Device and method for bonding components and substrates

Abstract

Device (1) for bonding one or more components and one or more substrates (3), the device comprising: • a bonding station (5) for bonding the components to the substrates, wherein the components are to be bonded to the substrates at the bonding station; • a transport device (7) for transporting the substrates along a path (8) from one or more loading stations (4) via the bonding station to one or more unloading stations (6), the transport device comprising: ◯ a carriage (11) having a flat holder (12) for receiving the substrates; ◯ a carriage moving device (13) for moving the carriage along the track (8); and ◯ a hold-down device (14) for holding the substrates on the holder; • one or more loading stations (4) for loading the substrates onto the carriage, which comprise one or more feed devices (9) for pulling the substrates onto the carriage holder; and • one or more unloading stations (6) for unloading the substrates after the components have been bonded thereto at the bonding station, comprising one or more extraction devices (10) for removing the substrates from the holder of the carriage.

Description

Technical area

[0001] The present disclosure relates to an apparatus for bonding one or more components, for example NAND and DRAM memory chips, and one or more substrates, as well as a method for bonding one or more components and one or more substrates using such an apparatus. BACKGROUND

[0002] Different types of chip bonding systems are available for different semiconductor market segments. For example, there are dedicated systems for thin chips with highly specialized components such as chip ejection systems, bondhead tools, and heaters on the substrate handlers.

[0003] The substrate feeders are typically based on a gripper feed principle, where the substrates or strips are moved to the processing positions via a series of gripper feeds across the substrate feeder. To do this, the grippers must grip the substrate at the side and pass it from one gripper to the next. This is a state-of-the-art solution that enables parallel processing of more than one substrate on the same substrate handler.

[0004] Typically, in today's production, substrates are pushed from a substrate input magazine onto the substrate handler. A roller drive is used to move them to a substrate output magazine.

[0005] Since the feeding concept allows the parallel handling of more than one substrate on the substrate handler and no chip sorting functionality is required, common die bonders are equipped with only one substrate handler and still achieve a reasonable throughput.

[0006] US 2013 / 0008599 A1, for example, discloses an apparatus for mounting semiconductors, comprising a dispensing station configured to apply adhesive parts to the substrate locations of a substrate, a bonding device configured to mount semiconductor chips onto the substrate locations, and a transport device configured to transport the substrates along a transport path.

[0007] KR 102106884 B1, for example, discloses an apparatus and a method for transporting a substrate from a substrate receiving body of a loader part to a transport track, wherein a bonding controller of the apparatus sends the substrate to a substrate receiving body of an unloader part as a chip mounting substrate when the bonding of all chips to the substrate by a bonding head is completed, and returns the substrate to the substrate receiving body of the loader part as a chip mounting substrate when the bonding of all chips to the substrate by the bonding head is not completed.

[0008] Furthermore, JP 2022 / 013070 A discloses an apparatus for manufacturing an article, comprising: a feeding part for feeding a workpiece; an assembly component holding section capable of holding a plurality of assembly components; an assembly component sort information storage section storing sort information for each assembly component held by the assembly component holding section; a housing part accommodating the workpiece on which each assembly component is mounted; and a buffer section storing the workpiece on which each assembly component is mounted on only a part of a mounted portion of the workpiece.

[0009] WO 2022 / 097415 A1 further discloses the feeding of a feed element from a rotor to a feed position, and the fed element, after being loaded with a workpiece, is conveyed to an unloader. If a workpiece supply source no longer has any workpieces of the type to be fed before the workpiece is mounted on the fed element, this fed element is conveyed to a standby position by a shuttle. Another fed element is conveyed to the vacated feed position.

[0010] However, the common substrate feeder design on current substrate handling systems is unsuitable for substrates with a stiffness below a certain value. With each clamping, the risk of damaging the tape or the chips already attached in a previous step increases. Furthermore, the tape must be held down at each processing position before processing and released again after processing. This is typically done using a vacuum, i.e., a pressure below atmospheric pressure, and a mechanical hold-down tool, both of which exert a physical impulse or shock on the substrate, which could damage the tape or the chips attached to it.

[0011] In some conventional systems, the substrate is moved to or onto a heater more than once, resulting in multiple heating and cooling cycles for the substrate.

[0012] This is particularly relevant for systems that rely on intermediate storage such as a magazine to store a substrate for bonding chips of a different bin code, will impose more than one heating and cooling cycle on the substrates each time a substrate is loaded and unloaded from the carriage.

[0013] Every time a substrate is clamped, released, heated, cooled, or otherwise manipulated, its physical properties, such as surface flatness, can change. Beyond a certain degree of change, the risk of damage to the substrate increases, for example, through collision with a mechanical part of the system or a magazine.

[0014] In addition, complex mechanical setup is required when changing products or creating a new recipe with current substrate handling concepts. Small fluctuations in the material or minor misadjustments during setup often lead to damaged or destroyed belts due to collisions with mechanical parts during loading, transporting, guiding, holding down, and unloading.

