Semiconductor assembly and device

Abstract

The invention relates to a semiconductor assembly (30) comprising a module (32) and a module frame (33), wherein the module (32) is connected to the module frame (33) via a bearing element (34) and is positioned relative to the module frame (33) by the bearing element (34), and the connection (35) includes a clamping device (56, 58) which prevents the module (32) from lifting off the module frame (33). According to the invention, the bearing element (34) has a clamping force element (50) for transmitting a clamping force effected by the clamping device (56, 58) and a positioning element (60) for positioning the module (32) relative to the module frame (33). Furthermore, the invention relates to a projection exposure system (1,101) and a mask inspection device with an assembly according to the invention.

Description

[0001] The invention relates to an assembly for semiconductor technology and a device for semiconductor technology, for example a mask inspection device or a projection exposure system.

[0002] Projection exposure systems for semiconductor lithography are used to create extremely fine structures, particularly on semiconductor devices or other microstructured components. The operating principle of these systems is based on creating extremely fine structures down to the nanometer range by means of a generally reduced-size image of structures on a mask, a so-called reticle, on an element to be structured, such as a wafer, which is coated with photosensitive material. The minimum dimensions of the created structures depend directly on the wavelength of the light used, the so-called useful light.The light sources used have emission wavelengths in the DUV range from 100 nm to 300 nm, although recently, light sources with emission wavelengths in the range of a few nanometers, for example, between 1 nm and 120 nm, particularly in the 13.5 nm range, have been increasingly used. This emission wavelength range is also referred to as the EUV range.

[0003] To illuminate the structures and, in particular, to image them, optical elements such as lenses and (especially in the field of EUV lithography) mirrors are used. Their so-called optical effective surfaces are exposed to useful light during normal operation of the associated system. Deviations of the optical effective surfaces from an optimal target position and shape have a significant impact on the quality of the image and thus on the quality of the manufactured components.

[0004] Typically, this problem is addressed by designing the optical elements used to be movable or deformable, allowing the aforementioned aberrations to be corrected during operation of the projection exposure system. The optical elements are usually arranged in receptacles of optical modules, which are mounted on module frames. These, in turn, can be movably mounted on an optical frame via actuators, as described above, and can thus be positioned in a predetermined position.

[0005] For precise alignment of the optical modules on the module holder, a statically determined or quasi-static bearing is preferred, which is formed, for example, by three so-called bipods, i.e. two-legs, each with one connection point on the optical module and two bearing points each on the module holder. The bipods with the optical module usually only rest on the bearing points of the module holder, so that the optical module must be secured against lifting off the bearing points, for example by clamping elements. In the solutions known from the prior art, however, the force flow of the forces applied by the clamping elements runs through the bipods, which can deform them. The resulting mechanical stresses in the bipods can be transferred to the optical module and subsequently also to the optical element.This has the disadvantage that the position of the optical module relative to the module holder can change and / or the optical element with its optical effective surface can be deformed, which can have a negative impact on the image quality of the associated projection exposure system.

[0006] A further disadvantage of the solutions known from the prior art is that after a possible replacement of the optical module during operation, both the position of the new optical module and the deformation of the corresponding optical effective area can usually deviate significantly from the values ​​of the original module, so that the requirements for image quality, which increase from generation to generation, can no longer be sufficiently ensured after the replacement.

[0007] The object of the present invention is to provide a device which eliminates the disadvantages of the prior art described above.

[0008] This object is achieved by a device having the features of the independent claim. The subclaims relate to advantageous developments and variants of the invention.

[0009] An assembly according to the invention for semiconductor technology comprises a module and a module frame, wherein the module is connected to the module frame via a bearing element and is positioned relative to the module frame by the bearing element. The connection includes a clamping device that prevents the module from being lifted off the module frame.

[0010] According to the invention, the bearing element comprises a clamping force element for transmitting a clamping force generated by the clamping device and a positioning element for positioning the module relative to the module frame. This has the advantage that the high clamping force required for this purpose has little or no influence on the positioning of the module. The clamping force is designed in such a way that lifting of the module from the module frame can be reliably prevented under predetermined loads. These loads not only relate to the loads occurring during operation, but in particular to the significantly higher loads during transport, assembly, or even during an earthquake compared to normal operation.

[0011] The high clamping forces are transferred by the clamping force element to a connection of the bearing element to the module frame, which comprises a base section. The positioning of the module is achieved by the positioning element, which is firmly connected to the base section. The force flow of the high clamping forces therefore only runs in the area of ​​the very rigid base section through the part of the bearing element that also determines the position of the module relative to the module frame. The deformations caused by the high clamping forces in the connection between the module and the module frame are thus minimized to the deformation of the very rigid base section, which can also advantageously minimize the deformation of an optical element mounted in the module.The high clamping forces have the advantage that the connection of the base part, which is only in contact with the module frame via a contact point, is also very rigid, which means that in the case that the module is an optical module of a projection exposure system, excitation of the module can only occur in frequency ranges that have little to no influence on the image quality of the projection exposure system.

