ELECTRONIC MODULE

Abstract

An electronic module 100 of the present invention comprises an electronic element 120, an internal connection port 134 which is electrically connected to the electronic element 120 and is electrically conductive, and a chip spacer 122 formed between a lower end face of the internal connection port 134 and the electronic element 120. The chip spacer 122 is bonded to the electronic element 120 via an electrically conductive bonding material BM1, and a recess 113 is formed on an upper surface of the chip spacer 122, the diameter of which is larger than that of the internal connection port 134. According to the electronic module 100 of the present invention, positional displacement between the internal connection port and the chip spacer is prevented, thus improving the desired self-alignment effect.

Description

[Cross-reference]

[0001] This application claims priority over Japanese patent application 2023-074801, filed on April 28, 2023, the entire contents of which are incorporated into the present application by reference. [Technical field]

[0002] The present invention relates to an electronic module. [State of the art]

[0003] Conventionally, electronic modules are known that each comprise an electronic element (a semiconductor element, a semiconductor chip) and an internal connection terminal that connects an electrode of the electronic module to a wiring structure on a circuit board. On the other hand, an electronic module is known that comprises an electronic element, a circuit board on which the electronic element is mounted, a pin connector that acts as an internal connection terminal and is connected to a wiring structure on the circuit board, and a conductor frame that supports the pin connector and electrically connects an electrode of the electronic element to the pin connector (see patent document 1 described below). Among these types of electronic modules, one is known in which an internal connection terminal is connected to an electrode of the electronic element instead of the wiring structure.Such an electronic module is considered to be an electronic module in which voltages are reduced by connecting the electronic element to the internal connection terminal via a chip spacer.

[0004] On the other hand, an electronic module is also known in which an electronic element 320 is bonded to an upper surface of an insulating plate 312 via a solder BM 30, as in Fig. 6 shown, and a chip spacer 318 is bonded via a solder BM 20 to a lower end of an internal connection terminal 334, which is guided through a through hole (not shown in the drawing) formed in a conductor frame (not shown in the drawing). [State of the art literature][Patent literature]

[0005] [Japanese Patent 1] No. 6850938 [Summary of the invention][Technical problem]

[0006] However, during the bonding step of the internal connection terminal 334 and the chip spacer 318, the solder BM 20 flows out between the internal connection terminal 334 and the chip spacer 318, so that when the solder melts, there is a positional shift of the internal connection terminal 334 relative to the chip spacer 318, which has the disadvantage that the electronic module has difficulty exhibiting a desired self-alignment effect.

[0007] The present invention was made in view of the aforementioned disadvantages, and it is an objective of the present invention to provide an electronic module that can improve a desired self-alignment effect by suppressing the positional displacement of the internal interconnect connector and the chip spacer. [Solution to the problem]

[0008] An electronic module of the present invention comprises an electronic element, an internal interconnection terminal which is electrically connected to the electronic element and has electrical conductivity, and a chip spacer formed between a lower end face of the internal interconnection terminal and the electronic element. The chip spacer is bonded to the electronic element via an electrically conductive bonding material, and a recess with a larger diameter than the internal interconnection terminal is formed on an upper surface of the chip spacer. [Advantageous effects of the present invention]

[0009] According to the electronic module of the present invention, the recess with a diameter larger than the diameter of the connector is formed in an area which is an outer circumferential section of an upper surface of the chip spacer and which corresponds to an outer environment of the connector, and therefore it is possible to provide an electronic module which can improve a desired self-alignment effect by suppressing the positional displacement between the internal connection connector and the chip spacer. [Brief description of the drawings] Fig. Figure 1 is a perspective view showing an external appearance of an electronic module 100 according to a first embodiment. Fig. Figure 2 is a view showing a chip spacer according to the first embodiment. Fig. 2(a) is a top view showing a pin connector and a chip spacer of the electronic module according to the first embodiment. Fig. 2(b) is a longitudinal section view of Fig. 2(a) and Fig. 2(c) is a perspective view showing an external appearance of a chip spacer. Fig. Figure 3 is a view showing a cross-sectional structure of the electronic module 100 according to the first embodiment. Fig. Figure 4 is a view showing the state of the pin connector and chip spacer when the pin connector is rotated. Fig. 4(a) is a view showing a state in a case where the shape of the pin connector and the chip spacer form a quadrilateral shape when the pin connector is rotated, and Fig. Figure 4(b) shows a state in a case where the shape of the pin connector and the chip spacer form a disk shape when the pin connector is rotated. Fig. Figure 5 is a view showing a cross-sectional structure of an electronic module 100 according to a second embodiment. Fig. Figure 6 is a view showing a state-of-the-art electronics module. [Description of the embodiments]

