Band holder for attaching a band to a ring frame and a wafer

Abstract

Band attachment (1) which features: a frame table (477) for holding a lower surface of a ring frame (94) which in itself has a defined opening; a wafer table (478) for holding a lower surface of a wafer (90) in the opening in the ring frame (94); a frame feeding mechanism (30) for feeding a ring frame (94) to the frame table (477); a wafer feeding mechanism (5) for feeding a wafer (90) to the wafer table (478); a tape fastening mechanism (47) for attaching a separating tape (93) to a ring frame (94) and a wafer (90) and integrally connecting the ring frame (94) and the wafer (90) together to convert them into a frame set (99); a frame cassette stage (131, 132) for placing a frame cassette (61, 618) on it, which is capable of storing ring frames (94); a robot (2) having a frame holder (21) for holding a ring frame (94) and being able to remove a ring frame (94) from the frame cassette (61, 618) placed on the frame cassette stage (131, 132) or to store the frame set (99) in the frame cassette (61, 618) placed on the frame cassette stage (131, 132); and a control unit (17), where the controller (17) executes: a control process for controlling the frame holder (21) of the robot (2) to hold a ring frame (94) and to remove it from the frame cassette (61, 618) on the frame cassette stage (131, 132), a control operation to control the frame feed mechanism (30) to receive the ring frame (94) held by the frame holder (21) of the robot (2), a control operation to control the frame holder (21) of the robot (2) to receive the frame set (99) held by the frame feed mechanism, and a control process for controlling the frame holder (21) of the robot (2) in order to store the frame set (99) held by the frame holder (21) of the robot (2) in the frame cassette (61, 618) on the frame cassette stage (131, 132).

Description

BACKGROUND OF THE INVENTION AREA OF THE INVENTION

[0001] The present invention relates to a tape attacher for attaching a tape to a ring frame and a wafer. DESCRIPTION OF THE RELATED STATE OF THE ART

[0002] A tape applicator for attaching a separating tape to a ring frame and a wafer, as disclosed in patent application JP 2019 - 110 189 A, uses a frame feeding mechanism to hold the top surface of the ring frame under suction, to hold the top surface of one of the topmost ring frames stacked in a frame storage area under suction, and to feed the ring frame to a frame table (see patent applications JP 2015 - 82 588 A and JP 2019 - 140 217 A). SUMMARY OF THE INVENTION

[0003] Each time the stacked ring frames are used up, the operator refills the frame storage with ring frames. However, the refilling process is a strain on the operator.

[0004] It is therefore an object of the present invention to provide a tape applicator that is free from a refilling process of ring frames by the operator.

[0005] In accordance with one aspect of the present invention, a tape feeder is provided comprising a frame table for holding a lower surface of a ring frame with a defined opening therein, a wafer table for holding a lower surface of a wafer in the opening in the ring frame, a frame feeding mechanism for feeding a ring frame to the frame table, a wafer feeding mechanism for feeding a wafer to the wafer table, a tape fastening mechanism for attaching a separating tape to a ring frame and a wafer and integrally connecting the ring frame and the wafer to each other in order to convert them into a frame set, a frame cassette stage for placing a frame cassette on it which is capable of storing ring frames, and a robot with a frame holder for holding a ring frame thereon and capable of removing a ring frame from the frame cassette which is placed on the frame cassette stage.or to store the frame set in the frame cassette, which is placed on the frame cassette stage, and includes a control system. In the case of the tape feeder, the control system performs a control operation to control the robot's frame holder to hold and remove a ring frame from the frame cassette on the frame cassette stage, a control operation to control the frame feeder mechanism to receive the ring frame held by the robot's frame holder, a control operation to control the robot's frame holder to receive the frame set held by the frame feeder mechanism, and a control operation to control the robot's frame holder to store the frame set held by the robot's frame holder in the frame cassette on the frame cassette stage.

[0006] In accordance with a further aspect of the present invention, a tape feeder is provided comprising a frame table for holding a lower surface of a ring frame with a defined opening therein, a wafer table for holding a lower surface of a wafer in the opening in the ring frame, a frame feeding mechanism for feeding a ring frame to the frame table, a wafer feeding mechanism for feeding a wafer to the wafer table, a tape fastening mechanism for attaching a separating tape to a ring frame and a wafer and integrally connecting the ring frame and the wafer to convert them into a frame set, a first frame cassette stage for placing a frame cassette on it which is capable of storing ring frames, a second frame cassette stage which is not the first frame cassette stage, and a robot which has a frame holder for holding a ring frame thereon and is capable ofto remove a ring frame from the frame cassette placed on the first frame cassette stage or to store the frame set in the frame cassette placed on the second frame cassette stage, and includes a control system. In the case of the tape applicator, the control system performs a control operation to control the robot's frame holder to hold and remove a ring frame from the frame cassette on the first frame cassette stage, a control operation to control the frame feeder mechanism to receive the ring frame held by the robot's frame holder, a control operation to control the robot's frame holder to receive the frame set held by the frame feeder mechanism, and a control operation to control the robot's frame holder to store the frame set held by the robot's frame holder in the frame cassette on the second frame cassette stage.

[0007] Preferably, the tape feeder further includes a wafer cassette platform for placing a wafer cassette capable of storing wafers, and the robot has a wafer holder in the tape feeder for holding a wafer, and the control system performs a control operation to control the robot's wafer holder to hold a wafer stored in the wafer cassette on the wafer cassette platform, and to remove the wafer from the wafer cassette, and a control operation to control the wafer feeder mechanism to receive the wafer held by the robot's wafer holder and feed the wafer to the wafer table.

[0008] The tape applicator in accordance with the aspect of the present invention comprises the frame cassette stage for placing a frame cassette on it, which is capable of storing ring frames, wherein the robot has a frame holder for holding a ring frame thereon and is capable of removing a ring frame from the frame cassette placed on the frame cassette stage or of storing a set of frames in the frame cassette placed on the frame cassette stage, and the control system.In the tape feeder, the control system performs a control operation to control the robot's frame holder to hold and remove a ring frame from the frame cassette on the frame cassette platform, a control operation to control the frame feeder mechanism to receive the ring frame held by the robot's frame holder, a control operation to control the robot's frame holder to receive the set of frames held by the frame feeder mechanism, and a control operation to control the robot's frame holder to store the set of frames held by the robot's frame holder in the frame cassette on the frame cassette platform. Accordingly, the tape feeder does not require the use of a frame storage system as used in the prior art, and it eliminates the need for the operator to replenish a frame storage system with ring frames.It is possible to store a frame set, including a separating belt, in the frame cassette, which is supplied with ring frames, and to feed, i.e., unload and receive, the frame cassette from the belt feeder using an automated guided vehicle (AGV) or an overhead hoist transfer mechanism (OHT). Consequently, it is not necessary for the operator to receive frame sets.

[0009] The tape feeder, in accordance with the other aspect of the present invention, comprises a first frame cassette platform for placing a frame cassette capable of storing ring frames, and a second frame cassette platform, which is not the first frame cassette platform. In the tape feeder, the controller performs a control operation to control the robot's frame holder in order to store the frame set, held by the robot's frame holder, in the frame cassette on the second frame cassette platform. It is therefore possible to store a frame set, including a separator tape, in an empty frame cassette on the second frame cassette platform and to feed, i.e., unload and receive, the frame cassette from the tape feeder using an AGV or OHT mechanism. Consequently, it is not necessary for the operator to receive frame sets.

[0010] In a case where the tape feeder further includes the wafer cassette stage for placing a wafer cassette capable of storing wafers, the robot has a wafer holder for holding a wafer, and the controller performs a control operation to control the robot's wafer holder to hold a wafer stored in the wafer cassette on the wafer cassette stage and to remove the wafer from the wafer cassette, and a control operation to control the wafer feeder mechanism to receive the wafer held by the robot's wafer holder and to feed the wafer to the wafer table, it is possible to produce a frictionless frame set comprising a wafer and a ring frame.

[0011] The above and other problems, features and advantages of the present invention, as well as the manner of its implementation, will best become clearer by studying the following description and attached claims, with reference to the attached drawings, which show a preferred embodiment of the invention, and the invention itself will best be understood thereby. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a perspective view illustrating, by means of an example, a wafer with a protective band, a ring frame and a separating band attached to it; Fig. Figure 2 is a perspective view illustrating, by means of an example, a belt attachment in accordance with an embodiment of the present invention in its entirety, which is positioned side by side and connected to a grinding device; Fig. 3 is a top view that illustrates the tape attachment in its entirety using an example; Fig. 4 is a perspective view that illustrates a frame set reversal using an example; Fig. Figure 5 is a perspective view illustrating a wafer feeding mechanism using an example; Fig. Figure 6 is a perspective view that illustrates a frame cassette using an example; Fig. Figure 7 is a perspective view illustrating a wafer cassette using an example; Fig. Figure 8 is a perspective view illustrating a cassette opening and closing mechanism and a wafer cassette stage using an example; Fig. Figure 9 is a perspective view of the cassette opening and closing mechanism from the rear; and Fig. Figure 10 is a perspective view that illustrates a robot using an example. DETAILED EXPLANATION OF THE PREFERRED FORM OF EXECUTION

[0012] A preferred embodiment of the present invention is described below with reference to the accompanying drawings. The present embodiment is described in relation to a three-dimensional coordinate system comprising X, Y, and Z axes extending along an X-axis direction, a Y-axis direction, and a Z-axis direction, respectively. The X-axis directions extend horizontally and include the +X and -X directions, and the Y-axis directions extend horizontally perpendicular to the X-axis directions and include the +Y and -Y directions. The Z-axis directions extend vertically perpendicular to both the X-axis and Y-axis directions and include the +Z and -Z directions.

[0013] As in Fig. Figure 1 illustrates a wafer 90 used in the present embodiment, a semiconductor wafer having a circular outline and made of a base material such as silicon. The wafer 90 has an end face 903 with a grid of regions delimited by several intersecting projected dividing lines 901, each region containing a number of components 900. A protective band 95 is attached to the end face 903 over the components 900 to protect the end face 903, for example, when the wafer 90 is ground.

