Submerged liquid cooling device

Abstract

The invention discloses an immersed liquid cooling device (100) comprising a liquid cooling radiator (40) having a first liquid box (41) at one end thereof combined with the open end of a liquid storage box (10), such that a heat dissipation radiator tube set (43) at the other end is immersed in the cooling liquid in the liquid storage box (10). The liquid storage box (10) is externally equipped with a cooling chip (20) and a heat sink (30). When the cooling chip (20) is activated, the cooling chip (20) reduces the cooling liquid in the liquid storage boxes (10) to a freezing temperature, so that the cooling liquid can quickly cool the working liquid in the heat dissipation radiator tube set (43), thereby preventing the heat dissipation efficiency of the heat dissipation radiator set (43) from being affected by the ambient temperature.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention

[0001] The present invention relates to a liquid cooling device used in the field of heat dissipation technology for processors, and more particularly to an immersed liquid cooling device that improves the heat dissipation efficiency of the liquid cooling device for the processor by the cooling action of thermoelectric materials. 2. Description of the state of the art

[0002] Heat dissipation devices, such as those shown in US 2006 / 0 185 378 A1 and US 2013 / 0 299 139 A1, typically include a liquid cooling head mounted on the surface of the processor, a liquid cooling radiator for heat dissipation, and two liquid lines connected between the liquid cooling head and the liquid cooling radiator. A liquid pump drives the working fluid to circulate between the liquid cooling head and the liquid cooling radiator. As the working fluid flows through the liquid cooling head, it absorbs the heat from the processor and then flows into the liquid cooling radiator for heat dissipation. The working fluid cools and then flows to the liquid cooling head. The heat is dissipated according to this circular flow.

[0003] The structure of a liquid cooler is shown in US 11 774 192 B2, which comprises a liquid inlet box, a liquid collection box, a plurality of exhaust pipes, and a fan. The liquid inlet box is divided by a partition wall into a hot liquid chamber and a cold liquid chamber. The wall of the liquid inlet box is provided with a hot liquid inlet and a cold liquid outlet, which connect the hot liquid chamber to the cold liquid chamber. The hot liquid inlet and the cold liquid outlet are each connected to the liquid cooling head via the aforementioned liquid lines. The exhaust pipes are connected between the liquid inlet box and the liquid collection box, and the fans are arranged outside the exhaust pipes.So when the high temperature working fluid enters the fluid inlet box from the hot fluid inlet and flows to the fluid collection box, and then flows back from the fluid collection box to the fluid inlet box and to the cold fluid outlet, fans are used to supply air to the exhaust pipes for air cooling and heat dissipation, thereby cooling the working fluid.

[0004] US 3 556 199 A shows a heat transfer system which uses the free convection flow of a coolant to reduce the temperature of a circulating, heated transport fluid, wherein a heat exchanger immersed in a coolant bath is designed and arranged to achieve the greatest possible temperature-density difference between the circulating transport fluid and the surrounding coolant, which generates strong natural convection currents.

[0005] DE 11 2019 005 877 T5 shows a heat exchanger comprising an internal component and a housing. The internal component is configured to allow a first fluid to flow within. The housing accommodates the internal component and is configured to allow a second fluid to flow within a space around the internal component in the housing. The internal component comprises a tank and a plurality of tubes. The first fluid flows within the tank along a longitudinal direction of the tank. The tube, which is formed in a tubular shape, is connected to the tank such that a longitudinal direction of the tube is perpendicular to the longitudinal direction of the tank. The tubes are stacked through a gap to be arranged or aligned in the longitudinal direction of the tank.A second inlet portion, which is an inlet for the second fluid, and a second outlet portion, which is an outlet for the second fluid, are arranged on a joint surface, which is a surface of the housing in a stacking direction in which the plurality of tubes are stacked together.

[0006] DE 20 2018 004 502 U1 shows a water-cooling radiator through which a liquid coolant can flow, comprising: a cold-end chamber body through which a liquid coolant can flow; at least one thermoelectric chip with a cooling surface and a heat-generating surface that are opposite one another, wherein the cooling surface of the at least one thermoelectric chip is thermally coupled to the cold-end chamber body; at least one heat dissipation device that is thermally coupled to the heat-generating surface of the at least one thermoelectric chip; and a water tank with a first chamber, a second chamber, an outer inlet, a first inner outlet, a first inner inlet, and an outer outlet, wherein the outer inlet and the first inner outlet correspond to the first chamber, and the first inner inlet and the outer outlet correspond to the second chamber.The cold-end chamber body has a channel, and two opposite ends of the channel are connected to the first inner outlet of the first chamber and the first inner inlet of the second chamber, respectively, so that liquid coolant flowing into the first chamber via the outer inlet flows through the channel and can then flow out of the second chamber via the outer outlet. However, conventional liquid cooling, which uses fans to dissipate heat from the working fluid, is easily affected by the ambient temperature. For example, if the room temperature is too high, the air cooling efficiency of the liquid cooler decreases, which directly affects the heat dissipation efficiency of the liquid cooling device for the processor. SUMMARY OF THE INVENTION

