Connection arrangement for an integrated circuit, circuit module, control device, motor vehicle and manufacturing method

Abstract

Connection arrangement (205) for an integrated circuit (215), the connection arrangement (205) comprising the following elements: - a plurality of columnar electrical connection elements (220, 225) extending parallel to one another from a surface of the integrated circuit (215); - wherein a first connecting element (220) is solid; - and a second connecting element (225) has an axial recess (235); - wherein the recess (235) is filled with an optically conductive medium (240) to allow transmission of a light signal on a radially inner portion; - wherein an optically and electrically conductive material for transmitting a light signal and an electrical signal is attached to one end of the second connecting element (225).

Description

[0001] The present invention relates to an integrated circuit, preferably in a control unit on board a motor vehicle. In particular, the invention relates to the connection of an integrated circuit to an interposer or a substrate.

[0002] A highly complex integrated circuit (IC), such as a processing device, a memory device, or an interface component, comprises a multitude of electrical connections for its power and signaling connections. The connections are very fine and can be located very closely to one another. The integrated circuit can be mounted on an interposer, which can also support additional integrated circuits. The interposer implements electrical connections between the circuits or leads a circuit connection to a contact surface configured for connection to a printed circuit board. In this case, contacts of the circuit can be fanned out for connection to the printed circuit board.

[0003] The integrated circuit and the interposer are usually connected using copper pillar arrays (CPAs). Small copper pillars are attached to a surface of the integrated circuit in a predetermined grid and each protruding end is provided with a small solder cap. The integrated circuit with the pillars can then be placed on the interposer and briefly heated together with it, closing the solder joints to the interposer. Compared to a ball grid array (BGA), a CPA usually has a smaller grid spacing and thus a higher connection density. The integrated circuit can be contacted primarily through the copper pillar, while the solder can mainly provide a mechanical and thermal connection.

[0004] Requirements for the packing density of connections between an integrated circuit and an interposer are constantly increasing. Due to simultaneous increases in transmission rates, the electromagnetic compatibility (including signal integrity) of electrical signals transmitted via the contacts is becoming increasingly important. Modern manufacturing methods, such as 3D packaging of integrated circuits, require new solutions in connection technology.

[0005] US 2008 / 0 142 964 A1 shows tubular bumps for integrated circuits and manufacturing processes.

[0006] One object underlying the present invention is to provide an improved technology for the signal connection of an integrated circuit, for example, to an interposer. The invention achieves this object by means of the subject matter of the independent claims. Subclaims specify preferred embodiments.

[0007] According to a first aspect of the present invention, an interconnect assembly for an integrated circuit comprises a plurality of columnar electrical interconnect elements extending parallel to one another from a surface of the integrated circuit. A first interconnect element is solid, and a second interconnect element has an axial recess. The recess is filled with an optically conductive medium to allow transmission of a light signal.

[0008] A column-shaped electrical interconnect element can be designed in the known manner as a copper pillar. An arrangement of copper pillars can also be called a copper pillar array (CPA). The second interconnect element can serve as an optical interconnect element to transmit modulated light between the interposer and another element. The light signal can transmit information at high speed. The transmission can be highly immune to interference, particularly with regard to electromagnetic influences. The information can be transmitted in only one direction (simplex), in both directions (duplex), or alternating in different directions (half-duplex). Multiple data streams can use different wavelength ranges in the light signal.

[0009] In a first embodiment, the second connecting element is configured solely for transmitting the optical signal. On the second connecting element, the recess forms a radially inner section, which is delimited by an electrically conductive outer section. The outer section can prevent light from entering or exiting the region of the recess. Furthermore, the radially outer section can be used for mechanically securing the integrated circuit and / or for heat transfer.

[0010] In a second embodiment, the second connecting element is additionally configured to transmit an electrical signal between the integrated circuit and an external element on the radially outer portion. The electrical signal can transmit information and / or energy.

[0011] In one embodiment, the signal transmits electrical energy between the integrated circuit and the external element. The energy transfer typically occurs toward the integrated circuit, but reverse transfer is also possible. It should be noted that energy and information can be transmitted simultaneously via the electrical connection, optionally in different directions.

