Heat dissipation device and communication device

Abstract

This document relates to a heat dissipation device and a communication device, and pertains to the technical field of heat dissipation technology for devices. The heat dissipation device comprises a first liquid cooling plate, a second liquid cooling plate, a first liquid distributor, and a second liquid distributor. The first liquid cooling plate is designed to be in contact with the chip and includes a first inner channel for the flow of cooling medium to dissipate surface heat, as well as a first liquid inlet and a first liquid outlet connected to the first inner channel.The second liquid cooling plate is designed to rest against the optical module and comprises a second inner channel for flow of the cooling medium to dissipate surface heat, as well as a second liquid inlet and a second liquid outlet, each connected to the second inner channel. One end of the first liquid distributor connects to the first and second liquid inlet to supply the first and second inner channels with the cooling medium. The heat dissipation device and communication device provided by the embodiments of the present application can increase the heat dissipation capacity for heat-generating components.

Description

[0001] The present application claims priority over the Chinese patent application filed with the Chinese Patent Office on June 24, 2024, under application number 202410821403.6, entitled “Heat Dissipation Device and Communication Device”, the entire contents of which are hereby incorporated into the present application by reference. Technical field

[0002] The present application relates to the technical field of heat dissipation technology for devices, in particular a heat dissipation device and a communication device. State of the art

[0003] With the continuous development of communication technology, the amount of data generated and exchanged in various fields has experienced explosive growth. Data transmission and exchange rely indispensably on communication devices capable of transmitting data in the form of electrical or optical signals. Optical transmission, characterized by its ability to bridge long distances with minimal signal loss and waveform distortion, is increasingly being used in communication devices.

[0004] However, the increased data transmission capacity has led to higher power consumption by the heat-generating components in the communication devices, causing temperatures to gradually rise during operation. Improving the heat dissipation capacity of these components presents a significant challenge. Content of the invention

[0005] The present application is based on the task of providing a heat dissipation device and a communication device that can increase the heat dissipation capacity for heat-generating components.

[0006] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of protection afforded by the claims.

[0007] In a first aspect, an embodiment of the present application provides a heat dissipation device. The heat dissipation device comprises a first liquid cooling plate, a second liquid cooling plate, a first liquid distributor, and a second liquid distributor. The first liquid cooling plate is designed to bear against the chip and comprises a first inner channel for flow of cooling medium to dissipate surface heat, as well as a first liquid inlet and a first liquid outlet connected to the first inner channel.The second liquid cooling plate is designed to rest against the optical module and includes a second inner channel for flow of the cooling medium to dissipate surface heat, as well as a second liquid inlet and a second liquid outlet, each connected to the second inner channel. One end of the first liquid distributor connects to the first and second liquid inlet to supply the first and second inner channels with the cooling medium. One end of the second liquid distributor connects to the first and second liquid outlets to return the cooling medium from the first and second inner channels.

[0008] In the heat dissipation device provided by the embodiments of the present application, a first liquid cooling plate and a second liquid cooling plate are provided for each of the heat-generating components in the communication device, wherein the first liquid cooling plate dissipates heat from the chip, while the second liquid cooling plate dissipates heat from the optical module. The cooling medium circulating in the first liquid cooling plate and the second liquid cooling plate can be supplied via the first liquid distributor and discharged together via the second liquid distributor. The liquid cooling and heat dissipation configuration, in which liquid cooling plates are provided, increases the heat dissipation capacity for the heat-generating components.

[0009] In the heat dissipation device and the communication device provided by the embodiments of the present application, a first liquid cooling plate and a second liquid cooling plate are provided, each for the heat-generating components in the communication device, wherein the first liquid cooling plate dissipates heat from the chip, while the second liquid cooling plate dissipates heat from the optical module. The cooling medium circulating in the first liquid cooling plate and the second liquid cooling plate can be supplied via the first liquid distributor and discharged together via the second liquid distributor. The liquid cooling and heat dissipation configuration, in which liquid cooling plates are provided, increases the heat dissipation capacity for the heat-generating components.

[0010] In certain embodiments, the heat dissipation device further comprises a third liquid distributor and several second liquid cooling plates, wherein the third liquid distributor is provided with a liquid inlet chamber and a liquid return chamber that are insulated from each other, the liquid inlet chamber connecting one end of the first liquid distributor to the second liquid inlet openings of the several second liquid cooling plates, and the liquid return chamber connecting one end of the second liquid distributor to the second liquid outlet openings of the several second liquid cooling plates. In this way, the several second liquid cooling plates can dissipate heat from different optical modules, with the third liquid distributor supplying the individual second liquid cooling plates with cooling medium.

