Heat medium heating device

Abstract

[Summary] Heat medium heating device 10, comprising: a printed circuit board 12; an electronic component 13 arranged on the printed circuit board; a flow channel element 22 formed of a metal and having a flow channel 21 through which a heat medium M flows; and a heating element 11 arranged in the flow channel and heating the heat medium, wherein a heat sink section 22H is formed integrally with the flow channel element, the heat sink section being connected to an outer boundary of the flow channel and having a surface on which the electronic component is mounted.

Description

[Technical field]

[0001] The present invention relates to a heat medium heating device. [Background]

[0002] JP2018-133300A (hereinafter referred to as Patent Document 1) discloses a conventional heat transfer medium heating device used for a vehicle air conditioning system. This heat transfer medium heating device comprises a housing in which a heat transfer medium flows, a PTC heating element for heating the heat transfer medium, and a control board for controlling the PTC heating element.

[0003] The housing includes a circuit board enclosure for accommodating the control board. The control board contains electronic components. Patent specification 1 describes how heat-generating electronic components such as an IGBT (insulated-gate bipolar transistor) and a FET (field-effect transistor), as well as other electronic components besides the heat-generating electronic components, can be used as electronic components of the control board. [State of the art][Patent specification]

[0004] [Patent Specification 1] Japanese patent application (kokai) No. 2018-133300 [Summary of the invention][Problem to be solved by the invention]

[0005] In the configuration described above, the electronic components are arranged in a space within the circuit board housing section and are not in contact with anything other than the main body of the control board. If a heat-generating electronic component is used, the heat it produces is dissipated into the air within the circuit board housing section. In such a case, the heat is not sufficiently dissipated by the electronic component, and the component overheats, potentially causing it to malfunction.

[0006] The present invention was developed on the basis of the above-mentioned circumstances, and one objective of the present invention is to provide a heat medium heating device that can increase the efficiency of heat radiation from a heat-generating electronic component. [Means to solve the problem]

[0007] A heat medium heating device of the present invention is a heat medium heating device comprising: a printed circuit board; an electronic component arranged on the printed circuit board; a flow channel element formed from a metal and having a flow channel through which a heat medium flows; and a heating element arranged in the flow channel and heating the heat medium, wherein a heat sink section is formed integrally with the flow channel element, the heat sink section being connected to an outer boundary of the flow channel and having a surface on which the electronic component is mounted.

[0008] Such a configuration allows the heat generated by the electronic component to be transferred from the heat sink section to the heat medium in the flow channel, thereby increasing the efficiency of heat radiation from the electronic component.

[0009] In the heat medium heating device of the present invention, the flow channel can have a circular cross-section, and the cooling element section can be connected to the tubular outer boundary of the flow channel.

[0010] Thanks to this configuration, the heat transfer medium can flow smoothly through the flow channel, as the channel has a circular cross-section. Furthermore, since the heat sink section is connected to the outer boundary of the flow channel, thus forming part of the outer boundary, the height (distance) of the heat sink section from the flow channel can be reduced, thereby decreasing the size of the heat transfer medium heating device. Additionally, the contact area between the heat sink section and the flow channel can be increased.

[0011] In the heat medium heating device of the present invention, the flow channel can have a tubular shape and extend in the longitudinal direction, and the flow channel can have a larger diameter in the direction of one side in the longitudinal direction in which the heat medium flows.

[0012] With such a configuration, air bubbles that form in the heat medium as a result of heating by the heating element are more likely to flow in the direction of flow and be released to the outside from a section of the flow channel with an enlarged diameter.

[0013] This prevents air bubbles from remaining in the flow channel, which would otherwise lead to heating by the heating element without liquid.

[0014] In the heat medium heating device of the present invention, the heating element can extend in the axial direction and have a through-hole along the axial direction, wherein the heat medium introduced into the through-hole through one end flows through the other end of the through-hole to an outer surface side of the heating element, reverses its flow direction at an inner wall surface of the flow channel and flows along an outer surface of the heating element to a side opposite in the axial direction, wherein a corner region of the inner wall surface of the flow channel, which faces the other end of the through-hole, can be curved.

[0015] With such a configuration, the heat medium, after flowing from the other end of the through-hole to the outer surface of the heating element and reversing its flow direction at the inner wall surface of the flow channel, flows smoothly along the curved corner section, thereby further increasing the efficiency of heat radiation from the electronic components via the heat medium.

