Chiplet-based system for a technical system
The chiplet-based system with integrated measurement adapters addresses the challenge of accessing internal signals and ensuring interference-free data transmission, enabling accurate and reliable measurement and monitoring in vehicle and aircraft ECUs.
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-09-16
- Publication Date
- 2026-03-19
AI Technical Summary
Existing electronic control unit (ECU) architectures in vehicles and aircraft face challenges in accessing internal signals and ensuring interference-free data transmission between multiple semiconductor chips, limiting measurement and monitoring capabilities.
A chiplet-based system with integrated measurement adapters on a substrate, utilizing die-to-die interfaces and non-interactive coupling elements, allows direct access to internal signals and interference-free data routing between chiplets and a circuit board, enhancing measurement and monitoring capabilities.
Enables accurate and reliable measurement of internal signals, minimizes transmission delays, and ensures stable operation by providing direct access and interference-free data transfer within the chiplet-based system.
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Abstract
Description
[0001] The invention relates to a chiplet-based system for a technical system. State of the art
[0002] Today's electronic control unit (ECU) architecture in technical systems such as vehicles or aircraft is characterized by one or more computing devices connected via Ethernet, PCIe, or other high-speed interfaces. Increasing integration is leading to so-called chiplet or multi-chip architectures, which integrate multiple dies (chips) on a single substrate. Disclosure of the invention
[0003] The invention relates to a chiplet-based system with the features of claim 1. Further features and details of the invention will become apparent from the respective dependent claims, the description and the drawings.
[0004] The invention relates in particular to a chiplet-based system for a technical system, especially for a vehicle or aircraft, comprising: - At least two chiplets, wherein the at least two chiplets are connected to each other via a respective interface, in particular a die-to-die interface, - A substrate in which connections from the chiplet-based system to a printed circuit board of an electronic control unit (ECU) are provided, wherein at least one measurement adapter is arranged between the chiplet-based system and the printed circuit board of the electronic control unit.
[0005] A chiplet is, in particular, a small, self-contained semiconductor chip that can be used as part of a larger system or circuit. Chiplets can be developed, tested, and produced independently and then assembled in a larger application. A die-to-die interface is, in particular, a connection between two or more semiconductor chips (also known as "dies") that enables them to communicate and exchange data. The die-to-die interface according to the present invention is preferably wired but can also be wireless. An electronic control unit is, in particular, an electronic component used in vehicles, machines, and other technical devices to control and regulate various functions.The electronic control unit receives signals from various sensors, processes these signals, and outputs corresponding control signals to actuators and other components. The electronic control unit can be programmable and, depending on the application, can perform various functions, such as controlling the engine, brakes, steering, lighting, and air conditioning. The measurement adapter is positioned between the chiplet-based system and a measuring device to acquire signals from the chiplet-based system and forward them to the measuring device. Depending on the application, the measurement adapter can support different measurement methods, such as voltage, current, or frequency measurements.The chiplet-based system according to the invention can advantageously access internal signals via the integrated measurement adapter, signals which would not be accessible in a conventional monolithic SoC (System-on-Chip) design. These measurement capabilities make it possible to analyze and monitor the operation of the chiplet-based system.
[0006] Advantageously, the invention provides that the at least one measurement adapter is arranged in the substrate and connected to the respective interface. In this way, the measurement adapter can be directly connected to the data flow between the chiplets. This allows internal signals of the chiplet-based system to be advantageously forwarded directly to a measuring device. This can minimize delays and improve the accuracy of measurement data acquired by means of the measurement adapter.
[0007] Furthermore, the at least one measurement adapter may be designed to route data traffic between the chiplets to the circuit board of the electronic control unit. Thus, the at least one measurement adapter can serve as a connecting element to direct data streams from the chiplets to the circuit board of the electronic control unit. This can enable the transfer of information between the individual chiplets to an external measuring device.
[0008] Advantageously, the invention provides that the at least one measurement adapter is designed to be non-interactive, thus ensuring interference-free transmission between the chiplets. For this purpose, the at least one measurement adapter can, for example, be designed as a high-impedance and / or capacitive coupling element. This can have the advantage that the internal functionality of the chiplet-based system is not impaired. The non-interactive design of the at least one measurement adapter can prevent or at least reduce interference with the signal paths between the chiplets, leading to reliable data transmission and thus stable system operation.
[0009] According to an advantageous embodiment of the invention, the chiplet-based system may further comprise a processing device configured to perform a configuration of the chiplet-based system and / or a filtering of signals from the chiplet-based system via the at least one measurement adapter. During configuration, it may be possible, for example, to configure or select which signals are to be read out via the measurement adapter, and this can be done individually according to a given requirement. The processing device can provide improved control over the signal readout and optimization of signal quality.
[0010] Furthermore, within the scope of the invention, it is optionally possible for the chiplet-based system to also have a measurement connector that is connected to the processing device, wherein the processing device is configured to forward the signals to the measurement connector, and the measurement connector provides an interface for externally reading the signals. This allows external devices to access the processed signals via the measurement connector, which can be helpful, for example, for analyzing functionality or diagnosing hardware problems of the chiplet-based system.
[0011] Another possibility is that the chiplet-based system also includes a network-on-chip component, with at least one measurement adapter connected to an output of this component. This allows the chiplet-based system to have an internal network for data transfer between the chiplets. Integrating the measurement adapters at an output of the network-on-chip component enables, in particular, monitoring of the data flow within the network. This allows for the analysis and optimization of network performance.
