Power module unit for an electronics unit

Abstract

The present invention relates to a power module unit (10) for an electronic unit, comprising an electrically conductive cladding (12) with at least one conductor element (14), wherein the conductor element (14) is at least partially surrounded by a potting material (16), wherein the conductor element (14) and the potting material (16) are designed to form a substantially fluid-tight surface (18), wherein the fluid-tight surface (18) is substantially free of an insulating layer.

Description

State of the art

[0001] The present invention relates to a power module unit for an electronic unit, a method for producing a power module unit and a vehicle.

[0002] There are currently a multitude of different solutions for developing power modules in the automotive sector. Due to increasing power density and stricter quality requirements, the demand for innovative and robust power module units is continuously growing.

[0003] The constant weight reduction in the vehicle sector to reduce fuel consumption as well as increasing competition are creating cost pressure, so that cheaper and more efficient components for vehicles are in greater demand. Disclosure of the invention

[0004] The power module according to the invention for an electronic unit with the features of claim 1 has the advantage over known ones that the power modules have a fluid-tight surface, thus eliminating the need for an insulating layer between a dielectric cooling medium and the power module unit. This allows for a reduction in the manufacturing costs of the power modules and also creates new cooling options.

[0005] This is achieved according to the invention in that the power module unit for an electronic unit has an electrically conductive cladding with at least one conductor element. The conductor element is at least partially surrounded by a potting material, wherein the conductor element and the potting material are configured to form a substantially fluid-tight surface, wherein the fluid-tight surface is substantially free of an insulating layer.

[0006] In other words, the conductor element can be overmolded using the potting material, so that a substantially fluid-tight surface can be created. In particular, a transition between the conductor element and the potting material can be crucial for forming a substantially fluid-tight surface. In this context, a substantially fluid-tight surface means that, in particular, a dielectric cooling medium cannot penetrate between the conductor element and the potting material, in particular due to manufacturing tolerances. Further preferably, no insulation layer or the like is arranged on the fluid-tight surface in order to provide insulation between the conductor element and the cooling medium, since the power module unit can be used in particular in combination with a dielectric cooling medium, such as oil.

[0007] The subclaims show preferred developments of the invention.

[0008] Further preferably, the power module unit has a functional element which is arranged on the at least one conductor element, wherein the power module unit is configured to dissipate heat generated at the functional element to a cooling medium on the fluid-tight surface.

[0009] An advantage of this embodiment is that the thermal conductivity of the power module unit can be improved, since the path traveled by the heat between the functional element and the cooling element can be reduced due to the elimination of the insulation layer. A functional element can, in particular, be any type of chip, holder, or similar.

[0010] A further aspect of the invention relates to a method for producing a power module unit as described above and below, comprising the steps: - Providing a punch grid, - Forming a power module unit from the lead frame using a potting material, - Forming an electrically conductive lamination with at least one conductor element in the power module unit, - wherein the potting material and the conductor element are configured to form a substantially fluid-tight surface.

[0011] An advantage of this embodiment is that the manufacturing costs of the power module unit can be significantly reduced, since the lead frame can be overmolded using a primary forming process in order to provide the base body for the power module unit. For example, a lead frame, in particular made of copper or similar, can be inserted into a primary forming tool. More preferably, the inserted lead frame can be overmolded in the primary forming tool using the potting material, such as a plastic, resin and / or similar, in order to thus form the power module unit. More preferably, at least one electrically conductive lamination is formed by separating the connections between the lead frame. In particular, the potting of the potting material can be carried out in such a way that the potting material rests or is pressed against the lead frame in such a way that a fluid-tight surface can be created.

[0012] More preferably, the method further comprises the step: - Arranging a functional element on a first side of the power module unit, which is arranged substantially facing away from the fluid-tight surface.

[0013] An advantage of this embodiment is that the power module unit can be flexibly equipped with components such as switches, chips, or similar. Furthermore, the fluid-tight surface allows the functional element to be separated or protected from a cooling medium, such as a dielectric cooling medium.

[0014] Further preferably, the functional element is an element selected from the group comprising at least: a circuit breaker unit, a clip element and / or a direct contacting element.

[0015] An advantage of this embodiment is that the corresponding functional elements can be applied to the power module unit for a particular application scenario.

