Electronic circuit and method for producing an electronic circuit

Abstract

An electronic circuit (100) comprises a first printed circuit board (105), a second printed circuit board (110), and a connecting device (115). The first printed circuit board (105) has an outer side (118) and an inner side (120) opposite the outer side (118). The first printed circuit board (105) has at least one first conductor track (130) and / or at least one through-opening. The second printed circuit board (110) has an outer side (122) and an inner side (128) opposite the outer side (122). The second printed circuit board (110) has a second conductor track (135), wherein the inner side (128) of the second printed circuit board (110) faces the inner side (118) of the first printed circuit board (105). The connecting device (115) is arranged in a space (125) between the first printed circuit board (105) and the second printed circuit board (110).The connecting device (115) forms at least one connecting element with a base and a side wall adjacent to the base. A bottom side of the base is arranged on the inner side (128) of the second printed circuit board (110) of the electronic circuit (100). The side wall extends at least partially through the through-opening of the first printed circuit board (105) of the electronic circuit (100).

Description

[0001] The present invention relates to an electronic circuit and to a method for manufacturing an electronic circuit.

[0002] Parasitic stray inductances can occur in power electronics.

[0003] The document DE 10 2019 125 108 A1 discloses a power electronics arrangement comprising a printed circuit board and a power module, a method for producing a power electronics arrangement and a motor vehicle comprising a power electronics arrangement.

[0004] The document DE 10 2014 208 226 A1 discloses a contact element for electrical connection and a copper strip for producing a plurality of contact elements.

[0005] The document US 2008 / 0142571 A1 discloses an electronic device.

[0006] The document DE 691 16 711 T2 discloses a multi-pin electrical connector with connection pins.

[0007] The document DE 10 2004 041 173 A1 discloses a solder structure between a strip of a busbar and a printed substrate.

[0008] The document DE 44 22 787 A1 discloses pins that are attached to the surface of printed circuits.

[0009] The document US 5,931,705 A discloses a surface mount wire connector.

[0010] Against this background, the present invention provides an improved electronic circuit and an improved method for manufacturing an electronic circuit according to the main claims. Advantageous embodiments emerge from the subclaims and the following description.

[0011] The advantages achievable with the approach presented here are, in particular, that an electronic circuit is created that can reduce stray inductance, especially parasitic stray inductance.

[0012] An electronic circuit has a first circuit board, a second circuit board, and a connecting device. The first circuit board has an outer side and an inner side opposite the outer side. The first circuit board has a first conductor track and / or at least one through-opening configured as an elongated hole. The second circuit board has an outer side and an inner side opposite the outer side. The second circuit board has a second conductor track, wherein the inner side of the second circuit board faces the inner side of the first circuit board. The connecting device is arranged in a space between the first circuit board and the second circuit board. The connecting device forms at least one connecting element with a base and a side wall adjacent to the base. An underside of the base is arranged on the inner side of the second circuit board of the electronic circuit.The side wall is at least partially led through the through-opening of the first printed circuit board of the electronic circuit.

[0013] The circuit boards can be manufactured cost-effectively and in large quantities. The interconnect device can also be referred to as board-to-board and, due to its shape, reduces the height in the gap, thereby reducing stray inductance. The base can be soldered to the second circuit board, while the sidewall can be soldered to the first circuit board. The electronic circuit can enable a small overall size of the assembly through better space utilization.

[0014] The approach presented here can provide optimized, low-parasitic layouts using the interconnect device, which can also be referred to as a pitch-optimized signal board-to-board connector, and concepts for this interconnect device. The approach presented here can thus also be understood as optimized low-parasitic layouts using pitch-optimized signal board-to-board connectors and concepts for these signal board-to-board connectors.

[0015] The approach presented here can be used for other substrate combinations, such as DBC (direct bonded copper), a joining technique that enables a tight electrical / thermal connection via copper, and / or AMB (active metal brazed), a joining technique or a form of brazing in which metal and ceramic can be joined without metallization.

[0016] Furthermore, the individual soldering steps can be partially or fully combined. For example, all three soldering processes (IMS board, PCB board, and pitch-optimized signal board-to-board connector) can be performed simultaneously, for example, in a vapor-phase soldering process.

[0017] The connecting device may comprise a metallic material. The metallic material may, in particular, be formed as an electrically conductive sheet. The metallic material may, for example, be copper sheet with or without a coating.

[0018] The connecting element can be L-shaped or J-shaped. The connecting element can be easily bent into the desired shape and / or etched into the desired shape, for example.

[0019] The connecting element can be formed in one piece. In particular, a bending edge can be formed between the base and the side wall. The connecting element can, for example, be etched into the desired shape and provided with a bending edge etched on one side to reduce the bending radius and increase accuracy.

[0020] The base of the connecting element can be wider than the side wall of the connecting element. Alternatively, the side wall of the connecting element can be wider than the base of the connecting element. Alternatively, the base of the connecting element and the side wall of the connecting element can have an identical width. This can, for example, reliably reduce the height in the intermediate space and / or enable a low-parasitic layout of the electronic circuit.

[0021] The side wall of the connecting element can be pin-shaped. In particular, the pin-shaped side wall can be arranged centrally on the base. This allows for various designs of the first circuit board and / or the second circuit board.

[0022] The base of the connector can be triangularly shaped. This allows the required installation space and / or the height of the gap to be reduced to achieve a low-parasitic layout.

[0023] The connecting device can form a further connecting element with a further base and a further side wall adjacent to the further base. A further underside of the further base can be arranged on the inside of the second printed circuit board of the electronic circuit. The further side wall can extend at least partially out of the through-opening of the electronic circuit. The further connecting element and the connecting element can be shaped identically and / or can be manufactured cost-effectively in large quantities.