[0014] The wafer 90 can alternatively be made from gallium arsenide, sapphire, ceramic, resin, gallium nitride, silicon carbide or similar materials, and can be free of components 900.

[0015] As in Fig. Figure 1 illustrates a separating band 93, which is also attached to the wafer 90, shaped as a circular band which has a larger diameter than the wafer 90 and a base layer made of polyethylene terephthalate, resin (PET resin) or the like, with an adhesive layer arranged on the base layer.

[0016] By using a tape applicator 1 in accordance with the present embodiment, which is described in Fig. 2 is illustrated and described later, an outer circumferential section of the adhesive layer of the separating tape 93, which is in Fig. The wafer 90 is attached, with its upper side facing upwards, to a rear side (i.e., a lower surface) of a ring frame 94, which has a defined circular opening to close the circular opening. A rear side 904 of the wafer 90 is attached to the adhesive layer of the separating strip 93, which is exposed in the opening in the ring frame 94. The center of the wafer 90 and the center of the opening in the ring frame 94 are substantially aligned. The wafer 90 is supported by the ring frame 94. The operator can handle the wafer 90 by grasping the ring frame 94 or by holding the ring frame 94 under suction. In other words, the wafer 90, the ring frame 94, and the separating strip 93 together form a frame set 99 that can be handled as a single unit.

[0017] As in Fig. As illustrated in Figure 2, the tape feeder 1 is connected, in accordance with the present embodiment, to a grinding device 19, which is positioned, for example, side by side. The wafer 90, which has been ground to a desired thickness and thinned by the grinding device 19, is received in a wafer cassette 62 and fed to the tape feeder 1. Thereafter, or after the thinned wafer 90 has been placed in a Fig. 2 illustrated transfer cassette 18 is taken up and received by the tape applicator 1, a separating tape 93 is attached by the tape applicator 1 to the wafer 90 and a ring frame 94, forming a frame set 99, and the protective tape 95 is, as in Fig. Figure 1 illustrates, taken from the end face 903 of wafer 90.

[0018] The transfer cassette 18, for example, is an open cassette that has several trays for storing wafers 90 on it respectively.

[0019] For example, the grinding device 19 and the belt feeder are positioned side by side or connected to each other in a cleanroom 1 with a predetermined distance between them along the X-axis directions. Passageways for the operator to move along these are provided, for example, to the front (in the -Y direction) and to the rear (in the +Y direction) of the grinding device 19 and the belt feeder 1.

[0020] The grinding device 19, which is known from the prior art, is a device for grinding the wafer 90, which is held under suction on a clamping table, with rotating grinding stones. The in Fig. 2 Illustrated grinding device 19 has an integrated intra-grinding device robot 190 which includes a movable arm which has a holding plate for holding the wafer 90 under suction.

[0021] On a front side of the grinding device 19, which is oriented in the -Y direction, a grinding device wafer cassette platform 199 is arranged for placing a pre-grinding wafer cassette 6211 on it. This platform holds several wafers 90 on individual shelves, each wafer having end faces 903 to which protective bands 95 are attached, and each wafer having back faces 904 to be ground. A wafer cassette 62, which holds ground wafers 90, is also arranged. The intra-grinding device robot 190 feeds the wafers 90 individually from the pre-grinding wafer cassette 6211 on the grinding device wafer cassette platform 199 to the clamping table in the grinding device 19 and also feeds a wafer 90, whose back face 904 has been ground, into the wafer cassette 62 on the grinding device wafer cassette platform 199.Alternatively, the intra-grinding device robot 190 feeds wafers 90, whose back sides 904 have been ground, individually to one of the trays of the transfer cassette 18, which is arranged between the grinding device 19 and the tape feeder 1.

[0022] For example, in the cleanroom, an OHT mechanism is arranged above the grinding device 19 and the belt feeder 1. The wafer cassette 62, which holds several ground wafers 90 on their respective trays, is guided from the grinding device wafer cassette platform 199 to a wafer cassette platform 133, which, as in Fig. Figure 2 illustrates how the OHT mechanism is connected to the tape attacher 1.

[0023] As in the Fig. 2 and Fig. As illustrated in Figure 3, a second frame cassette stage 132, a first frame cassette stage 131, and the wafer cassette stage 133 are arranged on a front side facing the -Y direction of a device base 10 of the tape feeder 1, the longitudinal directions of which are represented by the Y-axis directions. The second frame cassette stage 132, the first frame cassette stage 131, and the wafer cassette stage 133 are arranged sequentially in the order described from the +X-direction side to the -X-direction side. As shown in Fig. As illustrated in Figure 3, a frame cassette 618, which holds the frame sets 99 of several wafers 90 with protective strips 95 removed from their end faces 903 on its respective shelves, is placed on the second frame cassette platform 132. A frame cassette 61, which holds several ring frames 94 to be used on its respective shelves, is placed on the first frame cassette platform 131. A wafer cassette 62, which holds several wafers 90 on its respective shelves, which have been thinned to a desired thickness by the grinding device 19, which has ground their back faces 904, is placed, for example, on the wafer cassette platform 133.

[0024] As in Fig. As illustrated in Figure 3, the tape feeder 1 includes a frame table 477 for holding the lower surface of a ring frame 94, which has a defined opening; a wafer table 478 for holding the protective tape 95 on the lower surface of a wafer 90 in the opening in the ring frame 94; a frame feeder 30 for feeding a ring frame 94 to the frame table 477; a wafer feeder 5 for feeding a wafer 90 to the wafer table 478; a tape fastening mechanism 47 for fastening a separating tape 93 to a ring frame 94 and a wafer 90 to make them an integrated frame set 99; the second frame cassette stage 132 for placing a frame cassette 618 on it, which is capable of receiving ring frames 94, i.e., frame sets 99; and the first frame cassette stage 131 for placing a frame cassette on it. 61, which is capable of storing usable ring frames 94,a robot 2 with a frame holder 21 for holding a ring frame 94 and capable of removing a ring frame 94 from the frame cassette 61 on the first frame cassette stage 131 or of storing a frame set 99 in the frame cassette 618 on the second frame cassette stage 132, and a control unit 17 including a central processing unit (CPU) for controlling the components of the tape feeder 1, a storage medium, such as a memory, etc.

[0025] The tape fastening mechanism 47 is arranged on a rear section of the device base 10 of the tape applicator 1, extending in the +Y direction. The tape fastening mechanism 47 includes, for example, a tape fastening table 470 for holding a wafer 90 and a ring frame 94 under suction. The tape fastening table 470 is movable back and forth in the Y-axis directions by a ball screw mechanism 473. In particular, the tape fastening table 470 is linearly movable back and forth in the Y-axis directions along a path of motion defined by a pair of guide rails 4782.The movement path is positioned under a roll roller 472 for unwinding a non-illustrated woven-shaped surface material to which pre-cut cutting strips 93 are attached, from a band roller 935, a peeling plate 475 for peeling cutting strips 93 from the woven-shaped surface material and a fastening roller 474 which is rotatable about an axis of rotation extending in the X-axis directions.

[0026] The tape mounting table 470 includes the frame table 477 for holding the lower surface of a ring frame 94, which, as described above, has a circular opening defined in itself, and the wafer table 478 for holding the lower surface of a wafer 90 in the circular opening in the ring frame 94.

[0027] The frame table 477 and the wafer table 478 are integrally movable back and forth along the Y-axis directions. The frame table 477 surrounds the wafer table 478. Both the frame table 477 and the wafer table 478 have a flat holding surface made of a porous material or similar material, which can hold an object, i.e., a ring frame 94 or a wafer 90, under suction forces generated by a suction source (not illustrated), such as a vacuum-generating device, which is in fluid contact with the holding surface. The frame table 477 has a support surface that supports the lower surface of the ring frame 94 with several suction cups on the support surface. The suction cups hold the ring frame 94 under suction, and the support surface supports the lower surface of the ring frame 94.

[0028] While the peeling plate 475 peels a separating strip 93 from the fabric-like sheet material, which is peeled from the tape roll 935 by the peeling roller 472, the fastening roller 474 attaches the separating strip 93 to the wafer 90 and the ring frame 94, which are held on the tape fastening table 470, which moves below the fastening roller 474 in one of the Y-axis directions.

[0029] In the Fig. In the illustrated example 3, the belt roller 935, the puller roller 472, the puller plate 475 and the fastening roller 474 are arranged consecutively from the +Y direction side to the -Y direction side. However, the belt roller 935, the puller roller 472, the puller plate 475 and the fastening roller 474 can also be arranged consecutively from the -Y direction side to the +Y direction side.

[0030] The frame feeding mechanism 30 is arranged above the path of movement along which the belt fastening table 470 can be moved.

[0031] The frame feeding mechanism 30 includes, for example, a feeding plate 300. The feeding plate 300 comprises a base 301, which is designed as a circular plate, several, for example four, suction cup supports 302, which extend radially outwards in a horizontal direction from the outer circumferential edge of the base 301, and several, for example four, suction cups 303, each of which is arranged on the lower surface of the respective lower end of the suction cup support 302 to attract the ring frame 94 under suction force. The suction cups 303 are held in fluid contact with a suction source (not illustrated), such as a vacuum-generating device, which generates attractive suction forces.

[0032] The base 301 has an upper surface attached to the distal end of a swivel arm 305 that extends horizontally. The proximal end of the swivel arm 305 is connected to a pivoting mechanism 306, which includes an electric motor, a pivot axis, etc., for rotating the swivel arm 305 through 360° in a horizontal plane. The swivel arm 305 can also be moved vertically along the Z-axis by an actuator or similar device. The frame feeding mechanism 30 can guide a frame set 99 from the belt mounting table 470 to a peeling table 436 of a protective belt peeling mechanism 43, which will be described later.

