Multi-component connectors

Abstract

The present disclosure provides a multi-component connector arrangement and a method for manufacturing such an arrangement. A multi-component connector arrangement comprises, for example, a multi-component connector with a first and a second carrier element and also includes a plurality of components arranged between the first and the second carrier element. At least one of the plurality of components can be a heat sink component configured to conduct heat from a first region to a second region. Additionally or alternatively, the plurality of components can include a capacitor, a resistor, a varistor, an inductor, or the like. In at least some connectors, multiple slots are defined, and at least one component is arranged between the first and the carrier element in a corresponding slot of the multiple slots.

Description

Related registrations

[0001] The present application is based on the preliminary US patent application Serial No. 63 / 487,065, filed on February 27, 2023, which is incorporated herein by reference, and claims priority therefrom. background

[0002] High-frequency radio signal communication has gained popularity. For example, the demand for higher data transmission speeds for wireless smartphone connectivity has increased the demand for high-frequency components, including those configured for operation in the 5G spectrum. The trend toward miniaturization has also increased the need for small, passive components for processing such high-frequency signals. Miniaturization has also increased the challenges of surface mounting small, passive components suitable for operation in the 5G frequency spectrum. A connector that positions two or more components on the same footprint, for example to reduce the mounting area and / or increase performance, would be a welcome development. Summary

[0003] According to one embodiment of the present invention, a multi-component connector arrangement can comprise a multi-component connector with a first support element and a second support element spaced apart from the first support element. The multi-component connector arrangement can also comprise a plurality of components arranged between the first support element and the second support element of the multi-component connector. At least one of the plurality of components can be a heat sink component having a body containing a thermally conductive material that is electrically non-conductive, such that the heat sink component is configured to conduct heat from a first region to a second region.

[0004] According to another embodiment of the present invention, a multi-component connector arrangement can comprise a multi-component connector with a first support element, a second support element spaced apart from the first support element, and a plurality of slots. At least one component can be arranged between the first support element and the second support element of the multi-component connector, wherein the at least one component is arranged in a corresponding slot of the plurality of slots. Brief description of the drawings

[0005] A complete and enabling disclosure of the present invention, including the best embodiment, which is addressed to a person skilled in the art, is set out in particular in the remainder of the description, which refers to the accompanying figures, in which: Fig. Figure 1 is a perspective view of a multi-component connector arrangement with a multi-component connector mounted on a mounting surface, wherein several components are arranged in the multi-component connector and gaps are defined between adjacent components, according to the aspects of the present disclosure. Fig. Figure 2 is a perspective view of the multi-component connection arrangement of Fig. 1, with additional components arranged in the spaces defined between the adjacent components. Fig. Figure 3 is a perspective view of a multi-component connector arrangement, which includes a multi-component connector mounted on a mounting surface with several components arranged in the multi-component connector according to the aspects of the present disclosure. Fig. Figure 4 is a top view of a multi-component connector having a plurality of ribs defining a plurality of slots, and having a component arranged in a corresponding slot at each end of the connector, according to the aspects of the present disclosure. Fig. Figure 5 is a perspective view of a multi-component connector arrangement with a multi-component connector mounted on a mounting surface and having a first retaining element at a first end and a second retaining element at a second end, according to aspects of the present disclosure. Fig. Figure 6 is a top view of a multi-component connector with several transverse elements extending between opposing support elements of the multi-component connector, according to the aspects of the present disclosure. Fig. Figure 7 is a flowchart showing a process for manufacturing a multi-component compound arrangement according to the aspects of the present disclosure.

[0006] The repeated use of reference numerals in the present description and drawing serves to represent identical or analogous features or elements of the invention. Detailed description

[0007] It is understood that the present discussion is only a description of exemplary embodiments and is not intended as a limitation of the broader aspects of the present invention embodied by the exemplary construction.

[0008] Generally speaking, the present invention relates to a multi-component connector arrangement for mounting several components on a mounting surface within a single footprint. For example, a multi-component connector arrangement can comprise a multi-component connector with a first support element and a second support element spaced apart from the first support element, and a plurality of components can be arranged between the first support element and the second support element of the multi-component connector. The plurality of components can include at least one heat sink component, a capacitor, a resistor, a varistor, and / or an inductor.

[0009] The multi-component connector arrangement allows for the parallel connection of several components. Multiple components connected in parallel can be used to modify the value and increase the current-carrying capacity compared to a single component. For example, the inventors discovered that when using a pre-fabricated connector, such as the one described here, with defined slots and components that fit within the defined footprint, the components can be arranged or positioned within the connector to reduce heat, increase current-carrying capacity, achieve customer-specific values, and allow for variable values ​​during operation. It is also possible to combine several types of components on the same footprint, such as LC parallel (inductor-capacitor parallel), RC parallel (resistor-capacitor parallel), and so on.

[0010] In some embodiments, at least one of the plurality of components can be a heat sink component comprising a body containing a thermally conductive, electrically non-conductive material, such that the heat sink component is configured to conduct heat from a first region to a second region. The heat sink component can, for example, have at least one heat source connection and at least one heat sink connection. The heat source connections can be configured to connect to one or more corresponding electrical devices or components and conduct heat from the electrical devices or components to the heat sink component. The heat sink connections can be configured to dissipate heat from the heat sink component.For example, one or more heat sink connectors can connect the heat sink component to a heat sink to transfer heat from the one or more respective electrical devices or components to the heat sink component.

