Electronic circuit and method for manufacturing an electronic circuit

Abstract

An electronic circuit comprises a printed circuit board (105), a plurality of thermal vias (140), and a plurality of electrical vias (145). The printed circuit board (105) has a first (110) and second metal layer (115), a first (120) and second insulating layer (125), and a backplate (130). The first insulating layer (120) is arranged between the first metal layer (110) and the second metal layer (115), with the second insulating layer (125) being arranged between the second metal layer (115) and the backplate (130). In an operational state of the electronic circuit (100), current is allowed to flow through the metal layers (110, 115). The thermal pad (135) is arranged, or can be arranged, on a top surface of the first metal layer (110) and is configured to dissipate heat from a component (150).The thermal vias (140) are arranged between the metal layers (110, 115) on the first insulating layer (120). The thermal vias (140) are covered by the thermal pad (135) and are designed to transfer heat from the first insulating layer (120) to a thermal island (160) in the second metal layer (115). The thermal island (160) is formed or can be formed on the second metal layer (115) when the electronic circuit (100) is operational. The electrical vias (145) are arranged or can be arranged between the metal layers (110, 115) on the first insulating layer (120).

Description

[0001] The present invention relates to an electronic circuit and to a method for manufacturing an electronic circuit.

[0002] Parasitic stray inductances can occur in power electronics.

[0003] Against this background, the present invention provides an improved electronic circuit and an improved method for manufacturing an electronic circuit according to the main claims. Advantageous embodiments are described in the dependent claims and the following description.

[0004] The advantages achievable with the approach presented here consist in particular of creating an electronic circuit that can reduce stray inductance, especially parasitic stray inductance.

[0005] An electronic circuit comprises a printed circuit board (PCB), at least one thermal pad, a plurality of thermal vias, and a plurality of electrical vias. The PCB includes a first metal layer, a second metal layer, a first insulating layer, a second insulating layer, and a backplate. The first insulating layer is positioned between the first metal layer and the second metal layer, with the second insulating layer positioned between the second metal layer and the backplate. In an operational state of the electronic circuit, current is permitted to flow through the metal layers. The thermal pad is located, or can be located, on the top surface of the first metal layer and is configured to dissipate heat from a component.The thermal vias are arranged between the metal layers of the first insulating layer. These thermal vias are covered by the thermal pad and are designed to transfer heat from the first insulating layer to a thermal island in the second metal layer. This thermal island is present or can be formed on the second metal layer when the electronic circuit is operational. The electrical vias are also present or can be formed between the metal layers of the first insulating layer.

[0006] The printed circuit board (PCB) can be manufactured cost-effectively and in large quantities. The metal layers can be of varying thicknesses or uniform. These metal layers can be made of copper or another metal. Copper can exhibit excellent thermal and electrical conductivity and is durable. The insulating layers can also be of varying thicknesses. For example, the first insulating layer can be thicker than the second. A distance hcc can be directly determined by the thickness of the first insulating layer. The insulating layers can be electrically and / or thermally insulating. The board can be at least twice as thick as either the metal layer or the insulating layer. The thermal pad can effectively dissipate heat generated, for example, at a component in an operational state of the electronic circuit.By using thermal vias directly beneath the thermal interface material (TIM), heat and voltage potential can be transferred through the first insulating layer to the thermal island on the second metal layer. The thermal island can be located at least partially adjacent to the thermal vias. The approach presented here can also be understood as a double-layer IMS design for low parasitic commutation loops and can describe a low-parasitic commutation loop design for high-efficiency power electronics using two-layer insulated metal substrates.

[0007] The plate can be designed to dissipate heat, particularly if the plate is made of aluminum. This ensures reliable heat dissipation.

[0008] The thermal island can be electrically insulated on or within the second metal layer. This allows generated heat to be dissipated via the thermal vias into the thermal island and then through the second insulating layer into the plate.

[0009] The electrical vias can be arranged around or within the thermal vias. Alternatively, the electrical vias can be arranged adjacent to the thermal vias. This allows for advantageous control of the current flow.

[0010] The electronic circuit may include a component that can be located, or arranged, on the side of the thermal pad opposite the first metal layer. This component may, for example, be a transistor, and may allow internal heat transfer to the thermal pad.