[0033] The peeling table 436 of the protective tape peeling mechanism 43, which is in Fig. As illustrated in Figure 3, a frame set 99 can, for example, be held under suction. The peeling table 436 is arranged below a peeling element 431, which peels a protective strip 95 from a wafer 90 when moved along one of the Y-axis directions by a peeling element movement mechanism 435, such as an electrically driven slider or similar device, with the peeling element 431 grasping a peeling strip (not illustrated) attached to the protective strip 95. Alternatively, the peeling element 431 can include a peeling clamp for peeling the protective strip 95 from the end face 903 of the wafer 90 by directly gripping the protective strip 95.

[0034] The peel-off tape can, for example, be a heat-sealable tape that develops an adhesive effect when heated, but it is not limited to this.

[0035] For example, the tape 436 is linearly movable in the Y-axis directions along a motion path defined by a pair of guide rails 437 by a drive power generated by a ball screw mechanism 432.

[0036] A frame set turner 46 is arranged above the movement path along which the peeling table 436 can be moved.

[0037] As in the Fig. 3 and Fig. As illustrated in Figure 4, the frame set turner 46 includes, for example, a turning plate 460, which has a base 461 shaped as a rectangular plate and several suction cups 463, each arranged at the four corners of the lower surface of the base 461 for attracting a ring frame 94 under suction. The peeling table 436 can be positioned directly below the turning plate 460.

[0038] The frame-set turner 46 further includes a turntable lifting / lowering mechanism 467 for raising and lowering the turntable 460 along the Z-axis directions, a turntable motor 465 connected to the upper surface of the turntable 460, and a shaft 464 rotatable about its central axis extending along the Y-axis directions, having one end connected to the turntable motor 465 and another end supported on a lifting and lowering block 4673. The suction cups 463 are held in fluid contact with a suction source (not illustrated) that generates attractive suction forces.When the reversing motor 465 is activated, it rotates itself relative to the shaft 464 by a predetermined angle, which rotates the base 461 to a position where a frame set 99, held by the four suction cups 463, is facing downwards, and to a position where the frame set 99, held by the four suction cups 463, is facing upwards. A reversing plate column 469 is erected on the device base 10 in the -Y direction behind the reversing pad 460. The reversing plate lifting / lowering mechanism 467 is arranged on the front face of the reversing plate column 469, which points in the +Y direction.

[0039] The shaft 464 can be rotated by a rotary cylinder instead of the rotary motor 465.

[0040] The reversing motor 465 can be arranged on the lifting and lowering block 4673, and the reversing plate 460 can be connected to the shaft 464.

[0041] The rotating plate lifting / lowering mechanism 467 includes a ball screw 4670 with its central axis extending along the Z-axis directions, a pair of guide rails 4671, one of which is arranged on each side of the ball screw 4670 and which extend parallel to the ball screw 4670, an electric motor 4672, which is coupled to the upper end of the ball screw 4670 for rotating the ball screw 4670 about its central axis, and the lifting and lowering block 4673, which has an internal nut in threaded engagement with the ball screw 4670 and a pair of side sections which are held in slidable contact with the respective guide rails 4671.When the electric motor 4672 is activated, it rotates the ball screw 4670 about its central axis, causing the internal nut of the lifting and lowering block 4673 to move the lifting and lowering block 4673 back and forth along the Z-axis directions, while the lifting and lowering block 4673 is guided by the guide rails 4671. Consequently, the reversing plate 460, which is connected to the reversing motor 465, which is coupled to the lifting and lowering block 4673 by the shaft 464, is raised and lowered along the Z-axis directions.

[0042] The wafer feeding mechanism 5 for feeding a wafer 90 to the wafer table 478 is, as shown in the Fig. 3 and Fig. Figure 5 illustrates, for example, the wafer feeder mechanism 5 is arranged on the fixture base 10 close to the robot 2. It is movable along the Y-axis directions, for example, above the belt mounting table 74, including the frame table 477 and the wafer table 478.

[0043] The wafer feeding mechanism 5 features the in Fig. 5 illustrated structural details. As in Fig. As illustrated in Figure 5, the wafer feeding mechanism 5 includes, for example, a suction pad movement mechanism 52 arranged on a column 51 erected on a region of the device base 10 on the -X direction side, a suction pad lifting / lowering mechanism 53 connecting the suction pad movement mechanism 52 and a suction pad 55 for lifting and lowering the suction pad 55, and the suction pad 55 for receiving a wafer 90 held by a wafer holder 22 of the robot 2.

[0044] The suction pad motion mechanism 52 includes a ball screw 520, the central axis of which extends along the Y-axis direction, a pair of guide rails 521, one of which is arranged on each side of the ball screw 520 and which extend parallel to the ball screw 520, an electric motor 522, which is coupled to one end of the ball screw 520 for rotating the ball screw 520 about its central axis, and a movable block 523, which has an internal nut in threaded engagement with the ball screw 520 and a pair of side sections which are held in slidable contact with the respective guide rail 521. When the electric motor 522 is activated, it rotates the ball screw 520 about its central axis, which causes the inner nut of the movable block 523 to move the movable block 523 linearly along the Y-axis directions, while the movable block 523 is guided by the guide rails 521.Consequently, the suction pad 55, which is connected to the movable block 523 by the suction pad lifting / lowering mechanism 53, is moved along the Y-axis directions.

[0045] The suction pad lifting / lowering mechanism 53 comprises a ball screw 530 whose central axis extends along the Z-axis directions, a pair of guide rails 531, one of which is arranged on each side of the ball screw 530 and which extend parallel to the ball screw 530, an electric motor 532 which is coupled to the upper end of the ball screw 530 for rotating the ball screw 530 about its central axis, and a lifting and lowering arm 533 which extends in the +X direction and has an internal nut in threaded engagement with the ball screw 530 and a pair of side sections, each of which is held in slidable contact with one of the guide rails 531. The suction pad 55 is arranged at the distal end of the lifting and lowering arm 533.When the electric motor 532 is activated, it rotates the ball screw 530 about its central axis, which causes the internal nut of the lifting and lowering arm 533 to move the lifting and lowering arm 533 back and forth along the Z-axis directions, while the lifting and lowering arm 533 is guided by the guide rails 531. Therefore, the suction pad 55 on the lifting and lowering arm 533 is raised and lowered along the Z-axis directions.

[0046] The suction pad 55 has an upper surface, which is attached to the lower surface of the distal end of the lifting and lowering arm 533 by fastening bolts 541, a spring support 542, and support pins 543, which have springs or similar components for absorbing shocks generated upon contact with a wafer 90. In plan view, the suction pad 55 is designed as a circular plate and has a lower surface, a holding surface 550, made of a porous material for holding a wafer 90 under suction. The holding surface 550 is connected to a suction source (not illustrated), such as a vacuum-generating device, via a suction tube 553, a joint, etc., by means of a fluid.

[0047] The wafer table 478 is, as in Fig. Figure 3 illustrates the positioning under a movement path along which the suction pad 55 can be moved linearly in the Y-axis directions.

[0048] As in Fig. As illustrated in Figure 6, the frame cassette 61, which accommodates ring frames 94, is a Closed Type Front Opening Unified Pod (FOUP). The frame cassette 61 includes at least one OHT engagement element 611, accessible via the OHT mechanism (not illustrated), an upper plate 612 to which the OHT engagement element 611 is attached, several, for example three, side plates 613 extending downwards from the upper plate 612 in the -Z direction, several shelves 615 attached to the respective inner side faces of two of the side plates 613 facing each other along the X-axis directions, for placing ring frames 94 on them, and a bottom plate 616 connecting the lower ends of the three side plates 613. For example, handles not illustrated, which can be gripped by the operator, may be attached to the outer side surfaces of the side plates 613.

[0049] To meet the increasing cleanliness requirements of semiconductor devices, which are becoming ever smaller, and to ultimately enable their manufacture from wafers 90, the frame cassette 61, in accordance with the present embodiment, is of a closed type to protect against the ingress of dust. However, in accordance with the present invention, the frame cassette can also be of an open type. Furthermore, the frame cassette 61 can be free of OHT engagement elements 611.

[0050] The frame cassette 61 has a front opening 619 that is open in the +Y direction to allow the ring frame 94 to be inserted into and exited from the frame cassette 61. The trays 615 are spaced at predetermined vertical intervals within the frame cassette 61. Two of the trays 615, opposite each other along the X-axis directions, can support a ring frame 94 by supporting its outer circumferential sections.

[0051] When the frame cassette 61 is fed from a predetermined cassette feed source (not illustrated), located outside the tape feeder 1, to the first frame cassette stage 131 with the OHT engagement elements 611 by the OHT mechanism, the opening 619 is closed, for example, by a cassette cover 617. To remove a ring frame 94 from the frame cassette 61, two opening and closing handles 607 of a cassette opening and closing mechanism 6, which is located in Fig. Figure 8 illustrates that the tools are inserted into the respective keyholes 6170 defined in the cassette cover 617 and are then turned to open the cassette cover 617.

[0052] The OHT engagement element 611, which is erected on the upper panel 612, can be hooked and held by a clamp-like gripping arm or similar of the OHT mechanism.

[0053] The 618 frame cassette is structurally similar to the one in Fig. 6 illustrated frame cassette 61 identical.

[0054] The in Fig. Wafer cassette 62, illustrated in section 7, is essentially the same in its structure as the one shown in Fig. The wafer cassette 61 illustrated in Figure 6 is identical. The wafer cassette 62 has a front opening 629 in the +Y direction, which is open to allow the wafers 90, stored on the trays 625, to be conveyed out of the wafer cassette 62 in a state where outer circumferential sections are supported by them. The wafer cassette 62 has a height that is greater than, for example, the frame cassette 61, and a width and depth that are smaller than the frame cassette 61, since the wafers 90 have a smaller diameter than the ring frames 94.

[0055] If the wafer cassette 62 is fed from a predetermined wafer feed source (not illustrated), for example the grinding device wafer cassette stage 199 of the grinding device 19, which is positioned outside the tape feeder 1, to the in Fig. In the wafer cassette stage 133 illustrated in Figure 3, when a wafer is inserted with an OHT engagement element 621 gripped by the OHT mechanism, the opening 629 is closed by a cassette cover 627. To remove a wafer 90 from the wafer cassette 62, the opening and closing handles 607 of the [unclear] are used. Fig. 8 illustrated cassette opening and cassette closing mechanism 6 are inserted into respective keyholes 6270 defined in a cassette cover 627 and are then turned to open the cassette cover 627.

