Component assembly device

Abstract

Component mounting device (1), comprising: a mounting head (9) holding a component (19) and comprising a suction nozzle (10); a dispensing section (6a) which applies a paste (P) by spraying onto the component (19) held by the mounting head (9); and a paste receiving section (17) attached to the suction nozzle (10) in the mounting head (9) and catching the paste (P) discharged from the discharge section (6a) and unable to reach the component (19).

Description

TECHNICAL FIELD

[0001] The present invention relates to a component mounting apparatus that mounts an electronic component on a substrate. STATE OF THE ART

[0002] In recent years, to improve the product quality of large-sized components such as a ball grid array (BGA), it has become important to ensure adhesive strength, including the temporary securing function, after the components are mounted. For this reason, an electronic component mounting jig is used that has the function of applying an adhesive to the bottom surface of an electronic component in the state held by a mounting head after the component is removed (see, for example, JP 2012-28780 A).The prior art disclosed in this patent literature example showed the configuration of an electronic component mounting apparatus (automatic mounting apparatus) for mounting an electronic component (constituent part) on a substrate, in which a dispensing system is employed that has a function of dispensing an adhesive agent (dispensing agent) against gravity onto the lower surface of an electronic component held by a mounting head to additionally apply the adhesive agent.

[0003] JP 2006-186097 A discloses a method for selectively applying a viscous fluid to predetermined positions of a component prior to assembly on a printed circuit board. The method uses a placement machine that applies the viscous fluid in a targeted manner. It includes the steps of determining the position of the component and applying the viscous fluid, as well as applying the fluid at the detected position.

[0004] JP H06-198 231 A describes an adhesive application mechanism comprising an applicator with a nozzle and a protective cover. This mechanism enables precise application of adhesive to defined areas of a work surface by moving the nozzle vertically, and the protective cover limits the application area to prevent transfer to adjacent areas.

[0005] JP H07-15123 A discloses a method for mounting electronic components on printed circuit boards. An adhesive is applied to the underside of the components prior to assembly. This improves adhesion to the circuit board and minimizes assembly errors such as component misalignment and voids. The adhesive is applied using a special pen that supports the component during application.

[0006] JP H09-213 720 A describes a die bonding method and apparatus for mounting a semiconductor chip onto substrates such as lead frames or ceramic plates. The apparatus automates the process to increase productivity and includes a transport section, an adhesive feeder that drips adhesive onto the substrate, and a bonding head that mounts the chip.

[0007] JP 4 728 633 B2 describes an inkjet coating device that sprays droplets onto a target object through a nozzle. It includes a cover that covers the object after coating and a solvent holder in the cover that evaporates the solvent. The evaporated solvent is passed through holes to regulate drying on the object.

[0008] JP 2001-198510 A describes a cleaning device for nozzles of a resin dispensing dispenser. This device includes a cleaner with an opening into which the nozzle fits and a scraper plate that moves along the bottom of the cleaner. The nozzle protrudes through the opening and moves between specified positions to effectively remove resin residue. SUMMARY OF THE INVENTION

[0009] The component mounting device includes a mounting head, a dispensing section, and a paste receiving section. The mounting head holds a component and includes a suction nozzle. The dispensing section applies paste by spraying it onto the component held by the mounting head. The paste receiving section is attached to the suction nozzle in the mounting head and collects the paste that has been dispensed from the dispensing section and could not reach the component. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view of a component mounting apparatus according to the present exemplary embodiment. Fig. 2 illustrates the configuration of an anti-scatter cover used in a component mounting apparatus according to the present exemplary embodiment. Fig. 3A illustrates the process of attaching an anti-scatter cover in a component mounting apparatus according to the present exemplary embodiment. Fig. 3B illustrates the process of attaching an anti-scatter cover in a component mounting apparatus according to the present exemplary embodiment. Fig. 3C illustrates the process of attaching an anti-scatter cover in a component mounting apparatus according to the present exemplary embodiment. Fig. 3D illustrates the process of attaching an anti-scatter cover in a component mounting apparatus according to the present exemplary embodiment Fig. 4A illustrates application of a paste in a component mounting apparatus according to the present exemplary embodiment. Fig. 4B illustrates application of a paste in a component mounting apparatus according to the present exemplary embodiment. Fig. 5A illustrates the configuration of another anti-scatter cover used in a component mounting apparatus according to the present exemplary embodiment. Fig. 5B illustrates the configuration of another anti-scatter cover used in a component mounting apparatus according to the present exemplary embodiment. Fig. 6A illustrates the process of attaching an anti-scatter cover in a component mounting apparatus according to the present exemplary embodiment. Fig. 6B illustrates the process of attaching an anti-scatter cover in a component mounting apparatus according to the present exemplary embodiment. Fig. 6C illustrates the process of attaching an anti-scatter cover in a component mounting apparatus according to the present exemplary embodiment. Fig. 7 is a plan view of another component mounting apparatus according to the present exemplary embodiment. DESCRIPTION OF EMBODIMENTS

