Method for forming a power module connection

Abstract

A method for forming power module terminals involves removing an electrically insulating sheath from each of a first section and a second section of an elongated electrically conductive body, bending the elongated electrically conductive body in one or more dimensions to form a bent segment of the elongated electrically conductive body, separating the bent segment of the elongated electrically conductive body from a main part of the elongated electrically conductive body such that each of the first section and the second section of the elongated electrically conductive body is located at one end of the separated bent segment or is located between the ends of the separated bent segment, attaching the bent segment to a frame of a power module, and attaching the frame to a substrate of the power module.the attachment of at least one power semiconductor die to the substrate, and the attachment of the first section to the substrate or a power semiconductor die.

Description

BACKGROUND

[0001] The demand for electronic modules for power applications, commonly referred to as power modules, continues to rise rapidly across a wide range of industries, including automotive, consumer electronics, renewable energy, manufacturing, and medical technology, among many others. Advances in semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) have enabled the production of such power modules with advantageous properties, including smaller footprint, higher voltage and current capacity, and faster switching speeds.

[0002] A power module typically contains one or more power semiconductor dies mounted on a substrate and enclosed in a package, and one or more power module terminals that provide an externally accessible electrical interface to the power semiconductor die(s). Specifically, each power module terminal includes an internal end attached to the substrate (e.g., a conductor track or pad) or to a power semiconductor die, and an external end providing an external connection interface (e.g., a pin, a threaded nut, a wire segment), the internal end and the external end being connected by an elongated electrically conductive body, or in some cases, being ends of the elongated electrically conductive body themselves.Some power module applications require a specific arrangement of external interconnect interfaces, and some substrates used in power modules have a fixed arrangement of pads and / or traces electrically connected to the power semiconductor die(s). Power modules with fixed positions for both external interconnect interfaces and substrate pads / traces therefore require the power module terminals to be designed and structured to accommodate these fixed arrangements. This often necessitates changes in design and tooling to manufacture the terminals, potentially increasing manufacturing cycle time and costs.Furthermore, methods for electrically insulating the power module connections within the power module housing, such as applying an electrically insulating gel, can also increase manufacturing costs and are associated with reliability problems in some cases.

[0003] Therefore, there is a need for a solution that is cost-effective and has a short cycle time to form reliable power module connections that can be adapted to a variety of external connection interfaces and internal pad / trace layouts. OVERVIEW

[0004] According to one embodiment of a method for forming power module terminals, the method comprises: removing an electrically insulating sheath from each of a first section and a second section of an elongated electrically conductive body; bending the elongated electrically conductive body in one or more dimensions to form a bent segment of the elongated electrically conductive body; separating the bent segment of the elongated electrically conductive body from a main part of the elongated electrically conductive body such that each of the first section and the second section of the elongated electrically conductive body is located at one end of the separated bent segment or is located between the ends of the separated bent segment; attaching the bent segment to a frame of a power module; attaching the frame to a substrate of the power module;Attaching at least one power semiconductor die to the substrate; and attaching the first section of the elongated electrically conductive body to the substrate or to one of the power semiconductor dies.

[0005] According to one embodiment of a power module, the power module comprises: at least one power semiconductor die attached to a substrate; a frame attached to the substrate; and an elongated electrically conductive body segment attached to the frame, comprising: a first exposed section; a second exposed section; a non-exposed section bent in one or more dimensions; and an electrically insulating material encasing the non-exposed section but not the first exposed section or the second exposed section, wherein the first exposed section of the elongated electrically conductive body segment is attached to the substrate.

[0006] Experts will recognize further features and advantages after reading the following detailed description and examining the attached drawings. BRIEF DESCRIPTION OF THE FIGURES

[0007] The elements in the drawings are not necessarily to scale. Identical reference numerals denote corresponding similar parts. The features of the various embodiments shown can be combined, provided they are not mutually exclusive. Embodiments are illustrated in the drawings and described in detail in the following description. The Fig. Figures 1A-1D show views of a power module according to one embodiment. The Fig. Figures 2A-2F illustrate the formation of a curved segment of a power module connector according to one embodiment. The Fig. Figures 3A-3G illustrate the formation of a curved segment of a power module connector according to one embodiment. The Fig. Figures 4A-4D illustrate the formation of a curved segment of a power module connector according to one embodiment. Fig. Figure 5 illustrates the formation of a curved segment of a power module connector according to one embodiment. The Fig. 6A and Fig. Figure 6B illustrates the formation of a curved segment of a power module connector according to one embodiment. The Fig. Figures 7A-7E show cross-sectional views of an elongated electrically conductive body according to embodiments. Fig. Figure 8 illustrates the attachment of a power semiconductor die to a substrate of a power module according to one embodiment. The Fig. Figures 9A-9E illustrate the attachment of curved segments of power module connectors to a frame of a power module according to embodiments. Fig. Figure 10 illustrates the attachment of a frame and sections of curved segments of an elongated electrically conductive body attached to the frame to a substrate to produce a power module, according to one embodiment. Fig. Figure 11 illustrates the addition of an insulating gel to a volume of a power module according to one embodiment. DETAILED DESCRIPTION

[0008] This document describes a power module with power module terminals, each comprising a bent segment of a pre-insulated, elongated, electrically conductive body, and a method for manufacturing such power module terminals. According to the embodiments described herein, each segment of a pre-insulated, elongated, electrically conductive body of a power module terminal contains one or more bends that allow the segment to span the distance between an internal connection point and an external connection point of the power module. Hereinafter, these segments are referred to as bent segments. The term "bent profile" is used here to describe the shape, arrangement, angle, number, and other properties of the bend(s) of a particular bent segment.One or more power module terminals of a particular power module may contain one or more curved segments with a curved profile that differs from the curved profile of one or more other curved segments to accommodate the arrangement of the internal and external terminals of the particular power module.

[0009] According to the embodiments described here, curved segments with different curved profiles can be formed sequentially using a single manufacturing tool. Such an approach can offer the possibility of quickly changing the design of the curved segments with a simple program change, which can enable faster manufacturing of power module connections to accommodate power modules with different external and internal connection layouts. This can reduce tooling and manufacturing costs as well as the manufacturing cycle time, for example, by decreasing or eliminating the time required to design, manufacture, and / or modify the tools. The ability to produce curved segments with different designs sequentially can also streamline manufacturing by ensuring that all power module connections for a given power module (e.g.,Compared to batch processing of power module connectors of a single design, they can be manufactured in a shorter timeframe, potentially resulting in further cost and cycle time benefits. Furthermore, forming the bent segments using a programmable manufacturing tool, compared to other power module connector manufacturing methods, can enable power module connector designs with greater complexity and / or improved precision in bend placement, and can allow for greater flexibility regarding the shape (e.g., cross-section) of the elongated electrically conductive body used to form the bent segments.

[0010] Next, exemplary embodiments of a power module and a method for forming power module connections are described with reference to the figures.

[0011] The Fig. Figures 1A-1D show views of a power module 100 according to one embodiment. In particular, they show Fig. 1A a perspective view of the power module 100 and the Fig. Figures 1B-1D show cross-sectional side views of the power module 100.

