POWER MODULE

Abstract

A power module (20) comprising a converter stage (22) for converting an AC current into a DC current or a DC current into an AC current, and a DC intermediate circuit (26) electrically coupled to the converter stage (22) by a conductor arrangement (30), wherein the conductor arrangement (30) comprises a first conductor (62) for carrying a current between the converter stage (22) and the DC intermediate circuit (26) in a first current direction (34) and a second conductor (64) for carrying a current between the converter stage (22) and the DC intermediate circuit (26) in a second current direction (36) opposite to the first current direction (34), wherein the first conductor (62) comprises two or more first fingers (74) extending in a first extension direction (80) perpendicular to the first and second current directions (34, 36) to the second conductor (64), the second conductor (64) comprises two or more second fingers (76) extending in a direction parallel to the first extension direction (80) to the first conductor (62), the first and second fingers (74, 76) are arranged to engage with each other, and the first and second conductors (62, 64) are electrically insulated from each other.

Description

[0001] The invention relates to a power module. The power module can be an electrical converter, e.g., an inverter or a rectifier, and / or can form or comprise one or more half-bridges.

[0002] A conventional power module may comprise a carrier, at least one semiconductor chip mounted on the carrier, and a driver board arranged above the semiconductor chip. The carrier may comprise a DBC (direct bonded copper) substrate or an IMS (insulated metal substrate). The driver board may be configured to electrically contact and / or control the semiconductor chip. The semiconductor chip may be a high-power semiconductor chip. The power module may be configured to convert AC power into DC power or vice versa. Corresponding power modules are known from US 2020 / 0 084 878 A1 and US 2019 / 0 006 831 A1.

[0003] Some modern power modules, such as those that incorporate SiC- or GaN-based semiconductor chips, can offer high efficiency because very low switching energy is required to turn the semiconductor chips on and off. However, when switching the semiconductors at high speeds, the rapid switching can cause voltage oscillations. This can lead to an electromagnetic compatibility (EMC) problem for the power module.

[0004] Therefore, it is an object of the present invention to provide a power module that can enable high-speed switching, which can require only low switching energy, which can provide high EMC and / or which can particularly generate low or negligible voltage oscillations.

[0005] The object is solved by the subject matter of the independent claim. Advantageous embodiments are recited in the dependent claims.

[0006] One aspect relates to a power module. The power module comprises a converter stage for converting an AC current into a DC current or a DC current into an AC current, and a DC intermediate circuit electrically coupled to the converter stage by a conductor arrangement, wherein the conductor arrangement comprises a first conductor for carrying a current between the converter stage and the DC intermediate circuit in a first current direction and a second conductor for carrying a current between the converter stage and the DC intermediate circuit in a second current direction opposite to the first current direction. The first conductor comprises two or more first fingers extending to the second conductor in a first extension direction perpendicular to the first and second current directions. The second conductor comprises two or more second fingers extending to the first conductor in a direction parallel to the first extension direction.The first and second fingers are arranged to interlock. The first and second conductors may be electrically insulated from each other.

[0007] The inventors have recognized that one way to solve the above problem may be to reduce parasitic inductance induced by conductors, in other words, busbars, that electrically couple the converter stage to the DC link. This is because the amplitude of the voltage oscillations discussed above is proportional to the inductance generated by the power module and the switching speed at which the semiconductor chips are turned on and off. Therefore, low inductance can contribute to low voltage oscillations.

[0008] Furthermore, the inventors recognized that the parasitic inductance generated by a conventional busbar of a conventional power module can amount to between 40% and 70% of the total inductance generated by the power module. Reducing the inductance induced by the busbar, in other words, by the corresponding choke coils, can effectively contribute to reducing the total inductance generated and thus the voltage oscillations.

[0009] The interlocking fingers contribute to the fact that the inductance introduced into the power module by the conductor arrangement during operation of the power module can be very low. The low inductance can contribute to the fact that the voltage oscillations generated during operation of the power module, particularly when switching one or more semiconductor chips of the power module, are very small and / or negligible. This can enable fast switching of the power module and / or only low switching energy. Furthermore, high EMC can be provided by the power module. Furthermore, the power module can be provided at a low cost and / or have a low weight compared to conventional power modules.