[0010] Before describing the present exemplary embodiments, a problem with a conventional component mounting apparatus will be briefly described. When applying an adhesive, the adhesive must be precisely applied to a predetermined position of an electronic component that is an application target. However, depending on the properties of the adhesive used, the dispensing condition of a dispensing system, etc., the flying direction of the adhesive, the shape of the droplets, etc., are not always stable. The dispensed adhesive takes the form of fine droplets scattered in directions offset from the application target, except for main droplets that fly normally toward the position of the application target.The scattered droplets as described above cause device contamination and damage by adhering to a part of an assembly head that is different from the application target, such as a nearby mechanical unit, such as a suction nozzle for holding an electronic component. If such contamination or damage remains, a failure may occur; therefore, the task of cleaning up the contamination and damage is required, resulting in increased workload for workers.

[0011] Next, an exemplary embodiment of the present disclosure will be described with reference to the drawings. First, with reference to Fig. 1 the configuration of the component mounting device 1 will be described. Fig. 1 is a plan view of the component mounting apparatus 1 according to the present exemplary embodiment. The component mounting apparatus 1 has a function of mounting an electronic component, which is the first component held by a mounting head, onto a substrate, which is the second component.

[0012] In Fig. 1, a substrate conveyor 2 is arranged at the center of the base 1a along the x-axis (substrate conveying direction). The substrate conveyor 2 conveys a substrate 3, which is the second component transported in from the upstream side, and positions and holds the substrate 3 at a mounting position determined for performing component mounting operations. Component supply sections 4A and 4B are arranged on both sides of the substrate conveyor 2, and each of the component supply sections 4A and 4B includes a feed base 30 having a plurality of slots into which a parts feeder is mounted. One or more parts feeders 5, each of which is the parts feeder, are inserted in parallel into the slots of the feed base 30. It should be noted that the parts feeder 5 is arranged above the feed base 30 (on the drawing sheet side in Fig. 1).

[0013] Together with the parts feeder 5 for feeding an electronic component, which is the first component, to the component mounting apparatus 1, a dispenser 6 is inserted into a slot of the common feed base 30 at one side (at the lower side in Fig. 1) is inserted into the component supply section 4A. The parts feeder 5 feeds a carrier tape containing the electronic components in a tape feed direction at a uniform pitch, thereby feeding the carrier tape to the take-out position for the later-described mounting head 9 of the component mounting apparatus 11.

[0014] A dispensing portion 6a, which dispenses paste to be applied to the electronic component, is arranged at a front end portion of the dispenser 6 (unit) inserted in the feed base 30, on the side of the substrate conveying device 2. The dispensing portion 6a has a function of applying paste P, such as an adhesive for bonding components, by injection to the electronic component held by the mounting head 9 (see Fig. 4A). More specifically, the dispensing section 6a comprises: a paste container, such as a syringe, which stores the paste P; and a dispensing device that dispenses the paste P supplied from the paste container. The function of this dispensing device causes the paste P to fly against gravity through a dispensing hole 6b arranged upward in the dispensing section 6a; in this way, the paste P containing the electronic component 19 (see Fig. 4A), which is an application target, from below, applied thereto. In this example, the dispenser device 6 is only attached to the component supply section 4A (see Fig. 1) is arranged on one side, but the same or a similar configuration may apply to the component provision section 4B on the other side.