[0012] It is possible that the chiplet-based system according to the invention is used in a vehicle. The vehicle can be, for example, a motor vehicle and / or passenger vehicle and / or autonomous vehicle. The vehicle can have vehicle equipment, for example, for providing an autonomous driving function and / or a driver assistance system. The vehicle equipment can be designed to control the vehicle at least partially automatically and / or accelerate and / or brake and / or steer.
[0013] It is also possible that the chiplet-based system according to the invention will be used in an aircraft.
[0014] Further advantages, features, and details of the invention will become apparent from the following description, in which exemplary embodiments of the invention are described in detail with reference to the drawings. The features mentioned in the claims and in the description can each be essential to the invention individually or in any combination. The drawings show: Fig. 1 a schematic visualization of a technical system with a chiplet-based system according to exemplary embodiments of the invention, Fig. 2 a schematic representation of a chiplet-based system in a top view, Fig. 3 A schematic representation of a chiplet-based system with measurement technology adapters in a sectional view.
[0015] In Fig. 1 is a technical system 100 with a chiplet-based system 1 comprising a network-on-chip (NoC) component 11 which connects a basic chiplet 2a with further chiplets 2b, 2c, schematically represented according to embodiments of the invention.
[0016] Fig. Figure 2 shows a schematic representation of a chiplet-based system 1 according to exemplary embodiments in a top view. Here, four chiplets 2 are arranged on a substrate 4 and connected by die-to-die interfaces 3.
[0017] According to exemplary embodiments of the invention, a design is described which extends the structure of a chiplet-based system 1 by measuring technology adapters 5, which are in particular non-reactive to the overall system.
[0018] By eliminating the integration of the connections between chiplets 2 in the chiplet-based system 1 according to the invention on a monolithic silicon substrate, instead routing or connecting them via the substrate 4, new degrees of freedom can be provided to access internal signals for measurement technology that would not be accessible in a monolithic design.
[0019] In a typical monolithic SoC (System-on-Chip) configuration, the modules integrated within the SoC are primarily connected via SoC-internal buses that are not routed externally to a substrate. Signals routed via the substrate to a printed circuit board (PCB) of an electronic control unit (ECU) are primarily functional inputs and outputs, e.g., PCIe, Ethernet, MIPI, etc.
[0020] Advantageously, according to exemplary embodiments, a simple and non-reactive extension of the chiplet-based system 1 to include measurement capability can be provided by adding the measurement adapters 5 to the substrate 4, as shown in Fig. 3 shown in a sectional view. Fig.Figure 3 further shows regular connections 9 between the chiplets 2 and a printed circuit board (PCB) of an electronic control unit (ECU) 6. The measurement adapters 5 can be connected as additional connections between the chiplets 2 and the printed circuit board of the electronic control unit 6, particularly at the connection points of the die-to-die interfaces 3. According to exemplary embodiments, the measurement adapters 5 are integrated into the substrate 4 and are configured to transmit data between the chiplets 2 and the printed circuit board of the electronic control unit 6. The measurement adapters 5 can be high-impedance and / or capacitive coupling elements to avoid interfering with the data transmission between the chiplets 2.All signals from the measurement adapters 5 can be routed to a processing device 7, which can configure the chiplet-based system 1 and / or filter the signals. Furthermore, the processing device 7 can forward the signals to a measurement connector 8.
[0021] Functionally, the measurement technology adapters 5 are preferably arranged at an output of a Network-on-Chip (NoC) component 11, which connects a basic chiplet 2a with further chiplets 2b, 2c, wherein the basic chiplet 2a is designed in particular for central management in the chiplet-based system 1.
[0022] The preceding explanation of the embodiments describes the present invention solely by way of examples. Naturally, individual features of the embodiments can be freely combined with one another, provided this is technically feasible, without departing from the scope of the present invention.
Claims
[1] Chiplet-based system (1) for a technical system (100), comprising: - At least two chiplets (2), wherein the at least two chiplets (2) are connected to each other via a respective interface (3), in particular a die-to-die interface, - A substrate (4) in which connections (9) from the chiplet-based system (1) to a printed circuit board of an electronic control unit (6) are provided, wherein at least one measurement adapter (5) is arranged between the chiplet-based system (1) and the printed circuit board of the electronic control unit (6). [2] Chiplet-based system (1) according to claim 1, characterized by , that at least one measurement technology adapter (5) is arranged in the substrate (4) and connected to the respective interface (3). [3] Chiplet-based system (1) according to any one of the preceding claims, characterized by, that at least one measurement technology adapter (5) is designed to direct data traffic between the chiplets (1) to the circuit board of the electronic control unit (6). [4] Chiplet-based system (1) according to any one of the preceding claims, characterized by , that at least one measurement technology adapter (5) is designed to be non-reactive, so that interference-free transmission between the chiplets (2) is ensured. [5] Chiplet-based system (1) according to any one of the preceding claims, characterized by , that the chiplet-based system (1) further comprises a processing device (7) which is configured to perform a configuration of the chiplet-based system (1) and / or a filtering of signals of the chiplet-based system (1) via the at least one measurement technology adapter (5). [6] Chiplet-based system (1) according to claim 5, characterized by, that the chiplet-based system (1) further comprises a measurement connector (8) which is connected to the processing device (7), wherein the processing device (7) is configured to forward the signals to the measurement connector (8), wherein the measurement connector (8) provides an interface for externally reading the signals. [7] Chiplet-based system (1) according to any one of the preceding claims, characterized by , that the chiplet-based system (1) further comprises a network-on-chip component (11) and the at least one measurement adapter (5) is arranged at an output of the network-on-chip component (11).
Citation Information
Patent Citations
Backside Interconnection Interface Die For Integrated Circuits Package
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