[0010] The first and second fingers interlock. In other words, the first and second fingers are arranged alternately in the first and / or second current direction. Each of the fingers may be straight, i.e., have no bends. The first and second conductors may be electrically insulated from one another by an electrically insulating material arranged in the first and second current directions and in the first extension direction between the first and second conductors, in particular between the first and second fingers.Thus, only a single film of electrically insulating material can be arranged between the first and second conductors in the first and second current directions and in the first extension direction. Depending on the position of the corresponding section of the insulating film, the electrically insulating film can extend in the first and / or second current directions and in a second extension direction or in the first and second extension directions, the second extension direction being perpendicular to the first and second current directions and to the first extension direction.

[0011] The converter stage may comprise two or more semiconductor chips that are electrically coupled to one another. The converter stage may comprise one or more half-bridges. For example, the half-bridge(s) may be formed by the semiconductor chips. One or more of the semiconductor chips may be high-power semiconductor chips. The power module may be configured as an inverter. The DC link may comprise or be formed by a DC capacitor. The conductor arrangement may be referred to as a busbar.

[0012] According to one embodiment, the conductor arrangement comprises a first plane side parallel to the first and second current directions and parallel to the first extension direction, the conductor arrangement comprises a second plane side parallel and opposite the first plane side, the first plane side comprises a first side of the first conductor and a first side of the second conductor, and the second plane side comprises a second side of the first conductor and a second side of the second conductor. Thus, the first side of the first conductor can be flush with the first side of the second conductor, and the second side of the first conductor can be flush with the second side of the second conductor. If the first plane side is a top side of the conductor arrangement and the second plane side is a bottom side of the conductor arrangement, the conductor arrangement can therefore comprise only a single layer, viewed from the side.In such a side view, the first and second conductors can be arranged one behind the other. In other words, the conductor arrangement can comprise only a single layer in a second extension direction perpendicular to the first extension direction and perpendicular to the first and second current directions. This single-layer approach can enable a very thin conductor arrangement. Furthermore, easy and / or non-destructive bending of the conductor arrangement can be possible. The first plane side can be parallel to the second plane side.

[0013] In this context, the plane sides refer to the sides of the conductive part of the conductor arrangement. The conductor arrangement can optionally comprise an electrically insulating outer shell surrounding the conductive part. If the conductor arrangement as a whole, in particular the shell, is electrically insulated, the plane sides do not correspond to the outer sides, surfaces and / or planes of the entire conductor arrangement, but only to outer sides, surfaces and / or planes of the conductive part. The outer shell can also comprise several sides, wherein one of these sides can be arranged parallel to and directly on the first plane side and another of these sides can be arranged parallel to and directly below the second plane side.

[0014] According to one embodiment, the first plane side comprises a first side of the first fingers and a first side of the second fingers, and / or the second plane side comprises a second side of the first fingers and a second side of the second fingers. Thus, in the second extension direction, the first fingers and generally the first conductor may extend from the first plane side to the second plane side, and the second fingers and generally the second conductor may also extend from the first plane side to the second plane side. This may contribute to a very thin and / or compact conductor arrangement.

[0015] According to one embodiment, the first conductor comprises a first rod extending from the converter stage to the DC link and from which the first fingers extend, and / or the second conductor comprises a second rod extending from the converter stage to the DC link and from which the second fingers extend. The first rod may be parallel to the second rod. The first rod may be separated from the second rod by the first and second fingers. The first and second rods may extend in the first and / or second current direction. The first rod and the first fingers may be fixedly connected to one another. The first rod may couple the first fingers to one another. The first rod and the first fingers may be formed as one piece. The second rod and the second fingers may be fixedly connected to one another. The second rod may couple the second fingers to one another.The second rod and the second fingers may be formed integrally. Each of the rods may be straight, i.e., have no bends.

[0016] According to one embodiment, the first plane side is formed by a first side of the fingers, the first rod, the second fingers and the second rod and / or the second plane side is formed by a second side of the first fingers, the first rod, the second fingers and the second rod.

[0017] According to one embodiment, the first fingers are arranged perpendicular to the first rod and / or the second fingers are arranged perpendicular to the second rod.

[0018] According to one embodiment, the first conductor comprises a first contact of the first conductor arranged on the first rod and coupled to the DC link, and one or more second contacts of the first conductor arranged on corresponding ones of the first fingers and configured to couple to the converter stage. Alternatively or additionally, the second conductor comprises a first contact of the second conductor arranged on the second rod and coupled to the converter stage, and one or more second contacts of the second conductor arranged on corresponding ones of the second fingers and configured to couple to the DC link.

