Humidity sensor and method for its manufacture

Abstract

Humidity sensor with: - a humidity detection section (30) comprising a pair of detection electrodes (31a, 31b) and a humidity-sensitive film (36), wherein the detection electrodes (31a, 31b) are opposed to each other on a humidity detection section forming surface (20a) of a substrate (20), and wherein the humidity-sensitive film (36) covers the detection electrodes (31a, 31b) and a space between the detection electrodes (31a, 31b); - a contact point portion (40) as an external connection terminal, wherein the contact point portion (40) is spaced from the humidity sensing portion (30) on the humidity sensing portion forming surface (20a) of the substrate (20) and covered with a protective gel portion (50), under a condition that a bonding wire (115) is connected to the contact point portion (40); and - a barrier portion (60) disposed between the humidity sensing portion (30) and the contact point portion (40) on the humidity sensing portion forming surface (20a) of the substrate (20) to prevent the protective gel portion (50) from flowing from the contact point portion (40) side to the humidity sensing portion (30) side, wherein - the barrier section (60) has a barrier line (61, 81) and a humidity-sensitive barrier film (62), - the blocking line (61, 81) is constructed from the same material as the detection electrodes (31a, 31b) and is arranged on the same surface as the detection electrodes (31a, 31b), - the humidity-sensitive barrier film (62) is constructed from the same material as the humidity-sensitive film (36) and covers at least part of the barrier line (61, 81), - the humidity sensor further comprises a plurality of blocking lines (61, 81) which include the blocking line (61, 81) and are arranged side by side in an opposing direction in which the humidity sensing section (30) and the contact point section (40) are opposite each other, and - the blocking section (60) has a recess (63, 64) between adjacent blocking lines (61, 81) of the plurality of blocking lines (61, 81).

Description

TECHNICAL FIELD

[0001] The present invention relates to a humidity sensor and a method of manufacturing the humidity sensor, which comprises a pair of detection electrodes arranged opposite to each other and a humidity-sensitive film covering the detection electrodes and a space between the detection electrodes. STATE OF THE ART

[0002] Humidity sensors are known, for example, from JP 2008 - 64 561 A and JP 2002 - 71 612 A.

[0003] In JP 2008-64561 A, a pair of comb-shaped electrodes are formed on a surface of a substrate, and a frame member made of a foam is arranged around the comb-shaped electrodes. The entire area inside the frame member is covered with a humidity-sensitive film. Furthermore, a contact pad portion is formed as an external connection terminal on the substrate outside the frame member.

[0004] In JP 2002-71612 A, a humidity sensing section and a circuit section are formed on the same substrate. The humidity sensing section has a pair of sensing electrodes and a humidity-sensitive film. The circuit section processes an output signal from the humidity sensing section. The pair of sensing electrodes, which face each other on the same surface of the substrate, are spaced apart from each other. The humidity-sensitive film covers the sensing electrodes and a space between the sensing electrodes. Furthermore, a contact pad (not shown) of the circuit section is connected with a bonding wire, and a barrier section is formed between the humidity sensing section and the contact pad portion (the circuit section) of the substrate.

[0005] The contact portion is typically constructed of aluminum, for example, due to cost considerations. Consequently, there are concerns that the contact portion will corrode if the humidity sensor is used in a humid atmosphere. In JP 2002-71612 A, a protective gel portion made of a water-resistant material covers the contact portion, and the protective gel portion protects the contact portion from corrosion.

[0006] However, the protective gel portion still possesses flowability when the protective gel portion is applied. A curing process is then performed so that the protective gel portion can be firmly arranged at a predetermined position. Consequently, when the protective gel portion with flowability is applied to the contact point portion, the protective gel portion may flow and adhere to a surface of the humidity-sensitive film. In such a case, a property of the humidity-sensitive film may be changed, resulting in a decrease in humidity detection accuracy.

[0007] In JP 2008 - 64 561 A, the barrier portion reduces adhesion of the protective gel portion to the humidity-sensitive film. In JP 2002 - 71 612 A, the frame element reduces adhesion of the protective gel portion to the humidity-sensitive film.

[0008] Incidentally, in JP 2002-71612 A, the barrier portion is formed by applying polyimide, as a material for the humidity-sensitive film, to an area where the humidity sensing portion is formed, while applying polyimide to an area where the barrier portion is formed. Since the humidity-sensitive film and the barrier portion are formed simultaneously, the structure of the humidity sensor is simplified. Furthermore, the manufacturing process is simplified.

[0009] However, in JP 2002-71612 A, the barrier portion, like the humidity-sensitive film, is constructed solely of polyimide. Since the height of the barrier portion depends on the formation conditions of the humidity-sensitive film, it is difficult to form the barrier portion much higher (thicker) than the humidity-sensitive film. Consequently, if the amount of the protective gel portion to be applied is large, the protective gel portion may flow over the barrier portion to the humidity-sensing portion and adhere to the humidity-sensitive film.

[0010] In JP 2002-71612 A, the frame element is formed as a separate part from the humidity-sensitive film. Consequently, the height of the frame element can be set to a desired height regardless of the formation states of the humidity-sensitive film. However, since the frame element is formed as a separate part from the other elements of the humidity sensor, the number of parts of the humidity sensor increases. Consequently, the manufacturing process becomes complicated. The increase in the number of parts and the complication of the manufacturing process are clearly reflected in an increase in manufacturing costs. This makes the humidity sensor expensive.

[0011] DE 10 2006 018 563 A1 further discloses a capacitive humidity sensor comprising a humidity sensing element, a substrate, and an insulating layer. The humidity sensing element comprises a pair of comb-shaped electrodes and a humidity-sensitive layer. The comb-shaped electrodes are surrounded by a dam provided by a portion of the insulating layer. The insulating layer on the comb-shaped electrodes has a first height. The portion of the insulating layer on the dam has a second height that is higher than the first height. The humidity-sensitive layer has a height that is equal to or lower than the second height and is arranged within the dam. The dam further includes a first ring pattern made of the same material as the comb-shaped electrodes. SUMMARY OF THE INVENTION

[0012] It is an object of the present invention to provide a humidity sensor and a method for manufacturing the humidity sensor to effectively reduce adhesion of a protective gel portion to a humidity-sensitive film and at the same time simplify a structure and a manufacturing process.

[0013] The object is achieved by a humidity sensor according to claim 1 and a method for manufacturing a humidity sensor according to claim 15. Advantageous further developments are the subject of the subclaims.

[0014] According to the invention, the barrier line of the barrier portion is formed on the same surface as the detection electrodes, using the same material as the detection electrodes. Furthermore, the humidity-sensitive barrier film of the barrier portion is formed using the same material as the humidity-sensitive film. Consequently, the structure of the humidity sensor can be simplified. Furthermore, since the barrier portion is formed using a process in which another portion of the humidity sensor is formed, a manufacturing process can be simplified.