[0011] In certain embodiments, the heat dissipation device further comprises a third liquid distributor and several second liquid cooling plates, wherein the second inner channels of the several second liquid cooling plates are connected in series to form a flow channel, the third liquid distributor being provided with a liquid inlet chamber and a liquid return chamber that are insulated from each other, the liquid inlet chamber connecting one end of the first liquid distributor to one end of the flow channel, while the liquid return chamber connecting one end of the second liquid distributor to the other end of the flow channel. In this way, the number of connecting lines between the second liquid cooling plates and the third liquid distributor can be reduced by connecting the second inner channels of the several second liquid cooling plates in series.

[0012] In certain embodiments, multiple flow channels are provided, with one end of each flow channel connected to the liquid inlet chamber and the other end connected to the liquid return chamber. By connecting the second inner channels of some of the second liquid cooling plates in series, this ensures that the cooling medium does not flow through an excessive number of second liquid cooling plates, thus preventing any impairment of the heat dissipation performance of the optical modules.

[0013] In certain embodiments, the third liquid distributor is provided with a liquid inlet port connected to the liquid inlet chamber and a liquid outlet port connected to the liquid return chamber, wherein the liquid inlet port is further connected to one end of the first liquid distributor and the liquid outlet port is further connected to one end of the second liquid distributor, the liquid inlet port and the liquid outlet port being located on the same side of the third liquid distributor. This facilitates connections to other liquid distributors by arranging the liquid inlet port and the liquid outlet port on the same side of the third liquid distributor.

[0014] In certain embodiments, positioning steps are arranged on opposite lateral edges of the second liquid cooling plate. This arrangement of positioning steps facilitates the positioning of the second liquid cooling plate after its installation.

[0015] In certain embodiments, the surface edge of the second liquid cooling plate that rests against the optical module is provided with a guide ramp located on the side of the second liquid cooling plate facing away from the third liquid distributor. This arrangement of the guide ramp facilitates the insertion and removal of the optical module.

[0016] In certain embodiments, several first inner channels are provided, with one end of the several first inner channels being connected to the first liquid inlet opening, while the other end of the several first inner channels is connected to the first liquid outlet opening. In this way, the flow resistance can be reduced by flow-splitting design of the several first inner channels.

[0017] In certain embodiments, the first liquid cooling plate comprises a support plate, a substrate plate, and a cover plate, wherein the support plate is provided with a cavity, the substrate plate is connected to one side of the cavity, and the cover plate covers the other side of the cavity. The substrate plate is provided with the first inner channel, and the first liquid inlet and outlet are located on the support plate. In this way, the shaping of the first liquid cooling plate can be facilitated by the interaction of various components.

[0018] In a second aspect, the embodiments of the present application also provide a communication device comprising a printed circuit board and the aforementioned heat dissipation device. The printed circuit board is provided with a chip and an optical module. The first liquid cooling plate of the heat dissipation device is connected to the printed circuit board and rests against the chip, and the second liquid cooling plate of the heat dissipation device is connected to and rests against the optical module. Description of the attached drawings Fig. Figure 1 is a schematic representation of the three-dimensional structure when using a heat dissipation device provided by certain embodiments of the present application; Fig. 2 is a schematic structural top view when using the heat dissipation device provided by certain embodiments of the present application; Fig. Figure 3 is a schematic structural top view when using a second liquid cooling plate in the heat dissipation device provided by certain embodiments of the present application; Fig. Figure 4 is a schematic right structural side view when using the second liquid cooling plate in the heat dissipation device provided by certain embodiments of the present application; Fig. 5 is a schematic structural top view of the interaction of the second liquid cooling plate in the heat dissipation device provided by certain embodiments of the present application with an optical cage; Fig. Figure 6 is a schematic structural sectional view along the direction AA in Fig. 5; Fig. Figure 7 is a schematic right structural side view of the interaction of the second liquid cooling plate in the heat dissipation device provided by certain embodiments of the present application with an optical cage; Fig. 8 is a schematic structural top view of the second liquid cooling plate in the heat dissipation device provided by certain embodiments of the present application; Fig. Figure 9 is a schematic structural sectional view along the BB direction. Fig. 8; Fig. Figure 10 is a schematic structural front view when connecting the second liquid cooling plate in the heat dissipation device provided by certain embodiments of the present application to a capillary tube; Fig. Figure 11 is a schematic structural sectional view along the CC direction in Fig. 10; Fig. Figure 12 is a schematic structural sectional view along the DD direction in Fig. 11; Fig. Figure 13 is a schematic structural front view of a third liquid distributor in the heat dissipation device provided by certain embodiments of the present application; Fig. Figure 14 is a schematic structural sectional view along the direction EE in Fig. 13; Fig. Figure 15 is a schematic structural sectional view along the FF direction in Fig. 13; Fig. Figure 16 is a schematic structural sectional view along the direction GG in Fig. 13; Fig. Figure 17 is a schematic structural representation when using the second liquid cooling plate in the heat dissipation device provided by other embodiments of the present application; Fig. Figure 18 is a schematic structural front view of a first liquid cooling plate in the heat dissipation device provided by certain embodiments of the present application; Fig. Figure 19 is a schematic structural sectional view along the direction HH in Fig. 18; Fig. 20 is a schematic structural sectional view along direction II in Fig. 19; Fig. 21 is a schematic structural exploded view of the first liquid cooling plate in the heat dissipation device provided by certain embodiments of the present application; Fig. Figure 22 is a structural front view of the first liquid distributor in the heat dissipation device provided by certain embodiments of the present application; Fig. 23 is a schematic structural sectional view along the direction JJ in Fig. 22; Fig. Figure 24 is a right structural side view of the first liquid distributor in the heat dissipation device provided by certain embodiments of the present application. Specific embodiments