[0019] According to one embodiment, the power module is configured as an electrical inverter. Optionally, one or more semiconductor chips can be configured as high-power semiconductor chips. The high-power semiconductor chips can be configured to process high voltages, for example, more than 100 V, and / or high currents, for example, more than 10 A.

[0020] These and other aspects of the invention will become apparent and explained with reference to the embodiments described below. Embodiments of the present invention will be described in more detail below with reference to the attached figures. Fig. 1 shows a circuit diagram of an embodiment of a power module. Fig. Figure 2 shows a side view of a conventional conductor arrangement for a conventional power module. Fig. 3 shows a plan view of the conventional conductor arrangement of Fig. 2. Fig. 4 shows a side view of an embodiment of a conductor arrangement of the power module of Fig. 1. Fig. 5 shows a plan view of the conductor arrangement of Fig. 4.

[0021] The reference symbols used in the drawings and their meanings are summarized in the following list of reference symbols. Identical parts in the figures are generally provided with the same reference symbols.

[0022] Fig. 1 shows a circuit diagram of an embodiment of a power module 20. The power module 20 can be configured as an inverter or as a rectifier.

[0023] The power module 20 includes a converter stage 22 for converting an AC current into a DC current or a DC current into an AC current, and a DC intermediate circuit 26 electrically coupled to the converter stage 22 by a conductor arrangement 30. The conductor arrangement 30 may be referred to as a busbar.

[0024] The power module 20 may further include a battery 24 coupled to the DC link 26, an AC terminal 40 having three or more electrical contacts, a first DC terminal 42, and a second DC terminal 44. The DC link 26 may include a DC capacitor 28. One side of the DC capacitor 28 may be electrically coupled to the first DC terminal 42, and another side of the DC capacitor 28 may be electrically coupled to the second DC terminal 44. For example, the first DC terminal 42 may be a DC+ terminal and the second DC terminal 44 may be a DC- terminal.

[0025] During operation of the power module 20, a current can flow in a first current direction 34 from the DC link 26 through the conductor arrangement 30 to the first DC terminal 42 and in a second current direction 36 from the DC link 26 to the second DC terminal 44, or vice versa. The current flowing through the conductor arrangement can generate a parasitic inductance 32 between the DC link 26 and the first DC terminal 42 and between the DC link 26 and the second DC terminal 44.

[0026] The converter stage 22 comprises a semiconductor arrangement 38 having two or more electrically coupled semiconductor chips 46. The converter stage 22 may comprise or form one or more half-bridges. For example, the half-bridge(s) may be formed by the semiconductor chips 46. One or more of the semiconductor chips 46 may be high-power semiconductor chips. The high-power semiconductor chips may be configured to process high voltages, for example, more than 100 V, and / or high currents, for example, more than 10 A. The semiconductor chips 46 may comprise SiC or GaN.

[0027] Fig. Figure 2 shows a side view of a conventional conductor assembly 50 for a conventional power module (not shown).

[0028] Fig. 3 shows a plan view of the conventional conductor assembly 50 of Fig. 2.

[0029] The conventional conductor assembly 50 may include a conventional first conductor 52 and a conventional second conductor 54. The conventional first conductor 52 may be disposed on the conventional second conductor 54. An insulating layer 56 may be disposed between the conventional first conductor 52 and the conventional second conductor 54. The insulating layer 56 electrically insulates the conventional first conductor 52 from the conventional second conductor 54. The conventional first conductor 52, the insulating layer 56, and / or the conventional second conductor 54 may each be in the form of a sheet or layer, wherein the sheets or layers may run parallel to one another.

[0030] During operation of the power module 20, the current can flow in the first current direction 34 through the conventional first conductor 52 and in the second current direction 36 through the conventional second conductor 54, or vice versa. In Fig. 3, the conventional second conductor 54 is arranged below the conventional first conductor 56 and is not visible. Therefore, the second current direction 36, which indicates the direction in which the current flows through the conventional second conductor 54, is in Fig. 3 dashed.

[0031] In such a conventional conductor arrangement 30, the parasitic inductances 32 are relatively high.