[0056] In accordance with the present embodiment, the frame cassette 61 and the wafer cassette 62 can, for example, have distinguishing markings to differentiate them from one another. For example, the distinguishing markings are provided on the upper surfaces of the OHT engagement element 611 and the OHT engagement element 621, but are not necessarily limited to these locations.

[0057] The cassette opening and closing mechanism 6, which is in Fig. Figure 8 illustrates an opening and closing plate 60, which is designed, for example, as a rectangular plate. The opening and closing plate 60 includes two wafer-FOUP suction cups 603 and two frame-FOUP suction cups 606 on the front surface, facing the -Y direction.

[0058] For example, one of the two wafer FOUP suction cups 603 is arranged in a position that is higher than the two frame FOUP suction cups 606, and the other of the two wafer FOUP suction cups 603 is arranged in a position that is lower than the two frame FOUP suction cups 606.

[0059] Each of the two wafer FOUP suction cups 603 and the two frame FOUP suction cups 606 is held in fluid connection with a suction source 699, such as a vacuum generating device, by means of a fluid connection passage (not illustrated), such as a joint or a resin tube. When the suction source 699 is actuated, it generates suction forces that are transmitted to the wafer FOUP suction cups 603 and the frame FOUP suction cups 606.

[0060] While the cassette lid 627 of the in Fig. As the wafer cassette 62, illustrated in Figure 7, is held against the wafer FOUP suction cups 603, the suction source 699 is actuated to transmit suction forces to the wafer FOUP suction cups 603, enabling the cassette opening and closing mechanism 6 to hold the cassette lid 627 of the wafer cassette 62. At this point, the suction forces from the suction source 699 can also be transmitted to the frame FOUP suction cups 606. While the cassette lid 617 of the in Fig. When the frame cassette 61 is held against the frame FOUP suction cups 606 as illustrated in Figure 6, the suction source 699 is also actuated to transmit suction forces to the frame FOUP suction cups 606, so that the cassette opening and closing mechanism 6 can hold the cassette cover 617 of the frame cassette 61.

[0061] For example, pressure sensors can be connected to the wafer-FOUP suction cups 603. In a case where the pressure sensors detect contact between the wafer-FOUP suction cups 603 and the cassette lid 627 of the wafer cassette 62, the pressure sensors can send signals to actuate the suction source 699, which generates suction forces and transmits them to the wafer-FOUP suction cups 603.

[0062] As in Fig. As illustrated in Figure 8, the two opening and closing handles 607 are arranged on the front surface of the opening and closing plate 60 and spaced apart laterally along the X-axis directions. The two opening and closing handles 607 can be inserted into respective keyholes 6270, which are located in the cassette cover 627 of the Fig. 7 illustrated wafer cassette 62 are defined, and are inserted into the respective keyholes 6170, which are in the cassette lid 617 of the in Fig. The 6 illustrated frame cassette 61 is defined.

[0063] The opening and closing plate 60 incorporates a rotation mechanism (not illustrated) for turning the opening and closing handles 607. The rotation mechanism includes, for example, an electric motor, an encoder, etc., and can rotate the opening and closing handles 607 through a necessary angle.

[0064] While the cassette lid 627 is in the Fig. As the wafer cassette 62, illustrated in Figure 7, engages above the opening 629, the opening and closing handles 607 are inserted into the respective keyholes 6270 defined in the cassette cover 627 and then rotated in one direction to secure the cassette cover 627 to the wafer cassette 62. Conversely, while the cassette cover 627 is secured to the wafer cassette 62, the opening and closing handles 607 are inserted into the respective keyholes 6270 defined in the cassette cover 627 and then rotated in the opposite direction to release the cassette cover 627 from the wafer cassette 62.

[0065] While the cassette lid 617 is in the Fig. As the frame cassette 61, illustrated in Figure 6, engages above the opening 619, the opening and closing handles 607 are inserted into the respective keyholes 6170 defined in the cassette cover 617 and then rotated in one direction to secure the cassette cover 617 to the frame cassette 61. While the cassette cover 617 is secured to the frame cassette 61, the opening and closing handles 607 are, conversely, inserted into the respective keyholes 6170 defined in the cassette cover 617 and then rotated in the opposite direction to release the cassette cover 617 from the frame cassette 61.

[0066] A Y-axis plate movement mechanism 63 for moving the opening and closing plate 60 horizontally along the Y-axis direction is arranged below the opening and closing plate 60. The Y-axis plate movement mechanism 63 includes a ball screw 630 whose central axis extends along the Y-axis directions, a pair of guide rails 631, one of which is arranged on each side of the ball screw 630 and which extend parallel to the ball screw 630, an electric motor 632 which is coupled to the upper end of the ball screw 630 for rotating the ball screw 630 about its central axis, and a movable element 633 which has an internal nut engaging with the ball screw 630 and bottom sections which are held in slidable contact with the respective guide rails 631.When the electric motor 632 is activated, it rotates the ball screw 630 about its central axis, which causes the internal nut of the movable element 633 to move the movable element 633 along the Y-axis directions, while the movable element 633 is guided by the guide rails 631. The opening and closing plate 60 is connected to the movable element 633 by a plate lifting and lowering mechanism 64. Therefore, the opening and closing plate 60 can be moved along the Y-axis directions by the Y-axis plate movement mechanism 63.

[0067] As in Fig. As illustrated in Figure 9, the plate lifting and lowering mechanism 64 includes a support element 642, which is erected vertically on the movable element 633 and which has a guide groove 641 defined therein and which extends along the Z-axis directions, a ball screw 643 whose central axis extends along the Z-axis directions, an electric motor 644 which is coupled to the lower end of the ball screw 643 for rotating the ball screw 643 about its central axis, a guide rail 647 which is attached to the support element 642 and which extends along the Z-axis directions, and a lifting and lowering block 645 which has an internal nut in thread engagement with the ball screw 643 and a side section which is held in slidable contact with the guide rail 647. The opening and closing plate 60 is attached to the front surface of the lifting and lowering block 645, which faces the -Y direction.When the electric motor 644 is activated, it rotates the ball screw 643 about its central axis, which causes the internal nut of the lifting and lowering block 645 to move the lifting and lowering block 645 along the Z-axis directions, while the lifting and lowering block 645 is guided by the guide rail 647. Therefore, the opening and closing plate 60 on the lifting and lowering block 645 can be raised and lowered along the Z-axis directions by the plate lifting and lowering mechanism 64.

[0068] The second frame cassette stage 132, the first frame cassette stage 131 and the wafer cassette stage 133, which are in Fig. The three items illustrated can be raised and lowered along the Z-axis directions by the respective elevators not illustrated.

[0069] As in Fig. As illustrated in Figure 3, the cassette opening and closing mechanism 6 is moved back and forth along the X-axis directions by an X-axis movement mechanism 69, such as an electrically operated slide. The opening and closing plate 60 of the cassette opening and closing mechanism 6 can be positioned in a successive sequence from the +X-direction side to the -X-direction side in the manner described, in front of the cassette cover 617 of the frame cassette 618, which is placed on the second frame cassette stage 132 and receives the frame sets 99, the cassette cover 617 of the frame cassette 61, which is placed on the first frame cassette stage 131 and receives the ring frame 94 to be used, and the cassette cover 627 of the wafer cassette 62, which is placed on the wafer cassette stage 133 and receives the wafers 90 with protective bands 95 attached to them.

[0070] Fig. Figure 8 illustrates the first frame cassette stage 131 in detail. The in Fig. Figure 8 illustrates the first frame cassette stage 131, which is essentially identical in structure to the second frame cassette stage 132 and the wafer cassette stage 133, which are shown in Fig. 3 are illustrated. Therefore, only the first frame cassette stage 131 will be described below.

[0071] The first frame cassette stage 131, for example, has a rectangular shape in plan view. The first frame cassette stage 131 has three protruding elements 135 on its upper surface. The wafer cassette 62 and the frame cassette 61 each have three recesses (not illustrated) in their lower surfaces for engagement with the respective protruding elements 135. If the frame cassette 61 is placed on the first frame cassette stage 131 such that the protruding elements 135 and the recesses are aligned horizontally with each other, the protruding elements 135 are inserted into the recesses, thus securing the frame cassette 61 to the first frame cassette stage 131.

[0072] A wafer cassette detection sensor 136, comprising a first light emitter 1361 for emitting light and a first light detector 1362 for detecting the light emitted by the first light emitter 1361, is arranged on the upper surface of the first frame cassette stage 131. Furthermore, a frame cassette detection sensor 137, comprising a second light emitter 1373 for emitting light and a second light detector 1374 for detecting the light emitted by the second light emitter 1373, is arranged on the upper surface of the first frame cassette stage 131.

[0073] For example, the wafer cassette detection sensor 136 is positioned closer to the center of the first frame cassette stage 131 than the frame cassette detection sensor 137. As described above, the wafer cassette 62, in particular, has a width and depth that are smaller than those of the frame cassette 61. The wafer cassette detection sensor 136 is positioned in an area of ​​the first frame cassette stage 131 that can be covered by both the frame cassette 61 and the wafer cassette 62, and the frame cassette detection sensor 137 is positioned outside the area of ​​the first frame cassette stage 131 and can be covered by only the frame cassette 61.

