DISPLAY DEVICE

Abstract

A display device (100) may include a substrate (110) having a display region (AA), a non-display region (NA), and a bending region (BE), an adhesive layer (AD) disposed on the substrate (110), a pixel driver circuit (20) disposed on the adhesive layer (AD) in the display region (AA), a buffer layer (121) disposed on the adhesive layer (AD) and configured to cover the pixel driver circuit (20), a second protective structure (TRE2) disposed in the non-display region (NA) so as to surround the display region (AA), a first inorganic film (INO1) disposed on the pixel driver circuit (20), and a second inorganic film (INO2) disposed on the second protective structure (TRE2) in the display region (AA) and the non-display region (NA). The first inorganic film (INO1) and the second inorganic film (INO2) overlap in an area that overlaps the second protective structure (TRE2).

Description

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims priority to Korean Patent Application No. 10-2023-0192374, filed in the Republic of Korea on December 27, 2023. BACKGROUND1. Area

[0002] The embodiments of the present disclosure relate to a display device using an inorganic light emitting diode as a light source. 2. Discussion of related technology

[0003] An electroluminescent display device includes an organic light-emitting display device in which an organic light-emitting diode (OLED) is arranged, and an inorganic light-emitting display device (hereinafter referred to as "LED display device") in which an inorganic light-emitting diode (hereinafter referred to as "LED") is arranged.

[0004] The electroluminescent display device displays images using self-luminous elements and therefore does not require a separate light source, such as a backlight, and can be made in thin and various shapes.

[0005] Since an oxidation phenomenon may occur between an organic light-emitting layer and an electrode in the organic light-emitting display device due to the penetration of moisture and oxygen, a design to prevent the penetration of oxygen and moisture is required.

[0006] As an example of an inorganic light-emitting display device, a microLED display device, in which microLEDs are arranged in pixels, has recently attracted attention as a next-generation display device. The microLED can be an inorganic LED with a size of 100 µm or less. MicroLEDs are fabricated in a separate semiconductor process and transferred to pixel positions on a display panel substrate of the display device, and can be arranged in subpixels for each color. SUMMARY OF REVELATION

[0007] Since an insulating layer and an optical layer are made of organic materials, it may be difficult to prevent foreign substances such as moisture, hydrogen, and the like existing outside a display panel from entering the display panel, which may lead to driving defects in a pixel drive circuit, a metal line, and the like. Furthermore, when the insulating layer or the optical layer is disposed on the display panel, a defect may occur in which the insulating layer and the optical layer, which are disposed in a non-display area, flow out of the display panel.

[0008] According to aspects of the present disclosure, since a first protective structure, a second protective structure, a first inorganic film, and a second inorganic film are arranged to prevent or delay the invasion of foreign substances such as moisture, hydrogen, and the like from the outside, a defect such as corrosion or damage to a metal line and the like in the display panel can be prevented. Furthermore, since an outer optical layer and an outer dam structure are arranged, thicknesses of a second optical layer and the second inorganic film arranged in the non-display region can have the same or similar values as a thickness of those in the display region, and a defect in which organic layers such as the second optical layer and the like flow out from the non-display region of the display panel due to process problems can be prevented.

[0009] The technical problems to be solved by the present disclosure are not limited to the above-mentioned technical problems, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

[0010] According to one aspect of the present disclosure, a display device according to claim 1 is provided. Further embodiments are described in the dependent claims. A display device according to some aspects of the present disclosure may include a substrate having a display region, a non-display region, and a bending region, an adhesive layer disposed on the substrate, a pixel driver circuit disposed on the adhesive layer in the display region, a buffer layer disposed on the adhesive layer and configured to cover the pixel driver circuit, a buffer layer disposed on the adhesive layer in the display region and configured to cover the pixel driver circuit, a second protective structure disposed in the non-display region to surround the display region, a first inorganic film disposed on the pixel driver circuit, and a second inorganic film.which is arranged on the second protective structure in the display area and the non-display area, wherein the first inorganic film and the second inorganic film overlap in a region overlapping the second protective structure., BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other objects, features and advantages of the present invention will become more apparent to those skilled in the art by describing in detail exemplary embodiments thereof with reference to the accompanying drawings, in which: Fig. 1 is a view showing a display device according to one or more embodiments of the present disclosure; Fig. 2 is an enlarged view of area A in Fig. 1; Fig. 3 is a view showing a partial area of a pixel; Fig. 4 is a cross-sectional view taken along line II' in Fig. 3; Fig. 5 is a cross-sectional view along the line II-II' in Fig. 3; Fig. 6 is a cross-sectional view taken along the line III-III' in Fig. 3; Fig. 7 is a cross-sectional view showing an example in which a main light-emitting element and a sub-light-emitting element are electrically connected to a pixel driving circuit; Fig. 8 is a view showing a display device according to another embodiment of the present disclosure; Fig. 9 is a cross-sectional view along the line IV-IV' in Fig. 8; Fig. 10A is a view showing a display device according to another embodiment of the present disclosure; Fig. 10B is an enlarged view of area B in Fig. 10A; Fig. 11A is a cross-sectional view taken along the line YY' in Fig. 10B; Fig. 11B is a cross-sectional view taken along line YY' of the display device according to another embodiment of the present disclosure in Fig. 10B; Fig. 11C is a cross-sectional view taken along line YY' of a display device according to yet another embodiment of the present disclosure in Fig. 10B; Fig. 12A is a cross-sectional view taken along line ZZ' in Fig. 10A; Fig. 12B is a cross-sectional view taken along line ZZ' of the display device according to another embodiment of the present disclosure in Fig. 10A; and Fig. 12C is a cross-sectional view taken along line ZZ' of the display device according to yet another embodiment of the present disclosure in Fig. 10A. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0012] Advantages and features of the present disclosure, as well as methods for implementing them, will become apparent from the following embodiments, which are described in detail in conjunction with the accompanying drawings. The present disclosure is not limited to the embodiments to be described below and may be embodied in various different forms. The embodiments are provided only to fully disclose the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art, and the present disclosure is defined only by the scope of the claims.

[0013] Since the shapes, sizes, proportions, angles, numbers, and the like shown in the drawings for describing embodiments of the present disclosure are only examples, the present disclosure is not limited to the subject matter shown in the drawings. Throughout the disclosure, the same reference numerals refer to substantially the same components. When describing the present disclosure, it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present disclosure, the detailed description will be omitted.

[0014] When the terms "providing," "including," "with," "consisting of," and the like are used in this disclosure, other parts may be added unless "only" is used. A component expressed in the singular may also be interpreted in the plural unless expressly stated otherwise.

[0015] When interpreting the components, it should be noted that an error area is included even if it is not explicitly described.

[0016] When a positional relationship and a connecting relationship between two components is described as "on", "at an upper part", "at a lower part", "next to", "connecting or coupling", "crossing or intersecting" or the like, one or more other components may be inserted between the components unless there is an indication such as "immediate" or "direct".

[0017] When a temporal relationship is described with "after", "following", "and then", "before" or similar, it is possible that the temporal relationship is not continuous on a timeline unless "immediately" or "directly" is used.

[0018] "First," "second," and the like may be used before component names to distinguish components, but functions or structures are not limited by these ordinal numbers or component names. For ease of description, the ordinal numbers before the names of the same components may be different in different embodiments.

[0019] The following embodiments may be partially or completely combined with one another, and various types of connections and controls are technically possible. The embodiments may be implemented independently of one another or in conjunction with one another. Furthermore, the term "may" encompasses all meanings and scopes of the term "may."

[0020] Below, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. All components of each display device / appliance according to all embodiments of the present disclosure are operatively coupled and configured.