[0012] A known copper pillar array can be extended using such a second connecting element to realize both an electrical and an optical connection. A grid spacing or arrangement of copper pillars within the copper pillar array can be maintained. Electrical signals can be transmitted unchanged through the copper pillars.

[0013] Thus, the connection arrangement can be used to electrically and optically connect the integrated circuit to another element. Preferably, the other element is configured to exchange both electrical and optical signals in the region of the second connection element. However, the other element can also be configured to transmit only electrical or only optical signals to the second connection element. In this case, the other transmission technology can remain unused. Using the technology proposed herein, the connection arrangement can be used flexibly to connect an integrated circuit to other differently equipped elements.

[0014] Preferably, the integrated circuit is connected to an interposer, which typically comprises a planar, flat component. Additional electronic components can be mounted on the interposer. A carrier material for the interposer can comprise, for example, a semiconductor (substrate), glass, or an organic material. The organic material can comprise, for example, a glass-fiber-reinforced plastic, particularly with epoxy resin. Such a material is known and widely used under the designation FR-4.

[0015] The interposer can essentially be constructed like a printed circuit board. Conductive tracks are typically applied to the carrier material, which are designed to be electrically connected to the integrated circuit or the other element. Additional conductive tracks can be accommodated in embedded layers of the substrate. Vertically offset conductive tracks can be electrically connected to one another by means of vias. The interposer itself can be considered a printed circuit board, and the integrated circuit can also be configured for connection to a printed circuit board using the technology described herein.

[0016] The proposed connection arrangement with at least one second connecting element allows the advantages of an optical connection to be combined with those of a known electrical connection. In particular, data signals can be transmitted over the optical connection at high transmission speeds. Virtually no electromagnetic interference can escape to the outside. The sensitivity of the transmitted light signals to electromagnetic interference can be extremely low.

[0017] According to the invention, an optically and electrically conductive material for transmitting a light signal and an electrical signal is attached to one end of the second connecting element. The material can, in particular, comprise an electrically conductive plastic. For example, an electrically conductive polymer can be used that is also optically transparent. Conductive polymers are basic materials of organic electronics. Examples of conductive and transparent polymers include polyanilines (PANI) and polypyrroles (Ppy). A polymer can also be made electrically conductive by means of a metallic structure or carbon nanotubes. In one embodiment, the material is designed as an adhesive, so that it can additionally provide a mechanical adhesive effect.

[0018] It is preferred that a connecting element is axially connected to the integrated circuit. The axial connection can apply to a first and / or a second connecting element. The connecting element is preferably initially attached to the integrated circuit. In one embodiment, a connecting element has direct contact with a semiconductor layer of the integrated circuit.

[0019] The optical connection of the second connecting element is preferably axial. Typically, an axial optical connection is provided on both sides. The optically conductive medium can form a straight optical transmission path between the integrated circuit and the connected element. The radially outer, electrically conductive section of the connecting element is usually opaque. Thus, the outer section can simultaneously serve as optical shielding for the optical transmission path.

[0020] In one embodiment, the optically conductive medium with which the recess is filled is gaseous. In particular, the medium can comprise air. When producing a connecting arrangement or connecting two elements by means of the connecting arrangement, an atmosphere containing the medium can be present, so that the medium automatically settles into the recess. In this case, the second connecting element can be designed in the form of a small tube or a hollow cylinder.

[0021] The connecting element can also be connected to the other element by soldering. Solder can initially be applied axially to the connecting element and heated in a reflow process to create a soldered connection with an adjacent element. A second connecting element has a ring of solder at one end. The medium can have a similar melting temperature to the solder. The second connecting element can be thermally connected to another element, whereby both the solder and the medium can be liquefied by the application of heat. The solder can form a material-locking, electrically conductive connection with the other element. The molten optically conductive medium can form a material-locking connection with the other element. When the soldered connection is created, the solder can be partially displaced from the axial region and form a ring around the soldering point.Electric current can be transmitted mainly axially between the other element and the connecting element.

[0022] In a further embodiment, a solid is selected as the optically conductive medium. The melting temperature of the solid can be higher than the melting temperature of the solder, so that the medium is resistant to the heat during soldering. A small amount of another optically conductive medium with a lower melting temperature can be attached to an axial end of the medium so that it can be melted together with the solder. This allows a materially bonded, optically conductive connection to be established between the non-meltable medium and the other element in the radially inner section of the connecting element.