[0012] The power module 100 contains at least one power semiconductor die 110 attached to a substrate 120. For illustrative purposes, the power module 100 includes the Fig. 1A-1D two power semiconductor dies 110 shown, although each of the examples of the power module 100 described herein, including those in the Fig. The power semiconductor die 110 shown in Figures 1A-1D may contain only one power semiconductor die 110 or two or more power semiconductor die 110s. The power semiconductor die 110s are contained within a volume 105, which is bounded by the substrate 120 and a frame 130. The frame 130 may be attached to the substrate 120, in the example along an outer circumference of the substrate, using an adhesive, tape, or other bonding agent, by welding, etc. Alternatively, the substrate may be mounted to a base plate (not shown) by solder, adhesive, sintering, etc., and the frame 130 may be mounted to the base plate by threaded fasteners, adhesives, or other suitable fastening methods. The power module 100 may include a top, lid, cover, or other structure that separates one side of the volume 105 from the substrate 120.This top, lid, cover or other structure may be integrated into the frame 130 or may be provided as a separate part, but is in the . Fig. 1A-1D have been omitted to better illustrate the features contained in volume 105.

[0013] Each power semiconductor die 110 can contain one or more components, such as one or more transistors, diodes, resistors, capacitors, and / or other types of active or passive components. One or more of the power semiconductor dies 110 contained in the power module 100 can be a vertical power semiconductor die (e.g., a vertical power transistor die). In a vertical power transistor die, the primary current flow path runs between the front and back of the power semiconductor die 110 (along the z-direction in the Fig. 1A-1D). In one embodiment, one or more power semiconductor dies 110 are SiC transistor dies, such as SiC power MOSFET (metal oxide-semiconductor field-effect transistor) dies. One or more of the power semiconductor dies 110 contained in the power module 100 can be a Si power MOSFET die, a HEMT (high-electron mobility transistor) die, an IGBT (insulated-gate bipolar transistor) die, a JFET (junction field-effect transistor), etc. If more than one power semiconductor die 110 is included in the power module 100, the power semiconductor dies 110 may all have a similar or identical design (e.g., device type, structure, materials, dimensions, etc.), or some or each of the power semiconductor dies 110 may have a different design.Several configurations of the power semiconductor dies 110 within the power module 100 are conceivable. Each power semiconductor die 110 and / or its individual components contained within the power module 100 can be arranged to form all or part of a circuit within the power module 100, such as a DC / AC inverter, a DC / DC converter, an AC / DC converter, a DC / AC converter, an AC / AC converter, a multiphase inverter, an H-bridge, a motor driver, etc. In some examples, the power module 100 contains more than one power semiconductor die 110, and the circuit containing the power semiconductor dies 110 is a half-bridge or full-bridge circuit.

[0014] Examples of substrate 120 include a DCB (Direct Copper Bonded) or AMB (Active Metal Brazed) substrate, a printed circuit board (PCB), a conductor frame, or another substrate, e.g., an insulated metal substrate (IMS), etc. The substrate 120 shown here contains a metallization layer 122, which includes metallic (e.g., copper, aluminum, an alloy) pads, conductor tracks, and / or islands, each of which may be electrically coupled to one or more of the power semiconductor dies 110 (e.g., directly coupled, electrically coupled by a bond wire, a metal strip, or another electrically conductive body).

[0015] The frame 130 can contain one or more parts made of metal, plastic, composite material, and / or another suitable material. In some examples, the frame 130 is an electrically insulating frame, such as an electrically insulating molded frame. In one embodiment, the frame 130 is an electrically insulating molded frame formed from a mold compound. A mold compound is a plastic encapsulating agent typically composed of an organic resin, such as an epoxy resin. The plastic encapsulating agent may contain fillers, such as non-melting inorganic materials. Catalysts may be used to accelerate the crosslinking reaction of the organic resin. Other materials, such as flame retardants, adhesion promoters, ion traps, stress relief agents, dyes, etc., may optionally be added to the plastic encapsulating agent.The molding compound can be formed by injection molding, compression molding, film-assisted molding (FAM), reaction injection molding (RIM), resin transfer molding (RTM), blow molding, etc.

[0016] According to one embodiment, the power module 100 comprises several power module terminals, each containing an elongated electrically conductive body segment 140 (e.g., a segment of wire or tape, an elongated rod, or other elongated body) attached to the frame 130. Each elongated electrically conductive body segment 140 comprises a first exposed section 141, a second exposed section 142, and a non-exposed section 144 and is bent in one or more dimensions. An electrically insulating material, for example, polyetheretherketone (PEEK), polyimide (PL), polyphenylene sulfide (PPS), etc., encases the non-exposed section 144 but not the first exposed section 141 or the second exposed section 142.

[0017] The first exposed section 141 of each elongated electrically conductive body segment 140 is attached to the substrate 120 or one of the power semiconductor dies 110, thus electrically coupling each elongated electrically conductive body segment 140 to one or more power semiconductor dies 110. In the example of the power module 100 of Fig. 1A The first exposed sections 141 of the elongated electrically conductive body segments 140 are each attached to the metallization layer 122 of the substrate 120, although examples are conceivable in which one or more of the first exposed sections 141 are attached to other components of the substrate 120 or even directly to one or more power semiconductor dies 110. The metallization layer 122 of the substrate 120 can be structured into island-like structures, e.g., as in Fig. 1A shown to carry different electrical potentials (e.g. source, drain and gate potentials).

[0018] Each elongated electrically conductive body segment 140 is attached to the frame 130 such that the second exposed section 142, or optionally a connection interface 150 attached to the second exposed section 142, is at least partially exposed from a surface 130s of the frame 130. In such an arrangement, each second exposed section 142 or each connection interface 150 provides an externally accessible interface for attaching the power module 100 to an external component or assembly (e.g., a busbar or a printed circuit board) and for electrically coupling the one or more power semiconductor dies 110 of the power module 100 to the external component or assembly via the elongated electrically conductive body segments 140.

[0019] As noted, the connection interfaces 150 shown here are optional and not a requirement for the power module connections. This means that in some examples, the second exposed section 142 of one or more elongated electrically conductive body segments 140 of the power module 100 may be at least partially exposed from the surface 130s, and an external component or assembly may be directly attached to the second exposed section 142 of such an elongated electrically conductive body segment 140 (e.g., by soldering or a press fit). In the power module 100 example described here, each connection interface 150 is a nut, e.g., for a screw terminal of the power module 100. Other examples of a connection interface 150 include, among others, a rivet, a screw, a tab, or a pin.The connection interfaces 150 of the power module 100 can all be of a single type or can be of different types.

[0020] The Fig. Figures 1B-1D show cross-sectional side views of some example configurations of the elongated electrically conductive body segments 140 and their arrangement in the power module 100. However, it should be clear that the examples presented here are not limiting and other configurations and / or arrangements are to be considered (e.g., various combinations of the elements shown in the figures). Fig. 1B-1D depicted elongated electrically conductive body segments 140).

[0021] In each of the examples of Fig. 1B-1D is the first exposed section 141 of each elongated electrically conductive body segment 140 attached to the substrate 120, in particular to the metallization layer 122 of the substrate 120. As described with reference to Fig. As mentioned in 1A, examples are conceivable in which one or more of the first exposed sections 141 are attached to other components of the substrate 120 or directly to one or more power semiconductor dies 110.

[0022] In the example of Fig. In 1B, the first exposed section 141 and the second exposed section 142 are each located at one end of the electrically conductive body segment 140, with the non-exposed section 144 extending between the first exposed section 141 and the second exposed section 142. A connection interface 150, in this example a nut, is attached to every second exposed section 142 and is at least partially exposed from the surface 130s of the frame 130, although, as mentioned previously, other types of connection interfaces 150 may be used. Additionally, instead of a connection interface 150, the second exposed section 142 can be formed by one or more elongated electrically conductive body segments 140 of the frame 130. Fig. 1B of the power module 100 shown, at least partially exposed from the surface for 130s.