[0016] In the heat medium heating device of the present invention, the heating element can have a circular cross-section.

[0017] With such a configuration, the heat medium flows smoothly along the outer surface of the heating element, which can further increase the efficiency of heat radiation from the electronic components via the heat medium. [Effects of the invention]

[0018] The present invention enables the provision of a heat medium heating device that can increase the efficiency of heat radiation from a heat-generating electronic component. [Brief description of the drawings] [ Fig. 1] Exploded view of a heat medium heating device according to an embodiment of the present invention. [ Fig. 2] Perspective view of the heat medium heating device. [ Fig. 3] Sectional view along line AA in Fig. 2. [ Fig. 4] Cross-sectional view of a flow channel, perpendicular to the surface of Fig. 3. [Emphasis of the invention]

[0019] The following describes an embodiment of the present invention.

[0020] Fig. Figure 1 is an exploded view of a heat medium heating device according to an embodiment of the present invention. Fig. Figure 2 is a perspective view of the heat medium heating device. Fig. Figure 3 is a sectional view along line AA in Fig. 2.

[0021] It should be noted that the present invention is not limited to these illustrative examples, but that the present invention is to be demonstrated by the claims and includes all modifications within the meaning and scope of the claims. In the following description, where several identical elements are present, only some elements are designated by reference numerals, while the remaining elements are not designated by reference numerals in some cases.

[0022] In this description, a positive direction of the Z-axis is defined as upward direction, a negative direction of the Z-axis as downward direction, a positive direction of the X-axis as forward direction, and a positive direction of the Y-axis as clockwise direction to describe the structure of the heat medium heating device 10. However, in actual use, the heat medium heating device 10 may be arranged in a different orientation than shown in the drawings, so that the directions associated with the heat medium heating device 10 may differ from the defined directions.

[0023] The heat transfer medium heating device 10 according to the present invention heats a liquid (an example of the heat transfer medium) such as water. The heat transfer medium heating device 10 is, for example, arranged in an electric vehicle (EV) and serves to heat the interior of the electric vehicle or to keep a battery warm.

[0024] As in Fig. As shown in Figure 1, the heat medium heating device 10 comprises a heating element 11, a circuit board 12 and a housing 20 that accommodates the heating element 11 and the circuit board 12.

[0025] The housing 20 comprises a flow channel element 22 and various elements 24 to 26 (which will be described later) that are attached to the flow channel element 22.

[0026] A flow channel 21 is formed in the flow channel element 22. A heat medium M flows through the flow channel 21 and is heated by the heating element 11 arranged in the flow channel 21.

[0027] In the present example, the heating element 11 is a ceramic heating element. The heating element 11 comprises a circular tubular element 11A and a heating resistance element (not shown) embedded in the circular tubular element 11A.

[0028] The circular, tubular element 11A consists primarily of a ceramic material such as aluminum oxide. The heating element is made of a metal such as tungsten and has the form of a meandering, thin wire. The heating element generates heat when it is subjected to a voltage supply.

[0029] The heating element 11 can be manufactured, for example, by placing a metal sheet with a predetermined pattern, which is to form the heating resistance element, between ceramic green sheets, wrapping the resulting laminate around a rod-shaped mold, and firing the laminate. The heating element 11 has a flanged section 11B, which is soldered to the outer circumferential surface of the circular tubular element 11A.

[0030] Flange section 11B has an annular, plate-like shape. Flange section 11B is located near the left end of the circular, tubular element 11A.

[0031] As in Fig. As shown in Figure 1, electronic components 13 for controlling the power of the heating element 11 are arranged on a surface (underside) of the circuit board 12.

[0032] Each of the electronic components 13 is, for example, a switching element such as a FET, an IGBT, or the like. The electronic components 13 have properties that, when excited, can lead to the generation of heat, although the amount of heat generated is less than that of the heating element 11.

[0033] Each electronic component 13 has a main body section 13A and leads 13B that are electrically connected to the printed circuit board 12. The main body section 13A is formed from a resin, and a semiconductor device or the like is embedded in the main body section 13A. The leads 13B are arranged on a side face of the main body section 13A. It should be noted that the leads 13B can be arranged on the top (the surface facing the printed circuit board 12) of the main body section 13A.