[0015] Common die bonders with thin-die capability typically have a single substrate handler and therefore do not offer die sorting from wafer to substrate based on their quality classification (bin code). Bin code sorting must be performed either separately by a dedicated upstream facility that sorts wafers with mixed bin codes onto carriers containing only dies with one bin code each, or alternatively by a multi-pass process on one or more conventional die bonders, producing only dies with one bin code in each pass. Both solutions have significant disadvantages in terms of cost-effectiveness, the need for expensive cleanroom space, and they increase the risk of damage due to additional material handling.

[0016] Furthermore, since the current systems with single-strip handlers do not allow chip sorting, additional investments are required so that this can be provided in an upstream step on a separate system.

[0017] In addition, conventional substrate handlers require long and risky product setups and changeovers due to the complicated mechanical setup mentioned above.

[0018] An object of the present invention is to provide an apparatus and / or a method for bonding components and substrates, wherein relatively thin substrates (e.g. < 100 µm) for bonding components, such as semiconductor chips, can be safely handled.

[0019] An object of the invention is to provide an apparatus and / or method for bonding components and substrates that enables the sorting of different bin codes while achieving a relatively high throughput.

[0020] Another object of the invention is to provide an apparatus and / or method for bonding components and substrates, whereby a reduction in operating costs is achieved.

[0021] Another object of the invention is to provide an apparatus and / or method for bonding components and substrates, wherein a relatively higher overall operating time is achieved. SUMMARY OF THE INVENTION

[0022] According to the present invention, there is provided an apparatus for bonding one or more components and one or more substrates, the apparatus comprising: - a bonding station for bonding the components to the substrates, wherein the components are to be bonded to the substrates at the bonding station; - a transport device for transporting the substrates each time along a path from one or more loading stations via the bonding station to one or more unloading stations, the transport device comprises: ◯ a carriage having a flat support for the substrates; ◯ a device for moving the carriage along the track; and - a hold-down device for holding the substrates on the holder; - one or more loading stations for loading the substrates onto the carriage, comprising one or more feed devices for pulling the substrates onto the carriage holder; and - one or more unloading stations for unloading the substrates after the components have been bonded thereto in the bonding station, comprising one or more extraction devices for removing the substrates from the holder of the carriage.

[0023] Since the one or more substrates are drawn in at the loading stations and pulled out at the unloading stations and not pushed in or out, and the one or more substrates are moved along the entire path by the carriage, very thin substrates can be handled (e.g., having a thickness of < 100 µm) without or at least with a reduced risk of damaging the substrates.

[0024] Because the substrates are held by the same carriage between loading and unloading, and every process step (e.g., cleaning, bonding, post-bonding inspection) is performed on this carriage, there is no physical strain for steps such as re-clamping the substrate or transferring it to another carrier. Additionally, the time required to attach and detach the hold-down function at each processing position is eliminated, and substrate transfer is significantly reduced.

[0025] In addition, systems that rely on a buffer storage such as a magazine to store a substrate for bonding chips of a different bin code result in more than one heating and cooling cycle for the substrates each time a substrate is loaded and unloaded from the carriage.

[0026] The reduced cost of a single transport device enables the configuration of, for example, four or more transport devices per system to hold multiple containers at high throughput, thus offering competitive costs per bond.

[0027] In addition, the device described above allows the choice of a speed-optimized point-to-point pick-up and loading system instead of a heavy and slower gantry alternative.

[0028] One embodiment relates to a device as mentioned above, wherein the loading stations comprise one or more input magazines for storing the substrates therein, wherein the feed devices are configured to pull the substrates from the input magazines onto the holder of the carriage; and / or wherein the unloading stations comprise one or more output magazines for storing the substrates therein after the components have been bonded thereto at the bonding station, wherein the pull-out devices are configured to pull the substrates from the holder of the carriage into the output magazines.

[0029] As already mentioned, pulling the often extremely thin substrates from the input magazines directly onto the carriages and from the carriage directly into the output magazines reduces the risk of substrate damage and thus ensures a relatively high yield. Conventional loading and unloading modules are based on push rods or roller drives, which are more likely to cause belt jams.

[0030] One embodiment relates to a device mentioned above, wherein the retraction devices comprise: • one or more feed grippers (15) for gripping a front end (25) of the substrates (3), viewed in a direction of movement (X) along the path, for example an end (26) facing the carriage (11); and • one or more movement devices (16) for the grippers for moving the grippers back and forth in a direction of movement parallel to the flight path; and / or wherein the pull-out devices (10) comprise: • one or more pull-out grippers (27) for gripping a front end (25) of the substrates, viewed in a direction of movement along the path; and • one or more extendable gripper moving devices (28) for moving the extendable grippers back and forth in a direction of movement parallel to the trajectory path.