[0021] A display device according to one or more embodiments of the present disclosure includes a display region in which an image is displayed, or a display panel on which a screen is arranged, and a pixel driving circuit that drives pixels of the display panel. The display region includes a pixel region in which the pixels are arranged. The pixel region includes a plurality of light-emitting regions. A light-emitting element is arranged in each of the light-emitting regions. The pixel driving circuit may be incorporated into the display panel.

[0022] Fig. 1 is a view showing a display device according to one or more embodiments of the present disclosure. Fig. 2 is an enlarged view showing area A in Fig. 1 shows. Fig. 3 is a view showing a partial area of a pixel.

[0023] With reference to the Fig. 1 and Fig. 2, a display device 100 according to an embodiment of the present disclosure includes a display panel on which an input image is visually displayed. The display panel may include a display area AA (or active region) in which an image is displayed, and a non-display area NA (or non-active region) in which the image is not displayed. Various wiring and drive circuits may be mounted in the non-display area NA, and a pad portion PAD to which an integrated circuit, a printed circuit board, and the like are connected may be disposed. Here, the display panel may be a panel with a rectangular structure having a width in an X-axis direction, a length in a Y-axis direction, and a thickness in a Z-axis direction. In this case, the width and length of the display panel may be set to different values depending on the application range of the display device.The X-axis direction may mean a width direction, row direction, or lateral direction; the Y-axis direction may mean a length direction, column direction, or longitudinal direction; and the Z-axis direction may mean a vertical direction or thickness direction. Furthermore, the X-axis direction, the Y-axis direction, and the Z-axis direction may be perpendicular to each other, but may also mean other, non-perpendicular directions. Accordingly, each of the X-axis direction, the Y-axis direction, and the Z-axis direction may be described as one of a first direction, a second direction, and a third direction. Furthermore, a surface extending in the X-axis direction and the Y-axis direction may mean a horizontal plane.

[0024] A plurality of light-emitting elements 10 arranged in the display area AA and forming pixels PXL may be micro-sized inorganic light-emitting elements. The inorganic light-emitting elements may be grown on a silicon wafer and then applied to the display panel through a transfer process.

[0025] The transfer process of the light-emitting elements 10 can be carried out for each previously divided area. In Fig. 1 describes an example in which the display area AA is divided into twelve transfer areas ST, but the size or number of divided transfer areas is not limited thereto. The transfer process can be performed sequentially or simultaneously for a first transfer area ST to a twelfth transfer area ST. A blue light-emitting element 10, a green light-emitting element 10, and a red light-emitting element 10 can be transferred sequentially into each transfer area ST.

[0026] Data driver circuits or gate driver circuits may be arranged in the non-display area NA, and lines may be arranged that provide control signals for controlling these driver circuits. The control signals may include various timing signals, including clock signals, input data enable signals, and synchronization signals, and may be received via the pad section PAD.

[0027] The pixels PXL can be driven by the pixel drive circuit. The pixel drive circuit can receive a drive voltage, an image signal (digital signal), a synchronization signal synchronized with the image signal, and the like, and output an anode voltage and a cathode voltage of the light-emitting element 10 to drive a plurality of pixels. The drive voltage can be a high-potential voltage EVDD. The cathode voltage can be a low-potential voltage EVSS commonly applied to the pixels. The anode voltage can be a voltage corresponding to a pixel data value of the image signal. The pixel drive circuit can be arranged in the non-display area NA or below the display area AA.

[0028] Each pixel PXL may include a plurality of subpixels with different colors. For example, each of the plurality of pixels may include a red subpixel in which the light-emitting element 10 emitting light with a red wavelength is arranged, a green subpixel in which the light-emitting element 10 emitting light with a green wavelength is arranged, and a blue subpixel in which the light-emitting element 10 emitting light with a blue wavelength is arranged. The plurality of pixels may also include a white pixel.

[0029] With reference to Fig. 2 and Fig. 3, the plurality of pixels PXL may be continuously arranged in a first direction (an X-axis direction) and a second direction (a Y-axis direction). A plurality of subpixels of the same color may be arranged in the pixel of the display area AA.For example, each of the plurality of pixels may include a first red subpixel in which a 1-1 light-emitting element 11a emitting light with a red wavelength is arranged, a second red subpixel in which a 1-2 light-emitting element 11b emitting light with a red wavelength is arranged, a first green subpixel in which a 2-1 light-emitting element 12a emitting light with a green wavelength is arranged, a second green subpixel in which a 2-2 light-emitting element 12b emitting light with a green wavelength is arranged, a first blue subpixel in which a 3-1 light-emitting element 13a emitting light with a blue wavelength is arranged, and a second blue subpixel in which a 3-2 light-emitting element 13b emitting light with a blue wavelength is arranged.The 1-1 light-emitting element 11a, the 2-1 light-emitting element 12a, and the 3-1 light-emitting element 13a can be interpreted as main light-emitting elements. The 1-2 light-emitting element 11b, the 2-2 light-emitting element 12b, and the 3-2 light-emitting element 13b can be interpreted as sub-light-emitting elements.

[0030] A subpixel may include one or more light-emitting elements, and thus, if one light-emitting element becomes defective, the luminance of the subpixel can be adjusted by increasing the luminance of the other light-emitting elements. However, the present disclosure is not necessarily limited thereto, and a subpixel may also include only one light-emitting element.

[0031] A plurality of first electrodes 161 may be arranged in a dedicated manner among the light-emitting elements 10 and may be selectively connected to a plurality of signal lines TL1 to TL6 via a connecting portion 161a. A high-potential voltage may be applied to the pixel driver circuit via the signal lines TL1 to TL6. The signal lines TL1 to TL6 and the first electrodes 161 may be formed as an integrated electrode structure during an electrode patterning process.

[0032] For example, a first signal line TL1 may be connected to an anode electrode of the first red subpixel, and a second signal line TL2 may be connected to an anode electrode of the second red subpixel. A third signal line TL3 may be connected to an anode electrode of the first green subpixel, and a fourth signal line TL4 may be connected to an anode electrode of the second green subpixel. A fifth signal line TL5 may be connected to an anode electrode of the first blue subpixel, and a sixth signal line TL6 may be connected to an anode electrode of the second blue subpixel. If a subpixel includes only one light-emitting element, the number of signal lines TL may be reduced by half.

[0033] A second electrode 170 may be a cathode electrode arranged in each row and applying a cathode voltage to the light-emitting elements 10 arranged continuously in the first direction (the X-axis direction). A plurality of second electrodes 170 may be arranged to be spaced apart from each other in the second direction (the Y-axis direction). The plurality of second electrodes 170 may be connected to the cathode voltage via a contact electrode 163. Each of the plurality of second electrodes 170 may be electrically connected to the contact electrode 163. However, the present disclosure is not necessarily limited to this, and the second electrode 170 may not be divided into the plurality of second electrodes 170 and may be configured as one electrode layer and function as a common electrode.

[0034] Fig. 4 is a cross-sectional view taken along line II' in Fig. 3. Fig. 5 is a cross-sectional view along the line II-II' in Fig. 3. Fig. 6 is a cross-sectional view taken along the line III-III' in Fig. 3. Fig. 7 is a cross-sectional view showing an example in which two light-emitting elements are connected to the pixel driving circuit.

[0035] With reference to Fig. 3 to 5, the display device according to the embodiment includes the plurality of first electrodes 161 and the contact electrode 163 arranged on a substrate 110, the plurality of light-emitting elements 10 arranged on the plurality of first electrodes 161, a first optical layer 141 arranged between the plurality of light-emitting elements 10, and the second electrode 170 arranged on the plurality of light-emitting elements 10.

[0036] The substrate 110 may be made of flexible plastic. The substrate 110 may be made, for example, as a single- or multi-layer substrate from a material selected from, but not limited to, polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, polyarylate, polysulfone, and a cyclic olefin copolymer. The substrate 110 may be, for example, a ceramic or glass substrate.