[0015] Furthermore, the barrier portion has a multi-layer structure in which the humidity-sensitive barrier film is disposed on the barrier line. Consequently, the height of the barrier portion can be increased compared to the case where the barrier portion is constructed only with the humidity-sensitive barrier film. Accordingly, the protective gel portion is less likely to flow over the barrier portion, and adhesion of the protective gel portion to a surface of the humidity-sensitive film can be effectively mitigated.

[0016] Consequently, according to the present invention, the structure and manufacturing process can be simplified, and the adhesion of the protective gel portion to the humidity-sensitive film can be effectively reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other objects, features, and advantages of the present invention will become more apparent from the following detailed description with reference to the accompanying drawings. In the drawings: Fig. 1 is a diagram illustrating a perspective view of a humidity detecting device having a humidity sensor according to a first embodiment, in which a protective gel is omitted for simplicity; Fig. 2 is a diagram illustrating a plan view of the humidity sensor of the first embodiment, in which a detection electrode, a reference electrode, a lead for connecting the electrodes to a pad, and a dummy lead are shown by a solid line, and the protective gel is shown by a dashed line for convenience; Fig. 3 is a figure illustrating a cross-sectional view along the line III-III in the Fig. 2, in which the line for connecting the detection electrode to the contact point is omitted and the number of detection electrodes and dummy lines is compared with the Fig. 2 is reduced; Fig. 4A is a diagram illustrating a cross-sectional view for explaining an advantage of a blocking portion of a structure of the first embodiment, in which, for convenience, the number of dummy lines is compared with the Fig. 3 is reduced, and Fig. 4B is a diagram illustrating a cross-sectional view of a conventional structure as a comparative example; Fig. 5 is a diagram illustrating a cross-sectional view of a locking portion according to a modification; Fig. 6 is a diagram illustrating a cross-sectional view of a locking portion according to a modification; Fig. 7 is a diagram illustrating a plan view of a layout of a barrier portion of a substrate according to a modification, in which a detection electrode, a reference electrode, a wire for connecting the electrodes to a pad, and a dummy wire are shown by a solid line, and the protective gel is shown by a dashed line for convenience; Fig. 8 is a diagram illustrating a plan view of a layout of a barrier portion on a substrate according to a modification, in which a detection electrode, a reference electrode, a line for connecting the electrodes to a pad, and a dummy line are shown by a solid line, and a protective gel is shown by a dashed line for convenience; Fig. 9 is a diagram illustrating a plan view of a humidity sensor according to a second embodiment, in which a detection electrode, a reference electrode, a lead for connecting the electrodes to a pad, and a dummy lead are shown by a solid line, and a protective gel is shown by a dashed line for convenience; Fig. 10 is a diagram illustrating a plan view of a humidity sensor according to a third embodiment, in which a detection electrode, a reference electrode, a lead for connecting the electrodes to a circuit portion, a lead of the circuit portion in a barrier portion, a lead for connecting the circuit portion to a pad are shown by a solid line, a protective gel is shown by a dashed line, and portions of the circuit portion except for the lead in the barrier portion are shown by a one-dot chain line. EMBODIMENTS OF THE INVENTION

[0018] Embodiments of the present invention are described below with reference to the drawings, in which like elements are designated by like reference numerals. In the plan views of the Fig. 2 and 7 to 10, a humidity-sensitive film, a humidity-sensitive barrier film, and a humidity-sensitive bonding film are hatched to indicate regions where they are formed. (First embodiment)

[0019] Fig. 1 shows a humidity sensing device 100 with a humidity sensor chip 10 according to a present embodiment. The humidity sensing device 100 includes a housing 110 constructed of synthetic resin and shaped like a rectangular tube with a bottom, lead frame islands 111 and 112 mounted on an inner surface of the bottom of the housing 110, a humidity sensor chip 10 mounted on the island 111, a circuit chip 113 mounted on the island 112, and a lead (lead) 114 having a first end inside the housing 110 and a second end outside the housing 110.

[0020] Humidity sensor chip 10 and circuit chip 113 are electrically connected to each other via a bonding wire 115. Circuit chip 113 and lead 114 are electrically connected to each other via a bonding wire 116. Although not shown in the drawings, bonding wire 115, bonding wire 116, and their connecting portions (contact pads) are covered with a protective gel.

[0021] Accordingly, the humidity sensor chip 10 according to the present embodiment is a separate chip from the circuit chip 113. The humidity sensor chip 10 corresponds to a humidity sensor recited in the claims.

[0022] A structure of the humidity sensor chip 10 is described below.

[0023] As in the Fig. 2 and Fig. As shown in Figure 3, in the humidity sensor chip 10, a humidity sensing portion 30, a pad 40 as an external connection terminal, and a barrier portion 60 for reducing flow of a protective gel 50 are formed on the same substrate 20. The pad 40 is protected by the protective gel 50 under a condition that the bonding wire 115 is connected to the pad 40. The pad 40 corresponds to a pad portion recited in the claims, and the protective gel 50 corresponds to a protective gel portion recited in the claims.

[0024] According to the present embodiment, the substrate 20 is a silicon substrate, and an impurity diffusion layer 21 is formed in a surface portion of the entire first surface of the substrate 20. According to the present embodiment, the diffusion layer 21 is a p-type diffusion layer. An insulating layer 22 is formed on the diffusion layer 21, and a contact hole 22a is formed in a part of the insulating layer 22. According to the present embodiment, the insulating layer 22 includes a silicon oxide layer and a BPSG layer stacked in this order from the substrate 20 side. The humidity sensing portion 30, the pad 40, and the barrier portion 60 are formed on the insulating layer 22.The substrate 20 and the insulating layer 22 are collectively referred to as a substrate, and an opposite side of the insulating layer 22 from the substrate 20 is referred to as a first surface 20a of the substrate 20. The first surface 20a corresponds to a humidity sensing section forming surface recited in the claims.

[0025] The humidity sensing section 30 includes at least one capacitive sensing device 31. According to the present embodiment, the humidity sensing section 30 further includes a capacitive reference device 32. The capacitive sensing device 31 includes a pair of sensing electrodes 31a, 31b located opposite each other on the first surface 20a of the substrate 20. The capacitive reference device 32 includes a pair of reference electrodes 32a, 32b located opposite each other on the first surface 20a of the substrate 20, at a different position than the sensing electrodes 31a, 31b.