[0016] Further preferably, the lead frame comprises a first structural element and a second structural element, which are connected by means of a web, further comprising the step: - Removing the web to form the first conductor element and a second conductor element in the power module unit.

[0017] An advantage of this embodiment is that the flexural rigidity of the lead frame can be used to correctly insert it into a primary forming tool. Furthermore, it is also preferable to eliminate the need to insert a plurality of conductor elements into the primary forming tool. Furthermore, the web between the first conductor element and the second conductor element can be removed.

[0018] More preferably, the method further comprises the step: - Filling a residual space with the casting material, whereby the residual space is created by removing the web.

[0019] An advantage of this design is that no air pockets or similar remain in the power module unit, thus reducing the likelihood of corrosion.

[0020] More preferably, the formation of the power module unit further comprises the steps: - Inserting the punched grid into a forming tool, - Filling the mold with the potting material to form the power module unit.

[0021] An advantage of this embodiment is that the manufacturing costs of the power module unit can be significantly reduced and the potting material can be easily adapted to a specific application scenario during the manufacturing process.

[0022] Further preferably, the functional element is arranged on the punched grid before the punched grid is inserted into the forming tool.

[0023] An advantage of this embodiment is that a lead frame with the functional element can be inserted into the primary forming tool or forming tool in order to further reduce the manufacturing costs.

[0024] More preferably, the method further comprises the step: - Providing a turbulator structure on the conductor element on the substantially fluid-tight surface.

[0025] An advantage of this embodiment is that the cooling performance of the power module unit can be significantly improved by means of the turbulator structure.

[0026] More preferably, the turbulator structure is provided by means of an additive manufacturing process.

[0027] An advantage of this embodiment is that, for example, a flow velocity around the turbulator structure can be taken into account by means of an additive manufacturing process in order to be able to adapt the turbulator structure individually.

[0028] More preferably, the turbulator structure is provided by means of a soldering process.

[0029] An advantage of this embodiment is that a plurality of turbulator structures can be arranged cost-effectively on the conductor element.

[0030] A further aspect of the invention relates to a vehicle which has a power module unit as described above and below and / or has a component which has been manufactured by means of the method as described above and below. Short description of the drawings

[0031] Embodiments of the invention are described in detail below with reference to the accompanying drawings. In the drawing: Fig. 1, 9, 11 to 14c and 20 to 24 a power module unit according to an embodiment, Fig. 2 to 8, 10, 15 to 19, 22 and 25 show a punched grid according to an embodiment, Fig. 26 and Fig. 27 is a flowchart illustrating steps of the method according to an embodiment, Fig. 28 a vehicle according to an embodiment. Embodiments of the invention

[0032] Preferably, all identical components, elements and / or units in all figures are provided with the same reference numerals.

[0033] Fig. 1 shows a power module unit 10 according to one embodiment. The power module unit 10 for an electronic unit has an electrically conductive cladding 12 with at least one conductor element 14. Further preferably, the conductor element is at least partially surrounded by a potting material 16. Preferably, the conductor element 14 and the potting material 16 are configured to form a substantially fluid-tight surface 18, wherein the fluid-tight surface 18 is substantially free of an insulating layer.

[0034] Fig. 2 shows a lead frame 102 according to one embodiment. Furthermore, the lead frame 102 preferably comprises a first structural element 104 and a second structural element 106. The first structural element 104 and the second structural element 106 can be connected by means of a web 108.

[0035] Fig. Figure 3 shows a lead frame 102 according to one embodiment. Lead frame 102 preferably has a functional element 20.

[0036] Fig. Figure 4 shows a lead frame 102 according to one embodiment. Lead frame 102 is preferably inserted into or surrounded by a molding tool 114. Molding tool 114 can be filled with a potting material 16 to form power module unit 10.

[0037] Fig. Figure 5 shows a lead frame 102 according to one embodiment. Lead frame 104 preferably includes a turbulator structure 116.

[0038] Fig. 6 shows a lead frame 102 according to one embodiment. Lead frame 102 preferably comprises a functional element 20 and a turbulator structure 116.

[0039] Fig. Figure 7 shows a lead frame 102 according to one embodiment. In particular, a turbulator structure 116 is arranged on the lead frame 102, which protrudes from the mold 114.