[0034] Although not shown in detail, connecting wires and various other wires associated with the heating element 11 are electrically connected to the circuit board 12. These wires are electrically connected to an external power supply, etc., via external terminals C1 and C2. It should be noted that the external terminals C1 and C2 are located on a side face (in the positive X-axis direction of the Fig. 1) of the flow channel element 22 are attached.

[0035] As in Fig. As shown in Figure 1, the housing 20 comprises a flow channel element 22 and various elements 24 to 26 that are attached to the flow channel element 22.

[0036] The flow channel element 22 generally has a box-like shape and features a pipe section 22t (see Fig. 3) which is integrally formed on the underside of the flow channel element 22. The pipe section 22t has a circular cross-section and defines the outer boundary of the flow channel 21. The heating element 11 is arranged inside the pipe section 22t. The gap between the pipe section 22t and the heating element 11 serves as the flow channel 21.

[0037] The pipe section 22t is located at the front (along the Y-axis of Fig. 1 to the left) open. An outlet opening 22Y, which is an end section of the flow channel 21, is integrally formed with the pipe section 22t such that the outlet opening 22Y consists of a side surface of the pipe section 22t (in the positive X-axis direction of Fig. 1) stands out.

[0038] The flow channel element 22 is made of a metal and can be manufactured, for example, by aluminum die casting.

[0039] A heat sink section 22H with a flat surface is integrally connected to the outer surface of the pipe section 22t. The flat surface (top) of the heat sink section 22H serves as a mounting surface for the electronic components 13.

[0040] The circuit board 12 is housed in an interior space of the flow channel element 22, which is located on the top side of the pipe section 22t. The main body sections 13A of the electronic components 13 (in this example, two electronic components), which are mounted on the underside of the circuit board 12, are in contact with the flat surface (top side) of the heat sink section 22H.

[0041] It should be noted that in the present example, an insulating plastic film (not shown) and a plastic holder 15 for holding the electronic components 13 are arranged between the main body sections 13A of the electronic components 13 and the heat sink section 22H. However, if the main body sections 13A are spaced apart from the heat sink section 22H, the interposition of the aforementioned elements between them may be unnecessary, and a gap may exist between them.

[0042] Additionally, clips 17 with spring properties are arranged over the main body sections 13A, and the main body sections 13A are arranged between the clips 17 and the holder 15.

[0043] An opening on the top side of the flow channel element 22, in which the circuit board 12 is housed, is closed by a cover section 23 via a frame-shaped sealing element (seal) S1.

[0044] It should be noted that in the present example, the cover section 23 is also made of a metal. Since the flow channel element 22 and the cover section surrounding the circuit board 12 are made of a metal, an electromagnetic shielding effect can be achieved to protect the circuit board 12 from external interference.

[0045] Furthermore, a frame-shaped sealing element (gasket) S2, a sealing element (O-ring) S3, a flange holder 24 and a sealing element (O-ring) S4 are in this order in an opening of the pipe section 22t on the front (along the Y-axis of Fig. 1 to the left).

[0046] The heating element 11 extends through the sealing elements S2 and S3, the flange holder 24 and the sealing element S4, and the surface of the flange section 11B of the heating element 11 on the right side in the Y-axis direction is in contact with the sealing element S4.

[0047] Furthermore, on the opposite side of the flange section 11B, a sealing element (O-ring) S5, a heating element base holder 25, a sealing element (O-ring) S6 and a side cover 26 are arranged in this order.

[0048] Sealing elements S5 and S6 provide a liquid-tight seal between opposing surfaces of the heating element base holder 25, and sealing element S5 is in close contact with a proximal end of the heating element 11. Furthermore, the flange section 11B of the heating element 11 is sealed liquid-tight by sealing element S4. Additionally, the flange section 11B and the base section of the heating element 11 are supported by the flange holder 24 and the heating element base section holder 25.

[0049] Note that a temperature sensor 25b is inserted into a hole in the heating element base section holder 25 and is pressed and held by a forked section of a clamp 25a. The clamp 25a is fastened to the heating element base section holder 25 by a screw (not shown). A power transmission cable harness (not shown) extends from the temperature sensor 25b and is connected to the circuit board 12.

[0050] Similarly, an outlet-side temperature sensor (not shown) is arranged in the flow channel element 22 to be located near the circuit board 12 and is secured by a clamp 27a having a similar shape to the clamp 25a.