[0031] One or more sensors can be provided to detect successful loading and / or unloading.

[0032] Preferably, the grippers are movable along the path in the X-direction, preferably at least as far / long as the maximum length of the substrate / belt. The grippers are preferably also movable in the vertical direction or in the Z-direction so that the substrate / belt can be moved without collision. The feed grippers can also have a loading position and a parking position.

[0033] One embodiment relates to an aforementioned device, wherein, when the loading station comprises input magazines for storing substrates, the movement devices for the grippers are configured to move the grippers in a movement direction parallel to the path toward and away from the input magazines.

[0034] One embodiment relates to a device mentioned above, wherein the retraction device comprises: - a fixed frame; the means for moving the gripper comprising retracting: - a guide mounted on the frame and extending in the direction of travel, the retracting grippers being mounted on the guide so that they are movable over the carriage during use; and - a drive unit with which the grippers can be moved along the guide.

[0035] In one embodiment, the stationary frame extends over the track adjacent to the input magazines so that the carriage is movable under the frame; The feed grippers are suspended from the guide in such a way that they can move above the carriage when they are under the frame. This is a very robust way to position and move the feed grippers.

[0036] Similar to the infeed grippers, the outfeed grippers are preferably movable along the path in the X direction, preferably at least as far / long as the maximum substrate / tape length. The extendable grippers are preferably also movable in the Z direction, so that the substrate / tape can be subsequently moved while on the carriage without colliding with the extendable grippers. The extendable grippers can also have a loading position and a parking position.

[0037] One embodiment relates to the aforementioned device, wherein, when the unloading stations comprise output magazines for storing the substrates therein, the pull-out gripper movement devices are configured to move the pull-out grippers through the output magazines in a movement direction parallel to the trajectory path. Thus, the substrate can be pulled through the output magazines to be stored therein without the pull-out gripper movement devices being in the way, so to speak.

[0038] An embodiment relates to a device mentioned above, wherein the extraction device, when the loading stations comprise input magazines for storing substrates: - a fixed frame on one side of the output magazines facing away from the bonding station; wherein the means for moving the extendable gripper comprise: - a guide attached to the frame and extending in the direction of movement,

[0039] One embodiment relates to an aforementioned device, which also comprises: - a heating device for applying heat to the substrates when they are carried by the holder, wherein the heating device is arranged to transfer the heat to the substrates via the holder.

[0040] Such a heater can provide a constant temperature, but can also be programmed to follow a predefined temperature profile. Such a heater function may be required, for example, for bonding, where a die-attached film (DAF) must reach a specific temperature to melt and establish the adhesion required for processing.

[0041] In addition, the heater could consist of several heating zones, allowing individual temperature settings for each zone.

[0042] One embodiment relates to an aforementioned device, which also comprises: • one or more vertical movement devices that allow vertical movement of the input magazines with the carriage support to minimize the risk of damage.

[0043] This allows the substrate to be gently pulled onto the holder without risk of damage. Preferably, the vertically movable input magazines allow the substrates to be flush with the holder.

[0044] One embodiment relates to an aforementioned device, wherein the retracting gripper and / or the extracting gripper are arranged to grip the end of the substrates mechanically or are arranged to grip the end of the substrates using a negative pressure.

[0045] One embodiment relates to a device as mentioned above, wherein the hold-down device comprises a holding element on the upper side of the support surface, wherein the holding element is movable towards and away from the support surface and is configured to engage at least parts of one or more peripheral edges of the substrate in a lower, holding position thereof and in a higher, inactive position thereof is positioned at a distance above or to the side (in the case of a lateral, rotatable movement) of the support surface.

[0046] The holding element may, for example, comprise mechanical, electromechanical, magnetic or hydraulic / pneumatic hold-down means.

[0047] One embodiment relates to a device as mentioned above, wherein the holding element comprises corresponding passages on opposite transverse edges of the carriage, which passages are configured such that the feed devices can extend through them in a horizontal direction when the substrates are pulled onto the holder of the carriage, and / or such that the extraction devices can extend through them in a horizontal direction when the substrates are pulled off the holder of the carriage, at least in the inactive position of the holding element.

[0048] In one embodiment, the holding element is frame-shaped and has one or more holding frame parts, each arranged to contact one or more corresponding edges of the substrates along at least part of the edge length.

[0049] In one embodiment, the holding element comprises a plurality of holding pins, each holding pin being positioned on the holding element such that it engages an edge of the substrates in the holding position. The pins can be spring-loaded.

[0050] One embodiment relates to an aforementioned device, wherein the device for moving the carriage comprises a linear guide and a drive for driving the carriage such that it is movable along the linear guide, wherein the drive preferably comprises a belt drive.

[0051] Such a configuration is relatively small, requires comparatively little space and is relatively inexpensive.

[0052] One embodiment relates to a device as mentioned above, wherein the holder is rectangular and is designed to hold the entire surface of the substrates.