[0011] The base area of ​​the heat island can be smaller or larger than the base area of ​​the component. This allows for advantageous control over the current path.

[0012] The heat island can be at least partially covered by the building element, and additionally or alternatively, at least a portion of the heat island can remain uncovered by the building element. A portion of the heat island can also be at least partially laterally overlapped by the building element.

[0013] The electronic circuit can have multiple additional thermal vias and a further thermal pad. These additional thermal vias can be arranged between the metal layers of the first insulating layer. They can be covered by another thermal pad and designed to transfer heat from the first insulating layer to a further thermal island in the second metal layer. This further thermal island can be formed, or be formed, on the second metal layer when the electronic circuit is operational. The advantages of the approach described here can also be realized very efficiently with such an embodiment.

[0014] The electronic circuit may include an additional component, which may be located or positioned on the side of the additional thermal pad opposite the first metal layer. This additional component may be another transistor. The heat radiated by this additional component can be dissipated by the additional thermal pad.

[0015] A method for manufacturing an embodiment of an electronic circuit mentioned herein comprises a provisioning step and an assembly step. In the provisioning step, the printed circuit board (PCB) with the first metal layer, the second metal layer, the first insulating layer, the second insulating layer, and the board, as well as the at least one thermal pad, the thermal vias, and the electrical vias, are provided. In the assembly step, the thermal pad is placed on a top surface of the first metal layer, the thermal vias are placed on the first insulating layer, and the electrical vias are placed on the first insulating layer to manufacture the electronic circuit. The advantages of the approach described herein can also be realized very efficiently by such an embodiment.

[0016] The approach presented here further creates a device designed to perform, control, and implement the steps of a variant of the method presented here in appropriate facilities. This embodiment of the invention in the form of a device also allows the problem underlying the invention to be solved quickly and efficiently.

[0017] A device can be an electrical device that processes electrical signals, such as sensor signals, and outputs control signals accordingly. The device can have one or more suitable interfaces, which can be implemented in hardware and / or software. In the case of a hardware implementation, the interfaces can, for example, be part of an integrated circuit in which the device's functions are implemented. The interfaces can also be separate integrated circuits or consist at least partially of discrete components. In the case of a software implementation, the interfaces can be software modules that are present, for example, on a microcontroller alongside other software modules.

[0018] It is also advantageous to have a computer program product with program code that can be stored on a machine-readable medium such as semiconductor memory, hard disk memory or optical memory and is used to carry out the method according to one of the embodiments described above when the program is executed on a computer or device.

[0019] The invention is explained in more detail by way of example with reference to the accompanying drawings. These show: Fig. 1 a schematic representation of an embodiment of an electronic circuit; Fig. 2 a schematic representation of an embodiment of an electronic circuit; Fig. 3 a schematic representation of an embodiment of an electronic circuit; Fig. 4 a schematic representation of an embodiment of an electronic circuit; Fig. 5 a schematic representation of an embodiment of an electronic circuit; Fig. 6 a schematic representation of an embodiment of an electronic circuit; Fig. 7 a schematic representation of an embodiment of an electronic circuit; Fig. 8 a flowchart of an exemplary embodiment of a method for manufacturing an electronic circuit; Fig. 9 a block diagram of an exemplary embodiment of a control device for manufacturing an electronic circuit; Fig. 10 a circuit diagram of an exemplary embodiment of an electronic circuit; and Fig. 11 a representation of an exemplary embodiment of an electronic circuit.

[0020] In the following description of preferred embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, without repeating these elements.

[0021] Fig. Figure 1 shows a schematic representation of an embodiment of an electronic circuit 100. More precisely, a longitudinal section through the electronic circuit 100 is shown.

[0022] The electronic circuit 100 comprises a printed circuit board 105 with a first metal layer 110, a second metal layer 115, a first insulating layer 120, a second insulating layer 125, and a plate 130. Additionally, the electronic circuit 100 comprises at least one thermal pad 135, a plurality of thermal vias 140, and a plurality of electrical vias 145. Optionally, the electronic circuit 100 comprises a component 150 and / or another component 155.

[0023] The first insulating layer 120 is arranged between the first metal layer 110 and the second metal layer 115. The second insulating layer 125 is arranged between the second metal layer 115 and the plate 130. The metal layers 110 and 115 are shown to have the same thickness only as an example. The second insulating layer 125 is shown to be thinner than the first insulating layer 120 only as an example.