[0026] The shapes of the detection electrodes 31a, 31b and the reference electrodes 32a, 32b are not limited. According to the present embodiment, the detection electrodes 31a, 31b have, as shown in Fig. 2, have a comb shape and are arranged alternately. Due to the comb shape, while the layout area of ​​the detection electrodes 31a, 31b is reduced, the overlap area of ​​the detection electrodes 31a, 31b is increased. Consequently, a change in capacitance between the detection electrodes 31a, 31b with respect to a change in ambient humidity is increased, so that the sensor sensitivity can be increased. Similarly, the reference electrodes 32a, 32b have a comb shape and the reference electrodes 32a, 32b are arranged alternately.

[0027] Furthermore, the detection electrodes 31a, 31b differ, as in Fig. 2, in the overlap area and the number of teeth of the comb shape of the reference electrodes 32a, 32b. Specifically, the number of teeth of the detection electrodes 31a, 31b is larger than that of the reference electrodes 32a, 32b, and the overlap area of ​​the detection electrodes 31a, 31b is larger than that of the reference electrodes 32a, 32b.

[0028] The detection electrodes 31a, 31b and the reference electrodes 32a, 32b are constructed of the same material. Specifically, a wiring material such as aluminum, copper, gold, platinum, or polycrystalline silicon is deposited by vapor deposition, sputtering, or the like. Subsequently, a comb shape is formed by patterning in a photolithographic process. According to the present embodiment, the detection electrodes 31a, 31b, the reference electrodes 32a, 32b, and the contact pad 40 are constructed of aluminum. Consequently, as shown in Fig. 3, a protective layer 23 is formed on the detection electrodes 31a, 31b and the reference electrodes 32a, 32b, and a humidity-sensitive film 36 is formed on the protective layer 23.

[0029] The protective layer 23 protects the sensing electrodes 31a, 31b and the reference electrodes 32a, 32b from corrosion due to water. According to the present embodiment, the protective layer 23 is a silicon nitride layer formed by a plasma CVD method. The protective layer 23 is formed on the first surface 20a of the substrate 20 to cover not only the sensing electrodes 31a, 31b but also portions except for the contact pad 40. If the sensing electrodes 31a, 31b (and the reference electrodes 32a, 32b) are corrosion-resistant to water, the protective layer 23 can be omitted.

[0030] The humidity-sensitive film 36 is formed on the protective layer 23 to cover the detection electrodes 31a, 31b, a portion between the detection electrodes 31a, 31b, the reference electrodes 32a, 32b, and a portion between the reference electrodes 32a, 32b. According to the present embodiment, the humidity-sensitive film 36 for covering the detection electrodes 31a and 31b and the humidity-sensitive film 36 for covering the reference electrodes 32a and 32b are integrally formed as a single humidity-sensitive film 36. The humidity-sensitive film 36 can be composed of a known material, such as a polyimide-type material. According to the present embodiment, the humidity-sensitive film 36 is composed of a polyimide-type material.After a precursor (polyamide) is coated by a spin-coating process or a printing process, a heating and curing treatment (imidization treatment) is applied such that the humidity-sensitive film 36 can be formed.

[0031] In the humidity detection section 30, as in Fig. 2, the detection electrode 31a of the capacitive detection device 31 is electrically connected to a corresponding contact point 41 via a line 33. The detection electrode 31b of the capacitive detection device 31 and the reference electrode 32b of the capacitive reference device 32 are electrically connected to a corresponding contact point 42 via a common line 34. The reference electrode 32a of the capacitive reference device 32 is electrically connected to a corresponding contact point 43 via a line 35. Consequently, a capacitor formed by the pair of detection electrodes 31a, 31b is connected between the contact points 41 and 43 in series with a capacitor formed by the pair of reference electrodes 32a, 32b, and a connection point (midpoint) between these capacitors is connected to the contact point 42.

[0032] These lines 33-35 are formed on the first surface 20a of the substrate 20, i.e., on the same plane as the detection electrodes 31a, 31b and the reference electrodes 32a, 32b. Furthermore, the lines 33-35, like the detection electrodes 31a, 31b and the reference electrodes 32a, 32b, are constructed of aluminum and covered with the protective layer 23.

[0033] The contact pads 41-43, which are electrically connected to the electrodes 31a, 31b, 32a, and 32b of the humidity sensing section 30, are included in the contact pad 40. End portions of the leads 33-35 on the opposite side from the humidity sensing section 30 are exposed through the opening of the protective layer 23 and serve as the respective contact pads 41-43. That is, the contact pads 41-43 are constructed of the same aluminum as the sensing electrodes 31a, 31b and the reference electrodes 32a, 32b.

[0034] According to the present embodiment, the contact pad 40 further includes a contact pad 44 that is electrically connected to the diffusion layer 21. A line 45 extending along an edge of the substrate 20 having a rectangular planar shape is connected to the contact pad 44. A portion of the line 45 is, as shown in Fig. 3, exposed through the opening of the protective layer 23 and serves as the contact point 44. The line 45 is also formed on the first surface 20a of the substrate 20, ie, on the same plane as the detection electrodes 31a, 31b and the reference electrodes 32a, 32b. Furthermore, the line 45, like the detection electrodes 31a, 31b and the reference electrodes 32a, 32b, is constructed of aluminum and covered with the protective layer 23. A contact hole 22a of the insulating layer 22 is, as shown in Fig. 3, is filled with the line 45 such that the line 45 can be electrically connected to the diffusion layer 21. Consequently, when a constant potential (such as a ground potential) is applied to the line 45 via the contact point 44, the diffusion layer 21 can serve as a shielding layer against electromagnetic waves.

[0035] The contact pad 40 (41-44) is covered with the protective gel 50 under the condition that the bonding wire 115 is connected to the contact pad 40. That is, before the bonding wire 115 is connected to the contact pad 40, the humidity sensor chip 10 does not have the protective gel 50. The protective gel 50 protects the aluminum contact pad 40 from corrosion due to water and is composed of a water-resistant material such as a fluorinated gel. The protective gel 50 is applied around the contact pad 40 using a dispenser or the like and then cured. Consequently, the protective gel 50 still exhibits flowability when applied.

[0036] If the protective gel 50 applied near the contact point 40 flows toward the humidity sensing portion 30 and adheres to the humidity-sensitive film 36, a property of the humidity-sensitive film 36 may be changed such that the detection accuracy at ambient humidity may be reduced. For this reason, the barrier portion 60 is formed on the first surface 20a of the substrate 20 between the humidity sensing portion 30 and the contact point 40. The barrier portion 60 prevents the protective gel 50 applied near the contact point 40 from flowing toward the humidity sensing portion 30 and adhering to the humidity-sensitive film 36.

