PROCESSING DEVICE THAT REMOVES A RING-SHAPED REINFORCEMENT PART WITH A PROPOSED FORM FROM A WAFER

Abstract

Processing device (2) which removes an annular reinforcement part (24) with a projection shape from a wafer (4), wherein the annular reinforcement part (24) is formed in the projection shape on a rear surface (4b) corresponding to an outer circumferential excess area (20) which surrounds a component area (18), wherein the processing device (2) comprises: a wafer cassette table (8) on which a wafer cassette (6) in which several wafers (4) are placed; a wafer ejection means (10) that ejects the wafer (4) from the wafer cassette (6) placed on the wafer cassette table (8); a wafer table (12) supporting one side of a front surface (4a) of the wafer (4) ejected by the wafer ejection means (10); a frame accommodation means (66) which accommodates several ring-shaped frames (64) in which an opening part (64a) is formed which accommodates the wafer (4); a frame removal device (68) that removes the frame (64) from the frame support device (66); a frame table (70) which supports the frame (64) which is brought out by the frame ejection means (68); a tape adhesive (98) arranged above the frame table (70) and which adheres a tape (96) to the frame (64); a conveying means (100) for a frame (64') with attached belt (96), which conveys the frame to which the belt (96) is attached to the wafer table (12), positions the opening part (64a) of the frame (64) on the rear surface (4b) of the wafer (4) supported by the wafer table (12) and places a frame (64') with attached belt (96) on the wafer table (12); a tape pressure joining means (102) which performs a pressure joining of the tape (96) of the frame (64') with attached tape (96) to the rear surface (4b) of the wafer (4); a frame unit ejection means (192) which conveys a frame unit (U) away from the wafer table (12) in which the band (96) of the frame (64') with attached band (96) and the rear surface (4b) of the wafer (4) are pressure-connected by the band pressure joining means (102); a reinforcement part removal means (194) that cuts and removes the annular reinforcement part (24) from the wafer (4) of the frame unit (U) ejected by the frame unit ejection means (192); a means for removing an annular unit (196) which removes an annular unit from the reinforcing-part removal means (194) resulting from the removal of the annular reinforcing part (24); and a frame cassette table (200) on which a frame cassette (198) is placed, which accommodates the ringless unit transported by the means for ejecting the ringless unit (194), wherein the tape pressure connecting means (102) comprises an upper chamber (160) arranged above the wafer table (12), a lower chamber (162) in which the wafer table (12) is housed, a lifting and lowering mechanism (164) that raises and lowers the upper chamber (160) and creates a closed state in which the upper chamber (160) is in contact with the lower chamber (162) and an open state in which the upper chamber (160) is separated from the lower chamber (162), a vacuum section that places the upper chamber (160) and the lower chamber (162) into a vacuum state in the closed state, and a section for opening to the atmosphere (168) that opens the upper chamber (160) and the lower chamber (162) to the atmosphere, and, wherein, in a state in which the belt (96) of the frame (64') with attached belt (96) is positioned on the rear surface (4b) of the wafer (4) supported by the wafer table (12), the lifting-lowering mechanism (164) is actuated to maintain the closed state and to create a vacuum state, a pressure connection of the belt (96) of the frame (64') with attached belt (96) to the rear surface (4b) of the wafer (4) is carried out by a pressure roller (174) arranged in the upper chamber (160), and the part for opening to the atmosphere (168) gradually opens the upper chamber (160) and the lower chamber (162) to the atmosphere.

Description

BACKGROUND OF THE INVENTIONField of the invention

[0001] The present invention relates to a processing apparatus that removes an annular reinforcing part having a protruding shape from a wafer, the annular reinforcing part being formed on a rear surface in the predetermined shape corresponding to an outer peripheral excess portion surrounding a device portion. Description of related technology

[0002] A wafer in which a device region, in which multiple devices such as integrated circuits (ICs) and large-scale integration (LSIs) are defined by multiple planned dividing lines that intersect each other, and an outer peripheral excess region surrounding the device region are formed on a front surface, is ground to a desired thickness by grinding a back surface. The wafer is then divided into individual device chips by a dividing device or a laser processing device. The resulting device chips are used for electronic devices such as mobile phones and personal computers.

[0003] The present applicant has proposed the following procedure. A predetermined processing is performed in such a way that an annular reinforcement portion remains on a rear surface corresponding to an outer peripheral excess area to facilitate conveyance of a ground wafer. Subsequently, a dividing band is attached to the rear surface of the wafer, and the wafer is supported by a frame. The annular reinforcement portion is then removed from the wafer (see, for example, Japanese Patent Application Laid-Open No. 2010-62375 A). SUMMARY OF THE INVENTION

[0004] However, there is the following problem: It is difficult to adhere the division band to the back surface of the wafer, where the annular reinforcement portion is formed in a protruding shape on the back surface corresponding to the outer peripheral excess area to bond the wafer to the frame. In addition, it is difficult to cut and remove the annular reinforcement portion from the wafer, and productivity is low.

[0005] Therefore, it is an object of the present invention to provide a processing apparatus with which the work of adhering a division band to the back surface of a wafer in which an annular reinforcing part is formed in a protrusion shape on the back surface corresponding to an outer peripheral excess area to join the wafer to a frame is easy, and with which it is easy to cut the annular reinforcing part and remove it from the wafer.

[0006] According to one aspect of the present invention, there is provided a processing apparatus that removes an annular reinforcing part having a protrusion shape from a wafer, in which the annular reinforcing part is formed in the protrusion shape on a rear surface corresponding to an outer peripheral excess area surrounding a device area.The processing apparatus includes a wafer cassette table on which a wafer cassette in which a plurality of wafers are accommodated is placed, a wafer carrying-out means that carries out the wafer from the wafer cassette placed on the wafer cassette table, a wafer table that supports the front surface side of the wafer carried out by the wafer carrying-out means, a frame accommodating means that accommodates a plurality of annular frames in which an opening part is formed to accommodate the wafer, and a frame carrying-out means that carries the frame out of the frame accommodating means.The processing apparatus also includes a frame table that supports the frame carried out by the frame carrying out means, a tape adhering means that is arranged above the frame table and adheres a tape to the frame, a tape-attached frame conveying means that conveys the frame to which the tape is adhered to the wafer table, positions the opening part of the frame on the rear surface of the wafer carried by the wafer table, and places a tape-attached frame on the wafer table, and a tape pressure-bonding means that performs pressure-bonding of the tape of the tape-attached frame to the rear surface of the wafer.The processing apparatus also includes a frame unit carrying out means that carries out, from the wafer table, a frame unit in which the tape of the frame with the tape attached and the back surface of the wafer are pressure-bonded by the tape pressure-bonding means, a reinforcing member removing means that cuts and removes the annular reinforcing member from the wafer of the frame unit carried out by the frame unit carrying out means, a ringless unit carrying out means that carries out, from the reinforcing member removing means, a ringless unit resulting from the removal of the annular reinforcing member, and a frame cassette table on which a frame cassette is placed that accommodates the ringless unit carried out by the ringless unit carrying out means.The tape pressure bonding means includes an upper chamber disposed above the wafer table, a lower chamber in which the wafer table is housed, a raising-lowering mechanism that raises and lowers the upper chamber and creates a closed state in which the upper chamber is brought into contact with the lower chamber and an open state in which the upper chamber is separated from the lower chamber, a vacuum part that puts the upper chamber and the lower chamber in a vacuum state in the closed state, and an atmosphere opening part that opens the upper chamber and the lower chamber to the atmosphere.In a state where the tape of the tape-attached frame is positioned on the back surface of the wafer carried by the wafer table, the raising-lowering mechanism is operated to maintain the closed state, and to create a vacuum state, pressure-bonding the tape of the tape-attached frame to the back surface of the wafer is carried out by a pressing roller arranged in the upper chamber, and the atmosphere opening part gradually opens the upper chamber and the lower chamber to the atmosphere.

[0007] Preferably, the wafer table comprises an annular support part that supports the outer peripheral excess portion of the wafer and that causes a part on an inner side to be non-contact relative to the outer peripheral excess portion, and a frame support part that is arranged around the outer periphery of the annular support part and that supports the frame.

[0008] According to the processing apparatus of the present invention, it is easy to adhere the division band to the back surface of the wafer, in which the annular reinforcing part in the protrusion shape is formed on the back surface corresponding to the outer peripheral excess area to connect the wafer to the frame. In addition, it is easy to cut the annular reinforcing part and remove it from the wafer, and productivity becomes favorable. Furthermore, in the processing apparatus of the present invention, the atmosphere opening part gradually opens the upper chamber and the lower chamber to the atmosphere. Therefore, the pressure inside the upper chamber and the lower chamber does not change suddenly, and a stress accompanying the pressure change does not excessively act on the wafer.Thus, it is possible to prevent the wafer from being damaged when the upper chamber and the lower chamber are opened to the atmosphere.

[0009] The above and other objects, features and advantages of the present invention, as well as the mode for carrying them into effect, will best become apparent and the invention itself will be best understood by studying the following description and appended claims with reference to the attached drawings which show a preferred embodiment of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a machining apparatus of an embodiment of the present invention; Fig. Figure 2 is a perspective view of a wafer for which processing by the method shown in Fig. 1 shown processing device is executed; Fig. 3 is a perspective view of a wafer cassette table, etc., as shown in Fig. 1 shown; Fig. 4 is a perspective view of a Fig. 1 depicted hand; Fig. 5 is a perspective view of the Fig. 1 frame accommodation means etc.; Fig. 6A is a perspective view of a tape adhesive, etc. in the state in which a Fig. 1 frame table shown is positioned at a lowering position; Fig. 6B is a perspective view of the tape adhesive, etc. in the state in which the Fig. 1 frame table is positioned at a lifting position; Fig. 7 is an exploded perspective view of a Fig. 1 shown band pressure connection means; Fig. 8 is a perspective view of the Fig. 1 shown band pressure connection means; Fig. 9 is a sectional view illustrating the state in which pressing of a tape by a pressing roller is started in a tape press-joining step; Fig. 10 is a sectional view illustrating the state in which the pressing of the tape by the pressing roller in the tape pressing joining step is completed; Fig. 11 is a perspective view of a Fig. 1 illustrated reinforcing member removing means; Fig. 12 is a schematic diagram illustrating the state in which an origin of a gain portion of the wafer is irradiated with a laser beam in a gain portion removing step; Fig. 13 is a perspective view of a first raising / lowering table of the Fig. 1 illustrated reinforcing member removing means; Fig. 14 is a perspective view of a separation part of the Fig. 1 illustrated reinforcing member removing means; Fig. 15 is a schematic diagram illustrating the state in which the reinforcing member is separated from the wafer in the reinforcing member removing step; Fig. 16 is a perspective view of a disposal part of the Fig. 1 illustrated reinforcing member removing means; Fig. 17 is a perspective view of a reversing mechanism of a Fig. 1 means for conveying out a ringless unit; Fig. 18 is a perspective view of a support member for the ringless unit and a pusher of the Fig. 1 means for conveying out a ringless unit; and Fig. 19 is a perspective view illustrating the state in which an accommodating step of a ringless unit is carried out. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0010] A machining apparatus of an embodiment of the present invention will be described in detail below with reference to the drawings.