[0024] The thermal pad 135 is arranged on a top surface of the first metal layer 110. The electrical vias 145 are arranged between the metal layers 110 and 115 on the first insulating layer 120, with the thermal vias 140 also being arranged between the metal layers 110 and 115 on the first insulating layer 120. The thermal vias 140 are located within the area of ​​the thermal pad 135, while the electrical vias 145 are located outside the area of ​​the thermal pad 135.

[0025] According to one embodiment, the component 150 is arranged on a top side of the thermal pad 135, wherein the component 150 is only exemplified as a transistor.

[0026] In an operational state, the electronic circuit 100, component 150, generates heat. The heat emanating from component 150 is dissipated by the thermal pad 135 and transferred to the first metal layer 110. From the first metal layer 110, the heat is transferred to the thermal vias 140 arranged in the first insulating layer 120. Six thermal vias 140 are shown only as an example. Below the thermal vias 140 in the second metal layer 115, a thermal island 160 forms in the second metal layer 115 in the operational state of the electronic circuit 100. The heat from the thermal vias 140 is transferred to this thermal island. The thermal island 160 and the thermal vias 140 have, for example, the same width, with the thickness of the thermal island 160 corresponding to the thickness of the second metal layer 115 only as an example.

[0027] According to one embodiment, the electronic circuit has 100 additional electrical vias 165, additional thermal vias 170 and an additional thermal pad 175.

[0028] The additional thermal vias 170 are arranged, for example, on the first insulating layer 120. The additional thermal pad 175 is arranged, for example, on a top surface of the first metal layer 110, with the additional thermal vias 170 being located in the region of the additional thermal pad 175. The additional component 155 is arranged, for example, on a top surface of the additional thermal pad 175, with the additional component 155 being, for example, configured as an additional transistor. According to one embodiment, the additional electrical vias 165 are arranged on or in the first insulating layer 120, adjacent to the additional thermal vias 170.

[0029] The additional component 155 heats up, for example, when the electronic circuit 100 is in an operational state. The heat emanating from the additional component 155 is dissipated by the additional thermal pad 175 and transferred to the first metal layer 110. From the first metal layer 110, the heat is transferred to the additional thermal vias 170 arranged in the first insulating layer 120. Below the additional thermal vias 170 in the second metal layer 115, a further thermal island 180 forms in the second metal layer 115 when the electronic circuit 100 is in an operational state, and the heat from the additional thermal vias 170 is transferred to this thermal island.The additional thermal island 180 and the additional thermal vias 170, for example, have an identical width, with the thickness of the additional thermal island 180 merely corresponding to the thickness of the second metal layer 115 as an example.

[0030] With regard to component 150, the thermal vias 140 are arranged centered in the first insulating layer 120 only as an example. The other thermal vias 170 are also arranged centered in the first insulating layer 120 with regard to the other component 155, for example.

[0031] For example, the thermal pad 135 and the component 150, as well as the further thermal pad 175 and the further component 155, have the same width.

[0032] Adjacent to the further component 155, according to one embodiment, an additional component 185 is arranged, which is designed only by way of example as a snubber capacitor.

[0033] In the operational state of the electronic circuit 100, for example, a current path 198 flows through the printed circuit board 105, where the current path 198 is only shown by way of arrows for illustrative purposes. Starting from the additional component 185, the current path 198 flows through the first metal layer 110 to the electrical vias 145, through the electrical vias 145 to the second metal layer 115, and through the second metal layer 115. In the second metal layer 115, the current path 198 is routed past the thermal islands 160, 180, as shown only by way of example in the figure. Fig. Figure 2 shows the current path 198 from the second metal layer 115 to the further electrical vias 165 and through the further electrical vias 165 back to the first metal layer 110.