[0023] In the example of Fig. 1C are the first exposed sections 141 intermediate sections positioned between the ends of the electrically conductive body segments 140. Each electrically conductive body segment 140 of Fig. 1C includes a third exposed section 143 at one end of the electrically conductive body segment 140, with each first exposed section 141 being positioned between the second exposed section 142 and the third exposed section 143 of the respective electrically conductive body segment 140. A connection interface 150, in this example a nut, is attached to each third exposed section 143 and is at least partially exposed from the surface 130s of the frame 130, although, as mentioned previously, other types of connection interfaces 150 may be used. Additionally, instead of a connection interface 150, the third exposed section 143 can be formed by one or more elongated electrically conductive body segments 140 of the frame 130. Fig. The power module 1C shown is at least partially exposed from the surface for 130 seconds.

[0024] In the example of Fig. In Figure 1D, the first exposed section 141 and the second exposed sections 142 are each located at one end of a corresponding electrically conductive body segment 140. Each electrically conductive body segment 140 contains a third exposed section 143, which is an intermediate section positioned between the first exposed section 141 and the second exposed section 142. A connection interface 150, in this example a nut, is attached to each third exposed section 143 and is at least partially exposed from the surface 130s of the frame 130, although, as mentioned previously, other types of connection interfaces 150 may be used. Additionally, instead of a connection interface 150, the third exposed section 143 can be formed by one or more elongated electrically conductive body segments 140 of the frame 130. Fig. The power module 100, depicted in 1D, is at least partially exposed from the surface for 130 seconds. In the example of... Fig. In 1D, both the first exposed section 141 and the second exposed section 142 of each elongated electrically conductive body segment 140 are attached to the substrate 120, in particular to the metallization layer 122 of the substrate 120. Examples are conceivable in which one or more of the first exposed sections 141 and / or second exposed sections 142 are attached to other components of the substrate 120 or directly to one or more power semiconductor dies 110.

[0025] In the example of performance module 100 of the Fig. 1A-1D are part of each elongated electrically conductive body segment 140 and part of each connection interface 150 embedded in the frame 130. As referred to in the Fig. As described in more detail in Sections 9A-9D, the attachment of the elongated electrically conductive body segments 140 to the frame 130 can be achieved by forming the frame 130 from a molding compound, that is, by forming a molded frame 130 and inserting the parts of the elongated electrically conductive body segments 140 and the connecting interfaces 150 into the mold while the molded frame 130 is being formed. Other means of attaching the elongated electrically conductive body segments 140 to the frame 130 are also conceivable. Some of these are described with reference to Fig. 9E described.

[0026] As in the Fig. As shown in Figures 1B-1D, the power module 100 can contain an insulating gel 160 that at least partially fills the volume 105. The insulating gel 160 is arranged in the volume 105 such that the substrate 120 and the first exposed section 141 of each elongated electrically conductive body segment 140 are at least partially covered by the gel 160. In the example of Fig. In 1D, the second exposed section 142 of each elongated electrically conductive body segment 140 is also at least partially covered by the gel 160. Since the non-exposed section 144 of each elongated electrically conductive body segment 140 is encased by an electrically insulating material 145, at least the upper part of the non-exposed section 144 and the second exposed section 142 cannot both be covered by the gel 160. The insulating gel 160 consists of a different material than the electrically insulating material 145 that encases the elongated electrically conductive body segments 140. For example, the insulating gel 160 could be a potting compound.

[0027] An insulating gel, such as the insulating gel 160 of the power module 100, is included to electrically insulate those components of a power module that have exposed electrical conductors, such as substrates with conductive traces and / or contact pads, the power semiconductor dies themselves, and all uninsulated power module connections. An example power module that uses uninsulated power module connections, for example, those stamped or embossed from metal sheets, but is otherwise identical to the power module 100, is shown below. Fig. Similar to 1A-1D, this can require a large amount of insulating gel sufficient to cover large portions of the uninsulated power module terminals. In contrast, forming the power module terminals of the power module 100 from the elongated electrically conductive body segments 140, which are partially sheathed with the electrically insulating material 145, and embedding portions of the elongated electrically conductive body segments 140 in the frame 130, as in the Fig. Figures 1A-1D show that less insulating gel 160 can be used. In particular, the frame 130 of the power module 100 provides electrical insulation for the exposed second sections 142, and the electrically insulating material 145 provides electrical insulation for the non-exposed sections 144 of the elongated electrically conductive body segments 140.

[0028] Therefore, the insulating gel 160 must be used for the power module 100. Fig. In addition to the power semiconductor dies 110 and the metallization layer 122 of the substrate 120, only the first exposed sections 141 of the elongated electrically conductive body segments 140 are covered and electrically insulated. In some examples, filling the volume 105 with the insulating gel 160 to a depth d of less than 10 millimeters is sufficient to cover and electrically insulate the first exposed sections 141, where the depth d is measured from a surface 120s of the substrate 120 to which the first exposed sections 141 are attached, in this example a surface 120s of the metallization layer 122.In some examples of the power module 100, filling the volume 105 with the insulating gel 160 to a depth d of less than 5 millimeters is sufficient to cover and electrically insulate the first exposed sections 141 of the elongated electrically conductive body segments 140. Thus, the... Fig. The power module 100 shown in Figures 1A-1D offers material cost savings by requiring less insulating gel 160 to provide adequate insulation for the power module connections. Furthermore, using less insulating gel 160 can reduce the risk of failures associated with cracking and / or overfilling of the insulating gel 160, which, in addition to the potential material cost savings, can offer a reliability advantage.

[0029] The remainder of this disclosure describes an exemplary method for forming power module connections of the power module 100 of the Fig. 1A-1D and illustrates this. It should be noted that the x-, y-, and z-axes in the following figures are included for reference, but do not necessarily correspond to the x-, y-, and z-axes of the Fig. 1A-1D correspond.

[0030] The Fig. Figures 2A-2F illustrate a method for forming a curved segment 140 of a power module connector according to one embodiment. The method for forming the curved segment 140 in the Fig. 2A-2F is an example of forming an elongated electrically conductive body segment 140 of the Fig. 1A-1 D (e.g., bending an elongated electrically conductive body segment 140 in one or more dimensions), and the term "bent segment" is used below instead of "elongated electrically conductive body segment" to simplify the subsequent description. Therefore, it is understood that each bent segment 140 described here is an example of an elongated electrically conductive body segment 140 of the power module 100 of the Fig. 1A-1D. Furthermore, all components of a curved segment 140 can be similarly numbered components of an elongated electrically conductive body segment 140 of the Fig. 1A-1D correspond. Additionally, the steps of Fig. Steps 2A-2F can be performed in a different order than shown. Some such examples are described.

[0031] Fig. Figure 2A shows the provision of an elongated electrically conductive body 40 with an electrically insulating sheath 145. The elongated electrically conductive body 40 can be any electrically conductive wire, strip, elongated rod, or other elongated body. The elongated electrically conductive body 40 can be formed from a metal such as copper, aluminum, an alloy, etc., and can be provided on a coil or in some other form of large container. In the example of Fig. In step 2A, one end of the elongated electrically conductive body 40 is guided through an opening of a machine 10 and protrudes from it. The machine 10 can be anything from a manual or automated wire feeder to a manufacturing tool designed to perform all the steps described in the Fig. to carry out the steps shown in 2A to 2F, as will be described in more detail later. The elongated electrically conductive body 40, as shown in Fig. The part shown in 2A can be referred to in the following steps as the main part of the elongated electrically conductive body 40.