[0011] Referring to Fig. 1, a processing apparatus, designated as a whole by the numeral 2, comprises a wafer cassette table 8 on which a wafer cassette 6 in which a plurality of wafers are accommodated is placed, a wafer carrying-out means 10 that carries out a wafer from the wafer cassette 6 placed on the wafer cassette table 8, and a wafer table 12 that supports the front surface side of the wafer carried out by the wafer carrying-out means 10.

[0012] In Fig. 2 shows a wafer 4 being processed by the processing apparatus 2. On a front surface 4a of the wafer 4, a component region 18, in which a plurality of components 14, such as ICs and LSIs, are divided in a grid-like manner by planned dividing lines 16, and an outer peripheral excess region 20 surrounding the component region 18 are formed. Fig. In FIG. 2, a boundary 22 between the device region 18 and the outer peripheral excess region 20 is represented by a two-dot chain line for convenience. However, the line representing the boundary 22 does not actually exist. An annular reinforcing part 24 is formed in a protrusion shape in the outer peripheral excess region 20 on the rear surface 4b side of the wafer 4, and the thickness of the outer peripheral excess region 20 is greater than that of the device region 18. Further, a notch 26 representing the crystal orientation is formed on the peripheral edge of the wafer 4.

[0013] As in Fig. As shown in Fig. 3, a plurality of wafers 4 are accommodated in the cassette 6 in the up-down direction at intervals in the state where the front surfaces 4a are facing upward. The wafer cassette table 8 of the present embodiment includes an upper plate 28 on which the cassette 6 is placed, and a support plate 30 that supports the upper plate 28. The upper plate 28 can rise and fall, and a raising and lowering means may be provided that raises and lowers the upper surface 28 and positions it at a desired height.

[0014] The description is made with reference to Fig. 3. The wafer removal means 10 comprises a Y-axis movable element 32 which can move in a Y-axis direction which is Fig. 3 by an arrow Y, and a Y-axis feed means 34 that moves the Y-axis movable member 32 in the Y-axis direction. The Y-axis feed means 34 includes a ball screw 36 coupled to the lower end of the Y-axis movable member 32 and extending in the Y-axis direction, and a motor 38 that rotates the ball screw 36. The Y-axis feed means 34 converts a rotational motion of the motor 38 into a linear motion through the ball screw 36 and transmits the linear motion to the Y-axis movable member 32 to move the Y-axis movable member 32 in the Y-axis direction along a pair of guide rails 40 extending in the Y-axis direction. An X-axis direction that is Fig. 3 is represented by an arrow X, is a direction orthogonal to the Y-axis direction and a Z-axis direction which is in Fig. 3, the up-down direction is orthogonal to the X-axis and Y-axis directions. An XY plane defined by the X-axis and Y-axis directions is essentially horizontal.

[0015] As in Fig. As shown in Fig. 3, the wafer removal means 10 of the present embodiment includes a transfer arm 42 and a hand 44. The hand 44 is disposed at the tip of the transfer arm 42, supports the back surface 4b of the wafer 4 housed in the wafer cassette 6, and reverses the front and back sides of the wafer 4. The transfer arm 42 is disposed above the upper surface of the Y-axis movable member 32 and is driven by a suitable drive source (not shown) such as an air drive source or an electric drive source. This drive source drives the transfer arm 42 and positions the hand 44 to a desired position in each of the X-axis direction, the Y-axis direction, and the Z-axis direction. In addition, the drive source turns the hand 44 upside down.

[0016] With reference to Fig. 4, it is preferable that the hand 44 be a Bernoulli pad on which a negative pressure is created by an air jet and which supports the wafer 4 in a non-contact manner. The hand 44 of the present embodiment has a C-shape as a whole, and a plurality of air ejection ports 46 connected to an air supply source (not shown) are formed in a single surface of the hand 44. A plurality of guide pins 48 are attached to the outer peripheral edge of the hand 44 at intervals in the circumferential direction. Each guide pin 48 is configured to be movable in the radial direction of the hand 44.

[0017] The wafer removal means 10 pushes, as in Fig. 3 and Fig. 4, after positioning the hand 44 on the rear surface 4b side (lower side) of the wafer 4 in the wafer cassette 6 placed on the wafer cassette table 8, compressed air is discharged from the air ejection ports 46 of the hand 44 to generate a negative pressure on a single surface of the hand 44 by the Bernoulli effect, and carries the wafer 4 from the rear surface 4b side in a non-contact manner by the hand 44 under suction. Horizontal movement of the wafer 4 carried by the hand 44 under suction is restricted by the guide pins 48. Then, the wafer carrying out means 10 carries the wafer 4 carried by the hand 44 under suction out of the wafer cassette 6 by moving the Y-axis movable member 32 and the carrying arm 42.

[0018] As in Fig. 4, the wafer carrying-out means 10 of the present embodiment includes a notch detecting means 50 that detects the position of the notch 26 of the wafer 4. It is sufficient if the notch detecting means 50 is configured, for example, to include a light-emitting element 52 and a light-receiving element 54 arranged at a distance from each other in the up-down direction, and a drive source (not shown) that rotates at least one of the guide pins 48 of the hand 44.

[0019] The light-emitting element 52 and the light-receiving element 54 can be suspended from the Y-axis movable member 32 or a conveying path through the interposition of a suitable support (not shown). Furthermore, the wafer 4, which is supported by the hand 44 under suction, rotates due to the rotation of the guide pin 48 when the guide pin 48 rotates by the drive source described above. It is preferable that the outer peripheral surface of the guide pin 48 rotated by the drive source be formed of a suitable synthetic resin to securely transmit the rotation of the guide pin 48 to the wafer 4.

[0020] The notch detection means 50 can detect the position of the notch 26 by rotating the wafer 4 by the drive source via the guide pin 48 in the state where the wafer 4 is supported under suction by the hand 44 and the outer periphery of the wafer 4 is positioned between the light-emitting element 52 and the light-receiving element 54. This makes it possible to adjust the orientation of the wafer 4 to a desired orientation.

[0021] As in Fig. 3, the wafer table 12 is arranged next to the wafer removal means 10. The wafer table 12 of the present embodiment includes an annular support part 56 and a frame support part 58. The annular support part 56 supports the outer peripheral excess portion 20 of the wafer 4 and causes the inner side portion to be non-contact relative to the outer peripheral excess portion 20. The frame support part 58 is arranged around the outer periphery of the annular support part 56 and supports a frame 64 to be described later (see Fig. 5). On the upper surface of the annular support member 56, a plurality of suction holes 60 are formed at intervals in the circumferential direction, and each suction hole 60 is connected to suction means (not shown). The part located on the inner side in the radial direction relative to the annular support member 56 in the wafer table 12 is a circular recess 62 that is hollow downwards.

[0022] When the hand 44 rotates 180° to flip the front and back sides of the wafer 4, and the wafer 4 is placed on the wafer table 12 in the state where the front surface 4a of the wafer 4 is facing downward, the outer peripheral excess portion 20 of the wafer 4 is supported by the annular support member 56, and the component portion 18 of the wafer 4 is disposed in the recess 62. Although the wafer 4 is placed on the wafer table 12 in the state where the front surface 4a on which the components 14 are formed is facing downward, the components 14 do not come into contact with the wafer table 12, and therefore, damage to the components 14 is prevented.Further, the wafer table 12 prevents deviation of the position of the wafer 4 by operating a suction means and generating a suction force for each suction hole 60 to hold the outer peripheral excess portion 20 under suction after the outer peripheral excess portion 20 is supported by the annular support member 56.

[0023] Referring to Fig. 5, the processing apparatus 2 further includes a frame accommodating means 66 that accommodates a plurality of annular frames 64 in which an opening part 64a that accommodates the wafer 4, a frame carrying-out means 68 that carries out the frame 64 from the frame accommodating means 66, and a frame table 70 that supports the frame 64 carried out by the frame carrying-out means 68 are formed.

[0024] As in Fig. 5, the frame housing means 66 of the present embodiment includes a housing 72, a raising / lowering plate 74 arranged to be raised and lowered within the housing 72, and a raising / lowering means (not shown) that raises and lowers the raising / lowering plate 74. A Z-axis guide member 78 extending in the Z-axis direction is provided on the side surface of the housing 72 on the side opposite in the X-axis direction. Fig. 5. The raising / lowering plate 74 is supported by the Z-axis guide member 78 so that it can rise and fall, and the raising / lowering means that raises and lowers the raising / lowering plate 74 is arranged within the Z-axis guide member 78. It is sufficient if the raising / lowering means is configured, for example, to have a ball screw coupled to the raising / lowering plate 74 and extending in the Z-axis direction, and a motor that rotates this ball screw. On the side surface of the housing 72 at the position in the X-axis direction in Fig. A door 76 is arranged on the side near the housing 72, to which a handle 76a is attached. In the frame accommodation means 66, the frames 64 can be accommodated within the housing 72 by grasping the handle 76a and opening the door 76. Furthermore, an opening part 80 is provided at the upper end of the housing 72.

[0025] As in Fig. 5, the frames 64 are housed stacked above the upper surface of the raising / lowering plate 74 within the casing 72. The frame 64 at the uppermost level of the plurality of stacked frames 64 is lifted out from the opening portion 80 of the casing 72 by the frame lifting-out means 68. Further, when the frame 64 is lifted out from the opening portion 80, the frame accommodating means 66 appropriately lifts the raising / lowering plate 74 by the lifting / lowering means and positions the frame 64 at the uppermost level at the position from which this frame 64 can be lifted out by the frame lifting-out means 68.

[0026] The description is made with reference to Fig. 5. The frame delivery means 68 includes an X-axis guide member 82 fixed to a suitable bracket (not shown) and extending in the X-axis direction, an X-axis movable member 84 movably supported in the X-axis direction by the X-axis guide member 82, an X-axis feed means (not shown) that moves the X-axis movable member 84 in the X-axis direction, a Z-axis movable member 86 movably supported in the Z-axis direction by the X-axis movable member 84, and a Z-axis feed means (not shown) that moves the Z-axis movable member 86 in the Z-axis direction.It is sufficient if the X-axis feed means of the frame removal means 68 is configured to include a ball screw coupled to the X-axis movable member 84 and extending in the X-axis direction, and a motor that rotates this ball screw. It is sufficient if the Z-axis feed means is configured to include a ball screw coupled to the Z-axis movable member 86 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0027] The Z-axis movable member 86 of the frame removal means 68 includes a holding portion 88 that holds the frame 64. The holding portion 88 of the present embodiment includes a rectangular substrate 90 and a plurality of suction pads 92 disposed on the bottom surface of the substrate 90. Each suction pad 92 is connected to a suction means (not shown).