[0032] Fig. 4 shows a side view of an embodiment of a conductor arrangement 30 of the power module 20 of Fig. 1.

[0033] Fig. 5 shows a plan view of the conductor arrangement 30 of Fig. 4.

[0034] The conductor arrangement 30 comprises a first conductor 62 for carrying the current between the converter stage 22 and the DC intermediate circuit 26 in the first current direction 34 and a second conductor 64 for carrying the current between the converter stage 22 and the DC intermediate circuit 26 in the second current direction 36 opposite the first current direction 34. The first and second conductors 62, 64 can be electrically insulated from one another.

[0035] The first conductor 62 comprises two or more first fingers 74 that extend in a first extension direction 80 perpendicular to the first and second current directions 34, 36 to the second conductor 64. The second conductor 64 comprises two or more second fingers 76 that extend in a direction parallel to the first extension direction 80 to the first conductor 62. The first and second fingers 74, 76 are arranged such that they interlock. Thus, the first and second fingers 74, 76 interlock. In other words, the first and second fingers 74, 76 are arranged alternately in the first and / or second current directions 34, 36. Each of the fingers 74, 76 can be straight, i.e., have no curvatures. Each of the fingers 74, 76 can have a rectangular shape. For example, the corners, e.g., all corners, of the fingers 74, 76 can comprise right angles, such as 90°. Am Fig. 5 is shown.

[0036] The first conductor 62 may comprise a first rod 70 extending from the converter stage 22 to the DC link 26 and from which the first fingers 74 extend. Alternatively or additionally, the second conductor 64 may comprise a second rod 72 extending from the converter stage 22 to the DC link 26 and from which the second fingers 76 extend. The first fingers 74 may be arranged perpendicular to the first rod 70. Alternatively or additionally, the second fingers 76 may be arranged perpendicular to the second rod 72. The first rod 70 may be parallel to the second rod 72. The first rod 70 may be separated from the second rod 72 by the first and second fingers 74, 76. The first and second rods 70, 72 may extend in the first and / or second current directions 34, 36. The first rod 70 and the first fingers 74 may be fixedly connected to one another. The first rod 70 can couple the first fingers 74 together.The first rod 70 and the first fingers 74 can be formed integrally. The second rod 72 and the second fingers 76 can be fixedly connected to one another. The second rod 72 can couple the second fingers 76 to one another. The second rod 72 and the second fingers 76 can be formed integrally. Each of the rods 70, 72 can be straight, i.e., have no bends.

[0037] The first and second conductors 62, 64 can be electrically insulated from one another by an electrically insulating material 66 arranged between the first and second conductors 62, 64, in particular between the first and second fingers 74, 76, in the first and second current directions 34, 36 and in the first extension direction 80. Thus, only a single film of electrically insulating material 66 can be arranged between the first and second conductors 62, 64 in the first and second current directions 34, 36 and in the first extension direction 80.Depending on the position of the corresponding portion of the insulating film of the insulating material 66, the electrically insulating film may extend in the first and / or second current direction 34, 36 and in a second extension direction 82 or in the first and second extension directions 80, 82, wherein the second extension direction 82 is perpendicular to the first and second current directions 34, 36 and to the first extension direction 80.

[0038] Out of Fig. 4 that the conductor arrangement 30 may comprise a first plane side 84 parallel to the first and second current directions 34, 36 and parallel to the first extension direction 80, and that the conductor arrangement 30 may comprise a second plane side 86 parallel and opposite the first plane side 84. The first plane side 84 may be parallel to the second plane side 86. The first plane side 84 comprises a first side of the first conductor 62 and a first side of the second conductor 64. The second plane side 86 comprises a second side of the first conductor 62 and a second side of the second conductor 64. In particular, the first plane side 84 may comprise a first side of the first fingers 74 and a first side of the second fingers 76. Alternatively or additionally, the second plane side 86 may comprise a second side of the first fingers 74 and a second side of the second fingers 76.For example, the first plane side 84 may be formed by a first side of the first fingers 74, the first rod 70, the second fingers 76, and the second rod 72. Alternatively or additionally, the second plane side 86 may be formed by a second side of the first fingers 74, the first rod 70, the second fingers 76, and the second rod 72.