[0012] Furthermore, the division of the force flows in the bearing element into a force flow of the clamping force and a force flow of the portion of the module's weight, which is borne by the respective bearing element of the module's typically statically determined mounting, can lead to increased reproducibility during module assembly. This can be particularly advantageous when replacing the module at the customer's site, since positioning the new module, which, even with an identical module, may have different dimensions than the replaced module due to manufacturing and assembly tolerances, is facilitated by minimizing the non-reproducible deformations caused by the clamping force.

[0013] Furthermore, the clamping force element can have a receptacle for a clamping element of the clamping device. The clamping element can be supported on a base frame decoupled from the module frame, so that the reaction forces of the clamping forces cannot act on the module frame and unwanted deformation of the module can be advantageously avoided.

[0014] In addition, the positioning element can have a receptacle for the module, which in turn can have a connection surface for the module. The receptacle can be positioned via the positioning element independently of the receptacle for the clamping force element. The module can be screwed and / or glued to the receptacle, although other connection techniques are also conceivable.

[0015] In a further embodiment, the bearing element can have at least one first spacer, i.e. a spacer manufactured to a predetermined thickness, such as a washer, for adjusting the connection surface for the module to the module frame. This can be arranged between the base part and a housing of the positioning element. The base part can, for example, be screwed to one end of the housing via a thread and the spacer can be in the form of a washer. The length of the positioning element and thus the position of the module relative to the module frame in the longitudinal direction of the positioning element can be adjusted via the thickness of the spacer. The clamping force element can be arranged in the at least partially hollow housing of the positioning element and connected to it on the side of the base part opposite the module frame.The thickness of the spacer does not influence the position of the holder for the clamping element.

[0016] In particular, the bearing element can have at least one second spacer for adjusting the position of the clamping element holder relative to a connection surface of the module holder. The distance between the holders can be conveniently adjusted during assembly of the bearing element such that a predetermined minimum distance is maintained even during the subsequent positioning of the module's connection surface relative to the module frame, and contact between the holders is avoided.

[0017] In addition, the clamping force element can have a rod between the clamping element mount and a connection to the module. A rod is particularly well suited for transmitting a force along the longitudinal axis of the rod and is very rigid in this direction. The spacer for adjusting the distance between the mounts can, for example, be arranged between the rod and the clamping element mount.

[0018] In another embodiment, the clamping force element can be rigid only in its longitudinal direction, meaning it can be decoupled or flexible in all other degrees of freedom. Rigid in this context means that the rigidity of the clamping force element is designed to be as high as possible within the scope of the design and the technical properties of the material used, such as yield strength or fatigue strength. In contrast, soft is understood as the lowest rigidity within the scope of the design and technical properties of the material used.

[0019] In addition, the clamping force element and / or the positioning element can have at least one decoupling element. This can, for example, be designed as a monolithic joint, which can be manufactured by erosion and / or milling and / or other suitable manufacturing processes. The decoupling has the advantage that only forces in the longitudinal direction of the bearing element are transmitted, and all other degrees of freedom are decoupled. This minimizes the constraining forces on the bearing element that may be caused by manufacturing and / or assembly tolerances.

[0020] In particular, the bearing element can have at least one end stop for protecting the at least one decoupling element in the clamping force element and / or the positioning element. These can prevent damage to the decoupling element, which is designed, for example, as a joint, which can be caused, for example, by plastic deformation due to excessive deflection.

[0021] In a further embodiment, a contact surface of the base part can be convex. This allows the contact to be reduced to a well-defined contact point in a module frame with a flat contact surface, which can be advantageous for reproducibility.

[0022] In particular, the radius of the convex contact surface can correspond to the distance between the contact surface and the decoupling point between the rod and the clamping force element mount. This advantageously prevents parasitic constraining forces on the bearing element and thus also on the module caused by manufacturing and assembly tolerances.

[0023] In a further embodiment, the clamping force element can be preloaded relative to the base part. This preload can be achieved, for example, by a compression spring arranged between the clamping force element and the positioning element. This preload can ensure that the rod of the clamping force element is constantly in contact with the base part.

[0024] Furthermore, the positioning element can be rigidly connected to the module mount and the module connection only in its longitudinal direction. The other degrees of freedom can be decoupled, which, as already explained above, advantageously minimizes or almost completely eliminates parasitic forces on the module.