[0051] Meanwhile, an inlet port 26X, which is an end section of the flow channel 21, is formed in the side cover 26 such that the inlet port 26X projects to the left in the Y-axis direction. The sealing element S6 forms a liquid-tight seal between the side cover 26 (its inlet port 26X) and the heating element base holder 25. Thus, the inlet port 26X is in contact with the flow channel 21 on the side of the pipe section 22t.

[0052] In addition, an opening of the flow channel element 22, which surrounds the outside of the pipe section 22t, is closed by the side cover 26 via the sealing element S2.

[0053] The in Fig. The heat medium heating device 10 shown in Figure 2 is assembled in the manner described above.

[0054] Next, a characteristic section of the present invention will be described with reference to Fig. 3 described.

[0055] As in Fig. As shown in Figure 3, the heat sink section 22H, which has a mounting surface for the electronic components 13 on its upper side, is connected to the outer boundary of the flow channel 21 (the pipe section 22t) and is formed integrally with the flow channel element 22.

[0056] Through such a configuration, the heat generated by the electronic components 13 can be transferred from the metal heat sink section 22H to the heat medium M in the flow channel 21, thereby increasing the efficiency of heat radiation from the electronic components 13.

[0057] In the present example, the flow channel 21, as in Fig. Figure 4 shows a circular cross-section, and the heat sink section 22H is connected to the tubular outer boundary of the flow channel 21 (the tube section 22t). It should be noted that Fig. 4 a cross-sectional view of the flow channel 21 perpendicular to the plane of Fig. 3 is.

[0058] Due to this configuration, the heat medium M can flow smoothly through the flow channel 21 (the pipe section 22t) because the flow channel 21 has a circular cross-section. Furthermore, since the heat sink section 22H is connected to the outer boundary of the flow channel 21 (the pipe section 22t), thus forming part of the outer boundary, the height (distance) of the heat sink section 22H from the flow channel 21 (the pipe section 22t) can be reduced, thereby reducing the size of the heat medium heating device 10. Additionally, the contact area between the heat sink section 22H and the flow channel 21 can be increased.

[0059] It should be noted that the flow channel 21, which has a "circular" cross-section, does not have to have a constant diameter over its entire length. For example, the diameter of the flow channel 21 can decrease longitudinally towards one side or repeatedly decrease and increase along its length.

[0060] The expression “connected to the tubular outer boundary of the flow channel 21” means that there are no gaps G between the heat sink section 22H and the outer boundary of the flow channel 21 (the tube section 22t).

[0061] In contrast, in an assumed case where a heat sink section 220H is designed such that between the heat sink section 220H and the outer boundary of the flow channel 21 (the pipe section 22t) are provided (see dashed line in Fig. 4) The size of the heat medium heating device 10 increases because the height (distance) of the heat sink section 220H from the flow channel 21 becomes large. Furthermore, since the contact area between the heat sink section 220H and the flow channel 21 becomes smaller in areas where the gaps G are provided, the efficiency of heat dissipation from the electronic components 13 is poor compared to the case where the gaps G are not present.

[0062] In the present example, the flow channel 21, as in Fig. Figure 3 shows the shape of a pipe extending in the longitudinal direction L, and the diameter of the flow channel 21 increases along the flow direction F of the heat medium M in the longitudinal direction L.

[0063] Due to this configuration, air bubbles that form in the heat transfer medium M as a result of heating by the heating element 11 can more easily flow in the direction of flow F and be released outwards (towards the outlet opening 22Y) from a diameter-enlarging section of the flow channel 21. This prevents the air bubbles from remaining in the flow channel 21, which would otherwise lead to heating by the heating element 11 without any liquid present.

[0064] As described later, it should be noted that in the present example, the heating element 11 has a through-hole 11H and the heat medium M flows through the through-hole 11H. However, the “flow channel 21” refers to a space surrounded by the flow channel element 22 (the pipe section 22t). That is, in the present example, the “flow channel 21” is a region between the inner surface of the pipe section 22t and the outer surface of the heating element 11.

[0065] Accordingly, the flow direction F of the heat medium M in the "flow channel 21" is the flow direction between the inner surface of the pipe section 22t and the outer surface of the heating element 11 and is a direction to the left along the Y-axis. Fig. 3. The diameter of the flow channel 21 decreases along the Y-axis from Fig. 3 to the left, which means that "the flow channel 21 increases in diameter along the flow direction F of the heat medium M".

