Printed circuit board assembly and method for assembling a printed circuit board with an electronic component

Abstract

The invention relates to a printed circuit board arrangement (1) with a printed circuit board (4) having a top side (2) and a bottom side (3) and at least one electronic component (5), wherein the component (5) has at least one connection element (6), wherein the printed circuit board (4) has at least one conductor track (7) and at least one contact hole (8) for receiving and electrically contacting the connection element (6) of the electronic component (5), wherein the contact hole (8) is at least partially lined with a solderable material (10), namely an electrically conductive material (10) forming a soldering surface (9), and wherein the at least one conductor track (7) is in electrically conductive contact with the soldering surface (9),wherein the connection element (6) of the electronic component (5) is guided from the top side (2) of the circuit board (4) through the contact hole (8) and is electrically connected to the soldering surface (9) and thus to the at least one conductor track (7) via a solder (11), which is characterized in that a stabilizing hole (12) for stabilizing the electronic component (5) is formed adjacent to the contact hole (8), that the stabilizing hole (12) is lined with a solderable material (13), that the connection element (6) of the electronic component (5) is bent towards the stabilizing hole (12) at least on the top side (2) of the circuit board (4), and that the connection element (6) of the electronic component (5) is additionally at least mechanically connected to the solderable material (13) in the component stabilizing hole (12) via a solder (14).

Claims

[1] A printed circuit board assembly (1) comprising a printed circuit board (4) having a top side (2) and a bottom side (3) and at least one electronic component (5), wherein the component (5) has at least one connection element (6), wherein the printed circuit board (4) has at least one conductor track (7) and at least one contact hole (8) for receiving and electrically contacting the connection element (6) of the electronic component (5), wherein the contact hole (8) is at least partially lined with a solderable material (10), namely an electrically conductive material (10) forming a soldering surface (9), and wherein the at least one conductor track (7) is in electrically conductive contact with the soldering surface (9), wherein the connection element (6) of the electronic component (5) is guided from the top side (2) of the printed circuit board (4) through the contact hole (8) and is electrically conductively connected to the soldering surface (9) and thus to the at least one conductor track (7) via a solder (11), characterized bythat a stabilizing bore (12) for stabilizing the electronic component (5) is formed adjacent to the contact bore (8), that the stabilizing bore (12) is lined with a solderable material (13), that the connection element (6) of the electronic component (5) is bent towards the stabilizing bore (12) at least on the upper side (2) of the printed circuit board (4), and that the connection element (6) of the electronic component (5) is additionally at least mechanically connected to the solderable material (13) in the stabilizing bore (12) via a solder (14). [2] Printed circuit board arrangement (1) according to claim 1, characterized by that the solderable material (13) lining the stabilizing bore (12) extends at least partially onto the upper side (2) of the printed circuit board (4), in particular as far as the contact bore (8). [3] Printed circuit board arrangement (1) according to claim 2, characterized byin that the solderable material (13) of the stabilizing bore (12) and the solderable material (10) forming the soldering surface (9) of the contact bore (8) together form a soldering surface (15) on the upper side (2) of the printed circuit board (4), in particular wherein the contact bore (8) and the stabilizing bore (12) are surrounded by the soldering surface (15), further in particular wherein the soldering surface (15) is round, oval or square. [4] Printed circuit board arrangement (1) according to one of claims 1 to 3, characterized by that the at least one conductor track (7) is electrically conductively connected to the solderable material (13) of the stabilizing bore (12). [5] Printed circuit board arrangement (1) according to one of claims 1 to 4, characterized by that the stabilizing bore (12) has a smaller diameter (d S ) than the contact hole (8), in particular a diameter (d S ) from 0.3mm to 0.6mm. [6] Printed circuit board arrangement (1) according to one of claims 1 to 5, characterized by that the at least one connection element (6) of the electronic component (5) is bent at least twice, namely that a first bending point (17) and a second bending point (18) are realized on the upper side (2) of the printed circuit board arrangement (1). [7] Printed circuit board arrangement (1) according to claim 6, characterized by that the first bending point (17) and the second bending point (18) successively divide the connection element (6) of the electronic component (5) from the end (20) of the connection element (6) remote from the component body (19) to the component body (19) into a first partial section (21), a second partial section (22) and a third partial section (23), and that the second partial section (22) and the third partial section (23) are preferably bent towards one another in an L-shape or a V-shape. [8] Printed circuit board arrangement (1) according to one of claims 1 to 7, characterized bythat the additional solder (14) of the stabilizing bore (12) reinforces the connecting element (6) in the region of at least one bending point, preferably the second bending point (18), in particular completely envelops the bending point and that preferably the second bending point (18) is arranged directly above the stabilizing bore (12) [9] Method (100) for assembling a printed circuit board having at least one conductor track with at least one electronic component, wherein the electronic component has at least one connection element and wherein the printed circuit board has at least one contact hole for receiving the at least one connection element, which is lined with a solderable, electrically conductive material forming a soldering surface, wherein the at least one conductor track is in electrically conductive contact with the soldering surface and that the printed circuit board further has at least one stabilizing hole formed adjacent to the contact hole, which is lined with a solderable material, characterized by , that in a provision step (101) an electronic component with at least one bent connection element is provided, that in a mounting step (102) the printed circuit board is mounted with the at least one component by inserting the at least one bent connection element from the top side of the printed circuit board into the contact hole in such a way that the at least one bending point is arranged on the top side of the printed circuit board and the connection element is bent towards the stabilising hole, that in a soldering step (103) solder is applied from the underside of the printed circuit board in such a way that the connection element is electrically conductively connected to the soldering surface and thus to the at least one conductor track via solder in the region of the contact hole and is also additionally at least mechanically connected to the solderable material in the stabilizing hole via solder.

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