[0007] The main object of the present invention is to provide an immersed liquid cooling device. This object is achieved by the liquid cooling device described in the appended claim 1. Advantageous embodiments are set forth in the subclaims. The first liquid box at one end of a liquid cooling radiator is welded and assembled to the open end of a liquid storage box, so that the second liquid box at the other end of the liquid cooling radiator and the heat dissipation radiator tube set are immersed in the cooling liquid within the liquid storage box. A cooling chip is located on the outside of the liquid storage box, which cools the cooling liquid in the liquid storage box to a freezing temperature, allowing the cooling liquid to quickly cool the working fluid circulating in the heat dissipation radiator tube set.In this way, the liquid cooling radiator can dissipate heat without being affected by the ambient temperature, thereby improving the heat dissipation efficiency of the liquid cooling device for the processor.

[0008] Another object of the present invention is to provide an immersed liquid cooling device that enables the liquid cooling radiator to be stably installed in the liquid cooling box through the positioning rails in the liquid cooling box and the positioning frame structures on both sides of the liquid cooling radiator.

[0009] Another object of the present invention is to provide an immersed liquid cooling device that improves the internal thermal resistance structure of the liquid box at one end of the liquid cooling radiator so that the hot liquid flowing through the hot liquid chamber does not conduct heat into the cold liquid chamber and the cooling liquid is not heated by the hot liquid in the hot liquid chamber. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic three-dimensional view of the first embodiment of the immersed liquid cooling device of the present invention. Fig. 2 is a schematic front view of the first embodiment of the immersed liquid cooling device according to the invention. Fig. 3 is a schematic exploded view of the first embodiment of the immersed liquid cooling device according to the present invention. Fig. 4 is a schematic three-dimensional view of the front end of the liquid storage box in Fig. 2 of the present invention. Fig. 5 is a schematic exploded view of the liquid cooling element in Fig. 2 of the present invention. Fig. 6 is a schematic cross-sectional view of the immersed liquid cooling device of Fig. 1 of the present invention. Fig. 7 is a schematic front view of the second embodiment of the immersed liquid cooling device according to the invention. Fig. Figure 8 is a schematic cross-sectional view of the immersed liquid cooling device of Fig. 7 of the present invention. Fig. 9 is a schematic exploded view of a plurality of cooling chips installed on the rear wall of the liquid storage box of the present invention. Fig. 10 is a schematic exploded view of a cooling chip provided on the peripheral wall of the liquid storage box of the present invention. Fig. 11 is a schematic exploded view of the peripheral wall of the liquid storage box of the present invention equipped with a plurality of cooling chips. DETAILED DESCRIPTION OF THE INVENTION

[0010] Referring to Fig. 1, a submerged liquid cooling device 100 of the present invention is used to form a liquid cooling device with a liquid cooling head 200 and two liquid tubes 300, which is used in computers and servers to dissipate heat from the working fluid flowing through the liquid cooling head 200. Referring to Fig. 2 and Fig. 3 together, a preferred embodiment of the immersed liquid cooling device 100 of the present invention comprises: a liquid storage box 10, a cooling chip 20, a heat sink 30 and a liquid cooling radiator 40.

[0011] The liquid storage box 10 is a one-piece, stamped metal box, preferably made of an aluminum alloy with better thermal conductivity. Its structure includes a peripheral wall 11, a rear wall 12, a front opening 13, and a liquid storage chamber 14 (as shown in Fig. 2 to Fig. 4). The peripheral wall 11 is provided with a liquid injection port 15 connected to the liquid storage chamber 14 at a selected location, and with a bolt 16 locked in the liquid injection port 15 for injecting a cooling liquid into the liquid storage chamber 14.

