Three-dimensional radio frequency module in a system-in-package structure
Patent Information
- Application Number
- DE112023004102
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-12-29
- Filing Date
- 2023-10-27
- Publication Date
- 2025-07-17
AI Technical Summary
The packaging method of the existing radio frequency module system results in a larger packaging structure size, which limits the design and application of end products.
Adopting a three-dimensional RF module system packaging structure, the RF components are integrated through the first rewiring layer, the second rewiring layer and metal pillars to form a high-performance system package. The line width and line spacing can reach 2μm/2μm, reducing the packaging area. and volume.
It achieves high-performance system packaging, effectively reduces the packaging area and volume, and is suitable for the radio frequency module needs in the 5G era.
Smart Images
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Abstract
Description
A three-dimensional radio frequency module system packaging structure Technical Field
[0001] The present application belongs to the field of semiconductor technology and relates to a three-dimensional radio frequency module system packaging structure. Background Art
[0002] Wireless systems generally consist of four components: antennas, RF front-ends, RF transceiver modules, and baseband signal processors. With the advent of 5G, the demand for and value of antennas and RF front-ends are rapidly increasing. The RF front-end is the fundamental component that converts digital signals into wireless RF signals and is a core component of wireless communication systems.
[0003] Currently, the main packaging method for RF modules is the Flip Chip on Substrate process, which uses an inverted chip-on-substrate process to attach each chip to a flat substrate for electrical connection. This process is called System in a Package (SiP). The size of the resulting package structure is relatively large, which will limit the design of the end product.
[0004] Therefore, it is necessary to provide a three-dimensional radio frequency module system packaging structure.
[0005] Application Contents
[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of this application is to provide a three-dimensional radio frequency module system packaging structure to solve the problem of large radio frequency module system packaging size in the prior art.
[0007] To achieve the above objectives and other related objectives, the present application provides a three-dimensional radio frequency module system packaging structure, the three-dimensional radio frequency module system packaging structure comprising:
[0008] a first redistribution layer, the first redistribution layer comprising a first side and an opposite second side;
[0009] a metal column, the metal column being located on the first surface of the first redistribution layer, and a first end of the metal column being electrically connected to the first redistribution layer;
[0010] A radio frequency switch and a duplexer, wherein the radio frequency switch and the duplexer are both located on the first surface of the first re-distribution layer, and electrical connectors between the radio frequency switch and the duplexer are away from the first re-distribution layer;
[0011] a first packaging layer, the first packaging layer being located on a first surface of the first rewiring layer and covering the metal pillar, the RF switch, and the duplexer, and exposing the second end of the metal pillar, the RF switch, and the electrical connector of the duplexer;
[0012] a second redistribution layer, the second redistribution layer being located on the first packaging layer and comprising a first surface in contact with the first packaging layer and a second surface opposite thereto, the second redistribution layer being electrically connected to the second end of the metal pillar, and the second redistribution layer being electrically connected to the electrical connectors of the RF switch and the duplexer;
[0013] A low-noise amplifier, a power amplifier, and a filter, wherein the low-noise amplifier, the power amplifier, and the filter are located on the second surface of the second redistribution layer, and electrical connectors of the low-noise amplifier, the power amplifier, and the filter are electrically connected to the second redistribution layer respectively;
[0014] A first bottom filling layer is located on the second surface of the second rewiring layer and covers the low noise amplifier, the power amplifier and the electrical connectors of the filter.
[0015] Optionally, the invention further includes a second packaging layer located on a second surface of the second rewiring layer and covering the low noise amplifier, the power amplifier, the filter and the first bottom filling layer.
[0016] Optionally, the device further includes an electromagnetic isolation protection shell located outside the first packaging layer, the second packaging layer, the first redistribution layer, and the second redistribution layer and exposing the second surface of the first redistribution layer.
[0017] Optionally, it further includes a PCB substrate and a transceiver, and the transceiver and the packaging structure with the electromagnetic isolation protective shell are electrically connected to the PCB substrate.
[0018] Optionally, the device further includes a transceiver located on the second surface of the first re-distribution layer and electrically connected to the first re-distribution layer; and a second bottom filling layer is filled between the transceiver and the first re-distribution layer.
[0019] Optionally, a metal bump electrically connected to the first redistribution layer is provided on the second surface of the first redistribution layer, and an end portion of the metal bump protrudes from the surface of the transceiver.