[0019] To more clearly illustrate the problem, the technical solutions, and the advantages of the embodiments of the present application, the embodiments of the present application are explained in detail below with reference to the accompanying drawings. However, it is understandable to an average person skilled in this technical field that numerous technical details have been proposed in the embodiments of the present application to facilitate the reader's understanding. Nevertheless, the technical solutions claimed in the present application can also be realized without these technical details and various modifications and changes based on the embodiments described below.The subdivision of the following individual embodiments serves to facilitate the description and should not be interpreted as a restriction on the specific implementation form of the present application; the individual embodiments can be combined and related to one another if this is not contradictory.

[0020] Unless otherwise defined, all technical and scientific terminologies used herein shall have the same meanings as generally understood by a person skilled in the art working in the technical field of the present application; the terminologies used herein serve solely to describe specific embodiments and are not intended to limit the present application; the terms “include” and “include” and all variations thereof in the description, claims and accompanying drawings of the present application shall cover non-exclusive inclusion.

[0021] In the description of the embodiments of this application, the technical terms "assemble," "connect," "connect," or the like are to be understood in a broad sense; for example, they may refer to a permanent connection, a detachable connection, or a monolithic connection; they may refer to a mechanical connection or an electrical connection; they may refer to a direct connection or an indirect connection via an intermediate medium, or they may refer to a connection within two elements or an interaction between two elements. The average person skilled in this technical field will be able to understand the specific meaning of the aforementioned terms in the embodiments of this application according to the specific cases.

[0022] Traditional data centers use air cooling and heat dissipation systems, with the energy consumption of the heat dissipation system accounting for up to 33% of total energy consumption. The accelerated construction of data centers places higher demands on heat dissipation and energy consumption to achieve efficient heat dissipation from equipment, thereby reducing electrical energy usage effectiveness (PUE), saving electricity, and aligning with market trends toward reducing CO2 emissions and saving energy. PUE serves as an indicator for evaluating the energy efficiency of data centers, with a value greater than 1 and closer to 1 indicating lower energy consumption by non-IT (information technology) equipment, thus representing a better energy efficiency rating.

[0023] Communication devices are the components in data centers responsible for data transmission and exchange, and their heat dissipation requirements increase with rising data volumes. With the continuous development of optical transmission technology, data transmission devices primarily consist of switches designed for transmitting optical signals. Chips and optical modules are the main heat-generating components of these switches. As the data transmission capacity of the switches increases, so does the throughput of the optical modules, and consequently, their power consumption. This leads to increasingly higher switch temperatures; excessive temperatures can impair device performance, cause significant noise throughout the facility, and shorten the lifespan of the devices.

[0024] Air-cooled coolers are reaching their overall thermal resistance performance limits, with limited space further hindering heat dissipation. Conventional air cooling can no longer meet the heat dissipation requirements of switches.

