COOLING UNIT FOR A POWER SUPPLY MODULE AND A POWER SUPPLY MODULE

Abstract

The present utility model relates to a cooling assembly for a power supply module, comprising at least the following: A horizontal heat conduction structure having a support part and a heat conduction part arranged opposite the support part in the thickness direction, wherein the support part is configured to be able to support a heat-generating component of the power supply module, wherein the horizontal heat conduction structure, viewed in the horizontal direction, has at least one hot end region and one cold end region and is configured to be able to conduct the heat of the hot end region at least substantially along the horizontal direction to the cold end region;and a cooling structure, wherein the cooling structure comprises a cooling housing and several heat sinks, the cooling housing and the heat-conducting element together enclosing a receiving chamber for a cooling medium, and the heat sinks being rigidly connected to the heat-conducting element and extending into the receiving chamber, the cooling housing having an inlet opening and a drain opening, each connected to the receiving chamber. It further relates to a corresponding power supply module. This allows the thermal conductivity in the horizontal direction to be significantly increased and the overall cooling efficiency and operating performance of the power supply module to be improved.

Description

FIELD OF THE INVENTION

[0001] The present utility model relates to the field of power semiconductors, in particular to a cooling assembly for use in a power supply module. The present utility model also relates to a corresponding power supply module. STATE OF THE ART

[0002] With the current development of power electronic devices toward miniaturization, high performance, and high integration, power supply modules for power electronic devices serve as critical components for tightly enclosing power semiconductor components as a whole according to specific functional combinations and providing electrical and mechanical connections. These power supply modules have advantages such as small volume and high power density, which is why they are widely used in fields such as vehicles, industrial equipment, and household appliances.

[0003] When the power supply module is in operation, part of the electrical energy supplied to the power semiconductor components is converted into heat. This heat cannot be easily dissipated. It quickly accumulates and significantly increases the temperature of the power supply module, thereby reducing the working efficiency of the power supply module and leading to thermal failure, fires, and explosions. For this reason, current power supply modules are arranged with thermally conductive plates to dissipate the heat generated by the power semiconductor components. However, it is made of an isotropic metallic material, which means that the thermal conductivity of the thermal conductivity plate along the thickness direction is significantly higher than the thermal conductivity along the horizontal direction.In such a case, since the heat generated by the power semiconductor components is mainly transferred to the projection area of ​​the heat conduction plate below the power semiconductor component, the temperature in this projection area becomes significantly higher than the temperature in the other areas of the heat conduction plate, which results in the heat being dissipated basically only through the projection area, and the other areas of the heat conduction plate away from the projection area are not effectively utilized, thereby reducing the cooling efficiency of the heat conduction plate and preventing the heat inside the power supply module from being dissipated in time, thus affecting the working efficiency and service life of the power supply module. CONTENTS OF THE UTILITY MODEL

[0004] Therefore, the objective of the present invention is to propose an improved cooling assembly for a power supply module, which can significantly increase thermal conductivity in the horizontal direction, thereby dissipating the heat of the power supply module in a timely manner, thus improving the overall cooling efficiency and performance of the power supply module. Furthermore, the cooling assembly according to the present invention can be constructed simply and with a compact structure.

[0005] According to one aspect of the present utility model, a cooling assembly for a power supply module is provided, the cooling assembly comprising at least the following: - a horizontal heat conduction structure, wherein the horizontal heat conduction structure has a support part and a heat conduction part arranged opposite the support part in the thickness direction, wherein the support part is configured to be able to support a heat-generating component of the power supply module, wherein the horizontal heat conduction structure, viewed in the horizontal direction, has at least one warm end region and a cold end region and is configured to be able to conduct the heat of the warm end region at least substantially along the horizontal direction to the cold end region; and - a cooling structure, wherein the cooling structure comprises a cooling housing and a plurality of heat sinks, the cooling housing and the heat conducting part together surround a receiving chamber for a cooling medium and the heat sinks are fixedly connected to the heat conducting part and extend into the receiving chamber, wherein the cooling housing has an inlet opening and a discharge opening, each of which is connected to the receiving chamber.