[0037] A pixel driver circuit 20 may be disposed in the display area AA on the substrate 110. The pixel driver circuit 20 may include a plurality of thin-film transistors using an amorphous silicon semiconductor, a polycrystalline silicon semiconductor, or an oxide semiconductor.

[0038] The pixel driver circuit 20 may include at least one driving thin-film transistor, at least one switching thin-film transistor, and at least one storage capacitor. The pixel driver circuit 20 may be formed on the substrate 110 using a thin-film transistor (TFT) manufacturing method if it includes a plurality of thin-film transistors. In the embodiment, the pixel driver circuit 20 may be a concept that collectively refers to a plurality of thin-film transistors electrically connected to the light-emitting elements 10.

[0039] The pixel driver circuit 20 may be a drive driver fabricated on a single-crystal semiconductor substrate 110 using a metal-oxide-silicon field-effect transistor (MOSFET) manufacturing process. The drive driver may include a plurality of pixel driver circuits to drive a plurality of subpixels. When the pixel driver circuit 20 is implemented as a drive driver, after an adhesive layer is disposed on the substrate 110, the drive driver may be attached to the adhesive layer through a transfer process.

[0040] A buffer layer 121 may be disposed on the substrate 110, covering the pixel driver circuit 20. The buffer layer 121 may be made of an organic insulating material, such as, but not limited to, photosensitive photoacrylic or photosensitive polyimide.

[0041] The buffer layer 121 can be formed by multi-layering an inorganic insulating material, e.g., silicon nitride (SiN x ), silicon oxide (SiO x , e.g. SiO2) or similar, or by multi-layering an organic insulating material and an inorganic insulating material.

[0042] An insulating layer 122 may be disposed on the buffer layer 121. The insulating layer 122 may be made of an organic insulating material, such as, but not limited to, photosensitive photoacrylic or photosensitive polyimide. Interconnection lines may be disposed on the buffer layer 121. The interconnection lines may include a plurality of interconnection lines, such as a first interconnection line RT1, a second interconnection line RT2, and the like. The interconnection lines may be connected to the corresponding signal lines TL. The signal lines may include, but are not limited to, the first signal line TL1 through the sixth signal line TL6. The interconnection lines may include a plurality of line patterns disposed on different layers with one or more insulating layers therebetween.The conductive patterns arranged on different layers can be electrically connected by contact holes that run through the insulating layer.

[0043] A plurality of dam structures 130 may be disposed on the insulating layer 122. At least one light-emitting element 10 may be disposed on each dam structure 130. For example, a first light-emitting element 11 may be disposed on a first dam structure 130a, a second light-emitting element 12 may be disposed on a second dam structure 130b, and a third light-emitting element 13 may be disposed on a third dam structure 130c.

[0044] The dam structure 130 may be made of an organic insulating material, such as, but not limited to, photosensitive photoacrylic or photosensitive polyimide. The dam structure 130 may specify a position where the light-emitting elements 10 are attached during the transfer process of the light-emitting elements 10. The dam structure 130 may also be omitted.

[0045] A solder structure 162 may be disposed on the first electrode 161. The solder structure 162 may be made of, but is not limited to, indium (In), tin (Sn), or an alloy thereof.

[0046] Each of the plurality of light-emitting elements 10 may be mounted on the solder structure 162. A pixel may include light-emitting elements 10 in three colors. The first light-emitting element 11 may be a red light-emitting element, the second light-emitting element 12 may be a green light-emitting element, and the third light-emitting element 13 may be a blue light-emitting element. Two light-emitting elements may be mounted in each subpixel.

[0047] The first optical layer 141 may cover the plurality of light-emitting elements 10 and the dam structures 130. Accordingly, the first optical layer 141 may cover a space between the plurality of light-emitting elements 10 and a space between the plurality of dam structures 130. The first optical layers 141 may be arranged to extend in the first direction (X) and to be spaced apart in the second direction (Y) to separate pixels spaced apart in the second direction. Accordingly, the first optical layers 141 may be separated between pixel rows. Here, a row may mean the first direction. Further, a pixel row consisting of a plurality of pixels arranged in the first direction may be referred to as a pixel group. Accordingly, the display panel may include a plurality of pixel groups arranged to be spaced apart from each other in the second direction.For example, since the first optical layer 141 arranged in the first direction is arranged around the pixels, and the plurality of first optical layers 141 arranged corresponding to the plurality of pixel groups are arranged to be spaced from each other in the second direction, a first optical layer 141 arranged around the pixels constituting one row can be separated from another first optical layer 141 arranged around the pixels constituting another row.

[0048] The first optical layer 141 may contain an organic insulating material in which fine metal particles, such as titanium dioxide particles, are dispersed. The light emitted by the plurality of light-emitting elements 10 may be scattered by the fine metal particles dispersed in the first optical layer 141 and emitted to the outside.

[0049] The second electrode 170 may be disposed on the plurality of light-emitting elements 10. The second electrode 170 may be commonly connected to the plurality of pixels PXL. The second electrode 170 may be a thin electrode that transmits light. The second electrode 170 may be made of a transparent electrode material, such as, but not necessarily limited to, indium tin oxide (ITO).

[0050] The second electrode 170 may extend in the first direction (the X-axis direction) and be spatially separated in the second direction (the Y-axis direction). For example, one second electrode 170 may be configured to extend in the first direction, and a plurality of second electrodes 170 extending in the first direction may be spaced apart from each other in the second direction. In this case, the second electrodes 170 may be arranged corresponding to the pixels spaced apart from each other in the second direction.The second electrode 170 may include a first region 171 disposed on an upper surface of the light-emitting element 10 and an upper surface of the first optical layer 141, a second region 172 contacting and electrically connecting the contact electrode 163, and a third region 173 disposed on a side surface of the first optical layer 141 and connecting the first region 171 and the second region 172.

[0051] Each of the plurality of second electrodes 170 may overlap the first optical layer 141 in one plane, and the third region 173 may cover an outer plane of the first optical layer 141.

[0052] A second optical layer 142 may be an organic insulating material surrounding the first optical layer 141. The second optical layer 142 may be disposed on the insulating layer 142 together with the first optical layer 141. The first optical layer 141 and the second optical layer 142 may contain the same material (e.g., a siloxane). For example, the first optical layer 141 may be a siloxane containing titanium oxide (TiOx), and the second optical layer 142 may be a siloxane that does not contain titanium oxide (TiOx). However, the present disclosure is not necessarily limited thereto, and the first optical layer 141 and the second optical layer 142 may be formed from the same material or from different materials.

[0053] According to the embodiment, since the second region 172 of the second electrode 170 is connected to the contact electrode 163 in a generally flat state, excessive stress is not concentrated at a point connected to the contact electrode 163. Accordingly, the occurrence of cracks in the second electrode 170 can be effectively prevented.

[0054] The second optical layer 142 may cover the second region 172 and the third region 173 of the second electrode 170. An upper surface of the second optical layer 142 and an upper surface of the first region 171 of the second electrode 170 may form the same plane. For example, the first region 171 and the second optical layer 142 may function as a planarization layer. Accordingly, since there is no step on a surface on which a black matrix 190 is formed, a pattern of the black matrix 190 can be easily formed on the first optical layer 141 and the second optical layer 142. However, the present disclosure is not necessarily limited thereto, and the upper surfaces of the second optical layer 142 and the second electrode 170 may have different heights.