[0025] To improve the heat dissipation capacity for the heat-generating components, certain embodiments of the present application provide a heat dissipation device. The heat dissipation device utilizes liquid cooling and a heat dissipation form with a liquid cooling plate to dissipate heat from the heat-generating components of the switch. A liquid cooling system directs the cooling medium into the interior of the device to absorb the heat generated during operation of the heat-generating components, and then discharges it for cooling outside the device. This can effectively reduce the device temperature, improve the device's operating performance, and ensure efficient operation of the device.

[0026] Furthermore, the liquid cooling and heat dissipation device can achieve efficient heat dissipation for chips and optical modules of communication devices and reduce the efficiency of electrical energy use.

[0027] The heat dissipation device provided by certain embodiments of the present application is described below with reference to the Fig. 1 to 24 described, wherein the heat dissipation device serves to dissipate heat from the heat-generating components in a communication device.

[0028] As in the Fig. Figures 1 to 24 illustrate the heat dissipation device provided by certain embodiments of the present application, comprising a first liquid cooling plate 11, a second liquid cooling plate 12, a first liquid distributor 13, and a second liquid distributor 14. The first liquid cooling plate 11 is designed to bear against the chip and comprises a first inner channel 111 for flow of cooling medium to extract surface heat, as well as a first liquid inlet opening 112 and a first liquid outlet opening 113, which are connected to the first inner channel 111.The second liquid cooling plate 12 is designed to rest against the optical module and comprises a second inner channel 121 for flow of the cooling medium to dissipate surface heat, as well as a second liquid inlet 122 and a second liquid outlet 123, each connected to the second inner channel 121. One end of the first liquid distributor 13 is connected to the first liquid inlet 112 and the second liquid inlet 122 to supply the first inner channel 111 and the second inner channel 121 with the cooling medium. One end of the second liquid distributor 14 is connected to the first liquid outlet 113 and the second liquid outlet 123 to return the cooling medium from the first inner channel 111 and the second inner channel 121.

[0029] The first liquid cooling plate 11 is the part of the heat dissipation device responsible for dissipating heat from the chip. The cooling medium can circulate in the first inner channel 111 of the first liquid cooling plate 11 and, during circulation, absorb the heat transferred to the surface of the first liquid cooling plate 11. During circulation, the cooling medium can enter through the first liquid inlet opening 112 and, after absorbing heat, flow out through the first liquid outlet opening 113.

[0030] The second liquid cooling plate 12 is the part of the heat dissipation device responsible for dissipating heat from the optical module. The cooling medium can circulate in the second inner channel 121 of the second liquid cooling plate 12 and, during circulation, absorb the heat transferred to the surface of the second liquid cooling plate 12. During circulation, the cooling medium can enter through the second liquid inlet opening 122 and, after absorbing the heat, flow out through the second liquid outlet opening 123.

[0031] The first liquid distributor 13 and the second liquid distributor 14 each perform a flow-division function at the coolant inlet and outlet ends. After entering the interior of the first liquid distributor 13, the coolant can flow from one end of the distributor 13 to the first liquid cooling plate 11 and the second liquid cooling plate 12, respectively. This results in a parallel connection of the liquid cooling plates in the circulation loop, thereby reducing the flow resistance of the system. The coolant circulating in the first liquid cooling plate 11 and the second liquid cooling plate 12 can enter the interior of the second liquid distributor 14 from one end and finally flow out of the device. Fluorinated liquids, deionized water, or propylene glycol-aqueous solutions can be used as the coolant.

[0032] In the heat dissipation device provided by certain embodiments of the present application, the first liquid cooling plate 11 and the second liquid cooling plate 12 are provided for the heat-generating components in the communication device, wherein the first liquid cooling plate 11 dissipates heat from the chip, while the second liquid cooling plate 12 dissipates heat from the optical module. The cooling medium circulating in the first liquid cooling plate 11 and the second liquid cooling plate 12 can be supplied via the first liquid distributor 13 and discharged together via the second liquid distributor 14. The liquid cooling and heat dissipation configuration, in which liquid cooling plates are provided, increases the heat dissipation capacity for the heat-generating components.

[0033] In practice, the internal flow channels of the first liquid cooling plate 11 and the second liquid cooling plate 12 can have simple serpentine or parallel flow channel layouts, which can be manufactured using CNC (Computer Numerical Control) machining. To increase the heat exchange coefficients of the liquid cooling plates, the internal channels can also be formed using a tooth cutting process.