[0025] In a further embodiment, the bearing element can have a spring for aligning the clamping force element with the positioning element perpendicular to the clamping force. The spring can be configured at least in one direction perpendicular to the clamping force, which has the advantage that the positioning and clamping act at least in one plane, thereby at least minimizing possible parasitic forces between the two elements of the bearing element.

[0026] In particular, the assembly can comprise a bipod with two bearing elements. In this case, the spring can prevent the clamping force from escaping from the plane spanned by the longitudinal directions of the two bearing elements aligned at an angle to each other, thereby advantageously minimizing or almost completely eliminating parasitic forces on the module.

[0027] Furthermore, the bipod can include a decoupling element for decoupling a moment about an axis perpendicular to the longitudinal directions of the clamping force elements and the clamping force. The decoupling element can be designed, for example, as a joint, which can advantageously minimize the moment in the base section caused by manufacturing and assembly tolerances during assembly of the bipod on the mounting frame. The positioning element, which is crucial for positioning and deformation of the module, is thus only subjected to the minimized moment, which can be further reduced by the decoupling elements incorporated in the positioning element.

[0028] A device according to the invention for semiconductor technology, for example a projection exposure system or a mask inspection device, comprises an assembly according to one of the embodiments explained above.

[0029] In the following, embodiments and variants of the invention are explained in more detail with reference to the drawings. Fig. 1 schematically shows in meridional section a projection exposure system for EUV projection lithography, Fig. 2 schematically shows in meridional section a projection exposure system for DUV projection lithography, Fig. 3 a schematic representation of the invention, Fig. 4 an embodiment of the invention, and Fig. 5 a detailed view of the invention.

[0030] In the following, with reference to the Fig. 1 describes, by way of example, the essential components of a projection exposure system 1 for microlithography. The description of the basic structure of the projection exposure system 1 and its components is not intended to be limiting.

[0031] One embodiment of an illumination system 2 of the projection exposure system 1 has, in addition to a radiation source 3, an illumination optics 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 can also be provided as a separate module from the rest of the illumination system. In this case, the illumination system does not include the light source 3.

[0032] A reticle 7 arranged in the object field 5 is illuminated. The reticle 7 is held by a reticle holder 8. The reticle holder 8 can be displaced, in particular in a scanning direction, via a reticle displacement drive 9.

[0033] In the Fig. 1 shows a Cartesian xyz coordinate system for explanation. The x-direction is perpendicular to the plane of the drawing. The y-direction is horizontal and the z-direction is vertical. The scanning direction is in the Fig. 1 along the y-direction. The z-direction runs perpendicular to the object plane 6.

[0034] The projection exposure system 1 comprises a projection optics 10. The projection optics 10 serves to image the object field 5 into an image field 11 in an image plane 12. The image plane 12 runs parallel to the object plane 6. Alternatively, an angle other than 0° between the object plane 6 and the image plane 12 is also possible.

[0035] A structure on the reticle 7 is imaged onto a light-sensitive layer of a wafer 13 arranged in the image plane 12 in the region of the image field 11. The wafer 13 is held by a wafer holder 14. The wafer holder 14 can be displaced, in particular along the y-direction, via a wafer displacement drive 15. The displacement of the reticle 7, on the one hand, via the reticle displacement drive 9, and the displacement of the wafer 13, on the other hand, via the wafer displacement drive 15, can be synchronized with each other.

[0036] The radiation source 3 is an EUV radiation source. The radiation source 3 emits, in particular, EUV radiation 16, which is also referred to below as useful radiation, illumination radiation, or illumination light. The useful radiation has, in particular, a wavelength in the range between 5 nm and 30 nm. The radiation source 3 can be a plasma source, for example, an LPP source (laser produced plasma) or a DPP source (gas discharged produced plasma). It can also be a synchrotron-based radiation source. The radiation source 3 can be a free-electron laser (FEL).

[0037] The illumination radiation 16 emanating from the radiation source 3 is focused by a collector 17. The collector 17 can be a collector with one or more ellipsoidal and / or hyperboloidal reflection surfaces. The at least one reflection surface of the collector 17 can be exposed to the illumination radiation 16 at grazing incidence (GI), i.e., at angles of incidence greater than 45° relative to the normal direction of the mirror surface, or at normal incidence (NI), i.e., at angles of incidence less than 45°. The collector 17 can be structured and / or coated, on the one hand, to optimize its reflectivity for the useful radiation and, on the other hand, to suppress stray light.

[0038] After the collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focal plane 18. The intermediate focal plane 18 can represent a separation between a radiation source module, comprising the radiation source 3 and the collector 17, and the illumination optics 4.