[0055] The black matrix 190 may be an organic insulating material to which a black pigment is added. The second electrode 170 may be in contact with the contact electrode 163 under the black matrix 190. Transmission holes 191 may be formed between the patterns of the black matrix 190, through which light emitted from the light-emitting elements 10 is emitted to the outside. The transmission holes 191 may overlap the light-emitting elements 10 in the Z-axis direction, and a part of the black matrix 190 may overlap the first optical layer 141 in the Z-axis direction. Here, the Z-axis direction may be referred to as the third direction. The black matrix 190 can improve the problem in which light from adjacent light-emitting elements 10 is mixed by the first optical layer 141 and then emitted.

[0056] A cover layer 180 may be an organic insulating material covering the black matrix 190 and the second electrode 170. In Fig. 2 and Fig. 3, the configurations of the black matrix 190 and the cover layer 180 are omitted.

[0057] The contact electrode 163 is electrically connected to the first connection line RT1 located at a lower portion, and the first connection line RT1 may be connected to the pixel drive circuit 20. Accordingly, the cathode voltage may be applied to the second electrode 170 via the contact electrode 163. The first electrode 161 may be electrically connected to the second connection line RT2. This will be described below.

[0058] As in Fig. 5, the contact electrode 163 and the signal lines TL1 to TL6 may be arranged on the same plane. The pixel driver circuit 20 may be arranged below the contact electrode 163 and the signal lines TL1 to TL6. If the pixel driver circuit 20 is a drive driver, a plurality of drive drivers may be arranged in the display panel.

[0059] A passivation layer 133 may expose the contact electrode 163 so that the contact electrode 163 and the second electrode 170 are electrically connected. Furthermore, the passivation layer 133 may insulate the signal lines TL2 to TL5 and the second electrode 170. The passivation layer 133 may be made of an inorganic material.

[0060] As in Fig. 6, the connecting portion 161a of the first electrode 161 may extend along a side surface 131 of the dam structure 130 and may be electrically connected to the second connecting line RT2 arranged on the insulating layer 122.

[0061] The first electrode 161, the connecting portion 161a, the signal lines TL and / or the connecting lines RT1 and RT2 may contain a single or multi-layer metal film selected from titanium (Ti), molybdenum (Mo) and aluminum (Al).

[0062] The first electrode 161 or the signal lines TL may be formed to have a metal stack structure in which a plurality of metal layers are formed using metal materials with different materials, thicknesses, and the like. In this case, the first electrode 161, the connecting portion 161a, and the signal lines TL may be formed simultaneously through the same manufacturing process. Here, the thickness may mean a width between one side and the other side of the metal layer arranged in the Z direction.

[0063] The first electrode 161 may include a first metal layer ML1 disposed under the solder pattern 162, a second metal layer ML2 disposed under the first metal layer ML1, a third metal layer ML3 disposed under the second metal layer ML2, and a fourth metal layer ML4 disposed under the third metal layer ML3. When the first electrode 161 is formed from the first metal layer ML1, the second metal layer ML2, the third metal layer ML3, and the fourth metal layer ML4, the first electrode 161 may be deposited in the order of fourth metal layer ML4 -> third metal layer ML3 -> second metal layer ML2 -> first metal layer ML1 and then patterned by performing a photolithography process and an etching process.

[0064] The first metal layer ML1 may be arranged in contact with a lower part of the solder structure 162 and electrically connected to the solder structure 162.

[0065] In addition, the first metal layer ML1 may contain a transparent conductive oxide layer such as indium tin oxide (ITO) or indium zinc oxide (IZO), which exhibits excellent adhesion and is corrosion and acid resistant. Here, the first metal layer ML1 may be referred to as an adhesion layer.

[0066] The second metal layer ML2 may be formed from a material having a different resistance value than the first metal layer ML1 and the third metal layer ML3. In this case, the second metal layer ML2 may be formed from a material having a lower light reflectivity but a higher resistance value than the third metal layer ML3. The second metal layer ML2 may contain, for example, titanium (Ti) or molybdenum (Mo).

[0067] The third metal layer ML3 may be formed from a material that has a higher light reflectivity than the first metal layer ML1. In this case, the third metal layer ML3 may be formed from a material that has a higher light reflectivity than the second metal layer ML2. The third metal layer ML3 may contain, for example, aluminum (Al) or silver (Ag).

[0068] The light reflectivity of the third metal layer ML3 may be higher than the light reflectivity of the first metal layer ML1 and the second metal layer ML2.

[0069] The fourth metal layer ML4 can be formed from the same material as the second metal layer ML2. For example, the fourth metal layer ML4 can contain titanium (Ti) or molybdenum (Mo).

[0070] After the formation of the first metal layer ML1, a reflective opening OP may be formed in the first electrode 161. The reflective opening OP may be an area where only a portion of the third metal layer ML3 is exposed by removing the first metal layer ML1 and the second metal layer ML2. The reflective opening OP may have a shape that surrounds the solder structure 162 in a plane, and may have a circular or quadrangular shape, but is not limited thereto.

[0071] The light emitted by the light-emitting element 10 is reflected by a surface of the third metal layer ML3 exposed through the reflective opening OP, which can result in an increase in the luminous efficiency of the display device.

[0072] The passivation layer 133 may be disposed on the first electrode 161 and the signal line TL and may include an opening hole 133a exposing the solder pattern 162. Here, the opening hole 133a exposing the solder pattern 162 may be referred to as a first opening hole. In this case, the reflective opening OP may be formed in a shape surrounding the first opening hole.

[0073] The light-emitting element 10 may include a first conductivity type semiconductor layer 10-1, an active layer 10-2 disposed on the first conductivity type semiconductor layer 10-1, and a second conductivity type semiconductor layer 10-3 disposed on the active layer 10-2. A first drive electrode 15 may be disposed under the first conductivity type semiconductor layer 10-1, and a second drive electrode 14 may be disposed on the second conductivity type semiconductor layer 10-3.

[0074] The light-emitting element 10 can be formed on a silicon wafer by a method such as metal organic chemical vapor deposition (MOCVD), chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), molecular beam epitaxy (MBE), hydride vapor phase epitaxy (HVPE), sputtering or the like.

[0075] The first-conductivity-type semiconductor layer 10-1 may be realized with a group III-V, group II-VI, or the like compound semiconductor and may be doped with a first dopant. The first-conductivity-type semiconductor layer 10-1 may be made of any semiconductor material having a composition formula of Al x1 In y1 Ga (1-x1-y1)N (0<=x1<=1, 0<=y1<=1, and 0<=x1+y1<=1), InAlGaN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. When the first dopant is an n-type dopant such as Si, Ge, Sn, Se, Te, or the like, the first conductivity-type semiconductor layer 10-1 may be an n-type nitride semiconductor layer. However, when the first dopant is a p-type dopant, the first conductivity-type semiconductor layer 10-1 may be a p-type nitride semiconductor layer.

[0076] The active layer 10-2 is a layer where electrons (or holes) injected through the first-conductivity-type semiconductor layer 10-1 and holes (or electrons) injected through the second-conductivity-type semiconductor layer 10-3 meet. When the electrons and holes recombine, the active layer 10-2 transitions to a lower energy level and can generate light with a corresponding wavelength.

[0077] The active layer 10-2 can have a single-well structure, a multi-well structure, a single quantum well structure, a multi-quantum well (MQW) structure, a quantum dot structure, and a quantum line structure, but the structure of the active layer 10-2 is not limited to these. The active layer 10-2 can generate light in the visible light wavelength range. For example, the active layer 10-2 can generate light in any of the blue, green, and red wavelength ranges.