[0034] In certain embodiments, such as in the Fig. 3 and Fig. As shown in Figure 14, the heat dissipation device can further comprise a third liquid distributor 15, several second liquid cooling plates 12 are provided, the third liquid distributor 15 is provided with a liquid inlet chamber 151 and a liquid return chamber 152, which are insulated from each other, the liquid inlet chamber 151 connects one end of the first liquid distributor 13 to the second liquid inlet openings 122 of the several second liquid cooling plates 12, the liquid return chamber 152 connects one end of the second liquid distributor 14 to the second liquid outlet openings 123 of the several second liquid cooling plates 12.

[0035] The multiple secondary liquid cooling plates 12 can dissipate heat from multiple optical modules. The cooling medium circulating in the multiple secondary liquid cooling plates 12 can be supplied via the third liquid distributor 15. The third liquid distributor 15 is located near the multiple secondary liquid cooling plates 12. The third liquid distributor 15 is divided into two chambers: one for liquid inlet and one for liquid return. The two chambers are separated from each other, primarily to distribute and combine the cooling medium for the multiple secondary liquid cooling plates 12.

[0036] The liquid inlet chamber 151 of the third liquid distributor 15 can receive the cooling medium transferred from the first liquid distributor 13 and, via the connection between the liquid inlet chamber 151 and the second liquid inlet openings 122 of the multiple second liquid cooling plates 12, supply each second liquid cooling plate 12 with cooling medium. After the cooling medium has flowed through the second inner channels 121 in the second liquid cooling plates 12, the liquid return chamber 152 can receive the heat-absorbing cooling medium through the connection between the second liquid outlet openings 123 and the liquid return chamber 152 of the third liquid distributor 15. This finally flows out via the second liquid distributor 14.

[0037] The inclusion of the third liquid distributor 15 facilitates the supply of liquid to the multiple secondary liquid cooling plates 12, and the flow distribution through the third liquid distributor 15 ensures uniform heat dissipation for multiple optical modules. To further enhance temperature uniformity among the individual optical modules, the flow resistance of the branches, specifically the flow resistance of the secondary liquid cooling plates 12, can be increased. This increased branch flow resistance facilitates a uniform flow distribution through the third liquid distributor 15. The use of different liquid distributors allows for the parallel connection of liquid cooling plates of the individual levels in the circulation loop, resulting in a simplified layout and reduced system flow resistance.The number of second liquid cooling plates 12 can be three, four, five, six, seven or eight.

[0038] Additionally, the multiple second liquid cooling plates 12 can be arranged in series. This means that the cooling medium circulating in a second liquid cooling plate 12 can originate from other second liquid cooling plates 12, with only a portion of the multiple second liquid cooling plates 12 being connected at interfaces to the third liquid distributor 15.

[0039] As in Fig. As shown in Figure 17, the heat dissipation device may in certain embodiments further comprise a third liquid distributor 15, several second liquid cooling plates 12 are provided, wherein the second inner channels 121 of the several second liquid cooling plates 12 are connected in series to form a flow channel, the third liquid distributor 15 is provided with a liquid inlet chamber 151 and a liquid return chamber 152 which are insulated from each other, wherein the liquid inlet chamber 151 connects one end of the first liquid distributor 13 with one end of the flow channel, while the liquid return chamber 152 connects one end of the second liquid distributor 14 with the other end of the flow channel.

[0040] The respective second inner channels 121 of the second liquid cooling plates 12 can be interconnected via metal tubes 16, forming a flow channel comprising several second inner channels 121. One end of the flow channel receives the cooling medium distributed through the liquid inlet chamber 151, while the other end of the flow channel returns the cooling medium to the liquid return chamber 152. This reduces the number of lines between the second liquid cooling plates 12 and the third liquid distributor 15 and simplifies the connection structure.

[0041] In certain embodiments, such as in Fig. As shown in Figure 17, several flow channels can be provided, with one end of each flow channel being connected to the liquid inlet chamber 151, while the other end of each flow channel is connected to the liquid return chamber 152.

[0042] This means that the multiple second liquid cooling plates 12 are connected in a configuration consisting of a series connection followed by a parallel connection. This allows the cooling medium flowing into each flow channel to circulate in a smaller number of second liquid cooling plates 12, and ensures a heat dissipation capacity for each second liquid cooling plate 12 for the respective corresponding optical module. As shown in Fig. As shown in Figure 17, two second liquid cooling plates 12 are connected in series via a metal tube 16, the metal tube 16 being arranged in a U-shape. The two second liquid cooling plates 12 form a group that is connected in parallel to the third liquid distributor 15. The metal tube 16 can be made of copper tubing or corrugated metal tubing and is welded to the second liquid inlet 122 and the second liquid outlet 123 of the second liquid cooling plates 12.