[0028] The frame carrying-out means 68 holds the frame 64 under suction at the uppermost level accommodated in the frame accommodating means 66 by the suction pads 92 of the holding part 88, and then moves the X-axis movable member 84 and the Z-axis movable member 86. The frame carrying-out means 68 thereby carries the frame 64 at the uppermost level out of the frame accommodating means 66 with the frame 64 held under suction.

[0029] As in Fig. As shown in Figure 5, the frame table 70 is supported by a Z-axis guide member 94 so that it can rise and fall between a lowering position indicated by solid lines and a lifting position indicated by two-dot chain lines. A suitable drive source (e.g., an air drive source or an electric drive source) is connected to the Z-axis guide member 94, which raises and falls the frame table 70 between the lowering position and the lifting position. The frame 64, which is discharged by the frame discharge means 68, is received in the frame table 70 at the lowering position.

[0030] As in Fig. 1 and Fig. 5, the processing device 2 has a tape adhesive 98 (see Fig. 1), one (see Fig. 5) and a band pressure connection means 102 (see Fig. 1). The tape adhesion means 98 is disposed above the frame table 70 and adheres a tape 96 to the frame 64. The tape-attached frame conveying means 100 conveys the frame 64 to which the tape 96 is adhered (hereinafter often referred to as a "tape-attached frame 64'") to the wafer table 12, positions the opening part 64a of the frame 64 on the rear surface 4b of the wafer 4 carried by the wafer table 12, and places the tape-attached frame 64' on the wafer table 12. The tape pressure-bonding means 102 pressure-bonds the tape 96 of the tape-attached frame 64' to the rear surface 4b of the wafer 4.

[0031] With reference to Fig. 6A and Fig. 6B, the tape adhesive 98 of the present embodiment includes a roll tape support part 104 that supports a roll tape 96R in which the tape 96 is wound before use, a tape receiving part 106 that receives the used tape 96, a tape pull-out part 108 that pulls out the tape 96 from the roll tape 96R, a pressure-connecting part 110 that pressure-connects the pulled-out tape 96 to the frame 64, and a cutting part 112 that cuts the tape 96 projecting from the outer periphery of the frame 64 along the frame 64.

[0032] As in Fig. 6A and Fig. As shown in Figure 6B, the roller belt support member 104 includes a support roller 114 rotatably supported about an axis extending in the X-axis direction by a corresponding bracket (not shown). Supported by the support roller 114 is the roller belt 96R, in which the release paper 116 for protecting an adhesive surface of the belt 96 is attached to the adhesive surface of the belt 96 and wound into a circular cylindrical shape.

[0033] The tape take-up part 106 has a take-up roller 118 which is supported by a corresponding bracket (not shown) for rotation about an axis line extending in the X-axis direction, and a motor (not shown) which rotates the take-up roller 118. As shown in Fig. 6A and Fig. 6B, the tape receiving part 106 receives the used tape 96 in which a circular opening part 120 corresponding to the part adhered to the frame 64 is formed by rotating the take-up roller 118 by the motor.

[0034] The description is made with reference to Fig. 6A and Fig. 6B. The tape pull-out part 108 has a pull-out roller 122 arranged below the support roller 114 of the roller tape support part 104, a motor (not shown) that rotates the pull-out roller 122, and a driven roller 124 that rotates in conjunction with the rotation of the pull-out roller 122. The tape pull-out part 108 pulls the tape 96, which is gripped by the pull-out roller 122 and the driven roller 124, from the roller tape 96R by rotating the driven roller 124 together with the pull-out roller 122 by the motor.

[0035] The release paper 116 is separated from the belt 96 that has passed between the discharge roller 122 and the driven roller 124, and the separated release paper 116 is received by a release paper receiving part 126. The release paper receiving part 126 of the present embodiment includes a released paper receiving roller 128 disposed above the driven roller 124 and a motor (not shown) that rotates the released paper receiving roller 128. Further, the belt 96 from which the release paper 116 has been separated passes through a guide roller 130 disposed at a distance from the discharge roller 122 in the Y-axis direction and is guided to the receiving roller 118.

[0036] The pressure-connecting part 110 includes a pressing roller 132 movably arranged in the Y-axis direction and a Y-axis feed means (not shown) that moves the pressing roller 132 in the Y-axis direction. The Y-axis feed means of the pressure-connecting part 110 can be configured from a suitable drive source (e.g., an air drive source or an electric drive source).

[0037] As in Fig. 6A and Fig. 6B, the cutting part 112 includes a Z-axis guide member 134 fixed to a suitable support (not shown) and extending in the Z-axis direction, a Z-axis movable member 136 supported by the Z-axis guide member 134 for movement in the Z-axis direction, and a Z-axis feed means (not shown) that moves the Z-axis movable member 136 in the Z-axis direction. It is sufficient if the Z-axis feed means of the cutting part 112 is configured to include a ball screw coupled to the Z-axis movable member 136 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0038] The cutting part 112 further includes a motor 138 mounted on the lower surface of the tip of the Z-axis movable member 136, and an arm piece 140 rotated by the motor 138 about an axis extending in the Z-axis direction. First and second depending pieces 142a and 142b are mounted on the lower surface of the arm piece 140 at a distance from each other. A circular cutter 144 is supported by the first depending piece 142a for rotation about an axis orthogonal to the Z-axis direction. A hold-down roller 146 is supported by the second depending piece 142b for rotation about an axis orthogonal to the Z-axis direction.

[0039] The tape adhesive means 98 pulls out the tape 96 not used by the pull-out roller 122 and the driven roller 124 before the frame table 70, which has received the frame 64 from the frame-carrying-out means 68, is lowered from the lowering position (in Fig. 6A) into the lifting position (in Fig. 6B). Then, the frame table 70 is positioned at the lift position so far that the tape 96 can be pressed against the frame 64 by the pressing roller 132 of the pressure-bonding part 110, and the frame 64 is brought into contact with the pressing roller 132 by the tape 96. Then, the pressing roller 132 is rolled in the Y-axis direction while the adhesive surface of the adhesive of the tape 96 is pressed against the frame 64 by the pressing roller 132. Thereby, the pressure-bonding of the tape 96, which has been drawn out from the roller tape 96R by the tape drawing-out part 108, to the frame 64 can be performed.

[0040] After the tape 96 is pressure-bonded to the frame 64, the tape attachment means 98 lowers the Z-axis movable member 136 of the cutting part 112 through the Z-axis feed means to press the cutter 144 against the tape 96 on the frame 64 and hold the frame 64 down from above the tape 96 through the hold-down roller 146. Thereafter, the tape attachment means 98 rotates the arm piece 140 through the motor 138 and causes the cutter 144 and the hold-down roller 146 to move to trace a circle along the frame 64. This allows the tape 96 projecting from the outer periphery of the frame 64 to be cut along the frame 64. Furthermore, since the frame 64 is held down by the hold-down roller 146 from above the belt 96, a deviation of the position of the frame 64 and the belt 96 when cutting the belt 96 is prevented.Then, after the frame table 70 is lowered, the used tape 96 in which the circular opening part 120 corresponding to the part adhered to the frame 64 is formed is received by the tape receiving part 106.

[0041] As in Fig. 5, the belt-attached frame conveying means 100 includes a Y-axis guide member 148 fixed to a suitable bracket (not shown) and extending in the Y-axis direction, a Y-axis movable member 150 movably supported in the Y-axis direction by the Y-axis guide member 148, a Y-axis feed means (not shown) that moves the Y-axis movable member 150 in the Y-axis direction, a Z-axis movable member 152 movably supported in the Z-axis direction by the Y-axis movable member 150, and a Z-axis feed means (not shown) that moves the Z-axis movable member 152 in the Z-axis direction.It is sufficient if the Y-axis feeding means of the conveyor 100 for a belt-attached frame is configured to include a ball screw coupled to the Y-axis movable member 150 and extending in the Y-axis direction, and a motor that rotates this ball screw. It is sufficient if the Z-axis feeding means is configured to include a ball screw coupled to the Z-axis movable member 152 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0042] The Z-axis movable member 152 of the belt-attached frame conveyor 100 includes a holding portion 154 that holds the belt-attached frame 64'. The holding portion 154 of the present embodiment includes a rectangular substrate 156 and a plurality of suction pads 158 disposed on the bottom surface of the substrate 156. Each suction pad 158 is connected to a suction means (not shown).

[0043] The tape-attached frame conveying means 100 holds the upper surface of the tape-attached frame 64' supported by the frame table 70 in the suction state in which the adhesive surface of the tape 96 is directed downward through the suction pads 158 of the holding part 154, and moves the Y-axis movable member 150 and the Z-axis movable member 152. The tape-attached frame conveying means 100 thereby conveys the tape-attached frame 64' held under suction by the holding part 154 from the frame table 70 to the wafer table 12, positions the opening part 64a of the frame 64 on the rear surface 4b of the wafer 4 supported by the wafer table 12, and places the tape-attached frame 64' on the wafer table 12.

[0044] The band pressure connection means 102 is described with reference to Fig. 7 to Fig. 10. As described in Fig. As shown in Figure 7, the tape pressure bonding means 102 includes an upper chamber 160 disposed above the wafer table 12, a lower chamber 162 in which the wafer table 12 is housed, and a raising and lowering mechanism 164 that raises and lowers the upper chamber 160 and creates a closed state in which the upper chamber 160 is brought into contact with the lower chamber 162, and an open state in which the upper chamber 160 is separated from the lower chamber 162. The tape pressure bonding means 102 further includes a vacuum part 166 that places the upper chamber 160 and the lower chamber 162 in a vacuum state when closed, and an atmosphere opening part 168 that opens the upper chamber 160 and the lower chamber 162 to the atmosphere.

[0045] As in Fig. As shown in Figure 7, the upper chamber 160 of the present embodiment includes a circular upper plate 170 and a circular cylindrical sidewall 172 depending from the peripheral edge of the upper plate 170. Attached to the upper surface of the upper plate 170 is the raising-lowering mechanism 164, which may be configured from a suitable actuator such as an air cylinder. In a space defined by the lower surface of the upper plate 170 and the inner peripheral surface of the side wall 172, a pressing roller 174 for pressing the belt 96 of the frame 64' with the belt attached against the rear surface 4b of the wafer 4 carried by the wafer table 12, a support piece 176 rotatably supporting the pressing roller 174, and a Y-axis feed means 178 moving the support piece 176 in the Y-axis direction are arranged.