[0053] One embodiment relates to an aforementioned device, wherein the hold-down device is arranged to hold the substrates on the holder by means of a negative pressure.

[0054] The hold-down device can, for example, comprise holes or porous material to exert negative or positive pressure on the substrates, as well as air channels connected to at least one negative pressure generator and / or a compressed air source. Such negative pressure contributes to effectively holding a substrate on the surface. When the substrates are loaded onto and / or removed from the carriage, positive pressure can also be temporarily applied to further reduce friction between the substrates and the support surface.

[0055] One embodiment relates to an aforementioned device, wherein the hold-down device comprises channels provided in the carriage, wherein the channels are configured such that a negative pressure for holding the substrates on the holder can be applied through the channels.

[0056] Preferably, in use, the negative pressure is initially active in a central area of ​​the holder and then spreads to the edges of the holder in order to achieve a uniform "hold down" which increases the yield.

[0057] An embodiment relates to a device as mentioned above, wherein the components are of a type selected from the list consisting of semiconductor chips, dies, semiconductor packages, integrated circuits, optical elements, electronic elements, electro-optical elements, electromechanical elements, or any combination thereof; and / or wherein the substrates are strip-shaped and preferably have a length-to-width ratio of three to one or two to one.

[0058] One embodiment relates to a device as mentioned above, wherein the device comprises two or more of said transport devices and has individual loading stations and individual unloading stations for each of the two or more transport devices.

[0059] Such a device allows for optimal configuration of the “lanes” according to the customer’s production requirements: the number of lanes is formed based on the number of quality levels (bin codes) to ensure excellent throughput, improved operating costs and minimal space requirements.

[0060] One embodiment relates to a device as mentioned above, wherein the number of transport devices corresponds to the number of container codes delivered plus one.

[0061] Another aspect of the invention relates to a method for bonding one or more components and one or more substrates using an apparatus as mentioned above, comprising: - Loading the substrates onto the carriage at the loading stations by pulling the substrates onto the carriage holder using the pull-in devices; - to transport the substrates along a track from the loading stations to the bonding station using the transport device; - Bonding the components to the substrates in the bonding station; - each time the substrates are transported by the transport device along a path from the bonding station to the unloading stations after the components have been bonded to them at the bonding station; and - Unloading the substrates from the carriage at the unloading stations by pulling the substrates off the carriage holder using the pull-out devices.

[0062] One embodiment relates to an aforementioned method, wherein a pre-bond inspection and / or pre-bond cleaning and / or a post-bond inspection and / or post-bond cleaning takes place before or after bonding at the bonding station.

[0063] The modules for inspection and / or cleaning before and after bonding are preferably arranged in the direction of movement (X) in order to avoid having to remove the substrates from the holder and to keep the hold-down device activated.

[0064] Embodiments of devices according to the invention are analogously permissible for embodiments of methods according to the invention, and vice versa. Likewise, effects of embodiments of the devices according to the invention are also permissible for corresponding embodiments of methods, and vice versa. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] The invention is explained in more detail below with reference to the embodiments shown in the drawings. Fig. 1a shows an exemplary embodiment of a device according to the invention with four transport devices; Fig. 1b shows an exemplary embodiment of a loading station, for example the one shown in Fig. 1a shows a loading station, wherein a substrate is loaded from an input magazine onto a holder of a carriage by means of a feed device; Fig. 1c shows an exemplary embodiment of a loading station, for example the one shown in Fig. 1b shows a loading station, wherein a substrate was loaded from an input magazine onto a holder of a carriage by means of a feed device; Fig. 2a shows an exemplary embodiment of a device according to the invention, for example the one shown in Fig. 1a, wherein a substrate is movable along the path of the device; Fig. 2b shows an exemplary embodiment of a loading station, for example the one shown in Fig. 2a, wherein a substrate is moved along the path after the substrate has been loaded from an input magazine onto a holder of a carriage by a feed device; The Fig. 3a and Fig. 3b show embodiments of a discharge station, for example the one shown in Fig. 2a, wherein a substrate is unloaded from a holder of a carriage into an output magazine by means of an extraction device; Fig. 3c shows an exemplary embodiment of a discharge station, for example the one shown in the Fig. 2a, Fig. 3a and Fig. 3b shows an unloading station, wherein a substrate has been unloaded from a holder of a carriage into an output magazine by an extractor; and Fig. 4 shows an exemplary embodiment of a carriage movement device with a linear guide and a drive for the carriage, so that the carriage can be moved along the linear guide. DETAILED DESCRIPTION