[0012] The cooling chip 20 is a cooling chip made of semiconductor material that can convert thermal energy and electrical energy into each other. It is attached to the outside of the rear wall 12 of the liquid container 10. The rear wall 12 of the liquid storage box 10 can be provided with a groove 18, and the cooling chip 20 can be embedded in the groove 18 so that its cold surface 21 is in contact with the groove bottom 181 of the groove 18.

[0013] The heat sink 30 is made of an aluminum alloy with superior thermal conductivity and includes a base 31 and a plurality of radiating fins 32. The heat sink 30 is fixed to the rear panel 12 of the liquid storage tank 10 with screws, so that its base 31 is attached to a hot surface 22 of the cooling chip 20 to cool the hot surface 22 of the cooling chip 20, thereby achieving the effect of keeping the cold surface 21 of the cooling chip 20 at a low temperature. The heat sink 30 can be equipped with a fan 33 as needed. The fan 33 is arranged on either side of the heat sink 30 to direct the cold air through the radiating fins 32 of the heat sink 30 for heat dissipation.

[0014] As in Fig. 5 and Fig. 6, the liquid cooling radiator 40 includes a first liquid tank 41, a second liquid tank 42, and a heat dissipation radiator tube set 43 made of aluminum alloy, as well as a liquid pump 44 for pumping liquid. The first liquid tank 41 is internally divided into a hot liquid chamber 411 and a cold liquid chamber 412. The housing wall is provided with a hot liquid inlet 413 and a cold liquid outlet 414, which connect the hot liquid chamber 411 and the cold liquid chamber 412, respectively. The interior of the second liquid tank 42 is a return chamber 421 without partition walls. The heat dissipation radiator tube set 43 includes a plurality of first radiator tubes 431 and a plurality of second radiator tubes 432. One ends of the first radiator tubes 431 and the second radiator tubes 432 are connected to the hot liquid chamber 411 and the cold liquid chamber 412, respectively.the cold liquid chamber 412 of the first liquid tank 41. The other ends of the first radiator tubes 431 and the second radiator tubes 432 are connected to the return chamber 421 of the second liquid tank 42. The liquid pump 44 is an existing product and can be installed directly into the hot liquid chamber 411 or the cold liquid chamber 412 of the first liquid tank 41, thus making the liquid cooling radiator 40 an integrated liquid cooling radiator with a liquid pump. As a result, the working fluid is injected into the liquid cooling radiator 40, and the working fluid can be driven by the liquid pump 44 to circulate between the liquid cooling radiator 40 and the liquid cooling head 200.However, the liquid pump 44 may not be provided in the first liquid chamber 41 of the liquid cooling radiator 40 of the present invention, and the working fluid may be driven to circulate between the liquid cooling head 200 and the liquid cooling radiator 40 by a liquid pump arranged at other locations (such as the above-mentioned liquid lines 300).

[0015] Referring to Fig. 2 and Fig. 6, in the assembly of the present invention, the second liquid box 42 of the liquid cooling radiator 40 and the heat dissipation radiator tube set 43 are inserted from the front opening 13 of the liquid storage box 10 into the liquid storage chamber 14, and the outer peripheral wall of the first liquid box 41 is sealed (e.g., by welding) to the front opening 13 of the liquid storage box 10. Then, the cooling liquid is introduced into the liquid storage chamber 14 of the liquid storage box 10 through the liquid injection port 15, so that the second liquid box 42 and the heat dissipation radiator tube set 43 are completely immersed in the cooling liquid in the liquid storage box 10.

[0016] Again referring to Fig. 2 and Fig. 4, the two inner walls of the liquid storage chamber 14 of the liquid storage box 10 of the present invention are each provided with two rails 17, and each of the two sides of the heat-dissipating radiator tube set 43 is each provided with a positioning frame 45. When the second liquid box 42 of the liquid-cooling radiator 40 and the heat-dissipating radiator tube set 43 are loaded into the liquid box 10, the positioning frames 45 are confined between the respective two rails 17 in the liquid box 10, so that the longer heat-dissipating radiator tube set 43 can be stably installed in the liquid box 10, preventing the heat-dissipating radiator tube set 43 from shaking and causing the welded part of the first liquid box 41 and the front opening 13 to crack or detach.The positioning frame 45 includes a straight plate 451 connected to a corresponding side of the heat-dissipating radiator tube set 43, and a plurality of protruding positioning plates 452 perpendicular to the straight plate 451. During installation, the protruding positioning plates 452 are wedged between the respective two rails 17 in the liquid storage box 10. A fitting piece 19 is provided between the front end surface 171 of each of the aforementioned rails 17 and the front opening 13 of the liquid container 10.During assembly, the first liquid container 41 may be inserted into the front opening 13 until the end surface of the first liquid container 41 abuts against the front end surfaces 171 of the rails 17, and then the first liquid container 41 and the front opening 13 are welded together to achieve the effect that the first liquid container 41 is firmly embedded in the front opening 13 of the liquid container 10.