[0034] In other words, it shows Fig. 1. A special design to maintain the hcc distance ( Fig. 11) to reduce the two current paths 198 through the printed circuit board 105, which can also be described as a 2-layer IMS, without significantly reducing its thermal performance. The printed circuit board 105 consists of the first metal layer 110, which can also be described as the outer copper layer 1, the first insulating layer 120, the second metal layer 115, which can also be described as the inner copper layer 2, the second insulating layer 125, and the plate 130, which can also be described as the aluminum base plate. The plate 130 is designed for heat dissipation.The distance hcc is directly determined by the thickness of the first insulating layer 120, since the current path 198 flows through the additional component 185, which can also be called a surface-mounted capacitor, plus the components 150, 155 on the first metal layer 110, which can also be called outer layer 1, and on the second metal layer 115, which can also be called inner layer 2, back to the additional component 185. The cross-section with the current path 198 on the second metal layer 115, which is represented by arrows, is shown in . Fig. 2 shown.

[0035] In the approach presented here, bottom-cooled components 150, 115 are used, which allow internal heat transfer to their thermal pads 135, 175. By using thermal vias 140, 170 directly beneath the thermal pads 135, 175, the heat and voltage potential are transferred through the first insulating layer 120 to the thermal islands 160, 180 on the second metal layer 115. The thermal islands 160, 180 are electrically isolated from the main current path on the second metal layer 115. This design dissipates the heat generated during operation of the components 150, 155 via the thermal vias 140, 170 into the thermal islands 160, 180 and then via the second insulating layer 125 into the plate 130, which can also be referred to as the aluminum base plate.

[0036] Due to the isolated thermal islands 160, 180 on the second metal layer 115, the return current flows around the thermal islands 160, 180 through the electrical vias 145, 165 back to the first metal layer 110. a

[0037] To further reduce the thermal resistance between the components 150, 155 and the plate 130, the thermal islands 160, 180 and thermal vias 140, 170 are enlarged. This has a direct influence on the current path 198 in the second metal layer 115, thereby also increasing the leakage inductance LCC due to longer return current paths and reduced flux cancellation effects, directly controlled by the vertical alignment between the current path 198 on the first metal layer 110 and the current path 198 on the second metal layer 115, where the current path 198 on the second metal layer 115 can also be referred to as the return current path.

[0038] In other words, when designing power electronics for fast-switching applications, such as a gallium nitride transistor, correct layout design is a crucial aspect to consider. Due to the in Fig. 1 to Fig. The layout geometry of the current path 198 shown in Figure 7 reduces or prevents parasitic stray inductances, thus leaving the switching behavior of the fast-switching power electronics unaffected.

[0039] Fig. Figure 2 shows a schematic representation of an embodiment of an electronic circuit 100. More precisely, a section of a top view of the electronic circuit 100 is shown. The electronic circuit 100 is similar to or corresponds to the electronic circuit from [reference missing]. Fig. 1.

[0040] Shown is a top view of the second metal layer 115, through which the current path 198 flows. The current path 198 flows past the heat islands 160, 180.

[0041] The thermal islands 160, 180 are formed in the second metal layer 115, with the thermal vias 140, 170 arranged above the thermal islands 160, 180. The thermal islands 160, 180 and the thermal vias 140, 170 have the same base area. The components 150, 155 have a larger base area than the thermal islands 160, 180.

[0042] Fig. Figure 3 shows a schematic representation of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar to or corresponds to the electronic circuit from Fig. 1, except that the electrical vias 145 are arranged on or in the thermal vias 140 and only the further heat island 180 is formed.

[0043] The electrical vias 145 are arranged, for example, within the thermal vias 140. In an operational state, only the additional thermal island 180 is thus formed. The current path 198 flows through one half of the thermal vias 140 and the electrical vias 145. Subsequently, the current path 198 flows past the additional thermal island 180 to the additional electrical vias 165.

[0044] In other words, it shows Fig. 4. A further reduction of the leakage inductance LCC is achieved by utilizing the thermal vias 140 of the component 150 also for the direct current flow 198 from the first metal layer 110 to the second metal layer 115. The cross-section of this design option is shown. This modification is only possible for component 150, since its thermal conductivity path has the same electrical potential as the current path 198 on the second metal layer 115. Otherwise, a short circuit would occur in the other component 155, which would necessitate the use of the additional thermal interface 180.

[0045] Fig. Figure 4 shows a schematic representation of an embodiment of an electronic circuit 100. More precisely, a section of a top view of the electronic circuit 100 is shown. The electronic circuit 100 is similar to or corresponds to the electronic circuit from [reference missing]. Fig. 3.