[0011] The body of the heat sink component can be made of any suitable material with a generally low thermal resistance (e.g., less than about 6.67×10⁻⁵). -3 m·°C / W) and a generally high electrical resistance (e.g. greater than about 10 14 Ω·cm). A thermal resistance of 6.67×10 -3 m·°C / W corresponds to a thermal conductivity of approximately 150 W / m·°C. In other words, suitable materials for the body of the heat sink component can have a generally high thermal conductivity, e.g., greater than approximately 150 W / m·°C.

[0012] In some embodiments, the body of the heat sink component can be made, for example, from a material with a thermal conductivity between approximately 100 W / m·°C and approximately 2200 W / m·°C at approximately 22°C. In other embodiments, the body of the heat sink component can be made from a material having a thermal conductivity between approximately 125 W / m·°C and approximately 250 W / m·°C at approximately 22°C. In other embodiments, the body of the heat sink component can be made from a material having a thermal conductivity between approximately 150 W / m·°C and approximately 200 W / m·°C at approximately 22°C. In other embodiments, the body of the heat sink component can be made from a material having a thermal conductivity between approximately 150 W / m·°C and approximately 2000 W / m·°C at approximately 22°C.In other embodiments, the body of the heat sink component can be made of a material having a thermal conductivity between approximately 250 W / m·°C and approximately 1500 W / m·°C at approximately 22°C. In other embodiments, the body of the heat sink component can be made of a material having a thermal conductivity between approximately 300 W / m·°C and approximately 1000 W / m·°C at approximately 22°C. In other embodiments, the body of the heat sink component can be made of a material having a thermal conductivity between approximately 350 W / m·°C and approximately 750 W / m·°C at approximately 22°C.

[0013] In some embodiments, the body of the heat sink component may comprise aluminum nitride, beryllium oxide, aluminum oxide, boron nitride, silicon nitride, magnesium oxide, zinc oxide, silicon carbide, any suitable ceramic material and mixtures thereof.

[0014] In some embodiments, the body of the heat sink component may comprise aluminum nitride. In some embodiments, the body of the heat sink component may, for example, be made of any suitable composition, including aluminum nitride. In some embodiments, the body of the heat sink component may be made primarily of aluminum nitride. The body of the heat sink component may, for example, contain additives or impurities. In other embodiments, the body of the heat sink component comprises beryllium oxide. In some embodiments, the body of the heat sink component may, for example, be made of any suitable composition, including beryllium oxide. In some embodiments, the body of the heat sink component may be made primarily of beryllium oxide. The body of the heat sink component may, for example, contain additives or impurities.

[0015] In some embodiments, the first support element of the multi-component connector comprises a first flange, and the second support element of the multi-component connector comprises a second flange. In other embodiments, only one of the first support elements or the second support element may have a flange; that is, the multi-component connector may have only one of the first flanges or the second flange. At least one of the first flanges or the second flange may be configured to allow the multi-component connector to be attached to a mounting surface.

[0016] In some embodiments, the multi-component connector can define a plurality of slots, each slot being configured to receive a specific component from the plurality of components, such that each component can be "slotted" into the multi-component connector. For example, the multi-component connector can have a plurality of ribs that define individual slots for receiving a component, as further described elsewhere herein. As another example, a plurality of a single component type, such as a plurality of heat sink components, can be "pre-slotted" into a multi-component connector, so that the multi-component connector, in a "standard" or "basic" configuration, contains the plurality of that same component. The plurality of components of the same type can define one or more slots into which other components can be placed or "slotted."

[0017] For example, a first heat sink component can be arranged at a first end of the multi-component connector, and a second heat sink component can be arranged at a second end of the multi-component connector, with the first end spaced from the second end along a longitudinal direction. The first and second heat sink components can be pre-slotted into the multi-component connector, with one or more spaces defined between the first and second heat sink components to accommodate at least one capacitor, resistor, varistor, or inductor (e.g.,so that at least one of a capacitor, a resistor, a varistor or an inductor is arranged in the multi-component connector between the first heat sink component and the second heat sink component).

[0018] In some embodiments, a third heat sink component can also be pre-cut into the multi-component connector. For example, the third heat sink component can be positioned approximately midway between the first and second heat sink components. At least one space or slot can be defined between the first and third heat sink components, and at least one capacitor, resistor, varistor, or inductor can be slotted or positioned within the multi-component connector between the first and third heat sink components.Similarly, at least one space or slot can be defined between the third heat sink component and the second heat sink component, and at least one capacitor, resistor, varistor or inductor can be 'slotted' or arranged in the multi-component connector between the third heat sink component and the second heat sink component.

[0019] Such "pre-slotted" embodiments are just one example. In other embodiments, different types, numbers, and / or configurations of components can be "slotted" into the multi-component connector in a "standard" or "basic" configuration. In still other embodiments, the "standard" or "basic" configuration of the multi-component connector may consist only of the first and second carrier elements, without any components inserted into them. For example, one or more components (e.g., heat sink components, capacitors, resistors, varistors, inductors, etc.) can be inserted into or added to the multi-component connector, e.g., at the point where it is attached to the mounting surface.

