the lower chamber and the cooling fin).A first coolant is enclosed in the first chamber, and a second coolant, which differs from the first coolant, is enclosed in the second chamber.

[0005] The task can be considered to be to specify a new and improved heat dissipation device for electronics.

[0006] The problem is solved by a heat dissipation device according to claim 1 and an electronics cooling system according to claim 8. Furthermore, an exemplary method for operating an electronics cooling system is described.

[0007] A heat dissipation device according to the invention for an electronic cooling system with an electronic component that generates heat in response to receiving an electric current is described. The heat dissipation device comprises a housing attached to the electronic component that receives heat from the electronic component. The housing comprises a surface that defines a chamber. The heat dissipation device further comprises a first liquid contained in the chamber that absorbs heat from the housing, the first liquid having a first boiling point. The heat dissipation device further comprises a sorption material immersed in the first liquid. The heat dissipation device further comprises a second liquid adsorbed by the sorption material and having a second boiling point that is higher than the first boiling point of the first liquid.The first liquid evaporates to a first vapor when it reaches its first boiling point. The second liquid is desorbed by the sorbent material when both the second liquid and the sorbent material reach a desorption temperature below the second boiling point. The second liquid evaporates to a second vapor when it reaches its second boiling point.

[0008] In one embodiment, the sorption material is configured to desorb at least part of the second liquid into the chamber before all of the first liquid evaporates into the first vapor.

[0009] In one embodiment, the sorption material is configured to desorb at least a portion of the second liquid into the chamber after all of the first liquid has evaporated to the first vapor.

[0010] In one embodiment, the sorption material is spaced away from the surface of the housing and receives heat directly from the first liquid when the sorption material is immersed in the first liquid and the density of the first sorption material is less than the density of the first liquid.

[0011] In one embodiment, the sorption material is carried directly by the surface of the housing and receives heat directly from the surface of the housing in response to all of the first liquid evaporating into the first vapor or to a density of the first sorption material being greater than a density of the first liquid.

[0012] In one embodiment, the first liquid is water.

[0013] In one embodiment, the second liquid is ethylene glycol.

[0014] An electronic cooling system according to the invention comprises an electronic component that generates heat in response to receiving an electric current. The system further comprises a heat dissipation device for cooling the electronic component. The heat dissipation device includes a housing attached to the electronic component that receives heat from the electronic component, the housing having a surface that defines a chamber. The heat dissipation device further comprises a first liquid contained in the chamber that receives heat from the housing, the first liquid having a first boiling point. The heat dissipation device further comprises a first sorption material immersed in the first liquid and a second sorption material coated on the surface of the housing.The heat dissipation device further comprises a second liquid that is adsorbed by the first sorption material and / or the second sorption material and has a second boiling point that is higher than the first boiling point of the first liquid. The first liquid evaporates to a first vapor when it reaches its first boiling point. The second liquid is desorbed from the first sorption material and / or the second sorption material when the second liquid and the first sorption material and / or the second sorption material reach a desorption temperature. The desorption temperature is below the second boiling point. The second liquid evaporates to a second vapor when it reaches its second boiling point. The heat dissipation device further comprises one or more thermocouples attached to the electronic component and / or the heat dissipation device.The thermocouples generate an initial temperature signal corresponding to the temperature of the first liquid. The system further includes a controller electrically connected to the thermocouples. After receiving the initial temperature signal from the thermocouples, the controller compares the temperature of the first liquid to an initial temperature threshold. The controller generates an initial warning signal when it detects that the temperature of the first liquid exceeds the initial temperature threshold. The controller is electrically coupled to a display device to show an initial warning indicating that the first liquid is approaching the initial temperature threshold when the display device receives the initial warning signal from the controller.

[0015] In one embodiment, the first sorption material and / or the second sorption material are configured to desorb at least a portion of the second liquid into the chamber before all of the first liquid evaporates to the first vapor.

[0016] In one embodiment, the first sorption material and / or the second sorption material are configured to desorb at least a portion of the second liquid into the chamber after all of the first liquid has evaporated to the first vapor.

[0017] In one embodiment, the first sorption material is spaced away from the surface of the housing and receives heat directly from the first liquid and indirectly from the housing when the second sorption material is immersed in the first liquid and the density of the first sorption material is less than the density of the first liquid.

