Polishing device, in particular dental polishing device

Abstract

The invention relates to a polishing device, in particular a dental polishing device, for at least semi-automated polishing of at least one, in particular dental, workpiece (12a, 12.1a, 12.2a; 12b) and / or an apparatus, with at least one polishing unit (14a; 14b) which has a polishing disc element (16a; 16b), in particular a polishing disc, with at least one polishing pad (18a), and with a workpiece holding unit (22a; 22b) which has at least one workpiece holder (24a; 24b) for fixing the workpiece (12a, 12.1a, 12.2a; 12b) and / or the apparatus during a polishing process. It is proposed that the workpiece holder (24a; 24b) of the workpiece holding unit (22a; 22b) is at least partially movable relative to the polishing wheel element (16a; 16b).

Description

State of the art

[0001] The invention relates to a polishing device, in particular a dental polishing device.

[0002] A polishing device, in particular a dental polishing device, for at least partially automated polishing of at least one, in particular dental, workpiece and / or an apparatus, having at least one polishing unit which has a polishing disk element with at least one polishing pad, and having a workpiece holding unit which has at least one workpiece holder for fixing the workpiece and / or the apparatus during a polishing process, has already been proposed.

[0003] The object of the invention is, in particular, to provide a generic device with improved properties regarding automation and / or polishing results. This object is achieved according to the invention by the features of patent claim 1, while advantageous embodiments and further developments of the invention can be found in the subclaims. Advantages of the invention

[0004] The invention is based on a polishing device, in particular a dental polishing device, for at least partially automated polishing of at least one, in particular dental, workpiece and / or an apparatus, with at least one polishing unit which has a polishing disk element, in particular a polishing disk with at least one polishing pad, and with a workpiece holding unit which has at least one workpiece holder for fixing the workpiece and / or the apparatus during a polishing process.

[0005] It is proposed that the workpiece holder of the workpiece holding unit be at least partially movable relative to the polishing disk element. Preferably, the workpiece holder is designed to be moved during a polishing process, in particular in an automated manner. Preferably, the workpiece and / or the apparatus has, in particular, a three-dimensional surface to be polished.

[0006] In this context, a "polishing device" is understood to mean, in particular, a device intended for actively polishing a surface, in particular an outer surface, of a workpiece and / or an appliance. The polishing device is preferably formed by a dental polishing device intended for actively polishing dental crowns, in particular ceramic crowns, bridges, in particular multi-unit bridges, partial or full dentures, inlays, veneers, aligners, or other dental workpieces. However, an application of the polishing device in the watchmaking and / or jewelry industry would also be conceivable. The workpiece and / or the appliance can, in particular, be milled, printed, sintered, or manually manufactured. The polishing device is intended, in particular, for use in a dental practice and / or a dental laboratory.However, other applications of the polishing device that would appear appropriate to a person skilled in the art are also conceivable. Preferably, the polishing device is intended in particular for the semi-automatic or fully automatic polishing of workpieces. Furthermore, in this context, a "polishing unit" should be understood in particular as a unit of the polishing device that is intended for the direct polishing of the workpiece and / or the apparatus. Preferably, the polishing unit is intended to smooth at least one surface of the workpiece, in particular by removing material. Preferably, the polishing unit is intended to reduce the roughness of at least one surface of the workpiece and / or the apparatus. The polishing unit comprises in particular a polishing disk element with a polishing pad, wherein the polishing pad is intended for direct contact with the workpiece and / or the apparatus during a polishing process.The polishing pad can itself contain abrasive particles or be provided with a polishing agent during a polishing process. In particular, the polishing pad can be impregnated with polishing agent. In another possible embodiment, the pad, particularly its fibers, has an abrasive effect. The polishing pad can also be divided into differently active sectors or radial areas with different properties. The polishing disc element is, in particular, actively driven, particularly rotationally. Alternatively or additionally, it would also be conceivable for the polishing disc element to perform a translational, wobbling, or eccentric movement.

[0007] The polishing disc element can, in particular, have a shape other than a flat disc. The polishing disc element can have a free-form shape. The polishing disc element can be designed with a three-dimensionally shaped edge, such as a type of plate edge. The edge allows, in particular, the polishing of side surfaces or free-form surfaces of a workpiece, such as those found in crowns. By means of the workpiece holder, the contact pressure on the three-dimensionally shaped polishing disc element can be varied, in particular depending on the object and the polishing progress. Alternatively, it would also be conceivable for the polishing disc element to be bowl- or cup-shaped.

[0008] In this context, a “workpiece holding unit” is to be understood in particular as a unit which is intended to hold the workpiece and / or the equipment during a polishing process. Preferably, the workpiece and / or the equipment is fastened to the workpiece holder during a polishing process. For this purpose, the workpiece holding unit has in particular the workpiece holder, which is intended to directly hold, in particular to fix, the workpiece and / or the equipment. Preferably, the workpiece and / or the equipment is brought into contact with the polishing disk element via the workpiece holder during a polishing process. Preferably, the workpiece holding unit is not intended to be held by an operator. Preferably, the workpiece holding unit is connected in particular to a base frame of the polishing device.The workpiece holding unit and the polishing unit are preferably connected to the base frame of the polishing device. The workpiece holder comprises, in particular, a holding head, which is intended to be connected directly to the workpiece and / or the apparatus. A connection between the holding head and the workpiece and / or the apparatus can be realized, for example, by means of an adhesive connection, for example, by means of a water-soluble hot-melt adhesive, a water-soluble polymer, and / or a sugar derivative, by means of clamps, by means of looping, by means of suction through a vacuum, by means of internal spreading, by means of an anti-slip agent, or by means of an inflatable balloon inside a cavity of the workpiece and / or the apparatus. Alternatively or additionally, it would be conceivable for the workpiece holder to have an externally attached, flexible shaft, which can be positioned as desired relative to the polishing disk element.Alternatively, it would also be conceivable for the workpiece holding unit to comprise a collaborative robot, in particular an industrial robot, and / or an articulated arm robot.

[0009] The inventive design of the polishing device advantageously enables at least partially automated polishing of a workpiece and / or a piece of equipment. In particular, it advantageously enables polishing of three-dimensional surfaces of a workpiece and / or a piece of equipment. Furthermore, the mobility of the workpiece holder enables an advantageously uniform polishing pattern.

[0010] Furthermore, it is proposed that the polishing unit have a drive unit for a movable, in particular rotary, drive of the polishing disk element, wherein the workpiece holder of the workpiece holding unit is mounted at least partially movable. Preferably, the workpiece holder is intended to be moved during a polishing process, in particular in an automated manner. Preferably, the workpiece holder is mounted so as to be movable within a defined, limited range of movement. Preferably, the polishing disk element is driven by the drive unit. The drive unit is formed in particular by a motor, particularly preferably by an electric motor. However, other configurations of the drive unit that would appear expedient to a person skilled in the art are also conceivable.A rotational speed of the drive unit is designed to be controlled and / or regulated in particular via a computing unit of the polishing device. The rotational speed can preferably be varied during the polishing process. The computing unit is preferably provided for controlling and / or regulating the operation of the polishing device. A “computing unit” should be understood in particular as a unit with an information input, an information processing unit, and an information output. The computing unit advantageously has at least one processor, a memory, input and output means, further electrical components, an operating program, control routines, control routines and / or calculation routines. The components of the computing unit are preferably arranged on a common circuit board and / or advantageously arranged in a common housing. The computing unit is preferably at least partially programmable and / or controllable by an operator.Preferably, templates are stored in the memory of the computing unit, which templates can advantageously be easily selected by an operator depending on a workpiece and / or a piece of equipment. Preferably, a corresponding template contains a polishing program tailored to a workpiece type and / or a piece of equipment. The expression “at least partially movably mounted” is intended here to define in particular a mounting of a unit and / or an element, wherein the unit and / or the element, in particular decoupled from an elastic deformation of the unit and / or the element, has the possibility of movement along at least one distance greater than 10 mm, preferably greater than 20 mm and particularly preferably greater than 30 mm and / or has the possibility of movement around at least one axis by an angle greater than 20°, preferably greater than 30° and particularly preferably greater than 30°."Intended" should be understood in particular to mean specifically programmed, designed, and / or equipped. The fact that an object is intended for a specific function should be understood in particular to mean that the object fulfills and / or performs this specific function in at least one application and / or operating state.