[0046] The Y-axis feed means 178 includes a ball screw 180 coupled to the support piece 176 and extending in the Y-axis direction, and a motor 182 that rotates the ball screw 180. Furthermore, the Y-axis feed means 178 converts a rotational motion of the motor 182 into a linear motion through the ball screw 180 and transmits the linear motion to the support piece 176 to move the support piece 176 along a pair of guide rails 184 extending in the Y-axis direction.

[0047] A communication port 185 is formed in the side wall 172 of the upper chamber 160, and the above-described atmosphere opening portion 168 is connected to the communication port 185. The atmosphere opening portion 168 includes a flow path 168a extending from the communication port 185, a valve 168b disposed on the flow path 168a, and an orifice 168c disposed on the flow path 168a between the communication port 185 and the valve 168b. It is sufficient if the valve 168b is a well-known valve capable of opening and closing the flow path 168a.

[0048] As in Fig. As shown in Figure 7, the lower chamber 162 has a circular cylindrical side wall 186. The upper part of the side wall 186 is open, and the lower part of the side wall 186 is closed. A connecting opening 188 is formed in the side wall 186. The vacuum part 166, which can be configured by a suitable vacuum pump, is connected to the connecting opening 188 via a flow path 190. A valve 191 is arranged on the flow path 190, which opens and closes the flow path 190, and the valve 191 is arranged between the vacuum part 166 and the connecting opening 188.

[0049] In the state where the tape 96 of the frame 64' with the tape attached is positioned on the rear surface 4b of the wafer 4 carried by the wafer table 12, the tape pressure connecting means 102 lowers the upper chamber 160 through the raising-lowering mechanism 164 and brings, as shown in Fig. 8, the lower end of the side wall 172 of the upper chamber 160 contacts the upper end of the side wall 186 of the lower chamber 162 to close the upper chamber 160 and the lower chamber 162. Additionally, the belt pressure connection means 102 brings the pressing roller 174 into contact with the frame 64' with the belt attached.

[0050] Thereafter, the strip pressure connecting means 102 actuates the vacuum pump forming the vacuum part 166 in a state where the valve 191 arranged on the flow path 190 of the vacuum part 166 is opened and the valve 168b of the part 168 for opening to the atmosphere is closed, to place the interior of the upper chamber 160 and the interior of the lower chamber 162 in a vacuum state. Thereafter, as shown in Fig. 9 and Fig. 10, the tape pressure-bonding means 102 presses the pressing roller 174 in the Y-axis direction through the Y-axis feeding means 178 to thereby perform pressure-bonding of the tape 96 to the rear surface 4b of the wafer 4 and produce a frame unit U.

[0051] When the belt 96 is press-bonded to the back surface 4b of the wafer 4 by the press roller 174, a slight gap is formed between the wafer 4 and the belt 96 at an origin of the annular reinforcing part 24. However, since the press-bonding of the wafer 4 and the belt 96 is performed in the state where the interior of the upper chamber 160 and the interior of the lower chamber 162 are placed in the vacuum state, the pressure of the slight gap between the wafer 4 and the belt 96 is lower than the atmospheric pressure. Therefore, when the opening part 168 is opened to the atmosphere after the belt 96 is press-bonded, the belt 96 is pressed against the wafer 4 by the atmospheric pressure. As a result, the gap between the wafer 4 and the tape 96 at the origin of the reinforcing part 24 disappears, and the tape 96 comes into close contact with the rear surface 4b of the wafer 4 along the origin of the reinforcing part 24.

[0052] In the present embodiment, when the valve 168b of the atmosphere-opening part 168 is opened, the interior of the upper chamber 160 and the interior of the lower chamber 162 are gradually opened to the atmosphere through the opening 168c. Thus, the pressure inside the upper chamber 160 and the interior of the lower chamber 162 does not change suddenly. Therefore, a stress associated with a pressure change does not excessively act on the wafer 4, and damage to the wafer 4, such as the occurrence of a crack at the origin of the annular reinforcing part 24, when the upper chamber 160 and the lower chamber 162 are opened to the atmosphere, is prevented.

[0053] When the upper chamber 160 and the lower chamber 162 are opened, the opening degree of the valve 168b could be gradually changed from the fully closed state to the fully opened state (for example, over the course of about two or three seconds), instead of switching the opening degree of the valve 168b from the fully closed state to the fully opened state all at once. Alternatively, the following process could be repeated: The opening degree of the valve 168b is switched all at once from the fully closed state to the fully opened state, the fully opened state is maintained for a comparatively short time (for example, for 0.5 seconds), and then the valve 168b is returned to the fully closed state.By performing such an operation, even if the opening 168c is not included in the part 168 for opening to the atmosphere, the inside of the upper chamber 160 and the inside of the lower chamber 162 can be gradually opened to the atmosphere, and the wafer 4 can be prevented from being damaged.

[0054] As in Fig. 1 and Fig. 11, the processing device 2 further comprises frame unit carrying-out mechanisms 192, a reinforcement member removing means 194, a ringless unit carrying-out means 196 (see Fig. 1) and a frame cassette table 200 (see Fig. 1). The frame unit removal means 192 removes, from the wafer table 12, the frame unit U in which the tape 96 of the frame 64' with the tape attached and the rear surface 4b of the wafer 4 are pressure-bonded by the tape pressure-bonding means 102. The reinforcing member removal means 194 cuts and removes the annular reinforcing member 24 from the wafer 4 of the frame unit U removed by the frame unit removal means 192. The ringless unit removal means 196 removes, from the reinforcing member removal means 194, the ringless unit resulting from removal of the annular reinforcing member 24. A frame cassette 198 is placed on the frame cassette table 200 and houses the ringless unit removed by the ringless unit removal means 196.

[0055] As in Fig. As shown in Fig. 11, the frame unit carrying-out means 192 of the present embodiment includes a frame unit holding part 202, which includes a wafer holding part 202a that holds the wafer 4, and a frame holding part 202b that holds the frame 64. The frame unit carrying-out means 192 also includes a conveying part 206 that conveys the frame unit holding part 202 to a transition placement table 204.

[0056] The wafer holding part 202a of the frame unit holding part 202 includes a circular substrate 208 and a circular suction-adhering piece 210 attached to the lower surface of the substrate 208. A plurality of suction holes (not shown) are formed in the lower surface of the suction-adhering piece 210, and each suction hole is connected to a suction means (not shown). The frame holding part 202b includes a plurality of (four in the present embodiment) protruding pieces 212 projecting outward in the radial direction from the peripheral edge of the substrate 208 of the wafer holding part 202a, with spaces arranged therebetween in the circumferential direction, and suction pads 214 are attached to the lower surfaces of the protruding pieces 212. Each suction pad 214 is connected to a suction means (not shown).

[0057] The conveying part 206 includes an X-axis guide member 216 fixed to a corresponding bracket (not shown) and extending in the X-axis direction, an X-axis movable member 218 supported by the X-axis guide member 216 for movement in the X-axis direction, and an X-axis feed means (not shown) for moving the X-axis movable member 218 in the X-axis direction.The conveying part 206 further includes a Z-axis movable member 220 movably supported in the Z-axis direction by the X-axis movable member 218, a Z-axis feed means (not shown) that moves the Z-axis movable member 220 in the Z-axis direction, a Y-axis movable member 222 movably supported in the Y-axis direction by the Z-axis movable member 220, and a Y-axis feed means (not shown) that moves the Y-axis movable member 222 in the Y-axis direction. The substrate 208 of the wafer holding part 202a is coupled to the tip of the Y-axis movable member 222. It is sufficient if the X-axis, Y-axis and Z-axis feeding means of the conveying part 206 are each configured to have a ball screw and a motor that rotates the ball screw.

[0058] It is preferable that the frame unit outfeed means 192 include a two-dimensional moving mechanism that two-dimensionally moves the frame unit holding part 202 in the horizontal direction, and an imaging part 224 that images the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding part 202. In the present embodiment, the frame unit holding part 202 moves two-dimensionally in the horizontal direction on the XY plane by the X-axis feeding means and the Y-axis feeding means of the conveying part 206, and the two-dimensional moving mechanism is configured by the conveying part 206. Further, the imaging part 224 of the present embodiment is arranged between the wafer table 12 and the transfer placement table 204, and the outer periphery of the frame unit U held by the frame unit holding part 202 is imaged from the lower side of the wafer 4.

[0059] The frame unit removal means 192 actuates the removal part 206 in the state where the wafer 4 is held from the rear surface 4b side (belt 96 side) by the suction adhesion piece 210 of the wafer holding part 202a and the frame 64 is held under suction by the suction pads 214 of the frame holding part 202b. The frame unit removal means 192 thereby removes the frame unit U held by the frame unit holding part 202 from the wafer table 12.

[0060] Furthermore, the frame unit carrying-out means 192 of the present embodiment measures the coordinates of at least three points on the outer circumference of the wafer 4 by operating the carrying part 206, which constitutes the two-dimensional movement mechanism, and imaging by the imaging part 224 at at least three locations on the outer circumference of the wafer 4 of the frame unit U held by the frame unit holding part 202, and obtains the center coordinates of the wafer 4 based on the measured coordinates of the three points. Then, the frame unit carrying-out means 192 causes the center of the wafer 4 to coincide with the center of the temporary placement table 204 and temporarily places the frame unit U on the temporary placement table 204.

[0061] As in Fig. As shown in Fig. 11, the transition placement table 204 is arranged at a distance from the wafer table 12 in the X-axis direction. The transition placement table 204 of the present embodiment includes an annular support part 226 that supports the outer peripheral excess portion 20 of the wafer 4 of the frame unit U and causes the part on the inside to be non-contact relative to the outer peripheral excess portion 20, and a frame support part 228 that is arranged around the outer periphery of the annular support part 226 and that supports the frame 64.

[0062] The part located on the inner side in the radial direction relative to the annular support part 226 is a circular recess 230 that is hollow downwards. It is preferable that the frame support part 228 of the temporary placement table 204 include a heater (not shown), that the belt 96 of the frame unit U temporarily placed on the temporary placement table 204 is softened by heating the belt 96 by the heater, and that the belt 96 is brought into closer contact with the origin of the annular reinforcement part 24 by atmospheric pressure.

[0063] The machining apparatus 2 of the present embodiment includes a transition placement table conveying part 232 that conveys the transition placement table 204 in the Y-axis direction. The transition placement table conveying part 232 includes a Y-axis guide member 234 extending in the Y-axis direction, a Y-axis movable member 236 movably supported by the Y-axis guide member 234 in the Y-axis direction, and a Y-axis feed means 238 that moves the Y-axis movable member 236 in the Y-axis direction. The transition placement table 204 is fixed to the upper part of the Y-axis movable member 236. The Y-axis feed means 238 includes a ball screw 240 coupled to the Y-axis movable member 236 and extending in the Y-axis direction, and a motor 242 that rotates the ball screw 240.Further, the transition placement table conveying part 232 converts a rotational movement of the motor 242 into a linear movement through the ball screw 240 and transmits the linear movement to the Y-axis movable member 236 to convey the transition placement table 204 together with the Y-axis movable member 236 in the Y-axis direction.