[0074] If the in Fig. When the frame cassette 61, illustrated in Figure 6, is placed on the first frame cassette stage 131, both the wafer cassette detection sensor 136 and the frame cassette detection sensor 137 are covered by the frame cassette 61. The light emitted by the second light emitter 1373 of the frame cassette detection sensor 137 is reflected by the lower surface of the frame cassette 61 and detected by the second light detector 1374. Consequently, the frame cassette detection sensor 137 can determine that the cassette placed on the first frame cassette stage 131 is the frame cassette 61. If, on the other hand, the wafer cassette 62, which is smaller in width and depth than the frame cassette 61, is placed on the first frame cassette stage 131, only the wafer cassette detection sensor 136 is covered by the wafer cassette 62.The second light detector 1374 of the frame cassette detection sensor 137 cannot detect the light emitted by the second light emitter 1373, as the light is not reflected by the wafer cassette 62. The light emitted by the first light emitter 1361 of the wafer cassette detection sensor 136 is reflected by the lower surface of the wafer cassette 62 and is detected by the first light detector 1362. Consequently, the wafer cassette detection sensor 136 can determine that the cassette placed on the first frame cassette stage 131 is the wafer cassette 62.

[0075] The first frame cassette stage 131 and the wafer cassette stage 133, etc. can do without the wafer cassette detection sensor 136 and the frame cassette detection sensor 137.

[0076] As in Fig. As illustrated in Figure 3 and described above, the robot 2 belonging to the tape applicator in the present embodiment has the frame holder 21 for holding a ring frame 94 and is able to remove a ring frame 94 from the frame cassette 61 on the first frame cassette stage 131 or to store a frame set 99 in the frame cassette 618 on the second frame cassette stage 132. The robot 2 in accordance with the present embodiment also has the wafer holder 22 for holding a wafer 90 by suction.

[0077] As in the Fig. 3 and Fig. As illustrated in Figure 10, the robot 2 is a movable or multi-jointed robot and includes a holder horizontal movement mechanism 23 for horizontal movement of the frame holder 21 and the wafer holder 22 and a holder vertical movement mechanism 24, which may be, for example, an electric actuator, for vertical movement of the frame holder 21 and the wafer holder 22.

[0078] The holder horizontal movement mechanism 23, for example, has a pivoting structure with a swivel motor, a swivel arm assembly including several plate-shaped arms, and a pull mechanism integrated therein. In particular, the holder horizontal movement mechanism 23 operates by pivoting the arms about respective rotation axes extending in the Z-axis directions, i.e., vertical directions, with rotational power generated by the swivel motor, in order to pivot, for example, the wafer holder 22 in a horizontal plane defined by the X-axis and Y-axis directions, and also by moving the arms from a mutually superimposed state to a linearly aligned state, in order to move the wafer holder 22 linearly, for example, in a horizontal plane.

[0079] The holder vertical movement mechanism 24 is connected to a lower section of the holder horizontal movement mechanism 23. The holder vertical movement mechanism 24, together with the holder horizontal movement mechanism 23, moves the wafer holder 22, for example, up and down along the Z-axis direction to position the wafer holder 22 at a predetermined height.

[0080] As in Fig. As illustrated in Figure 3, an electrically operated carriage 249 is arranged under the holder vertical movement mechanism 24 to move the robot 2 back and forth along the X-axis directions.

[0081] As in Fig. As illustrated in Figure 10, a housing 25 supporting the wafer holder 22 is connected to one of the arms of the holder horizontal movement mechanism 23 by a column-like arm joint 259.

[0082] The wafer holder 22 is essentially in the form of an elongated, rectangular, flat plate and has a suction channel 220 defined therein, extending longitudinally along the wafer holder 22. The suction channel 220 has one end connected to a suction source (not illustrated), which may include a vacuum generating device and a compressor, etc., and another end opening into an upper suction surface at the distal end of the wafer holder 22 as a suction opening 221. A suction pad, made of rubber resin or similar material to increase suction forces, may be arranged in the suction opening 221. The suction opening 221 can open into either the upper or lower surface of the wafer holder 22, allowing both surfaces to function as suction surfaces.

[0083] The wafer holder 22 has a rear or proximal end that is supported by a holder 251 on the housing 25. The housing 25 contains a wafer holder turning mechanism 252, including a spindle, an electric motor, etc. The wafer holder turning mechanism 252 is capable of turning the wafer holder 22 in order to reverse the suction surface in which the suction opening 221 is defined. The wafer holder 22 does not necessarily have to be reversible.

[0084] The frame holder 21 is supported on a support arm 26 and includes two upper plates 211 and a lower plate 212 for arranging a ring frame 94 between them. The lower plate 212, for example, has the shape of a flat steel plate with a substantially arcuate edge that corresponds in shape to a section of the annular outer circumferential edge of the ring frame 94.

[0085] The ring frame 94, which is like in Fig. Figure 1, which has an essentially ring-shaped form, has several (in the illustrated example 4) flat positioning facets 949 defined in its outer circumferential edge.

[0086] As in Fig. As illustrated in Figure 10, two positioning blocks 213 for contacting the ring frame 94 are arranged on the upper surface of the lower plate 212. These blocks contact the ring frame 94 at symmetrical positions with respect to a center line of the upper surface of the lower plate 212. Each of the positioning blocks 213 has a contour that is essentially rectangular and includes a flat front surface for contacting the ring frame 94. The frame holder 21 can position the ring frame 94 in a horizontal plane by the front surfaces of the positioning blocks 213 bearing against the flat positioning facets 949 of the ring frame 94.

[0087] A plate feeding mechanism 215 for feeding the upper plates 211 into the in Fig. The Y-direction to the ring frame 94, as illustrated in Figure 10, is located on the upper surface of the lower plate 212. The plate feeding mechanism 215 is, for example, an air cylinder including a cylinder tube 2151 with a piston (not illustrated) slidably arranged therein, and a piston rod 2152 inserted into the cylinder tube 2151, one end of which is connected to the piston. The two upper plates 211 are supported by a support beam 2153, which is connected to the other end of the piston rod 2152. The support beam 2153 has bottom sections that are loosely mounted over a pair of guide rails 2154, which are arranged on the upper surface of the lower plate 212 and extend parallel to the piston rod 2152, so that the support beam 2153 is slidable on and along the guide rails 2154.

[0088] The plate feeding mechanism 215 is not limited to an air cylinder and can, for example, be an electric cylinder or similar.

[0089] In the illustrated example, gripping cylinders 216 are arranged at both longitudinal ends of the support beam 2153 along the X-axis directions. Each gripping cylinder 216 has piston rods that are movable along the Z-axis directions. The piston rods have lower ends that are connected to the upper surfaces of the upper plates 211, which are flat plates.

[0090] Each of the upper plates 211 is essentially designed as an elongated rectangular flat plate and has an essentially arcuate edge, the shape of which corresponds to a section of the annular outer circumferential edge of the ring frame 94. The frame holder 21 operates by positioning the ring frame 94 between the upper plates 211 and the lower plate 212 and lowering the upper plates 211 with the gripping cylinders 216, which causes the upper plates 211 and the lower plate 212 to grip the ring frame 94 vertically between them.

[0091] As in Fig. As illustrated in Figure 10, two sensors 217 can be arranged on the substantially arc-shaped edge of the lower plate 212 to check whether a ring frame 94 is present or not.

[0092] The frame holder 21 is attached to the front surface of the support arm 26, which is mounted on the housing 25 that supports the wafer holder 22 by means of a pivot axis 266. The frame holder 21 can pivot horizontally parallel to a horizontal plate with respect to the wafer holder 22 and can be spaced apart from the wafer holder 22.

[0093] The in Fig. 3. Illustrated control unit 17 includes a processor, such as a CPU, for performing arithmetic and processing operations in accordance with control programs, and a storage device, such as a memory, that stores the control programs or software and various types of data. The control unit 17 has functions that can be executed by the processor in accordance with the software stored in the storage device. The control unit 17 is electrically connected, via a wired or wireless communication link (not illustrated), to the components of the tape feeder 1, which includes the electrically driven carriage 249 for moving the robot 2 along the X-axis directions, the cassette opening and closing mechanism 6, the robot 2, the frame feeding mechanism 30, the frame set turner 46, etc. The control unit 17 can be a motor controller, a sequence controller, etc.on the components of the tape applicator 1. Various sensors, including the wafer cassette detection sensor 136 and the frame cassette detection sensor 137, which are located in . Fig. 8 are illustrated, etc. send detection signals to the controller 17.

[0094] An example of an operation of the band applicator 1 for forming a frame set 99, which can be cut after the in Fig. 1 illustrated wafer 90 by the in Fig. The grinding process shown in section 2, 19, is described below.

[0095] The pre-grinding wafer cassette 6211, which holds several wafers 90 to be processed, is fed from a cassette feed source through the OHT mechanism (not illustrated) into the grinding device 19 and is placed on the grinding device wafer cassette stage 199 of the grinding device 19.

[0096] The in Fig. Figure 1 illustrates wafer 90 with the protective band 95 attached to its end face 903, which is stored in the pre-cut wafer cassette 6211. The pre-cut wafer cassette 6211 has a design that corresponds to the one shown in Fig. 7 illustrated wafer cassette 62 identical structure.

[0097] The grinding device 19 also includes the cassette opening and cassette closing mechanism 6, which is located in Fig. Figure 8 illustrates this. The cassette opening and closing mechanism 6 opens the cassette lid of the pre-cut wafer cassette 6211, which is located in Fig. Figure 2 illustrates the grinding device wafer cassette stage 199, which allows a wafer 90 to be fed from the pre-grinding wafer cassette 6211. The intra-grinding device robot 190 holds the wafer 90 from the pre-grinding wafer cassette 6211, feeds it to the stage, and places the wafer 90 onto the clamping table 90, which holds the wafer 90 in place by suction. The rotating grinding stones are then lowered onto the back 904 of the wafer 90, grinding the wafer 90. After the wafer 90 has been ground to the desired thickness, the grinding stones are lifted from the wafer 90, whereupon the grinding process on the wafer 90 is completed.

[0098] The intra-grinding robot 190 feeds the ground wafer 90 from the clamping table and places it in the wafer cassette 62 on the grinding device wafer cassette platform 199, which is empty. Alternatively, the intra-grinding robot 190 feeds the ground wafer 90 from the clamping table and places it in the transfer cassette 18. The intra-grinding robot 190 can then place the ground wafer 90 back into the pre-grinding wafer cassette 6211.