[0066] The Fig. 1a - 4 are discussed in context. As already mentioned, Fig. 1a shows an exemplary embodiment of a device 1, in particular a die bonder, according to the invention with four transport devices (or “transport tracks”) 7. In particular, Fig. 1a a device 1 for bonding one or more components, for example NAND and DRAM memory chips, to one or more substrates (in the other figures, such as Fig. 1b, shown with reference number 3). The device 1 comprises a bonding station 5 for bonding the components (e.g., ultra-thin chips with a thickness of <15 µm) to the substrates, wherein one or more of the components are to be bonded to each of the plurality of substrates at the bonding station 5. The transport device 7 can alternatively or additionally also comprise an inspection station instead of a bonding station 5. The bonding station 5 can comprise two point-to-line placement systems capable of performing the chip sorting process without significant productivity losses or, alternatively, of producing the chip sorting process without the chip sorting process with a relatively high throughput compared to, for example, currently available NAND die bonding systems. Preferably, processing can also be performed after bonding, for example, cleaning, inspection, or heating.After unloading the substrate 3 at the unloading station 6, the holder 12 can also be cleaned or inspected. The device 1 can also be provided with advanced inspection features, such as UVI, crack detection, airborne and in-situ particle detection, a touchscreen, etc.

[0067] Each transport device 7 is configured to transport one of the plurality of substrates along a path 8 from a loading station 4 via the bonding station 5 to an unloading station 6 in a direction of movement X. Each transport device 7 comprises a carriage 11 with a flat holding surface 12 for holding the substrate thereon, a carriage movement device 13 for moving the carriage 11 along the path 8 (as in Fig. 4 more clearly shown) and a holding-down device (in the other figures, for example in Fig. 1b, shown with the reference number 14) for holding the substrate on the holding surface 12. The transport device 7 further comprises a loading station 4 for loading the substrates onto the carriage 11, which comprises a pull-in device 9 for pulling the one of the plurality of substrates onto the holder 12 of the carriage 11, and an unloading station 6 for unloading the substrates after one or more of the components have been bonded thereto at the bonding station 5, which comprises a pull-out device 10 for pulling the one of the plurality of substrates from the holder 12 of the carriage 11. Pulling the often ultra-thin substrates out, e.g., from an input magazine and into an output magazine (as shown in the other figures) is important to ensure a relatively high yield. Conventional loading and unloading modules are based on push rods or roller drives, in which jamming of belts / substrates 3 occurs relatively frequently.

[0068] The main factors influencing the number of transport devices 7 to be used are the number of chip quality classifications (bin codes / types) on the wafer and the throughput target. The holder 12 is preferably designed with a certain rigidity, for example, with a load capacity of at least 50 N, for example, at least 100 N.

[0069] The loading station 4 may comprise an input magazine 20 for storing a plurality of the substrates 3 therein, wherein the feed device 9 is configured to direct one of the plurality of substrates from the input magazine 20 directly onto the holder 12 of the carriage. Analogously, the unloading station 6 may comprise an output magazine 21 for storing the plurality of substrates therein after the one or more of the components have been bonded thereto at the bonding station 5, wherein the pull-out device 10 is configured to pull the one of the plurality of substrates from the support surface 12 of the carriage 11 and directly into the output magazine 21.

[0070] Although in Fig. 1a, four transport devices 7 are shown, the device 1 can generally comprise two or more of the aforementioned transport devices 7, for example two to four such transport devices 7, each of which has its own feed device 9 and its own pull-out device 10. However, one option could be to use one feed device 9 for more than one input magazine 20 by incorporating a Y-axis into the gripping device. The number of transport devices 7 can correspond to the number of container codes / qualities / types supplied or the number of container types supplied plus one. If three container types are supplied, the number of transport devices 7 can be three or four, for example. Preferably, each transport device / lane 7 processes a single container type. Preferably, one container type is used per substrate 3.Analogously, one container type is preferably used per loading station 4 and / or unloading station 6 (for example, one container type per input magazine 20 and / or output magazine 21). The bonding station 5 can comprise one or more chip ejectors, a first (left) picker, a second (right) picker, a first (left) transfer table and a second (right) transfer table, a first (left) bonding arm, and a second (right) bonding arm (all not shown for reasons of clarity). If, for example, three container codes are supplied, a first transport device / track 7 can process the first container type, a second transport device / track 7 can process the second container type, and a third transport device / track 7 can process the third container type. A first substrate 3, which is assigned to the first container type, can be located relatively "left" on the track 8 of the first transport device 7 (relatively closer to the loading station 4), and a second orA third substrate 3, which is assigned to the second or third bin type, can have progressed further along the track 8 and therefore be located relatively "to the right" on the track 8 (relatively closer to the unloading station 6). The chip ejector can then feed a chip with the first bin type to the first picker, the first transfer table, and the first bonding arm, wherein the first bonding arm loads the chip with the first bin type onto the associated substrate 3 of the first transport device 7. The chip ejector can then also feed a chip with the second or third bin type to the second picker, the second transfer table, and the second bonding arm, wherein the second bonding arm loads the chip with the second or third bin type onto the associated substrate 3 of the second or third transport device 7. In this way, an efficient multi-lane bonding process with a relatively high throughput can be achieved.

