POWER CONVERSION DEVICE AND ELECTRIC VEHICLE USING THE SAME

Abstract

A main circuit connection section of a power conversion device (100) comprises: a first conductor (11) provided at a rear surface of a circuit substrate (80); a second conductor (12) in which current flows in a direction opposite to that in the first conductor (11) and which is provided at a front surface of the circuit substrate (80) and at least partially opposes the first conductor (11) via the circuit substrate (80); a third conductor (17) in which current flows in the same direction as in the second conductor (12) and which is provided at the rear surface of the circuit substrate (80), maintaining an insulation distance (D) from the first conductor (11); a fourth conductor (17) provided in a side wall of at least one through-hole (80a) formed in the circuit substrate (80) and which connects the second conductor (12) and the third conductor (13);a relay section (18a) filled with a thermally conductive element in the through-hole (80a); and a cooling section (16) provided on surfaces of the first conductor (11) and the third conductor (13) via an insulating thermally conductive material (15).

Description

TECHNICAL AREA

[0001] The present disclosure relates to a power conversion device and an electric vehicle that uses the same. STATE OF THE ART

[0002] In power conversion devices used for electric vehicles such as hybrid and electric cars, higher currents and voltages are employed to reduce size and improve efficiency. From a power module protection perspective, low-inductance technology is required for the main circuit wiring to minimize overvoltages occurring during switching. It is known that inductance can be reduced by an arrangement in which conductors carrying opposing currents are positioned opposite each other. For example, patent document 1 shows that inductance can be reduced by the wiring pattern in a circuit substrate. QUOTE LIST PATENT DOCUMENT

[0003] Patent document 1: Japanese published patent publication no. 2017-220961 (paragraph

[0009] , Fig. 6) SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION

[0004] To further reduce inductance, it is necessary to reduce the distance between the opposing wires (P-line and N-line) or to increase the pattern width, but such a design is limited by structural and manufacturing constraints. Additionally, the main circuit wiring, through which a large current flows, must be configured so that the temperature rise caused by heat generation in the main circuit wiring is not transferred to a component with low thermal resistance; therefore, a cooling structure is also required.

[0005] The present disclosure was made to solve the above-mentioned problem, and one objective of the present disclosure is to provide a power conversion device that has high heat dissipation performance at low cost and in a simple manner, as well as an electric vehicle that uses it. MEANS TO SOLVE THE PROBLEM

[0006] A power conversion device according to the present disclosure comprises: a first conductor provided on a first surface of a substrate; a second conductor in which current flows in a direction opposite to that in the first conductor, and which is provided on a second surface of the substrate and is at least partially opposite to the first conductor via the substrate; a third conductor in which current flows in the same direction as in the second conductor, and which is provided on the first surface of the substrate, maintaining an insulation distance from the first conductor; a fourth conductor provided on a side wall of at least one through-hole formed in the substrate and connecting the second conductor and the third conductor; and a cooling section provided on surfaces of the first conductor and the third conductor via an insulating, thermally conductive material. IMPACT OF THE INVENTION

[0007] According to the present disclosure, the first conductor is opposite to the second conductor and adjacent to the third conductor, thereby reducing the inductance not only at the opposite ends but also at the adjacent ends. Additionally, it becomes possible to cool not only the conductor on the lower surface of the substrate but also the conductor on the front surface of the substrate via the relay section and the conductor on the side wall of the through-hole, thus miniaturizing the power conversion device. BRIEF DESCRIPTION OF THE DRAWINGS [ Fig. 1] Fig. Figure 1 is a block diagram showing a configuration of a power conversion device according to embodiment 1. [ Fig. 2] Fig. Figure 2 is a schematic perspective view showing a configuration of a main circuit connection section of the power conversion device according to embodiment 1. [ Fig. 3] Fig. Figure 3 is a sectional view showing a configuration of the main circuit connection section of the power conversion device according to embodiment 1. [ Fig. 4] Fig. Figure 4 is a schematic perspective view showing a configuration of a main circuit connection section of a power conversion device according to embodiment 2. [ Fig. 5] Fig. Figure 5 is a sectional view showing a configuration of the main circuit connection section of the power conversion device according to embodiment 2. [ Fig. 6] Fig. Figure 6 is a sectional view showing a configuration of a main circuit connection section of a power conversion device according to embodiment 3. [ Fig. 7] Fig. 7A and Fig. Figure 7B shows sectional views of a configuration of a main circuit connection section of a power conversion device according to embodiment 4. [ Fig. 8] Fig. Figure 8 is a sectional view showing a configuration of a main circuit connection section of a power conversion device according to embodiment 5. [ Fig. 9] Fig. Figure 9 is a sectional view showing another configuration of the main circuit connection section of the power conversion device according to embodiment 5. [ Fig. 10] Fig. Figure 10 shows a configuration of an electric vehicle that uses a power conversion device according to embodiment 6. DESCRIPTION OF THE EXECUTION FORMS Execution form 1