[0039] The illumination optics 4 comprises a deflecting mirror 19 and, downstream of this in the beam path, a first facet mirror 20. The deflecting mirror 19 can be a flat deflecting mirror or, alternatively, a mirror with a beam-influencing effect beyond the pure deflection effect. Alternatively or additionally, the deflecting mirror 19 can be designed as a spectral filter that separates a useful light wavelength of the illumination radiation 16 from stray light of a different wavelength. If the first facet mirror 20 is arranged in a plane of the illumination optics 4 that is optically conjugated to the object plane 6 as the field plane, it is also referred to as a field facet mirror. The first facet mirror 20 comprises a plurality of individual first facets 21, which are also referred to below as field facets. Of these facets 21, Fig. 1 only some examples are shown.

[0040] The first facets 21 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or partially circular edge contour. The first facets 21 can be designed as flat facets or, alternatively, as convexly or concavely curved facets.

[0041] As is known, for example, from DE 10 2008 009 600 A1, the first facets 21 themselves can also be composed of a plurality of individual mirrors, in particular a plurality of micromirrors. The first facet mirror 20 can, in particular, be designed as a microelectromechanical system (MEMS system). For details, reference is made to DE 10 2008 009 600 A1.

[0042] Between the collector 17 and the deflecting mirror 19, the illumination radiation 16 runs horizontally, i.e. along the y-direction.

[0043] In the beam path of the illumination optics 4, a second facet mirror 22 is arranged downstream of the first facet mirror 20. If the second facet mirror 22 is arranged in a pupil plane of the illumination optics 4, it is also referred to as a pupil facet mirror. The second facet mirror 22 can also be arranged at a distance from a pupil plane of the illumination optics 4. In this case, the combination of the first facet mirror 20 and the second facet mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006 / 0132747 A1, EP 1 614 008 B1, and US Pat. No. 6,573,978.

[0044] The second facet mirror 22 comprises a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also referred to as pupil facets.

[0045] The second facets 23 can also be macroscopic facets, which can, for example, be round, rectangular, or hexagonal, or alternatively facets composed of micromirrors. Reference is also made to DE 10 2008 009 600 A1 in this regard.

[0046] The second facets 23 can have planar or alternatively convex or concave curved reflection surfaces.

[0047] The illumination optics 4 thus form a double-faceted system. This basic principle is also known as a honeycomb condenser (fly's eye integrator).

[0048] It may be advantageous to arrange the second facet mirror 22 not exactly in a plane that is optically conjugated to a pupil plane of the projection optics 10. In particular, the pupil facet mirror 22 can be arranged tilted relative to a pupil plane of the projection optics 10, as described, for example, in DE 10 2017 220 586 A1.

[0049] With the help of the second facet mirror 22, the individual first facets 21 are imaged into the object field 5. The second facet mirror 22 is the last beam-forming mirror or actually the last mirror for the illumination radiation 16 in the beam path before the object field 5.

[0050] In a further embodiment of the illumination optics 4 (not shown), a transmission optics can be arranged in the beam path between the second facet mirror 22 and the object field 5, which transmission optics contributes in particular to the imaging of the first facets 21 into the object field 5. The transmission optics can have exactly one mirror, but alternatively also two or more mirrors, which are arranged one behind the other in the beam path of the illumination optics 4. The transmission optics can in particular comprise one or two mirrors for normal incidence (NI mirrors, normal incidence mirrors) and / or one or two mirrors for grazing incidence (GI mirrors, grazing incidence mirrors).

[0051] The illumination optics 4 has in the version shown in the Fig. 1, after the collector 17 there are exactly three mirrors, namely the deflection mirror 19, the field facet mirror 20 and the pupil facet mirror 22.

[0052] In a further embodiment of the illumination optics 4, the deflection mirror 19 can also be omitted, so that the illumination optics 4 can then have exactly two mirrors after the collector 17, namely the first facet mirror 20 and the second facet mirror 22.

[0053] The imaging of the first facets 21 by means of the second facets 23 or with the second facets 23 and a transmission optics into the object plane 6 is usually only an approximate imaging.

[0054] The projection optics 10 comprises a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the projection exposure system 1.

[0055] In the Fig. In the example shown in Figure 1, the projection optics 10 comprises six mirrors M1 to M6. Alternatives with four, eight, ten, twelve, or a different number of mirrors M1 are also possible. The penultimate mirror M5 and the last mirror M6 each have a passage opening for the illumination radiation 16. The projection optics 10 is a doubly obscured optic. The projection optics 10 has an image-side numerical aperture that is greater than 0.5 and can also be greater than 0.6, for example, 0.7 or 0.75.

