Power conversion apparatus

Abstract

The present application provides a power conversion apparatus. The power conversion apparatus comprises a circuit board, a power unit and a radiator. The circuit board is provided with a through hole. In the axial direction of the through hole, the power unit is located on one side of the circuit board. In the axial direction of the through hole, the radiator is located on the side of the circuit board away from the power unit. The radiator is provided with a boss, and the boss is at least partially located in the through hole and is in contact with the power unit. Heat emitted during working of the power unit can be transmitted to the radiator simply by means of the boss, and is then diffused to the external environment by means of the radiator, such that the heat dissipation path for the power unit is shortened, thus greatly improving the heat dissipation efficiency of the power unit, and facilitating rapid heat dissipation of the power unit.

Description

Power conversion equipment

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 28, 2023, with application number 202311852715.5 and application name “Power Conversion Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of electronic technology, and in particular to a power conversion device. Background Art

[0003] In existing power conversion devices, the power unit is mounted on one side of a circuit board using solder, and the heat sink is mounted on the other side. Thermally conductive material is placed between the heat sink and the circuit board. During operation, the power unit dissipates a large amount of heat, which is transported through the solder, circuit board, and thermally conductive material to the heat sink's heat dissipation substrate. The heat is then dissipated through the heat sink to the external environment, dissipating the heat from the power unit. However, the heat dissipation path of the power unit is too long, hindering rapid heat dissipation.

[0004] Summary of the Invention

[0005] The present application provides a power conversion device. The power unit of the power conversion device provided herein can transfer heat dissipated during operation to the radiator simply through a boss provided on the radiator, and then diffuse the heat to the external environment through the radiator. This shortens the heat dissipation path of the power unit, greatly improves the heat dissipation efficiency of the power unit, and facilitates rapid heat dissipation of the power unit.

[0006] In a first aspect, embodiments of the present application provide a power conversion device. The power conversion device includes a circuit board, a power unit, and a heat sink. The circuit board has a through hole. The power unit is located on one side of the circuit board in the axial direction of the through hole. The heat sink is located on the side of the circuit board facing away from the power unit in the axial direction of the through hole. The heat sink has a boss at least partially located in the through hole, and the power unit is disposed on a surface of the boss.

[0007] In the power conversion device provided in the embodiment of the present application, since the heat sink is provided with a boss, the boss is at least partially located in the through hole and in contact with the power unit. A large amount of heat dissipated by the power unit during operation is transported to the heat sink through the boss, and then diffused to the external environment through the heat sink, thereby achieving rapid heat dissipation of the power unit.

[0008] Compared with the existing power conversion equipment, the heat emitted by the power unit during operation is transported to the radiator through solder, circuit boards and thermal conductive materials, and then diffused to the external environment through the radiator to achieve the heat dissipation of the power unit; the present application only needs to use the boss provided on the radiator to transport the heat emitted by the power unit during operation to the radiator, and then diffuse it to the external environment through the radiator, shortening the heat dissipation path of the power unit, reducing the path thermal resistance, greatly improving the heat dissipation efficiency of the power unit, and facilitating the rapid heat dissipation of the power unit.

[0009] In a possible implementation, the power unit includes a heat-conducting layer, and the heat-conducting layer is disposed on a side of the power unit close to the boss.

[0010] The heat dissipated by the power unit during operation is output through the thermal conductive layer. The thermal conductive layer is located on the side of the power unit close to the boss. This ensures that the heat dissipated by the power unit during operation is transported through the boss to the heat sink, and then diffused to the external environment through the heat sink, achieving rapid heat dissipation of the power unit.

[0011] In a possible implementation manner, a projection of the boss in the axial direction of the through hole is located within a projection of the heat conducting layer in the axial direction of the through hole.

[0012] The design in which the projection of the boss in the axial direction of the through hole is located within the projection of the heat-conducting layer in the axial direction of the through hole ensures that the boss is entirely used to transfer the heat output from the heat-conducting layer by the power unit to the radiator, which is beneficial to improving the heat dissipation efficiency of the power unit.

[0013] In a possible implementation, the power unit includes a power device, and the power device is mounted on a side of the heat conducting layer facing away from the heat sink.

[0014] The power device generates a large amount of heat when working. The large amount of heat generated by the power device when working is output from the heat conductive layer and transported to the heat sink through the boss, and then diffused to the external environment through the heat sink, thereby achieving rapid heat dissipation of the power device and then rapid heat dissipation of the power unit.

[0015] In a possible implementation manner, a projection of the power device in the axial direction of the through hole is located within a projection of the boss in the axial direction of the through hole.

[0016] The design in which the axial projection of the power device in the through hole is located within the axial projection of the boss in the through hole is conducive to shortening the heat dissipation path of the heat dissipated by the power device during operation and being transported to the heat sink through the boss, thereby improving the heat dissipation efficiency of the power device.

[0017] In a possible implementation, a welding piece is provided between the heat sink and the heat conducting layer. The welding piece includes a first section, and the first section is provided between the boss and the heat conducting layer.

[0018] The heat output from the thermally conductive layer is transported along the axial direction of the through-hole through the first section of the weldment and the boss to the heat sink, where it is then diffused to the external environment through the heat sink, thereby dissipating heat from the power unit. The design, in which the heat dissipated by the power unit during operation is transported from the thermally conductive layer along the axial direction of the through-hole to the heat sink, helps shorten the heat dissipation path of the power unit, improves the heat dissipation efficiency of the power unit, and facilitates rapid heat dissipation of the power unit. Furthermore, the design in which the power unit and the boss are relatively fixed via the weldment simplifies the assembly process of the heat sink and other components, reduces the difficulty of assembling the heat sink and other components, and reduces the difficulty of assembling the power conversion device, making assembly easier.

[0019] In a possible implementation manner, a projection of the first segment in the axial direction of the through hole is located within a projection of the heat conducting layer in the axial direction of the through hole and within a projection of the covering boss in the axial direction of the through hole.

[0020] The design in which the projection of the first section in the axial direction of the through-hole is located within the projection of the heat-conducting layer in the axial direction of the through-hole and covers the projection of the boss in the axial direction of the through-hole ensures that the first section of the weldment is entirely used to transfer the heat output from the heat-conducting layer of the power unit to the boss, which is beneficial to improving the heat dissipation efficiency of the power unit.

[0021] In a possible implementation, in the axial direction of the through hole, the distance between the boss and the heat conducting layer is greater than or equal to the distance between the heat conducting layer and the circuit board.

[0022] In the axial direction of the through hole, the design of the distance between the boss and the heat-conducting layer is greater than or equal to the distance between the heat-conducting layer and the circuit board can avoid the presence of the boss affecting the installation of the power unit and the circuit board, which is beneficial to improving the installation strength of the power unit and the circuit board and improving the structural stability of the power conversion equipment.

[0023] In a possible implementation manner, the welding piece includes a second section, the second section is arranged on one side of the first section, and the second section is arranged between the hole wall of the through hole and the boss.

[0024] Heat output from the power unit from the thermally conductive layer can also be transferred to the boss via the first and second sections, and then from the boss to the heat sink. The design of the second section helps increase the amount of heat output from the power unit from the thermally conductive layer that is transferred to the boss via the first section of the weldment, thereby improving the heat dissipation efficiency of the power unit. Furthermore, the second section of the weldment secures the boss to the wall of the through-hole and the heat sink to the circuit board, thereby improving the structural stability of the power conversion device.

[0025] In a possible implementation, the welding component includes a third section, the third section is arranged outside the first section, and the third section is arranged between the heat conductive layer and the circuit board.

[0026] Since the third section of the welding part is arranged between the heat-conducting layer and the circuit board, the heat-conducting layer and the circuit board are relatively fixed through the third section of the welding part, and the power unit is fixedly connected to the circuit board, which is beneficial to improving the connection stability between the power unit and the circuit board, and is beneficial to improving the structural stability of the power conversion equipment.

[0027] In one possible embodiment, the heat sink includes a heat dissipation substrate, which is disposed on a side of the boss facing away from the heat conducting layer. The heat dissipation substrate includes a fixing surface and a mating surface, with the fixing surface facing the boss and the mating surface oriented in a different direction from the fixing surface. A spacing is provided between the boss and the wall of the through hole, and the heat dissipation substrate includes a groove, which includes a first opening and a second opening. The first opening is located on the fixing surface, and the second opening is located on the mating surface. The first opening communicates with the through hole.