[0018] In one embodiment, the first sorption material is carried directly by the surface of the housing and receives heat directly from the surface of the housing in response to the fact that all of the first liquid evaporates to a first vapor or that the density of the first sorption material is greater than the density of the first liquid.

[0019] In one embodiment, the second sorption material is coated on a portion of the housing that is spaced away from the electronic component, so that the second sorption material indirectly receives heat from the electronic component. The second liquid is desorbed by the second sorption material when the second liquid and the second sorption material reach the desorption temperature, which is above the first boiling point of the first liquid.

[0020] In one embodiment, the thermocouple generates a second temperature signal corresponding to the temperature of the second liquid. The controller compares the temperature of the second liquid to a second temperature threshold when it receives this second signal from the thermocouple. If the controller detects that the temperature of the second liquid exceeds this second temperature threshold, it generates a second warning signal. Upon receiving this second warning signal from the controller, the display shows a second warning indicating that the temperature of the second liquid is approaching the second temperature threshold.

[0021] In one embodiment, the electronic cooling system further includes a blower for generating an airflow to cool the housing and the first vapor and the second vapor inside the housing.

[0022] In one embodiment, the thermocouples comprise a first thermocouple attached to the electronic component that generates the first temperature signal, and a second thermocouple attached to the heat dissipation device that generates the second temperature signal.

[0023] An exemplary method for operating an electronic cooling system is described, which may include an electronic component and a heat dissipation device attached to the electronic component. The heat dissipation device comprises a housing attached to the electronic component and having a surface that defines a chamber. The heat dissipation device further includes a first liquid contained in the chamber, which has a first boiling point. The heat dissipation device further includes a first sorption material immersed in the first liquid. The heat dissipation device further includes a second liquid adsorbed by the first sorption material, which has a second boiling point higher than the first boiling point of the first liquid.The heat dissipation device further includes one or more thermocouples attached to the electronic component and / or a controller. The method comprises transferring heat from the electronic component to the first liquid. The method further comprises the evaporation of the first liquid to a first vapor in response to the first liquid receiving heat from the electronic component and reaching its first boiling point. The method further comprises the desorption of the second liquid from the sorbent material in response to the second liquid and the first sorbent material reaching a desorption temperature below the second boiling point. The method further comprises the evaporation of the second liquid to a second vapor when the second liquid reaches its second boiling point.

[0024] The process may further include the step of desorbing at least part of the second liquid into the chamber using the first sorption material and a second sorption material coated on the housing before all of the first liquid evaporates to the first vapor.

[0025] The process can further include the step of the first sorption material, which is spaced from the surface of the housing, receiving heat directly from the first liquid in response to the first sorption material being immersed in the first liquid and having a lower density than the first liquid. At least a portion of the second liquid is desorbed into the chamber by the first sorption material and / or the second sorption material after all of the first liquid has evaporated to the first vapor. The first sorption material, which is supported directly by the surface of the housing, receives heat directly from the surface of the housing in response to the evaporation of the first liquid to a first vapor.