[0056] Reflection surfaces of the mirrors Mi can be designed as freeform surfaces without a rotational symmetry axis. Alternatively, the reflection surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one rotational symmetry axis of the reflection surface shape. The mirrors Mi, like the mirrors of the illumination optics 4, can have highly reflective coatings for the illumination radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

[0057] The projection optics 10 has a large object-image offset in the y-direction between a y-coordinate of a center of the object field 5 and a y-coordinate of the center of the image field 11. This object-image offset in the y-direction can be approximately as large as a z-distance between the object plane 6 and the image plane 12.

[0058] The projection optics 10 can, in particular, be anamorphic. It has, in particular, different magnifications βx, βy in the x- and y-directions. The two magnifications βx, βy of the projection optics 10 are preferably (βx, βy) = (+ / - 0.25, + / - 0.125). A positive magnification β means imaging without image inversion. A negative sign for the magnification β means imaging with image inversion.

[0059] The projection optics 10 thus leads to a reduction in the ratio 4:1 in the x-direction, i.e. in the direction perpendicular to the scanning direction.

[0060] The projection optics 10 results in a reduction of 8:1 in the y-direction, i.e. in the scanning direction.

[0061] Other magnifications are also possible. Magnifications with the same sign and absolutely identical in the x and y directions, for example, with absolute values ​​of 0.125 or 0.25, are also possible.

[0062] The number of intermediate image planes in the x- and y-directions in the beam path between the object field 5 and the image field 11 can be the same or can vary depending on the design of the projection optics 10. Examples of projection optics with different numbers of such intermediate images in the x- and y-directions are known from US 2018 / 0074303 A1.

[0063] Each of the pupil facets 23 is assigned to exactly one of the field facets 21 to form a respective illumination channel for illuminating the object field 5. This can, in particular, result in illumination according to the Köhler principle. The far field is divided into a plurality of object fields 5 using the field facets 21. The field facets 21 generate a plurality of images of the intermediate focus on the pupil facets 23 assigned to them.

[0064] The field facets 21 are each imaged onto the reticle 7 by an associated pupil facet 23, superimposed on one another, to illuminate the object field 5. The illumination of the object field 5 is, in particular, as homogeneous as possible. It preferably has a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different illumination channels.

[0065] By arranging the pupil facets, the illumination of the entrance pupil of the projection optics 10 can be geometrically defined. By selecting the illumination channels, in particular the subset of the pupil facets that guide light, the intensity distribution in the entrance pupil of the projection optics 10 can be adjusted. This intensity distribution is also referred to as the illumination setting.

[0066] A likewise preferred pupil uniformity in the area of ​​defined illuminated sections of an illumination pupil of the illumination optics 4 can be achieved by redistributing the illumination channels.

[0067] Further aspects and details of the illumination of the object field 5 and in particular of the entrance pupil of the projection optics 10 are described below.

[0068] The projection optics 10 can, in particular, have a homocentric entrance pupil. This can be accessible. It can also be inaccessible.

[0069] The entrance pupil of the projection optics 10 cannot usually be precisely illuminated with the pupil facet mirror 22. When the projection optics 10 images the center of the pupil facet mirror 22 telecentrically onto the wafer 13, the aperture rays often do not intersect at a single point. However, a surface can be found in which the pairwise determined distance of the aperture rays is minimized. This surface represents the entrance pupil or a surface conjugate to it in spatial space. In particular, this surface exhibits a finite curvature.

[0070] It is possible that the projection optics 10 have different entrance pupil positions for the tangential and sagittal beam paths. In this case, an imaging element, in particular an optical component of the transmission optics, should be provided between the second facet mirror 22 and the reticle 7. With the help of this optical element, the different positions of the tangential entrance pupil and the sagittal entrance pupil can be taken into account.

[0071] In the Fig. In the arrangement of the components of the illumination optics 4 shown in Figure 1, the pupil facet mirror 22 is arranged in a surface conjugated to the entrance pupil of the projection optics 10. The field facet mirror 20 is arranged tilted relative to the object plane 6. The first facet mirror 20 is arranged tilted relative to an arrangement plane defined by the deflection mirror 19.

[0072] The first facet mirror 20 is arranged tilted to an arrangement plane which is defined by the second facet mirror 22.

[0073] Fig. 2 shows schematically in meridional section a further projection exposure system 101 for DUV projection lithography, in which the invention can also be used.

[0074] The structure of the projection exposure system 101 and the principle of imaging is comparable to that in Fig. 1 described structure and procedure. Identical components are provided with a 100 Fig. 1 raised reference numerals, the reference numerals in Fig. So 2 start with 101.