[0078] The second conductivity type semiconductor layer 10-3 may be disposed on the active layer 10-2. The second conductivity type semiconductor layer 10-3 may be realized with a group III-V, group II-VI, or the like compound semiconductor and may be doped with a second dopant. The second conductivity type semiconductor layer 10-3 may be made of any semiconductor material having a composition formula of In x2 Al y2 Ga 1-x2-y2N (0<=x2<=1, 0<=y2<=1, and 0<=x2+y2<=1), AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP, but not limited to these. When the second dopant is a p-type dopant such as Mg, Zn, Ca, Sr, Ba, or the like, the second conductivity-type semiconductor layer 10-3 doped with the second dopant may be a p-type semiconductor layer. However, when the second dopant is an n-type dopant, the second conductivity-type semiconductor layer 10-3 may be an n-type nitride semiconductor layer.

[0079] Although the embodiment describes a vertical structure in which the drive electrodes 14 and 15 are arranged on the top and bottom of a light-emitting structure, the light-emitting element may have a lateral structure or a flip-chip structure in addition to the vertical structure.

[0080] As in Fig. As shown in Figure 7, a main light-emitting element 12a and a sub-light-emitting element 12b may be arranged on the dam structure 130. The second light-emitting element 12 is described here as an example. A 1-1 electrode 161-1 connected to the main light-emitting element 12a may extend along one side surface of the dam structure 130 and may be electrically connected to a 2-1 connection line RT21 arranged at a lower portion. A 1-2 electrode 161-2 connected to the sub-light-emitting element 12b may extend along the other side surface of the dam structure 130 and may be electrically connected to a 2-2 connection line RT22 arranged at a lower portion.

[0081] The pixel driver circuit 20 can apply an anode voltage to the main light-emitting element 12a via the 2-1 connection line RT21 and an anode voltage to the sub-light-emitting element 12b via the 2-2 connection line RT22. The pixel driver circuit 20 can apply a cathode voltage to the main light-emitting element 12a and the sub-light-emitting element 12b via the first connection line RT1 and the second electrode 170.

[0082] The pixel driving circuit 20 can adjust the luminance by driving only the main light-emitting element 12a, and it can also adjust the luminance by driving the main light-emitting element 12a and the sub-light-emitting element 12b simultaneously. When the main light-emitting element 12a is dimmed, the luminance can be adjusted by driving only the sub-light-emitting element 12b.

[0083] Fig. 8 is a view showing a display device according to another embodiment of the present disclosure. Fig. 9 is a cross-sectional view along the line IV-IV' in Fig. 8.

[0084] As in Fig. 8 and Fig. As shown in Figure 9, a second electrode 170 may be electrically connected to a contact electrode 163 through a contact hole TH1 formed in a second optical layer 142. The second optical layer 142 may include the contact hole TH1 exposing the contact electrode 163. The second electrode 170, inserted into the contact hole TH1 of the second optical layer 142, may come into contact with an upper surface of the contact electrode 163. The contact hole TH1 may be formed in an outer region of a pixel.

[0085] Fig. 10A is a view showing a display device according to another embodiment of the present disclosure. Fig. 10B is an enlarged view of area B in Fig. 10A. Fig. 11A, Fig. 11B and Fig. 11C are cross-sectional views along the line YY' in Fig. 10B. Fig. 12A, Fig. 12B and Fig. 12C are cross-sectional views along the line ZZ' in Fig. 10A.

[0086] Since the content of configurations such as the configurations described in Fig. 1 to 9 described embodiment is redundant and omitted, the description focuses on other features.

[0087] With reference to Fig. 10A and Fig. 10B, a display panel may include a display area AA in which an image is displayed and a non-display area NA in which the image is not displayed. Various wiring and drive circuits may be mounted in the non-display area NA, and a pad portion PC to which an integrated circuit, a printed circuit board, and the like are connected may be disposed. A bending area BE may be disposed between the non-display area NA and the pad portion PC, and a connecting line area CL may be disposed between the bending area BE and the pad portion PC.

[0088] Data driver circuits or gate driver circuits may be arranged in the non-display area NA, and lines may be arranged that provide control signals for controlling these driver circuits. Here, the control signals may include various timing signals, including clock signals, input data enable signals, and synchronization signals, and may be received from the pad section PC via lines arranged in the interconnection line area CL.

[0089] A protective structure TRE2 may be formed in the non-display region NA to surround the display region AA. An outer dam structure 130a arranged to surround the protective structure TRE2 and an outer optical layer 143 arranged to cover the outer dam structure 130a may be arranged in the non-display region NA.

[0090] The pad portion PC may include a first region (film-on-panel, FP) to which a chip-on-film (COF) is attached. As described further below, a partial insulating layer may be removed in the first region FP.

[0091] Circuit components can be arranged directly on the pad section PC or attached to the pad section PC in the form of a chip-on-panel (COP) or COF.

[0092] The circuit components may include a printed circuit board (PCB). The chip-on-film (COF) may process various signals input from the printed circuit board (PCB) and output the signals to the display panel. For this purpose, one end of the chip-on-film (COF) may be attached to the display panel, and the other end opposite one end may be attached to the printed circuit board (PCB).

[0093] Various driver circuits, such as timing controllers and the like, can be mounted on the printed circuit board (PCB), and various signals generated by the driver circuits can be output to the chip-on-film (COF). The printed circuit board (PCB) can, for example, comprise a flexible printed circuit board (FPCB).

[0094] The display panel and the chip-on-film (COF) overlapping at least a portion of the display panel may be bonded together by an anisotropic conductive film (ACF) disposed therebetween.

[0095] With reference to another embodiment of the present disclosure, which is set forth in Fig. 11A and Fig. 12A, the display device according to another embodiment includes a plurality of first electrodes 161 and a contact electrode 163 arranged on a substrate 110, a plurality of light-emitting elements 10 arranged on the plurality of first electrodes 161, a first optical layer 141 arranged between the plurality of light-emitting elements 10, and a second electrode 170 arranged on the plurality of light-emitting elements 10.

[0096] An adhesive layer AD may be disposed on the substrate 110. An area where the adhesive layer AD is removed may be located in the non-display area NA or the bending area BE. This is because the more organic layers there are in the bending area BE, the higher the risk of an organic layer in the bending area BE being damaged or broken. The adhesive layer AD may be selected from, for example, any of an adhesive polymer, an epoxy resin, an ultraviolet (UV) resin, the polyimide series, the acrylate series, the urethane series, and a polydimethylsiloxane (PDMS), but is not limited to these.

[0097] A pixel driver circuit 20 in the form of a drive driver may be arranged on the adhesive layer AD in the display area AA.

[0098] A protective layer 120 may be formed on the adhesive layer AD to protect the pixel driving circuit 20. The protective layer 120 may cover at least part or all of the side surface of the pixel driving circuit 20 and cover a part of an upper surface of the pixel driving circuit 20. The protective layer 120 may cover the entire substrate 110 and cover part or all of the pad portion PC. The protective layer 120 may be made of an organic insulating material, such as, but not limited to, photosensitive photoacrylic or photosensitive polyimide.

[0099] A buffer layer 121 may be arranged on the protective layer 120, covering the pixel driver circuit 20.

[0100] A first inorganic film INO1 may be disposed on the protective layer 120. The first inorganic film INO1 may be formed as a single layer or as multiple layers of an inorganic material such as SiN xand / or SiO x If the protective layer 120 is made of an organic material, since the intrusion of moisture, hydrogen, or the like cannot be prevented, defects such as corrosion or the like may occur on metal lines, which may impair the normal operation of the pixel drive circuit 20. Since the first inorganic film INO1 is made of an inorganic material and is thus resistant to the intrusion of moisture from the outside, the occurrence of defects caused by moisture or the like can be prevented.

[0101] A third connecting line RT3 may be arranged on the protective layer 120.

[0102] An insulating layer 122 may be disposed on the buffer layer 121. An intermediate connection line RTN connected to a 1a connection line RT1a, a 2a connection line RT2a, and the third connection line RT3 may be disposed on the buffer layer 121.