[0039] Thus, in the second extension direction 82, the first fingers 74, the first rod 70, and generally the first conductor 62 may extend from the first plane side 84 to the second plane side 86, and the second fingers 76, the second rod 72, and generally the second conductor 64 may also extend from the first plane side 84 to the second plane side 86. In other words, the first side of the first conductor 62 may be flush with the first side of the second conductor 64, and the second side of the first conductor 62 may be flush with the second side of the second conductor 64. If the first plane side 84 is a top side of the conductor assembly 30 and the second plane side 86 is a bottom side of the conductor assembly 30, as in Fig. 4, the conductor arrangement, viewed from the side, can therefore comprise only a single layer. In such a side view, the first and second conductors 62, 64 can be arranged one behind the other. In other words, the conductor arrangement 30 can comprise only a single layer in the second extension direction 82, which runs perpendicular to the first extension direction 80 and perpendicular to the first and second current directions 34, 36.

[0040] In this context, the plane sides 84, 86 refer to the sides of a conductive part of the conductor arrangement 30 provided by the first and second conductors 62, 64. The conductor arrangement 30 may optionally comprise an electrically insulating outer sheath (not shown) surrounding the conductive part. If the conductor arrangement 30 as a whole, in particular the sheath, is electrically insulated, the plane sides 84, 86 do not correspond to the outer sides, surfaces, and / or planes of the entire conductor arrangement 30, but only to outer sides, surfaces, and / or planes of the conductive part. The outer sheath may also comprise multiple sides, wherein one of these sides may be arranged parallel to and directly on the first plane side 84 and another of these sides may be arranged parallel to and directly below the second plane side 86 when the conductor arrangement 30 is as in Fig. 4 is aligned.

[0041] The first conductor 62 may include a first contact 90 of the first conductor 62, which may be arranged on the first rod 70 and which may be coupled to the DC link 26. Furthermore, the first conductor 62 may include one or more second contacts 92 of the first conductor 62, which may be arranged on corresponding ones of the first fingers 74 and which may be configured to couple to the converter stage 22. Alternatively or additionally, the second conductor 64 may include a first contact 94 of the second conductor 64, which is arranged on the second rod 72 and which is coupled to the converter stage 22. Furthermore, the second conductor 64 may include one or more second contacts 96 of the second conductor 64, which may be arranged on corresponding ones of the second fingers 76 and which may be coupled to the DC link 26.The contacts 90, 92, 94, 96 may include an electrically conductive pad (not shown) or a through-hole for coupling to a corresponding electrical line (not shown), which may extend from the contacts 90, 92, 94, 96 to the DC link 26 or the converter stage 22, respectively. Thus, in each of the conductors 62, 64, the current may flow from the corresponding first contact 90, 94 via the corresponding rod 70, 72 and the corresponding fingers 74, 76 to the corresponding second contacts 92, 96, or vice versa.

[0042] A height H of the conductor assembly 30 in the second extension direction 82 may correspond to the height H of one of the conventional conductors 52, 54. Thus, the height H of the conductor assembly 30 may be less than half of the conventional conductor assembly 50. Furthermore, the weight of the conductor assembly 30 may be approximately half of the conventional conductor assembly 50, since a weight of each of the conductors 62, 64 may be approximately half the weight of the conventional conductors 52, 54, at least when the outer dimensions of the conductor assembly 30 correspond to the outer dimensions of the conventional conductor assembly 50.

[0043] With regard to the first and second current directions 34, 36, it should be noted that in this description, the current directions 34, 36 can refer to the electrical current direction or the physical current direction. Furthermore, during operation of the power module, the current in one of the conductors 62, 64 can flow in the first current direction 34 at one time and can flow in the second current direction 36 at another time, depending on the operating state of the power module 20. In the present invention, the first and second current directions 34, 36 can therefore be interchangeable; it is only important that the first current direction 34 is opposite to the second current direction 36 in order to keep the induced inductance low.