[0046] Shown is a top view of the second metal layer 115, through which the current path 198 flows. The current path 198 flows through the electrical vias 145 arranged in the thermal vias 140, although, for illustrative purposes, the current path 198 flows through only half of the vias 140, 145. The current path 198 then flows past the further thermal island 180 to the further electrical vias 165. The further thermal island 180 is similar to or corresponds, for example, to the one shown in Fig. 2 further heat islands shown.

[0047] Fig. Figure 5 shows a schematic representation of an embodiment of an electronic circuit 100. More precisely, a section of a top view of the electronic circuit 100 is shown. The electronic circuit 100 is similar to or corresponds to the electronic circuit from [reference missing]. Fig. 4, except that the base area of ​​the further heat island is 180 smaller.

[0048] The current path 198 flows past the further heat island 180. The further heat island 180 is, for example, half the size of the further heat island in Fig. 4. The further heat island 180 therefore has a base area that is half the size of the base area of ​​the further building element 155.

[0049] In other words, it shows Fig. 5 Another possibility for designing the current path 198 and thermal path in such a way as to further reduce the leakage inductance LCC is to arrange the additional thermal island 180 slightly offset below the additional component 155. This reduces the length of the current path 198 on the second metal layer 115 and improves the alignment between the current path on the first metal layer, which can also be referred to as the outer copper layer 1, and the current path on the second metal layer 115, thus suppressing flux.

[0050] Fig. Figure 6 shows a schematic representation of an embodiment of an electronic circuit 100. More precisely, a section of a top view of the electronic circuit 100 is shown. The electronic circuit 100 is similar to or corresponds to the electronic circuit from [reference missing]. Fig. 5, except that the further heat island 180 protrudes from the additional building element 155.

[0051] Current path 198 is merely an example of an identical current path to the one in Fig. 5, except that the further heat island 180 protrudes at least partially from the further building element 155. The base area of ​​the further heat island 180 corresponds, for example, to that of the further heat island made of Fig. 2 and / or Fig. 4.

[0052] In other words, the further heat island 180 is extended further over the outline of the further component 155 to improve heat propagation in the second metal layer 115.

[0053] Fig. Figure 7 shows a schematic representation of an embodiment of an electronic circuit 100. More precisely, a section of a top view of the electronic circuit 100 is shown. The electronic circuit 100 is similar to or corresponds to the electronic circuit from [reference missing]. Fig. 5 and / or Fig. 6, except that the further heat island 180 is divided into two parts 700, 705.

[0054] The further heat island 180 is, for example, divided, such that each part 700, 705 of the further heat island 180 protrudes at least partially from the further component 155, and a gap 710 is formed between the two parts 700, 705 of the further heat island 180. The current path 198 thus runs, for example, in a straight line through the gap 710.

[0055] In other words, the additional thermal island 180 is divided into two separate islands 700 and 705 to improve the current path 198 on the second metal layer 115, which can also be referred to as the inner copper layer 2. In this case, the return current path runs directly beneath the additional component 115, which further improves the leakage inductance LCC.

[0056] Fig. Figure 8 shows a flowchart of an embodiment of a method 800 for manufacturing an electronic circuit. The electronic circuit is similar to or corresponds to the electronic circuit shown in one of the figures described above.

[0057] Method 800 comprises a provisioning step 805 and an assembly step 810. In provisioning step 805, the printed circuit board is provided, comprising the first metal layer, the second metal layer, the first insulating layer, the second insulating layer, and the board, as well as the at least one thermal pad, the thermal vias, and the electrical vias. In assembly step 810, the thermal pad is placed on a top surface of the first metal layer, the thermal vias are placed on the first insulating layer, and the electrical vias are placed on the first insulating layer to fabricate the electronic circuit.

[0058] Fig. Figure 9 shows a block diagram of an exemplary embodiment of a control device 900 for manufacturing an electronic circuit. The control device 900 is designed to perform the method described above. Fig. 8 or a similar procedure to target and / or execute.

[0059] The control device 900 comprises a provisioning unit 905 and an assembly unit 910. The provisioning unit 905 is configured to provide the printed circuit board with the first metal layer, the second metal layer, the first insulating layer, the second insulating layer, and the board, as well as the at least one thermal pad, the thermal vias, and the electrical vias. The assembly unit 910 is configured to position the thermal pad on the top surface of the first metal layer, the thermal vias on the first insulating layer, and the electrical vias on the first insulating layer to assemble the electronic circuit.

