temperature sensor

Abstract

The present disclosure provides a temperature sensor comprising: a base for mounting on a part to be detected; a temperature-sensitive element attached to the base; and a printed circuit board attached to the base and to which the temperature-sensitive element (2) is electrically connected. The temperature sensor proposed by the present disclosure eliminates the conventional structure in which a temperature-sensitive element is mounted on a printed circuit board, but separates the temperature-sensitive element from the printed circuit board so that it is arranged as close as possible to the component to be detected.

Description

Technical field

[0001] The present invention relates to a temperature sensor. background

[0002] Temperature sensors are widely used in various devices to measure the temperature of components. With technological advancements and increasing measurement requirements, some temperature sensors must also transmit a sensor signal via their internal antennas to a receiving component or even a cloud platform for further processing. Therefore, higher demands are being placed on the temperature measurement accuracy and signal transmission quality of the temperature sensor.

[0003] Many factors influence the temperature sensing accuracy and signal transmission quality of a temperature sensor. For example, more sensitive temperature-sensitive elements, antennas with higher transmission power, etc., can often be used, but these solutions can significantly increase the cost and structural complexity of the temperature sensor.

[0004] Therefore, there is a desire in the engineering sector for a solution that can improve the performance of temperature sensors at lower costs and with a simpler design. Summary

[0005] In response to the problems and requirements mentioned above, the present disclosure proposes a new technical solution that solves the problems mentioned above and offers further technical advantages by adopting the following technical effects.

[0006] The present disclosure provides a temperature sensor comprising: a base for attaching to a part to be detected; a temperature-sensitive element attached to the base; a printed circuit board attached to the base and to which the temperature-sensitive element (2) is electrically connected.

[0007] The temperature sensor proposed by the present disclosure eliminates the conventional structure of attaching a temperature-sensitive element to a printed circuit board, but separates the temperature-sensitive element from the printed circuit board in order to be positioned as close as possible to the component to be detected. Brief character description Fig. Figure 1 is an exploded view of a temperature sensor according to a preferred embodiment of the present disclosure; Fig. Figure 2 is a view of the interior of the assembled temperature sensor unit; Fig. Figure 3 is a cross-sectional view along line AA of Fig. 2; Fig. Figure 4 is a view of the temperature sensor of Fig. 1. Detailed description

[0008] To clarify the purpose, technical solution, and advantages of the technical solution of the present disclosure, the technical solution of the embodiment of the present disclosure is described below with reference to the accompanying drawings of specific embodiments of the present disclosure. Identical reference numerals in the drawings represent identical components. It should be noted that a described embodiment is a subset of the embodiments of the present disclosure, not the entirety of them. Based on the described embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without inventive work fall within the scope of protection of the present disclosure.

[0009] Compared to the embodiments shown in the accompanying drawings, permissible embodiments within the scope of protection of this disclosure may have fewer components, different components not shown in the accompanying drawings, different components, differently arranged components, or differently connected components, etc. Furthermore, two or more components shown in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as several separate components.

[0010] Unless otherwise defined, technical or scientific terms used herein have their usual meanings as understood by those skilled in the art in the field to which this disclosure belongs. The terms "first," "second," and similar terms used in the description and claims of the patent application to this disclosure do not indicate any order, quantity, or meaning, but serve only to distinguish between different components. Where the number of components is not specified, the number of components may be one or more. Likewise, terms such as "a," "the," and "this" do not necessarily imply any limitation of quantity.Similar terms such as "including" or "comprising" mean that the elements or objects appearing before the terms include the elements or objects listed after the terms and their equivalents, without excluding other elements or objects. Similar terms such as "installation," "adjustment," "connection," or "adaptation" are not limited to physical or mechanical installation, adjustment, and connection, but may also include electrical installation, adjustment, and connection, whether directly or indirectly. "Top," "bottom," "left," and "right" are used only to indicate the relative orientation when using the device or the orientation shown in the accompanying drawings. If the absolute position of the described object changes, the relative orientation may also change accordingly.

[0011] As previously mentioned, the problem in this field is that it is difficult to obtain a temperature sensor with better performance through lower costs and a simpler design. The research of the inventor of the present disclosure has revealed that the arrangement of the internal components of the temperature sensor has a significant influence on its performance.

[0012] While a conventional temperature sensor is attached to the component being measured via its base, a temperature-sensitive element in a temperature sensor is typically mounted directly onto a printed circuit board (PCB), which in turn is attached to the base of the temperature sensor. However, due to limitations such as installation space constraints, PCB thickness, and the heat resistance of other components on the board, there is usually a certain distance between the PCB and the base. This not only places the temperature-sensitive element far from the component being measured, but also allows heat to be transferred to the element through various media. This conventional design thus prevents the temperature sensor from obtaining more accurate temperature data.