[0015] A y-axis stage 7 including a linear drive mechanism is arranged along the y-axis (the direction perpendicular to the x-axis direction) at an end portion of the upper surface of the base 1a on one side along the x-axis. Two x-axis stages 8, each also including a linear drive mechanism, are connected to the y-axis stage 7 so as to be movable along the y-axis. The mounting head 9 is mounted on each of the two x-axis stages 8 so as to be movable along the x-axis.

[0016] The mounting head 9 is a multi-composite head comprising a plurality of holding heads, and a suction nozzle 10 capable of sucking, holding, and individually moving up and down an electronic component 19 is provided at a lower end portion of each of the holding heads (see Fig. 4A). The mounting head 9 includes: a z-axis raising and lowering device that moves the suction nozzle 10 up and down; and a θ-axis rotating device that rotates the suction nozzle 10 around the nozzle axis.

[0017] When the y-axis table device 7 and the x-axis table device 8 are operated, the mounting head 9 moves along the x-axis and the y-axis. Thus, each of the two mounting heads 9 removes an electronic component with the suction nozzle 10 from the removal position of the tape feeder 5 of a corresponding one of the component supply sections 4A and 4B. In the present exemplary embodiment, the mounting head 9 has a function of holding not only the electronic component 19 supplied from the tape feeder 5 but also an anti-scatter cover 17 described below for a predetermined operation or process, such as transferring.

[0018] A component detection camera 13, a waste box 15, an anti-scatter cover providing section 16, and an anti-scatter cover attaching / detaching section 18 are arranged between the component providing section 4A on one side and the substrate conveyor 2, and the component detection camera 13 and a nozzle holder 14 are arranged between the component providing section 4B on the upper side and the substrate conveyor 2. The anti-scatter cover providing section 16 has a function of causing a plurality of disc-shaped anti-scatter covers 17 to be provided on the mounting head 9 to be stacked and provided (see Fig. 3A).

[0019] The anti-scattering cover 17 is attached to an upper portion of the suction nozzle 10 in the mounting head 9, functions as a paste receiving portion that catches the paste P discharged from the discharge portion 6a and failed to reach the electronic component 19, which is an application target, and is configured to be detachably attached to the mounting head 9. The anti-scattering cover providing portion 16, which causes the anti-scattering covers 17 to be stacked and provided, functions as a providing portion of the paste receiving portion that provides a plurality of paste receiving portions. The anti-scattering cover attaching / detaching portion 18 functions as an attaching / detaching portion of the paste receiving portion, which causes the anti-scattering cover 17, which functions as a paste receiving portion, to be attached to and detached from the mounting head 9.

[0020] The nozzle holder 14 accommodates a plurality of suction nozzles to be attached to the mounting head 9. The mounting head 9 is moved to access the nozzle holder 14, where a predetermined nozzle replacement operation is performed; in this way, a suction nozzle 10 corresponding to a target to be retained is attached to the mounting head 9. The waste box 15 houses the electronic component 19 determined to be defective in the detection result of the imaging output with the component recognition camera 13, the anti-scatter cover 17 after use, etc. More specifically, the mounting head 9 holding the electronic component 19, the anti-scatter cover 17, etc. to be recovered is moved to the waste box 15, and a discarding operation is performed; in this way, the target to be recovered is discarded and retracted into the waste box 15.

[0021] When the mounting head 9, which has taken out the electronic component 19 from the component supply section 4A or 4B, moves above the component recognition camera 13, the component recognition camera 13 captures an image of the electronic component 19 in the state in which it is held by the mounting head 9. Through a recognition process on the result of this imaging, the electronic component 19 is identified or located. A substrate recognition camera 12, which is arranged on the lower surface side of the x-axis table device 8 and moves integrally with the mounting head 9, is attached to the mounting head 9. As the mounting head 9 moves, the substrate recognition camera 12 moves to a position above the substrate 3 positioned by the substrate conveying device 2 and captures an image of the substrate 3. The position of the substrate 3 is detected through the recognition process on the result of this imaging.