[0037] The barrier portion 60 includes a dummy line 61 and a humidity-sensitive barrier film 62. The dummy line 61 is constructed of the same material as the detection electrodes 31a, 31b and is formed on the same plane (the first surface 20a of the substrate 20) as the detection electrodes 31a, 31b. The humidity-sensitive barrier film 62 is constructed of the same material as the humidity-sensitive film 36 and covers at least a portion of the dummy line 61. That is, the barrier portion 60 has a multi-layer structure including the dummy line 61 and the humidity-sensitive barrier film 62.

[0038] The blocking section 60 is described in more detail below. The dummy line 61 is electrically insulated from the electrodes 31a, 31b, 32a, 32b and the contact point 40 of the humidity sensing section 30 and does not provide an electrical connection function. The dummy line 61 is, as shown in Fig. 3, on the same plane as the detection electrodes 31a, 31b, ie, on the first surface 20a of the substrate 20. According to the present embodiment, the lines 33-35, 45, as shown in Fig. 2, the dummy line 61 is formed near an edge of the humidity sensor chip 10 (the first surface 20a of the substrate 20) having the rectangular planar shape. The dummy line 61 extends in a direction (a direction along one side of the rectangular shape) perpendicular to an opposing direction (hereinafter simply referred to as the "opposing direction") in which the humidity sensing portion 30 and the pad 40 oppose each other, to divide the humidity sensor chip 10 having the rectangular planar shape into two regions. Further, the plurality of dummy lines 61 are arranged side by side in the opposing direction. Specifically, the dummy lines 61 are arranged in parallel at regular intervals.

[0039] Like the detection electrodes 31a, 31b, the dummy line 61 is made of aluminum. Consequently, as shown in Fig. 3, the dummy line 61 is also covered with the protective layer 23, and the humidity-sensitive barrier film 62 is formed by the protective layer 23. Like the humidity-sensitive film 36, the humidity-sensitive barrier film 62 is constructed of a polyimide-type material.

[0040] The humidity-sensitive barrier film 62 is formed over the dummy lines 61a. Specifically, the humidity-sensitive barrier film 62 is formed integrally over the dummy lines 61, which are arranged adjacent to each other in the opposing direction. Since no dummy line 61a is arranged between the adjacent dummy lines 61a, as shown in Fig. 4, a recess 63 is formed on a surface of the humidity-sensitive barrier film 62 between the dummy lines 61a. The humidity-sensitive barrier film 62 extends from one side to the other from opposite sides of the humidity sensor chip 10 having the rectangular planar shape along an extending direction (a longitudinal direction) of the dummy line 61a. Thus, the humidity-sensitive barrier film 62 divides the humidity sensor chip 10 having the rectangular planar shape into two regions in the opposing direction.

[0041] The other dummy lines 61 are dummy lines 61b. The dummy lines 61b are exposed outside the humidity-sensitive barrier film 62, and only the protective layer 23 is disposed over the dummy lines 61b. According to the present embodiment, the dummy line 61b is, as shown in FIGS. Fig. 2 to 4, arranged between the humidity-sensitive film 36 and the humidity-sensitive barrier film 62. Since no dummy line 61 is arranged between the dummy line 61b and the dummy line 61a adjacent to the dummy line 61b, a depression 64 appears on a surface of the protective layer 23 between the dummy lines 61a, 61b. Although not shown in the Fig. 3 and Fig. 4 are as shown in Fig. 5, a plurality of dummy lines 61b are exposed outside the humidity-sensitive barrier film 62. Consequently, the recess 64 also appears on the surface of the protective layer 23 between the dummy lines 61b.

[0042] The barrier portion 60 is spaced apart from the humidity detection portion 30 in the opposing direction. Specifically, there is a region where no line and no electrode are formed between the dummy line 61 and the detection electrodes 31a, 31b and the reference electrodes 32a, 32b in the opposing direction. Furthermore, the humidity-sensitive film 36 and the humidity-sensitive barrier film 62 are completely separated from each other. There is a region where the humidity-sensitive films 36, 62 are not arranged between the humidity-sensitive film 36 and the humidity-sensitive barrier film 62 in the opposing direction. Consequently, as shown in Fig. 4, a recess 65 is formed on the surface of the protective layer 23 between the humidity sensing portion 30 and the outermost dummy line 61 closest to the humidity sensing portion 30 in the opposing direction.

[0043] In the humidity sensor chip 10, the capacitance of the capacitor formed in the capacitive sensing device 31 changes with a change in the ambient relative humidity, and the capacitance of the capacitor formed in the capacitive reference device 32 changes with the change in the ambient relative humidity. Furthermore, due to the above configuration, the ratio of the change in capacitance to the change in the ambient humidity is different between the capacitive sensing device 31 and the capacitive reference device 32. Accordingly, each capacitance is described by a straight line with a different slope and intercept point with respect to the ambient relative humidity. Specifically, there is a difference in sensitivity between the capacitive sensing device 31 and the capacitive reference device 32.Consequently, the relative ambient humidity can be detected based on a difference in the change in capacitance between the capacitive detection device 31 and the capacitive reference device 32.

[0044] Furthermore, the humidity-sensitive film 36 formed on the detection electrodes 31a, 31b is constructed of the same material as the humidity-sensitive film 36 formed on the reference electrodes 32a, 32b. Consequently, the influence of a sensor output characteristic with temperature (a sensitivity characteristic with temperature) due to the temperature-dependent characteristic of the humidity-sensitive film 36 (a water vapor absorption and desorption characteristic with temperature) and the influence of age-related deterioration of the humidity-sensitive film 36 can be eliminated.

[0045] The humidity sensor chip 10 can be manufactured, for example, by the manufacturing method described below.

[0046] First, a silicon wafer is prepared as the substrate 20, and a silicon oxide layer is formed on a surface by thermal oxidation. Then, the diffusion layer 21 is formed by ion implantation of impurities through the silicon oxide layer into the surface of the substrate 20. Following this, the BPSG layer is formed on the silicon oxide layer such that the BPSG layer and the silicon oxide layer can become the insulating layer 22. Then, after the contact hole 22a is formed at a predetermined position of the insulating layer 22, aluminum is deposited on the entire first surface 20a of the substrate 20. Then, the electrodes 31a, 31b, 32a, 32b, the lines 33-35 with the pad 40 (41-44), and the dummy line 61 are patterned.In this way, the electrodes 31a, 31b, 32a and 32b of the humidity detecting section 30 and the dummy line 61 (blocking line) are formed in the same process using the same material.