[0044] Although the invention has been illustrated and described in detail in the drawings and the foregoing description, such illustration and description are to be considered as illustrative or exemplary and not restrictive. In particular, the invention is not limited to the above embodiments. For example, the first and / or second conductors 62, 64 may include more or fewer fingers 74, 76. Further, the first and / or second fingers 74, 76 may have a different shape. For example, the fingers 74, 76 may have rounded edges. Alternatively or additionally, the fingers 74, 76 may extend at an angle other than 90° from the corresponding rods 70, 72. Those skilled in the art can recognize and make further variations of the disclosed embodiments in practicing the claimed invention upon careful consideration of the drawings, the disclosure, and the appended claims.In the claims, the term "comprising" does not exclude other elements or steps, and the indefinite article "a" does not exclude a plural. A single processor, controller, or other unit may perform the functions of multiple elements recited in the claims. The mere fact that certain measures are recited in different dependent claims does not mean that a combination of those measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope of protection. List of reference symbols 20 power module 22 converter stage 24 battery 26 DC intermediate circuit 28 DC capacitor 30 conductor arrangement 32 parasitic inductance 34 first current direction 36 second current direction 38 semiconductor device 40 AC connections 42 first DC connection 44 second DC connection 46 semiconductor chips 50 conventional ladder arrangement 52 conventional first conductor 54 conventional second conductor 56 Insulating layer 62 first leader 64 second conductor 66 Insulating material 70 first bar 72 second bar 74 first fingers 76 second fingers 80 first extension direction 82 second extension direction 84 first level page 86 second level page 90 first contact of the first conductor 92 second contact of the first conductor 94 first contact of the second conductor 96 second contact of the second conductor H Height

Claims

[1] Power module (20), comprising a converter stage (22) for converting an AC current into a DC current or a DC current into an AC current, and a DC intermediate circuit (26) which is electrically coupled to the converter stage (22) by a conductor arrangement (30), wherein the conductor arrangement (30) comprises a first conductor (62) for carrying a current between the converter stage (22) and the DC intermediate circuit (26) in a first current direction (34) and a second conductor (64) for carrying a current between the converter stage (22) and the DC intermediate circuit (26) in a second current direction (36) opposite to the first current direction (34), wherein the first conductor (62) comprises two or more first fingers (74) extending in a first extension direction (80) perpendicular to the first and second current directions (34, 36) to the second conductor (64), the second conductor (64) comprises two or more second fingers (76) extending in a direction parallel to the first extension direction (80) to the first conductor (62), the first and second fingers (74, 76) are arranged to engage with each other, and the first and second conductors (62, 64) are electrically insulated from each other. [2] Power module (20) according to claim 1, wherein the conductor arrangement (30) comprises a first plane side (84) parallel to the first and second current directions (34, 36) and parallel to the first extension direction (80), the conductor arrangement (30) comprises a second plane side (86) parallel and opposite the first plane side (84), the first plane side (84) comprises a first side of the first conductor (62) and a first side of the second conductor (64), and the second plane side (86) comprises a second side of the first conductor (62) and a second side of the second conductor (64). [3] Power module (20) according to claim 2, wherein the first plane side (84) comprises a first side of the first fingers (74) and a first side of the second fingers (76), and the second plane side (86) comprises a second side of the first fingers (74) and a second side of the second fingers (76). [4] Power module (20) according to claim 3, wherein the first conductor (62) comprises a first rod (70) extending from the converter stage (22) to the DC link (26) and from which the first fingers (74) extend, and the second conductor (64) comprises a second rod (72) extending from the converter stage (22) to the DC link (26) and from which the second fingers (76) extend. [5] Power module (20) according to claim 4, wherein the first plane side (84) is formed by a first side of the first fingers (74), the first rod (70), the second fingers (76) and the second rod (72), and the second plane side (86) is formed by a second side of the first fingers (74), the first rod (70), the second fingers (76) and the second rod (72). [6] Power module (20) according to one of claims 4 or 5, wherein the first fingers (74) are arranged perpendicular to the first rod (70), and / or the second fingers (76) are arranged perpendicular to the second rod (72). [7] Power module (20) according to one of claims 4 to 6, wherein the first conductor (62) comprises a first contact (90) of the first conductor (62) arranged on the first rod (70) and coupled to the DC link (26), and one or more second contacts (92) of the first conductor (62) arranged on corresponding ones of the first fingers (74) and configured to couple to the converter stage (22), and / or the second conductor (64) comprises a first contact (94) of the second conductor (64) arranged on the second rod (72) and coupled to the converter stage (22), and one or more second contacts (96) of the second conductor (64) arranged on corresponding ones of the second fingers (76) and configured to couple to the DC link (26). [8] Power module (20) according to one of the preceding claims, which is configured as an electrical inverter.

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