[0032] In Fig. Figure 2B shows a first section 141 and a second section 142 of the elongated electrically conductive body 40, which are referenced in this and subsequent steps. In this example, the second section 142 is located at the end of the elongated electrically conductive body 40 extending from the opening of the machine 10, and the first section 141 is located inward from the second section 142 along the elongated electrically conductive body 40.

[0033] Fig. Figure 2B shows the elongated electrically conductive body 40 after the tool 10 has removed the electrically insulating sheath 145 from the second section 142 of the elongated electrically conductive body 40, e.g., using a wire stripping technique. At this point, the second section 142 is located where, after completion of the in the Fig. In the procedure shown in 2A to 2F, the second end 42 of the curved segment 140 will be.

[0034] Fig. Figure 2C shows the attachment of a connection interface 150 to the second section 142 of the elongated electrically conductive body 40. As mentioned previously, the connection interface 150 is optional, and therefore the one shown in Fig. Step 2C shown is also optional. Additionally, although attaching the connection interface 150 to the second section 142 of the elongated electrically conductive body 40 during step 2C is possible, Fig. As shown in Figure 2C, the connection interface 150 is attached to the second section 142 after the removal of the electrically insulating sheathing 145 from the second section 142 of the elongated electrically conductive body 40.

[0035] Attaching the connection interface 150 to the second section 142 of the elongated electrically conductive body 40, as shown in Fig. As shown in Figure 2C, the connection process can include soldering, diffusion soldering, sintering, gluing, welding, crimping, etc., from the connection interface 150 to the second end 142. The connections shown in the Fig. The connection interface 150 shown in 2C-2F is a nut, although the connection interface 150, as previously referred to in the Fig. 1A and Fig. 1B mentioned, it could be a rivet, a screw, a tab, a pin or another type.

[0036] Fig. Figure 2D shows the bending of the elongated electrically conductive body 40 in one or more dimensions (x, y and / or z) to form the bent segment 140. The bending may involve twisting the elongated electrically conductive body 40 in one of the dimensions x, y and / or z.

[0037] Fig. Figure 2E shows the elongated electrically conductive body 40 after the tool 10 has removed the electrically insulating sheath 145 from the first section 141 of the elongated electrically conductive body 40, e.g., using a wire stripping technique. At this point, the first section 141 is located where, after completion of the in the Fig. In the procedure shown in Figures 2A to 2F, the first end 41 of the curved segment 140 will be located at the end 41. In some examples, the electrically insulating sheath 145 can be removed before or simultaneously with the removal of the electrically insulating sheath 145 from the second section 142 of the elongated electrically conductive body 40 from the first section 141.

[0038] Fig. Figure 2F illustrates the separation of the curved segment 140 from the main part of the elongated electrically conductive body 40. At this point, the curved segment 140 becomes an example of an elongated electrically conductive body segment 140 of the Fig. 1A-1D, which has the first section 141 from which the electrically insulating sheathing 145 has been removed (corresponding to a first exposed section 141 or a second exposed section 142 of the Fig. 1A-1D), the second section 142, from which the electrically insulating sheathing 145 has been removed (corresponding to a first exposed section 141 or a second exposed section 142 of the Fig. 1A-1D), a non-exposed section 144, and the electrically insulating material 145 that encases the non-exposed section 144 (i.e., the electrically insulating sheathing 145 of the Fig. 1A-1 D).

[0039] Unless otherwise specified, the first sections 141 and the second sections 142 of the curved segments 140 are described and illustrated below in such a way that they correspond to the first exposed sections 141 and the second exposed sections 142 of the elongated electrically conductive body segments 140, respectively. Fig. 1A-1D correspond, for example, when the attachment of the curved segment 140 to the substrate 120 is described. However, it should be noted that the first section 141 and the second section 142 of a curved segment 140 shown here each correspond to any one of the exposed sections 141, 142 or 143 of an elongated electrically conductive body segment 140 of the power module 110 of the Fig. 1A-1D can correspond to such an example. Such an example refers to the Fig. 4A-4D described.

[0040] As mentioned previously, in some examples the steps of Fig. 2A-2F may be performed in a different order than shown. Furthermore, forming the curved segment 140 may involve variations of the steps shown and / or the completion of additional steps. For example, a connection interface 150 may be attached to the first section 141 of the curved segment 140 instead of, or in addition to, attaching a connection interface 150 to the second section 142 of the curved segment 140. Forming the curved segment 140 may involve machining one or both of the first section 141 and / or the second section 142 of the curved segment 140. Examples include machining the first section 141 and / or the second section 142 for a solder joint (e.g.,a hot air solder leveling process (HASL or HAL), coating the first section 141 and / or the second section 142, advancing solder on the first section 141 and / or the second section 142, and adding a second wire layer or other metallic body to increase contact area. Further examples are described with reference to the following figures.

[0041] The Fig. Figures 3A-3G illustrate the formation of a curved segment 140 of a power module connector according to one embodiment. In particular, the figures shown in the Fig. The steps shown in 3A-3G are an alternative example to those described in the Fig. The steps shown in 2A-2F for forming the curved segment 140. As in the steps of the Fig. 2A-2F can perform the steps of Fig. Steps 3A-3G may be performed in a different order than shown. Unless otherwise specified, the details for performing the steps are as follows: Fig. 3A-3G similar to the corresponding steps of the Fig. 2A-2F.

[0042] Fig. 3A (correspondingly) Fig. Figure 2A) illustrates the provision of an elongated electrically conductive body 40 with an electrically insulating sheath 145. Fig. 3B (correspondingly) Fig. Figure 2B) illustrates the removal of the electrically insulating sheathing 145 from the second section 142 of the elongated electrically conductive body 40. Fig. 3C (correspondingly) Fig. Figure 2D illustrates the bending of the elongated electrically conductive body 40 in one or more dimensions to form the bent segment 140. Fig. 3D illustrates the bending of the second section 142 of the elongated electrically conductive body 40 in one or more dimensions (x, y and / or z). Fig. 3E (correspondingly) Fig. Figure 2E) illustrates the removal of the electrically insulating sheathing 145 from the first section 141 of the elongated electrically conductive body 40. Fig. Figure 3F illustrates the bending of the first section 141 in one or more dimensions, which may involve twisting the elongated electrically conductive body 40. Fig. 3G (correspondingly) Fig. Figure 2F illustrates the separation of the curved segment 140 from the main part of the elongated electrically conductive body 40.

[0043] The bending of the second section 142 and the first section 141 of the elongated electrically conductive body 40, as in the Fig. Represented in 3D or 3F, this process can be carried out to form the respective first and second sections 141 and 142 for contact during subsequent processing (e.g., with the substrate 120, with an external component or assembly). For example, one or both of the first end 141 and the second end 142 can be bent into a spiral to form a thread, a U-shape, a V-shape, or a radial spiral for flat contact geometries, a spring-loaded contact, etc.

[0044] The Fig. Figures 4A-4D illustrate the formation of a curved segment of a power module connector according to one embodiment. In particular, the figures shown in the Fig. The steps shown in 4A-4D are an alternative example to those described in the Fig. 2A-2F and Fig. Figures 3A-3G show the steps of forming the curved segment 140, in which the electrically insulating sheathing 145 is removed from a third section 143 of the elongated electrically conductive body 40.