[0013] Therefore, the present disclosure provides a temperature sensor as described in the Fig. 1 and Fig. Figure 2 shows a structure comprising: a base 1 for mounting on a component to be detected; a temperature-sensitive element 2 attached to the base 1; and a printed circuit board 3 attached to the base 1. The temperature-sensitive element 2 is electrically connected to the printed circuit board 3. With this structure, the temperature-sensitive element 2 is not only separated from the printed circuit board but also directly attached to the base 1, so that the temperature-sensitive element 2 is closer to the detected component and temperature data closer to the actual temperature of the detected component can be obtained solely through heat transfer from the base 1. The base 1 is preferably made of a metal material with high thermal conductivity or similar material to ensure better heat conduction.

[0014] Preferably, the base 1 can have a recess 10 in which the temperature-sensitive element 2 is arranged. By arranging the temperature-sensitive element 2 in the recess 10, it is closer to the component to be detected, and the recess 10 also thins the bottom wall of the base 1, which is more conducive to heat transfer. Therefore, provided the stiffness of the base 1 is sufficient, the recess 10 can be made as deep as possible so that the temperature-sensitive element 2 is as close as possible to the component to be detected. Preferably, a thermally conductive adhesive can be used to fill the gap between the temperature-sensitive element 2 and the recess 10. The thermally conductive adhesive not only performs a good heat conduction function but can also be used to firmly fix the temperature-sensitive element 2 in the recess 10.

[0015] Additionally, according to the inventor's research, an antenna used to transmit the temperature sensing signal is also affected by other components in the temperature sensor. For example, the antenna is very sensitive to metal components, especially in conventional temperature sensors where the antenna is typically attached to the circuit board. Therefore, the antenna can be significantly affected by the metal base if the circuit board is relatively close to it. Furthermore, the battery attached to the circuit board can also have a significant impact on the antenna.

[0016] Therefore, according to a preferred embodiment of the present disclosure, there is a first distance between the circuit board 3 and the base 1. Even if the antenna 4 of the temperature sensor (for example, a Bluetooth antenna) is attached directly to the circuit board 3, and since the circuit board 3 is spaced away from the base 1, the influence of the base 1 on the antenna 4 can therefore be reduced.

[0017] Preferably, the temperature sensor can comprise a carrier 8. As in the Fig. 1 and Fig. As shown in Figure 3, one end of the support 8 is connected to the base 1, and the other end is connected to the printed circuit board 3 to fasten the printed circuit board 3 to the base 1. Preferably, there are three or more supports 8. Preferably, one end of the support 8 includes a threaded stud 81 for screwing into a corresponding threaded hole in the base 1, and the other end includes a threaded hole 82 so that the screw 9, which passes through a through-hole 33 in the printed circuit board 3, can be screwed into the threaded hole 82 to fasten the printed circuit board 3 to the base 1. It should be understood that one end 81 of the support 8 may be connected to the base 1 in another way, for example, by press fit or welding. It should also be understood that the fastening of the support 8 to the printed circuit board 3 can be achieved by any other means.For example, in another embodiment not shown, the other end of the carrier 8 is also provided as a threaded stud which passes through the through hole 33 of the circuit board 3 and secures the circuit board 3 by means of a nut.

[0018] To further reduce the interference caused by the antenna 4, the antenna 4 can preferably be attached to a surface 31 of the circuit board 3, which points away from the base 1, with a second distance between the antenna 4 and the circuit board 3, as shown in the Fig. 2 and Fig. Figure 3 shows. Preferably, the temperature sensor can further comprise an antenna platform 7 having legs 71 connected to the circuit board 3, as shown in Figure 3. Fig. 2 shown. For example, three or more legs 71 may be present. The antenna 4 may in turn be attached to the antenna platform 7 or be integrally formed with it.

[0019] Therefore, the second distance can be chosen to be as large as possible while still meeting the requirements regarding mounting and dimensions. With this arrangement, due to the first distance between the circuit board 3 and the base 1 and the second distance between the antenna 4 and the circuit board 3, as described above, the antenna 4 is further away from the base 1, thus minimizing the influence of other components on the base 1 and the circuit board 3.