[0017] The first liquid box 41 of the liquid cooling radiator 40 consists of a first box body 415 and a first box cover 416, and the second liquid box 42 consists of a second box body 422 and a second box cover 423, again Fig. 5 and Fig. 6. The first box cover 416 and the second box cover 423 are each provided with a plurality of pipe sockets that communicate with the first box body 415 and the second box body 422, respectively. At this time, the two ends of the first radiator tubes 431 and the second radiator tubes 432 are respectively inserted into the pipe sockets and welded. In order to prevent the hot liquid chamber 411 of the first liquid box 41 from transferring heat to the cold liquid chamber 412, the first box body 415 of the present invention is provided with a hot liquid spacer 417 and a cold liquid spacer 418 in parallel, so that an insulated space 419 is formed between the hot liquid spacer 417 and the cold liquid spacer 418.The insulated space 419 is used to prevent the high-temperature working fluid flowing into the hot-liquid chamber 411 from transferring heat to the low-temperature working fluid in the cold-liquid chamber 412.

[0018] Again referring to Fig. 5 and Fig. 6, one of the preferred embodiments of the heat dissipation radiator tube set 43 includes a wave-shaped radiating fin 433 between each two adjacent tubes of the first radiator tubes 431 and the second radiator tubes 432 to improve heat dissipation efficiency. Or see Fig. 7 and Fig. 8, the heat dissipation radiator tube set 43 does not need to have the above-mentioned radiation fins 433 between the first heating tubes 431 and the second heating tubes 432, and only the use of the cooling liquid in the liquid storage box 10 is sufficient to quickly dissipate the heat from the working fluid in the first heating tubes 431 and the second heating tubes 432

[0019] Referring to Fig. 9, in order to improve the cooling efficiency of the cooling liquid, the cooling chip 20 of the present invention can be implemented with more than two, and the rear wall 12 of the liquid storage box 10 is provided with grooves 18 corresponding to the number of cooling chips 20. Furthermore, the cooling chips 20 of the present invention are not limited to being installed outside the rear wall 12 of the liquid storage box 10. As shown in Fig. 10 and Fig.As shown in Figure 11, one or more cooling chips 20 can also be installed outside the peripheral wall 11 of the liquid storage container 10. The peripheral wall 11 can also be provided with the same number of grooves 18 for the installation of cooling chips 20 on the outside.

[0020] When applying the present invention, the thermoelectric material of the cooling chip 20 is energized, causing the cold surface 21 of the cooling chip 20 outside the liquid reservoir 10 to absorb heat. The cooling fluid in the liquid reservoir 10 can be reduced to an icy-cold temperature, and the convection current absorbs heat through the working fluid in the heat-dissipating radiator tube set 43, causing the working fluid to rapidly cool and then flow to the liquid cooling head 200 to cool the processor.Since the temperature control of the cooling liquid in the liquid storage box 10 of the present invention depends on the current and voltage excited by the cooling chip 20, the ambient temperature can be prevented from affecting the heat dissipation efficiency of the liquid cooling radiator 40, thereby achieving the effect of improving the heat dissipation efficiency of the liquid cooling device for the processor.