[0011] It is further proposed that the polishing device have a movement unit which is intended to move the workpiece holding unit, in particular the workpiece holder of the workpiece holding unit, during operation on a defined path, in particular in a defined movement pattern, relative to the polishing unit. The movement unit comprises in particular a drive for automatically moving the workpiece holding unit, in particular the workpiece holder of the workpiece holding unit. Preferably, the drive is formed by at least one linear drive and / or spindle drive. However, other configurations of the drive which appear expedient to a person skilled in the art are also conceivable. Preferably, the movement unit is intended to move a workpiece and / or an apparatus by means of the workpiece holder over the polishing disk element.Preferably, the movement unit is provided for moving a workpiece and / or a piece of equipment in a defined movement pattern by means of the workpiece holder over the polishing pad element. The defined path and / or the defined movement pattern in which the workpiece holding unit is moved does not have to be identical for each polishing process. In particular, the path and / or the movement pattern in which the workpiece holding unit and thus the workpiece and / or the equipment is moved during a polishing process can be individually defined for each workpiece and / or each piece of equipment. The defined path and / or the defined movement pattern serve in particular to achieve different angles of flow and / or different directions of flow between the polishing pad and the workpiece or the equipment. In particular, different surfaces of the workpiece or the equipment should come into contact with the polishing pad.Furthermore, different air flow directions should be used to avoid scoring. The movement of the workpiece or the equipment on the polishing pad is advantageously designed in such a way that, over the course of the entire process, the partial surfaces are exposed to air flow from the pad in different directions, preferably rotated by 90°. The movement pattern preferably provides a semicircular movement of the workpiece holder over the polishing pad, wherein the overall orientation of the workpiece holder remains unchanged. This makes it possible, in particular, to advantageously at least partially automated, preferably automated, polishing of a workpiece and / or equipment. It is also advantageously possible to polish three-dimensional surfaces of a workpiece and / or equipment. In particular, manual holding and / or guiding of the workpiece and / or equipment can be dispensed with. A defined movement pattern (workpiece or pad, e.g.B. record), which is particularly specific for the workpiece and / or the appliance and takes into account in particular functional differences such as occlusal surface, lateral surface, makes it possible in particular to vary the local degree of processing and thus to realize locally different degrees of polishing.

[0012] Alternatively, it would also be conceivable to provide a movement unit that rotates the polishing unit, for example, in the form of a hollow body with fibers and polishing agents inside, around a stationary workpiece holder. This can, in particular, improve contamination. Furthermore, the hollow body can be formed, for example, by a disposable item.

[0013] It is further proposed that the movement unit have at least two axes of movement, via which the workpiece holder can be moved in at least one plane. The movement unit is preferably provided to guide the workpiece holding unit in at least two directions. The movement unit preferably has a bridge unit with two guide units, which are provided to guide the workpiece holding unit and which extends at least partially over the polishing unit. For this purpose, the movement unit in particular has guide units, specifically a first guide unit and a second guide unit. A first guide unit preferably guides the workpiece holding unit along a first axis of movement, in particular a Z-axis. The first guide unit preferably comprises at least one guide rail.Furthermore, the first guide unit preferably comprises at least one guide carriage, to which an intermediate frame of the movement unit is fastened, which is guided on the at least one guide rail of the first guide unit. Preferably, the second guide unit guides the workpiece holding unit, in particular along a second movement axis, preferably an X-axis. The second guide unit comprises, in particular, at least one guide rail firmly connected to the intermediate frame, and at least one guide carriage, which is guided on the guide rail of the second guide unit. However, another design of the movement unit that would appear appropriate to a person skilled in the art would also be conceivable, such as a cantilever arm, toothed belt drive, or the like. This makes it possible, in particular, to advantageously at least partially automated, preferably automated, polishing of a workpiece and / or an apparatus.In particular, targeted movement of the workpiece holder can be enabled. In particular, manual holding and / or guiding of the workpiece and / or the equipment can be dispensed with.

[0014] It is further proposed that the workpiece holding unit comprise at least one force adjustment unit, which, in at least one operating state, is designed to exert a contact pressure, in particular an adjustable one, on the workpiece holder. Preferably, the force adjustment unit can be used to adjust the force with which the workpiece holder presses a workpiece and / or an apparatus onto the polishing disc element. Preferably, the workpiece holder is partially decoupled from the movement unit via the force adjustment unit. Preferably, the workpiece holder can yield within a defined range of motion via the force adjustment unit of the polishing disc element.In this context, a "force adjustment unit" is understood to mean, in particular, a unit designed to adjust the action exerted by the movement unit on the workpiece holder and the action exerted by the workpiece holder on the polishing pad during operation. Preferably, the force adjustment unit partially decouples the workpiece holder from the movement unit, so that the workpiece holder can partially yield to resistance, such as, in particular, the polishing disc element, while the force adjustment unit simultaneously generates counterpressure against the polishing disc element. Preferably, the workpiece holder is connected to the movement unit via the force adjustment unit.The force adjustment unit is particularly provided for partially movably supporting the workpiece holder, wherein the force adjustment unit is provided, during operation, to press the workpiece holder into an end position with a defined force. The force adjustment unit is particularly provided for counteracting a deflection of the workpiece holder relative to the movement unit with a defined force. This makes it possible, in particular, to provide an advantageously defined polishing force. In particular, this makes it possible to advantageously at least partially automated, preferably automated, polishing of a workpiece and / or an apparatus. Furthermore, an optimal polishing result can be achieved, in particular, with differently shaped workpieces and / or apparatus.

[0015] It is further proposed that the force adjustment unit comprises at least one beam balance, at one end of which the workpiece holder is arranged, at least one spring element which is provided to act on the beam balance, and at least one pretensioning unit, in particular a stepper motor, which is provided to adjust a pretension of the spring element. The spring element is preferably arranged at a pivot point of the beam balance. The spring element is preferably connected to the beam balance at one end and to the pretensioning unit at the other end. The pretensioning unit is supported in particular on the movement unit, in particular on a guide carriage of the movement unit.A “spring element” is to be understood in particular as a macroscopic element which has at least one extension and / or angular position which, in a normal operating state, can be elastically changed by at least 10%, in particular by at least 20%, preferably by at least 30% and particularly advantageously by at least 50% and / or by at least 10°, in particular by at least 20°, preferably by at least 30° and particularly advantageously by at least 50°, wherein the element in particular generates a counterforce which is dependent on a change in the extension and / or angular position and is preferably proportional to the change and counteracts the change. An “extension” of an element is to be understood in particular as a maximum distance between two points of a perpendicular projection of the element onto a plane.A "macroscopic element" is understood to mean, in particular, an element with an extension of at least 1 mm, in particular of at least 5 mm, and preferably of at least 10 mm. The spring element is preferably formed by a spiral spring. This makes it possible, in particular, to provide an advantageous force adjustment unit. In particular, it makes it possible to advantageously at least partially automated, preferably automated, polishing of a workpiece and / or an apparatus. Furthermore, an optimal polishing result can be achieved, particularly with differently shaped workpieces and / or apparatus.

[0016] It is further proposed that the polishing device have a polishing agent supply unit which is provided for supplying polishing agent to the polishing disk element. The polishing agent supply unit preferably has a polishing agent tank and a supply line. The polishing agent supply unit preferably also has a conveying unit, in particular a polishing agent pump, for conveying the polishing agent from the polishing agent tank along the supply line. The supply line can, for example, end above the polishing disk element. Alternatively or additionally, it would also be conceivable for the polishing agent to be injected into the polishing disk element from below. The polishing agent supply unit is preferably provided for supplying polishing agent at least temporarily, in particular continuously or intermittently, during operation of the polishing disk element. Various polishing agents which appear appropriate to a person skilled in the art can be used as polishing agents.The polishing agent, in particular, exhibits adhesion to the polishing pad, especially to the fibers of the polishing pad. The polishing agent preferably contains an abrasive component. Various abrasives considered appropriate by a person skilled in the art are conceivable, such as, in particular, diamond, corundum, silicon carbide, and / or silicates. Furthermore, various grain sizes and / or grain size distributions considered appropriate by a person skilled in the art are conceivable.

[0017] Paste-like polishing agents or polishes that are solid at room temperature are also conceivable. These have the advantage of being thrown off unused to a much lesser extent.

[0018] Pasty polishing agents can be applied using squeezing units, while solid ones, for example in stick form, melt at least partially during application and solidify again on the pad.

[0019] Furthermore, it would also be conceivable for the polishing device to have a polishing agent collecting device designed to collect polishing agent that is thrown off or dripping from the polishing disc element. The polishing agent supply unit can, in particular, produce an optimal polishing result. In particular, polishing agent can be reliably supplied to the polishing pad. This makes it possible, in particular, to achieve an advantageously reproducible polishing result. Also proposed is the use of different polishing fluids depending on the polishing progress, for example, a more abrasive one at the beginning and a less abrasive one towards the end of the process.