[0028] The groove design is conducive to discharging impurities (such as air or flux, etc.) in the welded parts, reducing the void rate of the welded parts, reducing the thermal resistance of the welded parts, and improving the efficiency of transferring the heat output from the power unit from the heat conducting layer to the heat sink through the welded parts and the boss, thereby improving the heat dissipation efficiency of the power unit.

[0029] In a possible implementation, the heat sink includes heat dissipation fins, and the heat dissipation fins are fixedly connected to a side of the heat dissipation substrate facing away from the power unit.

[0030] The design of the heat dissipation fins is conducive to improving the efficiency of diffusing the heat emitted by the power unit during operation to the external environment, and is conducive to improving the heat dissipation efficiency of the power unit.

[0031] In a possible implementation manner, the number of power units, the number of through holes, the number of heat sinks, and the number of bosses are all plural, and the multiple power units, the multiple through holes, the multiple heat sinks, and the multiple bosses correspond one to one.

[0032] The heat dissipated by each power unit during operation is transferred to a heat sink via a boss, where it is then dissipated to the external environment, rapidly dissipating heat from the power unit. Multiple power units can each be rapidly cooled using multiple heat sinks. The heat sink can be adaptively designed based on the power unit, reducing the material cost of the heat sink and, consequently, the material cost of the power conversion equipment.

[0033] In a possible implementation manner, a plurality of heat sinks are fixedly connected to each other.

[0034] The design of fixed connection between multiple radiators ensures that the heat emitted by multiple power units during operation can be evenly distributed on the multiple radiators, which is beneficial to improving the heat dissipation uniformity of multiple power units through multiple radiators, and is beneficial to increasing the maximum temperature that the power units can withstand, which is beneficial to improving the safety of power unit use and improving the working performance of the power units. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0036] FIG1 is a block diagram of the structure of a power conversion device provided by an embodiment of the present application in cooperation with an AC power supply and a load device;

[0037] FIG2 is a schematic diagram of the three-dimensional structure of the power conversion device shown in FIG1 ;

[0038] FIG3 is a schematic diagram of the three-dimensional structure of the power module of the power conversion device shown in FIG2 ;

[0039] FIG4 is a schematic diagram of an exploded perspective view of the power module shown in FIG3 ;

[0040] FIG5 is a schematic structural diagram of the power module shown in FIG3 taken along line AA;

[0041] FIG6 is a schematic diagram of a portion of the structure of the power module shown in FIG5 omitting the heat sink and welding parts;

[0042] FIG7 is a schematic diagram of a partial three-dimensional structure of the power module shown in FIG6 ;

[0043] FIG8 is a schematic diagram of the three-dimensional structure of the heat sink of the power module shown in FIG5 ;

[0044] FIG9 is an enlarged view of a portion IX of the power module shown in FIG5 ;

[0045] FIG10 is a schematic diagram of a partial structure of the power module shown in FIG5 under another embodiment;

[0046] FIG11 is a schematic diagram of the three-dimensional structure of the heat sink of the power module shown in FIG10 ;

[0047] FIG12 is a schematic diagram of a partial structure of the power module shown in FIG5 under another embodiment;

[0048] FIG13 is a schematic diagram of a partial structure of the power module shown in FIG5 under another embodiment;

[0049] FIG13a is a schematic structural diagram of the power module shown in FIG5 under another embodiment;

[0050] FIG14 is a schematic diagram of a partial structure of the power module shown in FIG5 under another embodiment;

[0051] FIG15 is a schematic diagram of a partial structure of the power module shown in FIG5 under another embodiment;

[0052] FIG16 is a schematic diagram of a partial structure of the power module shown in FIG15 in another embodiment. DETAILED DESCRIPTION

[0053] The present application provides a power conversion device. The power unit of the power conversion device provided herein can transfer heat dissipated during operation to the radiator simply through a boss provided on the radiator, and then diffuse the heat to the external environment through the radiator. This shortens the heat dissipation path of the power unit, greatly improves the heat dissipation efficiency of the power unit, and facilitates rapid heat dissipation of the power unit.

[0054] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0055] 1 and 2 , FIG1 is a structural block diagram of a power conversion device 1000 provided in an embodiment of the present application in cooperation with an AC power source 2000 and a load device 3000. FIG2 is a schematic diagram of the three-dimensional structure of the power conversion device 1000 shown in FIG1 .

[0056] Exemplarily, the power conversion device 1000 is a rectifier. In other embodiments, the power conversion device 1000 may also be an electronic device including but not limited to an inverter, an AC-AC (Alternating Current-Alternating Current) converter, or a DC-DC (Direct Current-Direct Current) converter. The power conversion device 1000 is used to rectify the AC power output by the AC power source 2000 and output DC power to the load device 3000 to supply the load device 3000. The load device 3000 may be a device that uses DC power, including but not limited to a battery.

[0057] In some embodiments, the power conversion device 1000 includes a control circuit board 100, input terminals 200, a power module 300, output terminals 400, and a control module 500. The input terminals 200, output terminals 400, power module 300, and control module 500 are all fixedly connected and electrically connected to the control circuit board 100 by methods including, but not limited to, welding or gluing. The input terminals 200, output terminals 400, and control module 500 are all electrically connected to the power module 300 via the control circuit board 100. The input terminals 200 are used to receive alternating current (AC) power from the AC power source 2000. The power module 300 is used to rectify the AC power transmitted from the input terminals 200 and output DC power. The output terminals 400 are used to transmit the DC power output by the power module 300 to the load device 3000 for supplying the load device 3000. The control module 500 is used to control the operation of the power module 300 , so as to control the power module 300 to rectify the AC power transmitted from the input terminal 200 and output DC power.

[0058] Referring to Figures 3, 4, and 5, in conjunction with Figures 1 and 2, Figure 3 is a schematic perspective view of the power module 300 of the power conversion device 1000 shown in Figure 2. Figure 4 is a schematic perspective view of the exploded structure of the power module 300 shown in Figure 3. Figure 5 is a schematic perspective view of the power module 300 shown in Figure 3 taken along line AA.

[0059] As shown in Figures 3, 4, and 5, in some embodiments, the power module 300 includes a circuit board 10, a power unit 20, a fixing member 30, a heat sink 40, and a soldering member 50. In other words, the power conversion device 1000 (as shown in Figure 1) includes a circuit board 10, a power unit 20, a fixing member 30, a heat sink 40, and a soldering member 50. The power unit 20 is located on one side of the circuit board 10. The fixing member 30 is fixedly connected between the power unit 20 and the circuit board 10 and is electrically connected to the power unit 20 and the circuit board 10. The power unit 20 is fixedly connected and electrically connected to the circuit board 10 through the fixing member 30. The heat sink 40 is located on the side of the circuit board 10 facing away from the power unit 20 and is inserted into the circuit board 10 from the side of the circuit board 10 facing away from the power unit 20 and is spaced apart from the power unit 20. The soldering member 50 is located between the power unit 20 and the heat sink 40 and is fixedly connected to the power unit 20 and the heat sink 40. The power unit 20 is fixedly connected to the heat sink 40 via the welding piece 50 .

[0060] As shown in Figures 1, 2, and 5, the circuit board 10 is fixedly attached and electrically connected to the control circuit board 100. Through the control circuit board 100, the circuit board 10 is electrically connected to the input terminals 200, the output terminals 400, and the control module 500. Through the circuit board 10, the power unit 20 is electrically connected to the input terminals 200, the output terminals 400, and the control module 500. In other words, the control module 500 is electrically connected to the power unit 20. The power unit 20 is used to rectify the AC power supplied from the input terminals 200 and output DC power. The DC power output by the power unit 20 is transmitted to the load device 3000 via the output terminals 400 for supply. The control module 500 is used to control the operation of the power unit 20, thereby controlling the power unit 20 to rectify the AC power supplied from the input terminals 200 and output DC power. The power unit 20 generates a large amount of heat when it is working. The large amount of heat generated by the power unit 20 when it is working is diffused to the external environment through the welding part 50 and the heat sink 40, thereby achieving rapid heat dissipation of the power unit 20.

[0061] In some other embodiments, the control circuit board 100 may be omitted. The input terminals 200, output terminals 400, and control module 500 are fixedly connected and electrically connected to the circuit board 10 through methods including, but not limited to, welding or gluing. The input terminals 200, output terminals 400, and control module 500 are electrically connected to the power unit 20 through the circuit board 10. The power unit 20 can also rectify the AC power transmitted from the input terminals 200 and output DC power. The DC power output by the power unit 20 can also be transmitted to the load device 3000 via the output terminals 400 to supply the load device 3000.