[0040] Fig. Figure 8 shows a lead frame 102 according to one embodiment. Lead frame 102 has already been overmolded with potting material 16, but a conductor element 14 and a second conductor element 110 have not yet been formed by separating web 108.

[0041] Fig. Figure 9 shows a power module unit 10 according to one embodiment. The power module unit 10 has a conductor element 14 and a second conductor element 110, on each of which a functional element 20 is arranged. In particular, a web 108 between the conductor element 14 and the further conductor element 110 may have been removed.

[0042] Fig. 10 shows a lead frame 102 according to one embodiment. The lead frame 102 with the encapsulating material 16 preferably has a substantially fluid-tight surface 18 that is free of an insulating layer. Further preferably, the substantially fluid-tight surface 18 has a turbulator structure 116.

[0043] Fig. Figure 11 shows a power module unit 10 according to one embodiment. The power module unit 10 can, in particular, be arranged in a molding tool 114 in order to be able to overmold the lead frame 102.

[0044] Fig. Figure 12 shows a power module unit 10 according to one embodiment. The power module unit 10 forms a substantially fluid-tight surface 18 on which a turbulator structure 116 is arranged.

[0045] Fig. 13 shows a power module unit 10 according to one embodiment. The power module unit 10 can be secured to a cooling structure 300 by means of a screw 302. This creates a space between the cooling structure 300 and the power module unit 10, into which the turbulator structure 116 extends and through which the dielectric cooling medium flows.

[0046] Fig. 14a shows a power module unit 10 according to one embodiment. The power module unit 10 can be arranged separately from the cooling structure 300.

[0047] Fig. 14b shows a power module unit 10 according to one embodiment. In particular, the cooling structure 300 can have a support surface or the like on which the power module unit 10 can be arranged.

[0048] Fig. 14c shows a power module unit 10 according to one embodiment. The power module unit 10 can be arranged on the cooling structure 300, in particular by means of laser welding or the like.

[0049] Fig. Figure 15 shows a lead frame 102 according to one embodiment. Lead frame 102 includes, in particular, a first structural element 104 and a second structural element 106, which are connected by a web 108.

[0050] Fig. 16 shows a lead frame 102 according to one embodiment. Lead frame 102 can, in particular, be inserted into a mold 114 to be overmolded with potting material 16.

[0051] Fig. Figure 17 shows a lead frame 102 according to one embodiment. Lead frame 102 has a turbulator structure 116, particularly on a first structural element 104 and a second structural element 106.

[0052] Fig. 18 shows a lead frame 102 according to one embodiment. Lead frame 102 can, in particular, be inserted into a molding tool 114 and overmolded with a potting material 16, while simultaneously turbulator structure 116 is arranged outside of molding tool 114.

[0053] Fig. Figure 19 shows a lead frame 102 according to one embodiment. The power module unit 10 has a conductor element 14, which is attached to another conductor element 110 by means of a web.

[0054] Fig. Figure 20 shows a power module unit 10 according to one embodiment. In particular, the power module unit 10 can be arranged in a molding tool, so that an electrically conductive lamination 12 is present on the conductor element 14. More preferably, the conductor element 14 can be surrounded by the encapsulating material 16.

[0055] Fig. Figure 21 shows a power module unit 10 according to one embodiment. In particular, the encapsulating material 16 may have been removed on both sides, resulting in substantially parallel surfaces on the power module unit 10.

[0056] Fig. Figure 22 shows a power module unit 10 according to one embodiment. The power module unit 10 has, in particular, a turbulator structure 116, which is at least partially surrounded by a potting material 16.

[0057] Fig. Figure 23 shows a power module unit 10 according to one embodiment. The power module unit 10 comprises, in particular, a conductor element 14, which is formed with encapsulating material 16 to thereby form a substantially fluid-tight surface 18. A turbulator structure 116 can, in particular, be arranged on the fluid-tight surface 18.

[0058] Fig. Figure 24 shows a power module unit 10 according to one embodiment. The power module unit 10 preferably comprises at least one turbulator structure 116, which is arranged on the conductor element 14.

[0059] Fig. Figure 25 shows a power module unit 10 according to one embodiment. The power module unit 10 comprises, in particular, a lead frame 102, on which at least one functional element 20 and a turbulator structure 116 are arranged.