[0020] Furthermore, it is proposed that the polishing pad comprise aligned fibers, in particular wool fibers, which are arranged on a polishing surface of the polishing pad. Preferably, the polishing pad has two main extension surfaces, which extend in particular parallel to a main extension plane of the polishing pad, namely the polishing surface and a fastening surface for a, in particular detachable, connection to the polishing disk element. A "main extension plane" of a structural unit is to be understood in particular as a plane which is parallel to a largest side surface of a smallest imaginary cuboid which just completely encloses the structural unit and in particular runs through the center of the cuboid. The fibers of the polishing pad are designed in particular to be directed vertically.Possible fibers include, for example, polyamide fibers, polyester fibers, natural fibers, cotton fibers, linen fibers, goat hair, bison hair, wool fibers, or the like. However, other fibers deemed appropriate by a person skilled in the art are also conceivable. As an alternative to fibers, felt, in particular felt lamellas arranged in a spiral or concentrically wound manner on the polishing pad, is also conceivable. This makes it possible to provide a particularly advantageous polishing pad. In particular, a polishing pad can be provided with which even uneven surfaces of the workpiece and / or the equipment can advantageously be polished. In particular, it can be made possible to immerse the workpiece and / or the equipment into the polishing pad.

[0021] It is further proposed that the fibers be configured to be substantially vertical. The fibers are formed, in particular, from wool fibers. The fibers are, in particular, oriented substantially vertically. The fibers are, in particular, arranged on a base body of the polishing pad in such a way that the fibers are each arranged, at a fastening point, substantially vertically on the main extension surface of the base body. The fibers, in particular, have a defined length or length distribution. The fibers can have different lengths distributed over the polishing pad or the same length. Preferably, the fibers have a constant, defined diameter. Alternatively or additionally, it would also be conceivable for the fibers to have varying degrees of flexibility, in particular due to varying diameters.The expression “essentially perpendicular” is intended here in particular to define an alignment of a direction relative to a reference direction, wherein the direction and the reference direction, in particular viewed in a projection plane, enclose an angle of 90° and the angle has a maximum deviation of in particular less than 8°, advantageously less than 5° and particularly advantageously less than 2°. This makes it possible in particular to provide a particularly advantageous polishing pad. In particular, a polishing pad can be provided with which even uneven surfaces of the workpiece and / or the equipment can advantageously be polished. In particular, immersion of the workpiece and / or the equipment into the polishing pad can be enabled. Furthermore, an advantageously reproducible polishing result can be achieved.

[0022] It is further proposed that the fibers be conditioned for a polishing process. Alternatively or additionally, the entire polishing pad can also be conditioned. The fibers are preferably cut to a defined length or length distribution, for example for conditioning. Furthermore, loose fibers can be removed for conditioning, for example by brushing, combing, or blowing. The fibers can preferably be conditioned, for example, by etching processes, plasma processing, mechanical processing, or the like, in order to improve wettability and / or polishing agent adhesion, for example. This makes it possible, in particular, to achieve an optimal polishing result. The polishing pad can also be divided sectorally or radially into areas that are covered with fiber, felt, fabric, or other combinations that appear appropriate to a person skilled in the art, in accordance with the aforementioned covering.The areas can have different polishing properties.

[0023] It is further proposed that the polishing device have a further movement unit which, in at least one operating state, is provided for a translational movement of the entire polishing unit. The movement unit comprises, in particular, a drive for automated movement of the polishing unit, in particular of the polishing disk element of the polishing unit. Preferably, the drive is formed by at least one linear drive and / or spindle drive. However, other configurations of the drive which appear expedient to a person skilled in the art are also conceivable. Preferably, the further movement unit is provided for moving a polishing disk element relative to the workpiece holder. The movement axis of the further movement unit extends, in particular, perpendicular to a movement plane of the movement unit. The further movement unit provides, in particular, a third movement axis relative to the movement unit.This makes it possible, in particular, to provide a third degree of freedom of movement. The further movement unit is arranged, in particular, below the polishing unit. The polishing unit is arranged, in particular, on a guide carriage of a guide unit of the further movement unit. This makes it possible, in particular, to advantageously enable at least partially automated, preferably automated, polishing of a workpiece and / or an apparatus. Furthermore, it is advantageously possible to polish three-dimensional surfaces of a workpiece and / or an apparatus.

[0024] It is further proposed that the workpiece holder have an exchangeable holding head. The holding head is arranged on the workpiece holder in a detachable manner, preferably detachable without tools. Alternatively or additionally, it would also be conceivable for the entire workpiece holder and / or the workpiece holding unit to be detachably arranged on a base frame. In this context, “detachable” should be understood in particular to mean “non-destructively separable”. Preferably, the holding head is formed in particular by a universal holding head. In this case, it would also be conceivable for different holding heads to be provided for different workpiece types, such as crowns, veneers, inlays, onlays or the like. Corresponding holding heads can then have integrated masking and protection functions depending on the workpiece type.In particular, it would also be conceivable for a defined number of holding head types to be available, with an optimal holding head being recommended by the software depending on scan data and / or a selection of the workpiece type. The holding head can be recommended and / or prescribed, in particular depending on a set template. Alternatively, the holding head can be formed by an individual, in particular an individually printed, holding head. Preferably, for each workpiece and / or each apparatus, an individual holding head adapted to the workpiece and / or apparatus can be 3D printed, milled, or manufactured using a hardening, plastic mass, in particular using a rapid prototyping process, on the basis of existing scan data of the workpiece and / or the apparatus. Corresponding holding heads can then have integrated masking and protection functions depending on a workpiece and / or apparatus.Alternatively or additionally, it would be conceivable for the holding head to be formed from a disposable article with an integrated adhesive substance. The adhesive substance can be a viscous mass that requires, for example, heating. Alternatively, a chemically activated adhesive substance would also be conceivable. Activation can occur through capsule release and / or component mixing. With various holding heads, it would also be conceivable for the holding heads to be provided with a code, whereby the polishing device, in particular, for example, the workpiece holder, can recognize an orientation and / or type of workpiece and / or equipment by reading the code. Alternatively, an RFID chip can also be provided in the holding head, which is read by a reader of the polishing device, in particular in the workpiece holder. This could eliminate the need for the polishing device to read out scan data.This allows, in particular, reliable holding of the workpiece and / or the equipment. Furthermore, convenient attachment and / or detachment of the workpiece and / or the equipment to / from the workpiece holder is possible. Furthermore, reliable protection of the workpiece and / or the equipment during a polishing process is possible. In particular, masking and protective functions can be provided.

[0025] Furthermore, it is proposed that the polishing device comprise a polishing pad regeneration unit which, in at least one operating state, in particular before or after a polishing operation, is provided to bring the polishing disk element, in particular the polishing pad, into a defined state of polishing capability, in particular to rinse it to establish or restore the polishing capability. Preferably, in at least one operating state, in particular after a polishing operation, the polishing pad regeneration unit is provided to rinse the polishing disk element, in particular the polishing pad, to restore the polishing capability. The polishing pad regeneration unit is provided in particular to restore the polishing capability. Alternatively or additionally, however, the polishing pad regeneration unit can also be used to establish the polishing capability of the polishing pad before the polishing pad is used for the first time.The polishing pad regeneration unit is designed, in particular, to automatically rinse the polishing pad, particularly by flushing abrasive particles and polishing agents from the polishing pad. Furthermore, the polishing pad regeneration unit can be designed to trim the fibers of the polishing pad and / or remove loose fibers from the polishing pad. This can, in particular, enable pad regeneration to increase service life and avoid the need for a pad change during the process.

[0026] It is further proposed that the polishing device comprise a measuring and / or testing cell which is provided for checking the polishing result of the workpiece and / or the equipment. During the check, in particular, an assessment of the degree of gloss is carried out. For this purpose, the measuring and / or testing cell can, for example, comprise a light source which is provided for being directed onto the workpiece and / or the equipment, wherein a reflected light can be captured by a camera of the measuring and / or testing cell, in particular a CMOS camera. In particular, it can be output to an operator as a measure of the degree of gloss of the workpiece and / or the equipment with false color representation, so that the polishing result can be subsequently adjusted.It would also be conceivable for the gloss level of the workpiece and / or the equipment to be displayed to an operator using augmented reality, whereby the operator can be directly instructed as to where further polishing is required. The measuring and / or testing cell is arranged outside the polishing wheel element. The measuring and / or testing cell can, in particular, be arranged above the polishing wheel element, like the polishing pad regeneration unit. However, another arrangement that would appear sensible to a person skilled in the art would also be conceivable. In this case, it is conceivable that the workpiece and / or the equipment is moved automatically into the measuring and / or testing cell using the workpiece holder. Alternatively, manual transfer by the operator would also be conceivable. This makes it possible, in particular, to achieve an optimal polishing result.