[0045] Fig. 4A, which the Fig. 2E and Fig. Figure 3E shows the elongated electrically conductive body 40 after the tool 10 has removed the electrically insulating sheathing 145 from both the second section 142 and the first section 141 of the elongated electrically conductive body 40.

[0046] The Fig. Figures 4B-4C show the elongated electrically conductive body 40 after the tool 10 has removed the electrically insulating sheath 145 from the third section 143 of the elongated electrically conductive body 40, e.g., using a wire stripping technique. At this point, the third section 143 is located where, after completion of the in the Fig. In the procedure shown in Figures 4A-4D, the first end 41 of the bent segment 140 will be the first end 41, and the first section 141 will become an intermediate section of the bent segment 140 between the second section 142 and the third section 143. The electrically insulating sheathing 145 can be removed before, after, or simultaneously with the removal of the electrically insulating sheathing 145 from the first section 141 and the second section 142 of the elongated electrically conductive body 40 from the third section 143. In the example of Fig. 4B is a connection interface 150 attached to the third section 143. This example step can be described as forming an elongated electrically conductive body 40 from Fig. 1C corresponds. Fig. Figure 4C shows an example where a connection interface 150 is not attached to the second section 142, but instead to the first section 141. This example step can be compared to forming an elongated electrically conductive body 40 from Fig. 1D correspond, where the first section 141 of Fig. 4C the third exposed section 143 of Fig. 1D corresponds. Further steps can be carried out on the third section 143, e.g. machining the third section 143, soldering and / or bending the third section 143 in one or more dimensions for contact, as previously described.

[0047] Fig. Figure 4D shows the separation of the curved segment 140 from the main part of the elongated electrically conductive body 40. At this point, the curved segment 140 becomes an example of an elongated electrically conductive body segment 140 of the Fig. 1C and Fig. 1D, which has the first section 141 from which the electrically insulating sheathing 145 has been removed (corresponding to a first exposed section 141 of Fig. 1C or a third exposed section 143 of Fig. 1D), the second section 142, from which the electrically insulating sheathing 145 has been removed (corresponding to a second exposed section 142 or a third exposed section 143 of Fig. 1C or a second exposed section 142 or first exposed section 141 of Fig. 1D), the third exposed section from which the electrically insulating sheathing has been removed (corresponding to a third exposed section 143 or a second exposed section 142 of Fig. 1C or a first exposed section 141 or second exposed section 142 of Fig. 1D), a non-exposed section 144 and the electrically insulating sheathing 145 that encloses the non-exposed section 144 (i.e., the electrically insulating sheathing 145 of the Fig. 1C and Fig. 1D).

[0048] Fig. Figure 5 illustrates the formation of a curved segment 140 of a power module connection according to one embodiment. In particular, it illustrates Fig. 5 An example of bending the elongated electrically conductive body 40 in one or more dimensions to form a curved segment 140, e.g. during the Fig. 2D and Fig. The steps shown in Figure 3C are described. In this example, bending the elongated electrically conductive body 40 in one or more dimensions involves twisting the elongated electrically conductive body 40 about a longitudinal axis L of the elongated electrically conductive body 40. In this example, a first twist t1 and a second twist t2 in opposite directions are performed about a segment of the longitudinal axis L that is parallel to the x-direction, resulting in a segment of the elongated electrically conductive body 40, which originally extended parallel to the z-direction, being bent so that it extends parallel to the y-direction. This is only one example, and other variations and combinations of bending positions, angles, directions, etc., are conceivable.

[0049] The Fig. 6A and Fig. Figure 6B illustrates the formation of a curved segment of a power module connector according to one embodiment. In particular, the Fig. 6A and Fig. 6B a first curved segment 1401 with a first curved profile, which is the one in the Fig. 2A-2F or the Fig. Figure 3A-3G describes how the first curved segment 140 can be formed, and illustrates the formation of a second curved segment 1402 with a second curved profile that differs from the first curved profile of the first curved segment 1401. The second curved segment 1402 can be formed from the same elongated electrically conductive body 40 using the same method used to form the first curved segment 1401 and can be formed sequentially with the first curved segment 1401. Fig. Figure 6A illustrates the removal of the electrically insulating sheathing 145 from a third section 147 and a fourth section 148 of the elongated electrically conductive body 40 and the bending of the elongated electrically conductive body 40 in one or more dimensions to form the second bent segment 1402. At this point, the fourth section 148 is located where, after completion of the procedure shown here, the second end 42 of the second bent segment 1402 will be.

[0050] Like the first curved segment 1401, a connecting interface 150 can be attached to one or both of the fourth section 148 or the third section 147 of the second curved segment 1402 using the same method used to attach a connecting interface 150 to one or both of the second section 142 or the first section 141 of the first curved segment 1401.

[0051] Fig. Figure 6B shows the separation of the second curved segment 1402 from the main part of the elongated electrically conductive body 40 such that the third section 147 is located at a first end 41 of the second curved segment 1402 and the fourth section 148 is located at the second end 42 of the second curved segment 1402.

[0052] The formation of the second curved segment in 1402 in the Fig. 6A and Fig. 6B can be any of the above with reference to the Fig. The variants described in 2A-5 may be included. For example, the third section 147 and / or the fourth section 148 may be an intermediate section positioned between the first end 41 and the second end 42 of the second curved segment 1402. Furthermore, the second curved segment 1402 may include one or more additional sections from which the electrically insulating sheathing 145 has been removed, as described in the Fig. 4A-4D are shown and included.

[0053] As noted above, the machine can handle 10 of the Fig. 2A-6B a single manufacturing tool designed to perform all of the functions described in the Fig. to carry out the steps shown in 2A-6B. That is, to remove the electrically insulating sheathing 145 from sections of the elongated electrically conductive body 40 (the first section 141, the second section 142, the third section 143 of the Fig. 4A-4D, the third section 147 and the fourth section 148 of the Fig. 6A-6B etc.), bending the elongated electrically conductive body 40 in one or more dimensions to form a bent segment 140, and separating the bent segment 140 from the main part of the elongated electrically conductive body 40 can be carried out using the machine 10. Using such a manufacturing tool to form the bent segments 140 can offer numerous advantages in terms of manufacturing costs and cycle time. For example, the machine 10 can perform the step of bending the elongated electrically conductive body 40 based on a program and can thus be able to produce bent segments 140 with different shapes, sizes, bending positions, and orientations, remove the electrically insulating sheathing 145 at different positions, remove different amounts of the electrically insulating sheathing 145 from different sections, etc., and sequentially, without requiring any changes to the tools (e.g., stamps or punches). Such a process can be used, for example, to produce the first curved segment 1401 and the second curved segment 1402 of the . Fig. 6A and Fig. 6B to be produced sequentially.

[0054] The Fig. Figures 7A-7E show cross-sectional views of the elongated electrically conductive body 40 according to embodiments. In particular, each of the Fig. 7A-7E shows an example cross-section of the elongated electrically conductive body 40, which is used to form the curved segments 140 using the method described here.

[0055] Fig. Figure 7A shows the elongated electrically conductive body 40 with a round cross-section, e.g. like a round wire. Fig. Figure 7B shows the elongated electrically conductive body 40 with a square cross-section, e.g. like a square wire. Fig. Figure 7C shows the elongated electrically conductive body 40 with a rectangular cross-section, e.g. like a rectangular wire. Fig. Figure 7D shows the elongated electrically conductive body 40 with an elliptical cross-section, e.g. like an elliptical wire.