[0047] Subsequently, a silicon nitride layer is formed as the protective layer 23 on the entire first surface 20a of the substrate 20, and the contact pad 40 (41-44) is exposed by patterning. Following this, after the first surface 20a of the substrate 20 is coated with a precursor using, for example, a spin coating method, a hardening treatment is performed. Then, the humidity-sensitive film 36 and the humidity-sensitive barrier film 62 are formed by patterning. In this way, the humidity-sensitive film 36 of the humidity sensing section 30 and the humidity-sensitive barrier film 62 are formed in the same process using the same material.

[0048] Subsequently, the substrate 20 is diced into chips. After the bonding wire 115 has been connected to the corresponding contact point 40 (41-44), the protective gel 50 is applied around the contact point 40 using a dispenser or the like. The protective gel 50 is then cured. In this way, the humidity sensor chip 10 can be manufactured.

[0049] Advantages of the humidity sensor chip 10 and the manufacturing method of the present embodiment will be described below.

[0050] According to the present embodiment, the dummy line 61 as a barrier line of the barrier section 60 and the detection electrodes 31a, 31b of the humidity detection section 30 are formed in the same process using the same material. Furthermore, the dummy line 61 is formed on the same plane (on the first surface 20a of the substrate 20) as the detection electrodes 31a, 31b. Furthermore, the humidity-sensitive barrier film 62 of the barrier section 60 and the humidity-sensitive film 36 of the humidity detection section 30 are formed in the same process using the same material. Since the barrier section 60 is fabricated using the same material as the humidity detection section 30, a structure of the humidity sensor chip 10 can be simplified.Furthermore, since the barrier portion 60 is formed using the manufacturing process in which the humidity sensing portion 30 is formed, the manufacturing process can be simplified.

[0051] Furthermore, as in Fig. 4B, when the barrier portion 60 includes only the humidity-sensitive barrier film 62 without the dummy line 61 as the barrier line, a height H2 of the barrier portion 60 at a position where no dummy line 61 is present on the insulating layer 22 (at a position where the protective layer 23 is in contact with the insulating layer 22) is equal to a thickness of the humidity-sensitive barrier film 62. Since the humidity-sensitive film 36 and the humidity-sensitive barrier film 62 are formed in the same process using the same material as described above, it is difficult to form the humidity-sensitive barrier film 62 much thicker than the humidity-sensitive film 36. Consequently, when only the humidity-sensitive barrier film 62 is used, the barrier portion 60 cannot have a sufficient height.

[0052] In contrast, the locking portion 60 according to the present embodiment, as shown in Fig. 4A, a multi-layer structure in which the humidity-sensitive barrier film 62 is arranged on the dummy line 61a, layered over the protective layer 23. Consequently, a height H1 of the barrier portion 60 at a position where no dummy line 61 is located on the insulating layer 22 (at a position where the protective layer 23 is in contact with the insulating layer 22) is equal to the sum of a thickness of the humidity-sensitive barrier film 62 and a thickness of the dummy line 61 (61a). Accordingly, the height of the barrier portion 60 can be increased compared to the case where the barrier portion 60 only includes the humidity-sensitive barrier film 62. Consequently, since the protective gel 50 is less likely to flow over the barrier portion 60, adhesion of the protective gel 50 to a surface of the humidity-sensitive film 36 can be effectively reduced. Fig. 4A and Fig. 4B, an area between dashed lines shows a formation area of ​​the barrier section 60.

[0053] According to the present embodiment, as described above, the structure and manufacturing process of the humidity sensor chip 10 can be simplified, and the adhesion of the protective gel 50 to the humidity sensitive film 36 can be effectively reduced.

[0054] Furthermore, according to the present embodiment, the dummy line 61 as the barrier line is electrically insulated from the detection electrodes 31a, 31b and the pad 40, and the dummy line 61 does not provide an electrical connection function. With such an approach, the height of the barrier section 60 can be increased without a line 81 of a circuit section 80, which will be described later. Furthermore, since the dummy line 61 does not provide an electrical connection function, signal quality can be maintained even when a plurality of dummy lines 61 are arranged side by side and covered with the humidity-sensitive barrier film 62.

[0055] It should be noted that frictional resistance depends on the shape of an object in contact with a viscous element, such as the protective gel 50. In particular, since a structure with a projection and a recess has a large contact area with the viscous element, the frictional resistance is high compared to a flat surface. That is, the protective gel 50 cannot flow easily.

[0056] In this regard, according to the present embodiment, a plurality of dummy lines 61 are arranged side by side in the opposing direction in which the humidity sensing portion 30 and the contact pad 40 are opposed to each other, and the barrier portion 60 has the recesses 63, 64 between adjacent dummy lines 61. Specifically, the humidity-sensitive barrier film 62 is integrally formed across the adjacent dummy lines 61a, and the recess 63 is arranged on the surface of the humidity-sensitive barrier film 62 between the dummy lines 61a. The dummy line 61 has the dummy line 61b exposed outside the humidity-sensitive barrier film 62, and the recess 64 is arranged between the dummy line 61b and the dummy line 61 (61a or 61b) adjacent to this dummy line 61b.

[0057] When the barrier portion 60 has the recesses 63, 64 between the dummy lines 61 (at a position where no dummy line 61 exists), the contact area between the barrier portion 60 and the protective gel 50 until the protective gel 50 flows over the barrier portion 60 is increased without increasing the size of the barrier portion 60 in the opposing direction. Specifically, a length of a flow path required for the protective gel 50 to flow over the barrier portion 60 is increased. Consequently, the frictional resistance of the flowing protective gel 50 is increased. Further, a part of the protective gel 50 can be stored in the recesses 63, 64. Accordingly, the adhesion of the protective gel 50 to the humidity-sensitive film 36 can be more effectively mitigated.

[0058] Specifically, according to the present embodiment, the dummy line 61b exposed outside the humidity-sensitive barrier film 62 is disposed between the humidity-sensitive barrier film 62 and the humidity-sensitive film 36 in the opposing direction in which the humidity sensing portion 30 and the contact pad 40 oppose each other. Specifically, the recess 64 is located between the humidity-sensitive barrier film 62 and the humidity-sensitive film 36. Consequently, the humidity-sensitive barrier film 62 and the humidity-sensitive film 36 can be spaced apart from each other while increasing the contact area between the barrier portion 60 and the protective gel 50.

[0059] Typically, the depth of the recesses 63, 64 formed by a plurality of dummy lines 61 (barrier lines) increases with decreasing distance from the dummy line 61 in the height direction. In this regard, according to the present embodiment, while the recess 63 is formed on the humidity-sensitive barrier film 62, the recess 64 is formed on the surface of the protective layer 23 by the dummy line 61b exposed outside the humidity-sensitive barrier film 62. Since the recess 64 is located closer to the dummy line 61 in the height direction than the recess 63, the depth of the recess 64 is greater than the depth of the recess 63. Consequently, the adhesion of the protective gel 50 to the humidity-sensitive film 36 can be more effectively mitigated.