[0062] 6 and 7 , in conjunction with FIG1 and FIG4 , FIG6 is a partial structural diagram of the power module 300 shown in FIG5 omitting the heat sink 40 and the welding member 50. FIG7 is a partial three-dimensional structural diagram of the power module 300 shown in FIG6 .

[0063] As shown in Figures 1, 4, and 6, the circuit board 10 is exemplarily a rectangular circuit board. In other embodiments, the circuit board 100 may also be a circular circuit board, a triangular circuit board, or another special-shaped circuit board. For ease of description, the thickness direction of the circuit board 10 is defined as the first direction (i.e., the Z-axis direction in the figure), the length direction of the circuit board 10 is defined as the second direction (i.e., the X-axis direction in the figure), and the width direction of the circuit board 10 is defined as the third direction (i.e., the Y-axis direction in the figure).

[0064] The circuit board 10 includes a mounting surface 11, a second mounting surface 12, and a third mounting surface 13. In the Z-axis direction, the mounting surface 11 and the second mounting surface 12 are spaced apart from each other, with the third mounting surface 13 connected between the mounting surface 11 and the second mounting surface 12. The third mounting surface 13 is fixedly and electrically connected to the control circuit board 100 through methods including, but not limited to, welding or gluing. The circuit board 10 is fixedly and electrically connected to the control circuit board 100.

[0065] In some embodiments, the circuit board 10 is provided with a through hole 14. The through hole 14 extends along the Z-axis direction and has two openings, one opening is located on the mounting surface 11, and the other opening is located on the second mounting surface 12. That is, the through hole 14 passes through the circuit board 10 along the Z-axis direction. It can be understood that the extension direction of the through hole 14 is the Z-axis direction. Exemplarily, the through hole 14 is a rectangular hole. In some other embodiments, the through hole 14 may also be a circular hole, a triangular hole or other special-shaped holes. Among them, the through hole 14 includes a hole wall 141. The hole wall 141 is connected to the mounting surface 11 and the second mounting surface 12. Specifically, the hole wall 141 includes two first planes and two second planes. In the X-axis direction, the two first planes are opposite and spaced apart. In the Y-axis direction, the two second planes are opposite and spaced apart. And the two second planes are both connected between the two first planes.

[0066] As shown in Figures 6 and 7, in some embodiments, the power unit 20 is located on one side of the circuit board 10 in the Z-axis direction and is spaced apart from the circuit board 10. Specifically, the power unit 20 is located on the side of the mounting surface 11 facing away from the second mounting surface 12 and is spaced apart from the mounting surface 11. In other words, the mounting surface 11 faces the power unit 20. The projection of the power unit 20 in the Z-axis direction overlaps with the projection of the through hole 14 in the Z-axis direction. Specifically, the projection of the through hole 14 in the Z-axis direction is located within the projection of the power unit 20 in the Z-axis direction.

[0067] In some embodiments, the power unit 20 includes a thermally conductive layer 21, a power device 22, a plastic package 23, and pins 24. In the Z-axis direction, the power device 22 is mounted on one side of the thermally conductive layer 21. The plastic package 23 covers the entire power device 22 and a portion of the thermally conductive layer 21. The surface of the thermally conductive layer 21 facing away from the power device 22 is exposed to the outside of the plastic package 23. The pins 24 extend from the plastic package 23 and are electrically connected to the power device 22. In some other embodiments, the pins 24 may not extend, and the plastic package 23 may cover a portion of the pins 24. In the Z-axis direction, the surface of the pins 24 facing away from the power device 22 is exposed to the outside of the plastic package 23.

[0068] Exemplarily, the heat-conducting layer 21 is made of a heat-conducting material including but not limited to copper or aluminum. The heat-conducting layer 21 is a rectangular plate. In some other embodiments, the heat-conducting layer 21 may also be a circular plate, a triangular plate or other special-shaped plate. The projection of the heat-conducting layer 21 in the Z-axis direction completely covers the projection of the through-hole 14 in the Z-axis direction. Specifically, the size of the heat-conducting layer 21 in the X-axis direction is larger than the size of the through-hole 14 in the X-axis direction. The size of the heat-conducting layer 21 in the Y-axis direction is larger than the size of the through-hole 14 in the Y-axis direction. Exemplarily, the size of the heat-conducting layer 21 in the X-axis direction is 0.5 mm (millimeters) larger than the size of the through-hole 14 in the X-axis direction. The size of the heat-conducting layer 21 in the Y-axis direction is 0.5 mm larger than the size of the through-hole 14 in the Y-axis direction. In other words, the heat-conducting layer 21 expands outward by 0.5 mm compared to the through-hole 14 as a whole. In other embodiments, the heat conducting layer 21 may also expand outward by 0.6 mm, 0.7 mm, or other values ​​less than 1 mm relative to the through hole 14. In other words, the heat conducting layer 21 expands outward by 0.5-1 mm relative to the through hole 14.

[0069] The thermally conductive layer 21 includes a connecting surface 211 and a second connecting surface 212. In the Z-axis direction, the connecting surface 211 and the second connecting surface 212 face opposite each other and are spaced apart. The connecting surface 211 faces the mounting surface 11 and is spaced apart from it. The connecting surface 211 faces the circuit board 10 and is spaced apart from it. The second connecting surface 212 faces away from the circuit board 10.

[0070] For example, the power device 22 may be an electronic device including, but not limited to, a diode, a transistor, or a chip. The power device 22 is fixedly stacked on the second connection surface 212 of the thermally conductive layer 21 by, but not limited to, welding or gluing. The power device 22 is mounted on the second connection surface 212 of the thermally conductive layer 21. The projection of the power device 22 in the Z-axis direction is within the projection of the through-hole 14 in the Z-axis direction. That is, the projection of the power device 22 in the Z-axis direction overlaps with the projection of the through-hole 14 in the Z-axis direction. In other embodiments, these projections may not overlap.

[0071] Exemplarily, the plastic encapsulation 23 is made of an insulating material including, but not limited to, plastic or rubber. The plastic encapsulation 23 covers all power devices 22 and a portion of the thermal conductive layer 21. The connection surface 211 of the thermal conductive layer 21 is exposed on the exterior of the plastic encapsulation 23. In some embodiments, the plastic encapsulation 23 includes a first surface 231, a second surface 232, and a third surface 233. In the X-axis direction, the second surface 232 and the third surface 233 are located on opposite sides of the first surface 231 and are both connected to the first surface 231. In the X-axis direction, the second surface 232 and the third surface 233 are opposite to each other and spaced apart. The first surface 231 faces the mounting surface 11 and is spaced apart from the mounting surface 11. The plastic encapsulation 23 is spaced apart from the circuit board 10. The connection surface 211 of the thermal conductive layer 21 is exposed on the exterior of the plastic encapsulation 23 from the first surface 231 of the plastic encapsulation 23. The connection surface 211 is flush with the first surface 231. In other embodiments, they may not be flush.

[0072] Exemplarily, the pins 24 are made of a conductive material including, but not limited to, copper, aluminum, or a copper-aluminum mixture. There are multiple pins 24, specifically, twelve. In other embodiments, the number of pins 24 may be one, two, three, or more. Six pins 24 extend from the second surface 232 of the plastic encapsulation 23 and extend along the X-axis. These six pins 24 are sequentially arranged and spaced apart along the Y-axis. Another six pins 24 extend from the third surface 233 of the plastic encapsulation 23 and extend along the X-axis. These six pins 24 are sequentially arranged and spaced apart along the Y-axis. Each pin 24 is electrically connected to the power device 22 via, including but not limited to, a cable embedded in the plastic encapsulation 23. The surface of each pin 24 facing the mounting surface 11 is flush with the first surface 231 of the plastic encapsulation 23. In other embodiments, this may not be the case. The surface of each pin 24 facing the mounting surface 11 is spaced apart from the mounting surface 11. Each pin 24 is spaced apart from the mounting surface 11 . The pins 24 are spaced apart from the circuit board 10 .