[0020] In some embodiments, a first retaining element extends from the first support element to the second support element, for example, at a first end of the multi-component connector, and a second retaining element extends from the first support element to the second support element at a second end of the multi-component connector. The second end may be located longitudinally opposite the first end. Instead of pre-slotted components, the first and / or second retaining elements can help define the size and / or shape of the multi-component connector, for example, by holding the first and second support elements in position relative to each other. The first and / or second retaining elements can also help to hold the components within the multi-component connector.

[0021] In some embodiments, at least one of the first or second support elements comprises a plurality of ribs defining a plurality of slots, each of which can be configured to receive a corresponding component of the plurality of components. For example, the first support element may have a plurality of ribs projecting laterally from the first support element toward the second support element. In some embodiments, in addition to or instead of ribs defined by the first support element, the second support element may have a plurality of ribs projecting laterally from the second support element toward the first support element. The ribs projecting from each support element must not reach or touch the opposite support element.

[0022] If both the first and second support elements have ribs, rib pairs can also be defined along the longitudinal direction or along the length of the multi-component connector. For example, each rib pair can comprise a first rib defined by the first support element and a second rib defined by the second support element, with the first and second ribs of each rib pair aligned transversely to each other. The first and second ribs of each rib pair can be defined at the same height along a vertical direction or at different heights along the vertical direction. Furthermore, the first support element and / or the second support element can define two or more ribs at the same longitudinal and transverse positions but at different heights, e.g.,A first pair of ribs can be defined at a first height and a second pair of ribs at a second height that differs from the first height, such that the first pair of ribs and the second pair of ribs are generally aligned along the longitudinal, transverse and vertical directions, but are spaced apart from each other along the vertical direction.

[0023] In some embodiments, at least one cross member extends from the first support element to the second support element. For example, one, two, three, or more cross members may extend from the first support element to the second support element along the lateral direction. The one or more cross members can hold the first and second support elements in position relative to each other, e.g., help define the shape and size of the multi-component connector, and / or can provide stability and / or rigidity to the multi-component connector, which can help prevent damage to the one or more components arranged in the multi-component connector (e.g., due to bending, etc.), and / or can aid in mounting the multi-component connector to a device, such as a printed circuit board (PCB) or the like.

[0024] In some embodiments, the multi-component connector includes at least one fastening element for attaching the multi-component connector to a mounting surface of a device (e.g., a mounting surface of a printed circuit board). The fastening element may be, for example, a mechanical fastener such as a screw or the like, or the multi-component connector may be attached to the mounting surface by soldering, one or more chemical bonding agents, or the like. In some embodiments, the first support element defines a first opening, and the at least one fastening element includes a first fastening element that extends through the first opening to secure the multi-component connector to the mounting surface.In further embodiments, the second support element defines a second opening, and the at least one fastening element comprises a second fastening element that extends through the second opening to fasten the multi-component connector to the mounting surface.

[0025] In some embodiments, a gap is defined between at least two adjacent components of the plurality of components. For example, the gap may have a length approximately equal to the length of one component from the plurality of components. In other embodiments, the gap may have a length less than the length of one component from the plurality of components. In further embodiments, at least one of the first or second support elements comprises a plurality of ribs defining a plurality of slots, and the gap is at least one slot of the plurality of slots.

[0026] The numerous components incorporated into the multi-component connector can include one or more thin-film components. These thin-film components can contain one or more resistors, varistors, capacitors, inductors, and / or combinations thereof, such as a thin-film filter. The thin-film components can consist of one or more layers of conductive materials, dielectric materials, resistive materials, inductive materials, or other materials precisely formed using thin-film technology.

[0027] For example, the multitude of components arranged in the multi-component connector can include a thin-film varistor. The varistor can contain barium titanate, zinc oxide, or any other suitable dielectric material. The dielectric material can, for example, contain various additives that create or improve the voltage-dependent resistance of the dielectric material. In some embodiments, the additives can include, for example, oxides of cobalt, bismuth, manganese, or a combination thereof. In some embodiments, the additives can include oxides of gallium, aluminum, antimony, chromium, titanium, lead, barium, nickel, vanadium, tin, or combinations thereof. The dielectric material can be doped with the additive(s) in the range of approximately 0.5 mol% to approximately 3 mol%, and in some embodiments, from approximately 1 mol% to approximately 2 mol%.The average grain size of the dielectric material can contribute to its nonlinear properties. In some embodiments, the average grain size can range from approximately 1 micrometer to 100 micrometers, and in others from approximately 2 micrometers to 80 micrometers.

[0028] As another example, the thin-film component(s) can comprise a thin-film resistor with one or more resistive layers. The resistive layer can, for example, contain tantalum nitride (TaN), nickel chromium (NiCr), tantalum aluminide, chromium silicon, titanium nitride, titanium tungsten, tantalum tungsten, oxides and / or nitrides of these materials, and / or any other suitable thin-film resistive material. The resistive layer can have any suitable thickness.