[0023] A fusible, optically conductive medium can be located within the solder ring. Before attaching the second connecting element to the other element, the radially inner optical section can have an axial height corresponding to the axial height of the electrical, radially outer section. Both heights can be slightly reduced when connecting the second connecting element to the other element.

[0024] It is further preferred that the fusible medium be selected such that, in its molten state, it does not mix with the molten solder. The molten medium and the molten solder can form a two-phase system. This prevents the solder from interfering with an optical path that runs axially through the optically conductive medium. Conversely, it can prevent the molten medium from interfering with an electrical path that runs through the radially outer region of the second connecting element.

[0025] An electro-optical converter can be attached to the integrated circuit to transmit light into the medium or to detect light emerging from the medium. For example, a light-emitting diode can be used to emit light, and a photodiode to detect light. Other semiconductors for transmitting or receiving light are also possible.

[0026] It is further preferred that the connecting elements of the connecting arrangement are arranged in a predetermined grid. The grid can, in particular, comprise a matrix with rows and columns. Connecting elements can be located at all or only some of the defined grid points. A typical connecting arrangement can comprise several tens to several hundred connecting elements. Typically, the vast majority of the connecting elements are purely electrical. One or more second connecting elements can additionally transmit optical signals.

[0027] The first and second connecting elements preferably have cross-sectional areas of equal size. This allows a regular grid to be maintained. The additional optical function of the second connecting element can be used in a known connection arrangement with only first connecting elements to create an additional optical transmission path.

[0028] In other embodiments, however, the second connecting element may also have a smaller or, in particular, a larger cross-sectional area than a first connecting element. The second connecting element may then occupy the space of several adjacent grid points.

[0029] According to a further aspect of the present invention, a circuit module comprises an integrated circuit and a further element, which are electrically and optically connected to one another by means of a connection arrangement proposed herein. Different variants are conceivable. In a first variant, the further element can comprise an interposer. In a second variant, the further element can comprise a printed circuit board. In other words, a connection arrangement proposed herein can advantageously be used between an integrated circuit and an interposer or a printed circuit board. The interposer can carry a plurality of integrated circuits. A combined embodiment in which an interposer is connected to one or more integrated circuits and additionally to a printed circuit board is also possible.

[0030] The interposer may include a light guide for guiding light to or from a second interconnection element. In one embodiment, the interposer provides an optical path between second interconnection elements of two integrated circuits mounted on the interposer. At the same time, the interposer may establish an electrical connection between different interconnection elements of the same or different integrated circuits, or between a interconnection element and a terminal for a printed circuit board.

[0031] According to yet another aspect of the present invention, a control device comprises a circuit module described herein. The control device can be configured, in particular, for high-performance computing (HPC). The circuit module can comprise one or more integrated circuits that exchange data and / or control signals with other elements at high speed. Such an integrated circuit can comprise, for example, a memory module, a processing device, or an interface module. The integrated circuit is equipped with at least one second connection element described herein.

[0032] The control device is preferably designed for use on board a motor vehicle. According to yet another aspect of the present invention, a motor vehicle comprises a control device described herein. The motor vehicle may, in particular, comprise a motorcycle, a passenger car, or a truck. In further embodiments, the motor vehicle may also comprise an agricultural machine, a construction machine, or a special-purpose vehicle.

[0033] A first method for manufacturing an interconnection arrangement described herein on an integrated circuit comprises steps of attaching a plurality of first interconnect elements to the integrated circuit; attaching a second interconnect element to the integrated circuit; and filling the recess of the second interconnect element with the optically conductive medium.

[0034] It should be noted that the sequence of the aforementioned processing steps can also vary. For example, the optically conductive medium may already be present in the recess of the second connecting element when the second connecting element is attached to the interposer.

[0035] A second method for producing a circuit module with an integrated circuit and a further element comprises steps of producing a connection arrangement described herein on the integrated circuit according to a first method described herein; electrically connecting a first and a second connection element of the connection arrangement to the further element; and optically connecting the medium of the second connection element to the further element. Preferably, the electrical and optical connection take place in a single operation. This operation can comprise a reflow process in which parts of the connection arrangement are locally melted by the action of heat in order to create a materially bonded connection to an adjacent element. After cooling, the connection can be resilient and stable.