[0026] The method may further include the step of generating a first temperature signal, corresponding to the temperature of the first liquid, using the thermocouple. The controller compares the temperature of the first liquid to a first temperature threshold when it receives the first temperature signal from the thermocouple. The controller generates a first warning signal when it determines that the temperature of the first liquid is above the first temperature threshold. An indicator displays a first warning indicating that the first liquid is approaching the first temperature threshold when it receives the first warning signal from the controller. The thermocouple generates a second temperature signal, corresponding to the temperature of the second liquid.The controller compares the temperature of the second liquid to a second temperature threshold when it receives the second temperature signal from the thermocouple. The controller generates a second warning signal if it detects that the temperature of the second liquid exceeds the second temperature threshold. The indicator displays a second warning signal from the controller indicating that the temperature of the second liquid is approaching the second temperature threshold. Fig. Figure 1 is a perspective exploded view of an example of an electronic cooling system with an electronic component and a heat dissipation device for cooling the electronic component. Fig. Figure 2 is a cross-sectional view of the heat dissipation device of Fig.1 along line 2-2, which shows the heat dissipation device with a housing defining a chamber, a first liquid contained in the chamber, and a sorption material immersed in the first liquid. Fig. Figure 3 is an enlarged view of the heat dissipation device of Fig. 2 within circle 3, which shows a second liquid that is adsorbed by the sorption material, and wherein the density of the sorption material is greater than the density of the first liquid, such that the sorption material is directly supported by the casing before all of the first liquid has evaporated to a first vapor. Fig. Figure 4 is a cross-sectional view of another example of the electronics cooling system from Fig.1, which was recorded along line 2-2 and shows the heat dissipation device with a housing defining a chamber, a first liquid contained in the chamber, and a sorption material immersed in the first liquid. Fig. Figure 5 is an enlarged view of the heat dissipation device of Fig. 4 within circle 5, showing a second liquid adsorbed by the sorption material, the sorption material being spaced away from the housing before all of the first liquid has evaporated to a first vapor. Fig. Figure 6 is an enlarged view of the heat dissipation device of Fig. 5, which shows a second liquid being desorbed from the sorption material, the sorption material being carried directly by the case after all of the first liquid has evaporated into the first vapor. Fig.Figure 7 is a flowchart of an example procedure for operating the electronic cooling system of Fig. 1.

[0027] An exemplary electronics cooling system comprises a heat dissipation device with a sorbent material for separating and recombining two or more liquids to cool one or more electronic components. Although the detailed examples described below refer to a heat dissipation device with two liquids to provide a dual active thermal range of operating temperatures, other examples may include more than two liquids to provide any desired range of operating temperatures. More specifically, the heat dissipation device, as described in the detailed examples below, includes a first liquid contained within a housing, a sorbent material immersed in the first liquid, and a second liquid adsorbed by the sorbent material.The second liquid can be desorbed from the sorption material to prevent dehydration when the first liquid evaporates completely, thus preventing a cooling interruption that could damage the electronic component. In other words, the second liquid can serve as a buffer or reserve when the first liquid has completely evaporated. The first and second liquids provide a dual active thermal range (or operating temperature range) within which the heat dissipation device removes heat from the electronic component. This operating temperature range can extend from the lowest freezing point of the two liquids to the highest boiling point of both liquids.Within this operating temperature range, the liquids absorb heat from the electronic component, which in turn increases the temperature of the liquids.

[0028] The electronics cooling system can be a passive, open-loop system, in which a gravity-fed vapor chamber or closed-end pipe has a first closed end adjacent to the electronic component and a second closed end adjacent to a cooling fan. However, it is also considered that other examples of the system could be an active, closed-loop system comprising a vapor chamber or pipe forming a loop with a pump that pumps the condensate through the loop to return it to the electronic component.

[0029] The sorption material can be positioned in any suitable location relative to the electronic components and form a layer of any suitable thickness to adjust the heat dissipation device so that an appropriate percentage of each liquid is made available for cooling the electronic component. While only one liquid is adsorbed and desorbed by the sorption material described below, the sorption material can initially hold any number of different liquids. These liquids can have associated boiling points that differ from one another and be desorbed by the sorption material at associated desorption temperatures.Even though the examples described below for the first liquid and the second liquid are two different liquids with two different boiling points, the first and the second liquid can also be a single liquid with a single boiling point.

[0030] With reference to the Fig. 1 and Fig. Figure 2 includes an example of an electronic cooling system 100 comprising an electronic component 102 that generates heat in response to an electric current flowing through it. The electronic component can be a processor, driver circuits, power circuits, memory, or any other electronic component that generates heat in response to the electronic component 102 receiving an electric current.

[0031] As in the Fig. 2 and Fig.As best illustrated in Figure 3, the system 100 also includes a heat dissipation device 104 for cooling the electronic component 102. In this non-restrictive example, the heat dissipation device 104 can be a vapor chamber or a heat conductor for a passive, open-loop electronic cooling system. The heat dissipation device 104 includes a housing 106 with an inner surface 108 that defines a chamber 110, the housing 106 having a first and a second end 112, 114 ( Fig. 2) along chamber 110. Other examples of the device may be a steam chamber or a heat conduit for an active closed-loop system, wherein a pump pumps the condensate through the circuit to return it to the electronic component.