[0073] As shown in Figures 1, 6, and 7, in some embodiments, the fixing member 30 is made of solder, including but not limited to tin or tin-lead. In other embodiments, the fixing member 30 may also be made of conductive adhesive. The fixing member 30 is located between the pins 24 and the circuit board 10, and is fixedly connected and electrically connected to the pins 24 and the circuit board 10. Specifically, the fixing member 30 is located between the pins 24 and the mounting surface 11, and is fixedly connected and electrically connected to the pins 24 and the mounting surface 11. In this embodiment, the fixing member 30 is first covered on the mounting surface 11 of the circuit board 10, and the pins 24 of the power unit 20 then contact the fixing member 30. The fixing member 30 is melted at high temperature and then cooled and solidified. At this point, the fixing member 30 is located between the pins 24 and the mounting surface 11, and is fixedly connected and electrically connected to the pins 24 and the mounting surface 11. The thermal conductive layer 21 and the plastic package 23 of the power unit 20 are both spaced apart from the mounting surface 11 of the circuit board 10.

[0074] Exemplarily, the number of the fixing members 30 is multiple, specifically, the number of the fixing members 30 is 12. In other embodiments, the number of the fixing members 30 may also be 1, 2, 3, or more. The number of the fixing members 30 is equal to the number of the pins 24. The multiple fixing members 30 are located between the multiple pins 24 and the mounting surface 11 in a one-to-one correspondence, and are fixedly connected and electrically connected to the multiple pins 24 and the mounting surface 11 in a one-to-one correspondence. The multiple fixing members 30 are located between the multiple pins 24 and the circuit board 10 in a one-to-one correspondence, and are fixedly connected and electrically connected to the multiple pins 24 and the circuit board 10 in a one-to-one correspondence.

[0075] Pins 24 are fixedly and electrically connected to the circuit board 10 via fixing members 30. That is, in the axial direction of through-hole 14, power unit 20 is located on one side of the circuit board 10. Furthermore, power unit 20 is fixedly and electrically connected to the circuit board 10. It will be understood that power device 22 is electrically connected to circuit board 10 via pins 24. Power device 22 is electrically connected to input terminal 200, output terminal 400, and control module 500 via pins 24 and circuit board 10. Power device 22 can rectify the AC power transmitted from input terminal 200 and output DC power. This DC power can be transmitted from output terminal 400 to load device 3000 for supply.

[0076] 8 and 9 , in conjunction with FIG1 and FIG5 , FIG8 is a perspective structural diagram of the heat sink 40 of the power module 300 shown in FIG5 . FIG9 is an enlarged view of the IX portion of the power module 300 shown in FIG5 .

[0077] As shown in Figures 5, 8 and 9, in some embodiments, in the Z-axis direction, the heat sink 40 is installed in the through hole 14 from the side of the second mounting surface 12 facing away from the mounting surface 11, and is spaced apart from the power unit 20. Specifically, the heat sink 40 is installed in the through hole 14 from the side of the second mounting surface 12 facing away from the mounting surface 11, and is spaced apart from the thermal conductive layer 21 of the power unit 20. Exemplarily, the heat sink 40 is made of a thermal conductive material including but not limited to copper, aluminum or a copper-aluminum mixture. It can be understood that in the Z-axis direction (i.e., the axial direction of the through hole 14), the heat sink 40 is located on the side of the circuit board 10 facing away from the power unit 20. The power device 22 is installed on the side of the thermal conductive layer 21 facing away from the heat sink 40.

[0078] The heat sink 40 includes a heat sink base 41, heat sink fins 42, a mounting member 43, and a boss 60. In the Z-axis direction, the heat sink fins 42 are located on one side of the heat sink base 41 and are fixedly connected to the heat sink base 41. In the Z-axis direction, the mounting member 43 is located on the side of the heat sink fins 42 facing away from the heat sink base 41 and is fixedly connected to the heat sink fins 42. The boss 60 is located on the side of the heat sink base 41 facing away from the heat sink fins 42 and is fixedly connected to the heat sink base 41. In other embodiments, the heat sink fins 42 and mounting member 43 may be omitted.

[0079] The heat dissipation substrate 41 includes a fixed surface 411 and a mating surface 412. Specifically, the mating surface 412 includes a first mating surface 412a, a second mating surface 412b, a third mating surface 412c, a fourth mating surface 412d, and a fifth mating surface 412e. In the Z-axis direction, the fixed surface 411 and the first mating surface 412a are opposite each other and spaced apart. In the X-axis direction, the second mating surface 412b and the third mating surface 412c are opposite each other and spaced apart. The second mating surface 412b and the third mating surface 412c are both connected between the fixed surface 411 and the second mating surface 412. In the Y-axis direction, the fourth mating surface 412d and the fifth mating surface 412e are opposite each other and spaced apart. The fourth mating surface 412d and the fifth mating surface 412e are both connected to the fixed surface 411, the first mating surface 412a, the second mating surface 412b, and the third mating surface 412c. It is understood that the orientations of the fixing surface 411, the first mating surface 412a, the second mating surface 412b, the third mating surface 412c, the fourth mating surface 412d, and the fifth mating surface 412e are all different. The orientation of the mating surface 412 is different from the orientation of the fixing surface 411 of the heat dissipation substrate 41.

[0080] Among them, the heat dissipation substrate 41 is located on the side of the second mounting surface 12 facing away from the first mounting surface 11. That is, in the axial direction of the through hole 14 (i.e., in the Z-axis direction), the heat dissipation substrate 41 is located on the side of the circuit board 10 facing away from the power unit 20. The fixing surface 411 faces the circuit board 10 and abuts against the circuit board 10. That is, the heat dissipation substrate 41 abuts against the circuit board 10. In some other embodiments, the heat dissipation substrate 41 may also only contact the circuit board 10. The heat dissipation substrate 41 may also be spaced apart from the circuit board 10 and have a spacing. The heat dissipation substrate 41 may also be fixedly connected to the circuit board 10 by means including but not limited to welding or gluing. The first mating surface 412a faces away from the circuit board 10. It can be understood that in the Z-axis direction (i.e., in the axial direction of the through hole 14), the fixing surface 411 and the connection surface 211 of the thermal conductive layer 21 are opposite and spaced apart.

[0081] The heat sink fins 42 are fixedly connected to the first mating surface 412a of the heat sink base 41. Specifically, the heat sink fins 42 are fixedly connected to the side of the heat sink base 41 facing away from the power unit 20. For example, there are multiple heat sink fins 42, and specifically, there are six heat sink fins 42. In other embodiments, the number of heat sink fins 42 may be one, two, three, or more. The multiple heat sink fins 42 are spaced apart in the X-axis direction.

[0082] Illustratively, the mounting member 43 is adhesive. The mounting member 43 is bonded to the surface of the heat sink fin 42 facing away from the heat sink substrate 41. The mounting member 43 is fixedly connected to the surface of the heat sink fin 42 facing away from the heat sink substrate 41. In other embodiments, the mounting member 43 may not be adhesive. The mounting member 43 may also be fixedly connected to the surface of the heat sink fin 42 facing away from the heat sink substrate 41 by methods including but not limited to welding or gluing.

[0083] Among them, the mounting member 43 is fixedly connected to two heat sinks 42. In some other embodiments, the mounting member 43 may also be fixedly connected to one heat sink fin 42, three heat sink fins 42 or more heat sinks 42. The mounting member 43 is used to connect to an external operating device. The external operating device controls the movement of the radiator 40 through the mounting member 43 so that the radiator 40 can be assembled with other components of the power module 300. Exemplarily, the external operating device is an SMT (Surface Mount System, placement machine). The SMT machine can control the movement of the radiator 40 by mounting the mounting member 43 so that the radiator 40 can be assembled with other components of the power module 300. In this way, not only is the mounting accuracy high, but the risk of collision can be avoided, and the processing steps are not increased, which is conducive to reducing the manufacturing cost of the power module 300.