[0060] Fig. Figure 26 shows a flowchart illustrating steps of the method 100 for manufacturing a power module unit 10 according to one embodiment. The method 100 comprises the steps: - Providing S1 a punched grid (102), - Forming S2 a power module unit 10 from the lead frame 102 by means of a potting material 16, - Forming S3 an electrically conductive lamination 12 with at least one conductor element 14 in the power module unit 10, - wherein the potting material 16 and the conductor element 14 are configured to form a substantially fluid-tight surface 18.

[0061] Fig. 27 shows a flowchart illustrating steps of the method 100 according to an embodiment. Preferably, the method 100 comprises the same steps S1 to S3 as already described with regard to the Fig. 27. Further preferably, the method 100 comprises the step S4 of arranging a functional element. Further preferably, the method further comprises the step S5 of removing the web 108. Preferably, the method further comprises the step S6 of filling a residual space 112. Further preferably, the method 100 comprises the steps S7 of inserting and S8 of filling. Preferably, the method 100 comprises the step S9 of providing.

[0062] Fig. Figure 28 shows a vehicle 200 according to one embodiment. The vehicle 200 preferably has a power module unit 10. More preferably, the vehicle 200 has at least one component 202 manufactured by the method 100, as described above and below.

Claims

[1] Power module unit (10) for an electronic unit, comprising: - an electrically conductive lamination (12) with at least one conductor element (14), - wherein the conductor element (14) is at least partially surrounded by a potting material (16), - wherein the conductor element (14) and the potting material (16) are designed to form a substantially fluid-tight surface (18), - wherein the fluid-tight surface (18) is substantially free of an insulating layer. [2] Power module unit (10) according to claim 1, wherein the power module unit (10) has a functional element (20) which is arranged on the at least one conductor element (14), wherein the power module unit (10) is configured to dissipate heat generated at the functional element (20) to a cooling medium on the fluid-tight surface (18). [3] Method (100) for producing a power module unit (10) according to one of the preceding claims, comprising the steps: - providing (S1) a punched grid (1, 102), - forming (S2) a power module unit (10) from the lead frame (102) by means of a potting material (16), - forming (S3) an electrically conductive lamination (12) with at least one conductor element (14) in the power module unit (10), - wherein the potting material (16) and the conductor element (14) are designed to form a substantially fluid-tight surface (18). [4] The method (100) of claim 3, further comprising the step: - Arranging (S4) a functional element (20) on a first side (22) of the power module unit (10), which is arranged substantially facing away from the fluid-tight surface (18). [5] Method (100) according to one of claims 3 to 4, wherein the functional element (20) is an element selected from the group at least comprising: a circuit breaker unit, a clip element and / or a direct contacting element. [6] Method (100) according to one of claims 3 to 5, wherein the lead frame (102) comprises a first structural element (104) and a second structural element (106) which are connected by means of a web (108), further comprising the step: - removing (S5) the web (108) to form the first conductor element (14) and a second conductor element (110) in the power module unit (10). [7] The method (100) of claim 6, further comprising the step: - filling (S6) a residual space (112) with the casting material (16), wherein the residual space (112) is created by removing the web (108). [8] Method (100) according to one of claims 3 to 7, wherein the forming (S2) of the power module unit (10) further comprises the steps of: - inserting (S7) the punched grid (102) into a forming tool (114), - filling (S8) the molding tool (114) with the potting material (16) to form the power module unit (10). [9] Method (100) according to claim 8 and 4 to 5, wherein the arrangement (S4) of the functional element (20) on the lead frame (102) takes place before the insertion (S7) of the lead frame (102) into the molding tool (114). [10] Method (100) according to one of claims 3 to 9, further comprising the step: - Providing (S9) a turbulator structure (116) on the conductor element (14) on the substantially fluid-tight surface (18). [11] Method (100) according to claim 10, wherein the provision (S9) of the turbulator structure (116) is carried out by means of an additive manufacturing process. [12] Method (100) according to claim 10, wherein the provision (S9) of the turbulator structure (116) is carried out by means of a soldering process. [13] Vehicle (200) comprising a power module unit (10) according to one of claims 1 to 2 and / or a component (202) which was manufactured by means of the method (100) according to one of claims 3 to 12.

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