[0099] For example, all wafers 90 stored in the pre-grinding wafer cassette 6211 are ground one after the other in the manner described above, and the successively ground wafers 90 are stored in the wafer cassette 62. Subsequently, the OHT mechanism (not illustrated) moves the wafer cassette 62, which holds the ground wafers 90 with the protective bands 95 attached to them, from the grinding device wafer cassette platform 199 to the wafer cassette platform 133 of the band feeder 1 and places the wafer cassette 62 onto the wafer cassette platform 133.

[0100] At the in Fig. In the 3 illustrated tape feeder 1, a wafer 90 is fed to the wafer table 478 in accordance with one of two processes belonging to a first or second category.

[0101] In accordance with the process of the first category, the wafer holder 22 of the robot 2 holds a ground wafer 90, which is stored in the wafer cassette 62 or the pre-ground wafer cassette 6211 on the wafer cassette stage 133, and removes the ground wafer 90 from the wafer cassette 62 or the pre-ground wafer cassette 6211. Thereafter, the wafer feeding mechanism 5 receives the wafer 90, which is held by the wafer holder 22 of the robot 2, and feeds the wafer 90 to the wafer table 478.

[0102] In accordance with the process of the second category, the robot 2 removes a ground wafer 90 from the transfer cassette 18, and thereafter the wafer feeding mechanism 5 receives the wafer 90, which is held by the wafer holder 22 of the robot 2, and feeds the wafer 90 to the wafer table 478.

[0103] The robot 2 can also serve as a wafer feeding mechanism for feeding a wafer 90, which has been removed from the wafer cassette 62 or the pre-grinding wafer cassette 6211, or a wafer 90, which has been removed from the transfer cassette 18, directly to the wafer table 478.

[0104] The process of the first category is described below.

[0105] If the wafer cassette 62, which holds ground wafers 90, is, for example, on the in Fig. The wafer cassette detection sensor 136, which is placed in the wafer cassette stage 133 shown in the illustration, detects the wafer cassette. Fig. Figure 8 illustrates the wafer cassette 62. In response to the detection signal from the wafer cassette detection sensor 136, the controller 17 controls the cassette opening and closing mechanism 6. The X-axis movement mechanism 69 moves the cassette opening and closing mechanism 6 in the X-direction and positions the opening and closing plate 60 in front of the wafer cassette 62 on the wafer cassette platform 133. Furthermore, the plate lifting and lowering mechanism 64 is moved along one of the Z-axis directions to position the wafer cassette 60 in front of the wafer cassette 62 on the wafer cassette platform 133. Fig. The 7 illustrated keyholes 6270 in the cassette cover 627 of the wafer cassette 62 on the wafer cassette stage 133 are to be aligned at the height of the opening and closing handles 607 of the opening and closing plate 60.

[0106] Then the controller 17 controls the Y-axis plate movement mechanism 63, which is located in Fig. Figure 8 illustrates how to move the opening and closing plate 60 a proper distance in the -Y direction. The wafer cassette 62 and the opening and closing plate 60 move towards each other until the opening and closing handles 607 engage in their respective keyholes 6270 in the cassette lid 627. Once the opening and closing handles 607 have engaged in their respective keyholes 6270, the front surfaces of the opening and closing plate 60 and the cassette lid 627 are held in contact in the -Y direction. Then, the suction source 699, which is connected to the wafer-FOUP suction cups 603, is actuated to generate suction forces that are transmitted to the wafer-FOUP suction cups 603 to hold the cassette lid 627 against it under suction.

[0107] The rotation mechanism housed in the opening and closing plate 60 is then actuated to rotate the opening and closing handles 607 and remove the cassette lid 627 from the wafer cassette 62. The Y-axis plate movement mechanism 63 moves the cassette lid 627, which is held in place by the wafer-FOUP suction cups 603, in the +Y direction, thereby separating the cassette lid 627 from the wafer cassette 62. The opening and closing plate 60, which holds the cassette lid 627 in place, is then lowered and retracted from the front of the opening 629 in the wafer cassette 62.

[0108] Then the in Fig. 13 illustrated control 17 the robot 2. In particular, the electrically operated sled 249, which is in Fig. Figure 3 illustrates the robot 2 in the -X direction to position it in front of the wafer cassette 62, which is placed on the wafer cassette platform 133 with its opening 629 held open. The holder's horizontal movement mechanism 23 rotates the wafer holder 22 to an angular position where the wafer holder 22 faces the front of the opening 629 in the wafer cassette 62 such that the longitudinal directions, i.e., the Y-axis directions, of the wafer holder 22 are aligned with the direction along which wafers 90 can be inserted into and removed from the wafer cassette 62. Furthermore, the holder's vertical movement mechanism 24 moves the wafer holder 22 vertically and positions it in alignment with the height of a wafer 90 to be handled, which is stored on one of the trays 625 of the wafer cassette 62.

[0109] For example, the wafer holder turning mechanism 252, which is located in Fig. Figure 10 illustrates how to adjust the wafer holder 22 to bring the suction surface of the wafer holder 22, in which the suction opening 221 is defined, into a state in which the suction surface is facing upwards.

[0110] The wafer holder 22 then enters through the opening 629 at a predetermined position within it in the -Y direction. The wafer holder 22 is positioned below the center of the wafer 90.

[0111] Furthermore, the wafer holder 22 is raised until its suction surface comes into contact with the protective band 95, which is attached to the downward-facing end face 903 of the wafer 90. The suction source (not illustrated) is activated to generate suction forces that are transmitted through the suction channel 220 to the suction opening 221 to act on the wafer 90. The wafer 90 is now held under suction by the wafer holder 22 beneath the wafer 90 with its back side 904 facing upwards.

[0112] Then the wafer holder 22, which holds the wafer 90 under suction, is moved out of the wafer cassette 62, so that the wafer 90 is fed from the wafer cassette 62 by the robot 2.

[0113] The robot 2, with its wafer holder 22, which holds the wafer 90 under suction, feeds the wafer 90 from the wafer cassette 62. The controller 17 then executes a control operation to control the wafer feeding mechanism 5 in order to receive the wafer 90 from the wafer holder 22 of the robot 2 and feed the wafer 90 to the wafer table 478.

[0114] In particular, under the control of the controller 17, the holder horizontal movement mechanism 23 moves the wafer holder 22, which holds the wafer 90, horizontally, that is, it pivots it. The suction pad movement mechanism 52 of the in Fig. The wafer feeding mechanism 5, as illustrated in Figure 5, moves the suction pad 55 along the Y-axis directions to position the wafer 90, held by suction by the wafer holder 22, and the suction pad 55 in a horizontal plane in alignment with each other. The center of the suction pad 55 and the center of the wafer 90 are essentially brought into alignment with each other, after which the wafer 90 is positioned directly beneath the suction pad 55.

[0115] The suction pad lifting and lowering mechanism 53 lowers the suction pad 55 in the -Z direction to a vertical position, where the holding surface 550 of the suction pad 55 comes into contact with the back 904 of the wafer 90, at which point the lowering of the suction pad 55 is interrupted. Suction forces generated by the suction source (not illustrated) are transmitted to the holding surface 550 of the suction pad 55, causing the holding surface 550 to attract and hold the back 904 of the wafer 90 under suction. When the wafer 90 is held under suction against the suction pad 55, the controller 17 controls the robot 2 to release the holding force. As a result, a state is created in which the wafer 90 has been guided to the wafer feeding mechanism 5.

[0116] When the controller 17 controls the suction pad movement mechanism 52 and the suction pad lifting and lowering mechanism 53, the wafer feeder mechanism 5 places the wafer 90, held by suction on the suction pad 55, onto the wafer table 478 of the in Fig. Figure 3 illustrates the tape mounting table 470, such that the center of the wafer 90 and the wafer table 478 are essentially aligned. The wafer 90 is held against the wafer table 478 with its back side 904 facing upwards and by suction.

[0117] The process in the second category for feeding the wafer 90 to the wafer table 478 in the tape feeder 1 is described below.

[0118] Ground wafers 90 are processed by the Intra-grinding robot 190, which is located in Fig. 2 is illustrated, transported to the respective storage areas of the transfer cassette 18, which is arranged between the grinding device 19 and the belt feeder 1, and which is in Fig. 3 Illustrated control unit 17 controls the robot 2. The electrically driven carriage 249 moves the robot 2 in the +X direction and positions the robot 2 in front of the transfer cassette 18. The holder horizontal movement mechanism 23 rotates the wafer holder 22 to an angular position where the wafer holder 22 faces the front of the transfer cassette 18, so that the longitudinal directions, i.e., the Y-axis directions, of the wafer holder 22 are aligned with the direction along which wafers 90 can be inserted into and removed from the transfer cassette 18. In addition, the holder vertical movement mechanism 24 moves and positions the wafer holder 22 in an orientation with the height of a wafer 90 to be handled, which is stored on one of the trays of the transfer cassette 18.

[0119] The wafer holder 22 is then moved in the +X direction and enters the transfer cassette 18 at a predetermined position. The wafer holder 22 is positioned below the center of the wafer 90.

[0120] Furthermore, the wafer holder 22 is raised until its suction surface comes into contact with the protective band 95, which is attached to the downward-facing end face 903 of the wafer 90 in the transfer cassette 18. The wafer 90 is now held under suction from below by the wafer holder 22, to which suction forces generated by the suction source are transmitted. The wafer 90, held under suction by the wafer holder 22, has its back side 904 facing upwards.

[0121] Then the wafer holder 22, which holds the wafer 90 under suction, is moved out of the transfer cassette 18, and the wafer 90 is fed from the transfer cassette 18 by the robot 2. Afterwards, the wafer 90 is transferred from the wafer holder 22 to the wafer feeding mechanism 5 and then fed to the wafer table 478 by the wafer feeding mechanism 5 in essentially the same manner as in the process according to the first category.