[0020] Optionally, a third packaging layer is further included, which covers the transceiver, the second bottom filling layer and the metal bump, and the first surface of the third packaging layer is in contact with the second surface of the first rewiring layer, and the second surface of the third packaging layer exposes the end of the metal bump.
[0021] Optionally, the device further includes an electromagnetic isolation protection shell located outside the first packaging layer, the second packaging layer, the third packaging layer, the first rewiring layer and the second rewiring layer and exposing the second surface of the third packaging layer.
[0022] Optionally, the line width of the three-dimensional RF module system packaging structure is less than 2 μm, and the line pitch of the three-dimensional RF module system packaging structure is less than 2 μm.
[0023] Optionally, the three-dimensional RF module system packaging structure is a wafer-level three-dimensional RF module system packaging structure.
[0024] As described above, the three-dimensional RF module system packaging structure of the present application integrates various RF components into a three-dimensional RF module packaging structure through a first rewiring layer, a second rewiring layer, and metal columns, which can achieve high-performance system packaging. The packaging line width and line spacing can reach 2μm / 2μm, which can effectively reduce the packaging area and packaging volume. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] FIG1 is a schematic structural diagram of a three-dimensional radio frequency module system packaging structure in a first embodiment of the present application.
[0026] FIG2 is a schematic structural diagram of a three-dimensional radio frequency module system packaging structure in a second embodiment of the present application.
[0027] FIG3 shows a schematic structural diagram of a three-dimensional radio frequency module system packaging structure in the third embodiment of the present application.
[0028] FIG4 shows a schematic structural diagram of a three-dimensional radio frequency module system packaging structure in a fourth embodiment of the present application.
[0029] FIG5 is a schematic structural diagram of a three-dimensional radio frequency module system packaging structure in a fifth embodiment of the present application.
[0030] FIG6 is a schematic structural diagram of a three-dimensional radio frequency module system packaging structure in a sixth embodiment of the present application.
[0031] FIG7 shows a schematic structural diagram of the three-dimensional radio frequency module system packaging structure in the seventh embodiment of the present application.
[0032] Component Reference Numerals 110 First Rewiring Layer 111 First Metal Wiring Layer 112 First Dielectric Layer 120 Second Rewiring Layer 121 Second Metal Wiring Layer 122 Second Dielectric Layer 200 Metal Pillar 301 RF Switch 302 Duplexer 303 Low Noise Amplifier 304 Power Amplifier 305 Filter 306 Transceiver 410 First Packaging Layer 420 Second Packaging Layer 430 Third Packaging Layer 501 First Underfill Layer 502 Second Underfill Layer 600 Electromagnetic Isolation Shielding 700 Metal Bump 800 PCB Substrate DETAILED DESCRIPTION
[0033] The following describes the embodiments of the present application through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present application from the disclosure herein. The present application may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present application.
[0034] For example, when describing the embodiments of this application, cross-sectional views of device structures may be partially enlarged to a different scale for ease of explanation. Furthermore, these schematic views are merely illustrative and should not limit the scope of protection of this application. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.
[0035] For ease of description, spatially relative terms such as "under," "below," "below," "below," "above," and "on" may be used herein to describe the relationship of one element or feature to other elements or features shown in the drawings. It will be understood that these spatially relative terms are intended to encompass orientations of the device in use or operation in addition to the orientation depicted in the drawings. Additionally, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may be present. As used herein, "between" is inclusive of both endpoints.
[0036] In the context of the present application, a structure described as a first feature being "above" a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where an additional feature is formed between the first and second features, such that the first and second features may not be in direct contact.
[0037] It should be noted that the illustrations provided in this embodiment only illustrate the basic concept of the present application in a schematic manner. Therefore, the illustrations only show components related to the present application and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.
[0038] Example 1
[0039] As shown in Figure 1, this embodiment provides a three-dimensional RF module system packaging structure, which includes: a first rewiring layer 110, a metal pillar 200, an RF switch 301, a duplexer 302, a first packaging layer 410, a second rewiring layer 120, a low noise amplifier 303, a power amplifier 304, a filter 305 and a first bottom filling layer 501.