[0075] In contrast to a Fig. 1, due to the longer wavelength of the DUV radiation 116 used as useful light in the range from 100 nm to 300 nm, in particular from 193 nm, refractive, diffractive and / or reflective optical elements 117, such as lenses, mirrors, prisms, cover plates and the like, can be used in the DUV projection exposure system 101 for imaging or for illumination.The projection exposure system 101 essentially comprises an illumination system 102, a reticle holder 108 for receiving and precisely positioning a reticle 107 provided with a structure, by means of which the later structures on a wafer 113 are determined, a wafer holder 114 for holding, moving and precisely positioning this wafer 113 and a projection lens 110 with a plurality of optical elements 117, which are held via mounts 118 in a lens housing 119 of the projection lens 110.

[0076] The illumination system 102 provides DUV radiation 116 required for imaging the reticle 107 on the wafer 113. A laser, a plasma source, or the like can be used as the source for this radiation 116. The radiation 116 is shaped in the illumination system 102 via optical elements such that the DUV radiation 116, upon impinging on the reticle 107, exhibits the desired properties with regard to diameter, polarization, wavefront shape, and the like.

[0077] The structure of the subsequent projection optics 101 with the lens housing 119 does not differ in principle from that in Fig. 1 and is therefore not described further.

[0078] Fig. Figure 3 shows a schematic representation of an assembly 30 according to the invention, which is shown in a section. The assembly 30 comprises a module 32, which, for example, has an optical element designed as a mirror Mx,117, as is shown in a Fig. 1 and the Fig. 2 explained projection exposure systems 1, 101 is used. The module 32, which is in the Fig. 3 is transparent and therefore shown with dashed lines, is connected to a module frame 33 via a connection 31.

[0079] The connection 31 comprises a bearing element 34, via which the module 32 is mounted on the module frame 33, and a clamping element 56, which clamps the bearing element 34 between a base frame 58 and the module frame 33, so that lifting of the bearing element 34 and thus of the module 32, for example in the case of a shock load during transport, is reliably avoided.

[0080] The base frame 58 is decoupled from the module frame 33 so that the reaction forces of the clamping force do not act on the module frame 33. The clamping force caused by the clamping element 56 is in the Fig. 3 as an arrow and acts on the clamping force element 50. The clamping force element 50 comprises a receptacle 52, via which the clamping element 56 transmits the clamping force to the clamping force element 50. The receptacle 52 is connected via a rod 51 to a base part 36 of the bearing element 34, wherein the rod 51 only rests at the interface 57 between the rod 51 and the base part 36, i.e., is not firmly connected.

[0081] A spacer 53 is arranged between the rod 51 and the receptacle 52, so that the length of the clamping force element 50 can be adjusted via the spacer 53. The bearing element 34 further comprises a positioning element 60, which has a housing 61 with a connection surface 62 for the module 32. The base part 36 is screwed to the housing 61 via a thread 43, wherein a spacer 63 is arranged between the head surface 42 of the base part 36 and the underside of the housing 61. The thickness of the spacer 63 determines the position of the connection surface 62, whereby the module 32 can be positioned in the longitudinal direction of the bearing element 34. In the case of a conventional static mounting of the module 32, six of the Fig. 3, each of which can adjust a degree of freedom, are used. Optionally, a further spacer (not shown) can be arranged between the bearing element 34 and the module frame 33 and / or a contact surface (not shown) separated from the bearing surface 41 of the module frame 33 can be formed.

[0082] The clamping force element 50 is preloaded relative to the base part 36 connected to the positioning element 60 by a spring 55, which is supported on a projection 64 in the housing 61 of the positioning element 60 and presses against a shoulder 54 of the rod 51. This ensures contact at the interface 57 between the rod 51 and the base part 36, particularly during assembly of the module 30, i.e., when, for example, the clamping element 56 has not yet been installed. The force flow 39 of the clamping force runs via the clamping element 56, the receptacle 52, the spacer 53, and the rod 51 into the base part 36, i.e., not through the housing 61 of the positioning element 60, which is used for positioning and holding the module 32.This has the advantage that the high clamping force required only for transport or load cases caused by earthquakes only acts on the foot part 36 which is also relevant for positioning, whereby any deformation of the common foot part 36 which may be caused thereby is minimal due to the high rigidity of the same.

[0083] The clamping force also has a defined connection via the contact point 38 between the contact surface 37 of the base part 36 and the bearing surface 41 of the module frame 33, which also has a negligible influence on the positioning of the module 32. The force flow 40 through the positioning element 60, which only includes the portion of the weight force of the module 32 acting on the bearing element 34, runs via the housing 61, the spacer 63 and the base part 36 into the module frame 33 and is in the Fig. 3 is shown as a dashed line. The two force flows 39, 40 share only a minimal section in the base section 36, thus being virtually independent of each other.