[0060] Furthermore, according to the present embodiment, as shown in Fig. 2, the humidity-sensitive barrier film 62 and the humidity-sensitive film 36 are separated from each other. Consequently, even if the protective gel 50 reaches a surface (an upper surface) of the humidity-sensitive barrier film 62, the protective gel 50 does not reach the surface of the humidity-sensitive film 36 by continuously flowing over a member composed of the same material (polyimide). Further, the length of the flow path to the humidity-sensitive film 36 is increased. Accordingly, the adhesion of the protective gel 50 to the humidity-sensitive film 36 can be more effectively mitigated. Specifically, according to the present embodiment, the barrier portion 60 divides the humidity sensor chip 10 (the first surface 20a of the substrate 20) having the rectangular planar shape into two regions in the opposing direction.Consequently, the barrier portion 60 effectively prevents the protective gel 50 from flowing to the humidity sensing portion 30.

[0061] Furthermore, according to the present embodiment, the recess 65 is arranged between the humidity sensing portion 30 and the outermost dummy line 61b closest to the humidity sensing portion 30 in the opposing direction. The contact area between the barrier portion 60 and the protective gel 50 is increased by the recess 65. Furthermore, the protective gel 50 can be accommodated in the recess 65. (Modification)

[0062] In the above embodiment, the locking portion 60, as shown in the Fig. 3 and Fig. 4, the dummy line 61a covered with the humidity-sensitive barrier film 62, the dummy line exposed outside the humidity-sensitive barrier film 62, and the recesses 63, 64. Alternatively, the barrier portion 60 may, for example, as shown in Fig. 5, only the dummy line 61a covered with the humidity-sensitive barrier film 62 can be formed, such that only the recess 63 can be formed on the surface of the humidity-sensitive barrier film 62. Even with such a structure, since the height of the barrier portion 60 becomes large, the adhesion of the protective gel 50 to the surface of the humidity-sensitive film 36 can be more effectively reduced. Furthermore, since the humidity-sensitive barrier film 62 has the recess 63, the adhesion of the protective gel 50 to the humidity-sensitive film 36 can be more effectively reduced.

[0063] In the Fig. 5, in the opposing direction in which the contact pad 40 and the humidity sensing section 30 face each other, one end of the humidity-sensitive barrier film 62 on the contact pad 40 side is arranged closer to the contact pad 40 than one end of the dummy line 61a on the contact pad 40 side, and one end of the humidity-sensitive barrier film 62 on the humidity sensing section 30 side is arranged closer to the humidity sensing section 30 than one end of the dummy line 61a on the humidity sensing section 30 side. Alternatively, the end of the humidity-sensitive barrier film 62 on the contact pad 40 side may be arranged above the end of the dummy line 61a on the contact pad 40 side.Similarly, the end of the humidity-sensitive barrier film 62 on the side of the humidity sensing section 30 may be arranged above the end of the dummy line 61a on the side of the humidity sensing section 30.

[0064] The blocking section 60 can, for example, as in Fig. 6, only one dummy line 61a as the dummy line 61. Since the height of the barrier portion 60 becomes large, the adhesion of the protective gel 50 to the surface of the humidity-sensitive film 36 can be reduced more effectively. Fig. 6, in the opposing direction in which the contact pad 40 and the humidity sensing section 30 face each other, both the end of the humidity-sensitive barrier film 62 on the contact pad 40 side and the end of the humidity-sensitive barrier film 62 on the humidity sensing section 30 side are arranged above the dummy line 61a. Alternatively, the end of the humidity-sensitive barrier film 62 on the contact pad 40 side may be arranged closer to the contact pad 40 than the end of the dummy line 61a on the contact pad 40 side, and the end of the humidity-sensitive barrier film 62 on the humidity sensing section 30 side may be arranged closer to the humidity sensing section 30 than the end of the dummy line 61a on the humidity sensing section 30 side.

[0065] In the above embodiment, the barrier portion 60 extends in the direction perpendicular to the opposing direction in which the humidity sensing portion 30 and the pad 40 are opposed to each other, to divide the humidity sensor chip 10 (the first surface 20a of the substrate 20) having the rectangular planar shape into two regions. However, a layout of the barrier portion 60 is not limited to the above example. The barrier portion 60 may, for example, be as shown in Fig. 7, have a rectangular C-shape in plan view. The blocking portion 60 may be arranged in the opposing direction between the contact point 40 and the humidity sensing portion 30 and in a direction perpendicular to the opposing direction on both sides of the contact point 40. Since the contact point 40, as shown in Fig. 7, the barrier portion 60 is arranged along an edge of one side of the substrate 20 having the rectangular planar shape, the barrier portion 60 surrounds the contact point 40 on the first surface 20a of the substrate 20. Consequently, since the protective gel 50 is likely to flow in a direction away from the humidity sensing portion 30, the adhesion of the protective gel 50 to the humidity-sensitive film 36 can be more effectively mitigated.

[0066] Furthermore, the locking section 60, as in Fig. 8, surround the humidity sensing section 30. In the Fig. 8, the blocking portion 60 has a rectangular ring shape and the humidity detection portion 30 is arranged within the blocking portion 60. In the Fig. 8, the contact point 40 is arranged on each side, as seen from the humidity sensing section 30 and the barrier section 60. Even with such a structure, the adhesion of the protective gel 50 to the humidity-sensitive film 36 can be more effectively reduced. Fig. 7 and Fig. 8, the dummy line 61 is formed in sections where the lines 33-35 and 45 are not formed, within the formation area of ​​the barrier section 60.

[0067] In the above embodiment, the detection electrodes 31a, 31b, the reference electrodes 32a, 32b, and the dummy line 61 are covered with the protective layer 23. If the detection electrodes 31a, 31b, the reference electrodes 32a, 32b, and the dummy line 61 are constructed of a material that is corrosion-resistant to water, the protective layer 23 can be omitted. In this case, the humidity-sensitive barrier film 62 is in contact with the dummy line 61a, and the recess 64 is arranged adjacent to the dummy line 61b.

[0068] In the above embodiment, the wirings 33 to 35 and 45 connected to the pad 40 are constructed of the same aluminum material as the pad 40 and formed on the same plane (the first surface 20a of the substrate 20) as the detection electrodes 31a, 31b. Alternatively, at least a portion of the wiring passing through the formation region of the barrier portion 60 may be provided by a diffusion layer. With such an approach, the dummy wiring 61 may be formed such that the dummy wiring 61 can extend between two opposite sides of the humidity sensor chip 10 (the first surface 20a of the substrate 20) having the rectangular planar shape. Consequently, the height of the barrier portion 60 can be increased over an entire area between the two opposite sides.