[0008] Fig. Figure 1 is a block diagram showing a configuration of a power conversion device 100 (or power conversion device 100) according to embodiment 1 of the present disclosure. As shown in Fig. As shown in Figure 1, the power conversion device 100 comprises a housing 1, a heat sink 2, a power module 3, a capacitor 4, a control board 5, an AC output section 6, and a DC input section 7. The heat sink 2 dissipates the heat from heat-generating elements, e.g., the power module, the capacitor, the AC output section, and the DC input section, to the outside of the power conversion device.

[0009] Fig. Figure 2 is a schematic perspective view showing a configuration of a main circuit connection section of the power conversion device 100 according to embodiment 1, and schematically shows the configuration of the main circuit connection section between the power module and the capacitor, between the power module and the AC output section, between the power module and the DC input section, and between the DC input section and the capacitor in the power conversion device 100. Fig. 1. Fig. 3 is a sectional view in the direction of arrow AA in Fig. 2. A main circuit wiring refers to high-voltage connections from the DC input section to the capacitor, from the capacitor to the power module, and from the DC input section to the power module.

[0010] As in Fig. 2 and Fig. As shown in Figure 3, in the main circuit wiring of embodiment 1, a circuit substrate 80 has a first conductor 11 and a second conductor 12, between which a base material 14 is arranged. The first conductor 11 and the second conductor 12 are formed by metal elements with high electrical conductivity and high thermal conductivity and consist, for example, of copper or aluminum. In the present embodiment, copper is used. The base material 14 is an insulating resin.

[0011] The circuit substrate 80 has a multilayer structure and features copper patterns such as the first conductor 11 and electronic components not shown (components other than the main circuit wiring are not shown).

[0012] Regarding the directions in which currents flow, for example, water flows into... Fig. 2 Current through the first conductor 11 in an X-direction and current through the second conductor 12 in a -X-direction, so that the currents flow in opposite directions (the above can be reversed).

[0013] A third conductor 13 has the same potential phase (band) as the second conductor 12 and is provided on a rear surface (or back side), which is a first surface of the circuit substrate 80, a layer different from the second conductor 12, across the base material 14 and a relay section 18a, which is provided in a through-hole 80a formed in the circuit substrate 80. The relay section 18a is formed by an element having high thermal conductivity. The third conductor 13 is flush with the first conductor 11 and extends on the circuit substrate 80, maintaining an insulation distance D from the first conductor 11. At least one through-hole 80a is formed in the circuit substrate 80.

[0014] An insulating, thermally conductive material 15 is provided between a cooling section 16 and the first conductor 11. The insulating, thermally conductive material 15 has an insulating function and a heat dissipation function between the cooling section 16 and the first conductor 11 and the third conductor 13. The insulating, thermally conductive material 15 is in partial or complete contact with the first conductor 11 and the third conductor 13, so that parts where heat dissipation is required can transfer heat to the cooling section 16.

[0015] The first conductor 11, the third conductor 13, and a fourth conductor 17, formed on a side wall of the through-hole 80a, are formed by separate elements and are electrically connected when the circuit powder 80 is formed. In contrast to a busbar with a molded shape, the first conductor 11 and the second conductor 12 form parallel flat plates between which the comparatively thin base material 14 is arranged. Therefore, the distance between the electrodes can be shorter than in the case of a busbar with a molded shape, thus reducing the inductance. Since the first conductor 11 and the third conductor 13 are arranged flush with each other, parallel flat plates are also formed on a side surface section, further reducing the inductance.

[0016] In the cooling of a main circuit described in patent document 1, only one surface is cooled, and a surface opposite the cooling surface dissipates heat solely via a base material and a cooling conductor. Therefore, no active cooling can be performed, and the top surface exhibits a high temperature. However, in the present disclosure, the main circuit can also dissipate heat in the upper layer to the cooling section via the relay section 18a and the fourth conductor 17, which has high thermal conductivity.