[0084] Fig. Figure 4 shows a detail of an embodiment of an assembly 30 according to the invention, in which a bipod 70 with two bearing elements 34 is shown. The structure of the bearing elements 34 corresponds to that of the Fig. 3 explained bearing elements 34. The two clamping force elements 50 of the bearing elements 34 are connected to one another in the receptacle 52 via a decoupling element designed as a joint 59, whereby the clamping force elements 50 can align themselves with one another in the plane of the drawing during assembly, regardless of manufacturing and / or assembly tolerances, without introducing a parasitic moment into the foot parts 36 of the bearing elements 34 and thereby into the module 32 via the positioning element 60. The contact surface 37 of the foot part 36 is convex, so that the foot part 36 and the bearing surface 41 of the module frame 33 are connected to one another via a contact point 38, regardless of manufacturing tolerances and / or assembly tolerances.The radius R of the contact surface 37 corresponds to the distance between the joint 59 and the contact surface 37, thereby ensuring the connection at a contact point 38 and advantageously avoiding parasitic constraint forces caused by manufacturing and assembly tolerances. The housings 61 of the positioning elements 60 also comprise decoupling elements designed as joints 66, wherein the joints 66 are designed as universal joints with two axes perpendicular to each other and to the longitudinal axis of the housing 61.

[0085] The joints 66 decouple all manufacturing-related and assembly-related tolerances of the connection surface 62 of the holder 65 of the module 32, the bearing elements 34 themselves, and the bearing surfaces 41 of the module frame 33. Furthermore, the bearing elements 34 have end stops 71, which protect the joints 66 from damage, for example, plastic deformation caused by excessive deflection. The holder 52 for the clamping force elements 50 is centered in the direction perpendicular to the plane of the drawing to the holder 65 of the positioning elements 50 by a spring designed as a pin 72, which is mounted in a holder 73 connected to the holder 65 for the module 32 of the positioning element 60, thereby ensuring that the force flow 39 of the clamping force elements 50 and the force flow 40 of the positioning elements 60 always run at least in the plane of the drawing and ideally run parallel to one another.This advantageously minimizes the parasitic forces and moments on the module 32.

[0086] The pin 72 is the only connection in the area of ​​the receptacles 52, 65 between the positioning elements 60 and the clamping force elements 50, which are arranged at a distance from each other in all other degrees of freedom. The distance s of the receptacles 52, 65 is influenced by the thickness of the spacers 63 for adjusting the position of the module 32 to the module frame 33. The distance s is therefore expediently determined during assembly of the bipods 70 via the Fig. 3, the spacer 53 between the receptacle 52 and the rod 51 of the clamping force elements 50 is adjusted such that the distance s does not fall below a minimum distance due to the length changes of the positioning elements 60 that typically occur for positioning the module 32 to a predetermined position. The distance s is expediently adjusted such that the pin 72 never exerts forces in the direction of the clamping force, which in the Fig. 4 is represented by an arrow, but only causes a force to center the two receptacles 52, 65.

[0087] Fig. Figure 5 shows a section of the assembly 30 according to the invention in a plan view, in which a bipod 70 is shown. The module 32 is in the Fig. 4 transparent and therefore shown with dashed lines. In the area of ​​the receptacle 65 of the positioning elements 60, two connection points 67 for the module are arranged. The receptacle 52 of the clamping force elements 50, which in the Fig. 5 are covered by the housings 61 of the positioning elements 60, is arranged in a recess 76 of the receptacle 65, whereby the receptacle 52 can be rotated around the axis of the pin 72 for centering the receptacle 52 to the receptacle 65, as shown in Fig. 4 explains, can rotate, which in the Fig. 5 is indicated by an arrow. The receptacle 52 can also move freely in the direction of the projection of the longitudinal axes of the bearing elements 34 along a guide 74 of the pin 72. The edges of the recess 76 in the receptacle 65 are designed as end stops 75 for the receptacle 52 in order to prevent plastic deformation of the joint 59 ( Fig. 4) to prevent. List of reference symbols 1 projection exposure system 2 Lighting system 3 Radiation source 4 Lighting optics 5 Object field 6 Object level 7 reticles 8 reticle holders 9 Reticle displacement drive 10 Projection optics 11 Image field 12 Image plane 13 wafers 14 wafer holders 15 Wafer relocation drive 16 EUV radiation 17 Collector 18 Intermediate focal plane 19 Deflecting mirrors 20 facet mirrors 21 facets 22 facet mirrors 23 facets 30 assembly 31 connection 32 Module 33 module frames 34 bearing element 35 Connection bearing element 36 foot part 37 Contact surface foot part 38 Contact point foot part 39 Force flow clamping force 40 Power flow positioning 41 Storage area module frame 42 headrest footrest 43 Thread base / housing 50 clamping force element 51 Staff 52 Clamping force element holder 53 Spacer clamping force element 54 paragraph 55 preload spring 56 clamping element 57 Interface rod foot part 58 base frames 59 joint rods in connection bipod 60 positioning element 61 housings 62 Connection surface positioning element 63 spacers 64 lead 65 Recording Module 66 joint housing 67 connection points component 70 Bipod 71 End stop housing 72 pins 73 Recording Pin 74 Guide Pin 75 End stop connection clamping element 76 recess 101 Projection exposure system 102 Lighting system 107 reticles 108 reticle holders 110 Projection optics 113 wafers 114 wafer holders 116 DUV radiation 117 optical element 118 versions 119 lens housings M1-M6 mirrors R radius joint connection clamping force element s Distance between housing positioning element and connection clamping force element QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2008 009 600 A1 [0041, 0045] US 2006 / 0132747 A1