[0024] A rear side of the side wall and another rear side of the further side wall can be arranged or arranged adjacent to one another. Alternatively, the base and the further base can be arranged or arranged adjacent to one another.

[0025] The electronic circuit may include a connection unit that may be arranged between the rear side of the side wall and the further rear side of the further side wall. The connection unit may be arranged on the base and the further base to interconnect the connecting element and the further connecting element. This may enable a low-parasitic layout of the electronic circuit.

[0026] The connecting unit can be formed from an electrically insulating material. The electrically insulating material can be, for example, Kapton and / or an insulating plastic film, such as polypropylene or polycarbonate, or a similar electrically insulating material.

[0027] A method for producing an embodiment of an electronic circuit mentioned herein comprises a providing step and a arranging step. In the providing step, the first circuit board, the second circuit board, and the connecting device are provided. In the arranging step, the connecting device is arranged between the circuit boards. The base of the connecting element is arranged on the second circuit board, wherein the side wall of the connecting element is at least partially passed through a through-opening, designed as an elongated hole, in the first circuit board in order to produce the electronic circuit. In the arranging step, the base can be arranged on the second circuit board using a surface-mounted technology method.

[0028] The approach presented here further provides a device designed to perform, control, or implement the steps of a variant of a method presented here in corresponding devices. This embodiment of the invention in the form of a device also allows the problem underlying the invention to be solved quickly and efficiently.

[0029] A device can be an electrical device that processes electrical signals, for example, sensor signals, and outputs control signals depending on them. The device can have one or more suitable interfaces, which can be implemented in hardware and / or software. In a hardware implementation, the interfaces can, for example, be part of an integrated circuit in which functions of the device are implemented. The interfaces can also be separate integrated circuits or consist at least partially of discrete components. In a software implementation, the interfaces can be software modules that are present, for example, on a microcontroller alongside other software modules.

[0030] Also advantageous is a computer program product with program code that can be stored on a machine-readable medium such as a semiconductor memory, a hard disk memory or an optical memory and is used to carry out the method according to one of the embodiments described above when the program is executed on a computer or a device.

[0031] The invention is explained in more detail by way of example with reference to the accompanying drawings. They show: Fig. 1 shows an illustration of an embodiment of an electronic circuit; Fig. 2 shows a representation of a stray inductance to explain an embodiment of an electronic circuit; Fig. 3 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 4 shows a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 5 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 6 a representation of an electronic circuit; Fig. 7 shows an illustration of an embodiment of an electronic circuit; Fig. 8 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 9 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 10 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 11 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 12 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 13 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 14 is a representation of an embodiment of an electronic circuit; Fig. 15 is a representation of an embodiment of an electronic circuit; Fig. 16 is a diagram of a connecting device of an electronic circuit; Fig. 17 is a diagram of a connecting device of an electronic circuit; Fig. 18 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 19 a representation of an electronic circuit; Fig. 20 is a diagram of a connecting device of an electronic circuit; Fig. 21 is a flowchart of an embodiment of a method for manufacturing an electronic circuit; Fig. 22 is a block diagram of an embodiment of a control device for manufacturing an electronic circuit; Fig. 23 is a circuit diagram of an embodiment of an electronic circuit; Fig. 24 is a diagram of an embodiment of an electronic circuit; Fig. 25 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 26 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 27 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 28 is a diagram of an embodiment of an electronic circuit; and Fig. 29 a representation of an embodiment of an electronic circuit.

[0032] In the following description of preferred embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, whereby a repeated description of these elements is omitted.

[0033] Fig. 1 shows an illustration of an embodiment of an electronic circuit 100. More specifically, a longitudinal section through the electronic circuit 100 is shown.

[0034] The electronic circuit 100 comprises a first circuit board 105, a second circuit board 110 and a connecting device 115.

[0035] The first circuit board 105 has an outer side 118 and an inner side 120 opposite the outer side 118. The second circuit board 110 has an outer side 122 and an inner side 128 opposite the outer side 122. The inner side 128 of the second circuit board 110 faces the inner side 120 of the first circuit board 105, with a gap 125 formed between the first circuit board 105 and the second circuit board 110. The connecting device 115 is arranged in the gap 125 and has a small height h cc the electronic circuit 100.

[0036] The first circuit board 105, which may be referred to as a PCB, for example, has a first conductive trace 130, and the second circuit board 110, which may be referred to as an IMS, for example, has a second conductive trace 135. According to one embodiment, the second conductive trace 135 is arranged on the inner side 128 of the second circuit board 110, and the first conductive trace 130 is arranged on the inner side 120 of the first circuit board 105.

[0037] The first conductor track 130 runs, for example, continuously in the first printed circuit board 105. The second conductor track 135 has, for example, a plurality of through-openings in order to enable, for example, reliable operation and / or contacting of components 138, 140, 150.

[0038] For example, a component 138 is arranged in the gap 125 between the circuit boards 105, 110. This component is designed, for example, as a snubber, which can also be referred to as a Csnubb. The component 138 is electrically contacted to the second conductor track 135.

[0039] According to a further exemplary embodiment, a further component 140 is arranged in the intermediate space 125. The further component 140 has, for example, a greater height than the component 138. The further component 140 is designed, for example, as a transistor, more precisely as a semiconductor transistor and / or a high-side transistor, which can also be referred to as an HS transistor, wherein the further component 140 is electrically contacted with the second conductor track 135. A thermally conductive material 155, for example, is arranged between the further component 140 and the second conductor track 135. According to a further exemplary embodiment, a third component 150 is arranged in the intermediate space 125 between the first circuit board 105 and the second circuit board 110. The third component 150 is designed, for example, as a transistor and has an identical height to the further component 140.The third component 150 is arranged adjacent to the further component 140, wherein the further component 140 is arranged merely by way of example between the component 138 and the third component 150.