[0064] As in Fig. 1 and Fig. 11, the reinforcing member removing means 194 includes a laser beam irradiation means 244 that irradiates the origin of the annular reinforcing member 24 formed on the outer circumference of the wafer 4 with a laser beam to form a cutting groove, a first raising / lowering table 246 (see Fig. 1) which holds and lifts the frame unit U temporarily placed on the transition placement table 204 and which moves in the X-axis direction to position the frame unit U to the laser beam irradiation means 244, and a separating part 248 which separates the annular reinforcing part 24 from the cutting groove.

[0065] As in Fig. As shown in Fig. 11, the laser beam irradiation means 244 includes a casing 250 disposed adjacent to the transfer placement table 204 in the X-axis direction, an oscillator (not shown) housed in the casing 250 and oscillating a laser beam, and a light collector 252 that collects the laser beam oscillated by the oscillator and irradiates the laser beam onto the origin of the annular reinforcing member 24 formed on the outer periphery of the wafer 4. The laser beam irradiation means 244 further includes a suction nozzle 254 that sucks dirt particles generated when the wafer 4 is irradiated with the laser beam, and a suction means (not shown) connected to the suction nozzle 254.

[0066] The light collector 252 extends upward from the upper surface of the housing 250, with an inclination toward the side of the suction nozzle 254. This reduces the falling of dirt particles generated during laser beam irradiation onto the light collector 252. Furthermore, the suction nozzle 254 extends upward from the upper surface of the housing 250, with an inclination toward the side of the light collector 252.

[0067] As in Fig. As shown in Figure 12, the laser beam irradiation means 244 irradiates the origin of the annular reinforcing member 24 formed on the outer periphery of the wafer 4 with a laser beam LB while rotating the frame unit U supported by the first elevating / lowering table 246, to form an annular cutting groove 256 along the origin of the reinforcing member 24 by ablation processing. Furthermore, the laser beam irradiation means 244 sucks dirt particles generated by the ablation processing with the suction nozzle 254.

[0068] As in Fig. 1, the first raising / lowering table 246 is arranged above the transition placement table 204 so as to be movable in the X-axis direction and in the Z-axis direction. Referring to Fig. 13, the first raising / lowering table 246 includes an X-axis guide member 258 fixed to a suitable bracket (not shown) and extending in the X-axis direction, an X-axis movable member 260 supported by the X-axis guide member 258 for movement in the X-axis direction, an X-axis feed means (not shown) for movement of the X-axis movable member 260 in the X-axis direction, a Z-axis movable member 262 supported by the X-axis movable member 260 for movement in the Z-axis direction, and a Z-axis feed means (not shown) for movement of the Z-axis movable member 262 in the Z-axis direction. It is sufficient if the X-axis and Z-axis feeding means of the first raising / lowering table 246 are each configured to have a ball screw and a motor that rotates the ball screw.

[0069] A support shaft 264 extending downward is rotatably supported by the lower surface of the tip of the Z-axis movable member 262. A motor 266 is attached to the upper surface of the tip of the Z-axis movable member 262, rotating the support shaft 264 around an axis extending in the Z-axis direction. A circular suction attachment piece 268 is attached to the lower end of the support shaft 264. In the lower surface of the suction attachment piece 268, a plurality of suction holes (not shown) are formed on a circumference corresponding to the size of the frame 64 at intervals in the circumferential direction. Each suction hole is connected to a suction means.

[0070] The first raising / lowering table 246 holds, under suction by the suction-adhering piece 268, the part of the frame 64 of the frame unit U in which the belt 96 has been heated by the heater of the frame support part 228 of the transition placement table 204 and in which the belt 96 is in close contact with the origin of the annular reinforcing part 24. Thereafter, the first raising / lowering table 246 moves the Z-axis movable member 262 and the X-axis movable member 260 to raise the frame unit U held under suction by the suction-adhering piece 268, and move the frame unit U in the X-axis direction, positioning it toward the laser beam irradiation means 244.If the frame 64 is formed of a magnetizable material, an electromagnet (not shown) could be attached to the lower surface of the suction-adhering piece 268, and the suction-adhering piece 268 could cause suction-adhering of the frame 64 by a magnetic force.

[0071] Further, when the wafer 4 is irradiated with the laser beam LB by the laser beam irradiation means 244, the first elevating / lowering table 246 operates the motor 266 to rotate the frame unit U held under suction by the suction-adhering piece 268. Furthermore, the first elevating / lowering table 246 moves the frame unit U, in which the cutting groove 256 is formed at the origin of the reinforcing part 24, in the X-axis direction and the Z-axis direction, and temporarily places it on the temporary placement table 204.

[0072] As in Fig. 1, the separation part 248 is arranged at a distance from the first raising / lowering table 246 in the Y-axis direction in the movable range of the transition placement table 204 in the Y-axis direction. Referring to Fig. 14 and Fig. 16, the separation part 248 has ultraviolet irradiation parts 270 (see Fig. 14) which irradiate the tape 96 corresponding to the cutting groove 256 with ultraviolet light to reduce the adhesive force of the tape 96, and a second lifting / lowering table 272 (see Fig. 14) which holds the inside of the wafer 4 under suction, with the annular reinforcing part 24 exposed from the outer circumference, and which supports the frame 64. The separating part 248 further comprises a separating device 274 (see Fig. 14) acting on the outer circumference of the annular reinforcing part 24 and separating the annular reinforcing part 24, and a disposal part 276 (see Fig. 16) through which the separated annular reinforcing part 24 is disposed of.

[0073] As in Fig. As shown in Figure 14, the separation part 248 of the present embodiment includes a Z-axis guide member 278 fixed to a suitable bracket (not shown) and extending in the Z-axis direction, a Z-axis movable member 280 supported by the Z-axis guide member 278 for movement in the Z-axis direction, and a Z-axis feed means (not shown) that moves the Z-axis movable member 280 in the Z-axis direction. It is sufficient for the Z-axis feed means to be configured to include a ball screw coupled to the Z-axis movable member 280 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0074] A support piece 282 is supported by the lower surface of the tip of the Z-axis movable member 280, and a support shaft 286 is rotatably supported. The above-described second raising / lowering table 272 is coupled to the support shaft 286. A motor 284 is attached to the upper surface of the tip of the Z-axis movable member 280, which rotates the second raising / lowering table 272 together with the support shaft 286. A pair of the above-described ultraviolet irradiation parts 270 are attached to the support piece 282 of the present embodiment at a distance in the Y-axis direction.

[0075] The second raising / lowering table 272 is circular, and the diameter of the second raising / lowering table 272 is slightly smaller than that of the device region 18 (part inside the annular reinforcing member 24) of the wafer 4. A plurality of suction holes (not shown) are formed in the lower surface of the second raising / lowering table 272, and each suction hole is connected to a suction means.

[0076] Furthermore, the above-described separator 274 is attached to the support piece 282. The separator 274 includes a pair of movable pieces 288 movably disposed on the lower surface of the support piece 282 at a distance in the longitudinal direction of the support piece 282, and a pair of feed means 290 that move the pair of movable pieces 288. Each of the pair of feed means 290 may be configured from a suitable actuator, such as an air cylinder or an electric cylinder.

[0077] The separating device 274 includes a pair of pinch rollers 292a and 292b supported by each movable piece 288 at a pitch in the up-down direction, and a Z-axis feed means 294 that moves the upper pinch rollers 292a in the Z-axis direction. The Z-axis feed means 294 may be configured from a suitable actuator such as an air cylinder or an electric cylinder. The pinch rollers 292a and 292b are supported by the movable piece 288 for rotation about an axis extending in the Y-axis direction. A pressing roller 298 is attached to the upper pinch roller 292a through a support shaft 296.

[0078] With reference to Fig. 16, the disposal part 276 comprises a belt conveyor 300 which conveys the separated annular reinforcement part 24, as well as a dust box 302 in which the annular reinforcement part 24 conveyed by the belt conveyor 300 is accommodated. The belt conveyor 300 is moved by a suitable actuator (not shown) to a collection position (in Fig. 16 by solid lines), at which the belt conveyor 300 extends substantially horizontally, and at a standby position (in Fig. 16 by two-dot chain lines) where the belt conveyor 300 extends substantially vertically. On the side surface of the dust box 302, on the near side in the X-axis direction, Fig. 16, a door 304 is arranged, to which a handle 304a is attached. A crushing device (not shown) is mounted inside the dust box 302, which crushes the collected annular reinforcement member 24. From the dust box 302, the crushed waste of the collected annular reinforcement member 24, which is housed in the dust box 302, can be removed by grasping the handle 304a and opening the door 304.

[0079] When the transition placement table 204, on which the frame unit U in which the cutting groove 256 is formed at the origin of the reinforcement part 24 is temporarily positioned under the separation part 248 by the transition placement table conveying part 232, stops as shown in Fig. 15, the separating part 248 suctions the rear surface 4b side of the wafer 4 of the frame unit U by the second elevating / lowering table 272 and clamps the frame 64 by the clamping rollers 292a and 292b of the separator 274. Then, the separating part 248 irradiates ultraviolet light from the pair of ultraviolet irradiation parts 270 and reduces the adhesive force of the tape 96 adhered to the annular reinforcing part 24. In addition, the separating part 248 rotates the frame unit U together with the support shaft 286 and the second elevating / lowering table 272 relative to the separator 274 by the motor 284 while pressing down the annular reinforcing part 24 by the pressing rollers 298. The separation part 248 thereby separates the annular reinforcement part 24 from the frame unit U. The separated reinforcement part 24 is conveyed by the belt conveyor 300 to the dust box 302 and collected there.When separating the reinforcing part 24, the separating device 274 could be rotated relative to the frame unit U.

[0080] As in Fig. 1, the ringless unit removal means 196 is arranged adjacent to the reinforcement member removal means 194. Referring to Fig. 17 and Fig. 18, the means 196 for conveying out the ringless unit in the present embodiment comprises a reversing mechanism 308 (see Fig. 17), a support part 310 for the ringless unit (see Fig. 18) and a pressing part 312 (see Fig. 18). The reversing mechanism 308 includes a frame holding part 306 facing the ringless unit supported by the second raising / lowering table 272 and supporting the frame 64, moves toward the frame cassette table 200, and reverses the frame holding part 306. The ringless unit supporting part 310 supports the ringless unit reversed by the reversing mechanism 308, with the front surface 4a of the wafer 4 facing upward. The pressing part 312 causes the ringless unit supported by the ringless unit supporting part 310 to enter the frame cassette 198 placed on the frame cassette table 200 and accommodates the ringless unit therein.