[0040] Wherein, the first rewiring layer 110 includes a first surface and an opposite second surface; the metal column 200 is located on the first surface of the first rewiring layer 110, and the first end of the metal column 200 is electrically connected to the first rewiring layer 110; the RF switch 301 and the duplexer 302 are both located on the first surface of the first rewiring layer 110, and the electrical connectors of the RF switch 301 and the duplexer 302 are away from the first rewiring layer 110; the first packaging layer 410 is located on the first surface of the first rewiring layer 110 and covers the metal column 200, the RF switch 301 and the duplexer 302, and the first packaging layer 410 exposes the second end of the metal column 200, the electrical connectors of the RF switch 301 and the duplexer 302; the second rewiring layer 120 is located on the first surface of the first rewiring layer 110 A packaging layer 410 includes a first surface in contact with the first packaging layer 410 and a second surface opposite thereto, the second rewiring layer 120 is electrically connected to the second end of the metal pillar 200, and the second rewiring layer 120 is electrically connected to the electrical connectors of the RF switch 301 and the duplexer 302; the low-noise amplifier 303, the power amplifier 304 and the filter 305 are located on the second surface of the second rewiring layer 120, and the electrical connectors of the low-noise amplifier 303, the power amplifier 304 and the filter 305 are electrically connected to the second rewiring layer 120 respectively; the first bottom filling layer 501 is located on the second surface of the second rewiring layer 120, and covers the electrical connectors of the low-noise amplifier 303, the power amplifier 304 and the filter 305.
[0041] Specifically, the first rewiring layer 110 includes a first dielectric layer 112 and a first metal wiring layer 111 located in the first dielectric layer 112, and the second rewiring layer 120 includes a second dielectric layer 112 and a second metal wiring layer 121 located in the second dielectric layer 122. The first metal wiring layer 111 in the first rewiring layer 110 can be N≥1 layers, such as N is 1, 2, 3, 5, etc., and the second metal wiring layer 121 in the second rewiring layer 120 can be M≥1 layers, such as M is 1, 2, 3, 5, etc. There is no excessive restriction on the structures of the first rewiring layer 110 and the second rewiring layer 120.
[0042] The material of the metal pillar 200 may include one or a combination of copper and nickel; the electrical connectors of the RF switch 301, the duplexer 302, the low noise amplifier 303, the power amplifier 304, and the filter 305 may be solder bumps or metal pillars and solder bumps located above the metal pillars (not shown) or metal bumps and a solder layer located on the outer surface of the metal bumps (not shown). The specific types are not overly restricted here.
[0043] The method for forming the first encapsulation layer 410 may include compression molding, transfer molding, liquid sealing molding, vacuum lamination, and spin coating. After forming the first encapsulation layer 410, a process step of thinning the first encapsulation layer 410 may be included to reduce the size of the encapsulation structure. The material of the first encapsulation layer 410 may include, for example, epoxy resin, polyimide, etc. After forming the first encapsulation layer 410, the first encapsulation layer 410 may be thinned by, for example, CMP to further reduce the size of the encapsulation structure.
[0044] The electrical connection between the low noise amplifier 303, the power amplifier 304, the filter 305 and the second rewiring layer 120 can be protected by the first bottom filling layer 501. The material of the first bottom filling layer 501 can be an insulating material, and the specific type is not overly restricted here.
[0045] The line width of the three-dimensional RF module system packaging structure can be less than 2 μm, such as 2 μm, 1.5 μm, etc., and the line pitch of the three-dimensional RF module system packaging structure can be less than 2 μm, such as 2 μm, 1.5 μm, etc. In this embodiment, the first rewiring layer 110, the second rewiring layer 120, and the metal pillars 200 can be used to integrate various RF components into a three-dimensional RF module packaging structure, thereby achieving high-performance system-in-package and effectively reducing the packaging area and volume.
[0046] As a preferred example, a shielding layer (not shown) is provided on the surface of the RF switch 301 and is spaced apart from its electrical connectors to reduce the impact of electromagnetic waves generated during its operation on other components within the three-dimensional RF module system packaging structure.
[0047] As an example, the three-dimensional RF module system packaging structure may be a wafer-level three-dimensional RF module system packaging structure to further improve production efficiency, wherein the wafer-level size may include 12 inches, 8 inches, 6 inches, etc., and the specific size is not overly restricted here.
[0048] Example 2
[0049] As shown in Figure 2, this embodiment provides a three-dimensional RF module system packaging structure. The main difference between the three-dimensional RF module system packaging structure and the embodiment 1 is that it also includes a second packaging layer 420 located on the second surface of the second rewiring layer 120 and covering the low noise amplifier 303, the power amplifier 304, the filter 305 and the first bottom filling layer 501.