[0029] As another example, the thin-film component(s) can comprise a thin-film capacitor comprising one or more dielectric layers. The dielectric layer(s) can, for example, contain one or more suitable ceramic materials. Suitable materials include, for example, aluminum oxide (Al₂O₃), aluminum nitride (Al₃), beryllium oxide (BeO), aluminum oxide (Al₂O₃), boron nitride (BN), silicon (Si), silicon carbide (SiC), silicon dioxide (SiO₂), silicon nitride (Si₃N₄), gallium arsenide (GaAs), gallium nitride (GaN), zirconium dioxide (ZrO₂), mixtures thereof, oxides and / or nitrides of these materials, or any other suitable ceramic material. Further examples of ceramic materials include barium titanate (BaTiO₃), calcium titanate (CaTiO₃), zinc oxide (ZnO), ceramics containing low-fired glass, or other glass-bonded materials. Dielectric materials such as diamond and cubic boron arsenide can also be used.

[0030] The thin-film component can comprise one or more layers with thicknesses ranging from approximately 0.001 µm to approximately 1,000 µm, in some embodiments from approximately 0.01 µm to approximately 100 µm, in some embodiments from approximately 0.1 µm to approximately 50 µm, and in some embodiments from approximately 0.5 µm to approximately 20 µm. The respective material layer(s) forming the thin-film component can be applied using special techniques based on etching, photolithography, PECVD (plasma-enhanced chemical vapor deposition), or other techniques.

[0031] Fig. Figure 1 shows a perspective view of a multi-component connector assembly 100. The in Fig. The multi-component connector assembly 100 shown in Figure 1 is mounted on a mounting surface 10 of a device 20. The device 20 can be, for example, a printed circuit board (e.g., a printed circuit board or PCB), a multi-layer ceramic component, or another suitable electrical device.

[0032] The multi-component connector arrangement 100 comprises a multi-component connector 110 and a plurality of components 150 arranged therein. The multi-component connector 110 comprises a first support element 112 and a second support element 114, which is spaced apart from the first support element 112 along a lateral direction Y. As shown in Fig. As shown in Figure 1, each component of the multitude of components 150 is arranged between the first support element 112 and the second support element 114 of the multi-component connector 110.

[0033] The plurality of components 150 arranged in the multi-component connector 110 can be of the same type, or at least one component of the plurality of components 150 can differ from the other components of the plurality of components 150. With reference to Fig. 2 and Fig. 3. For example, one, some, or all of the plurality of components 150 can be a heat sink component 152, a capacitor 154 (such as a single-layer capacitor or a multi-layer capacitor), a resistor 156, a varistor 158, an inductor 160, or any other suitable component that can be mounted on a device such as the device 20. For example, a multi-component interconnection arrangement 100 can include at least one capacitor 154, at least one resistor 156, at least one varistor 158, and / or at least one inductor 160.

[0034] In some embodiments, two or more of the components 150 arranged in the multi-component connector 110 can be connected in parallel. For example, the multi-component connector 110 can contain an inductor 160 and a capacitor 154 connected in parallel (LC in parallel), and / or the multi-component connector 110 can contain a resistor 156 and a capacitor 154 connected in parallel (RC in parallel). Other combinations of components connected to each other in various ways can also be used.

[0035] One or more of the plurality of components 150 arranged in the multi-component connector 110 may be oriented vertically with respect to the mounting surface 10. For example, if at least one of the plurality of components 150 is a capacitor 154, the capacitor may comprise a plurality of electrode layers with dielectric material sandwiched between them. The capacitor 154 may be arranged vertically in the multi-component connector 110, with the electrode layers of the capacitor 154 extending along the vertical direction Z and generally perpendicular to the mounting surface 10. In other embodiments, one or more of the plurality of components 150 arranged in the multi-component connector 110 may be oriented horizontally with respect to the mounting surface 10.For example, the capacitor 154 in the multi-component connector 110 can be arranged in a horizontal orientation, with the electrode layers of the capacitor 154 generally being parallel to the mounting surface 10.

[0036] In some embodiments, a heat sink component 152 can be arranged on each side of another component type, such as a capacitor 154 and a resistor 156, as in the embodiment of Fig. 2 shown. That is, in Fig. 2 A heat sink component 152 is arranged at each of a first end 111 and a second end 113 of the multi-component connector 110, the first end 111 being spaced apart from the second end 113 along a longitudinal direction X perpendicular to the transverse direction Y. The capacitor 154 is arranged adjacent to the first heat sink element 152 located at the first end 111, and the resistor 156 is arranged adjacent to the second heat sink element 152 located at the second end 113. A third heat sink component 152 is arranged between the capacitor 154 and the resistor 156.

[0037] In at least some embodiments, the third heat sink component 152 can be arranged approximately midway between the first and second heat sink components 152, such that the three heat sink components 152 define slots for other components 150 and help to determine the size (e.g., width in the transverse direction Y and / or length in the longitudinal direction X) and shape of the multi-component connector 110. The capacitor 154, which is arranged between the first and third heat sink components 152, and the resistor 156, which is arranged between the third and second heat sink components 152, are just one example.It is self-evident that at least one capacitor 154, one resistor 156, one varistor 158, one inductor 160 and / or another component 150 may be arranged between the first heat sink component 152 and the third heat sink component 152, and at least one of the following components: a capacitor 154, a resistor 156, a varistor 158, an inductor 160 and / or another component 150 may be arranged between the third heat sink component 152 and the second heat sink component 152.

