Follower circuit, integrated circuit and amplification method

Abstract

A follower circuit (1) comprises: a voltage generation circuit (60) configured to generate a plurality of discrete voltages based on an input voltage; and a power supply modulation circuit (30) configured to select a voltage from among the plurality of discrete voltages and simultaneously output the selected voltage to a power amplifier (71) and a power amplifier (72). The power amplifier (71) is connected to an antenna (3) and configured to amplify a millimeter-wave signal. The power amplifier (72) is connected to an antenna (4) distinct from the antenna (3) and is configured to amplify a millimeter-wave signal.

Description

Technical field

[0001] The present invention relates to a follower circuit, an integrated circuit and an amplification method. Background technology

[0002] In recent years, power-added efficiency (PAE) has been improved by applying an ET mode (ET = envelope tracking) to a power amplifier circuit (PA circuit). Patent document 1 discloses a digital envelope tracking (D-ET) tracker circuit. Reference list patent document

[0003] Patent Document 1: US Patent No. 8829993 Summary of the invention: Technical problem

[0004] There is a growing need for a compact follower circuit that improves power efficiency (PAE) using multiple power amplifiers (PAs) capable of amplifying millimeter wave signals.

[0005] Accordingly, the present invention provides a compact follower circuit that can improve power efficiency (PAE) by using multiple power amplifiers capable of amplifying millimeter wave signals, as well as an integrated circuit and amplification method that can contribute to the miniaturization of the follower circuit. Solution to the problem

[0006] A follower circuit according to one aspect of the present invention comprises: a first power amplifier connected to a first antenna and configured to amplify a millimeter wave signal; a second power amplifier connected to a second antenna, different from the first antenna, and configured to amplify the millimeter wave signal; a voltage generation circuit configured to generate several discrete voltages based on an input voltage; and a supply modulator configured to select one voltage from among the several discrete voltages and simultaneously output the selected voltage to the first power amplifier and the second power amplifier.

[0007] An integrated circuit according to one aspect of the present invention comprises: a first external connection terminal and a second external connection terminal; at least one switch included in a voltage generation circuit configured to generate several discrete voltages based on an input voltage; and at least one switch included in a supply modulator configured to select one voltage from among the several discrete voltages and to output the selected voltage simultaneously to the first external connection terminal and the second external connection terminal.

[0008] An amplification method according to one aspect of the present invention comprises: generating several discrete voltages based on an input voltage; selecting one voltage from among the several discrete voltages based on an envelope signal of a millimeter wave signal; simultaneously supplying the selected voltage to a first power amplifier and a second power amplifier; and the first power amplifier and the second power amplifier amplifying the millimeter wave signal using the supplied voltage and outputting the amplified signals to different antennas. Advantageous effects of the invention

[0009] According to the present invention, it is possible to improve power efficiency (PAE) by using multiple power amplifiers capable of amplifying millimeter wave signals, thereby contributing to the miniaturization of tracker circuits. Brief description of the drawings Fig. Figure 1A is a graph that shows an example of changes in a power supply voltage in an APT mode (APT = Average Power Tracking). Fig. 1B is a graph that shows an example of changes in the power supply voltage in an A-ET mode (A-ET = Analog Envelope Tracking). Fig. 1C is a graph that shows an example of changes to the power supply circuitry in a D-ET mode. Fig. Figure 2 is a circuit configuration diagram of a communication device according to embodiment 1. Fig. Figure 3 is a circuit configuration diagram of a follower circuit according to embodiment 1. Fig. Figure 4 is a top view of an RF module according to embodiment 1. Fig. Figure 5 is a cross-sectional view of the RF module according to embodiment 1. Fig. Figure 6 is a flowchart illustrating an amplification method according to embodiment 1. Fig. Figure 7A is a circuit configuration diagram of a first voltage matching circuit according to embodiment 2. Fig. Figure 7B is a circuit configuration diagram of a second voltage matching circuit according to embodiment 2. Fig. Figure 8 is a top view of an RF module according to embodiment 3. Fig. Figure 9 is a top view of the RF module according to embodiment 3. Fig. Figure 10 is a cross-sectional view of the RF module according to embodiment 3. Description of the exemplary implementations

[0010] Exemplary embodiments of the present invention are described in detail below with reference to the drawings. It should be noted that the embodiments described below are all illustrative of comprehensive or specific examples. The numerical values, shapes, materials, components, component arrangements, and connection types explained in the following exemplary embodiments are merely examples and are not intended to limit the present invention.

[0011] It is noted that each of the drawings is a schematic diagram that has been appropriately highlighted, omitted, or scaled down to illustrate the present invention. Therefore, the drawings are not necessarily exact representations and may differ from the actual shapes, positional relationships, and proportions. In all drawings, the same reference numerals are assigned to substantially identical configurations, and overlapping descriptions may be omitted or simplified.

[0012] In all the following drawings, the x-axis and y-axis are orthogonal to each other on a plane parallel to the main surface of a module substrate. Specifically, if the module substrate has a rectangular shape in plan view, the x-axis is parallel to a first side of the module substrate, and the y-axis is parallel to a second side that is orthogonal to the first side of the module substrate. Additionally, the z-axis is an axis perpendicular to the main surface of the module substrate, with a positive direction indicating an upward direction and a negative direction indicating a downward direction.

[0013] In the following description, "connected" refers not only to direct connections via terminals and / or wiring conductors, but also to cases where electrical connections are made with other circuit elements placed between them. "Directly connected" refers to direct connections via terminals and / or wiring conductors without any other circuit elements being placed between them. "C is connected between A and B" means that one end of C is connected to A and the other end of C is connected to B, meaning that C is in series in the path connecting A and B. "The path connecting A and B" refers to a path constructed from a conductor that electrically connects A and B.

[0014] "Termination" refers to the point where a conductor ends within an element. It is noted that if the impedance of a conductor between elements is sufficiently low, a termination is not only interpreted as a single point, but also as any point on the conductor between the elements, or even as the entire conductor.

[0015] "The component is arranged on or in the substrate" includes both the arrangement of the component on the main surface of the substrate and the arrangement of the component within the substrate. "The component is arranged on the main surface of the substrate" includes not only the arrangement of the component in contact with the main surface of the substrate, but also the arrangement of the component above the main surface without direct contact with it (for example, if the component is laminated or stacked on top of another component that is in contact with the main surface). Additionally, it is acceptable for "the component is arranged on the main surface of the substrate" to include the arrangement of the component in a recess formed in the main surface.“The component is located within the substrate” includes not only the encapsulation of the component within the module substrate, but also cases where the entire component is located between two main surfaces of the substrate, with a section of the component not covered by the substrate, as well as cases where only a section of the component is located within the substrate.

[0016] "B is closer to A than C" means that the distance between A and B is shorter than the distance between A and C. Here, "the distance between A and B" means the shortest distance between A and B. This means that "the distance between A and B" is the length of the shortest line segment among several line segments that connect a point on the surface of A and a point on the surface of B.

[0017] In addition, expressions indicating the relationship between elements, such as "parallel" and "vertical", terms indicating the shape of elements, such as "rectangular shape", and numerical ranges do not merely represent strict meanings, but also encompass essentially equivalent ranges that include, for example, differences of a few percent.

[0018] Before describing the exemplary implementations, this section describes tracking modes, which are techniques for efficiently amplifying RF signals. In tracking modes, a power supply voltage, dynamically adjusted over time based on an RF signal, is fed to a power amplifier. There are several types of tracking modes: here, an APT mode, an A-ET mode, and a D-ET mode, which refer to the Fig. 1A to 1C are described. In the Fig. For 1A to 1C, the horizontal axis represents time and the vertical axis represents voltage. Additionally, a thick solid line represents a power supply voltage and a thin solid line (signal waveform) represents a modulated signal.

[0019] Fig. Figure 1A is a graph that illustrates an example of changes in the power supply voltage in APT mode. In APT mode, the power supply voltage is varied to several discrete voltage levels in units of frames based on the average power.

[0020] A frame refers to a unit that forms an RF signal (modulated signal). For example, in 5GNR (5th Generation New Radio) and LTE (Long Term Evolution), a frame comprises ten subframes, each subframe contains multiple slots, and each slot consists of multiple symbols. The subframe length is 1 ms, and the frame length is 10 ms.

[0021] It is noted that a mode in which the voltage level is varied in units of one frame or more based on the average power is referred to as APT mode and is distinguished from a mode in which the voltage level is varied in units smaller than one frame (e.g., subframes, slots, or symbols).

[0022] Fig. Figure 1B is a graph that shows an example of changes in the power supply voltage in A-ET mode. In A-ET mode, the power supply voltage is continuously varied based on an envelope signal, thus tracking the envelope of a modulated signal.