[0071] Fig. 1b shows an exemplary embodiment of a loading station 4, for example the one shown in Fig. 1a, wherein a substrate 3 is loaded from an input magazine 20 onto a holder 12 of a carriage 11 by means of a feed device 9. As in Fig. 1b, the feed device 9 can comprise a feed gripper 15 which grips a front end 25 of the substrate 3, viewed in a direction of movement (X) along the path 8, i.e. an end 26 facing the carriage 11, and a feed gripper movement device 16 with which the feed gripper 15 can be moved back and forth in a direction of movement parallel to the path 8, in particular towards and away from the input magazine 20. The feed gripper 15 can comprise a mechanical gripper and / or a suction tip. The input magazine 20 and / or the output magazine 21 can be moved out of / removed from a respective transport device / path 7 using, for example, a transfer robot.

[0072] The feed device 9 may further comprise a stationary frame 17. The feed gripper movement device 16 may comprise a guide 18 mounted on the frame 17 and extending in the direction of movement (X), with the feed gripper 15 mounted on the guide 18 such that it is movable over the carriage 11 during use. A drive unit for moving the gripper 15 along the guide 18 may also be provided (not shown). The feed device 9 may comprise sensors for detecting the successful feed of the substrate 3 (e.g., mass flow sensors or distance sensors).

[0073] The device 1 may further comprise a heating device 23 for supplying heat to the substrate 3 when it is held by the holder 12. The heating device 23 is preferably arranged to supply heat to the substrate 3 via the holder 12. The heating device 23 may comprise heating wires, temperature sensors, etc., embedded in the holder or directed directly beneath it. The heating device 23 may have dimensions of, for example, 300 mm (in the direction of movement) x 100 mm (in the transverse direction). The holder 12 preferably also includes a cooling function.

[0074] The device 1 may also comprise a (schematically shown) vertical movement device 32 for moving the input magazine 20 vertically such that the one of the plurality of substrates 3 to be pulled out of the input magazine 20 by the feed device 9 is moved to a vertical plane that is flush with the holder 12 of the carriage 11.

[0075] The feed gripper 15 (and / or the feed gripper 27, as shown in Fig. 3b) may be arranged to grip the end 25 of the substrate 3 mechanically, or may be arranged to grip said end 25 of the substrate 3 using a negative pressure, for example a vacuum.

[0076] The hold-down device 14 may comprise a holding element 22 on the upper side of the holder 12, wherein the holding element 22 is movable towards and away from the holder 12 and is configured such that, in a lower, holding position, it engages at least parts of one or more peripheral edges 33 of the substrate 3 and, in a higher, inactive position, is positioned at a distance above the holder. The holding element 22 may comprise corresponding passages 24a, 24b on opposite transverse edges 34 of the carriage 11, which are configured such that the feed device 9 can extend through them in a horizontal direction when it pulls the substrate 3 onto the support surface 12 of the carriage 11, and / or such that the extraction device 10 can extend through them in a horizontal direction when it pulls the substrate 3 from the support surface 12 of the carriage 11 (as in the Fig. 3b and Fig. 3c), at least in the inactive position of the holding element 22.

[0077] Preferably, the support surface 12 is rectangular and designed to support the entire surface of the substrate 3.

[0078] The hold-down device 14 can be arranged such that it holds the substrate 3 firmly on the support surface 12 with the aid of a negative pressure, for example a vacuum. The hold-down device 14 can comprise channels 35 provided in the carriage 11. The channels 35 are preferably designed such that a negative pressure for holding the substrate 3 on the support surface 12 can be applied through the channels 35, specifically such that the negative pressure, during use, initially takes effect in a central region 36 of the support surface 12 and then spreads to the edges 37 of the support surface 12. In addition to the channels 35, which are connected to at least one compressed air source, the holder 12 can also comprise bores or porous material in order to apply negative or positive pressure to the substrate 3 from below.The compressed air may be required to cool the holder 12 and the substrate 3 in the event of a production stop and / or to temporarily generate overpressure when pulling a substrate onto the holder.

[0079] The apparatus 1 is preferably arranged for bonding components and substrates 3, wherein the components are of a type selected from the list consisting of semiconductor chips, dies, semiconductor packages, integrated circuits, optical elements, electronic elements, electro-optical elements, electromechanical elements, or any combination thereof; and / or wherein the substrates 3 are strip-shaped and preferably have a length-to-width ratio of three to one or two to one.

[0080] Fig. 1c shows an exemplary embodiment of a loading station 4, for example the one shown in Fig. 1b, wherein a substrate 3 was loaded by a feed device 9 from an input magazine 20 onto a holder 12 of a carriage 11.

[0081] Fig. 2a shows an exemplary embodiment of a device 1 according to the invention, for example the one shown in Fig. 1a, wherein a substrate 3 is movable along the path of the device 1, as shown in the left part of Fig. 2a. The right part of the Fig. Figure 2a shows three substrates 3 waiting to be discharged.