[0038] In other embodiments, other combinations of components 150 can be arranged in the multi-component connector 110. For example, a first capacitor 154 can be arranged at the first end 111, a varistor 158 can be arranged next to the first capacitor 154, and a heat sink component 152 can be arranged next to the varistor 158. Then, an inductor 160 can be arranged next to the heat sink component 152, and a second capacitor 154 can be arranged at the second end 113 of the multi-component connector 110 next to the inductor 160. Of course, other combinations of components 150 can also be used in different sequences or positions. For example, a heat sink component 152 can be arranged at each of the first and second ends, with one or more other components 150 arranged between them.

[0039] As described herein, in various embodiments of the multi-component connector arrangement 100, at least one component of the plurality of components 150 arranged in the multi-component connector 110 is a heat sink component 152, although in some embodiments the plurality of components 150 arranged in the connector 110 may not be a heat sink component 152. Each heat sink component 152 may have a body 162 (in Fig. 2 partially outlined with dashed lines) containing a thermally conductive material that is electrically non-conductive, such that each heat sink component 152 is configured to dissipate heat from a first area 164 (in Fig. 2 outlined with dashed lines) to a second area 166 (in Fig. 2 outlined with dashed lines). For example, the first area can be a heat source connection and the second area 166 a heat sink connection. The first area or heat source connection 164 can be in contact with a heat source outside the heat sink component 152, and the second area or heat sink connection 166 can be in contact with a heat sink outside the heat sink component 152. As such, a corresponding heat sink component 152 can be configured to conduct heat from a heat source (via the first area or heat source connection 164 in contact with the heat source) to a heat sink (via the second area or heat sink connection 166 in contact with the heat sink). Such heat conduction away from the heat source can help control the temperature of a component or device containing the heat source.For example, heat transfer from the heat source to the heat sink can help prevent overheating of the component or device with the heat source.

[0040] One or more heat source connections 164 can be formed over at least one surface of the heat sink component 152. For example, the heat sink component 152 can have a rectangular parallelepiped shape and comprise six surfaces, and one or more heat source connections 164 can be formed over at least one of the six surfaces. Similarly, one or more heat sink connections 166 can be formed over at least one surface of the heat sink component 152, for example, over one of the six surfaces of a heat sink component 152 having a rectangular parallelepiped shape.

[0041] The heat source connection(s) 164 can be configured to be connected to one or more corresponding electrical devices or components and to conduct heat from the electrical devices or components to the heat sink component 152. The electrical devices or components can be, for example, one or more of the other components 150 arranged in the multi-component connector 110. The heat sink connection(s) 166 can be configured to be connected to a heat sink (e.g., a device such as a printed circuit board to which the heat sink component 152 is mounted using the multi-component connector 110, such as the device 20).

[0042] For example, a heat source connection 164 can be used in Fig. The first heat sink component 152 shown in Figure 2 may be in contact with the capacitor 154 next to the first heat sink component 152, and a heat sink terminal 166 of the first heat sink component 152 may be in contact with the device 20 on which the multi-component connector 110 is mounted. As such, the first heat sink component 152 may be configured to conduct heat from the capacitor 154 to the device 20. Similarly, the second heat sink component 152 may be configured to conduct heat from the resistor 156 to the device 20 through a heat source terminal 164 of the second heat sink component 152 in contact with the resistor 156 and a heat sink terminal 166 of the second heat sink component 152 in contact with the device 20.The third heat sink component 152 can have a first heat source connection 164 in contact with the capacitor 154 and a second heat source connection 164 in contact with the resistor 156 in order to dissipate heat from the capacitor 154 and the resistor 156 through a heat sink connection 166 in contact with the device 20. Of course, the heat sink components 152 of the embodiment of . Fig. 2 other configurations to conduct heat to and / or from other electrical devices or components.

[0043] As in the Fig. As further shown in Figures 1-3, the first support element 112 comprises a first flange 116 configured to attach the multi-component connector 110 to the mounting surface 10. Similarly, the second support element 114 comprises a second flange 118 configured to attach the multi-component connector 110 to the mounting surface 10. For example, the first flange 116 and the second flange 118 contact the mounting surface 10 in a plane extending in the longitudinal direction X and the transverse direction Y. A first edge support 115 projects from the first flange 116 away from the mounting surface 10 along the vertical direction Z, and a second edge support 117 projects from the second flange 118 away from the mounting surface 10 along the vertical direction Z. The first edge support 115 and the second edge support 117 are generally perpendicular to the mounting surface 10.The first edge support 115 and the first flange 116 together form the first support element 112, and the second edge support 117 and the second flange 118 together form the second support element 114.