[0017] If higher cooling capacity is required, relay section 18a can be made of metal, allowing heat to be transferred more efficiently to cooling section 16 than if only one surface of relay section 80a (fourth conductor 17) were made of metal. Since heat can be transferred from the second conductor 12 to the cooling section 16 via a front surface (or front face), which is a second surface of the circuit substrate 80, the widths of the first conductor 11 and the second conductor 12 can be reduced, resulting in a smaller power conversion device.

[0018] As described above, the power conversion device 100 according to the present embodiment 1 comprises: the first conductor 11, which is provided at the rear surface of the circuit substrate 80; a second conductor 12, in which current flows in a direction opposite to that in the first conductor 11, and which is provided at the front surface of the circuit substrate 80 and is at least partially opposite to the first conductor 11 via the circuit substrate 80; a third conductor 13, in which current flows in the same direction as in the second conductor 12, and which is provided at the rear surface of the circuit substrate 80, maintaining an insulation distance D to the first conductor 11; a fourth conductor 17, which is provided at the side wall of at least one through-hole 80a formed in the circuit substrate 80 and connects the second conductor 12 and the third conductor 13;the relay section 18a, which is filled with a thermally conductive element in the through-hole 80a; and the cooling section 16, which is provided on the surfaces of the first conductor 11 and the third conductor 13 via the insulating thermally conductive material 15. Thus, the first conductor is opposite the second conductor and adjacent to the third conductor, which reduces the inductance not only at the opposite parts but also at the adjacent parts. In addition, it becomes possible to cool not only the conductor on the lower surface of the substrate but also the conductor on the upper surface of the substrate via the relay section. Design 2

[0019] In embodiment 2, a case is described where the structure of the third conductor 13 in embodiment 1 is also provided on the opposite side of the first conductor 11.

[0020] Fig. Figure 4 is a schematic perspective view showing a configuration of a main circuit connection section of a power conversion device according to embodiment 2. Fig. 5 is a sectional view in the direction of arrow AA in Fig. 4.

[0021] As in Fig. 4 and Fig. As shown in Figure 5, the circuit substrate 80 in the section of the main circuit wiring in embodiment 2 has a fifth conductor 23 which has the same configuration as the third conductor 13, located on the side opposite the third conductor 13 above the first conductor 11.

[0022] The fifth conductor 23 has the same potential phase (band) as the second conductor 12 and is provided on the rear surface of the circuit substrate 80, which is a different layer than the second conductor 12, via the base material 14 and a relay section 18b formed in a through-hole 80b in the circuit substrate 80. The fifth conductor 23 is flush with the first conductor 11 and extends on the circuit substrate 80, maintaining an insulation distance D from the first conductor 11. At least one through-hole 80b is formed in the circuit substrate 80.

[0023] The first conductor 11, the third conductor 13, and a sixth conductor 27, formed on a side wall of the relay section 80b, are formed by separate elements and are electrically connected when the circuit substrate 80 is formed. In contrast to a busbar with a fixed shape, the first conductor 11 and the second conductor 12 form parallel flat plates between which the comparatively thin base material 14 is arranged. Therefore, the distance between the electrodes can be shorter than in the case of a busbar with a fixed shape, thus reducing the inductance. Since the first conductor 11 and the fifth conductor 23 are arranged flush with each other, parallel flat plates are also formed on a side surface section, further reducing the inductance.

[0024] Additionally, the above configuration further improves the cooling performance for the second conductor 12 on the front surface of the circuit substrate 80, thereby allowing the power conversion device to be further miniaturized. Furthermore, since the third conductor 13 and the fifth conductor 23 are arranged such that the first conductor 11 is positioned between the left and right sides, the area where parallel flat plates are present is increased compared to the configuration in embodiment 1, thus further reducing the inductance.

[0025] The other parts of the power conversion device 100 according to embodiment 2 are the same as those of the power conversion device 100 in embodiment 1, and the corresponding parts are marked with the same reference numerals, and their description will be omitted.