[0081] As in Fig. 17, the reversing mechanism 308 includes a Y-axis guide member 314 extending in the Y-axis direction, a Y-axis movable member 316 movably supported in the Y-axis direction by the Y-axis guide member 314, a Y-axis feed means (not shown) that moves the Y-axis movable member 316 in the Y-axis direction, an arm 318 movably supported in the Z-axis direction by the Y-axis movable member 316, and a Z-axis feed means (not shown) that moves the arm 318 in the Z-axis direction. It is sufficient if each of the Y-axis and Z-axis feeding means of the reversing mechanism 308 is configured to include a ball screw and a motor that rotates the ball screw.

[0082] The frame holding part 306 described above is supported by the arm 318 in such a manner that it can be vertically inverted. Additionally, a motor 320 is attached to the arm 318 to vertically invert the frame holding part 306. The frame holding part 306 of the present embodiment includes a substrate 324 rotatably supported by the arm 318 via a pair of rotary shafts 322, and a plurality of suction pads 326 attached to a single surface of the substrate 324. Each suction pad 326 is connected to a suction means (not shown). Furthermore, a rotary shaft 322 is coupled to the motor 320.

[0083] In the state where the suction pads 326 are directed upward, the reversing mechanism 308 holds the lower surface of the frame 64 of a ringless unit U' supported by the second raising / lowering table 272 under suction through the suction pads 326 and picks up the ringless unit U' from the second raising / lowering table 272. Further, the reversing mechanism 308 reverses the frame holding part 306 by the motor 320 to orient the front surface 4a of the wafer 4 upward, and then moves the ringless unit U' held by the frame holding part 306 to the frame cassette table 200 by moving the Y-axis movable member 316.

[0084] As in Fig. As shown in Figure 18, the ringless unit support portion 310 of the present embodiment includes a pair of support plates 328 movably supported in the X-axis direction by a suitable bracket (not shown), and a distance adjustment means (not shown) that adjusts the distance between the pair of support plates 328 in the X-axis direction. The distance adjustment means may be configured from a suitable actuator such as an air cylinder or an electric cylinder.

[0085] A heater (not shown) is attached to the pair of support plates 328 supporting the ringless unit U'. In the state where the distance between the pair of support plates 328 is reduced, the pair of support plates 328 heats the belt 96 of the ringless unit U' by the heater, thereby eliminating slack and wrinkles of the belt 96 caused by the removal of the reinforcing member 24.

[0086] The description is made with reference to Fig. 18. The pressing part 312 of the present embodiment includes a Y-axis guide member 330 extending in the Y-axis direction, a Y-axis movable member 332 movably supported by the Y-axis guide member 330 in the Y-axis direction, and a Y-axis feed means (not shown) that moves the Y-axis movable member 332 in the Y-axis direction. The Y-axis movable member 332 includes a base part 334 supported by the Y-axis guide member 330, a support column 336 extending upward from the upper surface of the base part 334, and a pressing piece 338 fixed to the upper end of the support column 336.It is sufficient if the Y-axis feeding means of the pressing part 312 is configured to have a ball screw coupled to the Y-axis movable member 332 and extending in the Y-axis direction, and a motor that rotates this ball screw.

[0087] As in Fig. 19, the ringless unit support part 310 widens the distance between the pair of support plates 328 by the distance adjustment means before receiving the ringless unit U', and then receives the ringless unit U' held by the suction pads 326. Then, the pressing part 312 moves the Y-axis movable member 332 in the Y-axis direction by the Y-axis feeding means, thereby causing the ringless unit U' supported by the ringless unit support part 310 to enter the frame cassette 198 placed on the frame cassette table 200 by the pressing piece 338 to receive the ringless unit U' therein.

[0088] In the Fig. 1 and Fig. In the frame cassette 198 shown in Fig. 19, a plurality of ringless units U' are accommodated at intervals in the up-down direction in the state in which the front surfaces 4a of the wafers 4 are directed upward. As shown in Fig. 18 and Fig. As shown in Figure 19, the frame cassette table 200 includes a placement part 340 on which the frame cassette 198 is placed, and a raising / lowering part 342 that raises and lowers the placement part 340 and positions it at a desired height. It is sufficient if the raising / lowering part 342 is configured to include a ball screw coupled to the placement part 340 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0089] Next, a processing method will be described in which, using the processing apparatus 2 described above, the division band 96 is adhered to the rear surface 4b of the wafer 4, the annular reinforcing part 24 is formed into a protrusion-like shape on the rear surface 4b corresponding to the outer peripheral excess portion 20 to connect the wafer 4 to the frame 64, and the annular reinforcing part 24 is cut to be removed from the wafer 4.

[0090] In the present embodiment, first, as shown in Fig. 1 and Fig. 3, a wafer cassette placing step is performed in which the wafer cassette 6 in which a plurality of wafers 4 are accommodated is placed on the wafer cassette table 8. In the cassette 6, a plurality of wafers 4 are accommodated at intervals in the up-down direction in the state where the front surfaces 4a are facing upward.

[0091] Furthermore, as in Fig. 1 and Fig. 5, a frame accommodating step is performed in which a plurality of annular frames 64 are accommodated, in which the opening part 64a for receiving the wafer 4 is formed in the frame accommodating means 66. The frame accommodating step may be performed before the wafer cassette placing step, or it may be performed after the wafer cassette placing step.

[0092] In the frame accommodation step, after the raising / lowering plate 74 of the frame accommodation means 66 is lowered to a desired position, the handle 76a is grasped and the door 76 is opened, and the plurality of frames 64 are stacked over the upper surface of the raising / lowering plate 74 to be accommodated. Further, the height of the raising / lowering plate 74 is appropriately adjusted, and the frame 64 at the uppermost level is positioned at a position from which this frame 64 can be carried out by the frame carrying-out means 68.

[0093] After the wafer cassette placing step and the frame accommodating step are performed, a wafer carrying out step is performed in which the wafer 4 is carried out from the wafer cassette 6 placed on the wafer cassette table 8.

[0094] Referring to Fig. 3, in the wafer-carrying-out step, first, the Y-axis feed means 34 of the wafer-carrying means 10 is actuated, and the Y-axis movable member 32 is positioned near the wafer cassette table 8. Thereafter, the conveying arm 42 is driven, and the hand 44, with the air ejection ports 46 facing upward, is positioned toward the rear surface 4b (lower side) of the wafer 4 in the wafer cassette 6. When the hand 44 is positioned toward the rear surface 4b of the wafer 4, a gap exists between the rear surface 4b of the wafer 4 and the hand 44, and each guide pin 48 is positioned outward in the radial direction.

[0095] Next, compressed air is discharged from the air discharge ports 46 of the hand 44 to create a negative pressure on a single surface side of the hand 44 by the Bernoulli effect, and the wafer 4 is non-contact suction-carried from the rear surface 4b side by the hand 44. After that, each guide pin 48 is moved inward in the radial direction, and horizontal movement of the wafer 4, which is suction-carried by the hand 44, is restricted by the guide pins 48. Then, the Y-axis movable member 32 and the conveying arm 42 of the wafer-carrying means 10 are moved, and the wafer 4, which is suction-carried by the hand 44, is conveyed out of the wafer cassette 6.

[0096] It is advantageous to perform a notch detection step in which the position of the notch 26 of the wafer 4 is detected after the wafer removal step has been performed. In the notch detection step, as shown in Fig. 4, the outer periphery of the wafer 4, which is held by the hand 44 under suction, is positioned between the light-emitting element 52 and the light-receiving element 54 of the notch detection means 50. Next, by rotating the wafer 4 by the drive source through the guide pin 48, the position of the notch 26 of the wafer 4 is detected. This makes it possible to adjust the orientation of the wafer 4 to a desired orientation.

[0097] After the notch detecting step is performed, a wafer carrying step of carrying the front surface 4a side of the wafer 4 by the wafer carrying-out means 10 through the wafer table 12 is performed.

[0098] Referring to Fig. 3, in the wafer carrying step, first, the hand 44 of the wafer carrying means 10 is turned upside down to direct the front surface 4a of the wafer 4 downward. Thereafter, the Y-axis movable member 32 and the carrying arm 42 of the wafer carrying means 10 are moved, and the outer peripheral excess portion 20 of the front surface 4a of the wafer 4, which is carried by the hand 44 under suction, is brought into contact with the annular supporting part 56 of the wafer table 12. At this time, the component portion 18 of the front surface 4a of the wafer 4 is disposed in the recess 62 of the wafer table 12. Therefore, the components 14 do not come into contact with the wafer table 12, and damage to the components 14 is prevented.

[0099] Next, the outer peripheral excess area 20 of the front surface 4a of the wafer 4 is held under suction by operating the suction means of the wafer table 12 and generating a suction force for each suction hole 60. After that, the wafer 4 is released from being held under suction by the hand 44, and the hand 44 is separated from the wafer table 12. In this way, the wafer 4 is transferred from the wafer-out means 10 to the wafer table 12. Since the wafer 4 transferred to the wafer table 12 is held under suction by each suction hole 60, the position of the wafer 4 does not deviate.

[0100] Further, after the wafer cassette placing step and the frame accommodating step have been performed, a frame accommodating step of carrying out the frame 64 from the frame accommodating means 66 is performed simultaneously with the wafer carrying out step and the wafer carrying step.

[0101] Referring to Fig. 5, in the frame-carrying-out step, first, the X-axis movable member 84 and the Z-axis movable member 86 of the frame-carrying-out means 68 are moved, and the suction pads 92 of the holding part 88 are brought into contact with the upper surface of the frame 64 at the top level, which is housed in the frame housing means 66. Next, the frame 64 is held at the top level by the suction pads 92 under suction by actuating the suction means of the frame-carrying-out means 68 and generating a suction force for the suction pads 92. Then, the X-axis movable member 84 and the Z-axis movable member 86 of the frame carrying-out means 68 are moved, and the frame 64 held at the uppermost level by the suction pads 92 of the holding part 88 is carried out from the frame accommodating means 66.

[0102] After the frame carrying out step is performed, a frame carrying step of carrying the frame 64 carried out by the frame carrying out means 68 by the frame table 70 is performed.

[0103] The description is made with reference to Fig. 5. In the frame carrying step, first, the X-axis movable member 84 and the Z-axis movable member 86 of the frame removal means 68 are moved, and the frame 64, which is held under suction by the suction pads 92, is brought into contact with the upper surface of the frame table 70. At this time, the frame table 70 is positioned in advance at the lowering position (in Fig. 5 (position shown by solid lines). Thereafter, the suction force of the suction pads 92 of the frame-out conveying means 68 is deactivated to place the frame 64 on the frame table 70. Then, the X-axis movable member 84 and the Z-axis movable member 86 of the frame-out conveying means 68 are moved, and the holding part 88 is separated from the upper side of the frame table 70.

[0104] After the frame supporting step is performed, a tape adhering step of adhering the tape 96 to the frame 64 is performed.