[0056] Fig. Figure 7E shows the elongated electrically conductive body 40 with a flattened profile, e.g., like a rod. The elongated electrically conductive body of this example has a width w in a first direction d1 perpendicular to a longitudinal axis L of the elongated electrically conductive body 40 and a height h in a second direction d2 perpendicular to the first direction d1 and to the longitudinal axis L of the elongated electrically conductive body 40, where the width w is greater than the height h.

[0057] Fig. Figure 8 illustrates the attachment of a power semiconductor die 110 to the substrate 120 of the power module 100 according to one embodiment. As noted above, the power module 100 can contain two or more power semiconductor dies 110, which are also attached using the method described in Figure 8. Fig. The power semiconductor die 110 can be attached to the substrate 120 in step 8 as shown. Attaching the power semiconductor die 110 to the substrate 120 can involve soldering, diffusion soldering, welding, gluing, etc., to a metallization layer of the substrate 120.

[0058] The Fig. Figures 9A-9E illustrate the attachment of curved segments 140 of power module connectors to the frame 130 of the power module 100 according to embodiments.

[0059] The Fig. Figures 9A-9C illustrate the attachment of the first curved segment 1401 and the second curved segment 1402 to the shaped frame 130, which is described in the description of the Fig. 1A-1D was presented. In particular, the Fig. 9A-9C the attachment of the first curved segment 1401 and the second curved segment 1402 to the formed frame 130 during the formation of the formed frame 130.

[0060] Fig. Figure 9A illustrates the insertion of part of the first curved segment 1401 and part of the second curved segment 1402 into a mold 20 shaped to form the shaped frame 130.

[0061] Fig. Figure 9B illustrates the injection of a liquefied molding compound 30 into the mold 20 such that the portion of the first curved segment 1401 and the portion of the second curved segment 1402 are embedded in the liquefied molding compound 20. In this example, the portion of each of the first curved segment 1401 and the second curved segment 1402 that is embedded in the liquefied molding compound includes the second section 142 and a second portion 1442 of the non-exposed section 144. The first section 141 and a first portion 1441 of the non-exposed section 144 of each of the first curved segment 1401 and the second curved segment 1402 are not embedded in the liquefied molding compound 20 in this example.

[0062] Fig. Figure 9C shows the finished formed frame 130, in which part of the first bent segment 1401 and part of the second bent segment 1402 are embedded in the formed frame 130. In this example, the first bent segment 1401 and the second bent segment 1402 are attached to the frame 130 (embedded therein in the example) such that the connecting interface 150, which is attached to the second section 142 of each of the first bent segment 1401 and the second bent segment 1402, is at least partially exposed to a surface 130s of the frame 130.

[0063] Fig. Figure 9D shows an alternative arrangement of the shaped frame 130. In this example, part of a curved segment 140 is without an attached connecting interface, for example, using the one shown in the Fig. The curved segment formed in steps 3A to 3G is embedded in the shaped frame 130 in such a way that the second section 142 of the curved segment 140 is at least partially free from a surface 130s of the frame 130.

[0064] Fig. Figure 9E illustrates the attachment of a curved segment 140 to the frame 130. In this example, the curved segment 140 is attached to the frame 130 after the frame 130 has been manufactured. The frame 130 contains preformed supports 132 to which the curved segment 140 is attached. The preformed supports 132 can be notches, loops, clamps, rings, straps, recesses, and / or other structures that are attached to and / or within an interior wall 130. Wof the frame 130. The preformed supports 132 can be part of the frame 130. In one example of the formed frame 130, the preformed supports 132 can be formed during a molding process used to create the formed frame 130. In this example, the bent segment 140 is attached to the frame 130 such that the connection interface 150 is partially exposed by the surface 130s of the frame 130.

[0065] Fig. Figure 10 illustrates the attachment of the frame 130 and the ends of the curved segments 1401 and 1402 attached to the frame 130 to the substrate 120 to produce the power module 100, according to one embodiment. Attaching the frame 130 to the substrate 120 of the power module 100 can involve gluing or adhesive tape fastening the frame 130 to the substrate 120, for example, along an outer circumference of the substrate 120.

[0066] The example of Fig. Figure 10 illustrates the attachment of the first sections 141 of the first curved segment 1401 and the second curved segment 1402 to the substrate 120, in particular to the metallization layer 122 of the substrate 120. The in Fig. However, the fastening step shown in Figure 10 may additionally or instead involve attaching the second section 142 of the first bent segment 1401 and / or the second bent segment 1402 to the substrate 120, or attaching one of the sections 141, 142 of one of the bent segments 1401, 1402 to an exposed contact of a power semiconductor die 110. Furthermore, the following are described with reference to Fig. The steps described in section 10 are not limited to attaching only the first sections 141 to the ends of the curved segments 140 on the substrate 120. For example, the steps described here can be used to attach intermediate sections positioned between the ends of a curved segment (e.g., when forming the power module 100 of Fig. 1C), to attach and to attach several sections to the ends of the curved segments 140 on the substrate 120 (e.g. when forming the power module 100 of Fig. 1D).

[0067] Attaching the first section 141 or the second section 142 of each of the first bent segment 1401 and the second bent segment 1402 to the substrate 120 or contact pad of a power semiconductor die 110 can involve soldering (e.g., preform or paste soldering), diffusion soldering, sintering, bonding, welding (e.g., ultrasonic welding, narrow-gap welding, resistance welding, laser welding), or other attachment methods. For example, the first section 141 or the second section 142 of the first bent segment 1401 and / or the second bent segment 1402 can be pressed or fitted into a soldered or welded interface (e.g., a rivet).

[0068] Fig. Figure 11 illustrates the addition of the insulating gel 160 to the volume 105 of the power module 100 according to one embodiment. In particular, it illustrates Fig.11. The addition of the insulating gel 160 to the volume 105 after the frame 130 has been attached to the substrate 120 of the power module 100. The insulating gel 160 is added to the volume 105 such that the substrate 120 and the first section 141 of each of the first curved segment 1401 and the second curved segment 1402 are at least partially covered by the gel 160. Furthermore, a non-exposed section 144 of each of the first curved segment 1401 and the second curved segment 1402 is at least partially not covered by the insulating gel 160. The insulating gel 160 has a depth d, measured from a surface 120. S of the substrate 120, to which the first section 141 of each of the first curved segment 1401 and the second curved segment 1402 is attached. In some examples, the depth d is less than or equal to 10 millimeters. For example, the depth d may be less than or equal to 5 millimeters.