[0027] Furthermore, the invention is based on a method for operating the polishing device. It is proposed that, in at least one polishing step, a workpiece held by the workpiece holder and / or an apparatus held by the workpiece holder is automatically polished at least in sections by means of the polishing unit of the polishing device. Preferably, the workpiece and / or the apparatus is polished in the polishing step without user intervention. Preferably, the polishing device carries out a defined polishing process, wherein the polishing process is preferably adapted to a workpiece and / or an apparatus. This makes it possible, in particular, to advantageously at least partially automated polishing of a workpiece and / or an apparatus. In particular, it is advantageously possible to polish three-dimensional surfaces of a workpiece and / or an apparatus.

[0028] Furthermore, it is proposed that in at least one fixing step, in particular prior to the polishing step, the workpiece and / or the apparatus be connected to a holding head of the workpiece holder by means of an adhesive connection. The adhesive connection is in particular detachable. Preferably, any adhesive used is water-soluble or detachable by means of heat, ultrasound, or the like. In particular, a separate device for detaching and fastening the workpiece, for example by means of water, hot air, ultrasound, or the like, can be provided, in particular if the workpiece holder makes this necessary. Alternatively or additionally, it would be conceivable for the workpiece holder to supply energy intended to maintain or detach the adhesive connection. For example, a coolant supply can be integrated into the workpiece holder to prevent disruption of the adhesive connection.Furthermore, active cooling of the workpiece and / or equipment and / or holding head can be achieved via a coolant supply.

[0029] Alternatively, solvent or hot water can be added via the workpiece holder to loosen the adhesive bond after the polishing process.

[0030] Furthermore, it would also be conceivable to provide a control step, particularly after the polishing step, in which the polishing result is checked. During the control, a gloss level is assessed, in particular. For this purpose, for example, a directed light source can be directed onto the workpiece and / or the equipment, with reflected light being captured by a camera, in particular a CMOS camera. In particular, it can be output to an operator as a measure of the gloss level of the workpiece and / or the equipment with false color representation, so that the polishing result can be subsequently adjusted. Furthermore, it would also be conceivable for the gloss level of the workpiece and / or the equipment to be output to an operator using augmented reality, whereby an operator can be directly instructed as to where further polishing is required. The control step is carried out, in particular, by the measuring and / or testing cell.

[0031] It is further proposed that in at least one regeneration step, in particular after the polishing step, the polishing disk element, in particular the polishing pad, be rinsed by means of the polishing pad regeneration unit to restore its polishing capability. The polishing pad regeneration unit is provided in particular to restore its polishing capability. The polishing pad regeneration unit automatically rinses the polishing pad, in particular flushing abrasive particles and polishing agent from the polishing pad. This enables, in particular, pad regeneration to increase service life and avoid the need for a pad change during the process.

[0032] Another form of pad regeneration can be achieved by scrubbing with a brush. This also serves to condition and extend the service life of the polishing pad. The various suggested options can also be combined; rinsing and brushing simultaneously is particularly beneficial.

[0033] It is further proposed that, in at least one selection step, in particular prior to the polishing step, a polishing parameter package designed for polishing the workpiece and / or the apparatus, in particular depending on the workpiece and / or the apparatus, in particular depending on a type or geometry of the workpiece and / or the apparatus, is selected and applied by the computing unit, in particular in the form of defined values ​​for various polishing parameters and / or for a movement pattern of the workpiece holder. The computing unit is in particular designed to load the polishing parameter package for a polishing process for at least one desired workpiece and / or a desired apparatus based on a selection mask, in particular a graphical and / or visualized one.Preferably, the computing unit is provided to display to an operator, in at least one operating state, in particular before the polishing step, at least one graphical and / or visualized selection mask with at least three options for workpieces and / or equipment for selection, in particular via a display, in particular a touchscreen display. Preferably, the computing unit is designed to query, when a CAD file of the workpiece and / or equipment is imported and / or when the workpiece and / or equipment is held ready, in particular by the operator, which type of workpiece and / or equipment is to be polished. Preferably, the selection mask comprises no more than ten, preferably no more than eight, and particularly preferably no more than six selection options at the same time.Preferably, a desired workpiece and / or a desired piece of equipment can be selected directly via the selection mask, wherein once the workpiece and / or the equipment has been selected, preferably no further polishing-specific inputs, such as polishing parameters, are necessary. It is particularly also conceivable for the selection mask to be multi-stage and have a plurality of selection levels. In a multi-stage selection, each selection level preferably comprises a maximum of eight, particularly preferably a maximum of six options, wherein a maximum of five, preferably a maximum of four selection levels are provided. The polishing parameter packages are loaded in particular in the form of templates. The polishing parameter packages or templates can in particular be edited by an operator. Changes to the parameters can in particular be made through free programmability.The polishing parameter packages each contain, in particular, defined values ​​for various polishing parameters, such as a polishing agent supply, a rotational speed and / or a rotational speed profile of the polishing disc element, and / or a contact pressure, and / or a defined movement pattern for the movement unit. This advantageously provides fast, simple, and intuitive operation of the polishing device. In particular, the query of complex polishing-specific parameters can be dispensed with.

[0034] Furthermore, it is proposed to use a temperature sensor to measure and evaluate the temperature behind the workpiece and / or the equipment, particularly in a slipstream, on the polishing pad. By arranging the temperature sensor behind the workpiece, interference or excessive abrasive action can be avoided, at least with contact temperature sensors. If the temperature is outside the previously defined control range, more polishing agent can be added, or the contact force and / or speed can be reduced to prevent damage to the workpiece.

[0035] A sensor that measures the force acting laterally on the workpiece and / or the equipment, particularly an acting moment and / or transverse forces, can be used in conjunction with an evaluation unit to determine the friction force. If force values ​​fall outside the previously defined control range, more polishing agent can be added, or the contact force and / or speed can be reduced to prevent workpiece damage.

[0036] The polishing device and / or method according to the invention should not be limited to the application and embodiment described above. In particular, the polishing device and / or method according to the invention can have a number of individual elements, components, and units as well as method steps that differs from the number stated herein to fulfill a function described herein. Furthermore, in the value ranges specified in this disclosure, values ​​within the stated limits are also to be considered disclosed and can be used arbitrarily. Drawings

[0037] Further advantages will become apparent from the following description of the drawings. The drawings illustrate two exemplary embodiments of the invention. The drawings, the description, and the claims contain numerous features in combination. Those skilled in the art will also expediently consider the features individually and combine them into useful further combinations.

[0038] They show: Fig. 1 a polishing device according to the invention with a polishing unit, with a workpiece holding unit, with a movement unit and with a further movement unit in a schematic representation, Fig. 2 shows a partial section of the polishing device according to the invention with the polishing unit, with the workpiece holding unit, with the movement unit and with the further movement unit during operation in a schematic representation, Fig. 3 the polishing unit of the polishing device according to the invention in a schematic, isometric representation, Fig. 4 the polishing unit of the polishing device according to the invention in a schematic side view, Fig. 5 shows the workpiece holding unit of the polishing device according to the invention with a force adjustment unit and a workpiece holder in a first operating state in a schematic representation, Fig. 6 shows the workpiece holding unit of the polishing device according to the invention with a force adjustment unit and a workpiece holder in a second operating state in a schematic representation, Fig. 7 several different, alternative holding heads for the workpiece holding unit in a holder in a schematic representation, Fig. 8 a first alternative holding head of the workpiece holder and a workpiece for fixing on the second holding head in a schematic exploded view, Fig. 9 a second alternative holding head of the workpiece holder and a workpiece for fixing on the third holding head in a schematic exploded view, Fig. 10 is a schematic flow diagram of a method for operating the polishing device according to the invention and Fig. 11 shows a further polishing device according to the invention with a polishing unit, with a workpiece holding unit and with a movement unit in a schematic representation. Description of the embodiments

[0039] The Fig. 1 and Fig. 2 show a polishing device 10a. The polishing device 10a is formed by a dental polishing device. The polishing device 10a is intended for the at least partially automated polishing of at least one, in particular dental, workpiece 12a. The polishing device 10a is intended for the partially automated polishing of dental workpieces 12a and / or appliances, such as dental crowns, in particular ceramic crowns, bridges, in particular multi-unit bridges, partial or full dentures, inlays, veneers, or other dental workpieces 12a. The polishing device 10a is intended for use in a dental laboratory and / or a dental practice. The polishing device 10a has a base frame 62a. The base frame 62a is formed, for example, by a rectangular frame made of extruded profiles. However, another design of the base frame 62a that would appear appropriate to a person skilled in the art would also be conceivable.In particular, it would also be conceivable for the base frame 62a to already have a cuboid shape, which serves as a frame for a housing. The base frame 62a is arranged stationary. Preferably, the base frame 62a is designed as the horizontal base side of the polishing device 10a.