[0032] The heat dissipation device 104 further includes a first liquid 116, which is contained in the chamber 110 of the housing 106 and receives heat from the housing 106, wherein the first liquid 116 has a first boiling point. The first liquid evaporates to a first vapor 118 when the first liquid 116 reaches the first boiling point. In this example, the first liquid 116 is water with a freezing point of 32 degrees Fahrenheit (0 °C) and a boiling point of 212 degrees Fahrenheit (100 °C) at standard pressure at sea level. However, it is conceivable that the first liquid could be other liquids with corresponding freezing and boiling points.

[0033] The heat dissipation device 104 further comprises a first sorption material 120 immersed in the first liquid 116. The first sorption material 120 is suspended in the first liquid 116 and movable relative to the housing 106, so that the electronic component 102 transfers heat directly to the housing 106, which in turn transfers heat directly to the first liquid 116, which in turn transfers heat to the first sorption material 120. In this example, the first sorption material 120 has a density greater than that of the first liquid, so that the first sorption material 120 is immersed below an upper surface of the first liquid 116 and supported by a bottom wall 106a of the housing 106. In other examples, however, the first sorption material may have a density lower than that of the first liquid.The first sorption material is selected from the group consisting of a zeolite, a silica gel, and a metal-organic framework. In other examples, however, the first sorption material may also include other suitable materials for desorbing and adsorbing the liquid.

[0034] The heat dissipation device 104 further comprises a second sorption material 122 coated on a side wall 106b of the housing 106. In this example, the second sorption material 122 is coated on a portion of the housing 106 spaced apart from the electronic component 102, so that the second sorption material 122 indirectly receives heat from the electronic component 102 via the bottom wall 106a and the side wall 106b of the housing 106. It is provided that the sorption material can be applied to any part of the inner surface. The sorption material is selected from the group consisting of a zeolite, a silica gel, and a metal-organic framework. In other examples, however, the sorption material can also include other suitable materials for desorbing and adsorbing the second liquid.

[0035] The heat dissipation device 104 further includes a second liquid 124, which is adsorbed by at least one of the first sorption material 120 and the second sorption material 122 and has a second boiling point that is higher than the first boiling point of the first liquid 116. The second liquid 124 is desorbed by the second sorption material 122 when the second liquid 124 and the second sorption material 122 reach the desorption temperature. In this example, the desorption temperature is above the first boiling point of the first liquid 116. In other examples, however, the desorption temperature may also be below the first boiling point of the first liquid. Furthermore, the second liquid 124 evaporates to a second vapor 126 when it reaches its second boiling point.In this example, the second liquid, 124, is ethylene glycol, which has a freezing point of 8.78 degrees Fahrenheit (-12.9 °C) and a boiling point of 386.6 degrees Fahrenheit (197 °C) at standard pressure at sea level. However, it is conceivable that the second liquid could be any other liquid with a corresponding freezing and boiling point. Furthermore, it is conceivable that the heat dissipation device could include any number of sorption materials arranged in other configurations to separate and recombine any number of liquids before other liquids have completely evaporated.

[0036] During operation, the first sorption material 120 and the second sorption material 122 desorb at least a part of a second liquid 124 into the chamber 110 before the entire first liquid 116 evaporates to a first vapor 118, so that the boiling point of the resulting mixture can depend on the concentration of the mixture, as the values ​​in the following table show. Weight percent ethylene glycol Boiling point of the solution (deg F) Boiling point of the solution (deg C) 0 212 100 10 215 102 20 215 102 30 220 104 40 220 104 50 225 107 60 230 110 70 240 116 80 255 124 90 285 134 100 387 197

[0037] The concentration or weight percentage of the solution can be controlled by at least one of the following: using predetermined liquids with associated boiling points, positioning sorbent materials that retain these liquids at predetermined positions relative to the electronic component, and forming layers of predetermined thickness from the sorbent material. In another example, the first and second sorbent materials 120, 122 are configured to desorb the second liquid 124 into chamber 110 after all of the first liquid 116 has evaporated to the first vapor 118.