[0122] In accordance with the first-category operation or the second-category operation, the robot 2, which has conveyed the wafer 90 to the wafer feeder 5, conveys a ring frame 940 to the frame feeder 30, while the wafer feeder 5 simultaneously conveys the wafer 90 to the wafer table 478. Specifically, the controller 17 performs a control operation to control the frame holder 21 of the robot 2 to hold and remove a ring frame 94 from the frame cassette 61 on the first frame cassette stage 131, and a control operation to control the frame feeder 30 to receive the ring frame 94 held by the frame holder 21 of the robot 2.

[0123] For example, the OHT mechanism (not illustrated) fed the frame cassette 61, which holds the ring frames 94 to be used, from the feed source and placed the frame cassette 61 on the first frame cassette stage 131. The in Fig. Figure 8 illustrates the frame cassette detection sensor 137 detecting the frame cassette 61. In response to the detection signal from the frame cassette detection sensor 137, the controller 17 controls the cassette opening and closing mechanism 6 to remove the cassette cover 617 from the frame cassette 61. Since the cassette opening and closing mechanism 6 operates in the same way as when removing the cassette cover 627 from the wafer cassette 62, its operation is omitted from the description. The opening and closing plate 60, which holds the cassette cover 627 under suction, is engaged from the front side of the opening 619 in the Fig. 6 illustrated frame cassette 61 lowered and withdrawn.

[0124] Then the controller 17 controls the robot 2. In particular, it moves the robot in Fig. Figure 3 illustrates electrically driven carriages 249 that move the robot 2 in the +X direction and position the robot 2 in front of the frame cassette 61, which is held open by its opening 619 and placed on the first frame cassette stage 131. To prevent the wafer holder 22 from obstructing the entry of the frame holder 21 into the frame cassette 61, the frame holder 21, which is in Fig. 10 is illustrated, in addition, for example, around the pivot axis 266 away from the wafer holder 22, until the direction in which the frame holder 21 protrudes, i.e., the direction in which the upper plates 211 move, extends perpendicular to the longitudinal directions of the wafer holder 22.

[0125] Furthermore, the holder horizontal movement mechanism 23 rotates the frame holder 21 to an angular position where the frame holder 21 faces the front of the opening 619 in the frame cassette 61. In addition, the holder vertical movement mechanism 24 positions the frame holder 21 at the height of a ring frame 94 to be handled, which is stored on one of the shelves 615 of the frame cassette 61.

[0126] For example, the frame holder 21 is positioned such that the center line of the upper surface of the lower plate 212 and the diameter of the ring frame 94 in the frame cassette 61 are substantially aligned. When the frame holder 21 is positioned in this way, the front surfaces of the Fig. 10 illustrated mounting blocks 213 of the frame holder 21 facing one of the flat positioning facets 949 of the ring frame 94, which in Fig. 1 is illustrated.

[0127] Then the frame holder 21, as in Fig. Figure 10 illustrates that the frame holder 21 is moved in the -Y direction to the ring frame 94 until the front surfaces of the mounting blocks 213 abut one of the flat positioning facets 949 of the ring frame 94. When the front surfaces of the mounting blocks 213 abut one of the flat positioning facets 949 of the ring frame 94, the frame holder 21 is positioned relative to the ring frame 94 and is no longer moved.

[0128] Furthermore, the movement in Fig. Figure 10 illustrates the plate feeding mechanism 215, which moves the upper plates 211 in the Y direction over the lower plate 212 until the distal ends of the upper plates 211 are in the Fig. Figure 10 illustrates the process – in the Y-direction, the frame holder 21 reaches the position of the substantially arcuate edge of the lower plate 212. Then, the frame holder 21 is raised in the +Z direction until the upper surface of the lower plate 212 makes contact with the lower surface of the ring frame 94. Next, the gripping cylinders 216 lower the upper plates 211 until the upper plates 211 and the lower plate 212 grip the ring frame 94 vertically, whereupon the holding process of the ring frame 94 by the frame holder 21 is completed.

[0129] Furthermore, the in Fig. Figure 3 illustrates the control system 17, which uses the robot 2 and the frame feeder 30 to transfer the ring frame 94 from the robot 2 to the frame feeder 30. Specifically, the holder horizontal movement mechanism 23 moves the frame holder 21, which holds the ring frame 94, horizontally, i.e., pivots it, and the pivoting mechanism 306 of the frame feeder 30 pivots the feeder plate 300 to position the ring frame 94, held by the frame holder 21, and the feeder plate 300 relative to each other in a horizontal plane. The center of the feeder plate 300 and the center of the ring frame 94 are essentially aligned, whereupon the ring frame 94 is positioned directly below the feeder plate 300.

[0130] After the feed plate 300 has been lowered to a vertical position where its suction cups 303 come into contact with the upper surface of the ring frame 94, the lowering of the feed plate 300 ceases. The feed plate 300 then attracts the upper surface of the ring frame 94 under suction forces transmitted from the suction source (not illustrated) to the suction cups 303. While the feed plate 300 holds the ring frame 94 under suction, a control process is executed to break the gripping of the ring frame 94 by the frame holder 21, resulting in the transfer of the ring frame 94 from the robot 2 to the frame feeding mechanism 30.

[0131] The control unit 17 controls the frame feeder 30 to position the ring frame, held under suction, on the frame table 477 of the tape mounting table 470 such that their centers are substantially aligned. The ring frame 94 is then held under suction on the frame table 477. The wafer 90 is now positioned in the opening in the ring frame 94 such that the center of the wafer 90 is substantially aligned with the center of the opening in the ring frame 94. The end face 903 of the in Fig. In Figure 1, the illustrated wafer 90 with the attached protective tape 95 was held against the wafer table 478 under suction, and the back side 904 of the wafer 90 is facing upwards. The back side 904 of the wafer 90 and the upper surface of the ring frame 94 are positioned at essentially the same height.

[0132] Then the fabric-like sheet material is processed by the in Fig. Figure 3 illustrates the unwinding roller 472, which is positioned close to the unwinding roller 472, unwinding towards the peeling plate 475. The peeling plate 475 pulls the separating strip 93 from the fabric-like sheet material, while the mounting roller 474 simultaneously rotates at a predetermined speed. Furthermore, the ball screw mechanism 473 moves the tape mounting table 470 in the +Y direction, causing the mounting roller 474 to press the separating strip 93 against the upper surface of the ring frame 94, which is held by suction against the frame table 477, and against the rear side 904 of the wafer 90, which is held by suction against the wafer table 478, from its outer circumferential sides.

[0133] When the tape mounting table 470 is moved in the +Y direction to a predetermined position where it passes the mounting roller 474, and the mounting roller 474 presses the separating tape 93 onto the ring frame 94 and the wafer 90, the separating tape 93 is attached to the wafer 90 and the ring frame 94. In this way, a frame assembly 99 is produced in which the wafer 90 and the ring frame 94 are integrally connected by the separating tape 93.

[0134] The frame feeding mechanism 30 then holds the upper surface of the ring frame 94 of the frame set 99 under suction, is then lifted and rotated in a horizontal plane to feed the frame set 99 from the belt mounting table 470, and positions the frame set 99 over the turning plate 460 of the frame set turner 46. The wafer 90 of the frame set 99 has the end face 903, which is protected by the protective belt 95 and faces downwards.

[0135] The rotating plate 460 is brought into a state in which the four suction cups 463 are facing upwards. The rotating plate lifting / lowering mechanism 467 raises the rotating plate 460 to bring the suction cups 463 into contact with the lower surface of the ring frame 94 of the frame set 99.

[0136] The suction source (not illustrated) is activated to generate suction forces that are transmitted to the suction cups 463, causing the suction cups 463 to attract the lower surface of the ring frame 94 under suction, whereupon the frame set 99 is held under suction by the frame set turner 46. Then the frame feeder 30 releases the frame set 99 and is spaced away from it.

[0137] The reversing motor 465 is then activated to rotate itself relative to the shaft 464 by a predetermined angle, which reverses the base 461 and the frame assembly 99, which are held by suction by the four suction cups 463. The end face 903 of the wafer 90 with the protective band 95 attached to it is facing upwards, and the frame assembly 99 is positioned under the reversing plate 460 and held by suction against it.

[0138] The peeling table 436 is moved in the -Y direction by the ball screw mechanism 432 and positioned under the turntable 460, which holds the frame set 99 against it by suction. Then, the turntable lifting / lowering mechanism 467 lowers the turntable 460 to place the frame set 99 onto the peeling table 436, while the center of the wafer 90 of the frame set 99 and the center of the peeling table 436 are essentially aligned. The frame set 99 is then held against the peeling table 436 by suction. The turntable 460 is lifted from the frame set 99, and the end face 903 of the wafer 90 of the frame set 99, which is protected by the protective band 95, is facing upwards.

[0139] The controller 17 controls the peeling element movement mechanism 435 to move the peeling element 431 along one of the Y-axis directions and also controls the ball screw mechanism 432 to move the peeling table 436 along one of the Y-axis directions, positioning the outer circumferential section of the protective band 95 of the wafer 90, which is attached to the end face 903 (i.e., a component surface), directly under the peeling element 431. The peeling element 431 then attaches the peeling band to the protective band 95. The peeling element 431 and the peeling table 436 are moved relative to each other along the Y-axis directions, peeling the protective band 95 from the end face 903 from an outer circumferential edge of the wafer 90 towards its center and then from the center to an opposite outer circumferential edge of the wafer 90.

[0140] After the protective tape 95 has been completely removed from the wafer 90 of the frame set 99, the peeling table 436 is positioned under the turning plate 460 of the frame set turner 46. The wafer 90 of the frame set 99 has its back side 904, which is protected by the separating tape 93 and is facing downwards.

[0141] The rotating plate 460 is set to a position in which the four suction cups 463 are facing downwards. The rotating plate lifting / lowering mechanism 467 lowers the rotating plate 460 to bring the suction cups 463 into contact with the upper surface of the ring frame 94 of the frame set 99. The frame set 99 is then held under suction by the frame set turner 46, and the release table 436 releases the frame set 99.