[0040] The polishing device 10a has a polishing unit 14a. The polishing unit 14a comprises a polishing disk element 16a and a polishing pad 18a arranged on the polishing disk element 16a. The polishing pad 18a is detachably connected to the polishing disk element 16a. The polishing pad 18a is connected to the polishing disk element 16a, for example, via a hook-and-loop connection. The polishing pad 18a has two main extension surfaces that extend parallel to a main extension plane of the polishing pad 18a, namely a polishing surface 42a and a fastening surface for a detachable connection to the polishing disk element 16a. The polishing pad 18a has a hook-and-loop surface on the fastening surface, in particular with barbs or loops, wherein the polishing disk element 16a has a corresponding hook-and-loop surface on its upper side.However, other connections between the polishing disk element 16a and the polishing pad 18a that would be deemed appropriate by a person skilled in the art are also conceivable. The polishing unit 14a is intended to smooth at least one surface of the workpiece 12a, in particular by removing material. The polishing unit 14a is intended to reduce the roughness of at least one surface of the workpiece 12a. For this purpose, the polishing pad 18a is brought into direct contact with the workpiece surface during a polishing process. The polishing pad 18a can itself contain abrasive particles and / or be provided with a polishing agent during a polishing process.

[0041] The polishing pad 18a has aligned fibers 44a arranged on the polishing surface 42a of the polishing pad 18a. The fibers 44a are essentially vertically arranged. The fibers 44a are formed from wool fibers. The polishing pad 18a has vertically arranged, aligned wool fibers. The fibers 44a have a defined surface structure. Furthermore, the polishing pad 18a has a defined fiber density and a defined fiber layer weight. However, another configuration of the polishing pad 18a that would appear appropriate to a person skilled in the art would also be conceivable. The fibers 44a are conditioned for a polishing process. Preferably, the fibers 44a are cut to a defined length or length distribution, for example, for conditioning. Furthermore, loose fibers 44a can be removed for conditioning, for example, by brushing, combing, or blowing out.Preferably, conditioning of the fibers 44a can be carried out, for example, by etching processes, plasma processing, mechanical processing or the like in order to improve, for example, wettability and / or polishing agent adhesion.

[0042] The polishing disc element 16a is actively driven, in particular rotationally. The polishing disc element 16a is eccentrically driven. The polishing unit 14a has a drive unit 20a for a movable, in particular rotational, drive of the polishing disc element 16a. The drive unit 20a is formed by an electric motor. However, another embodiment of the drive unit 20a that would appear expedient to a person skilled in the art would also be conceivable. The drive unit 20a has a drive shaft 58a, which is directly eccentrically coupled to the polishing disc element 16a. It would also be conceivable for a gear to be additionally interposed between the polishing disc element 16a and the drive unit 20a. The drive unit 20a is arranged vertically below the polishing disc element 16a. The drive unit 20a is provided for a rotational drive of the polishing disc element 16a during a polishing process.The rotational speed of the drive unit 20a is controlled, in particular, by a computing unit 60a of the polishing device 10a. The computing unit 60a is provided for controlling and / or regulating the operation of the polishing device 10a. The computing unit 60a is connected to the drive unit 20a.

[0043] The polishing device 10a has the computing unit 60a. Furthermore, the polishing device 10a has an operating unit 98a for operating and controlling the polishing device 10a. The operating unit 98a is coupled to the computing unit 60a. The operating unit 98a has, for example, a display 100a and an operating element 102a, which is formed, for example, by a rotary pushbutton.

[0044] The polishing device 10a further comprises a workpiece holding unit 22a. The workpiece holding unit 22a comprises a workpiece holder 24a for securing the workpiece 12a during a polishing process. The workpiece 12a is fastened to the workpiece holder 24a during a polishing process. The workpiece 12a is brought into contact with the polishing disk element 16a via the workpiece holder 24a during a polishing process. Alternatively, it would also be conceivable to provide a movement unit which rotates the polishing unit 14a, for example in the form of a hollow body fitted over it, with internal fibers and polishing agents, around a stationary workpiece holder 24a. The workpiece holding unit 22a is not intended to be held by an operator. The workpiece holding unit 22a is connected to the base frame 62a of the polishing device 10a. The workpiece holding unit 22a is indirectly connected to the base frame 62a of the polishing device 10a.The workpiece holder 24a comprises a holding head 48a, which is intended to be connected directly to the workpiece 12a. A connection between the holding head 48a and the workpiece 12a is achieved, for example, by means of an adhesive bond, in particular by means of a water-soluble hot-melt adhesive, a water-soluble polymer, and / or a sugar derivative. However, it would also be conceivable for a connection between the workpiece 12a and the holding head 48a to be achieved by means of clamps, by means of looping, by means of suction through a vacuum, by means of internal spreading, by means of an anti-slip agent, and / or by means of an inflatable balloon inside a cavity of the workpiece 12a.

[0045] The workpiece holder 24a has an interchangeable holding head 48a. The holding head 48a is detachably arranged on the workpiece holder 24a, preferably detachably without tools. Different holding heads 48a are provided for different workpiece types, such as crowns, veneers, inlays, onlays, or the like. Depending on the workpiece type, corresponding holding heads 48a have integrated masking and protection functions. It would also be conceivable, in particular, for a defined number of holding head types to be available, with an optimal holding head 48a being recommended by the software depending on the scan data. The holding head 48a can be recommended and / or prescribed, in particular, depending on a set template or polishing parameter package.

[0046] The Fig. Figures 7 to 9 show five alternative holding heads 48.1a, 48.2a, 48.3a, 48.4a, 48.5a, each of which is designed to hold different types of workpieces 12a, 12.1a, 12.2a and / or equipment. The holding head 48a from Figures Fig. 1 to 6 shows a holding head for holding a workpiece 12a formed by a veneer. Fig. 7 shows a holder 112a for receiving five holding heads 48.1a, 48.2a, 48.3a, 48.4a, 48.5a, in particular the five alternative holding heads 48.1a, 48.2a, 48.3a, 48.4a, 48.5a. The alternative holding heads 48.1a, 48.2a, 48.3a, 48.4a, 48.5a are each provided for coupling to the workpiece holder 24a. The alternative holding heads 48.1a, 48.2a, 48.3a, 48.4a, 48.5a each have a coupling section 114.1a, 114.2a. The coupling sections 114.1a, 114.2a are identical. The coupling sections 114.1a, 114.2a each have a circular-cylindrical base body with a circumferential, rounded groove 116.1a, 116.2a. Furthermore, an orientation recess 118.1a is provided at a free lower end of each base body. The alternative holding heads 48.1a, 48.2a, 48.3a, 48.4a, 48.5a can be inserted into a receptacle in the workpiece holder 24a via the respective coupling section 114.1a, 114.2a, each in a defined orientation.Furthermore, the alternative holding heads 48.1a, 48.2a, 48.3a, 48.4a, 48.5a each have a fixing section 120.1a, 120.2a, 120.3a, 120.4a, 120.5a for connecting to a workpiece 12a. The fixing section 120.1a of the first alternative holding head 48.1a has a truncated cylinder-shaped basic shape with a circular base, wherein the side edges are concavely curved. Furthermore, the fixing section 120.1a of the first alternative holding head 48.1a has an orientation recess 122.1a at a lower end. The first holding head 48.1a serves to fix a workpiece 12.1a (. Fig. 8). The fixing section 120.2a of the second alternative holding head 48.2a has a circular-cylindrical basic shape with two opposing elliptical indentations, wherein the elliptical indentations converge at an upper free end and form a saddle edge 124.2a.

[0047] Furthermore, the fixing section 120.2a of the second alternative holding head 48.2a has an orientation recess 122.2a at a lower end. The second holding head 48.2a serves to fix a workpiece 12.2a designed as a partial crown or onlay. The workpiece 12.2a is fixed in particular on the saddle edge 124.2.a ( Fig. 9). The fixing section 120.3a of the third alternative holding head 48.3a has a truncated cylinder-shaped basic shape with a circular base, wherein the side edges are concavely curved. The third holding head 48.3a tapers more sharply than the first holding head 48.1a. Furthermore, the fixing section 120.3a of the third alternative holding head 48.3a has an orientation recess 122.3a at each lower end. The fixing section 120.5a of the fifth alternative holding head 48.5a has a truncated cylinder-shaped basic shape with a circular base, wherein the side edges are concavely curved. The fifth holding head 48.5a tapers more sharply than the first holding head 48.1a and the third holding head 48.3a. Furthermore, the fixing section 120.5a of the fifth alternative holding head 48.5a has an orientation recess 122.5a at each lower end. The fixing section 120.4a of the fourth alternative holding head 48.4a has a circular-cylindrical basic shape with two opposing elliptical indentations, wherein the elliptical indentations converge at an upper free end and form a saddle edge 124.4a. The indentations are smaller than the indentations of the second holding head 48.2a. Furthermore, the fixing section 120.4a of the fourth alternative holding head 48.4a has an orientation recess 122.4a at each lower end.