[0040] The third component 150 is embodied, for example, as a low-side transistor and can be referred to, for example, as an LS transistor. A further thermally conductive material 160 is arranged, for example, between the third component 150 and the second conductor track 135.

[0041] According to one embodiment, the connecting device 115 forms a plurality of connecting elements 180, 182, 184, 186, 188, 190 with bases 165, 166 and side walls 170, 172, 173, 174, 175, 176, here only as an example six connecting elements 180, 182, 184, 186, 188, 190. For example, a support element 181, 183, 185, 187 is arranged on each connecting element 180, 182, 184, 186, 188, 190.

[0042] The connecting element 180 is arranged, for example, adjacent to the component 138 in the intermediate space 125, with the side wall 170 extending at least partially out of the through-opening 171. The support element 181 is received, for example, by the side wall 170 and rests against the base 165 of the connecting element 180. An underside of the base 165 is arranged on the inner side 128 of the second printed circuit board 110 of the electronic circuit 100, merely by way of example on the second conductor track 135. For example, the base 165 is soldered to the second printed circuit board 110. The side wall 170 is, for example, soldered from above and / or is or can be electrically contacted to the first printed circuit board 105.

[0043] The further connecting element 182 and the third connecting element 184 are arranged adjacent to one another, wherein the connecting elements 182, 184 are arranged merely by way of example on or in the further component 140, so that the bottoms of the connecting elements 182, 184 are not visible. The further side wall 172 of the further connecting element 182 extends at least partially through a further through-opening 192 in the first printed circuit board 105. The third side wall 173 of the third connecting element 184 extends at least partially through a third through-opening 193 in the first printed circuit board 105. The further support element 183 is received, for example, by the side walls 172, 173.

[0044] The fourth connecting element 186 and the fifth connecting element 188 are, for example, identical to the connecting elements 182, 184 and are arranged on or in the third component 150, so that the bottoms of the connecting elements 186, 188 are not visible. The fourth side wall 174 of the fourth connecting element 186 extends at least partially through a fourth through-opening 194 of the first printed circuit board 105. The fifth side wall 175 of the fifth connecting element 186 extends at least partially through a fifth through-opening 195 of the first printed circuit board 105. The third support element 185 is, for example, received by the side walls 174, 175.

[0045] The sixth connecting element 190 is, for example, shaped identically to the connecting element 180, wherein the sixth connecting element 190 is arranged adjacent to the third component 150 in the intermediate space 125. The bottom 166 of the sixth connecting element 190 is contacted to the second circuit board 110, and the sixth side wall 176 of the sixth connecting element 190 is at least partially guided through a sixth through-opening 196 of the first circuit board 105. The fourth support element 187 is, for example, received by the side wall 176.

[0046] The connecting device 115 is shown and illustrated in more detail in the following figures.

[0047] In an operational state of the electronic circuit 100, a current path 198 runs through the circuit boards 105, 110, which is shown only by way of example using arrows. More precisely, the current path 198 runs through the conductor tracks 135, 135 and, according to the embodiment shown here, in a counterclockwise direction. The current path 198 runs through the connecting element 180 and through the sixth connecting element 190.

[0048] By arranging the connecting device 115 in the electronic circuit 100, the height h cc in the space 125, whereby the low height h cc leads to an advantageous geometry of the current path 198, which enables a low stray inductance.

[0049] In other words, when designing power electronics for fast-switching applications, such as a gallium nitride transistor, the correct layout design is a crucial aspect to consider. Fig. 1, parasitic stray inductances are reduced or prevented, whereby the switching behavior of the fast-switching power electronics remains unaffected.

[0050] Fig. Figure 1 shows a structure of a vertical commutation loop with bottom-cooled components 140, 150, which can also be referred to as transistors, with the connecting device 115, which can also be referred to as a board-to-board connector, and with the use of the first circuit board 105, which can also be referred to as a PCB, and the second circuit board 110, which can also be referred to as an IMS (insulated metal substrate), as well as the required board-to-board signal connectors for gate and source (and optional Miller Clamp). Therefore, the height h cc of the design is limited by the height of the tallest component (signal board-to-board connector) soldered onto the second circuit board 110, and the minimum Lcc of the design is fixed. Dynamic switching tests of such designs show a slight influence of the stray inductance, also known as L cccan be described, on the switching behavior of the power electronics, which enormously improves their fast switching capability.

[0051] The connecting device 115 is optimized for a low-parasitic layout with a vertical commutation loop. The height h cc is advantageous for the design, and the distance between the two circuit boards 105, 110 can be less than three millimeters, less than two millimeters and / or less than one millimeter to determine the height h ccto reduce the size of the circuit board, which is necessary for a low-parasitic layout. The space requirement, not just the height, is relatively small, which has a positive impact on the layout and signal quality due to the shorter signal paths. The approach presented here shows sufficiently small connecting elements 180, 182, 184, 186, 188, 190 of the connecting device 115, which enable the requirements for connecting the second circuit board 110 to the first circuit board 105 in a high-performance application.

[0052] The connecting elements 182, 184, 186, 188, which can also be referred to as signal board-to-board connectors, are mounted, for example, using SMT (surface-mounted technology) on the second circuit board 110, which can also be referred to as an IMS board, or non-conductive connectors through the second circuit board 110, since otherwise the top and bottom of the second circuit board 110 are electrically connected, which is to be avoided. The connecting elements 180, 190, which can also be referred to as board-to-board connectors, are self-positioning on the solder pad and do not float away during soldering.