[0038] With renewed reference to Fig.The system 100 further comprises one or more thermocouples 128 attached to at least one of the electronic component 102 and the heat dissipation device 104. The thermocouples 128 generate a first temperature signal corresponding to the temperature of the first liquid 116 and a second temperature signal corresponding to the temperature of the second liquid 124. More precisely, in this example, the thermocouples 128 comprise a first thermocouple 130 attached to the electronic component 102, which generates the first temperature signal. The thermocouples 128 further comprise a second thermocouple 132 attached to the heat dissipation device 104, which generates the second temperature signal.In other examples, the system comprises a single thermocouple located in the chamber of the housing or elsewhere, and attached to any part of the heat dissipation device or electronic component.

[0039] System 100 further includes a controller 134, which is electrically connected to the thermocouples 128. The controller 134 compares the temperature of the first liquid 120 with a first temperature threshold when it receives the first temperature signal from the thermocouple 128. In this example, the first temperature threshold is the first boiling point of the first liquid, e.g., 212 degrees Fahrenheit (100 °C) in conjunction with water. The controller 134 generates a first warning signal when it detects that the temperature of the first liquid 120 is above the first temperature threshold. The controller 134 compares the temperature of the second liquid 124 with a second temperature threshold when it receives the second temperature signal from the thermocouple 128. Continuing with the previous example, the second temperature threshold is the second boiling point of the second liquid 124, e.g.,387 degrees Fahrenheit (197 °C) in conjunction with ethylene glycol. The controller 134 generates a second warning signal in response to the controller 134 detecting that the temperature of the second liquid 124 is above the second temperature threshold.

[0040] The control unit 134 is further electrically coupled to a display device 136 to show a first warning indicating that the first liquid 120 is approaching the first temperature threshold, in response to the display device 136 receiving the first warning signal from the control unit 134. The display device 136 further displays a second warning indicating that the temperature of the second liquid 124 is approaching the second temperature threshold, when the display device 136 receives the second warning signal from the control unit 134.

[0041] The system 100 further includes a blower 138, which directs an airflow over the second end 116 of the housing 106 and the fins 117 ( Fig. 2), extending from the housing 106, generated to dissipate heat from it.

[0042] With regard to the Fig. 4 and Fig. Figure 5 shows another example of a heat dissipation device 204, which is related to the heat dissipation device 104 of the Fig. 2 and Fig. 3 resembles and contains the same components, which are identified by the same reference symbols increased by 100. While the first sorption material contains 120 of Fig.3. If the first sorption material 120 has a density greater than that of the first liquid 116, so that it is submerged below the upper surface of the first liquid 116, then the first sorption material 220 has a density less than that of the first liquid 216, so that it is sufficiently buoyant to float to the upper surface of the first liquid 216. For this reason, the first sorption material 220 is spaced from the bottom wall 206a of the housing 206 and absorbs heat directly from the first liquid 216 and indirectly from the housing 206 when it is submerged in the first liquid 216. More precisely, the electronic component transfers heat to the housing 206, which in turn transfers heat to the first liquid 216, which in turn transfers heat to the first sorption material 220 and the second liquid 224 adsorbed therein.

[0043] Now, with reference to Fig. 6 The first sorption material 220 is carried directly from the surface 208 of the casing 206 and receives heat directly from the surface 208 of the casing 206 in response to the evaporation of the first liquid 216 into the first vapor 218.

[0044] With reference to Fig. 7 a procedure 300 for operating the system 100 of Fig. 2 provided. The procedure 300 begins in block 302 with the electronic component 102, which generates heat in response to receiving an electric current through the electronic component 102. More precisely, in this example ( Fig.1-3) The electronic component 102 transfers heat to the bottom wall 106a of the housing 106, which in turn transfers heat to the first liquid 120, and the first liquid 116 transfers heat to the first sorption material 120 and the first liquid 116 adsorbed therein. Furthermore, the first sorption material 120 has a density greater than that of the first liquid 116, so that the first sorption material 120 is submerged below the upper surface of the first liquid 116 and is directly supported by the bottom wall 106a of the housing 106. Accordingly, some of the heat is transferred directly from the housing 106 to the portion of the first sorption material 120 that is directly supported by the bottom wall 106a of the housing 106.