[0023] Fig. Figure 1C is a graph that illustrates an example of power supply voltage changes in D-ET mode. In D-ET mode, the power supply voltage is varied to several discrete voltage levels within a single frame based on an envelope signal, thus tracking the envelope of a modulated signal. This means that with D-ET, the power supply voltage varies in shorter time intervals than with APT. (Example 1)

[0024] Exemplary embodiment 1 is described below. A communication device 5 according to the present exemplary embodiment can be used to provide wireless connectivity. For example, the communication device 5 can be implemented in user equipment (UE) in a cellular network (also called a mobile network), such as mobile phones, smartphones, tablet computers, wearable devices, and the like. In another example, by implementing the communication device 5, wireless connectivity can be provided for IoT sensor devices (IoT = Internet of Things), medical / healthcare devices, vehicles, unmanned aerial vehicles (UAVs) (so-called drones), and automated guided vehicles (AGVs).In yet another example, by implementing the communication device 5, wireless connectivity can be provided via a wireless access point or a wireless hotspot.

[0025] The communication device 5 is used to transmit millimeter wave signals. A millimeter wave signal is a signal in a frequency band within the range of 30 GHz to 300 GHz. The communication device 5 uses multiple antennas to transmit millimeter wave signals in order to achieve beamforming, beam steering, or similar effects. [1.1 Circuit configuration of the communication device 5]

[0026] The circuit configuration of the communication device 5 according to the present embodiment is described with reference to Fig. 2 described. Fig. Figure 2 is a circuit configuration diagram of the communication device 5 according to the present embodiment.

[0027] It is noted that Fig. 2 represents an exemplary circuit configuration, and the communication device 5 can be implemented using a wide variety of circuit implementations and circuit technologies. Therefore, the following description of the communication device 5 should not be interpreted restrictively.

[0028] The communication device 5 according to the present embodiment comprises a tracker circuit 1, an RFIC (Radio Frequency Integrated Circuit) 2, and antennas 3 and 4. It is noted that the communication device 5 need not include the antennas 3 and / or 4.

[0029] The follower circuit 1 can simultaneously supply power supply voltages (Vcc1 and Vcc2) to power amplifiers 71 and 72 contained in RFIC 2. The power supply voltages (Vcc1 and Vcc2) are selected from several discrete voltages based on the envelope signal of a millimeter-wave signal amplified by power amplifiers 71 and 72. The circuit configuration of the follower circuit 1 will be described later using Fig. 3 described.

[0030] RFIC 2 can amplify a millimeter wave signal (RFin), which is an input transmit signal in the millimeter wave band, and output it to antennas 3 and 4. RFIC 2 can also amplify a millimeter wave signal (RFout), which is an input receive signal in the millimeter wave band from antennas 3 and 4, and output it. The circuit configuration of RFIC 2 is described later.

[0031] Antennas 3 and 4 are examples of a first and a second antenna, respectively, which differ from each other and can transmit millimeter-wave signals fed by RFIC 2 to the outside. Additionally, antennas 3 and 4 can also feed millimeter-wave signals received from the outside to RFIC 2. It is noted that the communication device 5 may include one or more additional antennas besides antennas 3 and 4. Millimeter-wave signals carrying the same data in the same frequency band are transmitted by antennas 3 and 4. In this case, the phases and / or polarization directions of the two millimeter signals transmitted by antennas 3 and 4 may differ. [1.2 Circuit configuration of RFIC 2]

[0032] Next, the circuit configuration of the RFIC 2, which is included in the communication device 5, will be described with reference to Fig. 2 described. The RFIC 2 comprises power amplifiers 71 and 72, low-noise amplifiers 73 and 74, external interconnects 75 and 76, switching circuits 77 and 78 and phase-shift circuits 79 to 82.

[0033] The power amplifier 71 is an example of a first power amplifier and is connected to the antenna 3. Specifically, the input end of the power amplifier 71 is connected to the phase-shift circuit 79, and the output end of the power amplifier 71 is connected to the antenna 3, with the switching circuit 77 arranged between them. The power amplifier 71 is further connected to the tracker circuit 1, with the external connection terminal 75 arranged between them. The power amplifier 71 can amplify a transmitted signal in the millimeter-wave band supplied via the phase-shift circuit 79 by using the power supply voltage (Vcc1) supplied by the tracker circuit 1.

[0034] The power amplifier 72 is an example of a second power amplifier and is connected to the antenna 4. Specifically, the input end of the power amplifier 72 is connected to the phase-shifting circuit 81, and the output end of the power amplifier 72 is connected to the antenna 4, with the switching circuit 71 arranged between them. The power amplifier 72 is further connected to the follower circuit 1, with the external connection terminal 76 arranged between them. The power amplifier 72 can amplify a transmit signal in the millimeter-wave band supplied via the phase-shifting circuit 81 by using the power supply voltage (Vcc2) supplied by the follower circuit 1.

[0035] The low-noise amplifier 73 is connected to the antenna 3. Specifically, the input end of the low-noise amplifier 73 is connected to the antenna 3, with the switching circuit 77 arranged between them, and the output end of the low-noise amplifier 73 is connected to the phase-shifting circuit 80. The low-noise amplifier 73 can amplify a received signal in the millimeter-wave band received via the antenna 3. It is noted that the low-noise amplifier 73 need not be included in the RFIC 2.

[0036] The low-noise amplifier 74 is connected to the antenna 4. Specifically, the input end of the low-noise amplifier 74 is connected to the antenna 4, with the switching circuit 78 arranged between them, and the output end of the low-noise amplifier 74 is connected to the phase-shifting circuit 82. The low-noise amplifier 74 can amplify a received signal in the millimeter-wave band received via the antenna 4. It is noted that the low-noise amplifier 74 need not be included in the RFIC 2.

[0037] External connection terminals 75 and 76 are input terminals for receiving the power supply voltages (Vcc1 and Vcc2, respectively) from the follower circuit 1. External connection terminals 75 and 76 are externally connected to external connection terminals 61 and 62 of the follower circuit 1, respectively, and are internally connected to the power amplifiers 71 and 72, respectively.

[0038] The switching circuit 77 is connected between the antenna 3 and both the power amplifier 71 and the low-noise amplifier 73. The switching circuit 77 consists of an SPDT-type switch circuit (SPDT = Single-Pole Double-Throw; single-pole changeover switch) and can switch the connection of the antenna 3 between the power amplifier 71 and the low-noise amplifier 73.

[0039] The switching circuit 78 is connected between the antenna 4 and both the power amplifier 72 and the low-noise amplifier 74. The switching circuit 78 is configured with an SPDT-type switch circuit and can switch the connection of the antenna 4 between the power amplifier 72 and the low-noise amplifier 74.

[0040] Phase-shift circuits 79 and 81 are connected to the inputs of power amplifiers 71 and 72, respectively, and can adjust the phase of the millimeter-wave signal (RFin). Phase-shift circuits 80 and 82 are connected to the outputs of low-noise amplifiers 73 and 74, respectively, and can adjust the phase of the millimeter-wave signal (RFout). It should be noted that phase-shift circuits 79 to 82 need not be included in RFIC 2. [1.3 Circuit configuration of the follower circuit 1]

[0041] Next, the circuit configuration of the tracker circuit 1, which is contained in the communication device 5, will be described with reference to Fig. 3 described. Fig. Figure 3 is a circuit configuration diagram of the follower circuit 1 according to the present embodiment.

[0042] It is noted that Fig. Figure 3 represents an exemplary circuit configuration, and the follower circuit 1 can be implemented using a wide variety of circuit implementations and circuit technologies. Therefore, the following description of follower circuit 1 should not be interpreted restrictively.

[0043] The follower circuit 1 comprises a voltage generation circuit 60, which includes a pre-regulator circuit 10 and a switched capacitor circuit 20, a supply modulator 30, voltage matching circuits 41 and 42, a digital control circuit 50, and external connection terminals 61 and 62. It is noted that the follower circuit 1 need not include the pre-regulator circuit 10.

[0044] The pre-regulator circuit 10 can also be referred to as a magnetic regulator or DC / DC converter. In the present embodiment, the pre-regulator circuit 10 is a step-up / step-down converter with one input and one output, which can convert an input voltage (Vbat) into an output voltage (adjusted voltage). The pre-regulator circuit 10 can adjust the output voltage based, for example, on a digital control signal from the RFIC 2. The adjusted voltage is supplied to the switching capacitor circuit 20. It should be noted that the pre-regulator circuit 10 can also be a step-down converter or a step-up converter.