[0105] With reference to Fig. 6A and Fig. 6B is in the tape adhesion step first, before the frame table 70 is lowered from the lowering position (in Fig. 6A) to the lifting position (in Fig. 6B), allowing the belt 96 to be attached to the frame 64, the belt 96 is pulled out from the roller belt 96R, and the belt 96 from which the discharge paper 116 has been separated is positioned above the frame table 70. The adhesive surface of the belt 96 arranged above the frame table 70 faces downward.

[0106] Next, the frame table 70 is raised so that the tape 96 can be pressed against the frame 64 from the upper side by the pressing roller 132 of the pressure-bonding part 110 of the tape adhesive 98. Then, the pressing roller 132 is rolled in the Y-axis direction while the adhesive surface of the tape 96 is pressed against the frame 64 by the pressing roller 132. The tape 96 pulled out from the roller tape 96R by the tape pulling-out part 108 can thereby be pressure-bonded to the frame 64.

[0107] Thereafter, the cutter 144 and the hold-down roller 146 of the cutting part 112 of the tape adhesive 98 are lowered to press the cutter 144 against the tape 96 on the frame 64 and adhere the frame 64 by the hold-down roller 146 from above the tape 96. Next, the arm piece 140 is rotated by the motor 138, and the cutter 144 and the hold-down roller 146 are moved to draw a circle along the frame 64. This allows the tape 96 protruding from the outer periphery of the frame 64 to be cut along the frame 64. Furthermore, since the frame 64 is held down by the hold-down roller 146 from above the tape 96, deviation in the positions of the frame 64 and the tape 96 is prevented when the tape 96 is cut. The used tape 96, in which the circular opening part 120 is formed, is received by the tape receiving part 106.

[0108] After the tape adhering step is performed, a tape-attached frame conveying step is performed in which the frame 64 to which the tape 96 is adhered is conveyed to the wafer table 12, and the opening part 64a of the frame 64 is positioned on the rear surface 4b of the wafer 4 carried by the wafer table 12 to position the tape-attached frame 64' on the wafer table 12.

[0109] In the belt-attached frame conveying step, first, the frame table 70 is moved from the lifting position to the lowering position. Thereafter, the Y-axis movable member 150 and the Z-axis movable member 152 of the belt-attached frame conveying means 100 (see Fig. 5) and the suction pads 158 of the holding part 154 of the conveyor 100 for a frame with attached tape are brought into contact with the upper surface of the frame 64' with attached tape (see Fig. 7) which is supported by the frame table 70 in the state in which the adhesive surface of the belt 96 is directed downward.

[0110] Next, the upper surface of the tape-attached frame 64' is held under suction by the suction pads 158 by actuating the suction means of the tape-attached frame conveying means 100 and generating a suction force for the suction pads 158. Thereafter, the Y-axis movable member 150 and the Z-axis movable member 152 of the tape-attached frame conveying means 100 are moved, and the tape-attached frame 64' held under suction by the suction pads 158 is conveyed away from the frame table 70.

[0111] Next, the tape-attached frame 64' held under suction by the suction pads 158 of the tape-attached frame 64' conveying means 100 is conveyed to the wafer table 12. Then, as shown in Fig. 7, the opening portion 64a of the frame 64 is positioned on the rear surface 4b of the wafer 4 supported by the wafer table 12, and the tape-attached frame 64' is brought into contact with the frame support portion 58 of the wafer table 12. At this time, the adhesive surface of the tape 96 of the tape-attached frame 64' faces downward, and the rear surface 4b of the wafer 4 faces upward and faces the adhesive surface of the tape 96.

[0112] Thereafter, the suction force of the suction pads 158 of the belt-attached frame conveyor 100 is deactivated to place the belt-attached frame 64' on the frame support part 58 of the wafer table 12. Then, the Y-axis movable member 150 and the Z-axis movable member 152 of the belt-attached frame conveyor 100 are moved, and the holding part 154 is separated from the upper side of the wafer table 12.

[0113] After the tape-attached frame conveying step is performed, a tape pressure-bonding step of performing bonding of the tape 96 of the tape-attached frame 64' to the back surface 4b of the wafer 4 under pressure is performed.

[0114] With reference to Fig. 7 to Fig. 10, in the band pressure joining step, first, the upper chamber 160 is lowered by the raising-lowering mechanism 164 of the band pressure joining means 102 and, as shown in Fig. As shown in Figure 8, the lower end of the side wall 172 of the upper chamber 160 is brought into contact with the upper end of the side wall 186 of the lower chamber 162. The upper chamber 160 and the lower chamber 162 are thereby closed. In addition, the pressing roller 174 is brought into contact with the frame 64' with the attached belt. Thereafter, as shown in Fig. 9, the upper end of the annular reinforcing part 24 of the wafer 4 is adhered to the adhesive surface of the tape 96 of the frame 64' with the tape attached.

[0115] Next, the vacuum part 166 of the band pressure connecting means 102 is operated in the state in which the valve 191 arranged on the flow path 190 of the vacuum part 166 is opened and the valve 168b of the part 168 for opening to the atmosphere is closed, and the interior of the upper chamber 160 and the interior of the lower chamber 162 are placed in a vacuum state. Thereafter, as shown in Fig. 9 and Fig. 10, pressure-bonding of the tape 96 to the rear surface 4b of the wafer 4 is performed by rolling the pressure roller 174 of the tape pressure-bonding means 102 in the Y-axis direction. This allows the frame unit U in which the rear surface 4b of the wafer 4 and the tape 96 are pressure-bonded to the wafer 4. Next, the valve 168b of the atmosphere-opening part 168 is opened, and the interior of the upper chamber 160 and the interior of the lower chamber 162 are gradually opened to the atmosphere through the opening 168c, so that the tape 96 is brought into close contact with the rear surface 4b of the wafer 4 along the origin of the annular reinforcing part 24 by the atmospheric pressure. Then, the upper chamber 160 is lifted by the raising-lowering mechanism 164.

[0116] The atmosphere opening part 168 of the present embodiment gradually opens the interior of the upper chamber 160 and the interior of the lower chamber 162 to the atmosphere. Therefore, the pressure inside the upper chamber 160 and the interior of the lower chamber 162 does not change suddenly, and stress associated with a pressure change does not excessively act on the wafer 4. Thus, it is possible to prevent damage to the wafer 4 when the upper chamber 160 and the lower chamber 162 are opened to the atmosphere.

[0117] During the tape pressure-bonding step, the suction force of the wafer 4 by the wafer table 12 is lost because the interior of the upper chamber 160 and the interior of the lower chamber 162 are placed in a vacuum state. However, when the upper chamber 160 and the lower chamber 162 are placed in the closed state, the upper end of the annular reinforcement part 24 of the wafer 4 adheres to the adhesive surface of the tape 96 of the tape-attached frame 64'. Thus, the position of the wafer 4 does not deviate during the tape pressure-bonding step.

[0118] After the tape pressure-bonding step is performed, a frame unit carrying-out step of carrying away the frame unit U in which the tape 96 of the tape-attached frame 64' and the back surface 4b of the wafer 4 are pressure-bonded from the wafer table 12 is performed.

[0119] Referring to Fig. 5, in the frame unit carrying-out step, first, the carrying part 206 of the frame unit carrying-out means 192 is actuated, and the lower surface of the suction-adhering piece 210 of the wafer holding part 202a of the frame unit holding part 202 is brought into contact with the tape 96 on the rear surface 4b side of the wafer 4. In addition, the suction pads 214 of the frame holding part 202b are brought into contact with the frame 64.

[0120] Thereafter, a suction force is generated by the suction adhesion piece 210 of the wafer holding part 202a and the suction pads 214 of the frame holding part 202b, and the wafer 4 is held under suction by the suction adhesion piece 210 of the wafer holding part 202a from the rear surface 4b (belt 96 side). In addition, the frame 64 is held under suction by the suction pads 214 of the frame holding part 202b. Then, the wafer 4 is released from being held under suction by the wafer table 12. Then, the conveying part 206 is actuated, and the frame unit U held by the frame unit holding part 202 is conveyed away from the wafer table 12.

[0121] After the frame unit carrying out step is performed, a temporary placement step is performed in which the center of the wafer 4 is made to coincide with the center of the temporary placement table 204 and the frame unit U is temporarily placed on the temporary placement table 204.

[0122] Referring to Fig. 11, in the transition placement step, first, the frame unit U held by the frame unit holding part 202 is positioned above the imaging part 224. Thereafter, the conveying part 206, which constitutes the two-dimensional movement mechanism of the frame unit carrying-out means 192, is actuated, and at least three locations on the outer circumference of the wafer 4 of the frame unit U held by the frame unit holding part 202 are imaged by the imaging part 224. This measures the coordinates of at least three points on the outer circumference of the wafer 4. Next, the center coordinates of the wafer 4 are obtained based on the measured coordinates of the three points.

[0123] Thereafter, the conveying part 206 is actuated, the center of the wafer 4 is positioned at the center of the annular support part 226 of the transition placement table 204, and the outer peripheral excess portion 20 of the front surface 4a of the wafer 4 is brought into contact with the upper surface of the annular support part 226 of the transition placement table 204. In addition, the lower surface of the frame 64 is brought into contact with the upper surface of the frame support part 228 of the transition placement table 204. At this time, the front surface 4a of the wafer 4 is directed downward. However, since the component region 18 is arranged in the recess 230 of the transition placement table 204, the components 14 do not come into contact with the transition placement table 204, and damage to the components 14 is prevented.

[0124] Next, the wafer 4 is released from the suction holding of the wafer holding part 202a, and the frame 64 is released from the suction holding of the frame holding part 202b, to transfer the frame unit U from the frame unit carrying-out means 192 to the temporary placement table 204. Thereafter, the heater of the frame support part 228 is actuated to heat the belt 96 of the frame unit U temporarily placed on the temporary placement table 204. This softens the belt 96 and brings it into close contact with the origin of the annular reinforcement part 24 of the wafer 4.

[0125] After the transition placement step is performed, a reinforcing member removing step is performed in which the annular reinforcing member 24 is cut off and removed from the wafer 4 of the frame unit U carried out by the frame unit carrying out means 192.

[0126] Referring to Fig. 1, Fig. 11 and Fig. 13, in the reinforcement member removal step, first, the X-axis movable member 260 and the Z-axis movable member 262 of the first raising / lowering table 246 of the reinforcement member removal means 194 are moved, and the lower surface of the suction adhesion piece 268 is brought into contact with the upper surface of the frame 64 of the frame unit U temporarily placed on the temporary placement table 204. Next, a suction force is generated for each suction hole of the suction adhesion piece 268 of the first raising / lowering table 246, and the part of the frame 64 of the frame unit U is held under suction.

[0127] Thereafter, the X-axis movable member 260 and the Z-axis movable member 262 of the first raising / lowering table 246 are actuated and, as shown in Fig. As shown in Fig. 12, the frame unit U, held under suction by the suction adhesive piece 268, is positioned above the laser beam irradiation means 244. Next, the focal point of the laser beam LB is positioned at the origin of the annular reinforcing part 24 of the wafer 4 of the frame unit U.