Claims

[1] Immersed liquid cooling device comprising a liquid storage container (10) which is a metal casing having a peripheral wall (11), a rear wall (12) and a front opening (13) forming a liquid storage chamber (14), the liquid storage chamber (14) being filled with a cooling liquid; at least one cooling chip (20), wherein the at least one cooling chip (20) has a hot surface (22) and an opposite cold surface (21) and is optionally arranged outside the rear wall (12) or the peripheral wall (11) of the liquid storage container (10), wherein the cold surface (21) thereof is optionally attached to the outside of the rear wall (12) or the peripheral wall (11) of the liquid storage container (10); a heat sink (30) whose base (31) is attached to the hot surface (22) of the at least one cooling chip (20); a liquid cooling radiator (40) comprising a first liquid box (41), a second liquid box (42), and a heat dissipating radiator tube set (43), the first liquid box (41) being internally divided into a hot liquid chamber (411) and a cold liquid chamber (412), and comprising a box wall provided with a hot liquid inlet (413) and a cold liquid outlet (414) connecting the hot liquid chamber (411) and the cold liquid chamber (412), respectively, the second liquid box (42) comprising a return chamber (421) therein, the heat dissipating radiator tube set (43) comprising a plurality of first radiator tubes (431) and second radiator tubes (432), the first radiator tubes (431) and the second radiator tubes (432) being connected at their respective one ends to the hot liquid chamber (411) and the cold liquid chamber (412), respectively.the cold liquid chamber (412) of the first liquid tank (41) and their respective opposite ends are connected to the return chamber (421) of the second liquid tank (42); and. wherein the second liquid box (42) of the liquid cooling radiator (40) and the heat dissipation radiator tube set (43) are placed in the liquid storage chamber (14) from the front opening (13) of the liquid storage box (10), and then the outer peripheral wall (11) of the first liquid box (41) seals the front opening (13) of the liquid storage box (10) so that the heat dissipation radiator tube set (43) is immersed in the cooling fluid in the liquid storage box (10); and wherein the liquid storage chamber (14) of the liquid storage box (10) has two opposite inner walls, each provided with two rails (17); the heat-dissipating radiator tube set (43) has two opposite sides, each provided with a positioning frame (45), each positioning frame (45) being delimited between the two rails (17) on the respective inner wall of the liquid storage chamber (14) of the liquid storage box (10). [2] The immersed liquid cooling device according to claim 1, wherein each positioning frame (45) comprises a straight plate (451) fixed to the respective one side of the heat dissipation radiator tube set (43), and a plurality of positioning projection plates (452) perpendicular to the straight plate (451) such that the positioning projection plates (452) are confined between the respective two rails (17). [3] The immersed liquid cooling device according to claim 1, wherein each of the rails (17) has a front end surface (171), and a fitting piece (19) is provided between the front end surfaces (171) of the rails (17) and the front opening (13) of the liquid storage box (10); wherein the first liquid box (41) is inserted into the front opening (13) with one end surface thereof abutting against the front end surfaces (171) of the rails (17). [4] The immersed liquid cooling device according to claim 3, wherein the first liquid box (41) and the front opening (13) of the liquid storage box (10) are welded together. [5] Immersed liquid cooling device according to claim 1, wherein one of the rear wall (12) and the peripheral wall (11) of the liquid storage box (10) is provided with at least one groove (18), wherein the at least one groove (18) has a groove bottom (181) and the at least one cooling chip (20) is embedded in the at least one groove (18) with its cold surface (21) being attached to the groove bottom (181) of the respective groove (18). [6] Immersed liquid cooling device according to claim 5, wherein the number of the at least one cooling chip (20) is a multiple and the number of the at least one groove (18) located on the rear wall (12) or the peripheral wall (11) of the liquid reservoir (10) corresponds to the number of the cooling chips (20). [7] The immersed liquid cooling device according to claim 1, wherein the first liquid tank (41) comprises a first tank body (415) and a first tank cover (416), and the second liquid tank (42) comprises a second tank body (422) and a second tank cover (423), the first tank cover (416) and the second tank cover (423) each being provided with a plurality of pipe sockets communicating with the first tank body (415) and the second tank body (422), respectively; the first radiator tubes (431) and the second radiator tubes (432) each being provided with two ends that are inserted into and welded to the pipe sockets. [8] The immersed liquid cooling device according to claim 7, wherein the first box body (415) is provided internally with a hot liquid spacer (417) and a cold liquid spacer (418) arranged in parallel with an insulated space (419) formed between the hot liquid spacer (417) and the cold liquid spacer (418). The hot liquid spacer (417) is separated from the cold liquid spacer (418). The hot liquid chamber (411) and the cold liquid chamber (412), and the hot liquid spacer (417) and the cold liquid spacer (418) separate the hot liquid chamber (411) and the cold liquid chamber (412). [9] The immersed liquid cooling device according to claim 1, wherein the heat dissipating radiator tube set (43) further comprises a plurality of radiation fins (433) each disposed between two adjacent first radiator tubes (431) and the second radiator tubes (432). [10] An immersed liquid cooling device according to claim 1, wherein the heat sink (30) comprises a fan (33) disposed on one side thereof and used to drive a flow of cold air through the heat sink (30) for heat dissipation. [11] The immersed liquid cooling device according to claim 1, wherein the liquid cooling radiator (40) comprises a liquid pump (44) arranged in either the hot liquid chamber (411) or the cold liquid chamber (412) of the first liquid box (41).

Images