[0142] The reversing plate 460 is then flipped to invert the frame set 99, which is held by suction by the four suction cups 463. This allows the frame feeder 30 to hold the frame set 99 by suction from above. The frame feeder 30 is rotated to an angular position above the frame set 99, which is held by suction by the reversing plate 460. For example, the reversing plate lifting / lowering mechanism 467 raises the reversing plate 460 to bring the side of the ring frame 94, to which the separating belt 93 is attached, into contact with the suction cups 303 of the frame feeder 30. With the center of the frame set 99 and the center of the feeder plate 300 essentially aligned, the frame set 99 is then held by suction by the frame feeder 30. The reversing plate 460 is lowered away from the frame set 99.

[0143] The frame feeding mechanism 30 can hold the frame set 99 directly under suction, while the end face 903 of the wafer 90 is facing upwards on the peeling table 436.

[0144] Then the controller 17 executes a control operation to control the frame holder 21 of the robot 2 in order to receive the frame set 99 held by the frame feed mechanism 30. In particular, the controller 17 controls the robot 2 to cause the holder's horizontal movement mechanism 23 to rotate the frame holder 21 and also to cause the frame set 99 to be held by the frame feed mechanism 30. Fig. Figure 3 illustrates the pivoting mechanism 306 of the frame feeder 30. This mechanism rotates the feeder plate 300, which holds the frame set 99 under suction, positioning the frame set 99 and the frame holder 21 relative to each other in a horizontal plane. The frame holder 21 then holds the ring frame 94 of the frame set 99 in the same way as it holds the ring frame 94 in the frame cassette 61 as described above. Therefore, a description of how the frame holder 21 holds the ring frame 94 of the frame set 99 is omitted. After the frame holder 21 has held the ring frame 94, the frame feeder 30 releases the ring frame 94.

[0145] Then, for example, the controller 17 executes a control operation to store the frame set 99, held by the frame holder 21 of the robot 2, in the frame cassette 618, which is empty, on the second frame cassette platform 132. This means that the controller 17 executes a control operation to control the frame holder 21 of the robot 2 in order to store the frame set 99, held by the frame holder 21 of the robot 2, in the frame cassette 618 on the second frame cassette platform 132.

[0146] The in Fig.The illustrated electrically driven carriage 249 moves the robot 2 in the +X direction and positions the robot 2 in front of the frame cassette 618. The holder horizontal movement mechanism 23 rotates the frame holder 21 to an angular position in front of the opening in the frame cassette 618. The holder vertical movement mechanism 24 positions the frame holder 21 to be handled at the level of one of the shelves of the frame cassette 618. The frame holder 21 enters the frame cassette 618, places the frame set 99 on the shelf, and is retracted from the frame cassette 618.

[0147] The control unit 17 can perform a control operation to individually store the frame set 99 held by the frame holder 21 of the robot 2 on the empty storage tray 615 of the frame cassette 61, which is placed on the first frame cassette platform 131.

[0148] When the frame sets 99 are stored individually on the trays of the frame cassette 618 and the frame cassette 618 becomes full, the OHT mechanism (not illustrated) moves the frame cassette 618 from the second frame cassette stage 132 to a cutting device or similar (not illustrated). The cutting device then divides a wafer 90 of a frame set 99, which has been removed from the frame cassette 618, into individual component chips.

[0149] As described above, the tape feeder 1, in accordance with the present embodiment, includes the first frame cassette 131 for placing the frame cassette 61, which is capable of storing ring frames 94, the robot 2, which has the frame holder 21 for holding a ring frame 94 and is capable of removing a ring frame 94 from the frame cassette 61 on the first frame cassette stage 131 or of storing a frame set 99 in the frame cassette 618, and the control unit 17.The controller 17 executes a control operation to control the frame holder 21 of the robot 2 to hold a ring frame 94 and remove it from the frame cassette 61 on the first frame cassette stage 131, a control operation to control the frame feeder mechanism 30 to receive the ring frame 94 held by the frame holder 21 of the robot 2, a control operation to control the frame holder 21 of the robot 2 to receive the frame set 99 held by the frame feeder mechanism 30, and a control operation to control the frame holder 21 of the robot 2 to store the frame set 99 held by the frame holder 21 of the robot 2 in the frame cassette 61. The tape feeder 1 does not need to use a frame storage system and does not need to rely on the operator to replenish a frame storage system with ring frames 94.As disclosed in particular in German patent applications JP 2015-82588A and JP 2019-140217A, it was previously common practice for an AGV mechanism, an OHT mechanism, or similar device to feed a wafer cassette 62 containing wafers 90 and a cassette containing frame sets 99, each comprising a ring frame 94 and a wafer 90 integrally connected by a separating belt 93. In accordance with the embodiment, the cassette, which was previously used only to feed frame sets 99, is given a new application, and the AGV or OHT mechanism is used to feed the frame cassette 61, which stores the ring frames 94, and to feed the ring frames 94 to the belt feeder 91. Consequently, the usual process of refilling ring frame 94, which is performed by the operator, is rendered unnecessary.

[0150] Since the controller 17 further executes a control operation to store the frame set 99, held by the frame holder 21 of the robot 2, in the frame cassette 618, which is placed on the second frame cassette platform 132, or a control operation to store the frame set 99, held by the frame holder 21 of the robot 2, in the frame cassette 61 on the first frame cassette platform 131, it is also possible to store a frame set 99 with a separating belt 93 attached to it in the frame cassette 61, which is supplied with ring frames 94, or in the frame cassette 618, which is empty, and to feed the frame cassette 61 or the frame cassette 618 from the belt feeder 1 using the AGV mechanism or the OHT mechanism. Consequently, the operator does not have to receive the frame sets 99.

[0151] Furthermore, the tape feeder 1 includes the wafer cassette stage 133 for placing the wafer cassette 62, which contains a wafer 90. The robot 2 includes the wafer holder 22 for holding a wafer 90, and the controller 17 performs a control operation to control the wafer holder 22 of the robot 2 to hold a wafer 90 stored in the wafer cassette 62 on the wafer cassette stage 133 and to remove the wafer 90 from the wafer cassette 62, and a control operation to control the wafer feeder 5 to receive the wafer 90 held by the wafer holder 22 of the robot 2 and to feed the wafer 90 to the wafer table 478. It is thus possible to produce a frame set 99, comprising a wafer 90 and a ring frame 94, more smoothly in the tape feeder 1.

Claims

[1] Band attacher (1) which features: a frame table (477) for holding a lower surface of a ring frame (94) which in itself has a defined opening; a wafer table (478) for holding a lower surface of a wafer (90) in the opening in the ring frame (94); a frame feeding mechanism (30) for feeding a ring frame (94) to the frame table (477); a wafer feeding mechanism (5) for feeding a wafer (90) to the wafer table (478); a tape fastening mechanism (47) for attaching a separating tape (93) to a ring frame (94) and a wafer (90) and integrally connecting the ring frame (94) and the wafer (90) together to convert them into a frame set (99); a frame cassette stage (131, 132) for placing a frame cassette (61, 618) on it, which is capable of storing ring frames (94); a robot (2) having a frame holder (21) for holding a ring frame (94) and being able to remove a ring frame (94) from the frame cassette (61, 618) placed on the frame cassette stage (131, 132) or to store the frame set (99) in the frame cassette (61, 618) placed on the frame cassette stage (131, 132); and a control unit (17), where the controller (17) executes: a control process for controlling the frame holder (21) of the robot (2) to hold a ring frame (94) and to remove it from the frame cassette (61, 618) on the frame cassette stage (131, 132), a control operation to control the frame feed mechanism (30) to receive the ring frame (94) held by the frame holder (21) of the robot (2), a control operation to control the frame holder (21) of the robot (2) to receive the frame set (99) held by the frame feed mechanism, and a control process for controlling the frame holder (21) of the robot (2) in order to store the frame set (99) held by the frame holder (21) of the robot (2) in the frame cassette (61, 618) on the frame cassette stage (131, 132). [2] Band attacher (1) which features: a frame table (477) for holding a lower surface of a ring frame (94) which in itself has a defined opening; a wafer table (478) for holding a lower surface of a wafer (90) in the opening in the ring frame (94); a frame feeding mechanism (30) for feeding a ring frame (94) to the frame table (477); a wafer feeding mechanism (5) for feeding a wafer (90) to the wafer table (478); a tape fastening mechanism (47) for attaching a separating tape (93) to a ring frame (94) and a wafer (90) and integrally connecting the ring frame (94) and the wafer (90) together to convert them into a frame set (99); a first frame cassette stage (131) for placing a frame cassette (61) on it, which is capable of storing ring frames (94); a second frame cassette stage (132) that is not the first frame cassette stage (131); a robot (2) which has a frame holder (21) for holding a ring frame (94) and is able to remove a ring frame (949) from the frame cassette (61) placed on the first frame cassette stage (131) or to store the frame set (99) in the frame cassette (61) placed on the second frame cassette stage (132), and a controller (17), where the controller (17) executes: a control process for controlling the frame holder (21) of the robot (2) to hold a ring frame (94) and remove it from the frame cassette (61, 618) on the first frame cassette stage (131), a control operation to control the frame feed mechanism (30) to receive the ring frame (94) held by the frame holder (21) of the robot (2), a control operation to control the frame holder (21) of the robot (2) to receive the frame set (99) held by the frame feed mechanism (30), and a control process to control the frame holder (21) of the robot (2) in order to store the frame set (99) held by the frame holder (21) of the robot (2) in the frame cassette (618) on the second frame cassette stage (132). [3] Band applicator (1) according to claim 1 or 2, further comprising: a wafer cassette platform (133) for placing a wafer cassette (62) on it, which is capable of storing wafers (90), wherein the robot (2) has a wafer holder (22) for holding a wafer (90) thereon, and the control (17) executes: a control process for controlling the wafer holder (22) of the robot (2) to hold a wafer (90) stored in the wafer cassette (62) on the wafer cassette platform (133), and to remove the wafer (90) from the wafer cassette (62), and a control process for controlling the wafer feeding mechanism (5) to receive the wafer (90) held by the wafer holder (22) of the robot (2) and to feed the wafer (90) to the wafer table (478).

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