[0006] Compared with the current technology, the cooling assembly for a power supply module according to the present utility model comprises a horizontal heat conduction structure and a cooling structure, wherein the horizontal heat conduction structure comprises a support part and a heat conduction part in the thickness direction and is divided into a warm end region and a cold end region in the horizontal direction, wherein the support part can absorb heat from the supported heat-generating component, wherein at least part of the heat is transferred in the horizontal direction from the warm end region to the cold end region and then dissipated by the cooling structure, whereby the thermal conductivity in the horizontal direction can be significantly increased and a concentration of heat in the projection area of ​​the heat-generating component can be avoided,so that the overall cooling efficiency of the power supply module is improved and the operating performance and service life of the power supply module are increased.

[0007] For example, the horizontal heat conduction structure forms a sealed vapor chamber between the support part and the heat conduction part, wherein the vapor chamber has an evaporation section in the warm end region and a condensation section in the cold end region, and a working medium capable of a phase change is located in the vapor chamber, wherein the horizontal heat conduction structure has a capillary layer arranged at least on the side of the support part facing the heat conduction part; or the horizontal heat conduction structure is constructed as a pulsating heat pipe.

[0008] For example, the heat sinks and the heat conducting part are constructed as a single piece; or the heat sinks and the cooling housing are constructed as a single piece and bonded to the heat conducting part; or the heat sinks are constructed separately and each bonded to the heat conducting part and the cooling housing.

[0009] For example, the heat sinks are arranged at least in the cold end region of the horizontal heat conduction structure; and / or the distribution density of the heat sinks in the cold end region is greater than the distribution density in the warm end region, or the heat sinks are arranged uniformly on the heat conduction part.

[0010] For example, the cold end region of the horizontal heat conduction structure is aligned with the inlet opening of the cooling housing; and / or the heat sinks are lamellar, serrated, needle-shaped or wave-shaped For example, the horizontal heat conduction structure has a heat insulating region between the warm end region and the cold end region; and / or the support part and / or the heat conduction part are constructed as metal stamping plates or sintered metal powder parts; and / or the cooling medium is water or air or another cooling liquid.

[0011] For example, the cooling housing is pot-shaped and has a flange part on the outer circumference, wherein the cooling housing is firmly connected to the heat conducting part of the horizontal heat conducting structure by means of the flange part.

[0012] According to a second aspect of the present utility model, a power supply module is provided, the power supply module comprising at least the following: - a cooling assembly according to the present utility model; - at least one heat-generating component, wherein the heat-generating component is fixedly arranged on the support part of the horizontal heat-conducting structure of the cooling assembly; and - a sealing part, wherein the sealing part is designed to enclose the heat-generating component.

[0013] For example, the heat-generating component is arranged at least partially in the warm end region of the horizontal heat conduction structure; and / or the power supply module comprises another cooling assembly for the heat-generating component.

[0014] For example, a thermally conductive adhesive is applied between the heat-generating component and the carrier part; and / or the power supply module is designed as an inverter or rectifier. DESCRIPTION OF THE CHARACTERS

[0015] The present utility model is described in more detail below with reference to the figures, so that the principles, features, and advantages of the present utility model can be better understood. The figures include the following: Fig. 1 shows a schematic sectional view of a power supply module according to an exemplary embodiment of the present utility model; Fig. 2a, Fig. 2b and Fig. 2c show a schematic plan view, a cross-sectional view in the thickness direction and an exploded view of a cooling assembly for a power supply module according to an exemplary embodiment of the present utility model; Fig. 3 shows a schematic representation of a horizontal heat conduction structure of a cooling assembly according to an exemplary embodiment of the present utility model; DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] In order to better clarify the technical problems to be solved by the present utility model, the technical solutions and the advantageous technical effects, the present utility model is explained in more detail below with reference to the figures and exemplary embodiments.

[0017] In the description of the present embodiments, orientations or positional relationships such as "top", "bottom", "left", "right", etc. are orientations or positional relationships based on the representations of the figures, which serve only for description and simplification and neither explicitly nor implicitly stipulate that the intended devices or elements must have a particular orientation or must be constructed and operated with a particular orientation, and therefore should not be understood as a limitation of the present invention.