[0026] As described above, the power conversion device 100 according to the present embodiment 2 in the configuration of embodiment 1 comprises: the fifth conductor 23, in which current flows in the same direction as in the second conductor 12 and which is provided on the rear surface of the circuit substrate 80, such that the first conductor 11 is arranged between the fifth conductor 23 and the third conductor 13, while maintaining the corresponding insulation distance D from the first conductor 11; the sixth conductor 27, which is provided on the side wall of the through-hole 80b formed in the circuit substrate 80, wherein the first conductor 11 is arranged between the through-hole 80a and the through-hole 80b and the sixth conductor 27 connects the second conductor 12 and the fifth conductor 23; and the relay section 18b, which is filled with a thermally conductive element in the through-hole 80b.Compared to the configuration of embodiment 1, the area in which parallel flat plates are present is thus increased, allowing the inductance to be further reduced. Additionally, the cooling performance can be further improved, enabling the power conversion device to be made smaller. embodiment 3

[0027] If the third conductor 13, the fifth conductor 23 and the first conductor 11 are designed over large (or wide) areas compared to the second conductor 12 in embodiment 1, this is described in embodiment 3.

[0028] Fig. Figure 6 is a sectional view showing a configuration of a main circuit connection section of a power conversion device according to embodiment 3. As shown in Fig. As shown in Figure 6, the main circuit wiring section in embodiment 3 has the third conductor 13 and the fifth conductor 23 extending over large areas beyond the area opposite the second conductor 12 over the circuit substrate 80.

[0029] With the above configuration, the cooling performance is improved because the third conductor 13 and the fifth conductor 23 extend over large areas on the cooling section 16, with the insulating thermally conductive material 15 positioned between them. As a result, it becomes possible to reduce the width of the second conductor 12, thus improving the degree of freedom in arranging the electronic components on the surface of the circuit substrate 80.

[0030] The other parts of the power conversion device 100 according to embodiment 3 are the same as those of the power conversion device 100 in embodiment 2, and the corresponding parts are marked with the same reference numerals, so their description is omitted here.

[0031] As described above, in the power conversion device 100 according to the present embodiment 3, the third conductor 13, the fifth conductor 23, and the first conductor 11 extend over large areas beyond the area opposite the second conductor 12 on the circuit substrate 80. Thus, in addition to the effects of embodiment 1 and embodiment 2, these conductors extend over large areas on the cooling section, with the insulating thermally conductive material positioned between them, thereby improving cooling performance. As a result, the width of the second conductor can be reduced, thus improving the degree of freedom for arranging the electronic components on the surface of the circuit substrate. Design 4

[0032] In embodiments 1 to 3, the phases are fixed on the front and rear surfaces of the circuit substrate. Embodiment 4 describes a case where the phases are shifted relative to each other.

[0033] Fig. 7A to Fig. Figure 7D shows sectional views of the configuration of a main circuit connection section of a power conversion device according to embodiment 4. Fig. 7A to Fig. 7D are sectional views, as shown in the directions of arrows AA, BB, CC and DD in Fig. 4 can be seen. In Fig. 7A to Fig. 7D shows the potentials of the conductors represented by (P) and (N) accordingly.

[0034] As in Fig. 7A to Fig. As shown in Figure 7D, in the main circuit wiring of embodiment 4, the circuit substrate 80 is configured such that the N-phase (first conductor 11) on the rear surface and the P-phase (second conductor 12) on the front surface of the base material 14 are shifted from position AA to position DD relative to each other, and the rear surface of the base material 14 is shifted towards the P-phase (third conductor 13 or fifth conductor 23) and the surface of the base material 14 is shifted towards the N-phase (seventh conductor 41).

[0035] At position DD, a seventh conductor 41 is a pattern that has the same potential as the first conductor 11 and is provided on a surface opposite to the first conductor 11, across the base material 14. An eighth conductor 42 and a ninth conductor 43 are patterns that have the same potential as the seventh conductor 41 and are provided on a surface opposite to the seventh conductor 41, across the base material.

[0036] At the in Fig. In position AA shown in 7A, the P-phase (second conductor 12) is present on the forward surface of the circuit substrate 80, and the N-phase (first conductor 11) is present on the rear surface, i.e., on the side of the cooling section 16.