[0050] The method for forming the second encapsulation layer 420 may include compression molding, transfer molding, liquid sealing molding, vacuum lamination, and spin coating. After forming the second encapsulation layer 420, a process step of thinning the second encapsulation layer 420 may be included to reduce the size of the package structure. The material of the second encapsulation layer 420 may include, for example, epoxy resin, polyimide, etc. After forming the second encapsulation layer 420, the second encapsulation layer 420 may be thinned using, for example, a CMP method to further reduce the size of the package structure.
[0051] For the structures, materials, etc. of other components in the three-dimensional RF module system packaging structure, please refer to Example 1 and will not be described in detail here.
[0052] Example 3
[0053] As shown in Figure 3, this embodiment provides a three-dimensional RF module system packaging structure. The main difference between the three-dimensional RF module system packaging structure and the second embodiment is that it also includes an electromagnetic isolation protective shell 600 located outside the first packaging layer 410, the second packaging layer 420, the first rewiring layer 110 and the second rewiring layer 120 and exposing the second surface of the first rewiring layer 110.
[0054] Regarding the structural materials and materials of other components in the three-dimensional radio frequency module system packaging structure, please refer to the second embodiment and will not be described in detail here.
[0055] Example 4
[0056] As shown in Figure 4, this embodiment provides a three-dimensional radio frequency module system packaging structure. The main difference between the three-dimensional radio frequency module system packaging structure and the third embodiment is that it also includes a PCB substrate 800 and a transceiver 306, and the transceiver 306 and the packaging structure with the electromagnetic isolation protective shell 600 are electrically connected to the PCB substrate 800.
[0057] For the structures, materials, etc. of other components in the three-dimensional RF module system packaging structure, please refer to Example 3 and will not be described in detail here.
[0058] Example 5
[0059] As shown in Figure 5, this embodiment provides a three-dimensional RF module system packaging structure. The main difference between the three-dimensional RF module system packaging structure and the second embodiment is that it also includes a transceiver 306 located on the second surface of the first rewiring layer 110 and electrically connected to the first rewiring layer 110; and a second bottom filling layer 502 is filled between the transceiver 306 and the first rewiring layer 110.
[0060] The material of the second bottom filling layer 502 may be the same as or different from that of the first bottom filling layer 501. The electrical connection between the transceiver 306 and the first rewiring layer 110 may be protected by the second bottom filling layer 502. The material of the second bottom filling layer 502 may be an insulating material, and the specific type is not overly restricted here.
[0061] Furthermore, a metal bump 700 electrically connected to the first re-distribution layer 110 is provided on the second surface of the first re-distribution layer 110 , and an end portion of the metal bump 700 protrudes from the surface of the transceiver 306 .
[0062] The metal bump 700 can facilitate subsequent electrical lead-out. The metal bump 700 can be a solder ball prepared by a reflow soldering process, but is not limited thereto. The specific material and preparation of the metal bump 700 are not limited here.
[0063] Regarding the structural materials and materials of other components in the three-dimensional radio frequency module system packaging structure, please refer to the second embodiment and will not be described in detail here.
[0064] Example 6
[0065] As shown in Figure 6, this embodiment provides a three-dimensional RF module system packaging structure. The main difference between the three-dimensional RF module system packaging structure and the fifth embodiment is that: it can also include a third packaging layer 430, and the third packaging layer 430 can cover the transceiver 306, the second bottom filling layer 502 and the metal bump 700, and the first surface of the third packaging layer 430 is in contact with the second surface of the first rewiring layer 110, and the second surface of the third packaging layer 430 exposes the end of the metal bump 700, thereby facilitating subsequent electrical connection through the exposed metal bump 700.
[0066] For the structural materials and materials of other components in the three-dimensional radio frequency module system packaging structure, please refer to Example 5 and will not be described in detail here.
[0067] Example 7
[0068] As shown in Figure 7, this embodiment provides a three-dimensional RF module system packaging structure. The main difference between the three-dimensional RF module system packaging structure and the sixth embodiment is that it also includes an electromagnetic isolation protective shell 600 located outside the first packaging layer 410, the second packaging layer 420, the third packaging layer 430, the first rewiring layer 110 and the second rewiring layer 120 and exposing the second side of the third packaging layer 430.