[0022] Fig. 2 illustrates the configuration of the anti-scatter cover 17 employed in the component mounting apparatus 1 according to the present exemplary embodiment. As shown in Fig. 2, the anti-scatter cover 17 (Example 1) has a fitting hole 17b, which has a diameter slightly smaller than the outer diameter of the suction nozzle 10, in a central region of the main body portion 17a formed in a disc shape using a disposable material such as resin as a consumable component. As described above, the mounting head 9 includes the suction nozzle 10, and the anti-scatter cover 17, which functions as a paste receiving portion, has the fitting hole 17b in the central region. By mounting the anti-scatter cover 17 on the mounting head 9, the suction nozzle 10 is inserted into the fitting hole 17b, so that the main body portion 17a is pressure-held by the suction nozzle 10; thus, the anti-scatter cover 17 is mounted on the suction nozzle 10.

[0023] Fig. 3A to Fig. 3D illustrate the fastening process of the anti-scatter cover 17 in the component mounting apparatus 1 according to the present exemplary embodiment. A mounting device 18a arranged in the anti-scatter cover fastening / detaching section 18 is used for the aforementioned fastening of the anti-scatter cover 17 to the mounting head 9. As shown in Fig. More specifically, as shown in Figure 3A, the main body of the mounting device 18a is an assembly tool 20 having a rough U-shape in plan view. The assembly tool 20 has an opening 20a shaped and sized to allow passage of the suction nozzle 10 attached to the mounting head 9 while blocking passage of a flange portion 10a provided integrally with the suction nozzle 10.

[0024] When attaching the anti-litter cover 17 to the mounting head 9 using the mounting device 18a, the suction nozzle 10 of the mounting head 9 first removes the anti-litter cover 17, which, as shown in Fig. 3A, is stacked in the anti-scatter cover providing portion 16 by sucking and holding the main body portion 17a. Next, the mounting head 9 holding the anti-scatter cover 17 is moved to the mounting jig 18a, and the anti-scatter cover 17 being held is positioned so that the fitting hole 17b is located above the opening 20a, and is then placed on the upper surface of the mounting tool 20 (arrow a).

[0025] As in Fig. Next, as shown in Fig. 3B, the mounting head 9 is moved in the state where the anti-scatter cover 17, which is no longer sucked by the suction nozzle 10, remains on the upper surface of the mounting tool 20, so that the suction nozzle 10 is pressed into the fitting hole 17b, and the mounting head 9 is lowered to a position where the flange portion 10a abuts the main body portion 17a. In this way, the anti-scatter cover 17 is held via the fitting hole 17b by pressure from the suction nozzle 10.

[0026] When separating the anti-scatter cover 17 attached to the mounting head 9, the separating unit 18b arranged on the anti-scatter cover attaching / detaching portion 18 is used. As shown in Fig. More specifically, as shown in Figure 3C, the main body of the separating unit 18b is a separating tool 21 having a roughly U-shape in plan view. The separating tool 21 has an opening 21a shaped and sized to allow passage of the flange portion 10a provided integrally with the suction nozzle 10 while blocking passage of the anti-scatter cover 17.

[0027] When separating the anti-scatter cover 17 attached to the mounting head 9 using the separating unit 18b, first, the mounting head 9 with the anti-scatter cover 17 attached to the suction nozzle 10 is moved, the height thereof is adjusted so that the main body portion 17a is located on the side of the lower surface of the separating tool 21, and in this state, the flange portion 10a is moved into the opening 21a as shown in Fig. 3C. By lifting the mounting head 9 in this state, the main body portion 17a, in the state in which it is attached to the suction nozzle 10, abuts against the lower surface of the cutting tool 21.

[0028] Next, the mounting head 9 is mounted as shown in Fig. 3D, is further lifted (arrow c) and thus the suction nozzle 10 is lifted together with the mounting head 9 in the state in which the anti-scatter cover 17 is engaged with the separating tool 21. As a result, the suction nozzle 10 is pulled out of the fitting hole 17b and the anti-scatter cover 17 is separated from the suction nozzle 10, falls down and is retracted. Next, with respect to Fig. 4A the functions of the anti-scatter cover 17 are described. Fig. 4A illustrates the process of applying the paste P in the component mounting apparatus 1 according to the present exemplary embodiment. Fig. 4A shows the state in which the electronic component 19, which has been removed from the tape feeder 5 by the suction nozzle 10, is positioned over the discharge portion 6a of the dispenser 6. The anti-scatter cover 17 has been previously attached to the mounting head 9, and the main body portion 17a, which is held by the suction nozzle 10 pressed into the fitting hole 17b, protrudes further outward than the flange portion 10a formed integrally with the suction nozzle 10.