[0045] The switching capacitor circuit 20 can generate several discrete voltages based on the adapted voltage supplied by the pre-regulator circuit 10. The generated discrete voltages are fed to the supply modulator 30.

[0046] The voltage generation circuit 60 comprises the pre-regulator circuit 10 and the switching capacitor circuit 20 and can generate several discrete voltages based on the input voltage (Vbat). It is noted that the voltage generation circuit 60 can have any circuit configuration and is not limited to the circuit configuration shown. Fig. 3 is restricted as long as it can generate multiple discrete voltages based on the input voltage (Vbat). For example, the voltage generation circuit 60 can include multiple pre-regulator circuits 10 and does not need to include the switching capacitor circuit 20.

[0047] The supply modulator 30 can selectively output at least one of the several discrete voltages generated by the switching capacitor circuit 20 to the power amplifiers 71 and 72 simultaneously. This means that the supply modulator 30 can select at least one voltage from among the several discrete voltages and supply the selected voltage to the power amplifiers 71 and 72 simultaneously.

[0048] The voltage matching circuit 41 is connected between the power supply modulator 30 and the external connection terminal 61. The voltage matching circuit 41 can adjust the level of the power supply voltage (Vcc1) supplied to the power amplifier 71. It should be noted that the voltage matching circuit 41 need not be included in the follower circuit 1.

[0049] The voltage matching circuit 42 is connected between the power supply modulator 30 and the external connection terminal 62. The voltage matching circuit 42 can adjust the level of the power supply voltage (Vcc2) supplied to the power amplifier 72. It should be noted that the voltage matching circuit 42 need not be included in the follower circuit 1.

[0050] The external connection terminal 61 is an example of a first external connection terminal and is an output terminal for supplying the power supply voltage (Vcc1) to the power amplifier 71. The external connection terminal 61 is externally connected to the external connection terminal 75 of the RFIC 2 and is internally connected to the supply modulator 30, with the voltage matching circuit 41 arranged between them.

[0051] The external connection terminal 62 is an example of a second external connection terminal and is an output terminal for supplying the power supply voltage (Vcc2) to the power amplifier 72. The external connection terminal 62 is externally connected to the external connection terminal 76 of the RFIC 2 and is internally connected to the supply modulator 30, with the voltage matching circuit 42 arranged between them.

[0052] The digital control circuit 50 can control the pre-regulator circuit 10, the switching capacitor circuit 20, the supply modulator 30, and the voltage matching circuits 41 and 42 based on digital control signals from the RFIC 2. It is noted that the digital control circuit 50 does not need to be included in the follower circuit 1.

[0053] It should be noted that the circuit configuration of the follower circuit 1 is exemplary and not limited to it. For example, the follower circuit 1 may include a pulse shaping network (PSN) connected between the supply modulator 30 and the external connection terminals 61 and / or 62. [1.3.1 Circuit configuration of the pre-regulator circuit 10]

[0054] Next, the detailed circuit configuration of the pre-regulator circuit 10, which is contained in the follower circuit 1, will be described with reference to Fig. 3 described. The pre-regulator circuit 1 comprises an input terminal T11, an output terminal T12, switches S11 to S14, a power inductor L11 and a capacitor C11.

[0055] Input terminal T11 is for receiving the input voltage (Vbat). Externally, input terminal T11 is connected to, for example, a direct current (DC) power source, and internally it is connected to switch S11.

[0056] Output terminal T12 is a connection for supplying an adapted voltage to the switching capacitor circuit 20. Output terminal T12 is externally connected to input terminal T20 of the switching capacitor circuit 20 and is internally connected to switch S13.

[0057] The power inductor L11 is used to increase and decrease the input voltage (Vbat). One end of the power inductor L11 is connected to switches S11 and S12, and the other end of the power inductor L11 is connected to switches S13 and S14.

[0058] Switch S11 is connected between input terminal T11 and one end of power inductor L11. In this connection configuration, switch S11 toggles between on and off, thus enabling the connection and disconnection of input terminal T11 and one end of power inductor L11.

[0059] Switch S12 is connected between one end of power inductor L11 and ground. In this connection configuration, switch S12 toggles between on and off, thus enabling the connection and disconnection of one end of power inductor L11 from ground.

[0060] Switch S13 is connected between the other end of power inductor L11 and output terminal T12. In this connection configuration, switch S13 toggles between on and off, thus enabling the connection and disconnection of the other end of power inductor L11 and output terminal T12.

[0061] Switch S14 is connected between the other end of power inductor L11 and ground. In this connection configuration, switch S14 toggles between on and off, thus allowing the other end of power inductor L11 to be connected and disconnected from ground.

[0062] Capacitor C11 is connected between switch S13 and output terminal T12, and ground. Specifically, one of the two electrodes of capacitor C11 is connected to switch S13 and output terminal T12, and the other electrode of capacitor C11 is connected to ground.

[0063] It is noted that the configuration of the pre-regulator circuit 10, which is in Fig. Figure 3 is merely an example and the configuration is not limited to it. For example, some of the switches S11 to S14 can be replaced by diodes. Furthermore, not all or part of the pre-regulator circuit 10 needs to be included in the follower circuit 1. [1.3.2 Circuit configuration of the switching capacitor circuit 20]

[0064] Next, the detailed circuit configuration of the switching capacitor circuit 20, which is included in the follower circuit 1, will be described with reference to Fig. 3 described.

[0065] The switching capacitor circuit 20 has a ladder-type circuit configuration and can generate several discrete voltages (V1 to V4). Specifically, the switching capacitor circuit 20 includes capacitors C20 to C29, switches S20 to S2F, input terminal T20, and output terminals T21 to T24. Energy and charge are input from the pre-regulator circuit 10 to node N3 via input terminal T20 and extracted from nodes N1 to N4 to the supply modulator 30 via output terminals T21 to T24.

[0066] Input terminal T20 is for receiving a matched voltage from the pre-regulator circuit 10. Input terminal T20 is externally connected to the pre-regulator circuit 10 and internally connected to node N3. It should be noted that the node to which input terminal T20 is connected is not limited to node N3. Input terminal T20 can be connected to any of nodes N1 through N4.

[0067] Output terminal T21 is a connection for supplying the voltage (V1) among the several discrete voltages (V1 to V4) to the supply modulator 30. Output terminal T21 is externally connected to the supply modulator 30 and internally connected to node N1.

[0068] Output terminal T22 is a connection for supplying the voltage (V2) to the supply modulator 30, one of several discrete voltages (V1 to V4). Output terminal T22 is externally connected to the supply modulator 30 and internally connected to node N2.

[0069] Output terminal T23 is a connection for supplying the voltage (V3) to the supply modulator 30, one of several discrete voltages (V1 to V4). Output terminal T23 is externally connected to the supply modulator 30 and internally connected to node N3.

[0070] Output terminal T24 is a connection for supplying the voltage (V4) to the supply modulator 30, one of several discrete voltages (V1 to V4). Output terminal T24 is externally connected to the supply modulator 30 and internally connected to node N4.

[0071] Capacitors C20 to C25 are flying capacitors (sometimes called transfer capacitors) and are used to increase and decrease the adjusted voltage (V3) supplied by the pre-regulator circuit 10. Specifically, capacitors C20 to C25 transfer charge between themselves, nodes N1 to N4, and ground, such that the voltages V1 to V4, satisfying the following equations: (V4 - V3) : (V3 - V2) : (V2 - V1) : (V1 - VG) = 1 : 1 : 1 : 1 and V4 > V3 > V2 > V1 > VG, are maintained at the four nodes N1 to N4, where VG represents ground potential.

[0072] One of the two electrodes of capacitor C20 is connected to one end of switch S20 and one end of switch S21. The other of the two electrodes of capacitor C20 is connected to one end of switch S24 and one end of switch S25.

[0073] One of the two electrodes of capacitor C21 is connected to one end of switch S22 and one end of switch S23. The other of the two electrodes of capacitor C21 is connected to one end of switch S26 and one end of switch S27.

[0074] One of the two electrodes of capacitor C22 is connected to one end of switch S24 and one end of switch S25. The other of the two electrodes of capacitor C22 is connected to one end of switch S28 and one end of switch S29.

[0075] One of the two electrodes of capacitor C23 is connected to one end of switch S26 and one end of switch S27. The other of the two electrodes of capacitor C23 is connected to one end of switch S2A and one end of switch S2B.

[0076] One of the two electrodes of capacitor C24 is connected to one end of switch S28 and one end of switch S29. The other of the two electrodes of capacitor C24 is connected to one end of switch S2C and one end of switch S2D.

[0077] One of the two electrodes of capacitor C25 is connected to one end of switch S2A and one end of switch S2B. The other of the two electrodes of capacitor C25 is connected to one end of switch S2E and one end of switch S2F.