[0018] In this specification, unless clearly stated and defined otherwise, the terms "install," "adjoin," and "connect" are to be understood in their broadest sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct adjoining or an indirect adjoining via an intermediate part, or two elements may be internally connected. Those of ordinary skill in the art will understand the meanings of the above terms in this disclosure depending on the circumstances.

[0019] Fig. 1 shows a schematic cross-sectional view of a power supply module 100 according to an exemplary embodiment of the present utility model. Fig. 2a, Fig. 2b and Fig. 2c each show a schematic plan view, a cross-sectional view in the thickness direction, and an exploded view of a cooling assembly for a power supply module according to an exemplary embodiment of the present utility model. The power supply module 100 is used in a power electronic device and is designed, for example, as an inverter or current regulator.

[0020] As in Fig. 1, the power supply module 100 comprises a cooling assembly 10 and at least one, in particular a plurality of, heat-generating components 20 that are fixedly arranged in the cooling assembly 10. The heat-generating components are, for example, power semiconductor components made of power semiconductor material and are designed to implement power control and convert electrical energy. For example, the heat-generating component 20 can comprise semiconductor elements such as a diode, an insulated gate bipolar transistor (IGBT), a MOSFET (metal oxide semiconductor field-effect transistor), a thyristor, etc. A combination of different heat-generating components 20 can be selected as needed to meet the performance requirements of the power supply module 10.The heat generated by the heat-generating component 20 during operation is dissipated by means of the cooling assembly 10 in order to keep the internal temperature of the power supply module 100 below a temperature threshold value.

[0021] As in Fig. 1, the power supply module 100 further comprises a potting encapsulation part 30, wherein the potting encapsulation part is configured to enclose the heat-generating component 20 to provide electrical insulation, sealing, and protection of the heat-generating component 20 from the external environment. The potting encapsulation part 30 is typically manufactured by injection molding from a polymer composite material, e.g., epoxy resin. Of course, any other material deemed appropriate by those skilled in the art is also conceivable.

[0022] As in Fig. 1, the cooling assembly 10 comprises a horizontal heat conduction structure 11 and a cooling structure 12, wherein the horizontal heat conduction structure 11, viewed in the thickness direction Y, has a support part 111 and a heat conduction part 112 arranged opposite the support part 111, wherein the support part is configured to be able to support a heat-generating component 20 of the power supply module 100, so that the heat generated by the heat-generating component 20 is transferred directly to the support part 111, while the heat conduction part 112 is designed for a heat-conducting connection to the cooling structure 12. In particular, a thermally conductive adhesive is applied between the heat-generating component 20 and the support part 111, wherein the thermally conductive adhesive fixes the heat-generating component 20 on the support part 111 and increases the thermal conductivity between the heat-generating component 20 and the support part 111.

[0023] As in Fig. 1, the horizontal heat conduction structure 11, viewed in the horizontal direction X, has a warm end region 113 and a cold end region 114 spaced apart from the warm end region in the horizontal direction X, wherein the warm end region corresponds to the projection region of the support part 111 in the thickness direction Y for supporting the heat-generating component 20, while the cold end region corresponds to the region of the support part 11 that is remote from the heat-generating component 20. In the context of the present utility model, the “horizontal direction X” is to be understood as the direction in the main extension plane of the cooling assembly 10, which is perpendicular to the thickness direction Y. In this case, the heat absorbed by the support part 111 can be transferred from the warm end region 113 to the cold end region 114 at least substantially in the horizontal direction X.In the context of the present utility model, “at least substantially” is to be understood as meaning that the major part of the heat, in particular all of the heat, is transferred in the horizontal direction X from the warm end region 113 to the cold end region 114.Subsequently, the heat in the cold end region 114 is further transferred into the cooling structure 112 via the heat conducting part 112 and dissipated via the cooling medium in the cooling structure 112, whereby the thermal conductivity of the cooling assembly 10 in the horizontal direction X can be effectively increased, so that the heat generated by the heat-generating component 20 can be transferred in the horizontal direction X to the cold end region 114 of the support part 11 remote from the heat-generating component 20, thereby avoiding a concentration of heat in the projection region of the heat-generating component or in the warm end region 113, thereby expanding the heat conduction area and improving the cooling effect, so that the heat inside the power supply module 100 is dissipated in a timely manner via the cooling assembly 10.

