LIQUID-COOLED NETWORK INTERFACE CONTROLLER (NIC) ARRANGEMENT

Abstract

Assemblies and methods of manufacturing are provided for a liquid-cooled network interface controller (NIC) assembly configured to receive and operatively engage a transceiver module. An exemplary liquid-cooled NIC assembly includes a PCB, a first thermally conductive member supported by the PCB, and a second thermally conductive member supported by the first thermally conductive member. The first thermally conductive member is thermally isolated from the second thermally conductive member. A liquid cooling unit can thermally engage the first thermally conductive member and the second thermally conductive member.The first thermally conductive member and the second thermally conductive member are configured to conduct heat to the liquid cooling unit such that the liquid cooling unit can dissipate heat from the first thermally conductive member and the second thermally conductive member.

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