[0029] In the process of applying the paste P to the electronic component 19, the discharge portion 6a of the dispenser 6 is actuated to eject main droplets of the paste P toward the lower surface of the electronic component 19 through the discharge hole 6b (arrow d), thereby causing the main droplets to reach a predetermined target application position. At this time, the paste P discharged through the discharge hole 6b of the discharge portion 6a includes, in addition to the main droplets that reach the target application position by flying thereto normally, paste P in particle form that scatters while spreading upward. Such paste P in particle form, which could not reach the electronic component 19, is captured by adhering to the lower surface of the main body portion 17a due to the anti-scatter cover 17 that has been attached to the suction nozzle 10.Thus, it is possible to prevent paste P discharged from the discharge portion 6a from scattering and adhering, thereby causing contamination or damage to a portion other than the application target, for example, a lower mechanical portion of the mounting head 9.

[0030] Fig. 4B illustrates an example in which, in addition to the anti-scattering cover 17 described above, an anti-scattering wall 22 is provided surrounding the discharge hole 6b of the discharge portion 6a, which prevents discharged paste P from scattering. The anti-scattering wall 22 is a cylindrical member slightly smaller in diameter than the main body portion 17a of the anti-scattering cover 17. By providing such an anti-scattering wall 22, when the main droplets of the paste P are sprayed toward the lower surface of the electronic component 19 through the discharge hole 6b (arrow e), it is possible to capture the scattering paste P by adhering to the inner surface of the anti-scattering wall 22, even if the particles of the paste P are scattered over such a wide area that cannot be covered by the anti-scattering cover 17. It should be noted that Fig. 5A and Fig. 5B illustrates variations of the anti-scatter cover 17 to be used in such applications. First, an anti-scatter cover 17A (Example 2) shown in Fig. 5A is provided by connecting the Fig. 2, an elastic holding portion 23 is provided, which is an annular elastic member having a fitting hole 23a around the fitting hole 17b. A stretchable material such as rubber is used for the elastic holding portion 23, and the inner diameter of the fitting hole 23a is set slightly smaller than the outer diameter of the corresponding suction nozzle 10. When attaching the anti-scatter cover 17A to the suction nozzle 10, the suction nozzle 10 is pressed into the fitting hole 23a, as in the case shown in Fig. 3A. By such an elastic holding portion 23 included in the anti-scatter cover 17A, the anti-scatter cover 17A can be securely held to the suction nozzle 10.

[0031] Next, an anti-scatter cover 17B (Example 3) shown in Fig. 5B is provided by the Fig. 2, a recess 17c serving as a guide for inserting the suction nozzle 10 into the fitting hole 17b is formed. More specifically, the anti-scatter cover 17B has a recess 17c formed continuously from the edge of the main body portion 17a to the fitting hole 17b, and further has a recess opening 17b, which is the recess 17c opened at the edge. When attaching the anti-scatter cover 17B having such a configuration to the suction nozzle 10, the outer peripheral surface of the suction nozzle 10 is pushed into the recess 17c via the recess opening 17d and guided to the fitting hole 17b; thus, the anti-scatter cover 17B is attached to the suction nozzle 10.Note that the recess 17c may be a slit formed by removing a part having a predetermined recess width along a recess line extending from the fitting hole 17b to the edge.

[0032] Fig. 6A to Fig. 6C illustrate the process of attaching the anti-litter cover 17B to the suction nozzle 10. Here, an anti-litter cover attaching / detaching portion 18A is used, which includes a clamp 24 capable of clamping the anti-litter cover 17B by means of two clamping members, namely an upper member 24a and a lower member 24b. Specifically, the clamp 24 is configured by combining the upper member 24a capable of raising and lowering from the top with the lower member 24b capable of supporting one end of the anti-litter cover 17B from the bottom on the upper surface. The upper member 24a has a shape that does not interfere with the flange portion 10a to allow lateral access of the mounting head 9 attached to the suction nozzle 10 in the state where the anti-scatter cover 17B is clamped by the clamping device 24.