[0036] The electrical connection may involve soldering. In one embodiment, a spacer is placed in the recess before heating to prevent the recess from being closed by molten solder. The spacer can be removed again after soldering or after a solder joint has cooled.

[0037] The placeholder can, for example, comprise a steel needle, particularly a stainless steel needle, to which liquid solder does not adhere. After the steel needle is withdrawn, a gaseous, optically conductive medium can penetrate into the recess and enable an optical transmission path through the second connecting element.

[0038] In yet another embodiment, the placeholder comprises a material that escapes during soldering. The material can, for example, become gaseous under the influence of heat during soldering and escape from an axial end of the second connecting element. Penetration of liquid solder into an optical connection of the second connecting element can thus be prevented. It is preferred that a temperature at which the material of the placeholder becomes gaseous is substantially at a melting temperature of the solder. It is further preferred that the material becomes gaseous under the influence of heat without boiling. For this purpose, for example, a material can be selected that sublimes at a typical melting temperature of solder, for example approximately 180°C.

[0039] The invention will now be described in more detail with reference to the accompanying figures, in which: Fig. 1 a motor vehicle with a control unit; Fig. 2 a circuit module with a connection arrangement; Fig. 3 a connecting element of a connecting arrangement; Fig. 4 a connecting element in a further embodiment; Fig. 5 is a bottom view of a connecting arrangement; Fig. 6 a side view of a connection arrangement; and Fig. 7 shows a flow diagram of a procedure.

[0040] Fig. 1 shows a system 100 with a motor vehicle 105 and an external location 110. A control device 115 is arranged on board the motor vehicle 105. The control device 115 can serve different purposes. In a first exemplary embodiment, the control device 115 receives scans from a sensor 120, which can be configured, in particular, to optically scan the surroundings of the motor vehicle 105. The sensor 120 can, for example, comprise a radar sensor, a LiDAR sensor, a camera, or an ultrasonic sensor. Based on the scans, the control device 115 can detect an object in the surroundings and intervene in the control of the motor vehicle 105 depending on the object. For example, the motor vehicle 105 can be steered longitudinally and / or transversely to avoid a collision with a detected object.In a second exemplary embodiment, the control device 115 is configured to transmit detected or determined information to the external location 110 via a wireless interface 125. For example, a specific geographical position of the motor vehicle 105 can be transmitted to the external location 110. The external location 110 can then transmit highly accurate and / or up-to-date map information relating to the determined position back to the motor vehicle 105. The control device 115 can process the received map information and, in particular, use it as the basis for controlling the motor vehicle 105. It should be noted that the control device 115 can also perform another task on board the motor vehicle 105. The control device 115 typically comprises means for high-performance computing (HPC).

[0041] Fig. 2 shows an exemplary circuit module 200 with a connection arrangement 205. The circuit module 200 includes an interposer 210, which is connected to an integrated circuit 215 by means of the connection arrangement 205. It should be noted that a connection arrangement 205 proposed herein can also be used to connect the integrated circuit 215 to a printed circuit board (PCB).

[0042] The connection arrangement 205 comprises at least a first connection element 220 and at least a second connection element 225. Although in Fig. While only a single first connecting element 220 is shown in FIG. 2, the number of first connecting elements 220 can far exceed the number of second connecting elements 225 in a practical application. The connecting elements 220, 225 are typically distributed in a predetermined arrangement, which may, in particular, comprise a grid. A connecting arrangement 205 can comprise several hundred connecting elements 220, 225.

[0043] The first connecting element 220 is essentially columnar and extends along a vertical direction that runs between the interposer 210 and the integrated circuit 215. The first connecting element 220 is preferably made of copper and is solid. On the interposer 210 side, the first connecting element 220 can be axially connected to a conductor track 230. The connection is preferably made by soldering and can implement an electrical, mechanical, and / or thermal connection.