[0060] Fig. Figure 10 shows a circuit diagram of an exemplary embodiment of an electronic circuit 100. The electronic design of the electronic circuit 100 resembles or corresponds to one of the figures described above.

[0061] The electronic circuit 100 has a first supply voltage connection 1002 and a second supply voltage connection 1004, with a capacitor 1006 connected between the supply voltage connections 1002, 1004.

[0062] The electronic circuit 100, for example, comprises a bridge circuit unit 1000, which includes a first half-bridge 1005 and a snubber capacitor 1010, consisting of the capacitor 1055 and its series resistor 1060. The first half-bridge 1015 has a first switch 1015 (high-side switch) and a second switch 1020 (low-side switch), wherein the switches 1015 and 1020 are connected to each other via a tap point 1025. The first switch 1015 is a high-side switch and the second switch 1020 is a low-side switch; the switches 1015 and 1020 are implemented as transistors.

[0063] The first switch 1015, for example, represents the additional component 155, and the second switch 1020 represents the additional component 185. The electronic circuit 100 comprises, for example, a first comparator 1030 and a second comparator 1035. The first comparator 1030 is connected, for example, to the first switch 1015, with a first inductor 1040 connected between the first switch 1015 and the first comparator 1030. The second comparator 1035 is connected, for example, to the second switch 1020, with a second inductor 1045 connected between the second switch 1020 and the second comparator 1035.

[0064] The second switch 1020, together with the second inductor 1045 and the second comparator 1035, forms, for example, a gate loop 1050, which can also be called a gateloop.

[0065] The current return path with snubber capacitor 1010 includes the component 150, where the component 150 represents a series circuit of a capacitor 1055 and a resistor 1060.

[0066] For example, a third inductor 1065 is connected between the first half-bridge 1005 and the second half-bridge 1010, which can also be referred to as leakage inductance and / or Lcc.

[0067] In an operational state, the current path 198 runs, as it does, for example, in Fig. 1 is described by the bridge circuit unit 1000 and forms a commutation loop 1070.

[0068] In other words, it shows Fig. 10. The most common parasitic leakage inductances. In fast-switching applications, the leakage inductance LCC of current path 198 has the greatest influence on the switching behavior and is reduced by a correct layout, as is the case, for example, in the Fig. 1 is shown and described.

[0069] Fig. Figure 11 shows an embodiment of an electronic circuit 100. The electronic circuit 100 is similar to or corresponds to the electronic circuit shown in one of the figures described above. In other words, it shows Fig. 11 a minimalist vertical commutation loop and its geometric parameters.

[0070] The current path 198, which runs along the circuit board 105, is shown. All four parameters I cc , h cc , w cc and t cc have a direct influence on the total leakage inductance Lcc. The height h cc , which is also known as distance h cc The current path 198 of the vertical commutation loop is significantly reduced in order to also reduce the corresponding leakage inductance Lcc.

[0071] The parameter Icc represents, for example, the length of the electronic circuit 100, hcc represents, for example, the height of the electronic circuit 100, wcc the width and tcc the thickness.

[0072] The embodiments described and shown in the figures are only examples. Different embodiments can be combined completely or with respect to individual features. An embodiment can also be supplemented by features from another embodiment.

[0073] Furthermore, the process steps according to the invention can be repeated and carried out in a different order than described.

[0074] If an embodiment includes an “and / or” connection between a first feature and a second feature, this can be interpreted as meaning that the embodiment according to one embodiment has both the first feature and the second feature, and according to another embodiment either only the first feature or only the second feature. Reference sign 100 electronic circuits 105 circuit board 110 first metal layer 115 second metal layer 120 first insulating layer 125 second insulating layer 130 plate 135 thermal pads 140 thermal vias 145 electrical vias 150 building elements 155 additional building element 160 Heat island 165 additional electrical vias 170 additional thermal vias 175 additional thermal pads 180 more heat islands 185 additional component 198 power path 700 Part One 705 Part Two 710 space 800 methods for manufacturing an electronic circuit Step 805 of deployment 810 Step of Arranging 900 Control device for manufacturing an electronic circuit 905 units for provision 910 Unit for arranging 1000 bridge circuit units 1002 first supply voltage connection 1004 second supply voltage connection 1005 first half-bridge 1006 Capacitor 1010 Snubber capacitor 1015 first switch 1020 second switch 1025 Tapping point 1030 first comparator 1035 second comparator 1040 first inductance 1045 second inductance 1050 gate loop 1055 Capacitor 1060 resistor 1065 third inductance 1070 Commutation loop Lcc stray inductance ICC length wcc width hcc height tcc thickness