[0033] When attaching the anti-litter cover 17B to the suction nozzle 10 using the anti-litter cover attaching / detaching portion 18A, the suction nozzle 10 of the mounting head 9 first takes out the anti-litter cover 17B stacked in the anti-litter cover providing portion 16 by sucking and holding the main body portion 17A, as shown in Fig. 6A. At this time, the anti-scatter cover 17B has been arranged in the anti-scatter cover providing section 16 so that the Fig. 5B is arranged in a predetermined direction. Next, the mounting head 9 holding the anti-litter cover 17B is moved to the anti-litter cover attachment / detachment portion 18A, and one end of the main body portion 17A of the anti-litter cover 17B being held is placed on the upper surface of the lower member 24b (arrow d). At this time, the anti-litter cover 17B is positioned so that the recess 17c is arranged in a predetermined direction suitable for inserting the suction nozzle 10.

[0034] Next, as in Fig. 6B, the upper member 24a is lowered (arrow e), and the anti-scatter cover 17B is clamped by the clamping device 24. Subsequently, in this state, the main body portion 17a sucked and held by the suction nozzle 10 is released, then the mounting head 9 is moved, and the operation of attaching the anti-scatter cover 17B to the suction nozzle 10 is performed. More specifically, the mounting head 9 is moved (arrow f) so that the flange portion 10a is located at the same height as the upper surface of the main body portion 17a, and the suction nozzle 10 is positioned in a direction corresponding to the recess opening 17d for the recess 17c formed in the anti-scatter cover 17B.

[0035] Next, as in Fig. 6C, the mounting head 9 is moved horizontally (arrow g) so that the suction nozzle 10 moves into the recess 17c via the recess opening 17d and reaches the fitting hole 17b by being guided through the recess 17c. Accordingly, the suction nozzle 10 is placed in the state in which it is secured in the fitting hole 17b by pressure. Subsequently, the clamping of the anti-scatter cover 17B with the clamping device 24 is released by lifting the upper member 24a, and thus the attachment of the anti-scatter cover 17B to the suction nozzle 10 is completed. It should be noted that when separating the anti-scatter cover 17B attached to the suction nozzle 10, the suction nozzle 10 held in the fitting hole 17b can be separated along the recess 17c by Fig. 6A to Fig. 6C is carried out in the reverse order.

[0036] Fig. 7 is a plan view of another component mounting apparatus 50 according to the present exemplary embodiment. Fig. Fig. 7 illustrates an example in which the anti-scatter cover providing section 16 shown in Fig. 1, is arranged between the substrate conveying device 2 and the component supply section 4A, is integrated in the dispensing device 6, which is mounted on the feed base 30 arranged in the component supply section 4A. In other words, as shown in Fig. 7, the anti-scatter cover providing portion 16A having the same or similar configuration as that shown in Fig. 1 shown anti-scatter cover provision section 16 (see also Fig.3) is arranged near the discharge section 6a arranged on the dispenser device 6. In this example, the paste receiving section providing section is arranged on the dispenser device 6 (device) mounted on the feed base 30 arranged in the component providing section 4A.

[0037] As described above, the component mounting apparatus according to the present exemplary embodiment is a component mounting apparatus for mounting the electronic component 19, which is the first component held by the mounting head 9, on the substrate 3, which is the second component, and includes the dispensing section 6a that applies paste P by spraying onto the electronic component 19 held by the mounting head 9. Furthermore, the component mounting apparatus is configured such that the anti-scattering cover 17, which functions as a paste receiving section that catches the paste P discharged from the dispensing section 6a and which could not reach the electronic component 19, is provided on the mounting head 9. Thus, when applying the paste to an electronic component, it is possible to prevent the discharged paste from scattering and adhering to a part deviating from the application target.