[0084] Exemplarily, the boss 60 is a rectangular cylinder. In other embodiments, the boss 60 may also be a circular cylinder, a triangular cylinder, or other special-shaped cylinder. The boss 60 is fixedly stacked on the fixed surface 411 of the heat dissipation substrate 41 and extends along the Z-axis direction. In other words, the fixed surface 411 faces the boss 60. Exemplarily, the boss 60 and the heat dissipation substrate 41 are integrally formed. This helps to improve structural strength and stability and facilitates the transfer of heat from the boss 60 to the heat dissipation substrate 41. In other embodiments, the boss 60 may also be fixedly connected to the fixed surface 411 of the heat dissipation substrate 41 by means including but not limited to fasteners. The boss 60 extends into the through hole 14 and is spaced apart from the hole wall 141 of the through hole 14. There is a distance between the boss 60 and the hole wall 141 of the through hole 14. Exemplarily, the distance between the boss 60 and the hole wall 141 of the through hole 14 is between 0.2 mm and 0.6 mm. In other embodiments, the distance between the boss 60 and the hole wall 141 of the through hole 14 may be less than 0.2 mm or greater than 0.6 mm, and the boss 60 may also contact the hole wall 141 of the through hole 14. The boss 60 is spaced apart from the thermal conductive layer 21. The boss 60 is spaced apart from the power unit 20. It is understood that the heat dissipation substrate 41 is disposed on the side of the boss 60 facing away from the thermal conductive layer 21.

[0085] The projection of the boss 60 in the Z-axis direction (i.e., in the axial direction of the through-hole 14) is located within the projection of the thermal conductive layer 21 in the Z-axis direction (i.e., in the axial direction of the through-hole 14) and within the projection of the heat dissipation substrate 41 in the Z-axis direction (i.e., in the axial direction of the through-hole 14). The projection of the boss 60 in the Z-axis direction completely covers the projection of the power device 22 in the Z-axis direction. In other words, the projection of the power device 22 in the Z-axis direction (i.e., in the axial direction of the through-hole 14) is located within the projection of the boss 60 in the Z-axis direction (i.e., in the axial direction of the through-hole 14). In other embodiments, the projection of the power device 22 in the Z-axis direction may partially overlap or not overlap with the projection of the boss 60 in the Z-axis direction.

[0086] The boss 60 includes a first wall surface 61 and a second wall surface 62. The first wall surface 61 faces away from the fixing surface 411 of the heat dissipation substrate 41. The second wall surface 62 is connected between the first wall surface 61 and the fixing surface 411. Exemplarily, the second wall surface 62 includes two third planes and two fourth planes. In the X-axis direction, the two third planes are spaced apart from each other. In the Y-axis direction, the two fourth planes are spaced apart from each other. Both fourth planes are connected between the two third planes. The first wall surface 61 is spaced apart from the connecting surface 211 of the thermal conductive layer 21. In the Z-axis direction, the distance between the first wall surface 61 and the connecting surface 211 is greater than the distance between the connecting surface 211 and the mounting surface 11 of the circuit board 10. The distance between the boss 60 and the connecting surface 211 is greater than the distance between the connecting surface 211 and the mounting surface 11. In other embodiments, the distance between the boss 60 and the connecting surface 211 may also be equal to the distance between the connecting surface 211 and the mounting surface 11. In other words, in the Z-axis direction (i.e., the axial direction of the through-hole 14), the distance between the connection surface 211 of the thermally conductive layer 21 and the boss 60 is greater than or equal to the distance between the connection surface 211 of the thermally conductive layer 21 and the mounting surface 11. In the Z-axis direction (i.e., the axial direction of the through-hole 14), the spacing between the boss 60 and the thermally conductive layer 21 is greater than or equal to the spacing between the thermally conductive layer 21 and the circuit board 10. The second wall 62 is spaced apart from the hole wall 141. In some other embodiments, the second wall 62 and the hole wall 141 may also be in contact. It is understood that the thermally conductive layer 21 is disposed on the side of the power unit 20 that is closest to the boss 60.

[0087] In the Z-axis direction (i.e., the axial direction of the through hole 14), the design of the distance between the boss 60 and the thermal conductive layer 21 is greater than or equal to the distance between the thermal conductive layer 21 and the circuit board 10 can avoid the presence of the boss 60 affecting the installation of the power unit 20 and the circuit board 10, which is beneficial to improving the installation strength of the power unit 20 and the circuit board 10, and is beneficial to improving the structural stability of the power module 300, and is beneficial to improving the structural stability of the power conversion device 1000 (as shown in Figure 1).

[0088] It is understood that the boss 60 is disposed between the power unit 20 and the heat dissipation substrate 41, the boss 60 being completely located within the through-hole 14, the boss 60 being fixedly connected to the heat dissipation substrate 41, and being spaced apart from the power unit 20. In other embodiments, the boss 60 may be partially located within the through-hole 14 and partially located on the side of the second mounting surface 12 of the circuit board 10 facing away from the mounting surface 11. In other words, the heat sink 40 is provided with the boss 60, and the boss 60 is at least partially located within the through-hole 14. The boss 60 is spaced apart from the power unit 20. In other embodiments, the boss 60 may also contact the thermal conductive layer 21, or the boss 60 may also contact the power unit 20.

[0089] In some embodiments, the welding part 50 is made of solder including but not limited to tin or tin-lead. The welding part 50 is filled between the power unit 20 and the heat sink 40. Specifically, the welding part 50 is filled between the thermal conductive layer 21 and the boss 60. The welding part 50 is filled between the thermal conductive layer 21 and the heat sink 40. In other words, a welding part 50 is provided between the heat sink 40 and the thermal conductive layer 21. The power unit 20 and the boss 60 are relatively fixed by the welding part 50. The welding part 50 includes a first section 51, a second section 52 and a third section 53. The first section 51 is fixedly stacked between the first wall surface 61 and the connecting surface 211. The first section 51 is fixedly stacked between the boss 60 and the connecting surface 211. In other words, the first section 51 is fixedly stacked between the boss 60 and the thermal conductive layer 21, and the first section 51 is arranged between the boss 60 and the thermal conductive layer 21.

[0090] The projection of the first section 51 in the Z-axis direction (i.e., the axial direction of the through-hole 14) is located within the projection of the thermal conductive layer 21 in the Z-axis direction (i.e., the axial direction of the through-hole 14). The projection of the first section 51 in the Z-axis direction overlaps the projection of the power device 22 in the Z-axis direction. In other words, the projection of the power device 22 in the Z-axis direction (i.e., the axial direction of the through-hole 14) is located within the projection of the first section 51 in the Z-axis direction (i.e., the axial direction of the through-hole 14). The projection of the first section 51 in the Z-axis direction partially overlaps with the projection of the boss 60 in the Z-axis direction. Specifically, the projection of the boss 60 in the Z-axis direction is located within the projection of the first section 51 in the Z-axis direction. The projection of the first section 51 in the Z-axis direction (i.e., the axial direction of the through-hole 14) overlaps the projection of the boss 60 in the Z-axis direction (i.e., the axial direction of the through-hole 14). In other embodiments, the projection of the first section 51 in the Z-axis direction may also completely overlap with the projection of the boss 60 in the Z-axis direction. It can be understood that the projection of the first section 51 in the Z-axis direction (i.e., the axial direction of the through hole 14) is located within the projection of the thermal conductive layer 21 in the Z-axis direction (i.e., the axial direction of the through hole 14) and covers the projection of the boss 60 in the Z-axis direction (i.e., the axial direction of the through hole 14).

[0091] In the Z-axis direction, the second section 52 is located on the side of the first section 51 facing away from the power unit 20 and is fixedly connected to the first section 51. The second section 52 is fixedly stacked between the second wall surface 62 and the hole wall 141. That is, the second section 52 is disposed on one side of the first section 51 and between the hole wall 141 of the through hole 14 and the boss 60. The second section 52 is fixedly connected to the fixing surface 411 of the heat dissipation substrate 41. The second section 52 is fixedly connected to the heat dissipation substrate 41. In other embodiments, the second section 52 may also be spaced apart from the heat dissipation substrate 41.

[0092] The third section 53 is disposed around the exterior of the first section 51. The third section 53 is fixedly stacked between the connection surface 211 and the mounting surface 11. The third section 53 is fixedly stacked between the thermally conductive layer 21 and the circuit board 10. The third section 53 is disposed between the thermally conductive layer 21 and the circuit board 10. In some other embodiments, both the second section 52 and the third section 53 may be omitted.

[0093] It is understood that the power device 22 generates a large amount of heat during operation. Because the first section 51 is fixedly connected to the boss 60 and the thermally conductive layer 21, the large amount of heat generated by the power device 22 during operation can be transported from the thermally conductive layer 21 through the first section 51 to the boss 60 along the Z-axis direction, and then diffused from the boss 60 through the heat dissipation substrate 41 and the heat dissipation fins 42 to the external environment, thereby achieving rapid heat dissipation of the power device 22. In other words, the large amount of heat generated by the power device 22 during operation is output from the thermally conductive layer 21, transported to the heat sink 40 through the boss 60, and then diffused to the external environment through the heat sink 40, thereby achieving rapid heat dissipation of the power device 22, and thus, rapid heat dissipation of the power unit 20.