[0010] An electronic module according to the present invention is described below. The embodiment described below is not intended to limit the invention as defined in the claims. Furthermore, not all elements and combinations of these elements described in the embodiment are necessarily essential for the present invention. [First embodiment]

[0011] An electronic module 100 according to a first embodiment has, as in Fig. Figure 1 shows an approximately rectangular, parallelepiped shape that is elongated in a longitudinal direction and flat in the vertical direction. The electronic module 100 includes an insulating plate 112, electronic components 120A, 120B, a first terminal 130, a second terminal 140, a third terminal 160, a first terminal frame 132B, a second terminal frame 142B, a third terminal frame 152B, and a casting resin (not shown in the drawing).

[0012] The insulating plate 112 is a ceramic plate, specifically a direct copper bond (DCB) plate, in which circuit wiring is formed on an upper surface of the ceramic plate and a heat-radiating metal plate is formed on a lower surface (back) of the ceramic plate. The two electronic elements 120A and 120B, for example, are arranged on the circuit wiring formed on a surface of the insulating plate 112. The insulating plate 112 can be a printed circuit board or similar. The insulating plate 112 has the shape of a rectangular, flat plate and is arranged longitudinally, i.e., in the front-to-back direction of the electronic module 100, on a central part of the electronic module 100.

[0013] The two electronic elements 120A and 120B are each arranged on the circuit wiring formed on a surface of the insulating plate 112. The electronic elements 120A and 120B can be formed from a semiconductor device, and a power metal-oxide-semiconductor field-effect transistor (MOSFET) can be used. However, IGBTs, thyristors, diodes, or other suitable elements can also be used. The electronic elements 120A and 120B each have an electrode (not shown in the drawing) on ​​both surfaces of the semiconductor plate. A source electrode and a gate electrode of the electronic elements 120A and 120B are formed on the upper surface of the semiconductor plate, and a drain electrode (not shown in the drawing) is formed on the lower surface of the semiconductor plate.

[0014] In the electronic element 120A, the source electrode is connected to the first terminal 130 via a chip spacer 122, an internal connection terminal 134, and the first terminal frame 132B. The source electrode is also connected via a wire, circuit wiring, or similar means to a pin terminal 172, which functions as a SENSE terminal. The gate electrode is connected to a pin terminal 174 via the circuit wiring. The drain electrode is located on a lower surface of the semiconductor board and is electrically connected to the circuit wiring. In the Fig. In the example shown, the internal connection terminal 134 is a pin terminal with a circular cross-section.

[0015] In electronic element 120B, the source electrode is connected to the drain electrode of electronic element 120A on a top surface via a chip spacer (not shown in the drawing), an internal connection terminal 154, the third terminal frame 152B, and the circuit wiring, and simultaneously connected to the third terminal 160 via the third terminal frame 152B. The source electrode is connected to a pin terminal 182, which acts as a SENSE terminal, via a wire, the circuit wiring, or similar means. The gate electrode is connected to a pin terminal 184 via the circuit wiring. The drain electrode is formed on a bottom surface of the semiconductor board and is electrically connected to the second terminal frame 142B via circuit wiring. In the Fig. In the example shown, the internal connection terminal 154 is a pin terminal with a circular cross-section.

[0016] The first connection frame 132B and the first connection 130 are formed in one piece from the same plate element 132. This means that a part of the plate element 132, which is embedded in the casting resin, corresponds to the first connection frame 132B. The first connection frame 132B has a through-hole 133 (see Fig. 3) which penetrates the first terminal frame 132B in a vertical direction and is electrically connected to the first terminal 130. The through-hole 133 has a circular shape when viewed vertically. An upper end section of the internal connection terminal 134 engages in the through-hole 133 by means of a fitting, and the first terminal frame 132B and the electrode of the electronic element 120A are connected to each other by the internal connection terminal 134. The shape of the through-hole is not limited to a circular shape, but can also form a polygonal shape, such as a hexagon.