[0024] As in Fig. 1 and Fig. As shown in Figure 2b, the cooling structure 12 comprises a cooling housing 121, wherein the cooling housing is sealed to the heat-conducting part 112 of the horizontal heat-conducting structure 11 and together surrounds a receiving chamber 122 for a cooling medium. The cooling housing 121 has an inlet opening 124 and an outlet opening 125, each of which is connected to the receiving chamber 122, whereby the cooling medium can flow into the receiving chamber 122 via the inlet opening 124 and, after flowing through the receiving chamber 122, flow out via the outlet opening 125. For example, the cooling medium can be water or air. Of course, any other cooling medium considered appropriate by those skilled in the art, for example, an aqueous glycol solution, is also conceivable.

[0025] As in Fig. 1 and Fig. As shown in Figure 2b, the cooling structure 12 further comprises a plurality of heat sinks 123, wherein the heat sinks are firmly connected to the heat-conducting part 112 of the horizontal heat-conducting structure 11 and extend into the receiving chamber 122, wherein the heat absorbed by the heat-conducting part 112 can be further transferred into the heat sinks 123. The heat sinks can significantly increase the thermal contact area with the cooling medium in the receiving chamber 122, whereby the heat is dissipated even more quickly from the heat-conducting part 112 via the cooling medium in the receiving chamber 122.

[0026] Fig. 3 shows a schematic representation of a horizontal heat conduction structure 11 of a cooling assembly 10 according to an exemplary embodiment of the present utility model.

[0027] As in Fig. 3, the support part 111 and the heat-conducting part 112 are arranged at a distance from one another and are firmly connected to one another. A sealed vapor chamber 115 is formed between the support part 111 and the heat-conducting part 112, and the vapor chamber can be formed by a recess in the support part 111 and / or a recess in the heat-conducting part 112. A working medium capable of a phase change, for example water, is located in the vapor chamber 115. The working medium can evaporate to the gas phase upon absorption of heat in the warm end region 113 and condense to the fluid phase upon release of heat in the cold end region 114. For this reason, the vapor chamber 115 has an evaporation section in the warm end region 113 and a condensation section in the cold end region 114.wherein the horizontal heat conduction structure 11 further comprises a capillary layer 116 arranged at least on the side of the support part 111 facing the heat conduction part 112. The capillary layer provides capillary force to the liquid working medium, and the capillary force allows the working medium to flow in the capillary layer 116. Upon absorbing heat from the heat-generating component 20, the working medium evaporates into the gaseous state in the warm end region 113 and flows in a first flow direction P1 to the heat conduction part 112. It then flows in the gaseous state in a second flow direction P2, which runs parallel to the horizontal direction X, into the cold end region 114, releases heat in the cold end region via the heat conduction part 112, and cools, thereby condensing into the liquid state.The liquid working medium flows in a third flow direction P3 to the capillary layer 116 arranged on the support part 111 and flows in the capillary layer under the influence of capillary force in a fourth flow direction P4 back into the warm end region 113, thereby forming a thermal cycle of the working medium and achieving highly efficient heat transfer in the horizontal direction X by means of the phase change of the working medium in the warm end region 113 and the cold end region 114. For example, the capillary layer 116 can also be arranged on the side of the heat-conducting part 112 facing the support part 111.

[0028] In addition, other configurations of the horizontal heat conduction structure 11 may be considered which those skilled in the art may consider appropriate, for example, a pulsating heat pipe configuration, wherein the pulsating heat pipe does not have a liquid absorption core, but its internal air bubble column and liquid column are spaced and randomly distributed, and a pressure difference is generated by the phase change of the working fluid, causing the working fluid to vibrate between the evaporation section and the condensation section.

[0029] For example, the horizontal heat conduction structure 11 may have a heat-insulating region between the warm end region 113 and the cold end region 114, as needed. By arranging the heat-insulating region, the heat distribution in the horizontal direction X can be specifically controlled.

[0030] For example, the support part 111 and the heat-conducting part 112 of the horizontal heat-conducting structure 11 are formed as a stamped metal plate, e.g., a copper plate, thereby realizing a cost-effective construction of the horizontal heat-conducting structure 11 that meets the thermal conductivity requirements. It is also possible for the support part 111 and the heat-conducting part 112 to be formed as sintered metal powder parts. It is also conceivable for the support part 111 and the heat-conducting part 112 to be manufactured using different processes or from different materials.