[0069] Although the present revelation is not limited to this, the following numbered examples illustrate one or more aspects of the revelation. Example 1. Method for forming power module terminals, comprising: removing an electrically insulating sheath from each of a first section and a second section of an elongated electrically conductive body; bending the elongated electrically conductive body in one or more dimensions to form a bent segment of the elongated electrically conductive body; separating the bent segment of the elongated electrically conductive body from a main part of the elongated electrically conductive body such that each of the first section and the second section of the elongated electrically conductive body is located at one end of the separated bent segment or is located between the ends of the separated bent segment; attaching the bent segment to a frame of a power module; attaching the frame to a substrate of the power module;Attaching at least one power semiconductor die to the substrate; and attaching the first section of the elongated electrically conductive body to the substrate or to one of the power semiconductor dies. Example 2. Method according to Example 1, wherein the curved section is attached to the frame in such a way that the second section of the elongated electrically conductive body is at least partially free from a surface of the frame. Example 3. Method according to Example 1 or 2, further comprising: attaching a connection interface to the second section of the elongated electrically conductive body, wherein the curved segment is attached to the frame in such a way that the connection interface is at least partially free from a surface of the frame. Example 4. Method according to Example 3, wherein the connection interface is a nut, a rivet, a screw or a pin. Example 5. Method according to Example 3 or 4, wherein the attachment of the connection interface to the second section of the elongated electrically conductive body comprises soldering, diffusion soldering, sintering, gluing, welding or crimping. Example 6. Method according to any of Examples 1 to 5, further comprising: bending the second section of the elongated electrically conductive body in one or more dimensions. Example 7. Method according to any one of Examples 1 to 6, wherein the attachment of the first section of the elongated electrically conductive body to the substrate comprises soldering, diffusion soldering, sintering, gluing or welding. Example 8. Method according to any of Examples 1 to 7, further comprising: bending the first section of the elongated electrically conductive body in one or more dimensions. Example 9. Method according to any one of Examples 1 to 8, further comprising removing the electrically insulating sheathing from a third section of the elongated electrically conductive body, wherein the third section of the elongated electrically conductive body is located at an end of the bent segment or between ends of the bent segment after the bent segment of the elongated electrically conductive body has been separated from the main part of the elongated electrically conductive body. Example 10. Method according to Example 9, which further includes attaching the third section of the elongated electrically conductive body to the substrate. Example 11. Method according to Example 9, wherein the curved segment is attached to the frame in such a way that the third section of the elongated electrically conductive body is at least partially free from a surface of the frame. Example 12. Method according to Example 9 or 11, further comprising: attaching a connection interface to the third section of the elongated electrically conductive body, wherein the curved segment is attached to the frame in such a way that the connection interface is at least partially free from a surface of the frame. Example 13. Method according to any one of Examples 1 to 12, further comprising: adding an insulating gel to a volume bounded by the substrate and the frame, such that the substrate and the first section of the elongated electrically conductive body are at least partially covered by the gel and a portion of the curved segment between the ends of the curved segment is at least partially not covered by the gel, after the frame has been attached to the substrate of the power module. Example 14. Method according to Example 13, wherein the insulating gel has a depth of less than or equal to 5 millimeters from a surface of the substrate to which the first section of the elongated electrically conductive body is attached. Example 15. Method according to one of Examples 1 to 14, wherein the frame is an electrically insulating shaped frame. Example 16. Method according to Example 15, wherein attaching the bent segment to the formed frame comprises: inserting part of the bent segment into a mold shaped to form the formed frame during the forming of the formed frame; and injecting a liquefied molding compound into the mold such that the part of the bent segment is embedded in the liquefied molding compound. Example 17. Method according to any one of Examples 1 to 16, wherein attaching the bent segment to the frame comprises attaching the bent segment to one or more preformed notches, loops, clamps, rings, straps and / or recesses on an inner wall of the frame. Example 18. Method according to any one of Examples 1 to 17, wherein bending the elongated electrically conductive body in one or more dimensions to form the bent segment comprises twisting the elongated electrically conductive body about a longitudinal axis of the elongated electrically conductive body. Example 19. Method according to any of Examples 1 to 18, wherein a cross-section of the elongated electrically conductive body is round, square, rectangular or elliptical. Example 20. Method according to any one of Examples 1 to 19, wherein the elongated electrically conductive body has a flattened profile with a width in a first direction perpendicular to a longitudinal axis of the elongated electrically conductive body and a height in a second direction perpendicular to the first direction and the longitudinal axis of the elongated electrically conductive body, and wherein the width is greater than the height. Example 21. Method according to any one of Examples 1 to 20, wherein the bent segment is a first bent segment, and wherein the method further comprises: removing the electrically insulating sheathing from each of a third section and a fourth section of the elongated electrically conductive body; bending the elongated electrically conductive body in one or more dimensions to form a second bent segment of the elongated electrically conductive body; separating the second bent segment of the elongated electrically conductive body from the main part of the elongated electrically conductive body such that each of the third section and the fourth section of the elongated electrically conductive body is located at one end of the second bent segment or is located between ends of the second bent segment; attaching the second bent segment to the frame of the power module;and attaching the third section of the elongated electrically conductive body to the substrate. Example 22. Method according to Example 21, wherein the first curved segment has a first curved profile and the second curved segment has a second curved profile that differs from the first curved profile. Example 23. Method according to Example 21 or 22, wherein the frame is an electrically insulating shaped frame and wherein attaching the first bent segment and the second bent segment to the shaped frame comprises: inserting a portion of the first bent segment and a portion of the second bent segment into a mold shaped to form the shaped frame during the formation of the shaped frame; and injecting a liquefied molding compound into the mold such that the portion of the first bent segment and the portion of the second bent segment are embedded in the liquefied molding compound. Example 24. Method according to any one of Examples 1 to 23, wherein the removal of the electrically insulating sheathing from the first section and the second section of the elongated electrically conductive body, the bending of the elongated electrically conductive body in one or more dimensions to form a bent segment of the elongated electrically conductive body, and the separation of the bent segment of the elongated electrically conductive body from the main part of the elongated electrically conductive body are performed using a single manufacturing tool. Example 25. Power module comprising: at least one power semiconductor die attached to a substrate; a frame attached to the substrate; and an elongated electrically conductive body segment attached to the frame, comprising: a first exposed section; a second exposed section; a non-exposed section bent in one or more dimensions; and an electrically insulating material encasing the non-exposed section but not the first exposed section or the second exposed section, the first exposed section of the elongated electrically conductive body segment being attached to the substrate. Example 26. Power module according to Example 25, further comprising: an insulating gel that at least partially fills a volume bounded by the substrate and the frame such that the substrate and the first exposed section of the elongated electrically conductive body segment are at least partially covered by the gel and a portion of the non-exposed section and the second exposed section are both at least partially not covered by the gel, wherein the insulating gel is made of a different material than the electrically insulating material that encases the elongated electrically conductive body segment.

[0070] Terms like "first," "second," and the like are used to describe different elements, areas, sections, etc., and are not meant to be restrictive. The same terms refer to the same elements throughout the description.

[0071] The terms "with", "containing", "including", "exhibiting", and the like, as used here, are open terms that indicate the presence of the specified elements or features, but do not exclude additional elements or features. The articles "a", "an", "a" and "the", "a" are intended to include both the plural and the singular unless the context clearly indicates otherwise.

[0072] The expression "and / or" should be interpreted to include all possible conjunctive and disjunctive combinations unless explicitly stated otherwise. For example, the expression "A and / or B" should be interpreted to mean only A, only B, or both A and B. The expression "at least one of" should be interpreted in the same way as "and / or" unless explicitly stated otherwise. For example, the expression "at least one of A and B" should be interpreted to mean only A, only B, or both A and B.

[0073] It is understood that the features of the various embodiments described herein may be combined with one another, unless expressly stated otherwise.

[0074] Although specific embodiments have been presented and described herein, it will be obvious to those skilled in the art that a variety of alternative and / or equivalent implementations can be used in place of the specific embodiments shown and described without departing from the scope of the present invention. This application is intended to cover all adaptations or variations of the specific embodiments discussed herein. Therefore, this invention is intended to be limited only by the claims and their equivalents.