[0066] In the present example, the heating element 11 extends as shown in Fig. Figure 3 shows the through-hole 11H in an axial direction AX and has a through-hole along the axial direction AX. The heat medium M, which passes through one end (along the Y-axis of Fig. When the heat medium M is introduced into the through-hole 11H (3 to the left), it flows out through the other end 11e of the through-hole 11H to the outer surface of the heating element 11. Subsequently, the heat medium M reverses its flow direction at the inner wall surface of the flow channel 21 and flows along the outer surface of the heating element 11 in the axial direction AX (towards the right side in the Y-axis). Fig. 3) to the opposite side.

[0067] A corner section 21e of the inner wall surface of the flow channel 21, which faces the other end 11e of the through-hole 11H, is curved.

[0068] Due to such a configuration, when the heat medium M has flowed out of the other end 11e of the through-hole 11H to the outside of the heating element 11, the heat medium M reverses its flow direction at the inner wall surface of the flow channel 21, the heat medium M flows smoothly along the curved corner section 21e, which can further increase the efficiency of heat radiation from the electronic components 13 via the heat medium M.

[0069] In the present example, the axial direction AX is parallel to the longitudinal direction L. However, no restriction is imposed on the relationship between the axial direction AX and the longitudinal direction L, and the axial direction AX and the longitudinal direction L can intersect.

[0070] In the present example, the heating element 11 has a circular cross-section.

[0071] With such a configuration, the heat medium M flows smoothly along the outer surface of the heating element 11, which further increases the efficiency of heat radiation from the electronic components 13 via the heat medium M.

[0072] It is understood that the present invention is not limited to the above embodiment and includes various modifications and equivalents within the idea and scope of the present invention.

[0073] In the embodiment described above, the heating element 11 is a ceramic heating element. However, the heating element 11 can be a PTC heating element or a sheathed heating element.

[0074] In the embodiment described above, the heating element 11 has a circular tube shape. However, the shape of the heating element can be modified accordingly.

[0075] The cross-sectional shape of the flow channel is not restricted. [Description of the reference numbers] 10 Heat medium heating device 11 Heating element 11H Through hole 11e other end of the through hole 12 circuit boards 13 electronic component 21 Flow channel 21e Corner area of ​​the inner wall surface of the flow channel 22 Flow channel element 22H Heat sink section M Heat medium L Longitudinal direction AX Axial direction QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2018-133300A

[0002] JP 2018-133300

[0004]

Claims

[1] Heat medium heating device (10), comprising: a circuit board (12); an electronic component (13) that is arranged on the circuit board (12); a flow channel element (22) formed from a metal and having a flow channel (21) through which a heat medium (M) flows; and a heating element (11) which is arranged in the flow channel (21) and heats the heat medium (M), wherein a heat sink section (22H) is formed integrally with the flow channel element (22), wherein the heat sink section (22H) is connected to an outer boundary of the flow channel (21) and the heat sink section (22H) has a surface on which the electronic component (13) is mounted. [2] Heat medium heating device (10) according to claim 1, wherein the flow channel (21) has a circular cross-section and the heat sink section (22H) is connected to the tubular outer boundary of the flow channel (21). [3] Heat medium heating device (10) according to claim 1 or 2, wherein the flow channel (21) has a tubular shape and extends in a longitudinal direction (L), and the flow channel (21) has a larger diameter in the direction of one side in the longitudinal direction (L) towards which the heat medium (M) flows. [4] Heat medium heating device (10) according to claim 1 or 2, wherein the heating element (11) extends in an axial direction (AX) and has a through hole (11H) along the axial direction (AX), the heat medium (M) introduced through one end into the through-hole (11H) flows out through the other end (11e) of the through-hole (11H) to an outer surface of the heating element (11), reverses its flow direction at an inner wall surface of the flow channel (21), and flows along an outer surface of the heating element (11) to a side opposite in the axial direction (AX), and a corner section (21e) of the inner wall surface of the flow channel (21), which faces the other end (11e) of the through hole (11H), is curved. [5] Heat medium heating device (10) according to claim 1 or 2, wherein the heating element (11) has a circular cross-section.

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