[0045] In another example ( Fig.4-6) the first sorption material 220 has a lower density than the density of the first liquid 216, so that the first sorption material 220 floats to the upper surface of the first liquid 216 and is carried away from the casing 206 ( Fig. 5) is spaced apart before all of the first liquid 216 evaporates into the first vapor 218. All the heat is transferred from the casing 206 to the first liquid 216, which in turn transfers heat to the first sorption material 220. It is conceivable that the position of the second sorption layer on the casing, the thickness of the second sorption layer, the density of the first sorption layer, and all other structures that form heat pathways to the sorption layers and the liquids adsorbed therein can be adjusted to control the rate of heat flow to them. In block 304, the first liquid 120 evaporates to the first vapor 126 when the first liquid 120 receives heat from the electronic component 102 and the first liquid 120 reaches the first boiling temperature.

[0046] In block 306, the first thermocouple 130 generates a first temperature signal, which is associated with the temperature of the first liquid.

[0047] In block 308, the controller 134 compares the temperature of the first liquid 120 with a first temperature threshold when the controller receives the first temperature signal from the first thermocouple 130. In this example, the first temperature threshold is the first boiling point of the first liquid. However, it is conceivable that the first temperature threshold could be above or below the first boiling point. For example, to provide an additional warning of the first liquid 120 drying out, the first temperature threshold could be a temperature below the first boiling point of the first liquid 120. If the temperature of the first liquid 120 is below the first temperature threshold, the procedure repeats block 308. If the temperature of the first liquid 120 is above the first temperature threshold, the procedure 300 continues with block 310.

[0048] In block 310, the controller 134 generates a first warning signal in response to the controller 134 detecting that the temperature of the first liquid 120 is above the first temperature threshold.

[0049] In block 312, a display device 136 shows an initial warning indicating that the first liquid 120 is approaching the first temperature threshold when the display device receives the first warning signal from the control unit 134.

[0050] In block 314, at least a portion of the second liquid 124 is desorbed from at least one of the first sorption material 120 and the second sorption material 122 and released into chamber 110 when the second liquid 124, the first sorption material 120, and the second sorption material 122 reach the desorption temperature. The desorption temperature is below the second boiling point. In one example, the desorption temperature is also below the first boiling point of the first liquid 116, which in turn is below the second boiling point of the second liquid 124, so that at least a portion of the second liquid 124 is desorbed from the first sorption material 120 and the second sorption material 122 before all of the first liquid 116 evaporates to the first vapor 118.In another example, the desorption temperature is above the first boiling point of the first liquid 116 and below the second boiling point of the second liquid 124, so that at least some of the second liquid 124 is desorbed from the first sorption material 120 and the second sorption material 122 after all of the first liquid 116 has evaporated to the first vapor 118.

[0051] In block 316, the second liquid 124 evaporates to the second vapor 128 after the second liquid 124 has received heat from the electronic component and the second liquid 124 has reached the second boiling temperature.

[0052] In block 318, the second thermocouple 132 generates a second temperature signal, which is assigned to the temperature of the second liquid 124.

[0053] In block 320, the controller 134 compares the temperature of the second liquid 124 with a second temperature threshold when the controller 134 receives the second temperature signal from the second thermocouple 132. In this example, the second temperature threshold is the second boiling point. However, it is conceivable that the second temperature threshold could be above or below the second boiling point. For example, to provide an additional warning of the second liquid 124 drying out, the second temperature threshold could be below the second boiling point of the second liquid 124. If the temperature of the second liquid 124 is below the second temperature threshold, the procedure 300 repeats block 320. If the temperature of the second liquid 124 is above the second temperature threshold, the procedure continues with block 322.

[0054] In block 322, the controller 134 generates a second warning signal in response to the controller 134 detecting that the temperature of the second liquid 124 is above the second temperature threshold.

[0055] In block 324, the display device 136 shows a second warning indicating that the temperature of the second liquid is approaching the second temperature threshold, in response to the display device receiving the second warning signal from the controller 134.