[0044] A second connecting element 225 is constructed similarly to a first connecting element 220, but includes an axial recess 235 filled with an optically conductive medium 240. An opto-electrical converter 245 is provided on the integrated circuit 215 in the region of an axial end of the medium 240. The medium 240 is located in a radially inner region of the second connecting element 225, and electrically conductive material is located in a radially outer region. Thus, the second connecting element 225 can establish both an optical and an electrical connection to the interposer 210. The electrical connection can be used to transmit information and / or energy.

[0045] In the illustrated embodiment, the interposer 210 comprises a light guide 250 axially adjacent to the medium 240 in the recess 235 of a second connecting element 225. By way of example only, the interposer 210 comprises multiple layers separated from one another by support layers 255. A horizontal section of the light guide 250 extends between two support layers 255.

[0046] In the illustrated embodiment, a total of two second connecting elements 225 are provided, whose associated optical fibers 250 are embedded at different depths in the interposer 210. One optical fiber 250 can lead to a further opto-electrical converter 245. In another embodiment, the optical fiber 250 leads to a further vertical connecting element in order to exchange optical signals with an opto-electrical converter 245 of a further component, in particular a further integrated circuit 215. A connecting arrangement 205 described herein can also be used.

[0047] Fig. Figure 3 shows a longitudinal section through a second connecting element 225 attached to an interposer 210. A longitudinal axis 302 of the second connecting element 225 runs vertically. The second connecting element 225 is typically formed or attached to the integrated circuit 215 before the integrated circuit 215 is connected to another element. The illustration shows the second connecting element 225 before being connected to such another element, in particular an interposer 210 or a printed circuit board.

[0048] A copper tube 305 extends vertically downward from the integrated circuit 215. The copper tube 305 typically has an axial length of a few tens of µm, for example, approximately 40 to 50 µm. A flat dome of solder 310 is attached to an axial end remote from the integrated circuit 215. The solder 310 forms a ring with an axial height of typically approximately 10 µm.

[0049] An optically conductive medium 240 is mounted in the axial recess 235. The medium 240 may comprise a solid body configured to melt at a similar temperature to the solder 310. The molten medium 240 may form a material bond with an adjacent element. For example, the medium 240 may comprise polyethylene, which is known as hot melt adhesive with a similar effect. In various embodiments, the medium 240 may be completely melted to bond to the other element or only at one end facing the other element.

[0050] In one embodiment, the medium 240 extends axially approximately only as far as the copper tube 305 and has a higher melting point than the solder 310, allowing it to remain solid during a reflow process. For example, the medium 240 may comprise glass or a temperature-resistant plastic. Attached to a lower end of the medium 240 is another medium 315 for optical connection, which is optically transparent and can melt at similar temperatures to the solder 310. During a soldering process, the solder 310 can provide an axial connection to the copper tube 305, and the medium 315 can provide an axial optical connection to the medium 240.

[0051] It is preferred that melting optical medium 240, 315 and molten solder 310 do not mix with each other during a soldering process. To this end, materials for the solder 310 and the medium 240, 315 can be selected such that, in the molten state, two phases are present that remain separate from each other, forming a two-phase system.

[0052] In yet another embodiment, a material can be arranged in the recess 235 that escapes when heated to a temperature at which the solder 310 is liquid. The material preferably becomes gaseous and can prevent liquid solder 310 from settling in the recess 235. Amounts of the material remaining in the recess 235 after cooling cannot impede optical transmission. The material can initially be present as a solid and then sublimate or dissociate into a gaseous material at the selected temperature.

[0053] Fig. Figure 4 shows a longitudinal section through a second connecting element 225 in a further embodiment. In contrast to the Fig. In the embodiment shown in Figure 3, the solder 310 is omitted here, and the medium spans the entire second connecting element 225 in the radial direction. This covers both the radially inner region, which is defined by the recess, and the radially outer region, which results from the copper tube 305. In a simple embodiment, the medium 315 is optically transparent but not electrically conductive, so that the second connecting element 225 can transmit an optical signal but not an electrical signal.