[0048] Alternatively, the holding head 48a can be formed by an individual, in particular an individually printed, holding head 48a. Preferably, an individual holding head 48a adapted to the workpiece 12a can be 3D-printed for each workpiece 12a based on existing scan data of the workpiece 12a, in particular using a rapid prototyping process. Corresponding holding heads 48a can then have integrated masking and protection functions depending on a workpiece 12a.

[0049] The workpiece holder 24a of the workpiece holding unit 22a is movably mounted relative to the polishing disk element 16a. The workpiece holder 24a of the workpiece holding unit 22a is mounted at least partially movably. The workpiece holder 24a is intended to be moved automatically during a polishing process. The workpiece holder 24a is movably mounted within a defined, limited range of motion. The polishing device 10a has a movement unit 26a, which is intended to move the workpiece holding unit 22a, in particular the workpiece holder 24a of the workpiece holding unit 22a, during operation on a defined path relative to the polishing unit 14a. The movement unit 26a is intended to move the workpiece 12a held by the workpiece holder 24a over the polishing disk element 16a by means of the workpiece holder 24a.The movement unit 26a is provided for moving the workpiece 12a in a defined movement pattern by means of the workpiece holder 24a over the polishing disk element 16a. The defined path in which the workpiece holder 24a is moved does not have to be identical for each polishing process. In particular, the path in which the workpiece holding unit 22a, and thus the workpiece 12a, is moved during a polishing process can be individually defined for each workpiece 12a. In particular, the path is defined by the computing unit 60a, preferably depending on a type or shape of the workpiece 12a. The computing unit 60a is designed to load a polishing parameter package for a polishing process of at least one desired workpiece 12a and / or a desired apparatus based on a selection mask, in particular a graphical and / or visualized one.The computing unit 60a is provided, in at least one operating state, in particular before the polishing step, to display to an operator via the display 100a at least one graphical and / or visualized selection mask with at least three options for workpieces 12a and / or equipment for selection. Preferably, a desired workpiece 12a and / or equipment can be selected directly via the selection mask using the operating element 102a, wherein, upon selection of the workpiece 12a and / or equipment, preferably no further polishing-specific inputs, such as polishing parameters, are necessary. The polishing parameter packages are loaded in the form of templates stored in a memory of the computing unit 60a. The polishing parameter packages or templates can be edited by an operator.The polishing parameter packages each contain, in particular, defined values ​​for various polishing parameters, such as a polishing agent supply, a rotational speed and / or a rotational speed profile of the polishing disk element 16a and / or a contact pressure, and / or a defined movement pattern for the movement unit 26a. For example, the workpiece 12a is moved back and forth in a semicircular path over the polishing disk element 16a by the movement unit 26a. The workpiece 12a can also be rotated by the workpiece holding unit 22a. The movement unit 26a has at least two movement axes 28a, 30a, via which the workpiece holder 24a can be moved in at least one plane. The movement unit 26a has two guide units 64a, 66a, which are provided for guiding the workpiece holding unit 22a, namely a first guide unit 64a and a second guide unit 66a.The guide units 64a, 66a are arranged on a frame bridge 68a, which extends at least partially over the polishing unit 14a. The frame bridge 68a is arranged on the base frame 62a. A first guide unit 64a guides the workpiece holding unit 22a along the first movement axis 28a, in particular a Z-axis. The first guide unit 64a comprises two guide rails, which are arranged directly on the frame bridge 68a. The guide rails are formed integrally with the frame bridge 68a. Furthermore, the first guide unit 64a comprises two guide carriages 70a, to which an intermediate frame 72a of the movement unit 26a is fastened and which are guided on the guide rails of the first guide unit 64a. A drive 74a of the first guide unit 64a is also arranged on one of the guide carriages 70a.The second guide unit 66a guides the workpiece holding unit 22a along the second movement axis 30a, preferably an X-axis. The second guide unit 66a comprises a guide rail rigidly connected to the intermediate frame 72a and a guide carriage 76a, which is guided on the guide rail of the second guide unit 66a. Furthermore, the second guide unit 66a has a drive (not further visible), via which the guide carriage 76a is movable on the guide rail. The drive of the first guide unit 64a and the drive of the second guide unit 66a are controlled by the computing unit 60a. However, another design of the movement unit 26a that would be deemed appropriate by a person skilled in the art would also be conceivable, such as a cantilever arm, toothed belt drive, or the like. The workpiece holding unit 22a is directly connected to the guide carriage 76a of the second guide unit 66a.

[0050] Furthermore, the workpiece holding unit 22a has a force adjustment unit 32a, which, in an operating state, is intended to exert an adjustable contact pressure on the workpiece holder 24a. The workpiece holding unit 22a has a base body 79a, which is fixedly connected to the guide carriage 76a of the second guide unit 66a. The force adjustment unit 32a is connected to the base body 79a and the workpiece holder 24a. The force adjustment unit 32a has a beam balance 34a, at one end of which the workpiece holder 24a is arranged and which is rotatably mounted on the base body 79a. Furthermore, the force adjustment unit 32a has a spring element 36a, which is intended to exert a contact force on the beam balance 34a. The spring element 36a is arranged at a pivot point of the beam balance 34a.The spring element 36a is connected at one end to the base body 79a and at the other end to a preload unit 38a. Furthermore, the force adjustment unit 32a includes the preload unit 38a, which is designed to adjust the preload of the spring element 36a. The preload unit 38a is arranged on the beam balance 34a. The beam balance 34a forms, in particular, a receiving area for the preload unit 38a. The preload unit 38a is formed by a stepper motor. Depending on the position of the preload unit 38a, the spring element 36a exerts a different torque on the beam balance 34a. However, another configuration of the force adjustment unit 32a that would be deemed appropriate by a person skilled in the art would also be conceivable.

[0051] Furthermore, the polishing device 10a has a further movement unit 46a, which, in at least one operating state, is provided for a translational movement of the entire polishing unit 14a. The further movement unit 46a is provided to move the polishing disk element 16a relative to the workpiece holder 24a. A movement axis 78a of the further movement unit 46a extends perpendicular to the movement plane of the movement unit 26a. The further movement unit 46a provides a third movement axis 78a relative to the movement unit 26a. The further movement unit 46a is arranged below the polishing unit 14a. The further movement unit 46a has a guide unit 80a. The guide unit 80a comprises a guide rail 82a, which is arranged directly on the base frame 62a.Furthermore, the guide unit 80a comprises two guide carriages (not shown) to which an intermediate frame 84a of the further movement unit 46a is attached. The guide carriages are guided on the guide rail 82a of the guide unit 80a. A drive of the guide unit 80a is also arranged on one of the guide carriages. The polishing unit 14a is arranged, in particular, on the intermediate frame 84a of the guide unit 80a of the further movement unit 46a.

[0052] Furthermore, the polishing device 10a has a polishing agent supply unit 40a, which is intended to supply polishing agent to the polishing disk element 16a. The polishing agent supply unit 40a has a polishing agent tank 86a and a supply line 88a. Furthermore, the polishing agent supply unit 40a also has a conveying unit 90a, in particular a polishing agent pump, for conveying the polishing agent from the polishing agent tank 86a along the supply line 88a. However, it would also be conceivable for the polishing agent to be conveyed solely by gravity. The supply line 88a ends, for example, above the polishing disk element 16a. Alternatively or additionally, it would also be conceivable for the polishing agent to be injected into the polishing disk element 16a from below. The polishing agent supply unit 40a is intended to continuously supply polishing agent during operation of the polishing disk element 16a.In particular, various polishing agents considered appropriate by a person skilled in the art are suitable as polishing agents. The polishing agent has adhesive properties to the polishing pad 18a, in particular to fibers 44a of the polishing pad 18a. The polishing agent contains an abrasive component. Various abrasives considered appropriate by a person skilled in the art are conceivable, such as, in particular, diamond, corundum, silicon carbide, and / or silicates. Furthermore, it would also be conceivable for the polishing device 10a to have a polishing agent collecting device (not shown) intended to collect polishing agent flung or dripping from the polishing disk element 16a.

[0053] Furthermore, the polishing device 10a has a splash guard 91a. The splash guard 91a is arranged on the intermediate frame 84a of the guide unit 80a of the further movement unit 46a. The splash guard 91a encloses the polishing disk element 16a in three spatial directions.