[0053] Fig. Figure 1 shows the novel solution of an optimized, low-parasitic layout using pitch-optimized interconnect elements 182, 184, 186, 188, which can also be referred to as board-to-board signal connectors. Thus, the first circuit board 105 can be arranged closer to the second circuit board 110, optimizing the parasitic layout and improving the following aspects of the design: By reducing the height h cc , the parasitic stray inductance Lcc is significantly reduced. The reduced Lcc reduces parasitic influences on the fast switching behavior of the power electronics. By increasing the capable switching speeds, the switching losses of the power electronics are reduced and the efficiency of the electrical system is improved. Improved gate and source signal quality, optional Müller clamp, and noise immunity are possible thanks to shorter and more direct signal paths.

[0054] In addition, the new connecting elements 182, 184, 186, 188 are space-optimized, which enables better layout options and further improves the design.

[0055] Fig. Figure 2 shows a representation of a stray inductance to explain an embodiment of an electronic circuit. It shows an optimized spacing 200 of the connecting device, with the spacing being merely 1.4 millimeters and a stray inductance of -6.4 nH.

[0056] The improvements in drain-source voltage oscillations during turn-off are shown. By reducing the distance 200 between the two circuit boards, the stray inductance is reduced by more than half. For example, if the distance was previously only 3.6 millimeters for an old signal board to the board terminals, the distance 200 is reduced in Fig. 2 to just 1.4 millimeters.

[0057] Fig. 3 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 1.

[0058] The connecting device 115 forms a connecting element 300 with a base 305 and a side wall 310. The connecting element 300 is formed, by way of example only, in an L-shaped manner and designed to be inserted into the space of the electronic circuit, as is shown, by way of example only, in Fig. 6 is shown and described in more detail.

[0059] Fig. 4 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 3, except that the connecting device 115 is shown in side view.

[0060] Fig. 5 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 3 and / or Fig. 4, except that the connecting device 115 is shown in a rear view. More specifically, the side wall 310 of the connecting element is shown in a rear view.

[0061] Fig. 6 shows an illustration of an embodiment of an electronic circuit 100. More specifically, a section of a longitudinal section through the electronic circuit 100 is shown. The electronic circuit 100 is similar or corresponds to the electronic circuit of Fig. 1, except that the connecting device 115 is designed differently.

[0062] The connecting device 115 forms the connecting element 300 and a further connecting element 600. The connecting elements 300, 600 are formed similarly, more precisely, in an L-shape, merely by way of example.

[0063] The base 305 of the connecting element 300 is in contact, for example, with the second conductor track 135 of the second circuit board 110. The side wall 310 of the connecting element 300 protrudes at least partially from a through-opening 605 of the first circuit board 105. The further connecting element 600 is arranged adjacent to the connecting element 300, wherein the further base 610 of the further connecting element 600 is in contact with the second conductor track 135 of the second circuit board 110. The further side wall 615 of the further connecting element 600 is at least partially led through a further through-opening 620 of the first circuit board 105.

[0064] The connecting elements 300, 600 are arranged, for example, axially symmetrically mirrored to one another.

[0065] The height h cc is correspondingly reduced due to the shape of the connecting elements 300, 600. The through openings 605, 620, for example, are electrically insulated.

[0066] In other words, the Fig. 3 to Fig. 6 the connecting device 115, which can also be referred to as an L-bent sheet connector for a description of the concept for distance-optimized connecting elements 300, 600, which can also be referred to as board-to-board signal connections.

[0067] The connecting device 115 is made of an electrically conductive sheet, for example, copper sheet with or without a coating, and is bent, for example, into the desired L-shape. The connecting device 115 is, for example, etched into the desired shape and provided with a bending edge etched on one side to reduce the bending radius and increase accuracy, see, for example, Fig. 8. The connecting device 115 is soldered on one side, i.e. with the bottom 305, 610 flat onto the second printed circuit board 110, for example together with the other components in the vapor phase soldering process and on the other side, i.e. the side wall 310, 615, the connecting device 115 can be soldered through the through-openings 605, 620, which can also be referred to as elongated holes, see also Fig. 7, in the first circuit board 105 and soldered from above.

[0068] Fig. 7 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar or corresponds to the electronic circuit of Fig. 6, except that a top view of the first circuit board 105 is shown. More specifically, for example, the through-openings 605, 620 are shown, through which the side walls of the connecting device can be passed.

[0069] Fig. Figure 8 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described figures.

[0070] The connecting device 115 forms the connecting element 300 with the base 305 and the side wall 310, wherein the side wall 310 is formed in a pin-shaped manner only by way of example. The side wall 310 extends, for example, centrally from the base 305. The connecting element 300 is formed, for example, in one piece, wherein a bending edge 800 is formed between the side wall 310 and the base 305.

[0071] In other words, the connecting device 115 is etched, for example, into the desired shape and is provided with the one-sided etched bending edge 800 in order to reduce the bending radius and increase the accuracy.

[0072] The side wall 310, which may also be referred to as the contact side, is capable of being reduced in size for the circuit board, for example in the form of individual pins or shorter sections, in order to increase the possibilities of the circuit board design, as described in the Fig. 8 to 10. The connecting device 115 can then also be referred to as a reduced L-bent sheet connector.

[0073] Fig. Figure 9 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 8, except that the connecting device 115 is shown in side view.

[0074] Fig. Figure 10 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 8 and / or Fig. 9, except that the connecting device 115 is shown in a rear view. More specifically, the side wall 310 is shown in a rear view.

[0075] The bottom 305 is wider than the side wall 310.