[0020] The temperature sensor also includes a battery 5, which is attached to a surface 32 of the circuit board 3 facing the base 1. This means that the battery 5 and the antenna 4 are located on both sides of the circuit board 3, further reducing the influence of the battery 5 on the antenna 4. According to a further preferred embodiment, which is not shown, the battery 5 can have a third distance from the circuit board 3 (for example, the battery 5 can be soldered to the circuit board 3 by longer pins so that the battery 5 does not adhere to the circuit board 3), further increasing the distance between the antenna 4 and the battery 5. Preferably, this third distance is filled with an adhesive, preferably silicone or epoxy.By filling the third space with the fastening adhesive, especially when the temperature sensor is used under strong vibrations, it is therefore possible to further secure the battery 5 and the circuit board 3 and achieve a vibration damping effect.

[0021] Preferably, the temperature sensor further comprises a pad 6 arranged between the battery 5 and the base 1. Since the temperature sensor can be used on vibrating components, the pad 6 can reduce the vibrations transmitted to the battery 5 and prevent the solder joints between the battery 5 pins and the circuit board 3 from loosening. The pad 6 can be made of any suitable material, such as foam, rubber, resin, etc., and can be connected to the battery 5 and the base 1 by adhesive or similar means.

[0022] According to a more preferred embodiment, the cushioning pad 6 can be a silicone foam which has better cushioning, insulation and high temperature resistance.

[0023] Additionally, the temperature sensor also includes a housing 100 that fits together with the base 1 (for example, by screwing it together) to enclose the components of the temperature sensor. Preferably, the surface of the housing 100 has a specific surface resistance of less than 10 Ω. 10 Ω and more than 10 6Ω. Therefore, no excessive charge accumulates in such a housing during operation, and in some operating scenarios, the explosion protection requirements are met. The base 1 can include a lower connection hole 101 to facilitate the attachment of the temperature sensor to the component to be monitored. The lower edges of the base 1 can include several straight edges 102 to facilitate the engagement of an installation tool, such as a wrench.

[0024] In light of the above, the present disclosure proposes a temperature sensor that eliminates a conventional structure for attaching a temperature-sensitive element to a printed circuit board (PCB). Instead, it separates the temperature-sensitive element from the PCB to be positioned as close as possible to the component being detected. Furthermore, the antenna is also mounted at a distance from the base and the PCB, thereby minimizing interference from other components, particularly metal components.

[0025] The exemplary embodiments of the present disclosure have been described in detail above with reference to preferred embodiments. However, those skilled in the art will understand that various modifications and variations can be made to the specific embodiments mentioned above without departing from the concept of the present disclosure. Modifications and various technical features and structures proposed in the present disclosure can be produced in various combinations without exceeding the scope of protection of the present disclosure as defined by the appended claims.

Claims

[1] Temperature sensor comprising: a base (1) for attaching a component to be detected; a temperature-sensitive element (2) attached to the base (1); a circuit board (3) which is attached to the base (1) and to which the temperature-sensitive element (2) is electrically connected. [2] Temperature sensor according to claim 1, wherein the base (1) has a recess (10) in which the temperature-sensitive element (2) is arranged. [3] Temperature sensor according to claim 2, wherein a gap between the temperature-sensitive element (2) and the recess (10) is filled with a thermally conductive adhesive. [4] Temperature sensor according to claim 1, wherein there is a first distance between the printed circuit board (3) and the base (1); wherein preferably the temperature sensor further comprises a carrier (8) which is connected at one end to the base (1) and at the other end to the printed circuit board (3) in order to attach the printed circuit board (3) to the base (1). [5] Temperature sensor according to claim 1 or 4, further comprising an antenna (4) which is attached to a surface (31) of the circuit board (3) facing away from the base (1) with a second distance between the antenna (4) and the circuit board (3). [6] Temperature sensor according to claim 5, further comprising an antenna platform (7) having legs (71) connected to the circuit board (3). [7] Temperature sensor according to claim 6, wherein an antenna (4) is attached to or integrally formed with the antenna platform (7). [8] Temperature sensor according to claim 1 or 4, further comprising a battery (5) attached to a surface (32) of the circuit board (3) facing the base (1); wherein preferably the temperature sensor further comprises a housing (100) wherein the surface of the housing (100) has a specific surface resistance of less than 10 10 Ω and more than 10 6 Ω has. [9] Temperature sensor according to claim 8, wherein a third gap is provided between the battery (5) and the circuit board (3); wherein preferably the third gap is filled with a fastening adhesive, preferably silicone or epoxy adhesive. [10] Temperature sensor according to claim 8, further comprising a cushion (6) arranged between the battery (5) and the base (1); wherein the cushion (6) is preferably a silicone foam.

Images