[0082] Fig. 2b shows an exemplary embodiment of a loading station 4, for example the one shown in Fig. 2a, wherein a substrate 3 is moved along the path after the substrate 3 has been loaded by a feed device 9 from an input magazine 20 onto a holder 12 of a carriage 11.

[0083] The Fig. 3a and Fig. 3b show embodiments of a discharge station 6, for example the one in Fig. 2a, wherein a substrate 3 is unloaded from a holder 12 of a carriage 11 into an output magazine 21 by an extraction device 10.

[0084] Fig. 3c shows an exemplary embodiment of a discharge station 6, for example the one shown in the Fig. 2a, Fig. 3a and Fig. 3b shows the unloading station 6, wherein a substrate 3 was unloaded from a holder 12 of a carriage 11 into an output magazine 21 by an extraction device 10. Fig. 3c shows more clearly that the extraction device 10 may comprise an extraction gripper 27 for gripping a front end 25 of the substrate 3, viewed in a movement direction (X) along the trajectory; and an extraction gripper moving device 28 for moving the extraction gripper 27 back and forth in a movement direction parallel to the trajectory. As shown in Fig. 3c, the pull-out gripper movement device 28 is preferably designed such that the pull-out gripper 27 can be moved through the output magazine 21 in a movement direction parallel to the trajectory.

[0085] The extraction device 10 may also include a stationary frame 29 on a side of the output magazine 21 facing away from the bonding station 5. The extraction gripper movement device 28 may include a guide 18 mounted on the frame 29 and extending in the direction of movement (X). The extraction gripper movement device 28 may be movable in the direction of movement (X) via the guide 18.

[0086] Fig.4 shows an exemplary embodiment of a carriage displacement device 13 with a linear guide 30 and a drive 32 for driving the carriage 11, so that the carriage 11 can be moved along the linear guide 30. The drive 32 preferably comprises a belt drive 38. The linear guide 30 preferably runs uninterrupted from the loading station 4 to the unloading station 6.

[0087] As already mentioned, a further aspect of the invention relates to a method for bonding components and substrates 3 using a device 1 as shown in the figures, which comprises loading the substrates 3 onto the carriage 11 at the loading station 4 by pulling one of the plurality of substrates 3 directly onto the holder 12 of the carriage using the feed device 9; transporting one of the plurality of substrates 3 at a time using the transport device 7 along a path 8 from the loading station 4 to the bonding station 5; bonding the components to the substrates 3 at the bonding station 5; each time transporting one of the plurality of substrates 3 with the transport device 7 along a path 8 from the bonding station to the unloading station 6 after the one or more components have been bonded thereto at the bonding station 5;and unloading the substrates 3 from the carriage 11 at the unloading station 6 by pulling one of the plurality of substrates 3 off the holder 12 of the carriage 11 with the pull-out device 10; LIST OF REFERENCE NUMBERS 1 device 2 - 3 Substrat 4 loading station 5 Bond Station 6 unloading station 7 Transport device 8 lane 9 Feed device 10 Extraction device 11 Carriage 12 Flat bracket 13 Carriage movement device 14 Hold-down device 15 feed grippers 16 Gripper, which is movable, is retracted 17 Stationary frame (feed) 18 Guide 19 - 20 Input magazine 21 issue magazine 22 Holding element 23 Heating device 24 Passage in the holding link (24a, 24b) 25 Front end of the substrate 26 Front of the substrate opposite the carriage 27 Extendable gripper 28 pull-out gripper movement devices 29 Stationary frame (extendable) 30 Linear guide 31 Drive 32 Vertical drive 33 Peripheral edge of the substrate 34 Transverse edge of the slide 35 Channel provided by providing negative pressure 36 Middle section of the bracket 37 Edge of the bracket 38 Belt drive X Direction of movement