[0094] The heat dissipated by the power unit 20 during operation is output from the heat-conducting layer 21. The heat output from the heat-conducting layer 21 is transported to the heat sink 40 along the Z-axis direction (i.e., the axial direction of the through hole 14) through the first section 51 of the weldment 50 and the boss 60, and then diffused to the external environment through the heat sink 40, thereby dissipating heat from the power unit 20. The design in which the heat dissipated by the power unit 20 during operation is transported from the heat-conducting layer 21 along the axial direction of the through hole 14 (i.e., the Z-axis direction) to the heat sink 40 is conducive to shortening the heat dissipation path of the power unit 20, improving the heat dissipation efficiency of the power unit 20, and facilitating rapid heat dissipation of the power unit 20. Moreover, the design in which the power unit 20 and the boss 60 are relatively fixed by the weldment 50 is conducive to simplifying the assembly process of the heat sink 40 and other components, reducing the difficulty of assembling the heat sink 40 and other components, reducing the difficulty of assembling the power module 300, and reducing the difficulty of assembling the power conversion device 1000 (as shown in FIG. 1 ), thereby facilitating assembly. It can be understood that the design of the heat conducting layer 21 being arranged on the side of the power unit 20 close to the boss 60 ensures that the heat dissipated by the power unit 20 during operation can be transported to the radiator 40 through the boss 60, and then diffused to the external environment through the radiator 40, thereby achieving rapid heat dissipation of the power unit 20.

[0095] Because the second section 52 is fixedly connected to the first section 51 and is disposed between the hole wall 141 of the through-hole 14 and the boss 60, the heat output from the power unit 20 from the thermally conductive layer 21 can also be transferred to the boss 60 via the first section 51 and the second section 52, and then transferred from the boss 60 to the heat sink 40. The design of the second section 52 helps increase the amount of heat output from the thermally conductive layer 21 by the power unit 20 that is transferred to the boss 60 via the first section 51 of the weldment 50, thereby improving the heat dissipation efficiency of the power unit 20. Furthermore, through the second section 52 of the weldment 50, the boss 60 is relatively fixed to the hole wall 141 of the through-hole 14, the boss 60 is relatively fixed to the circuit board 10, and the heat sink 40 is relatively fixed to the circuit board 10, thereby improving the structural stability of the power module 300 and the structural stability of the power conversion device 1000 (as shown in FIG. 1 ).

[0096] Since the third section 53 is fixedly connected to the first section 51 and the third section 53 is arranged between the heat-conducting layer 21 and the circuit board 10; through the third section 53 of the welding part 50, the heat-conducting layer 21 and the circuit board 10 are relatively fixed, and the power unit 20 is fixedly connected to the circuit board 10, which is beneficial to improving the connection stability between the power unit 20 and the circuit board 10, and is beneficial to improving the structural stability of the power module 300, and is beneficial to improving the structural stability of the power conversion device 1000 (as shown in Figure 1).

[0097] Compared to the existing power conversion device 1000 (as shown in FIG1 ), in which the heat dissipated by the power unit 20 during operation is transported to the heat dissipation substrate 41 of the radiator 40 via solder, circuit board 10, and thermally conductive material, and then diffused to the external environment through the radiator 40 to achieve a heat dissipation solution for the power unit 20, this embodiment only requires the soldering member 50 and boss 60 to transport the heat dissipated by the power unit 20 during operation to the heat dissipation substrate 41 of the radiator 40, and then diffused to the external environment through the radiator 40. This shortens the heat dissipation path of the power unit 20, reduces the path thermal resistance, greatly improves the heat dissipation efficiency of the power unit 20, and facilitates rapid heat dissipation of the power unit 20. Moreover, the power unit 20 and the heat dissipation substrate 41 are relatively fixed by the soldering member 50 and boss 60, which is conducive to simplifying the assembly process of the radiator 40 and other components, reducing the difficulty of assembling the radiator 40 and other components, and reducing the difficulty of assembling the power conversion device 1000, making it easier to assemble.

[0098] In addition, the design in which the projection of the first section 51 in the axial direction of the through-hole 14 (i.e., in the Z-axis direction) lies within the projection of the thermally conductive layer 21 in the axial direction of the through-hole 14 and covers the projection of the boss 60 in the axial direction of the through-hole 14 ensures that the first section 51 of the weldment 50 is entirely used to transfer heat output from the thermally conductive layer 21 to the boss 60, thereby facilitating improved heat dissipation efficiency for the power unit 20. The design in which the projection of the boss 60 in the axial direction of the through-hole 14 lies within the projection of the thermally conductive layer 21 in the axial direction of the through-hole 14 ensures that the boss 60 is entirely used to transfer heat output from the thermally conductive layer 21 to the heat sink 40, thereby facilitating improved heat dissipation efficiency for the power unit 20.

[0099] It can be understood that the heat output from the power unit 20 from the thermally conductive layer 21 is sequentially transferred to the heat dissipation substrate 41 along the axial direction of the through hole 14 (i.e., the Z-axis direction) through the first section 51 of the weld 50 and the boss 60, and then diffused to the external environment through the heat dissipation substrate 41. The design of the first section 51 of the weld 50 fixedly stacked on the boss 60 and the connecting surface 211 is conducive to increasing the connection area between the first section 51, the boss 60, and the thermally conductive layer 21, and is conducive to improving the connection strength between the first section 51, the boss 60, and the weld 50, which is conducive to improving structural stability. It is also conducive to increasing the amount of heat output from the thermally conductive layer 21 by the power unit 20 and transferred to the boss 60 through the first section 51 of the weld 50, which is conducive to improving the heat dissipation efficiency of the power unit 20.

[0100] The design of the fixed stacking of the boss 60 and the fixing surface 411 of the heat dissipation substrate 41 is beneficial to increasing the connection area between the boss 60 and the heat dissipation substrate 41, improving the connection strength between the boss 60 and the heat dissipation substrate 41, improving the structural stability, and increasing the amount of heat transferred from the boss 60 to the heat dissipation substrate 41, which is beneficial to improving the heat dissipation efficiency of the power unit 20.

[0101] The design of the projection of the power device 22 in the axial direction of the through hole 14 (i.e., in the Z-axis direction) being located within the projection of the boss 60 in the axial direction of the through hole 14 helps shorten the heat dissipation path of the heat dissipated by the power device 22 during operation and transported to the heat sink 40 via the boss 60, thereby improving the heat dissipation efficiency of the power device 22. The design of the heat dissipation fins 42 helps improve the efficiency of dissipating the heat dissipated by the power unit 20 during operation to the external environment, thereby improving the heat dissipation efficiency of the power unit 20.

[0102] Referring to Figures 10, 11, 12, and 13, in conjunction with Figures 1 and 5, Figure 10 is a schematic diagram of a partial structure of the power module 300 shown in Figure 5 according to another embodiment. Figure 11 is a schematic diagram of the three-dimensional structure of the heat sink 40 of the power module 300 shown in Figure 10. Figure 12 is a schematic diagram of a partial structure of the power module 300 shown in Figure 5 according to another embodiment. Figure 13 is a schematic diagram of a partial structure of the power module 300 shown in Figure 5 according to another embodiment.

[0103] As shown in Figures 5, 10, and 11, in some other embodiments, the heat dissipation substrate 41 is provided with a groove 413. The groove 413 extends along the Z-axis and has a first opening 4131. The first opening 4131 is located on the fixing surface 411 and communicates with the through-hole 14. The groove 413 also extends along the Y-axis and has two second openings 4132: one second opening 4132 is located on the fourth mating surface 412d, and the other second opening 4132 is located on the fifth mating surface 412e. It is understood that the groove 413 extends through the heat dissipation substrate 41 along the Y-axis. In other embodiments, it may not extend through the heat dissipation substrate 41. In other words, the second opening 4132 on the fourth mating surface 412d may be omitted; alternatively, the second opening 4132 on the fifth mating surface 412e may be omitted. Exemplarily, there are two grooves 413: a first groove 413a and a second groove 413b. In other words, the grooves 413 include a first groove 413a and a second groove 413b. In other embodiments, the number of the grooves 413 may be 1, 3, 4, or more. In the X-axis direction, the first groove 413 a and the second groove 413 b are located on opposite sides of the boss 60 .