[0037] At the in Fig. At position BB shown in 7B, the arrangement changes from the state at position AA to a state in which the conductors on the front surface and the cooling of the circuit substrate 80 are arranged alternately in a plane direction, while maintaining the insulation distances D between the P-phase and the N-phase. As shown in Fig. As shown in Figure 7B, the conductors are arranged in a configuration of P-phase (second conductor 12 and fifth conductor 23) - N-phase (seventh conductor 41 and first conductor 11) - P-phase (second conductor 12 and third conductor 13). In the present embodiment 4, only the P-phase-N-phase-P-phase configuration is shown, but, for example, the widths of the P-phase and the N-phase can be reduced, and a variety of P-phase and N-phase configurations can be provided.

[0038] At the in Fig. The cross-section shown in position CC at 7C indicates that the N-phase (seventh conductor 41) is transferred to the front surface and the P-phase (second conductor 12, fifth conductor 23 and third conductor 13) is present on the front surface and a lower part.

[0039] At the in Fig. In the position DD shown in 7D, the N-phase (seventh conductor 41) extends on the forward surface of the circuit substrate 80 and also on the side of the cooling section 16 over the relay sections 18a and 18b, with the N-phase (eighth conductor 42 and ninth conductor 43) being formed on the same plane as the P-phase (third conductor 13 or fifth conductor 23).

[0040] The in Fig. 7A and Fig. The states shown in Figure 7D are states in which the P-phase and the N-phase are shifted relative to each other. In the present embodiment 4, the case where the phases are shifted relative to each other once was described, but the present disclosure is not limited to this. Between the P-phase and the N-phase, the phase arrangements on the circuit substrate 80 can be shifted multiplicatively relative to each other over a number of time intervals. In the present embodiment 4, depending on the cooling, the areas of the eighth conductor 42, the ninth conductor 43, and the relay sections 18a and 18b can be reduced, and the number of relay sections can be reduced, although this is not shown.

[0041] The other parts of the power conversion device 100 according to embodiment 4 are the same as those of the power conversion device 100 in embodiment 1, and the corresponding parts are marked with the same reference numerals, and their description is omitted.

[0042] As described above, in the power conversion device 100 according to the present embodiment 4, the circuit substrate 80 is configured such that the arrangements of the potential phases of the conductors on the front surface and the rear surface are offset from each other at least once. Thus, the conductors for both potentials can be cooled directly by the cooler beneath the circuit substrate, thereby reducing the temperature difference between the conductors. Consequently, the conductors can be cooled without excessively increasing the widths of the conductor layers to cool the high-temperature parts of the circuit substrate. This allows the circuit substrate to be reduced in size, and as a result, the power conversion device can also be reduced in size. Design 5

[0043] In embodiment 5, a case is described where metal plates are provided on the conductor surfaces of the circuit substrate 80.

[0044] Fig. Figure 8 is a sectional view showing a configuration of a main circuit wiring section of a power conversion device according to embodiment 5. As shown in Fig. As shown in Figure 8, in the main circuit wiring section of embodiment 5, a first metal plate 51 is provided on the surfaces of the first conductor 11, the third conductor 13 and the relay section 18a on the rear surface of the circuit substrate 80, and a second metal plate 52 is provided on the surfaces of the second conductor 12 and the relay section 18a on the front surface of the circuit substrate 80.

[0045] The first metal plate 51 and the second metal plate 52 are mounted to the conductors by soldering. In the present embodiment 5, the number of first metal plates 51 and second metal plates 52 is one, but the present disclosure is not limited thereto. The number and mounting positions of the metal plates can be selected according to the degree of current distribution.

[0046] The other parts of the power conversion device 100 according to embodiment 5 are the same as those of the power conversion device 100 in embodiment 1, and the corresponding parts are marked with the same reference numerals, and their description is omitted.

[0047] In the present embodiment 5, the case was described in which the configuration of the third conductor 13 is provided on one side of the first conductor 11. However, this configuration can also be provided on the opposite side of the first conductor 11. Fig. Figure 9 is a sectional view showing a different configuration of the circuit connection section of the power conversion device according to embodiment 5. As shown in Fig. As shown in Figure 9, the circuit substrate 80 in the main circuit wiring section has the fifth conductor 23 with the same configuration as the third conductor 13 on the side opposite the third conductor 13 via the first conductor 11, and the first metal plate 51 and the second metal plate 52 are provided on the conductors as in the embodiment 5 above.

[0048] In the present embodiment 5, both the first metal plate 51 and the second metal plate 52 are provided. However, only one of them may also be provided.