[0078] Capacitors C26 to C29 are smoothing capacitors and are used to maintain and smooth the voltages (V1 to V4) at nodes N1 to N4.

[0079] Capacitor C26 is connected between node N1 and ground. Specifically, one of the two electrodes of capacitor C26 is connected to node N1. Meanwhile, the other electrode of capacitor C26 is connected to ground.

[0080] Capacitor C27 is connected between nodes N1 and N2. Specifically, one of the two electrodes of capacitor C27 is connected to node N2. Meanwhile, the other of the two electrodes of capacitor C27 is connected to node N1.

[0081] Capacitor C28 is connected between nodes N2 and N3. Specifically, one of the two electrodes of capacitor C28 is connected to node N3. Meanwhile, the other of the two electrodes of capacitor C28 is connected to node N2.

[0082] Capacitor C29 is connected between nodes N3 and N4. Specifically, one of the two electrodes of capacitor C29 is connected to node N4. Meanwhile, the other of the two electrodes of capacitor C29 is connected to node N3.

[0083] Switch S20 is connected between capacitor C20 and ground. Specifically, one end of switch S20 is connected to one of the two electrodes of capacitor C20. Meanwhile, the other end of switch S20 is connected to ground.

[0084] Switch S21 is connected between capacitor C20 and node N1. Specifically, one end of switch S21 is connected to one of the two electrodes of capacitor C20. Meanwhile, the other end of switch S21 is connected to node N1.

[0085] Switch S22 is connected between capacitor C21 and ground. Specifically, one end of switch S22 is connected to one of the two electrodes of capacitor C21. Meanwhile, the other end of switch S22 is connected to ground.

[0086] Switch S23 is connected between capacitor C21 and node N1. Specifically, one end of switch S23 is connected to one of the two electrodes of capacitor C21. Meanwhile, the other end of switch S23 is connected to node N1.

[0087] Switch S24 is connected between capacitors C20 and C22 and node N1. Specifically, one end of switch S24 is connected to the other of the two electrodes of capacitor C20 and to one of the two electrodes of capacitor C22. Meanwhile, the other end of switch S24 is connected to node N1.

[0088] Switch S25 is connected between capacitors C20 and C22 and node N2. Specifically, one end of switch S25 is connected to the other of the two electrodes of capacitor C20 and to one of the two electrodes of capacitor C22. Meanwhile, the other end of switch S25 is connected to node N2.

[0089] Switch S26 is connected between capacitors C21 and C23 and node N1. Specifically, one end of switch S26 is connected to the other of the two electrodes of capacitor C21 and to one of the two electrodes of capacitor C23. Meanwhile, the other end of switch S26 is connected to node N1.

[0090] Switch S27 is connected between capacitors C21 and C23 and node N2. Specifically, one end of switch S27 is connected to the other of the two electrodes of capacitor C21 and to one of the two electrodes of capacitor C23. Meanwhile, the other end of switch S27 is connected to node N2.

[0091] Switch S28 is connected between capacitors C22 and C24 and node N2. Specifically, one end of switch S28 is connected to the other of the two electrodes of capacitor C22 and to one of the two electrodes of capacitor C24. Meanwhile, the other end of switch S28 is connected to node N2.

[0092] Switch S29 is connected between capacitors C22 and C24 and node N3. Specifically, one end of switch S29 is connected to the other of the two electrodes of capacitor C22 and to one of the two electrodes of capacitor C24. Meanwhile, the other end of switch S29 is connected to node N3.

[0093] Switch S2A is connected between capacitors C23 and C25 and node N2. Specifically, one end of switch S2A is connected to the other of the two electrodes of capacitor C23 and to one of the two electrodes of capacitor C25. Meanwhile, the other end of switch S2A is connected to node N2.

[0094] Switch S2B is connected between capacitors C23 and C25 and node N3. Specifically, one end of switch S2B is connected to the other of the two electrodes of capacitor C23 and to one of the two electrodes of capacitor C25. Meanwhile, the other end of switch S2B is connected to node N3.

[0095] Switch S2C is connected between capacitor C24 and node N3. Specifically, one end of switch S2C is connected to the other of the two electrodes of capacitor C24. Meanwhile, the other end of switch S2C is connected to node N3.

[0096] Switch S2D is connected between capacitor C24 and node N4. Specifically, one end of switch S2D is connected to the other of the two electrodes of capacitor C24. Meanwhile, the other end of switch S2D is connected to node N4.

[0097] Switch S2E is connected between capacitor C25 and node N3. Specifically, one end of switch S2E is connected to the other of the two electrodes of capacitor C25. Meanwhile, the other end of switch S2E is connected to node N3.

[0098] Switch S2F is connected between capacitor C25 and node N4. Specifically, one end of switch S2F is connected to the other of the two electrodes of capacitor C25. Meanwhile, the other end of switch S2F is connected to node N4.

[0099] A first set of switches, with switches S20, S23, S24, S27, S28, S2B, S2C and S2F, and a second set of switches with switches S21, S22, S25, S26, S29, S2A, S2C and S2E, are alternately switched on and off based on a control signal CS20 from the digital control circuit 50.

[0100] Specifically, in a first phase, the first set of switches is turned on and the second set of switches is turned off. Accordingly, one of the two electrodes of capacitor C20 is connected to ground. The other of the two electrodes of capacitor C20, one of the two electrodes of capacitor C21, and one of the two electrodes of capacitor C22 are connected to node N1. The other of the two electrodes of capacitor C21, the other of the two electrodes of capacitor C22, one of the two electrodes of capacitor C23, and one of the two electrodes of capacitor C24 are connected to node N2. The other of the two electrodes of capacitor C23, the other of the two electrodes of capacitor C24, and one of the two electrodes of capacitor C25 are connected to node N3. The other of the two electrodes of capacitor C25 is connected to node N4.

[0101] In contrast, in a second phase, the first set of switches is switched off and the second set of switches is switched on. Accordingly, one of the two electrodes of capacitor C21 is connected to ground. One of the two electrodes of capacitor C20, the other of the two electrodes of capacitor C21, and one of the two electrodes of capacitor C23 are connected to node N1. The other of the two electrodes of capacitor C20, one of the two electrodes of capacitor C22, the other of the two electrodes of capacitor C23, and one of the two electrodes of capacitor C25 are connected to node N2. The other of the two electrodes of capacitor C22, one of the two electrodes of capacitor C24, and the other of the two electrodes of capacitor C25 are connected to node N3. The other of the two electrodes of capacitor C24 is connected to node N4.

[0102] By repeating the first and second phases as described above, capacitors C20 to C25 can undergo complementary charging and discharging. For example, in one of the first and second phases, capacitors C20, C22, and C24 are charged to capacitors C26 to C29, and in the other of the first and second phases, capacitors C21, C23, and C25 are charged to capacitors C26 to C29. This means that capacitors C26 to C29 are always being charged by one of capacitors C20 to C25; therefore, even if a high-speed current flows from one of nodes N1 to N4 to the supply modulator 30, one of nodes N1 to N4 is replenished with a high-speed charge, thus suppressing potential variations at nodes N1 to N4.

[0103] By operating in this manner, the switching capacitor circuit 20 can maintain approximately equal voltages at both ends of each of the capacitors C26 to C29. In particular, at the four nodes N1 to N4, labeled V1 to V4, the voltages V1 to V4 are maintained that satisfy the following: (V4 - V3) : (V3 - V2) : (V2 - V1) : (V1 - VG) = 1 : 1 : 1 : 1. For example, if the matched voltage supplied by the pre-regulator circuit 10 is 3 V, the switching capacitor circuit 20 can generate (1 V, 2 V, 3 V, and 4 V) as the several discrete voltages (V1 to V4).

[0104] It is noted that (V4 - V3) : (V3 - V2) : (V2 - V1) : (V1 - VG) is not limited to 1 : 1 : 1 : 1, and can be designed for any ratio (e.g. 1 : 2 : 3 : 4 or 4 : 3 : 2 : 1). [1.3.3 Circuit configuration of the supply modulator 30]

[0105] Next, the detailed circuit configuration of the supply modulator 30, which is included in the follower circuit 1, will be described with reference to Fig. 3 described. The supply modulator 30 includes input terminals T31 to T34, switches S31 to S34 and an output terminal T35.

[0106] Input terminals T31 to T34 are for receiving the several discrete voltages (V1 to V4) generated by the switching capacitor circuit 20. Externally, input terminals T31 to T34 are connected to the respective output terminals T21 to T24 of the switching capacitor circuit 20, and internally they are connected to the respective switches S31 to S34.