[0104] It can be understood that the groove 413 includes a first opening 4131 and a second opening 4132. The first opening 4131 is located on the fixing surface 411, and the second opening 4132 is located on the mating surface 412. The first opening 4131 is connected to the through hole 14. The design of the groove 413 facilitates the discharge of impurities (such as air or flux, etc.) in the welding component 50, helps reduce the void ratio of the welding component 50, helps reduce the thermal resistance of the welding component 50, and helps improve the efficiency of transferring heat output from the power unit 20 from the heat conductive layer 21 to the heat sink 40 through the welding component 50 and the boss 60, thereby improving the heat dissipation efficiency of the power unit 20.

[0105] As shown in Figures 10 and 12, in other embodiments, the groove 413 may also extend along the Z-axis direction and have a first opening 4131 and a second opening 4132. The first opening 4131 is located on the fixing surface 411 and is connected to the through hole 14. The second opening 4132 is located on the first mating surface 412a. In this way, the design of the groove 413 is also conducive to discharging impurities (such as air or flux, etc.) in the welding part 50, which is conducive to reducing the void ratio of the welding part 50, reducing the thermal resistance of the welding part 50, and improving the heat dissipation efficiency of the power unit 20. The design of the groove 413 is diverse, which is conducive to reducing the design cost of the groove 413, reducing the processing cost of the power module 300, and reducing the processing cost of the power conversion device 1000 (as shown in Figure 1).

[0106] As shown in Figures 10 and 13, in some other embodiments, the groove 413 extends along the Z-axis and has a first opening 4131. The first opening 4131 is located on the fixing surface 411 and is connected to the through hole 14. The groove 413 may also extend along the X-axis and have a second opening 4132. The second opening 4132 of the first groove 413a is located on the second mating surface 412b. The second opening 4132 of the second groove 413b is located on the third mating surface 412c. In this way, the design of the groove 413 is also conducive to discharging impurities (such as air or flux, etc.) from the weld 50, which is conducive to reducing the void ratio of the weld 50, reducing the thermal resistance of the weld 50, and improving the heat dissipation efficiency of the power unit 20. The design of the groove 413 is diverse, which is conducive to reducing the design cost of the groove 413 and reducing the processing cost of the power conversion device 1000 (as shown in Figure 1).

[0107] Please refer to FIG. 13 a in combination with FIG. 5 . FIG. 13 a is a schematic structural diagram of the power module 300 shown in FIG. 5 in another embodiment.

[0108] In some other embodiments, welding member 50 may be omitted. Boss 60 contacts thermally conductive layer 21. Boss 60 contacts power unit 20. Heat dissipated by power unit 20 during operation is transferred from thermally conductive layer 21. The contact between boss 60 and thermally conductive layer 21 ensures that heat dissipated by power unit 20 during operation is transported via boss 60 to heat sink 40, where it is then dissipated to the external environment, rapidly dissipating heat from power unit 20.

[0109] Please refer to FIG. 14 , in combination with FIG. 5 , which is a schematic diagram of a partial structure of the power module 300 shown in FIG. 5 in another embodiment.

[0110] In some other embodiments, in the Z-axis direction, the thermal conductive layer 21 of the power unit 20 is located on one side of the circuit board 10 and is spaced apart from the circuit board 10. The boss 60 is fixedly stacked on the connection surface 211 of the thermal conductive layer 21. The boss 60 is fixedly stacked on the side of the thermal conductive layer 21 facing the circuit board 10. The boss 60 is fixedly connected to the thermal conductive layer 21. Exemplarily, the boss 60 and the thermal conductive layer 21 are integrally formed. This is beneficial to improving the connection strength and improving the structural stability. The boss 60 extends along the Z-axis direction and partially extends into the through hole 14. That is to say, the boss 60 is partially located in the through hole 14. In some other embodiments, the boss 60 may also pass through the through hole 14, or the boss 60 may also be entirely located in the through hole 14.

[0111] The welding part 50 is filled between the heat dissipation substrate 41 and the boss 60. Specifically, the second section 52 and the third section 53 of the welding part 50 are omitted. The first section 51 of the welding part 50 is fixedly stacked between the heat dissipation substrate 41 and the boss 60. That is to say, in the Z-axis direction (i.e., in the axial direction of the through hole 14), the first section 51 is located on one side of the boss 60 and is fixedly connected to the boss 60. In the Z-axis direction (i.e., in the axial direction of the through hole 14), the boss 60 is fixedly connected to the thermal conductive layer 21, and the welding part 50 is fixedly connected to the heat dissipation substrate 41. In this way, the heat dissipated by the power unit 20 during operation is transported from the thermal conductive layer 21 to the heat dissipation substrate 41 through the boss 60 and the welding part 50, and then diffused to the external environment through the heat dissipation substrate 41, which can also achieve rapid heat dissipation of the power unit 20.

[0112] As shown in Figures 5 and 14, it can be understood that, in the axial direction of the through-hole 14 (i.e., in the Z-axis direction), the first section 51 is located on one side of the boss 60 and is fixedly connected to the boss 60. Furthermore, in the axial direction of the through-hole 14, one of the thermally conductive layer 21 and the heat dissipation substrate 41 is fixedly connected to the boss 60, while the other is fixedly connected to the first section 51. In this way, heat dissipated from the power unit 20 during operation is output from the thermally conductive layer 21. Heat output from the thermally conductive layer 21 is transported along the axial direction of the through-hole 14 (i.e., in the Z-axis direction) through the first section 51 of the weldment 50 and the boss 60 to the heat dissipation substrate 41, where it is then diffused to the external environment through the heat dissipation substrate 41, thereby dissipating heat from the power unit 20. This design, in which heat dissipated from the power unit 20 during operation is transported from the thermally conductive layer 21 along the axial direction of the through-hole 14 to the heat dissipation substrate 41, helps shorten the heat dissipation path of the power unit 20, improves the heat dissipation efficiency of the power unit 20, and facilitates rapid heat dissipation of the power unit 20.

[0113] 15 and 16, in conjunction with FIG1 and FIG5, FIG15 is a partial structural diagram of the power module 300 shown in FIG5 under another embodiment. FIG16 is a partial structural diagram of the power module 300 shown in FIG15 under another embodiment.

[0114] As shown in Figures 5 and 15, in some other embodiments, the number of power units 20 is multiple. Specifically, the number of power units 20 is 2. In some other embodiments, the number of power units 20 may also be 3, 4 or more. In the Z-axis direction, the multiple power units 20 are all located on one side of the circuit board 10. Through the fixing member 30, the pins 24 of each power unit 20 are fixedly connected and electrically connected to the circuit board 10. The heat-conducting layer 21 of each power unit 20 is spaced apart from the circuit board 10. For details, please refer to the relevant description of the embodiment shown in Figure 5 and will not be repeated here. Along the X-axis direction, the multiple power units 20 are arranged in sequence and spaced apart.

[0115] There are multiple through-holes 14. Specifically, there are two through-holes 14. In other embodiments, the number of through-holes 14 may be three, four, or more. Along the X-axis, the multiple through-holes 14 are sequentially arranged and spaced apart. Furthermore, the projections of the multiple through-holes 14 along the Z-axis overlap with the projections of the multiple power units 20 along the Z-axis in a one-to-one correspondence. In other words, the multiple through-holes 14 correspond one-to-one to the multiple power units 20.

[0116] There are multiple heat sinks 40. Specifically, there are two heat sinks 40. In other embodiments, the number of heat sinks 40 may be three, four, or more. The heat sinks 40 are installed in a one-to-one correspondence with the plurality of through-holes 14 and are spaced apart from the thermal conductive layers 21 of the plurality of power units 20. The heat sinks 40 are installed in a one-to-one correspondence with the plurality of through-holes 14 and are spaced apart from the plurality of power units 20.

[0117] It can be understood that the number of the heat dissipation substrate 41 of the heat sink 40 and the number of the bosses 60 provided on the heat sink 40 are both two. The number of both the heat dissipation substrate 41 and the bosses 60 is multiple, and the number of heat dissipation substrates 41 is equal to the number of bosses 60. The multiple bosses 60 are located in the multiple through-holes 14 in a one-to-one correspondence and are spaced apart from the thermal conductive layers 21 of the multiple power units 20. In other words, the multiple bosses 60 are located in the multiple through-holes 14 in a one-to-one correspondence and are spaced apart from the multiple power units 20. The multiple heat dissipation substrates 41 are located on the side of the circuit board 10 facing away from the power units 20 and are fixedly connected to the multiple bosses 60 in a one-to-one correspondence.