[0031] For example, the heat sinks 123, as shown in Fig. 1 and Fig. 2b, is firmly connected to the heat-conducting part 123. Here, the heat sinks 123 can extend completely through the receiving chamber 122 to the cooling housing 121 in the thickness direction Y, so that the heat sinks 123 are connected to the cooling housing 121 and a portion of the heat can also be dissipated via the cooling housing 121. However, it is also possible for the heat sinks 123 to extend partially through the receiving chamber 122 and not be connected to the cooling housing 121.

[0032] For example, the heat sinks 123, as shown in Fig. 1 and Fig. 2b, and the heat-conducting part 121 is constructed in one piece. This allows the number of individual parts to be reduced and the assembly process to be simplified. However, it is also possible for the heat sinks 123 and the cooling housing 121 to be constructed in one piece and bonded to the heat-conducting part 112 by means of a material fit, e.g., by welding or gluing. It is also conceivable for the heat sinks 123 to be constructed separately and each bonded firmly to the heat-conducting part 112 and the cooling housing 121 by means of a material fit.

[0033] For example, the heat sinks 123, as shown in Fig. 1 and Fig. 2b, are arranged at least in the cold end region 114 of the horizontal heat-conducting structure 11, whereby a problem-free dissipation of the heat of the heat-conducting part 112 in the cold end region 114 can be realized. In particular, a plurality of heat sinks 123 are distributed over the entire extension plane of the heat-conducting part 112, wherein the distribution density of the heat sinks 123 in the cold end region 114 is greater than the distribution density in the warm end region 113, whereby the thermal conductivity in the horizontal direction X can be comprehensively utilized in a targeted manner. Here, the distribution density of the heat sinks 123 represents the distribution number of the heat sinks 123 per unit area, because the greater the distribution density of the heat sinks 123 in an area, the more heat sinks 123 are arranged in this area and the easier it is to dissipate heat from this area.Of course, it is also possible for the heat sinks 123 to be arranged uniformly on the side of the heat conducting part 112 facing the cooling housing 121, as shown in . Fig. 2c is shown.

[0034] For example, the heat sink 123 is designed as a fin. Of course, any other configuration deemed appropriate by those skilled in the art is also conceivable, such as a serrated shape, a needle shape, or a wave shape.

[0035] For example, the cold end region 114 of the horizontal heat conduction structure 11, as shown in Fig. 1 and Fig. 2b, aligned with the inlet opening 124 of the cooling housing 121, whereby the temperature difference between the cooling medium and the heat sinks 123 arranged in the cold end region 114 can be increased, so that overall the cooling efficiency of the horizontal heat conduction structure 11 is increased.

[0036] For example, the cooling housing 121, as shown in Fig. 2a and Fig. 2c, is pot-shaped and has an opening open towards the heat-conducting part 112, wherein the cooling housing 121 has a flange part 126 on the outer circumference, wherein the cooling housing 121 is firmly connected to the heat-conducting part 112 of the horizontal heat-conducting structure 11 by means of the flange part, for example by means of screws or welding.

[0037] For example, the power supply module 100 further comprises a further cooling assembly for the heat-generating component 20, wherein the heat-generating component 20 can be arranged on the other cooling assembly in addition to being arranged in the warm end region 113 of the support part 111 of the cooling assembly 10, and the other cooling assembly can, for example, substantially implement a heat dissipation direction in the thickness direction Y.

[0038] The embodiments described above were explained only within the scope of the examples used to describe the present utility model. It is understood that individual features of the embodiments can be freely combined with one another, as long as technically feasible, without deviating from the scope of the present utility model.

[0039] Other advantages and alternative embodiments of the present utility model will be apparent to those skilled in the art. Therefore, in a broader sense, the present utility model is by no means limited to the details, representative structures, and examples shown and described. Rather, those skilled in the art may make various modifications and substitutions without departing from the basic spirit and scope of the present utility model.