[0076] Fig. 11 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described figures, except that a connecting unit 1100 is shown.

[0077] The connecting device 115 forms the connecting elements 300, 600, wherein the connecting elements 300, 600 are merely exemplary and of the same type and L-shaped. The side walls 310, 615 of the connecting elements 300, 600 are arranged adjacent to or parallel to one another. The connecting elements 300, 600 are arranged horizontally mirrored to one another.

[0078] The electronic circuit comprises, for example, the connecting unit 1100, which is arranged between the side walls 310, 615 of the connecting elements 300, 600 in order to connect the connecting elements 300, 600 to one another. The connecting unit 1100 is, for example, rectangular in shape and, in the assembled state, protrudes at least partially from the side walls 310, 615, wherein the connecting unit 1100 is, for example, thinner than the side walls 310, 615.

[0079] Fig. Figure 12 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 11, except that the connecting device 115 is shown in side view.

[0080] The connecting unit 1100 is merely exemplary flush with the undersides of the bases 305, 610 and protrudes at least partially from the top side of the side walls 310, 615.

[0081] Fig. 13 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 11 and / or Fig. 12, except that the connecting device 115 is shown in a rear view. More specifically, the side wall 310 or the further side wall 615 is shown in a rear view.

[0082] Fig. 14 shows an illustration of an embodiment of an electronic circuit 100. More specifically, a section of a longitudinal section through the electronic circuit 100 is shown. The electronic circuit 100 is similar or corresponds to the electronic circuit of Fig. 6, except that the connecting device 115 is arranged differently. The connecting device 115 is similar to or equivalent to the connecting device of Fig. 11 to 13.

[0083] The connecting elements 300, 600 are arranged in the intermediate space 125 of the electronic circuit 100 such that the side walls 310, 615 at least partially protrude from the through-opening 605 of the first printed circuit board 105. The connecting unit 1100 is arranged between the side walls 310, 615 of the connecting elements 300, 600, wherein the connecting unit 1100 protrudes at least partially from the through-opening 605 of the first printed circuit board 105, wherein the connecting unit 1100 protrudes further from the through-opening 605 than the connecting elements 300, 600. The side walls 310, 615 and the connecting unit 1100 are thus at least partially guided through the one through-opening 605 of the first printed circuit board 105.The connecting unit 1100 is formed merely by way of example thicker than the side walls 310, 615 and merely by way of example ends flush with the undersides of the bases 305, 610, wherein only the bases 305, 610 are contacted on the second conductor track 135 of the second circuit board 110.

[0084] In other words, the Fig. 11 to Fig. 14 the connecting device 115, which is also known as |L-bent sheet metal double connector can be used to describe the concept for distance-optimized connecting elements 300, 600, which can also be referred to as board-to-board signal connections.

[0085] The connecting device 115 is made of an electrically conductive sheet, for example, copper sheet with or without a coating, and is bent, for example, into the desired L-shape. The connecting device 115 is, for example, etched into the desired shape and provided with a bending edge etched on one side to reduce the bending radius and increase accuracy, see, for example, Fig. 8. The connecting elements 300, 600, which are also known as L-Bent-Sheet connectors or |L-bent-sheet double connectors are provided with the connecting unit 1100 and connected back-to-back. The connecting unit 1100 may also be referred to as an electrically insulating material and may comprise, for example, Kapton, insulating plastic film such as polypropylene or polycarbonate, or a similar electrically insulating material.

[0086] The connecting elements 300, 600 are flat on one side, i.e., with the bases 305, 610 soldered flat onto the second circuit board 110, for example, together with the other components using a vapor-phase soldering process. On the other side, i.e., the side walls 310, 615 are contacted through the through-hole 605, which can also be referred to as an elongated hole, in the first circuit board 105 and soldered from above. The through-hole 605 in the first circuit board 105 has two electrically insulated contacts for the two connecting elements 300, 600, see Fig. 15.

[0087] According to one embodiment, additional connectors, which may also be referred to as L-bent sheet connectors, are connectable back-to-back with the interconnect unit 1100 to transmit additional signals, such as a Müller terminal.

[0088] The side walls 310, 615, for example, are pin-shaped to increase the possibilities of circuit board design.

[0089] Fig. 15 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar or corresponds to the electronic circuit of Fig. 14, except that a top view of the first circuit board 105 is shown.

[0090] More specifically, a top view of the through-hole 605 of the first circuit board 105 is shown, which is configured to at least partially accommodate the side walls and the connection unit. The through-hole 605 is, for example, electrically insulated.

[0091] Fig. 16 shows a diagram of a connecting device 115 of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 11, except that the connection unit 1100 is arranged differently.

[0092] The connecting elements 300, 600 are arranged adjacent to one another, with the bases 305, 610 facing each other. The connecting unit 1100 is arranged on the upper side of the bases 305, 610 to connect the connecting elements 300, 600 to one another. A gap 1600 is formed between the bases 305, 610.

[0093] Fig. Figure 17 shows a diagram of a connecting device 115 of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 16, except that the connecting device 115 is shown in side view.

[0094] Fig. Figure 18 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 16 and / or Fig. 17, except that the connecting device 115 is shown in a rear view. More specifically, the side wall 310 or the further side wall 615 is shown in a rear view.

[0095] Fig. Figure 19 shows an illustration of an electronic circuit 100. More specifically, a section of a longitudinal section through the electronic circuit 100 is shown. The electronic circuit 100 is similar or corresponds to the electronic circuit of Fig. 6, except that the connecting device 115 is designed differently. The connecting device 115 is similar to or equivalent to the connecting device 115 of Fig. 16 to Fig. 18.