[0017] The internal connection terminal 134 is formed from a metal element in the form of a circular column. The internal connection terminal 134 electrically connects the electrode of the electronic element 120A and the first connection frame 132B. For example, the internal connection terminal 134 is attached to the first connection frame 132B by a press fit.

[0018] As in the Fig. 2(a) and Fig. As shown in Figure 2(c), the chip spacer 122 is a thin, flat, electrically conductive plate element (in this embodiment, a copper plate) that is disk-shaped. The chip spacer 122 is arranged concentrically to the internal connection terminal 134. The diameter of the chip spacer 122 is larger than the diameter of the internal connection terminal 134. An annular recess 113 with an outer diameter larger than the diameter of the internal connection terminal 134 is formed on an upper surface of the chip spacer 122. The chip spacer 122 is bonded to a lower surface of the internal connection terminal 134 via an electrically conductive bonding material (e.g., solder BM2) in the recess 113.A solder BM1) is bonded to an upper surface of the electronic element 120A (more precisely, an electrode not shown in the drawing). To facilitate the description of the embodiment, the designation 120 is used as a reference numeral for the electronic element in the following description, unless explicitly required to distinguish the electronic elements.

[0019] Projecting sections 115 are formed on the lower surface of the chip spacer 122. By bringing the lower ends of the projecting sections 115 into contact with the electrode of the electronic element 120, it is possible to maintain a fixed distance between a base of the chip spacer 122 and the electronic element 120. Furthermore, the solder thickness of the solder BM1, which is arranged between the chip spacer 122 and an electronic element 120, can be maintained at a fixed value. Recessed sections 117, corresponding to the projecting sections 115, are formed on an upper surface of the chip spacer 122. Although the projecting sections 115 extend from above at four locations, e.g., B. in the recess 113 of the chip spacer 122, by exerting a force in a vertical downward direction using mandrels (not shown in the drawing), the preceding sections 115 can also be formed by other methods such as e.g.with the aid of a punch. In addition, the recessed sections 117 can be formed when the preceding sections 115 are formed by exerting a force in a vertical downward direction through the mandrels, so that an external appearance of the recessed section 117 assumes a shape corresponding to the shape of the preceding section 115, and an outer diameter and depth of the recessed section 117 change according to the shape of the preceding section 115.Furthermore, it is preferred that, with respect to the locations where the protruding sections 115 and the recessed sections 117 are formed, the protruding sections 115 and the recessed sections 117 are arranged outside a position of the outer circumference of the inner connection terminal 134 and within an outer diameter of the chip spacer 122, and that the number of protruding sections 115 and the number of recessed sections 117 is at least three or more. The reason for specifying the number of protruding sections 115 and recessed sections 117 at three or more is to prevent the protruding sections 115 and the recessed sections 117 from interfering with the perpendicular orientation of the chip spacer 122.

[0020] A chip spacer (not shown in the drawing) is also arranged between a lower surface of the internal connection terminal 154 and the electronic element 120 in the same manner as described above. However, the structure of such a chip spacer and similar components are essentially the same as the chip spacer 122 described above, and therefore the description of the chip spacer is omitted.

[0021] The second terminal frame 142B is electrically connected to the second terminal 140. The second terminal frame 142B is embedded in the casting resin. In the electronic module 100, the second terminal frame 142B is formed integrally with the second terminal 140, which is formed from the same plate element 142. This means that part of the plate element 142 embedded in the casting resin forms the second terminal frame 142B.

[0022] The second terminal frame 142B has four through-holes (without reference numerals) that penetrate the second terminal frame 142B vertically. Viewed vertically, the through-holes are circular. An upper end section of the internal connecting electrodes 144 engages in each of the four through-holes. The second terminal frame 142B and the electrode (not shown in the drawing) of the electronic element 120B are connected by means of the four internal connecting electrodes 144. The internal connecting electrodes 144 are attached to the second terminal frame 142B, for example, by a press fit. The number of through-holes and the number of internal connecting electrodes 144 described above are not limited to four, as long as a required current is ensured, and can be set to a desired number greater than one.