[0043] EP 1 614 008 B1

[0043] US 6,573,978

[0043] DE 10 2017 220 586 A1

[0048] US 2018 / 0074303 A1

[0062]

Claims

[1] Assembly (30) for semiconductor technology with a module (32) and a module frame (33), wherein the module (32) is connected to the module frame (33) via a bearing element (34) and is positioned by the bearing element (34) to the module frame (33) and the connection (35) comprises a clamping device (56, 58) which prevents the module (32) from being lifted off the module frame (33), characterized by that the bearing element (34) has a clamping force element (50) for transmitting a clamping force caused by the clamping device (56, 58) and a positioning element (60) for positioning the module (32) relative to the module frame (33). [2] Assembly (30) according to 1, characterized by that the clamping force element (50) has at least one receptacle (52) for a clamping element (56) of the clamping device (56,58). [3] Assembly (30) according to one of claims 1 or 2, characterized by that the positioning element (60) has at least one receptacle (65) for the module (32). [4] Assembly (30) according to one of the preceding claims, characterized by that the bearing element (34) has at least one first spacer (63) for adjusting the alignment of the module (32) to the module frame (33). [5] Assembly (30) according to one of the preceding claims, characterized by that the bearing element (34) has at least one second spacer (53) for adjusting the position of the receptacle (52) for the clamping element (56) to a connection surface (62) of the receptacle (65) for the module (32). [6] Assembly (30) according to one of claims 2 to 5, characterized by that the clamping force element (50) has a rod (51) between the receptacle (52) for the clamping element (56) and a connection (35) to the module frame (33). [7] Assembly (30) according to one of the preceding claims, characterized by that the clamping force element (50) is only rigid in its longitudinal direction. [8] Assembly (30) according to one of the preceding claims, characterized by that the clamping force element (50) and / or the positioning element (60) has at least one decoupling element (59,66). [9] Assembly (30) according to 8, characterized by that the bearing element (34) has at least one end stop (71,75) for protecting the at least one decoupling element (59,66) in the clamping force element (50) and / or the positioning element (60). [10] Assembly (30) according to one of claims 6 to 9, characterized by that a contact surface (37) of the connection (35) of the bearing element (34) to the module frame (33) is convex. [11] Assembly (30) according to claim 10, characterized by that the radius (R) of the convex contact surface (37) corresponds to the distance of the contact surface (37) to the decoupling (59) between the rod (51) and the receptacle (52) of the clamping force element (50). [12] Assembly (30) according to one of claims 6 to 11, characterized bythat the clamping force element (50) is prestressed relative to the connection (35) to the module frame (33). [13] Assembly (30) according to one of claims 6 to 12, characterized by that the positioning element (60) is rigidly connected to the holder (65) for the module (32) and the connection (35) to the module frame (33) only in its longitudinal direction. [14] Assembly (30) according to one of the preceding claims, characterized by that the bearing element (34) has a spring (72) for aligning the clamping force element (50) to the positioning element (60) perpendicular to the clamping force. [15] Assembly (30) according to one of the preceding claims, characterized by that the assembly (30) comprises a bipod (70) with two bearing elements (34). [16] Assembly (30) according to claim 15, characterized bythat the bipod (70) comprises a decoupling element (59) for decoupling a moment about an axis perpendicular to the longitudinal directions of the clamping force elements (50) and perpendicular to the clamping force. [17] Device for semiconductor technology with an assembly according to one of claims 1 to 16. [18] Device according to claim 17, characterized by that the device is a projection exposure system (1,101). [19] Device according to claim 17, characterized by that the device is a mask inspection device.

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