[0096] The connecting device 115 is arranged in the intermediate space 125 of the electronic circuit 100. The side wall 310 of the connecting element 300 protrudes at least partially from the through-opening 605 of the first circuit board 105, while the further side wall 615 of the further connecting element 600 protrudes at least partially from the further through-opening 620 of the first circuit board 105. The bases 305, 610 are contacted to the second conductor track 135 of the second circuit board 110, wherein the bases 305, 610 are covered by the connecting unit 1100. The connecting unit 1100 and the bases 305, 610 have an identical thickness merely as an example.

[0097] In other words, the Fig. 16 to Fig. 19 the connecting device 115, which is also known as L -Bent sheet metal double connector can be referred to for a description of the concept for connecting elements 300, 600, which are also called distance-optimized board-to-board signal connections or L -Bent-Sheet double connectors or L-Bent-Sheet connectors.

[0098] The connecting device 115 is made of an electrically conductive sheet, for example, copper sheet with or without a coating, and is bent, for example, into the desired L-shape. The connecting device 115 is, for example, etched into the desired shape and provided with a bending edge etched on one side to reduce the bending radius and increase accuracy. The connecting device 115 is soldered flat on one side, i.e., with the base 305, 610, onto the second printed circuit board 110, for example, together with the other components using a vapor phase soldering process, and on the other side, i.e., the side wall 310, 615, the connecting device 115 can be inserted through the through-openings 605, 620, which can also be referred to as elongated holes, see also Fig. 7, in the first circuit board 105 and soldered from above.

[0099] The side walls 310, 615, which can also be referred to as the contact side, can be reduced in size for the circuit board 105, 110, for example, as individual pins or shorter sections, in order to increase the possibilities of the circuit board design. According to one embodiment, the connecting elements 300, 600 can be connected frontally to the connection unit 1100 in order to transmit additional signals, such as a Müller terminal. Furthermore, the required installation space can be reduced by "subdividing" the flat soldered surfaces on the second circuit board 110, as is the case, for example, in Fig. 20 is shown.

[0100] Fig. Figure 20 shows a diagram of a connecting device 115 of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described figures, except that the bases 305, 610 of the connecting elements 300, 600 are triangular in shape.

[0101] Fig. Figure 21 shows a flowchart of an embodiment of a method 2100 for manufacturing an electronic circuit. The electronic circuit is similar to or corresponds to the electronic circuit from one of the figures described above.

[0102] The method 2100 comprises a provision step 2105 and a placement step 2110. In the provision step 2105, the first circuit board, the second circuit board, and the connecting device are provided. In the placement step 2110, the connecting device is arranged between the circuit boards. The base of the connecting element is arranged on the second circuit board, with the side wall of the connecting element extending at least partially out of a through-opening in the first circuit board to produce the electronic circuit.

[0103] Fig. Figure 22 shows a block diagram of an embodiment of a control device 2200 for manufacturing an electronic circuit. The control device 2200 is designed to implement the method of Fig. 21 or a similar process.

[0104] For this purpose, the control device 2200 has a provision unit 2205 and a placement unit 2210. The provision unit 2205 is designed to provide the first circuit board, the second circuit board, and the connecting device. The placement unit 2210 is designed to arrange the connecting device between the circuit boards. The base of the connecting element is arranged on the second circuit board, wherein the side wall of the connecting element is at least partially guided through a through-opening of the first circuit board in order to produce the electronic circuit.

[0105] Fig. 23 shows a circuit diagram of an embodiment of an electronic circuit 100. The electronic design of the electronic circuit 100 is similar to or corresponds to one of the figures described above.

[0106] The electronic circuit 100 has a first supply voltage terminal 2302 and a second supply voltage terminal 2304, wherein a capacitor 2306 is connected between the supply voltage terminals 2302, 2304.

[0107] The electronic circuit 100 comprises, for example, a bridge circuit unit 2300, which comprises a first half-bridge 2305 and a second half-bridge 2310. The first half-bridge 2310 comprises a first switch 2315 and a second switch 2320, wherein the switches 2315, 2320 are connected to each other via a tapping point 2325. The first switch 2315 represents a high-side switch, and the second switch 2320 represents a low-side switch; the switches 2315, 2320 are embodied as transistors.

[0108] The first switch 2315 represents the additional component 140, the second switch 2320 represents the third component 150. The electronic circuit 100 comprises, for example, a first comparator 2330 and a second comparator 2335. The first comparator 2330 is connected, for example, to the first switch 2315, with a first inductance 2340 connected between the first switch 2315 and the first comparator 2330. The second comparator 2335 is connected, for example, to the second switch 2320, with a second inductance 2345 connected between the second switch 2320 and the second comparator 2335.

[0109] The second switch 2320, together with the second inductance 2345 and the second comparator 2335, forms, for example, a gate loop 2350, which can also be referred to as a gate loop.

[0110] The second half-bridge 2310 has the component 138, wherein the component 138 represents a series circuit of a capacitor 2355 and a resistor 2360.

[0111] For example, a third inductance 2365, which can also be referred to as leakage inductance and / or Lcc, is connected between the first half-bridge 2305 and the second half-bridge 2310. In an operational state, the current path 198 runs as shown, for example, in Fig. 1, by the bridge circuit unit 2300 and forms a commutation loop 2370.

[0112] In other words, Fig. 23 are the most common parasitic stray inductances. In fast switching applications, the stray inductance LCC of current path 198 has the greatest influence on the switching behavior and can be reduced by a correct layout, as shown, for example, in the Fig. 1 is shown and described.

[0113] Fig. Figure 24 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar or corresponds to the electronic circuit from one of the figures described above. In other words, Fig. 24 a minimalist vertical commutation loop and its geometric parameters.