[0107] Output terminal T35 is for outputting a voltage selected from several discrete voltages (V1 to V4). Externally, output terminal T35 is connected to voltage matching circuits 41 and 42, and internally to switches S31 to S34.

[0108] Switch S31 is connected between input terminal T31 and output terminal T35. In this connection configuration, switch S31 is switched between on and off by a control signal CS30 from the digital control circuit 50, thus enabling the connection and disconnection of input terminal T31 and output terminal T35.

[0109] Switch S32 is connected between input terminal T32 and output terminal T35. In this connection configuration, switch S32 is toggled between on and off by the control signal CS30 from the digital control circuit 50, thus enabling the connection and disconnection of input terminal T32 and output terminal T35.

[0110] Switch S33 is connected between input terminal T33 and output terminal T35. In this connection configuration, switch S33 is toggled between on and off by the control signal CS30 from the digital control circuit 50, thus enabling the connection and disconnection of input terminal T33 and output terminal T35.

[0111] Switch S34 is connected between input terminal T34 and output terminal T35. In this connection configuration, switch S34 is toggled between on and off by the control signal CS30 from the digital control circuit 50, thus enabling the connection and disconnection of input terminal T34 and output terminal T35.

[0112] In the present embodiment, switches S31 to S34 are controlled to be exclusively on. This means that only one of the switches S31 to S34 is closed, while all the remaining switches S31 to S34 are controlled to be open. This allows the supply modulator 30 to output a voltage selected from among the several discrete voltages (V1 to V4) to the external connection terminals 61 and 62 via the voltage matching circuits 41 and 42.

[0113] It is noted that the configuration of the supply modulator 30, which is in Fig. Figure 3 is merely an example and the configuration is not limited to it. In particular, switches S31 to S34 can have any configuration and be controlled in any way, as long as they can selectively connect at least one of the four input terminals T31 to T34 to the output terminal T35. For example, two of switches S31 to S34 can be closed, while the remaining switches S31 to S34 can be open. [1.3.4 Circuit configuration of the voltage matching circuits 41 and 42]

[0114] Next, the circuit configuration of the voltage matching circuits 41 and 42 will be described with reference to Fig. 3 described. The voltage matching circuits 41 and 42 each comprise variable resistors R41 and R42.

[0115] Variable resistor R41 is an example of a first variable resistor and is connected between the output terminal T35 of the power supply modulator 30 and the external connection terminal 61. Variable resistor R42 is an example of a second variable resistor and is connected between the output terminal T35 of the power supply modulator 30 and the external connection terminal 62. Variable resistors R41 and R42 can adjust the output voltage of the power supply modulator 30 such that the level difference between the power supply voltages Vcc1 and Vcc2, supplied to RFIC 2 by the external connection terminals 61 and 62, is reduced according to control signals CS41 and CS42. Such an adjustment of the output voltages is performed, for example, during calibration. Alternatively, the output voltages can be adjusted dynamically in units of frames.

[0116] It is noted that the voltage matching circuits 41 and 42 are optional components and one or both of the voltage matching circuits 41 and 42 need not be included in the follower circuit 1. [1.3.5 Circuit configuration of the digital control circuit 50]

[0117] Next, the circuit configuration of the digital control circuit 50, which is contained in the follower circuit 1, will be described with reference to Fig. 3 described. The digital control circuit 50 comprises a first control 51 and a second control 52.

[0118] The first controller 51 can process a digital control signal based on a serial data transmission standard, supplied by the RFIC 2, to generate control signals CS10, CS20, CS41, and CS42 for controlling the pre-regulator circuit 10, the switching capacitor circuit 20, and the voltage matching circuits 41 and 42. In the present embodiment, source-synchronous digital control signals (a clock signal (CLK) and a data signal (DATA)) are used as digital control signals based on the serial data transmission standard. It is noted that clock-embedded digital control signals could also be used as digital control signals based on the serial data transmission standard.

[0119] The second controller 52 can process a digital control signal based on a parallel data transmission standard, supplied by the RFIC 2, in D-ET mode to generate the control signal CS30 for controlling the supply modulator 30. In the present embodiment, signals (DCL1 and DCL2) with digital control levels (DCL) are used as digital control signals based on the parallel data transmission standard.

[0120] Each of the DCL signals (DCL1 and DCL2) is a bit signal generated based on the envelope signal of the millimeter-wave signal (RFin), which is amplified by RFIC 2. Each of the multiple discrete voltages (V1 to V4) is represented by a combination of two bit signals. For example, the multiple discrete voltages (V1 to V4) are represented as "00", "01", "10", and "11", respectively. It is noted that a Gray code can be used to represent the voltage levels. [1.4 Implementation example of the follower circuit 1 and RFIC 2]

[0121] Next, an RF module 100 will be described as an implementation example of the tracker circuit 1 and the RFIC 2, with reference to the Fig. 4 and Fig. 5 described. Fig. Figure 4 is a top view of the RF module 100 according to the present embodiment. Fig. Figure 5 is a cross-sectional view of the RF module 100 according to the present embodiment. The cross-sectional view of the RF module 100 in Fig. 5 is carried out along a line vv in Fig. 4.

[0122] It is noted that in Fig. 4 a resin component 94, which covers several components on a main surface 90a of a module substrate 90, is omitted. In Fig. 4. The components on the module substrate 90 are labeled with reference symbols (e.g., "C20") so that the positional relationship between the components is readily apparent. Additionally, functional regions, represented by dashed lines in the RFIC 2 and an integrated circuit 91, are labeled with their functions (e.g., "SC switch section"). However, such labels do not need to be present on the actual components. Furthermore, the hatched components are optional and not essential for this embodiment.

[0123] The RF module 100 comprises the module substrate 90, on which the tracker circuit 1 and the RFIC 2 are mounted. Fig. The module substrate 90, as shown in Figure 2, is implemented. The module substrate 90 has main surfaces 90a and 90b facing each other. Through-hole conductors, wiring, and ground planes are formed within the module substrate 90 and on the main surface 90a. Fig. 4 and Fig. Figure 5 shows only wiring 92 between external connection port 61 and external connection port 75 and wiring 93 between external connection port 62 and external connection port 76.

[0124] For example, the module substrate 90 can be an LTCC substrate (LTCC = Low Temperature Co-Fired Ceramic; ceramic fired together at low temperature) or an HTCC substrate (HTCC = High Temperature Co-Fired Ceramic = ceramic fired together at high temperature) with a laminated structure of several dielectric layers, a component-embedded circuit board, a substrate with a redistribution layer (RDL = Redistribution Layer), or a printed circuit board; however, the module substrate 90 is not limited to these substrates.

[0125] The RFIC 2, the integrated circuit 91, the power inductor L11 and the capacitor C11, which are contained in the pre-regulator circuit 10, and the capacitors C20 to C29, which are contained in the switching capacitor circuit 20, are arranged on the main surface 90a of the module substrate 90. It is noted that the power inductor L11 may be arranged outside the module substrate 90.

[0126] The RFIC 2 comprises the power amplifiers 71 and 72, the low-noise amplifiers 73 and 74, several external interconnects including external interconnects 75 and 76, the switching circuits 77 and 78, and the phase-shifting circuits 79 to 82. Fig. Figure 4 shows only the sections where the power amplifiers 71 and 72 are implemented, as well as the external connection terminals 75 and 76, while other circuits and the like are omitted.

[0127] The sections where the power amplifiers 71 and 72 are implemented are arranged in the vicinity of the integrated circuit 91. In particular, the sections where the power amplifiers 71 and 72 are implemented are arranged along the side surface of the RFIC 2 facing the integrated circuit 91.

[0128] The multiple external connection terminals of the RFIC 2 consist, for example, of copper electrodes or solder electrodes and are electrically connected to input / output terminals and / or ground terminals, for example, on the main surface 90a of the module substrate 90. It is noted that in Fig. 4 the multiple external connection ports of the RFIC 2 are omitted, with the exception of external connection ports 75 and 76.

[0129] The external connection terminal 75 is electrically connected to the external connection terminal 61 of the integrated circuit 91, with the wiring 92 of the module substrate 90 located between them. Here, the external connection terminal 75 is closer to the external connection terminal 61 of the integrated circuit 91 than the external connection terminal 76. Preferably, the external connection terminal 75 is located closer to the external connection terminal 61 of the integrated circuit 91 among the multiple external connection terminals of the RFIC 2. This can shorten the wiring length of the wiring 92.

[0130] The external connection terminal 76 is electrically connected to the external connection terminal 62 of the integrated circuit 91, with the wiring 93 of the module substrate 90 located between them. Here, the external connection terminal 76 is closer to the external connection terminal 62 of the integrated circuit 91 than the external connection terminal 75. Preferably, the external connection terminal 76 is closest to the external connection terminal 62 of the integrated circuit 91 among the multiple external connection terminals of the RFIC 2. This can shorten the wiring length of the wiring 93.