[0118] There are multiple welding parts 50. Specifically, the number of welding parts 50 is 2. In some other embodiments, the number of welding parts 50 may also be 3, 4 or more. The multiple welding parts 50 are filled between the heat-conducting layers 21 of the multiple power units 20 and the multiple heat sinks 40 in a one-to-one correspondence. The multiple welding parts 50 are fixedly connected to the multiple heat-conducting layers 21 in a one-to-one correspondence, and are fixedly connected to the multiple bosses 60 and the multiple heat dissipation substrates 41 in a one-to-one correspondence. In other words, the multiple welding parts 50 are fixedly connected to the multiple bosses 60 in a one-to-one correspondence, and are fixedly connected to the multiple power units 20 in a one-to-one correspondence. In some other embodiments, they may not be fixedly connected to the multiple heat dissipation substrates 41.

[0119] It can be understood that the number of power units 20, the number of through holes 14, the number of heat dissipation substrates 41, the number of bosses 60, and the number of welding parts 50 are all multiple, the multiple bosses 60 are located in the multiple through holes 14 in a one-to-one correspondence, the multiple welding parts 50 are fixedly connected to the multiple bosses 60 in a one-to-one correspondence, the multiple heat dissipation substrates 41 are fixedly connected to the multiple bosses 60 in a one-to-one correspondence, and the multiple power units 20 are fixedly connected to the multiple welding parts 50 in a one-to-one correspondence. The multiple power units 20, the multiple through holes 14, the multiple heat dissipation substrates 41, the multiple bosses 60, and the multiple welding parts 50 correspond one-to-one. In other words, the number of power units 20, the number of through holes 14, the number of heat sinks 40, and the number of bosses 60 are all multiple, and the multiple power units 20, the multiple through holes 14, the multiple heat sinks 40, and the multiple bosses 60 correspond one-to-one.

[0120] In this way, the heat dissipated by each power unit 20 during operation is transferred to a heat sink 41 via a boss 60 and a weldment 50, and then diffused to the external environment through the heat sink 41, achieving rapid heat dissipation of the power unit 20. Multiple power units 20 can achieve rapid heat dissipation through multiple heat sinks 41. The heat sink 41 can be adaptively designed according to the power unit 20, which helps reduce the material cost of the heat sink 41 and the material cost of the power conversion device 1000 (as shown in Figure 1). In other words, the heat dissipated by each power unit 20 during operation is transferred to a heat sink 40 via a boss 60, and then diffused to the external environment through the heat sink 40, achieving rapid heat dissipation of the power unit 20. Multiple power units 20 can achieve rapid heat dissipation through multiple heat sinks 40. The heat sink 40 can be adaptively designed according to the power unit 20, which helps reduce the material cost of the heat sink 40 and the material cost of the power conversion device 1000.

[0121] As shown in Figures 15 and 16, in other embodiments, multiple heat dissipation substrates 41 are fixedly connected to each other. Exemplarily, multiple heat dissipation substrates 41 are integrally formed. This is beneficial to improving the connection strength and improving the structural stability. In other words, multiple radiators 40 are fixedly connected to each other. The design of fixed connection between multiple radiators 40 ensures that the heat emitted by multiple power units 20 during operation can be evenly distributed on the multiple radiators 40, which is beneficial to improving the heat dissipation uniformity of multiple power units 20 through multiple radiators 40, and is beneficial to improving the maximum temperature that the power unit 20 can withstand, and is beneficial to improving the safety of use of the power unit 20, and is beneficial to improving the working performance of the power unit 20.

[0122] Please refer to Figures 1, 5, 10, 12, 13, 14, 15 and 16 again. An embodiment of the present application provides a power conversion device 1000, which includes a circuit board 10, a power unit 20 and a heat sink 40. The circuit board 10 is provided with a through hole 14. In the axial direction of the through hole 14 (i.e., in the Z-axis direction), the power unit 20 is located on one side of the circuit board 10. In the axial direction of the through hole 14 (i.e., in the Z-axis direction), the heat sink 40 is located on the side of the circuit board 10 that is away from the power unit 20, wherein the heat sink 40 is provided with a boss 60, which is at least partially located in the through hole 14 and contacts the power unit 20.

[0123] In the power conversion device 1000 provided in the embodiment of the present application, since the heat sink 40 is provided with a boss 60, the boss 60 is at least partially located in the through hole 14 and in contact with the power unit 20. When the power unit 20 is working, a large amount of heat is transmitted to the heat sink 40 through the boss 60, and then diffused to the external environment through the heat sink 40, thereby realizing rapid heat dissipation of the power unit 20.

[0124] Compared with the existing power conversion device 1000, the heat emitted by the power unit 20 during operation is transported to the heat dissipation substrate 41 of the radiator 40 through the solder, circuit board 10 and thermal conductive material, and then diffused to the external environment through the radiator 40 to realize the heat dissipation solution of the power unit 20; the present application only needs to transport the heat emitted during operation to the radiator 40 through the boss 60 provided on the radiator 40, and then diffuse it to the external environment through the radiator 40, shortening the heat dissipation path of the power unit 20, reducing the path thermal resistance, greatly improving the heat dissipation efficiency of the power unit 20, and facilitating the rapid heat dissipation of the power unit 20.

Claims

1. A power conversion device, characterized in that, The power conversion device includes: a circuit board provided with through holes; a power unit which, in the axial direction of the through holes, is located on one side of the circuit board; and a heat sink which, in the axial direction of the through holes, is located on the side of the circuit board opposite to the power unit. The heat sink is provided with a boss, at least part of the boss is located in the through holes, and the power unit is arranged on the surface of the boss.

2. The power conversion device according to claim 1, wherein, The power unit includes a heat conducting layer provided on the side of the power unit close to the boss.

3. The power conversion device according to claim 2, characterized in that The projection of the boss in the axial direction of the through holes is located within the projection of the heat conducting layer in the axial direction of the through holes.

4. The power conversion device according to claim 2, characterized in that The power unit includes power devices mounted on the side of the heat conducting layer opposite to the heat sink.

5. The power conversion device according to claim 4, characterized in that, The projection of the power devices in the axial direction of the through holes is located within the projection of the boss in the axial direction of the through holes.

6. The power conversion device according to any one of claims 2 to 5, characterized in that, A welding member is provided between the heat sink and the heat conducting layer. The welding member includes a first section provided between the boss and the heat conducting layer.

7. The power conversion device according to claim 6, characterized in that, The projection of the first section in the axial direction of the through holes is located within the projection of the heat conducting layer in the axial direction of the through holes and covers the projection of the boss in the axial direction of the through holes.

8. The power conversion device according to claim 6, characterized in that, In the axial direction of the through holes, the distance between the boss and the heat conducting layer is greater than or equal to the distance between the heat conducting layer and the circuit board.

9. The power conversion device according to claim 6, characterized in that, The welding member includes a second section provided on one side of the first section and arranged between the hole wall of the through holes and the boss.

10. The power conversion device according to claim 6, characterized in that, The welding member includes a third section surrounding the outside of the first section and arranged between the heat conducting layer and the circuit board.

11. The power conversion device according to claim 6, characterized in that, The heat sink includes a heat dissipation substrate provided on the side of the boss opposite to the heat conducting layer. The heat dissipation substrate includes a fixing surface and a mating surface. The fixing surface faces the boss, and the orientation of the mating surface is different from that of the fixing surface. There is a distance between the boss and the hole wall of the through holes. The heat dissipation substrate is provided with a groove including a first opening and a second opening. The first opening is located on the fixing surface, the second opening is located on the mating surface, and the first opening communicates with the through holes.

12. The power conversion device according to claim 11, wherein, The heat sink includes heat dissipation fins fixedly connected to the side of the heat dissipation substrate opposite to the power unit.

13. The power conversion device according to any one of claims 1 to 5, characterized in that, The number of the power units, the number of the through holes, the number of the heat sinks, and the number of the bosses are all multiple, and the multiple power units, the multiple through holes, the multiple heat sinks, and the multiple bosses correspond to each other one by one.

14. The power conversion device according to claim 13, wherein The multiple heat sinks are fixedly connected to each other.

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