[0069] In the above embodiment, the humidity sensor chip 10 includes the diffusion layer 21, the pad 44, and the lead 45 electrically connected to the diffusion layer 21. However, the humidity sensor chip 10 is not always required to include these. (Second embodiment)

[0070] In the first embodiment, the humidity-sensitive film 36 and the humidity-sensitive barrier film 62 are separated from each other. In contrast, according to the present embodiment, the humidity-sensitive film 36 and the humidity-sensitive barrier film 62 are separated as shown in Fig. 9, are connected to one another into a unit via a humidity-sensitive connecting film 70 which is made of the same material (polyimide) as the humidity-sensitive film 36.

[0071] In an example of Fig. 9, the humidity-sensitive barrier film 62 extends, similar to the first embodiment (see Fig. 2) between two opposite sides of the first surface 20a of the substrate 20 having the rectangular planar shape to divide the first surface 20a into two regions. Furthermore, the width of the humidity-sensitive barrier film 62 in a direction perpendicular to a longitudinal direction of the humidity-sensitive barrier film 62 (in the opposing direction in which the humidity sensing portion 30 and the contact pad 40 face each other) is smaller than the width of the humidity-sensitive film 36. The humidity-sensitive connecting film 70 is connected to each end of the humidity-sensitive barrier film 62 in the longitudinal direction of the humidity-sensitive barrier film 62.

[0072] The humidity sensor chip 10 of the above structure can provide the following advantages in addition to those described in the first embodiment. It should be noted that the barrier portion 60, except for the humidity-sensitive bonding film 70, can provide the same advantages as the recesses 64, 65.

[0073] According to the present embodiment, the humidity-sensitive connecting film 70 connects the humidity-sensitive film 36 and the humidity-sensitive barrier film 62 into a single humidity-sensitive film. Consequently, the total contact area between the humidity-sensitive film and the substrate 20 is increased, so that detachment of the humidity-sensitive film 36 and the humidity-sensitive barrier film 62 during a dicing process can be reduced. In particular, detachment of the humidity-sensitive barrier film 62, which is narrower than the humidity-sensitive film 36, can be reduced.

[0074] The humidity-sensitive barrier film 62 is connected to the humidity-sensitive film 36 at both ends in the longitudinal direction via the humidity-sensitive connecting film 70, and is separated from the humidity-sensitive film 36 at the center in the longitudinal direction. The contact point 40 is located in the center in the longitudinal direction. That is, even if the protective gel 50 reaches a surface of a central portion of the humidity-sensitive barrier film 62, which is located near the contact point 40 in the opposing direction in which the humidity sensing portion 30 and the contact point 40 face each other, the protective gel 50 does not reach the surface of the humidity-sensitive film 36 by continuously flowing over a member constructed of the same material (polyimide). Furthermore, the length of the flow path to the humidity-sensitive film 36 is increased.Consequently, the adhesion of the protective gel 50 to the humidity-sensitive film 36 can be more effectively reduced. (Third embodiment)

[0075] In the above embodiment, the humidity sensor chip 10 is a separate chip from the circuit chip 113, and the dummy line 61, which is electrically separated from the electrodes 31a, 31b, 32a, 32b and the pad 40 of the humidity detection section 30, is used as the blocking line. In contrast, according to the present embodiment, as shown in Fig. As shown in Figure 10, a circuit portion 80 of the circuit chip 113 is integrated into the humidity sensor chip 10, and a line 81 of the circuit portion 80 is used as the blocking line. The circuit portion 80 includes a circuit (such as a CV conversion circuit) for processing an output of the humidity detection portion 30.

[0076] In an example of Fig. 10, the circuit section 80 is formed between the humidity detection section 30 and the contact point 40 in the opposite direction in which the humidity detection section 30 and the contact point 40 are opposite each other. The line 81 of the circuit section 80 is constructed of the same material (aluminum) as the detection electrodes 31a, 31b. Like the dummy line 61, the line 81 extends in a direction perpendicular to the opposite direction. Furthermore, a plurality of lines 81 are arranged side by side in the opposite direction. Fig. 2, two leads 81 are covered with the humidity-sensitive barrier film 62. However, the number of leads 81 is not limited to the above example. Like the dummy lead 61, the lead 81 may include not only one lead covered with the humidity-sensitive barrier film 62, but also one lead exposed outside the humidity-sensitive barrier film 62.

[0077] It should be noted that lines 33-35 are electrically connected to the electrodes 31a, 31b, 32a, 32b of the humidity sensing section 30 and the circuit section 80. Line 46 is connected to the contact point 40 and the circuit section 80.

[0078] The humidity sensor chip 10 of the above configuration can provide the following advantages in addition to those described in the first embodiment. According to the present embodiment, the circuit portion 80 is integrated into the humidity sensor chip 10. Consequently, the size of the humidity sensing device 100 can be reduced. Furthermore, the line 81 of the circuit portion 80, which is formed in the same substrate 20 as the humidity sensing portion 30, is used as the blocking line. Consequently, the size of the humidity sensor chip 10 can be reduced compared to the case where the dummy line 61 is used.

[0079] According to the present embodiment, the humidity sensor chip 10 and the circuit chip 113 are integrated into one chip. Consequently, one of the islands 111, 112 of the humidity detection device 100 shown in the Fig.1 is omitted and the contact point 40 of the humidity sensor chip 10 is connected to the line 114 via the bonding wire 115.

[0080] Although the present invention has been described in conjunction with its embodiments, it should be understood that it is not limited to the embodiments. The present invention is intended to encompass various modifications and equivalent arrangements within its scope.

[0081] According to the embodiments, the humidity sensing section 30 includes the capacitive sensing device 31 and the capacitive reference device 32. Alternatively, the humidity sensing section 30 may include only the capacitive sensing device 31.

[0082] According to the embodiments, the humidity sensor chip 10 is configured as a capacitive humidity sensor for detecting a change in ambient humidity based on a change in the capacitance between the detection electrodes 31a, 31b. However, the detection principle is not limited to this. For example, the humidity sensor chip 10 may be configured as a resistive humidity sensor for detecting a change in ambient humidity based on a change in the impedance of the humidity-sensitive film 36.