[0131] The integrated circuit 91 comprises a PR switch section 91a, an SC switch section 91b, an SM switch section 91c, a voltage matching section 91d, and several external connection terminals, including external connection terminals 61 and 62. The PR switch section 91a comprises switches S11 to S14. The SC switch section 91b comprises switches S20 to S2F. The SM switch section 91c comprises switches S31 to S34. The voltage matching section 91d comprises variable resistors R41 and R42. The integrated circuit 91 may also include the digital control circuit 50.

[0132] The multiple external connection terminals of the integrated circuit 91 consist, for example, of copper electrodes or solder electrodes and are electrically connected to input / output terminals and / or ground terminals, for example, on the main surface 90a of the module substrate 90. It is noted that in Fig. 4 the several external connection terminals of the integrated circuit 91 are omitted, with the exception of the external connection terminals 61 and 62.

[0133] The external connection terminal 61 is electrically connected to the external connection terminal 75 of the RFIC 2, with the wiring 92 of the module substrate 90 arranged between them. Here, the external connection terminal 61 is closer to the external connection terminal 75 of the RFIC 2 than the external connection terminal 62. Preferably, the external connection terminal 61 is closest to the external connection terminal 75 of the RFIC 2 among the multiple external connection terminals of the integrated circuit 91. This can shorten the wiring length of the wiring 92.

[0134] The external connection terminal 62 is electrically connected to the external connection terminal 76 of the RFIC 2, with the wiring 93 of the module substrate 90 arranged between them. Here, the external connection terminal 62 is closer to the external connection terminal 76 of the RFIC 2 than the external connection terminal 61. Preferably, the external connection terminal 62 is closest to the external connection terminal 76 of the RFIC 2 among the multiple external connection terminals of the integrated circuit 91. This can shorten the wiring length of the wiring 93.

[0135] It is noted that in Fig. 4. The PR switch section 91a, the SC switch section 91b, the SM switch section 91c, and the voltage matching section 91d are included in the single integrated circuit 91, but the configuration is not restricted thereto. For example, the PR switch section 91a, the SC switch section 91b, the SM switch section 91c, and the voltage matching section 91d may be contained individually in separate integrated circuits. Alternatively, for example, the PR switch section 91a and the SC switch section 91b may be contained in a single integrated circuit, while the SM switch section 91c and the voltage matching section 91d may be contained in another integrated circuit. It is noted that the integrated circuits may be manufactured using different process technology nodes.

[0136] The integrated circuit 91 can, for example, be configured using CMOS (Complementary Metal Oxide Semiconductor) and can, in particular, be manufactured by an SOI process (Silicon on Insulator). It should be noted that the integrated circuit 91 is not limited to CMOS.

[0137] Each of the capacitors C20 to C29 is implemented as a chip capacitor. A chip capacitor refers to a surface mount device (SMD) that forms a capacitor. It should be noted that the implementation of multiple capacitors is not limited to chip capacitors. For example, some or all of the multiple capacitors may be contained within an integrated passive device (IPD) or may be included in the integrated circuit 91.

[0138] The wiring 92 electrically connects the external connection terminal 61 of the tracker circuit 1 and the external connection terminal 75 of the RFIC 2, which are formed on the integrated circuit 91. The wiring 92 consists of a wiring structure arranged on the main surface 90a of the module substrate 90, and / or a through-hole conductor and a wiring structure arranged within the module substrate 90.

[0139] The wiring 93 electrically connects the external connection terminal 62 of the tracker circuit 1 and the external connection terminal 76 of the RFIC 2, which are formed on the integrated circuit 91. The wiring 93 consists of a wiring structure arranged on the main surface 90a of the module substrate 90, and / or a through-hole conductor and a wiring structure arranged within the module substrate 90.

[0140] The resin component 94 covers the components located on the main surface 90a of the module substrate 90. The resin component 94 consists, for example, of an epoxy resin and serves to ensure the reliability of several electronic components on the main surface 90a, such as mechanical strength and moisture resistance. It is noted that the resin component 94 does not need to be included in the RF module 100.

[0141] Several external connection terminals 95 are arranged on the main surface 90b of the module substrate 90. The several external connection terminals 95 are electrically connected to input / output terminals and / or ground terminals, for example on a main board (not shown) arranged in the negative z-axis direction of the RF module 100. In addition, the several external connection terminals 95 are electrically connected to several components arranged on the main surface 90a, with through-hole conductors, formed, for example, within the module substrate 90, arranged between them.

[0142] Copper electrodes can be used as multiple external connection terminals 95, but they are not limited to this. For example, solder electrodes can be used as multiple external connection terminals 95.

[0143] It is noted that this is in the Fig. 4 and Fig. The RF module 100 shown in Figure 5 is merely an example and is not limited to this. For instance, the surface of the resin component 94 can be covered with a shielding electrode layer, formed, for example, by atomization. By connecting the shielding electrode layer to ground, it is possible to suppress external noise from entering the components within the RF module 100, as well as to suppress noise generated by the RF module 100 from interfering with other modules or other components. [1.5 Amplification methods]

[0144] Next, a reinforcement method according to the present embodiment will be described with reference to Fig. 6 described. Fig. Figure 6 is a flowchart illustrating the amplification process according to the present embodiment.

[0145] First, the voltage generation circuit 60 generates several discrete voltages (V1 to V4) based on the input voltage (Vbat) (S101). The supply modulator 30 selects one voltage from among the several discrete voltages (V1 to V4) based on the envelope signal of a millimeter-wave signal (S102). The follower circuit 1 simultaneously feeds the voltage selected by the supply modulator 30 to the power amplifiers 71 and 72 (S103). The power amplifiers 71 and 72 each amplify the millimeter-wave signal using the voltages (Vcc1 and Vcc2) supplied by the follower circuit 1 and each output the amplified signals to different antennas (S104). [1.6 Effects etc.]

[0146] As described above, the follower circuit 1 according to the present embodiment comprises the following: the voltage generation circuit 60, which is configured to generate several discrete voltages based on an input voltage; and the supply modulator 30, which is configured to select one voltage from among the several discrete voltages and to output the selected voltage simultaneously to the power amplifiers 71 and 72, wherein the power amplifier 71 is connected to the antenna 3 and is configured to amplify a millimeter wave signal, and the power amplifier 2 is connected to the antenna 4, which is different from the antenna 3, and is configured to amplify the millimeter wave signal.

[0147] Accordingly, the same voltage is simultaneously supplied by the supply modulator 30 to the power amplifiers 71 and 72, which are connected to the different antennas 3 and 4, respectively. Therefore, for example, in the communication device 5, where millimeter-wave signals carrying the same data are simultaneously transmitted from the two antennas 3 and 4 for beamforming, it is possible to improve power efficiency by using the two amplifiers 71 and 72. Additionally, the level difference between the power supply voltages supplied to the two power amplifiers 71 and 72 can be reduced, thereby reducing the error between the two millimeter-wave signals being amplified by the respective power amplifiers 71 and 72.Furthermore, the voltage generation circuit 60 and the supply modulator 30 can be used jointly by the two power amplifiers 71 and 72, thereby reducing the circuit scale of the follower circuit 1 and contributing to the miniaturization of the communication device 5.

[0148] In addition, for example, the follower circuit 1 according to the present embodiment can further comprise the voltage matching circuit 41, which is connected between the supply modulator 30 and the power amplifier 71 and is configured to match a voltage supplied by the supply modulator 30.

[0149] Accordingly, if a level difference exists between the power supply voltage Vcc1, which is supplied to the power amplifier 71, and the power supply voltage Vcc2, which is supplied to the power amplifier 72, the level of the power supply voltage Vcc1 can be adjusted by the voltage matching circuit 41, thereby reducing the level difference between the power supply voltages Vcc1 and Vcc2. Consequently, it is possible to reduce the error between the two millimeter-wave signals, which are each amplified by the two power amplifiers 71 and 72.

[0150] Additionally, for example in the follower circuit 1 according to the present embodiment, the voltage matching circuit 41 can include the variable resistor R41.

[0151] Accordingly, the voltage matching circuit 41 can be implemented with a simplified configuration.

[0152] In addition, for example, the follower circuit 1 according to the present embodiment can further comprise the voltage matching circuit 42, which is connected between the supply modulator 30 and the power amplifier 72 and is configured to match the voltage output from the supply modulator 30.