[0044] In some embodiments, the first edge support 115 can be in contact with a heat sink connection 166 of a heat sink component 152 arranged in the multi-component connector 110, and the first flange 116 can contact a heat sink of the device 20, and / or the second edge support 117 can be in contact with a heat sink connection 166 of a heat sink component 152 arranged in the multi-component connector 110, and the second flange 118 can contact a heat sink of the device 20.As such, heat that is conducted from a heat source connection 164 of the respective heat sink component 152 through the heat sink component 152 to the first flange 116 and / or the second flange 118 in thermal connection with the respective heat sink connection 166 (through the first and / or second edge holder 115 , 117) can be directed away from the respective heat sink component 152 and into the heat sink of the device 20, thereby dissipating heat from the heat source in contact with the respective heat source connection 164.

[0045] In some embodiments, the multi-component connector 110 can include at least one fastening element 120 ( Fig. 1, Fig. 3) for attaching the multi-component connector 110 to the mounting surface 10. For example, the first support element 112 can have an opening 122 ( Fig. 2) define, and the at least one fastening element 120 may comprise a first fastening element 120 extending through the opening 122 defined in the first support element to fasten the multi-component connector 110 to the mounting surface 10. Similarly, in some embodiments, the second support element 114 may define an opening 122, and the at least one fastening element 120 may comprise a second fastening element 120 extending through the opening 122 defined in the second support element 114 to fasten the multi-component connector 110 to the mounting surface 10.

[0046] The multi-component connector 110 can include one or more fastening elements 120 in one or both first support elements 112 and / or second support elements 114 to secure the multi-component connector 110 to the mounting surface 10 of the device 20. In other embodiments, however, the multi-component connector can also be attached to the mounting surface 10 in another way, for example by soldering, chemical bonding agents, or the like, and the opening(s) 122 and the fastening element(s) 120 can be omitted, as shown in the Fig. Shown 4-6.

[0047] If you compare the Fig. 1 and Fig. 2. The multitude of components 150 can be stacked closely together or spaced apart. For example, each of the multitude of components 150 can be inserted into or positioned in the multi-component connector 110 so that the components 150 are located close together, as in Fig. Figure 2 shows, for example, that two or more of the plurality of components 150 can touch or almost touch each other. In other embodiments, however, a space 124 can be defined between one or more pairs of adjacent components, as shown in Fig. Figure 1 shows the space 124. This space allows air to flow around the components, e.g. to cool them.

[0048] In some embodiments, the space 124 may have a width that generally corresponds to the width of a component of the plurality of components 150, but in other embodiments, the space 124 may be larger or smaller than the width of a component of the plurality of components 150. With reference to Fig. 4 For example, in some embodiments, one or both of the first support elements 112 and / or the second support element 114 may comprise ribs 126 that define a plurality of slots 128 for each component of the plurality of components 150; that is, each slot 128 of the plurality of slots 128 may be configured to accommodate a corresponding component of the plurality of components 150. Each rib 126 projects along the transverse direction Y into the space defined between the first support element 112 and the second support element 114. For example, as in Fig. As shown in Figure 4, each rib 126 defined on the first support element 112 projects along the lateral direction Y towards the second support element 114, and each rib 126 defined on the second support element 114 projects along the lateral direction Y towards the first support element 112.

[0049] If one component of the plurality of components 150 is positioned in each slot 128 of a pair of adjacent slots 128, the components 150 in the pair of adjacent slots 128 are separated by a thickness T rib The rib 126 is spaced apart from at least one of the first support elements 112 or the second support element 114, which define the adjacent slots 128. In other embodiments, one or more empty slots 128 can be arranged between the components 150, so that adjacent components 150 are separated by the thickness T. rib of one or more ribs 126 and a length L slot one or more slots 128 are spaced apart from each other in the longitudinal direction X. For example, as in Fig. Figure 4 shows the two components 150, which are arranged in the multi-component connector 110, by the length L slot of three slots 128 and the thickness T ribfour ribs spaced 126 apart.

[0050] It becomes clear that the length L slot of each slot 128 essentially equal to a length L comp Each component of the plurality of components 150 can be oriented in the longitudinal direction X, e.g., such that each component 150 fits precisely into a respective slot 128. In some embodiments, however, the length L can be slot one or more slots 128 may be slightly larger than the length of one or more of the components 150, e.g., to accommodate a component 150 with a greater length L comp to accommodate the component 150 so that it is not held tightly or firmly in a slot 128, but rather there is a certain "play" or movement of the component 150 in the slot 128.

[0051] As in Fig. As shown in Figure 4, both the first support element 112 and the second support element 114 can have a plurality of ribs 126 that define a plurality of slots 128. One rib 126 of the first support element 112 can be aligned along a lateral direction Y with one rib 126 of the second support element 114, as shown in Figure 4. Fig. 4 shown. In other embodiments, only one of the first support elements 112 or the second support element 114 may comprise ribs 126 to define the slots 128.

[0052] To Fig. 5: In some embodiments, the multi-component connector 110 may include one or more retaining elements 130. The retaining element(s) 130 may help to hold the one or more components 150 (such as the heat sink component(s) 152, capacitor(s) 154, resistor(s) 156, varistor(s) 158 and / or inductor(s) 160 as described herein) within the multi-component connector 110. For example, as in Fig. As shown in Figure 5, a first retaining element 130 can extend from the first support element 112 to the second support element 114 along the lateral direction Y at the first end 111 of the multi-component connector 110, while a second retaining element 130 can extend from the first support element 112 to the second support element 114 along the lateral direction Y at the second end 113 of the multi-component connector 110.