[0114] Shown is the current path 198, which runs along the first circuit board 105 and the second circuit board 110. All four parameters lcc, hcc, i.e., the height hcc, wcc, and tcc, have a direct influence on the total leakage inductance LCC. The height hcc, which can also be referred to as the distance hcc, between the current paths 198 of the vertical commutation loop is significantly reduced to also reduce the corresponding leakage inductance LCC.

[0115] For example, the parameter Icc represents the length of the electronic circuit 100, hcc represents the height of the electronic circuit 100, wcc the width and tcc the thickness.

[0116] Fig. 25 shows a representation of a connecting device 115 for explaining an embodiment of an electronic circuit.

[0117] The connecting device 115 forms the connecting elements 300, 600, wherein the connecting elements 300, 600 are merely exemplary of being of the same type and shaped in a J-shape. The side walls 310, 615 of the connecting elements 300, 600 are arranged adjacent to or parallel to one another, with a gap 2500 formed between the side walls 310, 615. The connecting elements 300, 600 are arranged, for example, horizontally mirrored to one another.

[0118] The bottoms 305, 610 of the connecting elements 300, 600 have, for example, an at least partially L-shaped base area.

[0119] Fig. Figure 26 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 25, except that the connecting device 115 is shown in side view.

[0120] The gap 2500 is formed between the side walls 310, 615.

[0121] Fig. Figure 27 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 25 and / or Fig. 26, except that the connecting device 115 is shown in a bottom view. More specifically, the floors 305, 610 are shown in a bottom view.

[0122] Fig. Figure 28 shows an illustration of an embodiment of an electronic circuit 100. More specifically, a section of a longitudinal section through the electronic circuit 100 is shown. The electronic circuit 100 is similar or corresponds to the electronic circuit of Fig. 14, except that the connecting device 115 is arranged differently. The connecting device 115 is similar to or equivalent to the connecting device of Fig. 25 to 27.

[0123] The connecting elements 300, 600 are arranged in the intermediate space 125 of the electronic circuit 100 such that the side walls 310, 615 protrude at least partially from the through-opening 605 of the first circuit board 105. The bases 305, 610 are at least partially contacted with the second conductor track 135 of the second circuit board 110.

[0124] Fig. Figure 29 shows an illustration of an embodiment of an electronic circuit 100. More specifically, a section of a longitudinal section through the electronic circuit 100 is shown. The electronic circuit 100 is similar or corresponds to the electronic circuit of Fig. 28, except that the electronic circuit 100 has the through-opening 605 and the further through-opening 620. The side wall 310 of the connecting element 300 is, for example, at least partially passed through the through-opening 605, wherein the further side wall 615 of the further connecting element 615 is at least partially passed through the further through-opening 620.

[0125] In other words, the Fig. 25 to 29 show the connecting device 115, which can also be referred to as a J|J bent-sheet double connector, for a description of the concept for distance-optimized connecting elements 300, 600, which can also be referred to as signal board-to-board connectors.

[0126] The connecting device 115 is made of an electrically conductive sheet, for example, coated or uncoated copper sheet, and is bent, for example, into the desired J-shape. The connecting device 115 is etched, for example, into the desired shape and provided with a single-sided etched bending edge to reduce the bending radius and increase accuracy. The two connecting elements 300, 600, which can also be referred to as J-bent sheet connectors, are mounted back-to-back with the gap 2500, which can also be referred to as an insulating gap.

[0127] The connecting device 115 is soldered flat onto the second circuit board 110 on one side, i.e., with the base 305, 610, for example, together with the other components using a vapor-phase soldering process. On the other side, i.e., the side wall 310, 615, the connecting device 115 can be contacted through the through-openings 605, 620, which can also be referred to as elongated holes, in the first circuit board 105 and soldered from above. The through-openings 605, 620 have, for example, two electrically insulated contacts for the two connecting elements 300, 600.

[0128] The side walls 310, 615, which can also be referred to as contact sides, are scalable for the printed circuit board 105, 110, for example, as individual pins or shorter sections to increase the design possibilities of the printed circuit board 105, 110. As shown in Fig.29, two separate through holes 605, 620 can be used, one for each connecting element 300, 600

[0129] The exemplary embodiments described and shown in the figures are selected only as examples. Different exemplary embodiments can be combined with each other in their entirety or with regard to individual features. Furthermore, one exemplary embodiment can be supplemented by features of another exemplary embodiment.

[0130] Furthermore, method steps according to the invention can be repeated and carried out in a different order than that described.