[0153] Accordingly, if a level difference exists between the power supply voltage Vcc1, which is supplied to the power amplifier 71, and the power supply voltage Vcc2, which is supplied to the power amplifier 72, the level of the power supply voltage Vcc2 can be adjusted by the voltage matching circuit 42, thereby reducing the level difference between the power supply voltages Vcc1 and Vcc2. Consequently, it is possible to reduce the error between the two millimeter-wave signals, which are each amplified by the two power amplifiers 71 and 72.

[0154] Additionally, for example in the follower circuit 1 according to the present embodiment, the voltage matching circuit 42 can include the variable resistor R42.

[0155] Accordingly, the voltage matching circuit 42 can be implemented with a simplified configuration.

[0156] Furthermore, the integrated circuit 91 according to the present embodiment comprises the following: the external connection terminals 61 and 62; at least one switch included in the voltage generation circuit 60, which is configured to generate several discrete voltages based on an input voltage; and at least one switch included in the supply modulator 30, which is configured to select one voltage from among the several discrete voltages and simultaneously output the selected voltage to the external connection terminals 61 and 62.

[0157] Accordingly, the voltage from the supply modulator 30 is simultaneously output to the two external connection terminals 61 and 62. Therefore, for example, in the communication device 5, where millimeter-wave signals carrying the same data are simultaneously transmitted from the two antennas 3 and 4 for beamforming, it is possible to simultaneously supply the voltage from the two external connection terminals 61 and 62 to the two power amplifiers 71 and 72, thus improving the power efficiency of the two power amplifiers. Additionally, the level difference between the power supply voltages supplied to the two power amplifiers 71 and 72 from the two external connection terminals 61 and 62 can be reduced, thereby reducing the error between the two millimeter-wave signals being amplified by the two power amplifiers 71 and 72.Furthermore, the voltage generation circuit 60 and the supply modulator 30 can be used jointly by the two power amplifiers 71 and 72, thereby miniaturizing the integrated circuit 91.

[0158] In addition, the amplification method according to the present embodiment comprises the following: generating several discrete voltages based on an input voltage (S101); selecting one voltage from among the several discrete voltages based on an envelope signal of a millimeter wave signal (S102); simultaneously supplying the selected voltage to the power amplifiers 71 and 72 (S103); and the power amplifiers 71 and 72 amplifying the millimeter wave signal using the supplied voltage and each outputting the amplified signals to the different antennas 3 and 4 (S104).

[0159] Accordingly, a voltage selected from among several discrete voltages based on the envelope signal of a millimeter-wave signal is simultaneously supplied to power amplifiers 71 and 72. Therefore, if millimeter-wave signals carrying the same data are transmitted from the two antennas 3 and 4, it is possible to apply a D-ET mode to the two power amplifiers 71 and 72 and improve the additional power efficiency. Furthermore, the level difference between the power supply voltages fed to the two power amplifiers 71 and 72 can be reduced, thereby reducing the error between the two millimeter-wave signals being amplified by the respective power amplifiers 71 and 72. (Example 2)

[0160] Exemplary embodiment 2 is now described. The main difference between this embodiment and exemplary embodiment 1 is the configuration of the voltage matching circuits. The present exemplary embodiment is described below with reference to the drawings, focusing on the differences compared to exemplary embodiment 1.

[0161] The follower circuit 1 according to the present embodiment differs from the follower circuit 1 according to embodiment 1 in that it includes voltage matching circuits 41A and 42A instead of voltage matching circuits 41 and 42. Therefore, descriptions of circuits other than voltage matching circuits 41A and 42A are omitted. [2.1 Circuit configuration of the voltage matching circuits 41A and 42A]

[0162] The circuit configuration of the voltage matching circuits 41A and 42A is now described with reference to the Fig. 7A and Fig. 7B described. It is noted that the Fig. 7A and Fig. Figure 7B represents an exemplary circuit configuration, and the voltage matching circuits 41A and 42A can be implemented using a wide variety of circuit implementations and circuit technologies. Therefore, the following description of the voltage matching circuits 41A and 42A should not be interpreted restrictively.

[0163] The voltage matching circuit 41A includes a switching capacitor 411A and a selector 412A.

[0164] The switching capacitor 411A is an example of a first switching capacitor and can generate multiple voltages from a single voltage supplied by the supply modulator 30. Since the circuit configuration of the switching capacitor 411A is the same or similar to that of the switching capacitor circuit 20, its diagram and description have been omitted.

[0165] Selector 412A is an example of a first selector and can select one voltage from among the several voltages generated by switching capacitor 411A. The selected voltage is output to external connection terminal 61. Since the circuit configuration of selector 412A is the same as or similar to that of supply modulator 30, its description is omitted. It should be noted that selector 412A differs from supply modulator 30, which is controlled by a digital control signal based on the serial data transmission standard, in that selector 412A is controlled by a digital control signal based on the parallel data transmission standard.

[0166] The voltage matching circuit 42A includes a switching capacitor 421A and a selector 422A.

[0167] The switching capacitor 421A is an example of a second switching capacitor and can generate multiple voltages from a single voltage supplied by the supply modulator 30. Since the circuit configuration of the switching capacitor 421A is the same or similar to that of the switching capacitor circuit 20, its diagram and description are omitted.

[0168] Selector 422A is an example of a second selector and can select one voltage from among the several voltages generated by switching capacitor 421A. The selected voltage is output to external connection terminal 62. Since the circuit configuration of selector 422A is the same as or similar to that of supply modulator 30, its description is omitted. It should be noted that selector 422A differs from supply modulator 30, which is controlled by a digital control signal based on the parallel data transmission standard, in that selector 422A is controlled by a digital control signal based on the serial data transmission standard. [2.2 Effects etc.]

[0169] As described above, in the follower circuit 1 according to the present embodiment, the voltage matching circuit 41A can include the switching capacitor 411A, which is configured to generate a first plurality of voltages based on a voltage output by the supply modulator 30, and the selector 412A, which is configured to select a first voltage from among the first plurality of voltages generated by the switching capacitor 411A.

[0170] Accordingly, the voltage matching circuit 41A can not only lower the voltage output by the supply modulator 30, but also increase it, thereby improving the flexibility of the voltage matching.

[0171] As described above, in the follower circuit 1 according to the present embodiment, the voltage matching circuit 42A can include the switching capacitor 421A, which is configured to generate a second plurality of voltages based on a voltage output from the supply modulator 30, and the selector 422A, which is configured to select a second voltage from among the second plurality of voltages generated by the switching capacitor 421A.

[0172] Accordingly, the voltage matching circuit 42A can not only lower the voltage output by the supply modulator 30, but also increase it, thereby improving the flexibility of the voltage matching. (Example 3)

[0173] Exemplary embodiment 3 is now described. The main difference between this embodiment and exemplary embodiment 1 is that the follower circuit 1 and the RFIC 2 are implemented on both sides of the module substrate 90. The present exemplary embodiment is described below with reference to the drawings, focusing on the differences from exemplary embodiment 1.

[0174] Since the circuit configuration of the communication device 5, the follower circuit 1 and the RFIC 2 is the same or similar to that of embodiment 1, their illustrations and descriptions have been omitted. [3.1 Implementation example of the follower circuit 1 and RFIC 2]

[0175] As an implementation example of the tracker circuit 1 and the RFIC 2, an RF module 100A according to the present embodiment is described with reference to the Fig. 8, Fig. 9 to Fig. 10 described.

[0176] Fig. Figure 8 is a top view of the RF module 100A according to the present embodiment. Fig. Figure 9 is a top view of the RF module 100A according to the present embodiment and represents the side of the main surface 90b of the module substrate 90 when viewed from the positive z-axis direction. Fig. Figure 10 is a cross-sectional view of the RF module 100A according to the present embodiment. The cross-section of the RF module 100A in Fig. 10 takes place along a line xx in the Fig. 8 and Fig. 9.

[0177] In the Fig. 8 and Fig. Figure 9 omits the representation of the resin component 94, which covers several components on the main surfaces 90a and 90b of the module substrate 90. In the Fig. 8 and Fig. 9. The components on the module substrate 90 are labelled with reference symbols (e.g., "C20") so that the positional relationship between the components is readily apparent. Additionally, functional regions, represented by dashed lines in RFIC 2, as well as the integrated circuit 91, are labelled with their functions (e.g., "SC switch section"). However, such labels do not necessarily have to be affixed to the actual components. Furthermore, in Fig. 9 The hatched components represent optional components that are not essential for the present embodiment.

[0178] The RF module 100A comprises the module substrate 90, on which the tracker circuit 1 and the RFIC 2 are mounted. Fig.The module substrate 90 is a double-sided implementation substrate with main surfaces 90a and 90b facing each other. Through-hole conductors, wiring structures, and ground planes are formed within the module substrate 90 and on the main surface 90a. Only one wiring connection 92A between the external connection terminal 61 and the external connection terminal 75 is shown.