[0128] Next, the origin of the annular reinforcement portion 24 of the wafer 4 is irradiated with the laser beam LB while the suction attachment piece 268 and the frame unit U are rotated by the motor 266 of the first elevating / lowering table 246. This can perform ablation processing for the origin of the annular reinforcement portion 24 of the wafer 4 and form the annular cutting groove 256. Further, when the wafer 4 is irradiated with the laser beam LB, the suction means of the laser beam irradiation means 244 is actuated to generate a suction force for the suction nozzle 254, and the debris generated by the ablation processing is sucked into the suction nozzle 254.

[0129] Next, the X-axis movable member 260 and the Z-axis movable member 262 of the first raising / lowering table 246 are moved, and the outer peripheral excess portion 20 of the front surface 4a of the wafer 4 of the frame unit U held under suction by the suction-adhering piece 268 is brought into contact with the upper surface of the annular support member 226 of the transitional placement table 204. In addition, the lower surface of the frame 64 is brought into contact with the upper surface of the frame support member 228 of the transitional placement table 204. Thereafter, the suction force of the suction-adhering piece 268 of the first raising / lowering table 246 is deactivated to transfer the frame unit U from the first raising / lowering table 246 to the transitional placement table 204.

[0130] Next, the transition placement table 204 having received the frame unit U is positioned by the transition placement table conveying part 232 under the separation part 248 of the reinforcement part removing means 194 (see Fig. 11). At this time, the belt conveyor 300 of the disposal part 276 is positioned in the standby position. After that, the second elevating / lowering table 272 of the separation part 248 is lowered, and the lower surface of the second elevating / lowering table 272 is brought into contact with the belt 96 of the rear surface 4b part of the wafer 4. Next, a suction force is generated on the lower surface of the second elevating / lowering table 272, and the rear surface 4b side of the wafer 4 of the frame unit U is held under suction by the second elevating / lowering table 272.

[0131] Thereafter, the second raising / lowering table 272, which holds the wafer 4 of the frame unit U under suction, is raised to separate the frame unit U from the transition placement table 204. In addition, the transition placement table 204 is moved to the lower side of the first raising / lowering table 246. Next, as shown in Fig. As shown in Figure 15, the pair of feed means 290 and the Z-axis feed means 294 of the separator 274 are actuated, and the frame 64 is clamped in the up-down direction by the upper and lower pinch rollers 292a and 292b. Furthermore, the belt conveyor 300 of the disposal section 276 is moved from the standby position to the collection position.

[0132] Thereafter, ultraviolet light irradiation is performed by the pair of ultraviolet irradiation parts 270 to reduce the adhesive force of the tape 96 adhering to the annular reinforcing member 24. In addition, while the annular reinforcing member 24 is pressed down by the pressing rollers 298, the frame unit U, together with the support shaft 286 and the second raising / lowering table 272, is rotated relative to the separator 274 by the motor 284. This allows the annular reinforcing member 24 to be separated from the frame unit U. The reinforcing member 24 dropped from the frame unit U is conveyed to the dust box 302 by the tape conveying device 300 and is collected. When the reinforcing member 24 is separated, the separator 274 may be rotated relative to the frame unit U.

[0133] After the reinforcing member removing step is performed, a ringless unit carrying out step is performed in which the ring-shaped unit U' resulting from the removal of the ring-shaped reinforcing member 24 from the reinforcing member removing means 194 is carried out.

[0134] In the ringless unit removal step, first, the belt conveyor 300 of the disposal part 276 of the reinforcement part removing means 194 is moved from the collection position to the standby position. Next, the frame holding part 306 of the reversing mechanism 308 (see Fig. 17) of the ringless unit carrying out means 196 is positioned under the ringless unit U' held by the second raising / lowering table 272 under suction.

[0135] Thereafter, the arm 318 is lifted in the state where the suction pads 326 of the frame holding part 306 are directed upward, and the suction pads 326 of the frame holding part 306 are brought into contact with the lower surface side of the frame 64 of the ringless unit U' in the state where the ringless unit U' is supported by the second raising / lowering table 272 and the front surface 4a of the wafer 4 is directed downward.

[0136] Next, suction force is generated for the suction pads 326 of the frame holding part 306, and the frame 64 of the ringless unit U' is held under suction by the suction pads 326. Thereafter, the suction of the ringless unit U' is released under suction by the second raising / lowering table 272. Thus, the ringless unit U' is transferred from the second raising / lowering table 272 of the reinforcement member removing means 194 to the frame holding part 306 of the ringless unit carrying-out means 196.

[0137] After the ringless unit carrying out step is performed, an accommodating step of the ringless unit U' carried out by the ringless unit carrying out means 196 is performed.

[0138] In the ringless unit accommodation step, first, the reversing mechanism 308 of the ringless unit discharge means 196 is turned upside down, and the ringless unit U' held by the frame holding part 306 under suction is turned upside down. Thus, the ringless unit U' is placed under the frame holding part 306, and the front surface 4a of the wafer 4 is directed upward.

[0139] Next, the Y-axis movable member 316 and the arm 318 of the reversing mechanism 308 are moved, and the ringless unit U' is brought into contact with the upper surfaces of the pair of support plates 328 of the ringless unit support part 310. At this time, the distance between the pair of support plates 328 is reduced by the distance adjusting means, and the pair of support plates 328 are in close contact with each other. Thereafter, the suction holding of the ringless unit U' by the frame holding part 306 is released to place the ringless unit U' on the pair of support plates 328. Next, slack and wrinkles of the belt 96 caused due to the removal of the reinforcing member 24 are eliminated by operating the heater attached to each support plate 328 and heating the belt 96 of the ringless unit U'.Then, the ringless unit U' is held under suction and lifted again by the frame holding part 306.

[0140] Next, after the distance between the pair of support plates 328 has been increased by the distance adjusting means, the ringless unit U' is placed on the upper surfaces of the support plates 328. Then, as shown in Fig. 19, the ringless unit U' supported by the ringless unit support member 310 is pressed by the pressing piece 338 of the pressing member 312, and the ringless unit U' is caused to enter the frame cassette 198 placed on the frame cassette table 200 and is housed therein.

[0141] The configuration of the embodiment is as described above. In the processing apparatus 2 of the present embodiment, labor is simple to adhere the dividing band 96 to the rear surface 4b of the wafer 4, in which the annular reinforcing part 24 is formed in a protrusion shape on the rear surface 4b corresponding to the outer peripheral excess portion 20, to integrate the wafer 4 with the frame 64. In addition, it is easy to cut off the annular reinforcing part 24 and remove it from the wafer 4, and productivity becomes favorable.

[0142] Furthermore, in the processing apparatus 2 of the present embodiment, the atmosphere opening part 168 gradually opens the interior of the upper chamber 160 and the interior of the lower chamber 162 to the atmosphere. Therefore, the pressure inside the upper chamber 160 and the interior of the lower chamber 162 does not change suddenly, and stress associated with a pressure change does not excessively act on the wafer 4. Thus, it is possible to prevent damage to the wafer 4 when the upper chamber 160 and the lower chamber 162 are opened to the atmosphere.

Claims

[1] A processing apparatus (2) for removing an annular reinforcing part (24) having a protrusion shape from a wafer (4), in which the annular reinforcing part (24) is formed in the protrusion shape on a rear surface (4b) corresponding to an outer peripheral excess region (20) surrounding a device region (18), the processing apparatus (2) comprising: a wafer cassette table (8) on which a wafer cassette (6) in which a plurality of wafers (4) are accommodated is placed; a wafer removal means (10) that removes the wafer (4) from the wafer cassette (6) placed on the wafer cassette table (8); a wafer table (12) supporting one side of a front surface (4a) of the wafer (4) conveyed out by the wafer conveying means (10); a frame accommodating means (66) accommodating a plurality of annular frames (64) in which an opening part (64a) accommodating the wafer (4) is formed; a frame removal means (68) for removing the frame (64) from the frame accommodation means (66); a frame table (70) supporting the frame (64) conveyed out by the frame conveying means (68); a tape adhesive (98) disposed above the frame table (70) and adhering a tape (96) to the frame (64); a conveying means (100) for a frame (64') with attached tape (96) that conveys the frame to which the tape (96) is adhered to the wafer table (12), positions the opening part (64a) of the frame (64) on the rear surface (4b) of the wafer (4) carried by the wafer table (12), and places a frame (64') with attached tape (96) on the wafer table (12); a tape pressure-bonding means (102) that performs pressure-bonding of the tape (96) of the frame (64') with the tape (96) attached to the rear surface (4b) of the wafer (4); a frame unit removal means (192) for removing from the wafer table (12) a frame unit (U) in which the tape (96) of the frame (64') with the tape (96) attached and the rear surface (4b) of the wafer (4) are pressure-connected by the tape pressure-connecting means (102); a reinforcing member removing means (194) that cuts and removes the annular reinforcing member (24) from the wafer (4) of the frame unit (U) carried out by the frame unit carrying out means (192); a ringless unit removal means (196) for removing from the reinforcement member removal means (194) a ringless unit resulting from the removal of the annular reinforcement member (24); and a frame cassette table (200) on which a frame cassette (198) is placed, which accommodates the ringless unit conveyed out by the means for conveying out the ringless unit (194), wherein the tape pressure bonding means (102) comprises an upper chamber (160) arranged above the wafer table (12), a lower chamber (162) in which the wafer table (12) is accommodated, a raising-lowering mechanism (164) which raises and lowers the upper chamber (160) and creates a closed state in which the upper chamber (160) is brought into contact with the lower chamber (162) and an open state in which the upper chamber (160) is separated from the lower chamber (162), a vacuum part which puts the upper chamber (160) and the lower chamber (162) into a vacuum state in the closed state, and an atmosphere opening part (168) which opens the upper chamber (160) and the lower chamber (162) to the atmosphere, and, wherein, in a state in which the belt (96) of the belt-attached frame (64') is positioned on the rear surface (4b) of the wafer (4) carried by the wafer table (12), the raising-lowering mechanism (164) is operated to maintain the closed state and to create a vacuum state, pressure-bonding the belt (96) of the belt-attached frame (64') to the rear surface (4b) of the wafer (4) is carried out by a pressing roller (174) arranged in the upper chamber (160), and the atmosphere opening part (168) gradually opens the upper chamber (160) and the lower chamber (162) to the atmosphere. [2] The processing apparatus (2) according to claim 1, wherein the wafer table (12) includes an annular support part (56) that supports the outer peripheral excess portion (20) of the wafer (4) and that causes a part on an inner side to be non-contact relative to the outer peripheral excess portion (20), and a frame support part (58) that is arranged around an outer periphery of the annular support part (56) and that supports the frame (64).

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