[0054] In a preferred embodiment, the medium 315 is both electrically conductive and optically transmissive. The medium 315 may comprise an electrically conductive plastic, in particular a polymer. Depending on the electrical signal to be transmitted via the copper tube 305, it may be acceptable for the medium 315 to form a non-negligible electrical resistance, for example, if the signal carries information rather than transmits energy. Since the signal only has to travel a very short distance through the medium 305 after the integrated circuit 210 has been attached by means of the connecting arrangement 225, and the cross-section of the contact area is small, a specific resistance may be, for example, up to 1 Ω mm 2 / m. It may also be tolerable if the transparency of the medium 315 is only present in a wavelength range that is to be used for transmitting an optical signal. Optical attenuation in the wavelength range used should be so low that the optical signal can be transmitted well without the material 305 becoming excessively heated or permanently clouded by the transmitted light.

[0055] Fig. 5 shows an exemplary bottom view of a connection arrangement 205. The connection arrangement 205 comprises a plurality of first connection elements 220 and at least one second connection element 225. The connection elements 220, 225 are arranged here in the manner of a matrix in rows 505 and columns 510. A connection element 220, 225 can be located at each node of the grid, or predetermined nodes without a connection element 220, 225 can be provided. A different arrangement than in Fig. 4 is also possible.

[0056] Fig. 6 shows an exemplary side view of a connection arrangement 205 according to the embodiment of Fig. 4. It can be seen how a row 505 with first connecting elements 220 carries a second connecting element 225 at one point, which allows a concentric transmission of an optical and an electrical signal. In the illustration of Fig. 5 below, terminations made of solder 310 or optically transparent medium 315 can be seen at the axial ends of the connecting elements 220, 225.

[0057] Fig.7 shows a flowchart of an exemplary method 700. In a step 705, connecting elements 220, 225 can be attached to the integrated circuit 215. The connecting elements 220, 225 extend parallel to one another and preferably perpendicularly from a planar surface of the integrated circuit 215. Axial ends of the connecting elements 220, 225 are located substantially at the same height above the surface of the integrated circuit 215.

[0058] In a step 710, a placeholder can be inserted into a recess 235 of a second connecting element 225. The placeholder can, for example, comprise a solid body to which liquid solder is unlikely to adhere. Alternatively, the placeholder can also comprise a solid body, a liquid, or a pasty mass.

[0059] In a step 715, the assembly can be attached to another element 210. Axial ends of the connecting assembly 205 can abut the other element 210.

[0060] In a step 720, axial ends of the connecting elements 220, 225 can be thermally connected to the further element 215. For this purpose, the entire assembly can be heated to melt solder 310 at the axial ends of the connecting elements 220, 225. At the same time, optically transparent medium 240, 315 can be liquefied in a second connecting element 225. A cohesive electrical connection can be established using the molten solder. A cohesive optical connection can be closed in a corresponding manner using the molten medium 240, 315.

[0061] In an embodiment in which the recess 235 contains not a medium 240, 315 but a placeholder, the placeholder can prevent the solder from blocking an optical path in the axial direction of the recess 235. After the solder has cooled, the placeholder can be removed in a step 725.

[0062] Optionally, an optically conductive medium 240 can now be introduced or filled into the recess 235. In one embodiment, the medium 240 is gaseous and can, for example, comprise air. If the placeholder is removed in a suitable atmosphere, the gaseous medium 240 automatically settles into the recess 235. A non-gaseous medium 240 can be inserted into the recess as a solid, a liquid, or a pasty mass. The liquid or paste can be cured or crosslinked there, for example, by reaction with atmospheric oxygen, treatment with ultraviolet light, or the escape of solvent. Reference symbol 100 systems 105 Motor vehicle 110 external positions 115 Control device 120 sensors 125 wireless interface 200 circuit module 205 Connection arrangement 210 Interposers 215 integrated circuit 220 first connecting element 225 second connecting element 230 conductor track 235 recess 240 optically conductive medium 245 opto-electrical converter 250 light guides 255 Carrier layer 302 Longitudinal axis 305 copper pipe 310 solder 315 Medium 505 line 510 column 700 procedures 705 Attach fasteners to interposer 710 Insert placeholder into recess 715 add another element 720 thermal bonding 725 Remove placeholders