[0103] A first insulating layer 122a may be disposed on the buffer layer 121, covering the 1a interconnection line RT1a, the 2a interconnection line RT2a, and the intermediate interconnection line RTN.

[0104] A 1b interconnection line RT1b and a 2b interconnection line RT2b may be arranged on the first insulating layer 122a.

[0105] A second insulating layer 122b may be disposed on the first insulating layer 122a, covering the 1b connecting line RT1b and the 2b connecting line RT2b.

[0106] A 1c interconnection line RT1c and a 2c interconnection line RT2c may be arranged on the second insulating layer 122b.

[0107] A third insulating layer 122c may be arranged on the second insulating layer 122b, covering the 1c connecting line RT1c and the 2c connecting line RT2c.

[0108] A 1d interconnection line RT1d and a 2d interconnection line RT2d may be arranged on the third insulating layer 122c.

[0109] A fourth insulating layer 122d, which covers the 1d connecting line RT1d and the 2d connecting line RT2d, may be arranged on the third insulating layer 122c. The more insulating layers there are in the bending region BE, the more likely the insulating layer is to be damaged during bending. The fourth insulating layer 122d may not be arranged in the bending region BE, in the non-display region NA adjacent to the bending region BE, and in the connecting line region CL. N insulating layers (0 <N<5 und N ist eine ganze Zahl) können in dem Biegebereich BE angeordnet sein.

[0110] A plurality of signal lines TL, a contact electrode, and a seventh signal line may be arranged on the fourth insulating layer 122d. For example, the plurality of signal lines TL, the contact electrode, and the seventh signal line may be arranged on the same layer. Being arranged on the same layer may mean that they are formed entirely on one layer and then separated from each other by a patterning process or the like. However, the present disclosure is not necessarily limited to this, and heights may be different, but when a plurality of lines or electrodes are formed on the same layer, the plurality of lines or electrodes may be defined as being arranged on the same layer.

[0111] The 1a interconnection line RT1a, the 1b interconnection line RT1b, the 1c interconnection line RT1c, the 1d interconnection line RT1d, and the plurality of signal lines TL may be electrically connected by contact holes penetrating through insulating layers and inorganic films where the 1a interconnection line RT1a, the 1b interconnection line RT1b, the 1c interconnection line RT1c, the 1d interconnection line RT1d, and the plurality of signal lines TL are arranged, respectively.

[0112] The 2a interconnection line RT2a, the 2b interconnection line RT2b, the 2c interconnection line RT2c, the 2d interconnection line RT2d, and the contact electrode 163 may be electrically connected by contact holes penetrating through insulating layers and inorganic films where the 2a interconnection line RT2a, the 2b interconnection line RT2b, the 2c interconnection line RT2c, the 2d interconnection line RT2d, and the contact electrode 163 are disposed, respectively.

[0113] An anode voltage supplied from the pixel driving circuit 20 can be supplied to the light-emitting element 10 via the 1a connection line RT1a, the 1b connection line RT1b, the 1c connection line RT1c, the 1d connection line RT1d, the plurality of signal lines TL and the first electrode 161.

[0114] A cathode voltage supplied from the pixel driving circuit 20 can be supplied to the light-emitting element 10 via the 2a connection line RT2a, the 2b connection line RT2b, the 2c connection line RT2c, the 2d connection line RT2d, the plurality of signal lines TL and the first electrode 161.

[0115] The interconnect lines listed above are examples, and each interconnect line may include a plurality of conductive patterns arranged on different layers with one or more insulating layers between them. The conductive patterns arranged on different layers may be electrically connected by vias extending through the insulating layers.

[0116] The third connecting line RT3 is arranged on the protection layer 120. The third connecting line RT3 may extend from the display area AA to the pad portion PC.

[0117] A fourth interconnection line may be arranged on the first insulating layer 122a and extend to the pad portion PC and the interconnection line region CL.

[0118] A fifth interconnection line may be arranged on the second insulating layer 122b and extend to the pad portion PC and the interconnection line region CL.

[0119] A sixth interconnection line may be arranged on the third insulating layer 122c and extend to the pad portion PC and the interconnection line region CL.

[0120] A seventh interconnection line may be arranged on the fourth insulating layer 122d and extend to the pad portion PC and the interconnection line region CL.

[0121] Signals output from a circuit component such as a printed circuit board (PCB) can be transmitted to the pixel driver circuit 20 arranged in the display area AA via the chip-on-film (COF), the seventh interconnection line, the sixth interconnection line, the fifth interconnection line, the fourth interconnection line, and the third interconnection line RT3.

[0122] A plurality of dam structures 130 may be arranged on the insulating layer 122. At least one light-emitting element 10 may be arranged on each dam structure 130. Referring to Fig. 3, Fig. 11A and Fig. 12A, for example, a first light-emitting element 11 may be arranged on a first dam structure 130a, a second light-emitting element 12 may be arranged on a second dam structure 130b, and a third light-emitting element 13 may be arranged on a third dam structure 130c.

[0123] The first electrode 161 may be disposed on the dam structure 130. In the embodiment, the first electrode 161 may include a plurality of metal layers ML2, ML3, and ML4 except for a first metal layer ML1 during a formation process, and in a separate process, the first metal layer ML1 may be disposed only in a region overlapping the first electrode 161 and the light-emitting element 10. An opening OP may be disposed in the first electrode 161. In the embodiment, the opening OP may be formed by removing the second metal layer ML2. The first metal layer ML1 may not be disposed on the pad portion PC. Furthermore, the first metal layer ML1 may not be disposed in regions other than the region overlapping the light-emitting element 10.

[0124] A solder structure 162 may be disposed on the first electrode 161. The solder structure 162 may be made of, but is not limited to, indium (In), tin (Sn), or an alloy thereof. The solder structure 162 may include a first portion 162a and a second portion 162b. The first portion 162a may contain indium (In), and the second portion 162b may contain gold (Au). When the light-emitting element 10 is transferred, the first portion 162a and the second portion 162b may be pressure-bonded and then eutectically bonded by applying heat. When pressure is applied to the second portion 162b, a portion of the second portion 162b may cover at least part or all of the side surface of the first portion 162a.In this case, since the contact area between the first portion 162a and the second portion 162b is increased, the adhesion can be increased and the electrical signal transmission can be improved.

[0125] The plurality of light-emitting elements 10 can each be mounted on the solder structure 162.

[0126] A 1-1 optical layer 141a may cover the plurality of light-emitting elements 10 and the dam structures 130. Accordingly, the 1-1 optical layer 141a may cover a space between the plurality of light-emitting elements 10 and a space between the plurality of dam structures 130. The on-plane arrangement of the 1-1 optical layer 141a is the same as the on-plane arrangement of the first optical layer 141.

[0127] The second electrode 170 may be arranged on the plurality of light-emitting elements 10. The second electrode 170 may be commonly connected to the plurality of pixels PXL.

[0128] A second protection structure TRE2 may be formed in the non-display region NA so as to surround the display region AA. The second protection structure TRE2 may be formed by disposing a 1-2 optical layer 141b and then removing the first to fourth insulating layers 122a, 122b, 122c, 122d and the second optical layer 142. An outer dam structure 130a disposed to surround the second protection structure TRE2 and an outer optical layer 143 disposed to cover the outer dam structure 130a may be disposed in the non-display region NA. The outer dam structure 130a and the outer optical layer 143 may be formed on three sides of the four sides surrounding the display panel, excluding the side adjacent to the bending region BE. The outer dam structure 130a may be formed from the same material in the same process as the dam structure 130.The outer optical layer 143 may be formed from the same material in the same process as the optical layer 141a.