[0023] The third terminal frame 152B is electrically connected to the third terminal 160. The third terminal frame 152B can be arranged on the same plane as the first terminal frame 132B and the second terminal frame 142B.

[0024] The third terminal frame 152B has a through-hole (without reference numeral) that penetrates the third terminal frame 152B vertically. The through-hole is circular when viewed vertically. An upper end section of the internal connection terminal 154, which functions as an internal connection electrode, engages in the through-hole by means of a fitting. The third terminal frame 152B and an electrode (not shown in the drawing) of the electronic element 120B are connected to each other by means of the internal connection electrodes 144. The internal connection terminal 154 is attached to the third terminal frame 152B, for example, by an interference fit.

[0025] As in Fig. As shown in Figure 1, the first terminal 130 is located on a longitudinally forward side of the electronic module 100. The first terminal 130 is formed from a flat, electrically conductive plate element, such as the plate-shaped element 132A, which is formed, for example, from a copper plate. The first terminal 130 has a through-hole (without reference numeral) that penetrates the first terminal 130 vertically. The through-hole is, for example, circular when viewed vertically. The shape of the through-hole is not limited to a circular shape but can also be a polygon, such as a hexagon.

[0026] An upper end of a first union nut 230 engages by fitting into the through-hole. In such a configuration, it is preferred that the height of an upper surface of the first union nut 230 is equal to or less than the height of an upper surface of the first connection 130.

[0027] A lower surface of the first terminal 130 and the first union nut 230 are embedded in the casting resin. Conversely, an upper surface of the first terminal 130 is exposed to the outside of the casting resin. An external connecting element (not shown in the drawing) is arranged on the upper surface of the first terminal 130 that is exposed by the casting resin, and the external connecting element is fastened by a screw (not shown in the drawing) so that an electrical connection can be established between the first terminal 130 and the external connecting element.

[0028] As in the Fig. 1, Fig. 2 to Fig. As shown in Figure 3, the second terminal 140 is located on a longitudinally rear side of the electronic module 100. The second terminal 140 is formed from a flat, electrically conductive plate element, such as the plate element 142A, which is, for example, formed from a copper plate. The second terminal 140 has a through-hole (without a reference numeral) that penetrates the second terminal 140 in a vertical direction. The through-hole is, for example, circular when viewed vertically.

[0029] An upper end of a second union nut 240 engages by fitting into the through-hole. In such a configuration, it is preferred that the height of an upper surface of the second union nut 240 is equal to or less than the height of an upper surface of the second connection 140.

[0030] A lower surface of the second terminal 140 and the second union nut 240 are embedded in the casting resin. Conversely, an upper surface of the second terminal 140 is exposed to the outside of the casting resin. An external connecting element (not shown in the drawing) is arranged on the upper surface of the second terminal 140 that is exposed by the casting resin, and the external connecting element is fastened by a screw (not shown in the drawing) so that an electrical connection can be established between the second terminal 140 and the external connecting element.

[0031] The electronic module 100 can also have a third connection 160. The third connection 160 is any constituent element. As in Fig. As shown in Figure 1, the third terminal 160 is formed from a flat, electrically conductive plate element and a copper plate. The third terminal 160 is arranged such that its longitudinal direction corresponds to the plate thickness and is elongated with the vertical direction as its longitudinal direction. The third terminal 160 comprises: a section that is located on the top side of the casting resin and is exposed relative to the casting resin (hereinafter referred to as the "upper section"); and a section that is covered by the casting resin (hereinafter referred to as the "lower section").