[0054] The polishing device 10a further comprises a polishing pad regeneration unit 50a. The polishing pad regeneration unit 50a is provided, in at least one operating state, in particular before or after a polishing process, to bring the polishing disk element 16a, in particular the polishing pad 18a, into a defined state of polishing capability, in particular to rinse it to establish or restore the polishing capability. The polishing pad regeneration unit 50a is provided, in at least one operating state, in particular after a polishing process, to rinse the polishing disk element 16a, in particular the polishing pad 18a, to restore the polishing capability. The polishing pad regeneration unit 50a is provided to restore the polishing capability. The polishing pad regeneration unit 50a is provided to automatically rinse the polishing pad 18a, wherein, in particular, abrasive particles and polishing agent are rinsed from the polishing pad.The polishing pad regeneration unit 50a is provided, for example, to rinse the polishing pad 18a using a rinsing fluid. Furthermore, the polishing pad regeneration unit 50a can be provided to shorten the fibers of the polishing pad and / or remove loose fibers from the polishing pad. The polishing pad regeneration unit 50a is arranged, for example, on the guide carriage 76a of the second guide unit 66a and has, for example, spray means for applying a rinsing fluid. The rinsing fluid can be collected, for example, using a polishing agent collecting device.

[0055] Furthermore, the polishing device 10a has a measuring and testing cell 108a, which is intended to perform a check of the polishing result of the workpiece 12a and / or the equipment. During the check, an assessment of the gloss level of a surface of the workpiece 12a is carried out. For this purpose, the measuring and testing cell 108a has, for example, a light source, which is intended to be directed onto the workpiece 12a and / or the equipment, wherein a reflected light can be captured by a camera (not shown in detail) of the measuring and / or testing cell 108a, in particular a CMOS camera. In particular, it can be output to an operator as a measure of the gloss level of the workpiece 12a and / or the equipment with false color representation, so that the polishing result can be subsequently adjusted.The measuring and testing cell 108a, like the polishing pad regeneration unit 50a, is arranged above the polishing disk element 16a on the guide carriage 76a of the second guide unit 66a.

[0056] Furthermore, the polishing device 10a has a temperature sensor (not shown in detail), which is intended to measure and evaluate the temperature behind the workpiece 12a and / or the equipment on the polishing pad 18a during operation during a polishing process. The temperature sensor is connected to the computing unit 60a. If the temperature is outside the previously defined control range, more polishing agent can be added, or a contact force and / or speed can be reduced to prevent damage to the workpiece. Furthermore, a sensor can be provided that measures the forces acting laterally on the workpiece 12a and / or the equipment and, together with the computing unit 60a, serves to determine the frictional force.

[0057] Fig. 10 shows a flowchart of a method for operating the polishing device 10a. During the method, a dental workpiece 12a is polished automatically.

[0058] The method includes, for example, a transmission step 92a. In transmission step 92a, an operator transmits CAD data and / or scan data of a dental workpiece 12a to be polished to the computing unit 60a of the polishing device 10a. Alternatively or additionally, it would also be conceivable for the workpiece 12a to be scanned directly by the polishing device 10a. Furthermore, it would also be conceivable for an operator to merely specify the type of dental workpiece 12a involved. Furthermore, it would also be conceivable for a type of dental workpiece 12a to be detected directly by the computing unit 60a via the holding head 48a. For this purpose, the holding head 48a can, for example, have a code or a chip, such as, in particular, an RFID chip.

[0059] Furthermore, the method comprises a selection step 106a prior to a polishing step, in which, depending on the workpiece 12a and / or the equipment, in particular depending on a type or geometry of the workpiece 12a and / or equipment, a polishing parameter package designed for polishing the workpiece 12a and / or the equipment, in particular in the form of defined values ​​for various polishing parameters and / or for a movement pattern of the workpiece holder, is selected and applied by the computing unit 60a. For this purpose, the computing unit 60a provides the operator with a graphical and / or visualized selection mask with at least three options for workpieces 12a and / or equipment for selection via the display 100a.Preferably, a desired workpiece 12a and / or a desired piece of equipment can be selected directly via the selection mask, whereby, upon selecting the workpiece 12a and / or the equipment, no further polishing-specific inputs, such as polishing parameters, are required. It is also conceivable, in particular, for the selection mask to be multi-stage and have multiple selection levels. The polishing parameter packages are loaded, in particular, in the form of templates.

[0060] The method further comprises a fixing step 54a. The fixing step 54a preferably follows the transfer step 92a. In the fixing step 54, the workpiece 12a is connected to a holding head 48a of the workpiece holder 24a by means of an adhesive connection. For this purpose, a holding head 48a that matches the workpiece 12a is selected, and the workpiece 12a is glued onto the holding head. The adhesive connection is, in particular, detachable. Preferably, an adhesive used is water-soluble. After the workpiece 12a has been glued onto the holding head 48a, the holding head 48a is connected to the workpiece holder 24a in a connecting step 94a. The connection is, in particular, made via a detachable plug connection.

[0061] A polishing step 52a then follows. The polishing step 52a can be started for a polishing process via a user interface (not shown in detail), such as in particular a touch display, of the computing unit 60a. The computing unit 60a selects a polishing program suitable for the workpiece 12a. The polishing program contains, in particular, a defined movement sequence of the movement unit 26a and the second movement unit 46a, a defined contact pressure of the force adjustment unit 32a and / or a defined rotational speed of the drive unit 20a. In the polishing step 52a, the workpiece 12a held by the workpiece holder 24a and / or an apparatus held by the workpiece holder 24a is automatically polished at least in sections by means of the polishing unit 14a of the polishing device 10a.For automatic polishing, the polishing program is executed by the computing unit 60a, wherein the polishing program is preferably adapted to a workpiece 12a. During the polishing process, polishing agent is supplied to the polishing disk element 16a by means of the polishing agent supply unit 40a.

[0062] This is followed by a control step 110a, in which the polishing result is checked using the measuring and testing cell 108a. During the control, a gloss level is assessed. For this purpose, for example, a directed light source is directed onto the workpiece 12a and / or the equipment, with reflected light being captured by the camera, in particular a CMOS camera. It can, in particular, be output to an operator as a measure of the gloss level of the workpiece 12a and / or the equipment with false color representation, so that the polishing result can be subsequently adjusted. It would also be conceivable for the computing unit 60a to automatically generate another polishing program, which serves to improve the polishing result.

[0063] This is followed by a release step 96a. In the release step 96a, the workpiece 12a is released from the holding head 48a. The workpiece 12a is released using water. In particular, a separate device for releasing the workpiece 12a, for example, using water, can be provided.

[0064] Furthermore, a regeneration step 56a follows the polishing step 52a. In the regeneration step 56a, the polishing disk element 16a, in particular the polishing pad 18a, is rinsed by the polishing pad regeneration unit 50a to restore its polishing capability. The polishing pad regeneration unit 50a rinses the polishing pad 18a, for example, using a rinsing liquid. The polishing pad regeneration unit 50a rinses the polishing pad 18a automatically, in particular by flushing abrasive particles and polishing agent from the polishing pad 18a. The process can then be repeated again with the transfer step 92a and another workpiece 12a.

[0065] In the Fig. 11 shows a further embodiment of the invention. The following descriptions are essentially limited to the differences between the embodiments, with reference to the description of the embodiment of the Fig. 1 to 10. To distinguish the embodiments, the letter a in the reference numerals of the embodiment in the Fig. 1 to 10 by the letter b in the reference numerals of the embodiment of the Fig. 11. With regard to components with the same designation, in particular with regard to components with the same reference numerals, reference can in principle also be made to the drawings and / or the description of the embodiment of the Fig. 1 to 10.

[0066] Fig.11 shows an alternative polishing device 10b according to the invention. The polishing device 10b is intended for at least partially automated polishing of at least one, in particular dental, workpiece 12b.

[0067] The polishing device 10b has a polishing unit 14b. The polishing unit 14b comprises a first polishing disk element 16b and a polishing pad 18b arranged on the first polishing disk element 16b. The polishing unit 14b further comprises a second polishing disk element 16b' and a polishing pad 18b' arranged on the second polishing disk element 16b'. The polishing pads 18b, 18b' are each detachably connected to the respective polishing disk element 16b, 16b'. The polishing pads 18b, 18b' each have two main extension surfaces, which extend parallel to a main extension plane of the respective polishing pad 18b, 18b', namely polishing surfaces 42b and a fastening surface for a detachable connection to the respective polishing disk element 16b, 16b'. The polishing surfaces 42b, 42b' of the polishing pads 18b, 18b' face each other. The second polishing disc element 16b' is arranged above the first polishing disc element 16b.A polishing area is formed between the polishing disc elements 16b, 16b'. The polishing unit 14b is intended to smooth at least one surface of the workpiece 12b, in particular by removing material. The polishing unit 14b is intended to reduce the roughness of at least one surface of the workpiece 12b. For this purpose, the polishing pads 18b, 18b' are brought into direct contact with the workpiece surface during a polishing process. The polishing pads 18b, 18b' can themselves contain abrasive particles and / or be provided with a polishing agent during a polishing process.