[0129] After forming a first protective structure TRE1 and the second protective structure TRE2, a second inorganic film INO2 may be disposed to cover the display region AA and the non-display region NA. The second inorganic film INO2 may completely cover the inside of the first protective structure TRE1 and the second protective structure TRE2, and a part of the second inorganic film INO2 may be in contact with the first inorganic film INO1 in the second protective structure TRE2. Furthermore, the second protective structure TRE2 may be disposed between the second electrode 170 and the 1-2 optical layer 141b in a region adjacent to the light-emitting element 10 in the process sequence. The second protective structure TRE2 may completely cover the outer optical layer 143, but may also cover only a part of the outer optical layer 143 in the non-display region NA.The second inorganic layer INO2 can be formed from the same material as the first inorganic layer INO1, but is not limited to this.

[0130] As described above, when the first protective structure TRE1, the second protective structure TRE2, the first inorganic film INO1, and the second inorganic film INO2 are arranged, the intrusion of foreign substances such as moisture, hydrogen, and the like from the outside can be prevented or delayed, thereby preventing defects such as corrosion or damage to the metal line and the like in the display panel. Furthermore, since the outer optical layer 143 and the outer dam structure 130a are arranged, thicknesses of the second optical layer 142 and the second inorganic film INO2 arranged in the non-display region NA can have the same or similar values as the thickness of those in the display region AA, and a defect in which organic layers such as the second optical layer 142 and the like flow out from the non-display region NA of the display panel due to process problems can be prevented.

[0131] The 1-2 optical layer 141b may be arranged to overlap the 1-1 optical layer 141a on the second electrode 170. The 1-2 optical layer 141b may be arranged on the second electrode 170 to increase the amount of forward-emitted light.

[0132] After forming the 1-1 optical layer 141a, the 1-1 optical layer 141a located in a region adjacent to the upper surface of the light-emitting element 10 is removed to bring the second electrode 170 and the light-emitting element 10 into contact with each other. Thereafter, the second electrode 170 is disposed on the 1-1 optical layer 141a. Further, the 1-1 optical layer 141a or the 1-2 optical layer 141b is removed, and the first protection pattern TRE1 is formed to apply a cathode voltage to the second electrode 170. The second electrode 170 may be electrically connected to the signal line TL formed on the fourth insulating layer 122d via the first protection pattern TRE1 and receive the cathode voltage.

[0133] The second optical layer 142 may be an organic insulating material surrounding the first optical layer 141. The second optical layer 142 may be disposed on the insulating layer 142 together with the first optical layer 141. The 1-1 optical layer 141a and the 1-2 optical layer 141b may be disposed in the display area AA, but the second optical layer 142 may be disposed in the display area AA and the non-display area NA. A black matrix 190 may be disposed on the 1-2 optical layer 141b. The black matrix 190 may be disposed on the 1-2 optical layer 141b, the second inorganic film INO2, and the second optical layer 142. Transmission holes 191 may be formed between the patterns of the black matrix 190, through which light emitted from the light-emitting elements 10 is emitted to the outside.

[0134] A cover layer 180 may be an organic insulating material covering the black matrix 190 and the second inorganic layer 141b.

[0135] To protect the plurality of interconnection lines RT1a, RT1b, RT1c, RT1d, RT2a, RT2b, RT2c, and RT2d arranged in the display area AA from foreign substances such as moisture and the like, an inorganic film may be further disposed to cover each of the interconnection lines after the formation of the interconnection lines. For example, after forming the 1a interconnection line RT1a and the 2a interconnection line RT2a, an inorganic film may be further disposed to cover the 1a interconnection line RT1a, the 2a interconnection line RT2a, and the buffer layer 121.

[0136] According to one embodiment of the present disclosure Fig. 11A, the third connection line RT3 can transmit electrical signals received from the pad portion to the pixel driver circuit 20 via the intermediate connection line RTN, the 1a connection line RT1a, and the 2a connection line RT2a.

[0137] The intermediate interconnection line RTN can be manufactured from the same material in the same process as the 1a interconnection line RT1a and the 2a interconnection line RT2a.

[0138] The second protective structure TRE2 is formed such that an upper part of the third interconnection line RT3 is exposed and can then be covered by the second inorganic film INO2.

[0139] The third connecting line RT3 may be in direct contact with a part of the first inorganic film INO1 and at least a part of the second inorganic film INO2.

[0140] According to one embodiment of the present disclosure Fig. 11A and Fig. 12A, the second protection structure TRE2 may be formed to have the same taper without flat portions at boundaries between the buffer layer 121, the plurality of insulating layers 122a, 122b, 122c, and 122d, and the second optical layer 142.

[0141] According to a further embodiment of the present disclosure according to Fig. 11B and Fig. 12B, when forming the second protective structure TRE2, the plurality of insulating layers 122a, 122b, 122c, and 122d and the second optical layer 142 may be removed in separate processes according to the process environment and equipment. For example, the second protective structure TRE2 may be formed by first removing the plurality of insulating layers 122a, 122b, 122c, and 122d in a region where the second protective structure TRE2 is formed after the fourth insulating layer 122d is disposed, and then disposing and removing the second optical layer 142.Accordingly, a region having a flat surface may be formed at the boundary between the uppermost surface of the plurality of insulating layers 122a, 122b, 122c, and 122d and the second optical layer 142, and an inclination angle (bevel) of the second inorganic film INO2 disposed on inclined surfaces of the plurality of insulating layers 122a, 122b, 122c, and 122d and an inclination angle of the second inorganic film INO2 disposed on an inclined surface of the second optical layer 142 may be different.

[0142] According to yet another embodiment of the present disclosure, Fig. 11C and Fig.12C, when forming the second protective structure TRE2, each insulating layer included in the plurality of insulating layers 122a, 122b, 122c, and 122d and the second optical layer 142 may be removed in a separate process for each layer according to the process environment and equipment. Accordingly, a region having a flat surface may be formed at boundaries between the plurality of insulating layers 122a, 122b, 122c, and 122d and a boundary between the fourth insulating layer 122d and the second optical layer 142, and inclination angles (bevels) of the second inorganic film INO2 disposed on inclined surfaces of the plurality of insulating layers 122a, 122b, 122c, and 122d and an inclined surface of the second optical layer 142 may be different from each other.

[0143] Although a vertical structure in which the drive electrodes 14 and 15 are arranged at the top and bottom of the light-emitting structure is described in the embodiment, the light-emitting element may also have a lateral structure or a flip-chip structure in addition to the vertical structure.

[0144] The display device according to the embodiments of the present disclosure can be used for a mobile device, a video phone, a smart watch, a watch phone, a wearable device, a foldable device, a rollable device, a bendable device, a flexible device, a curved device, a sliding device, a variable device, an electronic notebook, an electronic book, a portable multimedia player (PMP), a personal digital assistant (PDA), an MP3 player, a mobile medical device, a desktop personal computer (PC), a laptop PC, a netbook computer, a workstation, a navigation device, a display device for vehicles, a display device for theaters, a television, a wallpaper device, a signage device, a game device, a notebook, a monitor, a camera, a camcorder, a household appliance, and the like.Furthermore, the display device according to one or more embodiments of the present disclosure may be applied to an inorganic light-emitting lighting device.

[0145] The display device according to one or more embodiments of the present disclosure may be described as follows.

[0146] A display device according to one or more embodiments of the present disclosure includes: a substrate having a display region, a non-display region, and a bending region; an adhesive layer disposed on the substrate; a pixel driving circuit disposed on the adhesive layer in the display region; a buffer layer disposed on the adhesive layer and configured to cover the pixel driving circuit; a second protective structure disposed in the non-display region so as to surround the display region; a first inorganic film disposed on the pixel driving circuit; and a second inorganic film disposed on the second protective structure in the display region and the non-display region, wherein the first inorganic film and the second inorganic film overlap in a region overlapping the second protective structure.

[0147] The first inorganic film can only extend to an area that overlaps the second protective structure.