[0032] A through-hole (without reference numeral) penetrating the third terminal 160 longitudinally is formed in the upper side section of the third terminal 160. In this configuration, an external connector (not shown in the drawing) can be fastened to the third terminal 160 by means of a screw (not shown in the drawing) and a nut (not shown in the drawing). Additionally, one end of a cap nut (not shown in the drawing) can engage by fitting it into the through-hole. In this configuration, the electrical connection between the third terminal 160 and the external connector can be securely established when the external connector is fastened to the third terminal 160 by means of the screw. A lower section of the third terminal 160 is connected to electrodes (not shown in the drawing) of the electronic components 120A and 120B. [Advantages of the first embodiment]

[0033] According to the electronic module 100 of the first embodiment, the annular recess 113, with an outer diameter larger than the diameter of the internal connection port 134, is formed on the chip spacer 122. The formation of such a recess 113 prevents the solder BM2 from flowing outwards in a radial direction between the upper surface of the chip spacer 122 and the lower surface of the internal connection port 134.

[0034] The disc-shaped chip spacer 122 is arranged concentrically to the internal connection port 134 (see Fig. 4(b)). Accordingly, it is in comparison to a case in which a chip spacer 127 formed in a square shape is arranged, for example, on the upper surface of the electronic element 120 and on a lower surface of an internal interconnect 234 with a square shape (see Fig. 4(a)), possible, to prevent the chip spacer 122 from coming into contact with an electronic component 128 in the vicinity of the chip spacer 122 due to the rotational movement of the internal connection terminal 234 during the coagulation of a solder.

[0035] The foregoing sections 115 are formed on the lower surface of the chip spacer 122. Accordingly, when coagulating the solder BM1, it is possible to achieve self-alignment of the chip spacer 122 in the direction of an axis of the internal connection port 134 by providing the foregoing sections 115.

[0036] Furthermore, the recessed sections 117 are formed on the upper surface of the chip spacer 122. Accordingly, it is possible to prevent the solder BM2 from flowing outwards in a radial direction between the upper surface of the chip spacer 122 and the lower surface of the internal connection terminal 134. [Second embodiment]

[0037] The following refers to Fig. 5 an electronic module according to the second embodiment of the present invention is described. The second embodiment corresponds essentially to the first embodiment except that the recessed sections 117 are not formed in the first embodiment described above. Accordingly, the description is given only with regard to the modified features, and the description of substantially identical parts is omitted. As in Fig. As shown in Figure 5, only the protruding sections 115 are formed on a chip spacer 126 using a mold by injection molding, without the sections shown in Figure 5 being formed on a chip spacer 126. Fig. 2(c) shown recessed sections 117 are formed. Even in the case where only the preceding sections 115 are formed without the recessed sections 117, an annular recess 113 with an outer diameter larger than the diameter of an internal connection port 134 is formed in the chip spacer 126.

[0038] Accordingly, by forming the recess 113 on the chip spacer 126 with an outer diameter larger than the diameter of the internal connection port 134, it is possible to prevent solder BM2 from flowing radially outwards between an upper surface of the chip spacer 122 and a lower surface of the internal connection port 134. Furthermore, the projecting sections 115 are formed on the lower surface of the chip spacer 126. Thus, by providing the projecting sections 115, it is possible to achieve self-alignment of the chip spacer 126 in the direction of an axis of the internal connection port 134 during the coagulation of the solder BM1. [List of reference symbols] 100 electronic modules 112 Insulation board 113 In-depth study 115 preceding section 117 in-depth section 120 (120A, 120B) electronic element 122, 126 chip spacers 130 first connection 132A, 142A, 160A flat plate element 134, 154 internal connection port 140 second connection 132B, 142B, 152B connection frame 160 third connection 170 casting resin QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2023-074801

[0001] JP 6850938

[0005]

Claims

[1] Electronic module comprising: an electronic element; an internal connection port that is electrically connected to the electronic element and has electrical conductivity; and a chip spacer formed between a lower end face of the internal interconnect and the electronic element, wherein the chip spacer is bonded to the electronic element via an electrically conductive bonding material, and a recess with a diameter larger than the internal connection terminal is formed on an upper surface of the chip spacer. [2] Electronic module according to claim 1, wherein the internal connection terminal has a circular column shape and the chip spacer has a disk shape. [3] Electronic module according to claim 1, wherein a protruding section is formed on a lower surface of the chip spacer. [4] Electronic module according to claim 1, wherein a recessed section is formed on an upper surface of the chip spacer.

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