[0131] If an embodiment comprises an “and / or” link between a first feature and a second feature, this can be read such that the embodiment according to one embodiment has both the first feature and the second feature and according to another embodiment has either only the first feature or only the second feature. Reference symbol 100 electronic circuit 105 first circuit board 110 second circuit board 115 Connecting device 118 Outside of the first circuit board 120 Inside of the first circuit board 122 Outside of the second circuit board 125 space 128 Inside of the second circuit board 130 first conductor track 135 second conductor track 138 component 140 additional components 150 third component 155 Thermal conductive material 160 additional thermal conductive material 165 Bottom of the connecting element 166 Bottom of the sixth connecting element 170 Side wall of the connecting element 171 Through hole of the first circuit board 172 further side wall of the further connecting element 173 third side wall of the third connecting element 174 fourth side wall of the fourth connecting element 175 fifth side wall of the fifth connecting element 176 sixth side wall of the sixth connecting element 180 connecting element 181 Support element 182 additional connecting element 183 additional support element 184 third connecting element 185 third support element 186 fourth connecting element 187 fourth support element 188 fifth connecting element 190 sixth connecting element 192 additional through-hole of the first circuit board 193 third through hole of the first circuit board 194 fourth through hole of the first circuit board 195 fifth through hole of the first circuit board 196 sixth through hole of the first circuit board 198 Power path 200 distance 300 connecting element 305 Floor 310 side wall 600 additional connecting element 605 passage opening 610 further base of the further connecting element 615 further side wall of the further connecting element 620 additional passage opening 800 bending edge 1100 connection unit 1600 gap 2100 Method for producing an electronic circuit 2105 Deployment step 2110 Arranging step 2200 Control device for producing an electronic circuit 2205 Unit for providing 2210 Unit for arranging 2300 bridge circuit unit 2302 first supply voltage connection 2304 second supply voltage connection 2305 first half bridge 2306 Capacitor 2310 second half bridge 2315 first switch 2320 second switch 2325 tapping point 2330 first comparator 2335 second comparator 2340 first inductance 2345 second inductance 2350 gate loop 2355 capacitor 2360 resistance 2365 third inductance 2370 Commutation loop 2500 gap Lcc leakage inductance lcc length wcc width hcc height tcc thickness

Claims

[1] Electronic circuit (100) having the following features: a first circuit board (105) having an outer side (118) and an inner side (120) opposite the outer side (118), wherein the first circuit board (105) has at least one first conductor track (130) and wherein the first circuit board (105) has at least one through-opening (605) designed as an elongated hole; a second circuit board (110) having an outer side (122) and an inner side (128) opposite the outer side (122), wherein the second circuit board (110) has a second conductor track (135), wherein the inner side (128) of the second circuit board (110) faces the inner side (120) of the first circuit board (105); and a connecting device (115) arranged in an intermediate space (125) between the first circuit board (105) and the second circuit board (110), wherein the connecting device (115) forms at least one connecting element (300) with a base (305) and a side wall (310) adjacent to the base (305), wherein an underside of the base (305) is arranged on the inside (128) of the second circuit board (110) of the electronic circuit (100), wherein the side wall (310) is at least partially led through the through-opening (605) of the first circuit board (105) of the electronic circuit (100), characterized by , that the connecting device (115) forms a further connecting element (600) with a further base (610) and a further side wall (615) adjacent to the further base (610), wherein a further underside of the further base (610) is arranged on the inner side (128) of the second printed circuit board (110) of the electronic circuit (100), wherein the further side wall (615) is at least partially led through the through-opening (605) of the first printed circuit board (105) of the electronic circuit (100). [2] Electronic circuit (100) according to claim 1, wherein the connecting device (115) comprises a metallic material, in particular wherein the metallic material is formed as an electrically conductive sheet. [3] Electronic circuit (100) according to one of the preceding claims, wherein the connecting element (300) is L-shaped or J-shaped. [4] Electronic circuit (100) according to one of the preceding claims, wherein the connecting element (300) is formed in one piece, in particular wherein a bending edge (800) is formed between the base (305) and the side wall (310). [5] Electronic circuit (100) according to one of the preceding claims, wherein the bottom (305) of the connecting element (300) is wider than the side wall (310) of the connecting element (300) or wherein the side wall (310) of the connecting element (300) is wider than the bottom (305) of the connecting element (300) or wherein the bottom (305) of the connecting element (300) and the side wall (310) of the connecting element (300) have an identical width. [6] Electronic circuit (100) according to one of the preceding claims, wherein the side wall (310) of the connecting element (300) is pin-shaped, in particular wherein the pin-shaped side wall (310) is arranged centrally on the base (305). [7] Electronic circuit (100) according to one of the preceding claims, wherein the bottom (305) of the connecting element (300) is triangular in shape. [8] Electronic circuit (100) according to one of the preceding claims, wherein a rear side of the side wall (310) and a further rear side of the further side wall (615) are arranged or can be arranged adjacent to one another or wherein the base (305) and the further base (610) are arranged or can be arranged adjacent to one another. [9] Electronic circuit (100) according to one of the preceding claims, comprising a connecting unit (1100) which is arranged between the rear side of the side wall (310) and the further rear side of the further side wall (615) or wherein the connecting unit (1100) is arranged on the base (305) and the further base (610) in order to connect the connecting element (300) and the further connecting element (600) to one another. [10] Electronic circuit (100) according to claim 9, wherein the connection unit (1100) is formed from an electrically insulating material. [11] A method (2100) for manufacturing an electronic circuit (100) according to any one of claims 1 to 10, wherein the method (2100) comprises the following steps: Providing (2105) the first circuit board (105), the second circuit board (110) and the connecting device (115); and Arranging (2110) the connecting device (115) between the printed circuit boards (105, 110), wherein the base (305) of the connecting element (300) is arranged on the second printed circuit board (110), wherein the side wall (310) of the connecting element (300) is at least partially guided through a through-opening (605) designed as an elongated hole in the first printed circuit board (105) in order to produce the electronic circuit (100), wherein furthermore for the connecting device (115) a further connecting element (600) with a further base (610) and a further side wall (615) adjoining the further base (610) is arranged, wherein a further underside of the further base (610) is arranged on the inside (128) of the second printed circuit board (110) of the electronic circuit (100), wherein the further side wall (615) protrudes from the through-opening (605) of the first printed circuit board (105) of the electronic circuit (100) is at least partially passed through. [12] Control device (2200) which is designed to carry out and / or control the steps of the method (2100) according to claim 11 in corresponding units. [13] Computer program product with program code for carrying out the method according to claim 11, when the computer program product is executed on a control device. [14] A machine-readable storage medium on which the computer program product according to claim 13 is stored.

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