[0148] Furthermore, the display device according to one or more embodiments of the present disclosure may further include a protective layer disposed on the adhesive layer and under the first inorganic film and covering at least part or all of a side surface of the pixel driving circuit; a plurality of insulating layers disposed on the buffer layer; a dam structure disposed on the plurality of insulating layers; a plurality of light-emitting elements disposed on the dam structure; a 1-1 optical layer disposed on the insulating layer and configured to cover the plurality of light-emitting elements and the dam structure; and a second optical layer disposed on the same layer as the 1-1 optical layer so as to surround a side surface of the 1-1 optical layer.

[0149] Furthermore, the display device according to one or more embodiments of the present disclosure may further include: an outer dam structure formed on the same layer as the dam structure and arranged to surround the protective structure; and an outer third optical layer arranged to cover the outer dam structure, and the second inorganic film may be arranged on the outer optical layer, and the outer dam structure may be arranged farther from the display area than the second protective structure.

[0150] Moreover, the display device according to one or more embodiments of the present disclosure may further include: a plurality of wirings arranged in a corresponding manner on the plurality of insulating layers; and a third connecting wire arranged on the protective layer so as to extend from the bending region to the display region, and a surface of the third wire may overlap the first inorganic film and the second inorganic film in a region overlapping the second protective pattern.

[0151] The second protective structure may be formed by removing the plurality of insulating layers and the second optical layer.

[0152] The second inorganic film disposed on an inclined surface of the second protective structure may have a constant inclination angle.

[0153] The second inorganic film disposed on an inclined surface of the second protective structure may have a flat surface on the uppermost surface of the plurality of insulating layers.

[0154] The second inorganic film disposed on an inclined surface of the second protective structure may have a flat surface on an upper surface of each of the plurality of insulating layers.

[0155] Furthermore, the display device according to one or more embodiments of the present disclosure may further include: a first electrode disposed on the dam structure; a first metal layer disposed on the first electrode; a soldering structure disposed on the first metal layer; and a second electrode disposed on the light-emitting element, and the light-emitting element may be disposed on the soldering structure.

[0156] Furthermore, the display device according to one or more embodiments of the present disclosure may further include: a 1-2 optical layer disposed on the second electrode and overlapping with the 1-1 optical layer; and a first protective layer on the plurality of insulating layers formed by removing at least one of the 1-1 optical layer 1-1 and the 1-2 optical layer.

[0157] A region in which the adhesive layer is removed may be located in at least one of the non-display region and the bending region.

[0158] The outer dam structure may be made of the same material as the dam structure, and the outer optical layer may be made of the same material as the 1-1 optical layer.

[0159] According to aspects of the present disclosure, by disposing a first protective structure, a second protective structure, a first inorganic film, and a second inorganic film for preventing or delaying the intrusion of foreign substances such as moisture, hydrogen, and the like from entering from the outside, defects such as corrosion or damage to a metal line and the like in a display panel can be prevented. Furthermore, since an outer optical layer and an outer dam structure are disposed, the thicknesses of a second optical layer and the second inorganic film disposed in a non-display region can have the same or similar values as a thickness of those in the display region, and a defect in which organic layers such as the second optical layer and the like flow out from the non-display region of the display panel due to process problems can be prevented. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] KR 10-2023-0192374

[0001]

Claims

[1] Display device (100), comprising: a substrate (110) having a display area (AA), a non-display area (NA) and a bending area (BE); an adhesive layer (AD) disposed on the substrate (110); a pixel driver circuit (20) arranged on the adhesive layer (AD) in the display area (AA); a buffer layer (121) disposed on the adhesive layer (AD) and configured to cover the pixel driver circuit (20); a second protective structure (TRE2) arranged in the non-display area (NA) so as to surround the display area (AA); a first inorganic film (INO1) disposed on the pixel driver circuit (20); and a second inorganic film (INO2) disposed on the second protective structure (TRE2) in the display area (AA) and the non-display area (NA), wherein the first inorganic film (INO1) and the second inorganic film (INO2) overlap in a region that overlaps the second protective structure (TRE2). [2] The display device (100) according to claim 1, wherein the first inorganic film (INO1) extends only to the area overlapping the second protective structure (TRE2). [3] Display device (100) according to claim 1 or 2, further comprising: a protective layer (120) disposed on the adhesive layer (AD) and under the first inorganic film (INO1) and covering at least part or all of a side surface of the pixel driver circuit (20); a plurality of insulating layers (122a, ..., 122d) arranged on the buffer layer (121); a dam structure (130) disposed on the plurality of insulating layers (122a, ..., 122d); a plurality of light-emitting elements (10) arranged on the dam structure (130); a 1-1 optical layer (141a) disposed on at least one of the plurality of insulating layers (122a, ..., 122d) and configured to cover the plurality of light-emitting elements (10) and the dam structure (130); and a second optical layer (142) disposed on the same layer as the 1-1 optical layer (141a) so as to surround a side surface of the 1-1 optical layer (141a). [4] Display device (100) according to claim 3, further comprising: an outer dam structure (130a) arranged on the same layer as the dam structure (130) and arranged to surround the second protective structure (TRE2); and an outer optical layer (143) arranged to cover the outer dam structure (130a), wherein the second inorganic film (INO2) is arranged on the outer optical layer (143), and wherein the outer dam structure (130a) is arranged further away from the display area (AA) than the second protective structure (TRE2). [5] Display device (100) according to claim 4, further comprising: a plurality of connecting lines (RT1b, RT2b, RT1c, RT2c, RT1d, RT2d) arranged in an associated manner on the plurality of insulating layers (122a, ..., 122d); and a third connecting line (RT3) arranged on the protective layer (120) so as to extend from the bending region (BE) to the display region (AA), wherein a surface of the third connecting line (RT3) overlaps the first inorganic film (INO1) and the second inorganic film (INO2) in the region overlapping the second protective structure (TRE2). [6] The display device (100) according to claim 5, wherein the second protective structure (TRE2) is formed by removing the plurality of insulating layers (122a, ..., 122d) and the second optical layer (142). [7] The display device (100) according to claim 6, wherein the second inorganic film (INO2) disposed on an inclined surface of the second protective structure (TRE2) has a constant inclination angle. [8] The display device (100) according to claim 6, wherein the second inorganic film (INO2) disposed on an inclined surface of the second protective structure (TRE2) has a flat surface on an uppermost surface of the plurality of insulating layers (122a, ..., 122d). [9] The display device (100) according to claim 6, wherein the second inorganic film (INO2) disposed on an inclined surface of the second protective structure (TRE2) has a flat surface on an upper surface of each of the plurality of insulating layers (122a, ..., 122d). [10] Display device (100) according to one of claims 6 to 9, further comprising: a first electrode (161) disposed on the dam structure (130); a first metal layer (ML1) disposed on the first electrode (161); a solder structure (162) arranged on the first metal layer (ML1); and a second electrode (170) arranged on one of the plurality of light-emitting elements (10), wherein one of the plurality of light-emitting elements (10) is arranged on the solder structure (162). [11] Display device (100) according to claim 10, further comprising: a 1-2 optical layer (141b) disposed on the second electrode (170) and overlapping with the 1-1 optical layer (141a); and a first protective layer on the plurality of insulating layers (122a, ..., 122d) formed by removing at least one of the 1-1 optical layer (141a) and the 1-2 optical layer (141b). [12] The display device (100) according to any one of claims 4 to 11, wherein the outer dam structure (130a) comprises the same material as the dam structure (130) and the outer optical layer (143) comprises the same material as the 1-1 optical layer (141a). [13] The display device (100) according to any one of claims 1 to 12, wherein a region in which the adhesive layer (AD) is removed is present in at least one of the non-display region (NA) and the bending region (BE).

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