Claims

[1] Heat dissipation device (104) for an electronic cooling system (100) with an electronic component (102) which generates heat in response to receiving an electric current, wherein the heat dissipation device (104) comprises: a housing (106) that is attached to the electronic component (102) and absorbs heat from the electronic component (102), wherein the housing (106) has a surface (108) that defines a chamber (110); a first liquid (116) which is contained in the chamber (110) of the housing (106) and receives heat from the housing (106), wherein the first liquid (116) has a first boiling temperature; a sorption material (120) immersed in the first liquid (116); and a second liquid (124) which is adsorbed by the sorption material (120) and has a second boiling point which is higher than the first boiling point of the first liquid (116); wherein the first liquid (116) evaporates to a first vapor (118) when the first liquid (116) reaches the first boiling temperature; and wherein the second liquid (124) is desorbed from the sorption material (120) when the second liquid (124) and the sorption material (120) reach a desorption temperature below the second boiling temperature, and wherein the second liquid (124) evaporates to a second vapor (120) when the second liquid (124) reaches the second boiling temperature. [2] The heat removal device (104) according to claim 1, wherein the sorption material (120) is configured to desorb at least a part of the second liquid (124) into the chamber (110) before the entire first liquid (116) evaporates to the first vapor (118). [3] The heat removal device (104) according to claim 1, wherein the sorption material (120) is configured to desorb at least a portion of the second liquid (124) into the chamber (110) after all of the first liquid (116) has evaporated to the first vapor (118). [4] The heat dissipation device (104) according to claim 3, wherein the sorption material (120) is spaced apart from the surface (108) of the housing (106) and receives heat directly from the first liquid (116) and indirectly from the housing (106) as a reaction to the fact that the sorption material (120) is immersed in the first liquid (116). [5] The heat dissipation device (104) according to claim 3, wherein the sorption material (120) is carried directly from the surface (108) of the housing (106) and receives heat directly from the surface (108) of the housing (106) in response to the evaporation of the first liquid (116) into the first vapor (118). [6] The heat dissipation device (104) according to claim 1, wherein the first liquid (116) is water. [7] The heat dissipation device (104) according to claim 1, wherein the second liquid (124) is ethylene glycol. [8] An electronic cooling system (100), comprising: an electronic component (102) that generates heat in response to receiving an electric current; a heat dissipation device (104) for cooling the electronic component (102), wherein the heat dissipation device (104) comprises: a housing (106) that is attached to the electronic component (102) and absorbs heat from the electronic component (102), wherein the housing (106) has a surface (108) that defines a chamber (110); a first liquid (116) which is contained in the chamber (110) of the housing (106) and receives heat from the housing (106), wherein the first liquid (116) has a first boiling temperature; a first sorption material (120) immersed in the first liquid (116); a second sorption material (122) coated on the surface (108) of the housing (106); and a second liquid (124) that is adsorbed by the first sorption material (120) and / or the second sorption material (122) and has a second boiling point that is higher than the first boiling point of the first liquid (116); wherein the first liquid (116) evaporates to a first vapor (118) when the first liquid (116) reaches the first boiling temperature; wherein the second liquid (124) is desorbed by at least one of the first sorption material (120) and the second sorption material (122) in response to the second liquid (124) reaching a desorption temperature below the second boiling temperature, and wherein the second liquid (124) evaporates to a second vapor (126) in response to the second liquid (124) reaching the second boiling temperature; at least one thermocouple (128) attached to the electronic component (102) and / or the heat dissipation device (104), wherein the at least one thermocouple (128) generates a first temperature signal which is associated with a temperature of the first liquid (116); and a controller (134) which is electrically connected to the at least one thermocouple (128), wherein the controller (134) compares the temperature of the first liquid (116) with a first temperature threshold when the controller (134) receives the first temperature signal from the at least one thermocouple (128), and wherein the controller (134) generates a first warning signal when the controller (134) determines that the temperature of the first liquid (116) is above the first temperature threshold; wherein the controller (134) is electrically coupled to a display device (136) to display an initial warning indicating that the first liquid (116) is approaching the first temperature threshold when the display device (136) receives the first warning signal from the controller (134). [9] The electronic cooling system (100) according to claim 8, wherein the first sorption material (120) and / or the second sorption material (122) are configured to desorb at least a portion of the second liquid (124) into the chamber (110) before the entire first liquid (116) evaporates to the first vapor (126). [10] Electronic cooling system (100) according to claim 8, wherein the first sorption material (120) and / or the second sorption material (122) is configured to desorb at least a portion of the second liquid (124) into the chamber (110) after all of the first liquid (116) has evaporated to the first vapor (118).

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