[0179] In the present embodiment, the integrated circuit 91, the power inductor L11 and the capacitor C11, which are contained in the pre-regulator circuit 10, and the capacitors C20 to C29, which are contained in the switching capacitor circuit 20, are arranged on the main surface 90b of the module substrate 90.

[0180] The external connection terminal 75 of RFIC 2 is electrically connected to the external connection terminal 61 of the integrated circuit 91, which is located on the main surface 90b, with the wiring 92A of the module substrate 90 situated between them. Here, the external connection terminal 75 is closer to the external connection terminal 61 of the integrated circuit 91 than the external connection terminal 76. This allows for a shorter wiring length of the wiring 92A.

[0181] The external connection terminal 76 of RFIC 2 is electrically connected to the external connection terminal 62 of the integrated circuit 91, which is located on the main surface 90b, with wiring (not shown) of the module substrate 90 located between them. Here, the external connection terminal 76 is closer to the external connection terminal 62 of the integrated circuit 91 than the external connection terminal 75. This can shorten the wiring length between the external connection terminals 76 and 62.

[0182] The external connection pin 61 of the integrated circuit 91 is electrically connected to the external connection pin 75 of the RFIC 2, with the wiring 92A of the module substrate 90 located between them. Here, the external connection pin 61 is closer to the external connection pin 75 of the RFIC 2 than the external connection pin 62. This can shorten the wiring length of the wiring 92A.

[0183] The external connection pin 62 of the integrated circuit 91 is electrically connected to the external connection pin 76 of the RFIC 2, with the wiring of the module substrate 90 located between them. Here, the external connection pin 62 is closer to the external connection pin 76 of the RFIC 2 than the external connection pin 61. This can shorten the wiring length between the external connection pins 62 and 76.

[0184] The voltage matching section 91d within the integrated circuit 91 overlaps at least partially with the power amplifiers 71 and 72 within the RFIC 2 in a planar view of the module substrate 90.

[0185] Wiring 92A electrically connects the external connection terminal 61 of the tracker circuit 1 and the external connection terminal 75 of the RFIC 2, which are formed on the integrated circuit 91. Wiring 92A consists of a wiring structure arranged on the main surface 90a of the module substrate 90, and / or a through-hole conductor and a wiring structure arranged within the module substrate 90.

[0186] The resin substrate 94 covers the components located on the main surfaces 90a and 90b of the module substrate 90. The resin component 94 consists, for example, of an epoxy resin and serves to ensure the reliability of several electronic components on the main surfaces 90a and 90b, such as mechanical strength and moisture resistance. It is noted that the resin component 94 does not necessarily have to be included in the RF module 100A.

[0187] For example, copper rod electrodes can be used as the multiple external connection terminals 95, but they are not limited to this. [3.2 Effects etc.]

[0188] As described above, in the RF module 100A according to the present embodiment, the tracker circuit 1 and the RFIC 2 can be implemented on the main surfaces 90a and 90b, which face each other, of the module substrate 90.

[0189] Accordingly, the RF module can be miniaturized to 100A. (Further examples)

[0190] The follower circuit, the integrated circuit, and the amplification method according to the present invention have been described above based on the exemplary embodiments; however, the follower circuit, the integrated circuit, and the amplification method according to the present invention are not limited to the exemplary embodiments described above. Other exemplary embodiments realized by combining any components in the exemplary embodiments described above, various modifications obtained by applying various changes, recognizable to those skilled in the art, to the exemplary embodiments described above without departing from the essence of the present invention, and various devices incorporating the follower circuit or integrated circuit described above are also included in the present invention.

[0191] For example, in the circuit configuration of various circuits according to the embodiments described above, other circuit elements and wiring may be introduced into the traces that connect the circuit elements and signal lines shown in the drawings. For example, a filter and / or an impedance matching circuit may be inserted between the power amplifier 71 and the antenna 3.

[0192] It should be noted that the number of discrete voltages generated by the switching capacitor circuit 20 in the embodiments described above is exemplary and not limited to the number shown in those embodiments. For example, in the embodiments described above, the switching capacitor circuit 20 can generate three or fewer discrete voltages, or five or more discrete voltages. In this case, the number of stages of the conductor-type circuit configuration of the switching capacitor circuit 20 can be increased.

[0193] It is noted that in the embodiments described above, the communication device 5 may comprise four power amplifiers and four antennas, each connected to the four power amplifiers. In this case, the follower circuit 1 may comprise two supply modulators, and each of the two supply modulators may supply the power supply voltage to two power amplifiers simultaneously. Alternatively, the follower circuit 1 may comprise a single supply modulator, and the single supply modulator may supply the power supply voltage to four power amplifiers simultaneously. It is noted that the four power amplifiers may be implemented together in a single RFIC or separately in two RFICs.

[0194] It is noted that in the embodiments described above, the voltage matching circuits 41 and 42 need not be included in the follower circuit 1. In this case, the follower circuit 1 can supply a power supply voltage from a single external interconnect to the power amplifiers 71 and 72. At this point, the RFIC 2 can include a single external interconnect, shared by the power amplifiers 71 and 72, as an input for receiving the power supply voltage. Alternatively, the RFIC 2 can have two separate external interconnects for the power amplifiers 71 and 72. Commercial applicability

[0195] The present invention can be widely used in communication devices, such as mobile phones, as a follower circuit that selectively supplies several discrete voltages. Reference symbol list 1 Follower circuit 2 RFIC 3 and 4 antennas 5 Communication device 10 Pre-regulator circuit 20 Switching capacitor circuit 30 Supply modulator 41, 41A, 42 and 42A voltage matching circuits 50 digital control circuits 51 first control 52 second control 60 Voltage generation circuit 61, 62, 75, 76 and 95 external connection ports 71 and 72 power amplifiers 73 and 74 Low-noise amplifiers 77 and 78 Switch circuits 79, 80, 81 and 82 Phase shift circuits 90 modular substrate 90a and 90b main surfaces 91 integrated circuit 91a PR switch section 91b SC switch section 91c SM switch section 91d Voltage matching section 92, 92A and 93 wiring 94 resin component 100 and 100A RF modules 411A and 421A switching capacitors 412A and 422A selectors QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] US 8829993

[0003]

Claims

[1] Follower circuit which has the following features: a voltage generation circuit configured to generate a plurality of discrete voltages based on an input voltage; and a supply modulator configured to select a voltage from a plurality of discrete voltages and to simultaneously output the selected voltage to a first power amplifier and a second power amplifier, wherein the first power amplifier is connected to a first antenna and configured to amplify a millimeter wave signal, and the second power amplifier is connected to a second antenna that is different from the first antenna and is configured to amplify the millimeter wave signal. [2] Follower circuit according to claim 1, which further comprises the following feature: a first voltage matching circuit that is connected between the supply modulator and the first power amplifier and is configured to match the voltage output from the supply modulator. [3] Follower circuit according to claim 2, wherein: The first voltage matching circuit has a first variable resistor. [4] Follower circuit according to claim 2, wherein: The first voltage matching circuit has the following characteristics: a first switching capacitor configured to generate a first plurality of voltages based on the voltage output by the supply modulator; and a first selector configured to select a single first voltage from among the first plurality of voltages generated by the first switching capacitor. [5] Follower circuit according to one of claims 2 to 4, which further comprises the following feature: a second voltage matching circuit, which is connected between the supply modulator and the second power amplifier and is configured to match the voltage output by the supply modulator. [6] Follower circuit according to claim 5, wherein: The second voltage matching circuit has a second variable resistor. [7] Follower circuit according to claim 5, wherein: The second voltage matching circuit has the following features: a second switching capacitor configured to generate a second plurality of voltages based on the voltage output by the supply modulator; and a second selector configured to select a single second voltage from among the second plurality of voltages generated by the second switching capacitor. [8] Integrated circuit which has the following features: a first external connection port and a second external connection port; at least one switch included in a voltage generation circuit configured to generate a plurality of discrete voltages based on an input voltage; and at least one switch included in a supply modulator configured to select one voltage from a plurality of discrete voltages and to output the selected voltage simultaneously to the first external connection terminal and the second external connection terminal. [9] Amplification method, which includes the following steps: Generating a plurality of discrete voltages based on an input voltage; Selecting a voltage from a plurality of discrete voltages based on an envelope signal of a millimeter wave signal; Supplying the selected voltage simultaneously to a first power amplifier and a second power amplifier; and The first power amplifier and the second power amplifier amplify the millimeter wave signal using the supplied voltage and each output the amplified signals to different antennas.

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