[0069] Regarding the structural materials and materials of other components in the three-dimensional radio frequency module system packaging structure, please refer to Example 6 and will not be described in detail here.
[0070] To sum up, the three-dimensional RF module system packaging structure of the present application integrates various RF components into a three-dimensional RF module packaging structure through the first rewiring layer, the second rewiring layer, and the metal pillars, which can achieve high-performance system packaging, and the packaging line width and line spacing can reach 2μm / 2μm, which can effectively reduce the packaging area and packaging volume.
[0071] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical concepts disclosed in this application shall be covered by the claims of this application.
Claims
1. A three-dimensional radio frequency module system packaging structure, characterized in that: The three-dimensional radio frequency module system packaging structure includes: a first redistribution layer, the first redistribution layer comprising a first side and an opposite second side; a metal column, the metal column being located on the first surface of the first redistribution layer, and a first end of the metal column being electrically connected to the first redistribution layer; A radio frequency switch and a duplexer, wherein the radio frequency switch and the duplexer are both located on the first surface of the first re-distribution layer, and electrical connectors between the radio frequency switch and the duplexer are away from the first re-distribution layer; a first packaging layer, the first packaging layer being located on a first surface of the first rewiring layer and covering the metal pillar, the RF switch, and the duplexer, and exposing the second end of the metal pillar, the RF switch, and the electrical connector of the duplexer; a second redistribution layer, the second redistribution layer being located on the first packaging layer and comprising a first surface in contact with the first packaging layer and a second surface opposite thereto, the second redistribution layer being electrically connected to the second end of the metal pillar, and the second redistribution layer being electrically connected to the electrical connectors of the RF switch and the duplexer; A low-noise amplifier, a power amplifier, and a filter, wherein the low-noise amplifier, the power amplifier, and the filter are located on the second surface of the second redistribution layer, and electrical connectors of the low-noise amplifier, the power amplifier, and the filter are electrically connected to the second redistribution layer respectively; A first bottom filling layer is located on the second surface of the second rewiring layer and covers the low noise amplifier, the power amplifier and the electrical connectors of the filter.
2. The three-dimensional radio frequency module system packaging structure according to claim 1, wherein: The invention also includes a second packaging layer located on a second surface of the second rewiring layer and covering the low noise amplifier, the power amplifier, the filter and the first bottom filling layer.
3. The three-dimensional radio frequency module system packaging structure according to claim 2, wherein: The invention also includes an electromagnetic isolation protection shell located outside the first packaging layer, the second packaging layer, the first redistribution layer and the second redistribution layer and exposing the second surface of the first redistribution layer.
4. The three-dimensional radio frequency module system packaging structure according to claim 3, wherein: It also includes a PCB substrate and a transceiver, and the transceiver and the packaging structure with the electromagnetic isolation protection shell are both electrically connected to the PCB substrate.
5. The three-dimensional radio frequency module system packaging structure according to claim 2, wherein: It also includes a transceiver located on the second surface of the first redistribution layer and electrically connected to the first redistribution layer; a second bottom filling layer is filled between the transceiver and the first redistribution layer.
6. The three-dimensional radio frequency module system packaging structure according to claim 5, characterized in that: A metal bump electrically connected to the first redistribution layer is provided on the second surface of the first redistribution layer, and an end portion of the metal bump protrudes from the surface of the transceiver.
7. The three-dimensional radio frequency module system packaging structure according to claim 6, characterized in that: It also includes a third packaging layer, which covers the transceiver, the second bottom filling layer and the metal bump, and the first surface of the third packaging layer contacts the second surface of the first rewiring layer, and the second surface of the third packaging layer exposes the end of the metal bump.
8. The three-dimensional radio frequency module system packaging structure according to claim 7, characterized in that: The invention also includes an electromagnetic isolation protection shell located outside the first packaging layer, the second packaging layer, the third packaging layer, the first redistribution layer and the second redistribution layer and exposing the second surface of the third packaging layer.
9. The three-dimensional radio frequency module system packaging structure according to claim 1, wherein: The line width of the three-dimensional radio frequency module system packaging structure is less than 2 μm, and the line spacing of the three-dimensional radio frequency module system packaging structure is less than 2 μm.
10. The three-dimensional radio frequency module system packaging structure according to claim 1, characterized in that: The three-dimensional radio frequency module system packaging structure is a wafer-level three-dimensional radio frequency module system packaging structure.