Claims

[1] Electronic circuit (100) having the following features: a printed circuit board (105) with a first metal layer (110), a second metal layer (115), a first insulating layer (120), a second insulating layer (125) and a plate (130), wherein the first insulating layer is arranged between the first metal layer (110) and the second metal layer (115), wherein the second insulating layer is arranged between the second metal layer (115) and the plate (130), wherein in an operational state of the electronic circuit, current flow through the metal layers (110, 115) is enabled; at least one thermal pad (135) which is or can be arranged on a top surface of the first metal layer (110) and is designed to dissipate heat from a component (150); a plurality of thermal vias (140) arranged between the metal layers (110, 115) on the first insulating layer (120), wherein the thermal vias (140) are covered by the thermal pad (135) and are designed to transfer heat from the first insulating layer (120) to a thermal island (160) in the second metal layer (115), wherein the thermal island (160) is formed or can be formed on the second metal layer (115) in an operational state of the electronic circuit; and a plurality of electrical vias (145) which are arranged or can be arranged between the metal layers (110, 115) on the first insulating layer (120). [2] Electronic circuit (100) according to claim 1, wherein the plate (130) is designed to dissipate heat, in particular wherein the plate (130) is made of aluminium as a material. [3] Electronic circuit (100) according to one of the preceding claims, wherein the heat island (160) is or can be formed electrically insulated on or in the second metal layer (115). [4] Electronic circuit (100) according to one of the preceding claims, wherein the electrical vias (145) are arranged around or in the thermal vias (140) or wherein the electrical vias (145) are arranged adjacent to the thermal vias (140). [5] Electronic circuit (100) according to one of the preceding claims, comprising a component (150) which is arranged or can be arranged on one of the component sides of the thermal pad (135) opposite the first metal layer (110). [6] Electronic circuit (100) according to one of the preceding claims, wherein a base area of ​​the heat island (160) is smaller or larger than a base area of ​​the component (150). [7] Electronic circuit (100) according to one of claims 5 to 6, wherein the heat island (160) is at least partially covered by the component (150) and / or wherein at least a partial area of ​​the heat island (160) is not covered by the component (150). [8] Electronic circuit (100) according to one of the preceding claims, comprising a plurality of further thermal vias (170) and a further thermal pad (175), wherein the further thermal vias (170) are arranged between the metal layers (110, 115) on the first insulating layer (120), wherein the further thermal vias (170) are covered by the further thermal pad (175) and are designed to transfer heat from the first insulating layer (120) to a further thermal island (180) in the second metal layer (115), wherein the further thermal island (180) is formed or can be formed on the second metal layer (115) in an operational state of the electronic circuit. [9] Electronic circuit (100) according to claim 8, comprising a further component (155) which is arranged or can be arranged on one of the component sides of the further thermal pad (175) opposite the first metal layer (110). [10] Method (800) for manufacturing an electronic circuit (100) according to any one of claims 1 to 9, wherein the method (800) comprises the following steps: Providing (805) the printed circuit board (105) with the first metal layer (110), the second metal layer (115), the first insulating layer (120), the second insulating layer (125) and the board (130), as well as providing (805) the at least one thermal pad (135), the thermal vias (140) and the electrical vias (145); and Arranging (810) the thermal pad (135) on a top surface of the first metal layer (110), the thermal vias (140) on the first insulating layer (120) and arranging (8410) the electrical vias (145) on the first insulating layer (120) to create the electronic circuit (100). [11] Control device (900) configured to perform and / or control the steps (805, 810) of the method (800) according to claim 10 in corresponding units (905, 910). [12] Computer program product with program code for carrying out the method (800) according to claim 10, when the computer program product is executed on a control device (900). [13] Machine-readable storage medium on which the computer program according to claim 12 is stored.

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