Claims

[1] Device (1) for bonding one or more components and one or more substrates (3), the device comprising: • a bonding station (5) for bonding the components to the substrates, wherein the components are to be bonded to the substrates at the bonding station; • a transport device (7) for transporting the substrates along a path (8) from one or more loading stations (4) via the bonding station to one or more unloading stations (6), the transport device comprising the following: ◯ a carriage (11) having a flat holder (12) for receiving the substrates; ◯ a carriage moving device (13) for moving the carriage along the track (8); and ◯ a hold-down device (14) for holding the substrates on the holder; • one or more loading stations (4) for loading the substrates onto the carriage, which comprise one or more feed devices (9) for pulling the substrates onto the carriage holder; and • one or more unloading stations (6) for unloading the substrates after the components have been bonded thereto at the bonding station, comprising one or more extraction devices (10) for removing the substrates from the holder of the carriage. [2] Device (1) according to claim 1, wherein the loading stations (4) comprise one or more input magazines (20) for storing the substrates (3) therein, wherein the feed devices (9) are designed to pull the substrates from the input magazines onto the holder (12) of the carriage; and / or wherein the unloading stations (6) comprise one or more output magazines (21) for storing the substrates therein after the components have been bonded thereto at the bonding station (5), wherein the pull-out devices (10) are designed to pull the substrates from the holding surface of the carriage (11) and into the output magazines. [3] Device (1) according to claim 1 or 2, wherein the retraction devices (9) comprise: • one or more feed grippers (15) for gripping a front end (25) of the substrates (3), viewed in a direction of movement (X) along the path, for example an end (26) facing the carriage (11); and • one or more feed gripper movement devices (16) for moving the feed grippers back and forth in a direction of movement parallel to the web; and / or wherein the extraction devices (10) comprise: • one or more pull-out grippers (27) for gripping a front end (25) of the substrates, viewed in a direction of movement along the path; and • one or more pull-out gripper moving devices (28) for moving the pull-out grippers back and forth in a direction of movement parallel to the track. [4] Apparatus (1) according to claim 3, wherein, depending on claim 2, the pull-out gripper moving devices (28) are configured to move the pull-out grippers (27) through the output magazines (21) in a direction of movement parallel to the trajectory. [5] Device (1) according to one of the preceding claims further comprises: • a heating device (23) for applying heat to the substrates (3) when they are carried by the holder (12), the heating device being arranged to transfer the heat to the substrates via the holder. [6] Device (1) according to one of the preceding claims further comprises, depending on claim 2, the following • one or more vertical drives (32) which enable vertical movement of the input magazines (20) with the holder (12) of the carriage (11). [7] Device (1) according to one of the preceding claims, wherein, depending on claim 3, the feed grippers (15) and / or the extraction grippers (27) are arranged to grip the end (25) of the substrates mechanically, or are arranged to grip the end of the substrates using a negative pressure. [8] Device (1) according to one of the preceding claims, wherein the hold-down device (14) comprises a holding element (22) on top of the holder (12), the holding element being movable towards and away from the holder and being configured to engage at least parts of one or more peripheral edges (33) of the substrates (3) in a lower holding position thereof and positioned at a distance above or to one side of the holder in an inactive position thereof. [9] Device (1) according to claim 8, wherein the holding element (22) comprises corresponding passages (24a, b) on opposite transverse edges (34) of the carriage (11), which passages are designed such that the pulling-in devices (9) can extend in the horizontal direction when the substrates (3) are pulled onto the holder (12) of the carriage, and / or such that the pulling-out devices (10) can pass through in the horizontal direction when the substrates are pulled off the holder of the carriage, at least in the inactive position of the holding element. [10] Device (1) according to one of the preceding claims, wherein the carriage movement device (13) comprises a linear guide (30) and a drive (32) for driving the carriage (11) so that it is movable along the linear guide. [11] Device (1) according to one of the preceding claims, wherein the hold-down device (14) is arranged to hold the substrates (3) on the support surface (12) using a negative pressure. [12] Device (1) according to claim 11, wherein the hold-down device (14) comprises channels (35) provided in the carriage (11), the channels being designed such that a negative pressure for holding the substrates (3) on the holder (12) can be applied through the channels. [13] Device (1) according to claim 12, wherein the negative pressure in use is initially effective in a central region (36) of the holder and then spreads to the edges (37) of the holder. [14] Device (1) according to one of the preceding claims, wherein the components are of a type selected from the list consisting of semiconductor chips, dies, semiconductor packages, integrated circuits, optical elements, electronic elements, electro-optical elements, electromechanical elements or any combination thereof; and / or wherein the substrates are strip-shaped and preferably have a length to width ratio of three to one or two to one. [15] Device (1) according to one of the preceding claims, wherein the device comprises two or more of the transport devices (7) and has an individual loading station (4) and unloading station (6) for each of the two or more transport devices. [16] Device (1) according to claim 15, wherein the number of transport devices (7) corresponds to the number of container codes delivered plus one. [17] A method for bonding one or more components and one or more substrates (3), using a device (1) according to any one of the preceding claims, comprising: • Loading the substrates onto the carriage (11) at the loading stations (4) by pulling the substrates onto the carriage holder (12) using the feed devices (9); • to transport the substrates with the transport device (7) along a path (8) from the loading stations (4) to the bonding station (5); • Bonding the components to the substrates in the bonding station; • transporting the substrates with the transport device (7) along a path (8) from the bonding station to the unloading stations (6) after the components have been glued thereto at the bonding station; and • Unloading the substrates from the carriage at the unloading stations by pulling the substrates off the carriage holder using the pull-out devices (10). [18] Method according to claim 17, wherein a pre-bond inspection and / or pre-bond cleaning and / or a post-bond inspection and / or post-bond cleaning is carried out before or after the bonding at the bonding station.

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