[0053] With reference to Fig. 6 In some embodiments, at least one transverse element 132 extends from the first support element 112 to the second support element 114. The transverse element(s) 132 can help to hold the first support element 112 in position relative to the second support element 114 and / or can provide stability or rigidity to the multi-component connector 110, e.g., to prevent damage to one or more components 150 arranged therein, which could result from bending, etc., of the device 20 and the mounting surface 10. The in Fig. Figure 6, a top view of the multi-component connector 110, shows three transverse elements 132. In particular, in Fig. 6. A first transverse element 132 extends from the first support element 112 to the second support element 114 at the first end 111, a second transverse element 132 extends from the first support element 112 to the second support element 114 at the second end 113, and a third transverse element 132 extends from the first support element 112 to the second support element 114 at a point approximately midway between (or approximately equidistant from) the first end 111 and the second end 113 along the longitudinal direction X. Of course, a different number of transverse elements 132 and / or a different spacing between or a different position of transverse elements 132 can be used, or in some embodiments, transverse elements 132 can be omitted entirely.

[0054] In embodiments comprising one or more crossbeams 132, the crossbeam(s) 132 can be positioned at the same or different locations in the vertical direction Z. For example, in the Fig. In the embodiment shown in Figure 6, with three transverse elements 132, each transverse element 132 is arranged next to the mounting surface 10, i.e., at a location of the multi-component connector 110 along the vertical direction Z that is closest to the mounting surface 10. In other embodiments, at least one of the three transverse elements 132 in the illustrated embodiment can be positioned at a different location in the vertical direction Z, e.g., at a midpoint along the vertical direction Z between a location closest to the mounting surface 10 and a location furthest from the mounting surface 10, and / or at the location along the vertical direction Z that is furthest from the mounting surface 10.

[0055] With reference to Fig. 7 The present disclosure also provides methods for forming a multi-component connector assembly, such as the multi-component connector assembly 100. For example, as in (702) in Fig. As shown in Figure 7, a method 700 for forming a multi-component connector assembly 100 can include forming a first support element 112 and, as shown in Figure 704, forming a second support element 114. As described herein, the first support element 112 and the second support element 114 together form a multi-component connector 110. It is evident that forming the first support element 112 and the second support element 114 can include forming one or more ribs 126 on a respective support element 112, 114, and / or forming one or more retaining elements 130.

[0056] Method 700 can also include, as shown in (706), spacing the second support element 114 from the first support element 112 along a lateral direction Y. As described herein, spacing the second support element 114 from the first support element 112 can include defining one or more transverse elements 132 extending from the first support element 112 to the second support element 114.

[0057] As shown in (708), method 700 can further comprise arranging at least one component 150 between the first support element 112 and the second support element 114 of the multi-component connector 110. For example, the at least one component 150 can be a heat sink component 152, such that, for example, the heat sink component 152 is "pre-slotted" in the multi-component connector 110, as described elsewhere herein. As described above, one or more components 150 (such as one or more heat sink components 152, capacitors 154, resistors 156, varistors 158, and / or inductors 160) can be pre-slotted in a multi-component connector 110, such that, for example, the multi-component connector 110 is ready for mounting on a mounting surface 10, with or without positioning or slotting other components 150 in the multi-component connector 110.As an example, three heat sink components 152 can be pre-cut into a multi-component connector 110, e.g., one heat sink component 152 at each longitudinal end 111, 113 of the connector 110 and the third heat sink component 152 approximately midway between the first and second ends 111, 113. Of course, in some embodiments, the multi-component connector 110 can be provided without any components 150 already arranged in it, and the one or more components 150 can be positioned in the connector 110 before or after the connector 110 is mounted on the mounting surface 10. Applications

[0058] The various embodiments of the multi-component connection arrangements disclosed here can have a multitude of applications.

[0059] Application examples include power processing systems and monolithic microwave integrated circuits (MMICs). For instance, the multi-component connector assembly can include at least one heat sink component to facilitate heat dissipation from the device terminals connected to the heat sink component's heat source terminals. Various suitable electrical component configurations can be connected to the heat sink component's terminals. For example, the device can include a printed circuit board (e.g., with embedded components), a power amplifier, a filter, a synthesizer, a computer component, a power supply, and / or a diode. Specific examples of power amplifiers include gallium nitride (GaN) power amplifiers, high-frequency amplifiers, and the like.Examples of diodes suitable for connection to a thermal component described here include diodes specifically designed for use in lasers.