Claims

[1] Connection arrangement (205) for an integrated circuit (215), the connection arrangement (205) comprising the following elements: - a plurality of columnar electrical connection elements (220, 225) extending parallel to one another from a surface of the integrated circuit (215); - wherein a first connecting element (220) is solid; - and a second connecting element (225) has an axial recess (235); - wherein the recess (235) is filled with an optically conductive medium (240) to allow transmission of a light signal on a radially inner portion; - wherein an optically and electrically conductive material for transmitting a light signal and an electrical signal is attached to one end of the second connecting element (225). [2] The interconnection arrangement (205) of claim 1, wherein the second interconnection element (225) is configured to transmit an electrical signal between the integrated circuit (215) and an external element on a radially outer portion. [3] The interconnection assembly (205) of claim 2, wherein the signal transmits electrical energy between the integrated circuit (215) and the external element. [4] Connecting arrangement (205) according to one of the preceding claims, wherein an electrical connection of one of the connecting elements (220, 225) is made axially. [5] Connecting arrangement (205) according to one of the preceding claims, wherein an optical connection of the second connecting element (225) is axial. [6] The interconnection arrangement (205) of any preceding claim, wherein the optically conductive medium (240) is gaseous. [7] The connecting assembly (205) of any one of claims 1, 4 or 5, wherein the second connecting element (225) comprises a ring of solder (310) at one end; wherein the medium (240) has a similar melting temperature to the solder (310). [8] Connection arrangement (205) according to claim 7, wherein the medium (240) is adapted to form a material connection in the molten state. [9] The connecting arrangement (205) of claim 7, wherein the medium (240) extends into the ring of solder (310). [10] The connecting assembly (205) of any one of claims 7 to 9, wherein the molten medium (240) and the molten solder (310) do not mix with each other. [11] The interconnection arrangement (205) of any preceding claim, wherein an electro-optical converter (245) is mounted on the integrated circuit (215) for irradiating light into the medium (240) or detecting light emerging from the medium (240). [12] Connecting arrangement (205) according to one of the preceding claims, wherein the connecting elements (220, 225) are arranged in a predetermined grid. [13] Connecting arrangement (205) according to one of the preceding claims, wherein the first and second connecting elements (225) have equal cross-sectional areas. [14] Circuit module (200) comprising an integrated circuit (215) and a further element, which are electrically and optically connected to one another by means of a connection arrangement (205) according to one of the preceding claims. [15] Circuit module (200) according to claim 14, wherein the further element comprises an interposer (210). [16] Circuit module (200) according to claim 14 or 15, wherein the further element comprises a printed circuit board. [17] Circuit module (200) according to one of claims 14 to 15, wherein an electro-optical converter is attached to the further element in order to radiate light into the medium (240) or to detect light emerging from the medium (240). [18] Control device (115) comprising a circuit module (200) according to one of claims 14 to 17. [19] Motor vehicle (105) comprising a control device (115) according to claim 18. [20] A method (700) for producing a connection arrangement (205) on an integrated circuit (215), the method (700) comprising the following steps: - attaching (705) a plurality of first columnar electrical connecting elements (220) of the connecting arrangement (205) to the integrated circuit (215) such that the first connecting elements (220) extend parallel to one another from a surface of the integrated circuit (215), the first connecting elements (220) being solid; - Attaching (705) a second columnar electrical connection element (225) of the connection arrangement (205) to the integrated circuit (215) such that the second connection element (225) extends parallel to the first connection elements (220) from the surface of the integrated circuit (215), wherein the second connection element (225) has an axial recess (235); and - filling (725) the recess (235) of the second connecting element (225) with an optically conductive medium (240) to allow transmission of a light signal on a radially inner portion. [21] Method (700) for producing a circuit module (200) with an integrated circuit (215) and a further element, the method (700) comprising the following steps: - producing a connection arrangement (205) on the integrated circuit (215) according to a method (700) according to claim 20; - electrically connecting (720) a first and second connecting element (225) of the connecting arrangement (205) to the further element; and - optically connecting (720) the optically conductive medium (240) of the second connecting element (225) to the further element. [22] The method (700) of claim 21, wherein the electrical connection (720) comprises soldering; wherein a placeholder is mounted in the recess (235) to prevent closure of the recess (235) by liquid solder (310) during soldering; wherein the placeholder is removed after soldering.

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