[0049] As described above, the power conversion device 100 according to the present embodiment 5 further comprises one or both of the first metal plate 51, which is provided on the rear surface of the circuit substrate 80, and the second metal plate 52, which is provided on the front surface of the circuit substrate 80. Thus, the metal plate provided on each conductor has the effect of increasing the cross-sectional area of ​​the current path, thereby reducing heat generation in each conductor and the temperature rise in each conductor. Since, in addition, the thickness of each conductor is increased and its cross-sectional area is enlarged, the width of each conductor can be reduced, making it possible to reduce the area of ​​the circuit substrate and, as a result, to miniaturize the power conversion device. Design 6

[0050] In embodiment 6, a case is described if the power conversion device 100 from embodiment 1 is used in an electric vehicle.

[0051] Fig. Figure 10 shows a configuration of an electric vehicle 200 that uses the power conversion device 100 according to embodiment 6 of the present disclosure.

[0052] As in Fig. As shown in Figure 6, the electric vehicle 200 comprises: the power conversion device 100 according to each of embodiments 1 to 5, which converts DC power input from a battery 21 and outputs AC power; and a motor 22 (22a, 22b) which is driven by AC power input from the power conversion device 100.

[0053] As described above, the electric vehicle 200, which uses the power conversion device 100 according to the present embodiment 6, comprises: the power conversion device 100 according to one of embodiments 1 to 5, which converts the DC power input from the battery 21 and outputs AC power; and the motor 22 (22a, 22b), which is operated with AC power from the power conversion device 100. Since the power conversion device has lower inductance and size, the electric vehicle can be reduced in size and weight.

[0054] Although the disclosure above has been described with reference to various exemplary embodiments and implementations, it should be clear that the various features, aspects, and functions described in one or more of the individual embodiments are not limited in their applicability to the specific embodiment in which they are described, but can be applied, alone or in various combinations, to one or more of the embodiments of the disclosure. It is understood that numerous modifications, not shown by way of example, can be developed without derogation from the scope of the present disclosure. For example, at least one of the components can be modified, added, or removed.At least one of the components mentioned in at least one of the preferred embodiments can be selected and combined with the components mentioned in another preferred embodiment. DESCRIPTION OF REFERENCE MARKS 11 first leader 12 second conductor 13 third ladder 15 thermally conductive insulating material 17 fourth leader 16 Cooling section 18a, 18b Relay section 80 circuit substrate 80a, 80b Through hole 100 Power conversion device QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2017-220961

[0003]

Claims

[1] Power conversion device comprising: a first conductor provided on a first surface of a substrate; a second conductor in which current flows in a direction opposite to that in the first conductor, and which is provided on a second surface of the substrate and is at least partially opposite to the first conductor across the substrate; a third conductor in which current flows in the same direction as in the second conductor and which is provided at the first surface of the substrate, maintaining an insulation distance to the first conductor; a fourth conductor, which is provided on a side wall of at least one through-hole formed in the substrate and connects the second conductor and the third conductor; and a cooling section provided on the surfaces of the first conductor and the third conductor via an insulating, thermally conductive material. [2] Power conversion device according to claim 1, further comprising a relay section filled with a heat-conducting element inside the through-hole. [3] Power conversion device according to claim 1 or 2, further comprising a fifth conductor in which current flows in the same direction as in the second conductor and which is provided on the first surface of the substrate such that the first conductor is positioned between the fifth conductor and the third conductor, maintaining the appropriate insulation distances to the first conductor; and a sixth conductor provided on a side wall of a through hole formed on another side of the substrate, wherein the first conductor is arranged between the through hole and the through hole formed on the other side, and the sixth conductor connects the second conductor and the fifth conductor. [4] Power conversion device according to claim 3, further comprising a relay section which is filled with a heat-conducting element within the through-hole on the other side. [5] Power conversion device according to claim 3 or 4, wherein the third conductor, the fifth conductor and the first conductor are formed over wide areas beyond a region which opposes the second conductor over the substrate. [6] Power conversion device according to any one of claims 1 to 5, wherein the substrate is configured such that arrangements of potential phases of the first conductor and the second conductor are shifted at least once relative to each other. [7] Power conversion device according to any one of claims 1 to 6, further comprising a first metal plate provided on the first surface of the substrate and / or a second metal plate provided on the second surface of the substrate. [8] Electric vehicle, including: the power conversion device according to any one of claims 1 to 7, which converts DC power input from a battery and outputs AC power; and a motor driven by AC power input from the power conversion device.

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