Claims

[1] Humidity sensor with: - a humidity detection section (30) comprising a pair of detection electrodes (31a, 31b) and a humidity-sensitive film (36), wherein the detection electrodes (31a, 31b) are opposed to each other on a humidity detection section forming surface (20a) of a substrate (20), and wherein the humidity-sensitive film (36) covers the detection electrodes (31a, 31b) and a space between the detection electrodes (31a, 31b); - a contact point portion (40) as an external connection terminal, wherein the contact point portion (40) is spaced from the humidity sensing portion (30) on the humidity sensing portion forming surface (20a) of the substrate (20) and covered with a protective gel portion (50), under a condition that a bonding wire (115) is connected to the contact point portion (40); and - a barrier portion (60) disposed between the humidity sensing portion (30) and the contact point portion (40) on the humidity sensing portion forming surface (20a) of the substrate (20) to prevent the protective gel portion (50) from flowing from the contact point portion (40) side to the humidity sensing portion (30) side, wherein - the barrier section (60) has a barrier line (61, 81) and a humidity-sensitive barrier film (62), - the blocking line (61, 81) is constructed from the same material as the detection electrodes (31a, 31b) and is arranged on the same surface as the detection electrodes (31a, 31b), - the humidity-sensitive barrier film (62) is constructed from the same material as the humidity-sensitive film (36) and covers at least part of the barrier line (61, 81), - the humidity sensor further comprises a plurality of blocking lines (61, 81) which include the blocking line (61, 81) and are arranged side by side in an opposing direction in which the humidity sensing section (30) and the contact point section (40) are opposite each other, and - the blocking section (60) has a recess (63, 64) between adjacent blocking lines (61, 81) of the plurality of blocking lines (61, 81). [2] Humidity sensor according to claim 1, wherein - the humidity-sensitive barrier film (62) covers at least two adjacent barrier lines (61, 81) and a space between the at least two adjacent barrier lines (61, 81); and - the recess (63, 64) is arranged between the at least two adjacent blocking lines (61, 81). [3] Humidity sensor according to claim 1 or 2, wherein - at least one barrier line (61b) of the plurality of barrier lines (61, 81) is exposed outside the humidity-sensitive barrier film (62), and - the recess (63, 64) is arranged between the exposed barrier line (61b) and the barrier line (61, 81) adjacent to the exposed barrier line (61b). [4] Humidity sensor according to claim 3, wherein - the exposed barrier line (61b) is arranged between the humidity-sensitive barrier film (62) and the humidity-sensitive film (36) in the opposite direction in which the humidity sensing section (30) and the contact point section (40) are opposite each other. [5] Humidity sensor according to one of claims 1 to 4, wherein - the detection electrodes (31a, 31b), the contact point portion (40) and the blocking line (61, 81) are constructed from the same material; - surfaces of the detection electrodes (31a, 31b) and a surface of the blocking line (61, 81) are collectively covered with a protective layer (23); and - the humidity-sensitive film (36) and the humidity-sensitive barrier film (62) are formed on the protective layer (23). [6] Humidity sensor according to one of claims 1 to 5, wherein - the blocking line (61, 81) comprises a dummy line (61) which has no electrical connection function and is electrically insulated from the detection electrodes (31a, 31b) and the contact point portion (40). [7] Humidity sensor according to one of claims 1 to 6, further comprising: - a circuit section (80) formed in the substrate (20) and designed to process an output signal of the humidity detection section (30), wherein - the blocking line (61, 81) includes a line (81) of the circuit section (80). [8] Humidity sensor according to one of claims 1 to 7, wherein - the humidity-sensitive film (36) and the humidity-sensitive barrier film (62) are separated from each other. [9] Humidity sensor according to claim 8, wherein - the humidity detection section forming surface (20a) of the substrate (20) has a rectangular shape; and - the humidity-sensitive barrier film (62) of the barrier portion (60) extends from one side of the humidity sensing portion forming surface (20a) to the opposite other side to divide the humidity sensing portion forming surface (20a) into two regions. [10] Humidity sensor according to one of claims 1 to 7, wherein - the humidity-sensitive film (36) and the humidity-sensitive barrier film (62) are connected to one another via a humidity-sensitive connecting film (70) which is constructed from the same material as the humidity-sensitive film (36). [11] Humidity sensor according to claim 10, wherein - the humidity detection section forming surface (20a) of the substrate (20) has a rectangular shape; - the humidity-sensitive barrier film (62) of the barrier portion (60) extends from one side of the humidity sensing portion forming surface (20a) to the opposite other side to divide the humidity sensing portion forming surface (20a) into two regions; - a width of the humidity-sensitive barrier film (62) is less than a width of the humidity-sensitive film (36) in a direction perpendicular to a longitudinal direction of the humidity-sensitive barrier film (62); and - the humidity-sensitive connecting film (70) is connected to a portion of the humidity-sensitive barrier film (62). [12] Humidity sensor according to claim 10, wherein - the blocking section (60) has a rectangular C-shape in plan view and is arranged between the contact point section (40) and the humidity detection section (30); and - the blocking section (60) is arranged on both sides of the contact point section (40), in a direction perpendicular to the opposing direction in which the humidity sensing section (30) and the contact point section (40) are opposite each other. [13] Humidity sensor according to claim 8 or 10, wherein the barrier portion (60) surrounds the humidity sensing portion (30). [14] Humidity sensor according to one of claims 1 to 13, wherein - the humidity detection section (30) detects a change in the ambient humidity based on a change in the capacitance between the detection electrodes (31a, 31b). [15] A method for manufacturing a humidity sensor, comprising: - an electrode forming step for forming a pair of detection electrodes (31a, 31b) on a predetermined surface (20a) of a substrate (20); - a humidity detection section forming step for forming a humidity detection section (30) by forming a humidity-sensitive film (36) to cover the detection electrodes (31a, 31b) and a space between the detection electrodes (31a, 31b); and - a contact point portion forming step for forming a contact point portion (40) as an external connection terminal such that the contact point portion (40) is spaced from the humidity detection portion (30) on the surface (20a) of the substrate (20) and is covered with a protective gel portion (50), under a condition that a bonding wire (115) is connected to the contact point portion (40), wherein - the electrode forming step comprises a barrier line forming step for forming a plurality of barrier lines (61, 81) arranged side by side in an opposing direction in which the humidity detecting section (30) and the contact point section (40) face each other on the surface (20a) of the substrate (20) between the humidity detecting section (30) and the contact point section (40) using the same material as the detecting electrodes (31a, 31b), and - the humidity sensing portion forming step comprises a barrier portion forming step of forming a barrier portion (60) that prevents the protective gel portion (50) from flowing from the contact point portion (40) side to the humidity sensing portion (30) side by forming a humidity-sensitive barrier film (62) to cover at least a part of the plurality of barrier lines (61, 81) using the same material as the humidity-sensitive film (36), the barrier portion (60) having a recess (63, 64) between adjacent barrier lines (61, 81) of the plurality of barrier lines (61, 81).

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