[0060] These and other modifications and variations of the present invention can be carried out by those skilled in the art without departing from the scope of the present invention. Furthermore, it should be understood that aspects of the various embodiments can be exchanged either in whole or in part. Moreover, those skilled in the art will understand that the foregoing description is only exemplary and does not serve to limit the invention as further described in the appended claims. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] US 63 / 487,065

[0001]

Claims

[1] Multi-component connector assembly comprising: a multi-component connector that includes the following: a first support element, and a second support element that is spaced apart from the first support element; and a multitude of components arranged between the first support element and the second support element of the multi-component connector, wherein at least one of the plurality of components is a heat sink component having a body containing a thermally conductive material that is electrically non-conductive, such that the heat sink component is configured to conduct heat from a first area to a second area. [2] Multi-component connector arrangement according to claim 1, wherein the first support element has a first flange configured to attach the multi-component connector to a mounting surface. [3] Multi-component connector arrangement according to claim 2, wherein the second support element has a second flange configured to attach the multi-component connector to a mounting surface. [4] Multi-component connector arrangement according to claim 1, wherein the heat sink component comprises a heat source connection and a heat sink connection, and wherein the heat source connection is in contact with the first area and the heat sink connection is in contact with the second area. [5] Multi-component connector arrangement according to claim 1, wherein the plurality of components comprises at least one capacitor, one resistor, one varistor or one inductor. [6] Multi-component connector arrangement according to claim 1, wherein the plurality of components comprises at least two components connected in parallel. [7] Multi-component connector arrangement according to claim 1, wherein a first retaining element extends from the first support element to the second support element. [8] Multi-component connector arrangement according to claim 7, wherein the first retaining element extends from the first support element to the second support element at a first end of the multi-component connector, and wherein a second retaining element extends from the first support element to the second support element at a second end of the multi-component connector, the second end being opposite the first end along a longitudinal direction. [9] Multi-component connector arrangement according to claim 1, wherein at least one of the first support element or the second support element has a plurality of ribs defining a plurality of slots, each slot of the plurality of slots being configured to accommodate a corresponding component of the plurality of components. [10] Multi-component connector arrangement according to claim 1, wherein at least one transverse element extends from the first support element to the second support element. [11] Multi-component connector arrangement according to claim 1, wherein the multi-component connector further comprises at least one fastening element for securing the multi-component connector to a mounting surface. [12] Multi-component connector arrangement according to claim 11, wherein the first support element defines a first opening, wherein the at least one fastening element comprises a first fastening element and wherein the first fastening element extends through the first opening to fasten the multi-component connector to the mounting surface. [13] Multi-component connector arrangement according to claim 12, wherein the second support element defines a second opening, wherein the at least one fastening element comprises a second fastening element and wherein the second fastening element extends through the second opening to fasten the multi-component connector to the mounting surface. [14] Multi-component connector arrangement according to claim 1, wherein a space is defined between at least two adjacent components of the plurality of components. [15] Multi-component connector arrangement according to claim 14, wherein the gap has a length approximately equal to the length of one component of the plurality of components. [16] Multi-component connector arrangement according to claim 14, wherein the gap has a length that is smaller than the length of one component of the plurality of components. [17] Multi-component connector arrangement according to claim 14, wherein at least one of the first support element or the second support element comprises a plurality of ribs defining a plurality of slots, and wherein the space is at least one slot of the plurality of slots. [18] Multi-component connector arrangement according to claim 1, wherein the second support element is spaced apart from the first support element along a lateral direction, wherein the heat sink component is a first heat sink component, wherein the plurality of components further comprises a second heat sink component, and wherein the multi-component connector comprises a first end which is spaced apart from a second end along a longitudinal direction perpendicular to the lateral direction, wherein the first heat sink component is arranged at the first end in the multi-component connector and the second heat sink component is arranged at the second end in the multi-component connector. [19] Multi-component connector arrangement according to claim 18, wherein at least one of a capacitor, a resistor, a varistor or an inductor is arranged in the multi-component connector between the first heat sink component and the second heat sink component. [20] Multi-component connector arrangement according to claim 18, wherein the plurality of components further comprises a third heat sink component and wherein the third heat sink component is arranged approximately midway between the first heat sink component and the second heat sink component. [21] Multi-component connector arrangement according to claim 20, wherein at least one of a capacitor, a resistor, a varistor or an inductor is arranged in the multi-component connector between the first heat sink component and the third heat sink component. [22] Multi-component connector arrangement according to claim 21, wherein at least one of a capacitor, a resistor, a varistor or an inductor is arranged in the multi-component connector between the third heat sink component and the second heat sink component. [23] Multi-component connector assembly comprising: a multi-component connector that includes the following: a first support element, a second support element, which is spaced apart from the first support element, and a multitude of slots; and at least one component that is arranged between the first support element and the second support element of the multi-component connector, wherein the at least one component is arranged in a corresponding slot of the plurality of slots. [24] Multi-component connector arrangement according to claim 23, wherein at least one of the first support element or the second support element has a plurality of ribs defining the plurality of slots. [25] Multi-component connector arrangement according to claim 23, wherein the at least one component is at least a heat sink component, a capacitor, a resistor, a varistor or an inductor. [26] Method for manufacturing a multi-component connector assembly, the method comprising: form a first support element; which form a second support element; Spacing of the second support element from the first support element along a lateral direction; and Arranging at least one heat sink component between the first support element and the second support element, wherein the at least one heat sink component has a body containing a thermally conductive material that is electrically non-conductive, such that the heat sink component is configured to conduct heat from a first area to a second area.

Images