[0068] The first polishing disc element 16b has a three-dimensionally shaped edge, such as a type of cup-shaped rim. The edge allows for the polishing of side surfaces or free-form surfaces of a workpiece 12b, such as those found in crowns. By means of a workpiece holder 24b, the contact pressure on the three-dimensionally shaped first polishing disc element 16b can be varied, in particular depending on the object and the polishing progress.

[0069] The polishing disc elements 16b, 16b' are each actively driven, in particular rotationally driven. The polishing disc elements 16b, 16b' are eccentrically driven. The polishing unit 14b has two drive units for a movable, in particular rotational, drive of the polishing disc elements 16b, 16b'. The drive units are each formed by an electric motor. The drive units are each provided for a rotating drive of the polishing disc elements 16b, 16b' during a polishing process. A rotational speed of the drive units can be controlled independently of one another via a computing unit of the polishing device 10b. As rotational speed variants of the rotational speed n1 of the first polishing disc element 16b and the rotational speed n2 of the second polishing disc element 16b', it would be conceivable, in particular, that n1 = n2, n1 ≠ n2, n1 = 0, or n2 = 0. Furthermore, the polishing disc elements 16b, 16b' can be driven in counter-rotation.Furthermore, the axes of the drive unit and / or the polishing disc elements 16b, 16b' can be offset from one another. Furthermore, a variable contact pressure by means of adjustable polishing disc elements 16b, 16b' would also be conceivable. Alternatively or additionally, oscillation of the polishing disc elements 16b, 16b' would also be possible. A computing unit is provided for controlling and / or regulating the operation of the polishing device 10b. The computing unit is connected to the drive units.

[0070] The polishing device 10b further comprises a workpiece holding unit 22b. The workpiece holding unit 22b comprises the workpiece holder 24b for fixing the workpiece 12b during a polishing process. The workpiece 12b is fastened to the workpiece holder 24b during a polishing process. The workpiece 12b is brought into contact with the polishing disk elements 16b, 16b' via the workpiece holder 24b during a polishing process. The workpiece holder 24b comprises an externally attached flexible shaft, which can be positioned as desired relative to the polishing disk elements 16b, 16b'. The workpiece holding unit 22b further comprises a drive 104b, in particular an electric motor, which is provided for rotatingly driving the workpiece holder 24b. List of reference symbols 10 Polishing device 12 Workpiece 12.1 Workpiece 12.2 Workpiece 14 Polishing unit 16 polishing disc element 18 polishing pad 20 drive unit 22 Workpiece holding unit 24 Workpiece holder 26 movement units 28 Movement axis 30 Movement axis 32 force adjustment unit 34 beam balance 36 spring element 38 Preload unit 40 Polishing agent supply unit 42 polishing surface 44 fibers 46 movement units 48 Holding head 48.1 Holding head 48.2 Holding head 48.3 Holding head 48.4 Holding head 48.5 Holding head 50 polishing pad regeneration unit 52 polishing steps 54 Fixing step 56 Regeneration step 58 drive shaft 60 computing units 62 base frames 64 command unit 66 Command Unit 68 frame bridge 70 guide carriages 72 intermediate frames 74 Drive 76 guide carriages 78 Movement axis 79 basic bodies 80 management unit 82 guide rail 84 intermediate frames 86 Polishing agent tank 88 supply line 90 conveyor unit 91 Splash guard 92 Transfer step 94 Connection step 96 Release step 98 Control unit 100 displays 102 Control element 104 Drive 106 Selection step 108 measuring and test cell 110 Control step 112 bracket 114.1 Coupling section 114.2 Coupling section 116.1 Groove 116.2 Groove 118.1 Orientation recess 120.1 Fixing section 120.2 Fixing section 120.3 Fixing section 120.4 Fixing section 120.5 Fixing section 122.1 Orientation recess 122.2 Orientation recess 122.3 Orientation recess 122.4 Orientation recess 122.5 Orientation recess 124.2 Saddle edge 124.4 Saddle edge

Claims

[1] Polishing device, in particular a dental polishing device, for at least partially automated polishing of at least one, in particular dental, workpiece (12a, 12.1a, 12.2a; 12b) and / or an apparatus, with at least one polishing unit (14a; 14b) which has a polishing disk element (16a; 16b), in particular a polishing disk with at least one polishing pad (18a), and with a workpiece holding unit (22a; 22b) which has at least one workpiece holder (24a; 24b) for fixing the workpiece (12a, 12.1a, 12.2a; 12b) and / or the apparatus during a polishing process, characterized by that the workpiece holder (24a; 24b) of the workpiece holding unit (22a; 22b) is at least partially movable relative to the polishing disk element (16a; 16b). [2] Polishing device according to claim 1, characterized byin that the polishing unit (14a; 14b) has a drive unit (20a) for a movable, in particular rotary, drive of the polishing disk element (16a; 16b), wherein the workpiece holder (24a; 24b) of the workpiece holding unit (22a; 22b) is mounted at least partially movable. [3] Polishing device according to claim 1 or 2, characterized by a movement unit (26a) which is provided to move the workpiece holding unit (22a), in particular the workpiece holder (24a) of the workpiece holding unit (22a), in operation on a defined path, in particular in a defined movement pattern, relative to the polishing unit (14a). [4] Polishing device according to claim 3, characterized by that the movement unit (26a) has at least two movement axes (28a, 30a) via which the workpiece holder (24a) can be moved in at least one plane. [5] Polishing device according to one of the preceding claims, characterized bythat the workpiece holding unit (22a) has at least one force adjustment unit (32a) which, in at least one operating state, is provided to act on the workpiece holder (24a) in a contact pressure, in particular an adjustable pressure. [6] Polishing device according to claim 5, characterized by that the force adjustment unit (32a) has at least one beam balance (34a), at one end of which the workpiece holder (24a) is arranged, at least one spring element (36a) which is intended to act on the beam balance (34a) with a contact force, and at least one pretensioning unit (38a), in particular a stepper motor, which is intended to adjust a pretension of the spring element (36a). [7] Polishing device according to one of the preceding claims, characterized by a polishing agent supply unit (40a) which is provided for supplying polishing agent to the polishing disk element (16a). [8] Polishing device according to one of the preceding claims, characterized by that the polishing pad (18a; 18b) comprises aligned fibers (44a), in particular wool fibers, which are arranged on a polishing surface (42a; 42b) of the polishing pad (18a; 18b). [9] Polishing device according to claim 8, characterized by that the fibers (44a) are formed substantially vertically. [10] Polishing device at least according to claim 8, characterized by that the fibers (44a) are conditioned for a polishing process. [11] Polishing device according to one of the preceding claims, characterized by a further movement unit (46a) which is provided in at least one operating state for a translational movement of the entire polishing unit (14a). [12] Polishing device according to one of the preceding claims, characterized by that the workpiece holder (24a) has an exchangeable holding head (48a). [13] Polishing device according to one of the preceding claims, characterized by a polishing pad regeneration unit (50a) which, in at least one operating state, in particular before or after a polishing process, is provided to bring the polishing disk element (16a), in particular the polishing pad (18a), into a defined state of polishability, in particular to rinse it to establish or restore the polishability. [14] Polishing device according to one of the preceding claims, characterized by a measuring and / or testing cell (108a) which is intended to carry out a check of a polishing result of the workpiece (12a, 12.1a, 12.2a) and / or the apparatus. [15] Workpiece holding unit of a polishing device (10a; 10b) according to one of the preceding claims. [16] Method for operating the polishing device (10a) according to one of claims 1 to 14, characterized byin that in at least one polishing step (52a) a workpiece (12a, 12.1a, 12.2a) held by the workpiece holder (24a) and / or an apparatus held by the workpiece holder (24a) is automatically polished at least in sections by means of the polishing unit (14a) of the polishing device (10a). [17] Method according to claim 16, characterized by that in at least one fixing step (54a), in particular before the polishing step (52a), the workpiece (12a) and / or the apparatus is connected to a holding head (48a) of the workpiece holder (24a) by means of an adhesive connection. [18] Method according to claim 16 or 17, characterized by in that in at least one regeneration step (56a), in particular after the polishing step (52a), the polishing disk element (16a), in particular the polishing pad (18a), is rinsed by means of the polishing pad regeneration unit (50a) to restore the polishing ability. [19] Method according to one of claims 16 to 18, characterized by in that in at least one selection step (106a), depending on the workpiece (12a, 12.1a, 12.2a) and / or the apparatus, in particular depending on a type or geometry of the workpiece (12a, 12.1a, 12.2a) and / or apparatus, a polishing parameter package designed for polishing the workpiece (12a, 12.1a, 12.2a) and / or the apparatus, in particular in the form of defined values ​​for various polishing parameters and / or for a movement pattern of the workpiece holder (24a), is selected and applied by the computing unit (60a).

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