Claims

[1] Cooling assembly (10) for a power supply module (100), characterized by that the cooling assembly (10) comprises at least the following: - a horizontal heat conduction structure (11), wherein the horizontal heat conduction structure (11) has a support part (111) and a heat conduction part (112) arranged opposite the support part (111) in the thickness direction (Y), wherein the support part is configured to be able to support a heat-generating component (20) of the power supply module (100), wherein the horizontal heat conduction structure (11), viewed in a horizontal direction (X), has at least one warm end region (113) and a cold end region (114) and is configured to be able to conduct the heat of the warm end region (113) at least substantially in the horizontal direction (X) to the cold end region (114); and - a cooling structure (12), wherein the cooling structure (12) comprises a cooling housing (121) and a plurality of heat sinks (123), the cooling housing (121) and the heat conducting part (112) together surround a receiving chamber (122) for a cooling medium and the heat sinks (123) are fixedly connected to the heat conducting part (112) and extend into the receiving chamber (122), wherein the cooling housing (121) has an inlet opening (124) and a drain opening (125), which are each connected to the receiving chamber (122). [2] Cooling assembly (10) according to claim 1, characterized by , that the horizontal heat conduction structure (11) forms a sealed steam chamber (115) between the support part (111) and the heat conduction part (112), wherein the steam chamber (115) has an evaporation section in the warm end region (113) and a condensation section in the cold end region (114), and a working medium capable of a phase change is located in the steam chamber (115), wherein the horizontal heat conduction structure (11) has a capillary layer (116) arranged at least on the side of the support part (111) facing the heat conduction part (112); or the horizontal heat conduction structure (11) is constructed as a pulsating heat pipe. [3] Cooling components (10) according to claim 1 or 2, characterized by , that the heat sinks (123) and the heat conducting part (112) are constructed in one piece; or the heat sinks (123) and the cooling housing (121) are constructed in one piece and are integrally connected to the heat conducting part (112); or the heat sinks (123) are constructed separately and are each connected by a material fit to the heat conducting part (112) and the cooling housing (121). [4] Cooling assembly (10) according to claim 1 or 2, characterized by , that the heat sinks (123) are arranged at least in the cold end region (114) of the horizontal heat conduction structure (11); and / or the distribution density of the heat sinks (123) in the cold end region (114) is greater than the distribution density in the warm end region (113), or the heat sinks (123) are arranged uniformly on the heat conducting part (112). [5] Cooling assembly (10) according to claim 1 or 2, characterized by , that the cold end region (114) of the horizontal heat conducting structure (11) is arranged aligned with the inlet opening (124) of the cooling housing (121); and / or the heat sinks (123) are constructed in a lamellar, serrated, needle-shaped or wave-shaped manner; and / or the heat sinks (123) extend completely through the receiving chamber (122) in the thickness direction (Y) and are connected to the cooling housing (121). [6] Cooling assembly (10) according to claim 1 or 2, characterized by , that the horizontal heat conducting structure (11) has a heat insulating region between the warm end region (113) and the cold end region (114); and / or the carrier part (111) and / or the heat-conducting part (112) are formed; and / or the cooling medium is water or air or another cooling liquid. [7] Cooling assembly (10) according to claim 1 or 2, characterized by that the cooling housing (121) is pot-shaped and has a flange part (126) on the outer circumference, wherein the cooling housing (121) is firmly connected to the heat-conducting part (112) of the horizontal heat-conducting structure (11) by means of the flange part (126). [8] Power supply module (100), characterized bythat the power supply module (100) comprises at least the following: - a cooling assembly (10) according to one of claims 1 to 7; - at least one heat-generating component (20), wherein the heat-generating component (20) is fixedly arranged on the support part (111) of the horizontal heat-conducting structure (11) of the cooling assembly (10); and - a potting capsule part (30), wherein the potting capsule part (30) is designed to enclose the heat-generating component (20). [9] Power supply module (100) according to claim 8, characterized by , that the heat-generating component (20) is arranged at least partially in the warm end region (113) of the horizontal heat-conducting structure (11); and / or the power supply module (100) comprises an additional cooling assembly for the heat-generating component (20). [10] Power supply module (100) according to claim 8 or 9, characterized bythat a thermally conductive adhesive is applied between the heat-generating component (20) and the carrier part (111); and / or the power supply module (100) is designed as an inverter or rectifier.

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