[0038] Note that, in the examples provided in the exemplary embodiment described above, the vacuum suction type suction nozzle 10 is employed as the means for holding the electronic component 19 by the mounting head 9. However, the present invention is also applicable to a method in which the electronic component 19 is held by a means other than vacuum suction, for example, a method in which an electronic component is mechanically gripped by a mechanical gripper. According to the present disclosure, when additionally applying paste to the lower surface of an electronic component, it is possible to prevent the dispensed paste from scattering and adhering to a part other than an application target. INDUSTRIAL APPLICABILITY

[0039] The component mounting apparatus according to the present disclosure has an advantageous effect that, when applying a paste to an electronic component, it can prevent the dispensed paste from scattering and adhering to a region other than an application target, and is therefore useful in the field of component mounting in which paste is additionally applied to the lower surface of an electronic component before mounting on a substrate. REFERENCE SYMBOLS IN THE DRAWINGS 1.50 component assembly device 1a Basis 2 Substrate conveyor 3 Substrate (second component) 4A, 4B Component Provisioning Section 5 Belt feed (parts feed) 6 Donor facility (facility) 6a Submission section 6b Discharge hole 7 y-axis table setup 8 x-axis table setup 9 Mounting head 10 Suction nozzle 10a Flange section 11 Component assembly facility 12 Substrate detection camera 13 Component detection camera 14 nozzle holders 15 waste bin 16, 16A Anti-scatter cover providing section (paste receiving section providing section) 17, 17A, 17B Anti-scatter cover (paste receiving section) 17a Main body section 17b fitting hole 17c recess 17d opening 18 Anti-scatter cover attachment / detachment section (paste receiving section attachment / detachment section) 18A Anti-litter cover attachment / detachment section 18a Pass facility 18b Facility 19 electronic component (first component) 20 fastening tools 20a Opening 21 tools 21a Opening 22 Anti-scatter wall 23 elastic holding section 23a fitting hole 24 clamping device 24a upper element 24b lower element 30 Feeding base a arrow b arrow c arrow d arrow e arrow f arrow g arrow P Paste

Claims

[1] Component mounting device (1), comprising: a mounting head (9) holding a component (19) and comprising a suction nozzle (10); a dispensing section (6a) which applies a paste (P) by spraying onto the component (19) held by the mounting head (9); and a paste receiving section (17) attached to the suction nozzle (10) in the mounting head (9) and catching the paste (P) discharged from the discharge section (6a) and unable to reach the component (19). [2] The component mounting apparatus (1) according to claim 1, wherein the paste receiving portion (17) is detachably attached to the mounting head (9). [3] Component mounting device (1) according to claim 1, wherein the suction nozzle (10) sucks and holds the component (19), a fitting hole (17b) is formed in a central region of the paste receiving section (17), and the paste receiving section (17) is attached to the suction nozzle (10) by inserting the suction nozzle (10) into the fitting hole (17b). [4] The component mounting apparatus (1) according to claim 3, wherein the paste receiving portion (17) comprises an annular elastic member (23) around the fitting hole (17b). [5] The component mounting device (1) according to claim 3, wherein a recess (17c) or a slit is formed in the fitting hole (17b), the recess (17c) and the slit extending from an edge of the paste receiving portion (17), and an outer peripheral surface of the suction nozzle (10) is pushed into the recess (17c) or the slot to attach the paste receiving portion (17) to the suction nozzle (10). [6] Component mounting apparatus (1) according to claim 1, wherein the paste receiving section (17) is one of a plurality of paste receiving sections, and the component mounting device (1) further comprises: a paste receiving section supporting section (16) supporting the plurality of paste receiving sections; and a paste receiving portion attaching / detaching portion (18) that attaches the paste receiving portion (17) to the mounting head (9) and detaches the paste receiving portion (17) from the mounting head (9). [7] Component mounting device (1) according to claim 6, further comprising: a parts feeder (5) which feeds the component (19); and a feed base (30) having a plurality of slots into each of which the parts feeder (5) is fitted, wherein the dispensing section (6a) is arranged on a unit (6) mounted on the feed base (30). [8] The component mounting apparatus (1) according to claim 7, wherein the paste receiving portion supporting portion (16) is disposed on the unit (6). [9] Component mounting device (1) according to claim 1, further comprising: an anti-scattering wall (22) arranged around a dispensing hole (6b) of the dispensing section (6a) and preventing dispensed paste (P) from scattering.

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