Claims

[1] Method for forming power module connections, comprising: Removing an electrically insulating sheathing (145) from each of a first section (141) and a second section (142) of an elongated electrically conductive body (40); Bending the elongated electrically conductive body (40) in one or more dimensions to form a bent segment (140) of the elongated electrically conductive body (40); Separating the curved segment (140) of the elongated electrically conductive body (40) from a main part of the elongated electrically conductive body (40) such that the first section (141) and the second section (142) of the elongated electrically conductive body (40) are each located at one end of the separated curved segment (140) or are located between ends of the separated curved segment (140); Attaching the curved segment (140) to a frame (130) of a power module (100); Attaching the frame (130) to a substrate (120) of the power module (100); Attaching at least one power semiconductor die (110) to the substrate (120); and Attaching the first section (141) of the elongated electrically conductive body (40) to the substrate (120) or one of the power semiconductor dies (110). [2] Method according to claim 1, wherein the curved section (140) is attached to the frame (130) such that the second section (142) of the elongated electrically conductive body (40) is at least partially covered by a surface (130) S ) of the frame (130) is exposed. [3] The method of claim 1, further comprising: Attaching a connection interface (150) to the second section (142) of the elongated electrically conductive body (40), wherein the curved segment (140) is attached to the frame (130) in such a way that the connection interface (150) is at least partially separated from a surface (130) S ) of the frame (130) is exposed. [4] Method according to claim 3, wherein the connection interface (150) is a nut, a rivet, a screw or a pin. [5] Method according to claim 3, wherein the attachment of the connection interface (150) to the second section (142) of the elongated electrically conductive body (40) comprises soldering, diffusion soldering, sintering, gluing, welding or crimping. [6] The method of claim 1, further comprising: Bending the second section (142) of the elongated electrically conductive body (40) in one or more dimensions and / or Bending the first section (141) of the elongated electrically conductive body (40) in one or more dimensions. [7] Method according to claim 1, wherein the attachment of the first section (141) of the elongated electrically conductive body (40) to the substrate (120) comprises soldering, diffusion soldering, sintering, gluing or welding. [8] The method of claim 1, further comprising removing the electrically insulating sheathing (145) from a third section (143) of the elongated electrically conductive body (40), wherein the third section (143) of the elongated electrically conductive body (40) is located at an end of the bent segment (140) of the elongated electrically conductive body (40) or is located between ends of the bent segment (140) after the bent segment (140) of the elongated electrically conductive body (40) has been separated from the main part of the elongated electrically conductive body (40). [9] Method according to claim 8, further comprising attaching the third section (143) of the elongated electrically conductive body (40) to the substrate (120). [10] Method according to claim 8, wherein the curved segment (140) is attached to the frame (130) such that the third section (143) of the elongated electrically conductive body (40) is at least partially covered by a surface (130 S ) of the frame (130) is exposed. [11] The method of claim 8, further comprising: Attaching a connection interface (150) to the third section (143) of the elongated electrically conductive body (40), wherein the curved segment (140) is attached to the frame (130) in such a way that the connection interface (150) is at least partially separated from a surface (130) S ) of the frame (130) is exposed. [12] The method of claim 1, further comprising: Adding an insulating gel (160) to a volume bounded by the substrate (120) and the frame (130) such that the substrate (120) and the first section (141) of the elongated electrically conductive body (40) are at least partially covered by the gel (160) and a part of the curved segment (140) between the ends of the curved segment (140) is at least partially not covered by the gel (160), after attaching the frame (130) to the substrate (120) of the power module (100). [13] Method according to claim 12, wherein the insulating gel (160) has a depth of less than or equal to 5 millimeters from a surface (120s) of the substrate (120) to which the first section (141) of the elongated electrically conductive body (40) is attached. [14] Method according to claim 1, wherein the frame (130) is an electrically insulating shaped frame (130). [15] Method according to claim 14, wherein the fastening of the bent segment (140) to the shaped frame (130) comprises: Inserting part of the curved segment (140) into a mold (20) shaped to form the formed frame (130) during the formation of the formed frame (130); and Injecting a liquefied molding compound (30) into the mold (20) such that the part of the bent segment (140) is embedded in the liquefied molding compound (30). [16] Method according to claim 1, wherein attaching the bent segment (140) to the frame (130) involves attaching the bent segment (140) to one or more preformed notches, loops, clamps, rings, straps and / or recesses on an inner wall (130) W ) of the frame (130). [17] Method according to claim 1, wherein bending the elongated electrically conductive body (40) in one or more dimensions to form the bent segment (140) comprises twisting the elongated electrically conductive body (40) about a longitudinal axis of the elongated electrically conductive body (40). [18] Method according to claim 1, wherein a cross-section of the elongated electrically conductive body (40) is round, square, rectangular or elliptical. [19] Method according to claim 1, wherein the elongated electrically conductive body (40) has a flattened profile with a width in a first direction perpendicular to a longitudinal axis of the elongated electrically conductive body (40) and a height in a second direction perpendicular to the first direction and the longitudinal axis of the elongated electrically conductive body (40), and wherein the width is greater than the height. [20] Method according to claim 1, wherein the bent segment (140) is a first bent segment (1401) and wherein the method further comprises: Removing the electrically insulating sheathing (145) from each of a third section (143) and a fourth section (148) of the elongated electrically conductive body (40); Bending the elongated electrically conductive body (40) in one or more dimensions to form a second bent segment (1402) of the elongated electrically conductive body (40); Separating the second curved segment (1402) of the elongated electrically conductive body (40) from the main part of the elongated electrically conductive body (40) such that the third section (143) and the fourth section (148) of the elongated electrically conductive body (40) are each located at one end of the second curved segment (1402) or are located between ends of the second curved segment (1402); Attaching the second curved segment (1402) to the frame (130) of the power module (100); and Attaching the third section (143) of the elongated electrically conductive body (40) to the substrate (120). [21] Method according to claim 20, wherein the first bent segment (1401) has a first bent profile and the second bent segment (1402) has a second bent profile which differs from the first bent profile. [22] Method according to claim 20, wherein the frame (130) is an electrically insulating shaped frame (130) and wherein the fastening of the first bent segment (1401) and the second bent segment (1402) to the shaped frame (130) comprises: Inserting part of the first curved segment (1401) and part of the second curved segment (1402) into a mold (20) shaped to form the formed frame (130) during the formation of the formed frame (130); and Injecting a liquefied molding compound (30) into the mold (20) such that the part of the first curved segment (1401) and the part of the second curved segment (1402) are embedded in the liquefied molding compound (30). [23] Method according to claim 1, wherein the removal of the electrically insulating sheathing (145) from the first section (141) and the second section (142) of the elongated electrically conductive body (40), the bending of the elongated electrically conductive body (40) in one or more dimensions to form a bent segment (140) of the elongated electrically conductive body (40), and the separation of the bent segment (140) of the elongated electrically conductive body (40) from the main part of the elongated electrically conductive body (40) are carried out using a single manufacturing tool. [24] Power module (100) which features: at least one power semiconductor die (110) attached to a substrate (120); a frame (130) attached to the substrate (120); and an elongated electrically conductive body segment (40) that is attached to the frame (130) and has: a first exposed section (141); a second exposed section (142); a non-exposed section (144) that is bent in one or more dimensions; and an electrically insulating material (145) that encases the non-exposed section (144) but not the first exposed section (141) or the second exposed section (142), wherein the first exposed section (141) of the elongated electrically conductive body segment (40) is attached to the substrate (120). [25] Power module (100) according to claim 24, further comprising: an insulating gel (160) that at least partially fills a volume bounded by the substrate (120) and the frame (130) such that the substrate (120) and the first exposed section (141) of the elongated electrically conductive body segment (40) are at least partially covered by the gel (160) and part of the non-exposed section (144) and the second exposed section (142) are both at least partially not covered by the gel (160), wherein the insulating gel (160) is made of a different material than the electrically insulating material (145) that encases the elongated electrically conductive body segment (40).

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