[0043] For liquid cooling and heat dissipation of "belly-to-belly" stacked optical modules, the [materials / components] in the Fig. 1 and Fig. The liquid cooling assemblies for optical modules shown in Figure 2 are provided. The upper and lower two layers of liquid cooling assemblies for optical modules are arranged symmetrically across the printed circuit board (PCB). During insertion and removal of the optical modules, heat is dissipated by the cooling medium within the second liquid cooling plate 12.

[0044] Furthermore, the first liquid distributor 13 comprises a chamber with one inlet and three outlets. The second liquid distributor 14 comprises a chamber with three inlets and one outlet. Quick-release couplings for liquid cooling are attached to the liquid inlet opening 132 of the first liquid distributor 13 and the liquid outlet opening of the second liquid distributor 14. The three liquid distribution openings 133 of the first liquid distributor 13 supply liquid to two liquid cooling assemblies for the optical module and the first liquid cooling plate 11. The three liquid return openings of the second liquid distributor 14 return the cooling liquid from the two liquid cooling assemblies for the optical module and the first liquid cooling plate 11.Connections with barbs 18 for connecting hoses are welded to the liquid distribution openings 133 of the first liquid distributor 13 and the liquid return openings of the second liquid distributor 14. The materials of the first liquid distributor 13 and the second liquid distributor 14 can be copper or stainless steel. To ensure uniform liquid distribution, adjustments can be made to the system flow resistance of the liquid cooling assemblies for the optical module and to the flow resistance of the first liquid cooling plate 11, or the opening diameters of the three liquid distribution openings of the first liquid distributor 13 can be optimized.

[0045] The cooling medium flows via a liquid cooling connection into the first liquid distributor 13 and supplies liquid to two third liquid distributors 15 and a first liquid cooling plate 11. The third liquid distributor 15 supplies the upper and lower two layers of the second cooling plates with liquid via capillary tubes 17. The liquid then flows through the third liquid distributor 15 to collect before finally returning to the second liquid distributor 14.

[0046] Additionally, the heat dissipation of the optical module can utilize a combination of liquid cooling plates and capillary tubes 17, the flexibility of the capillary tubes 17 being designed to allow the liquid cooling plate to float. This compensates for structural gaps when inserting and removing the optical module. As shown in Fig. As shown in Figure 11, the seal is achieved by a press fit of the capillary tubes 17 with the barbed connections of the second liquid cooling plate 12. Locking is achieved by sleeves. The material of the capillary tubes 17 is PTFE (polytetrafluoroethylene). To facilitate disassembly, the capillary tubes 17 can be separated, as shown in the Fig. Figures 10 to 12 show that the third liquid distributor 15 is connected to the capillary tubes 17 via a flange 155. Sleeves 171 are connected to the capillary tubes 17. Corresponding threaded bores 156 are provided at the appropriate location on the flange 155 of the third liquid distributor 15, allowing the end of the sleeve 171 to engage with the threaded bore 156. The end face of the flange 155 is sealed with an O-ring 157.

[0047] As in the Fig. 3 and Fig. As shown in Figure 14, the third liquid distributor 15 can be provided with a liquid inlet port 153 connected to the liquid inlet chamber 151 and a liquid outlet port 154 connected to the liquid return chamber 152, wherein the liquid inlet port 153 is further connected to an end of the first liquid distributor 13, and the liquid outlet port 154 is further connected to an end of the second liquid distributor 14, wherein the liquid inlet port 153 and the liquid outlet port 154 are located on the same side of the third liquid distributor 15.

[0048] The liquid inlet port 153 is connected via the liquid inlet line 131 to the liquid distribution opening of the first liquid distributor 13, while the liquid outlet port 154 is connected via the liquid return line 141 to the liquid return opening of the second liquid distributor 14. By arranging the liquid inlet port 153 and the liquid outlet port 154 on the same side of the third liquid distributor 15, a simplified connection of the liquid inlet and outlet hoses is ensured. The material of the third liquid distributor 15 can be copper or stainless steel and is integrally welded with the barbed connections for connecting to the hoses.

[0049] In certain embodiments, 12 positioning stages 124 can be arranged on opposite lateral edges of the second liquid cooling plate.

[0050] The second liquid cooling plate 12 can be attached to the upper frame of an optical cage 21 by means of an elastic mounting bracket 23. The positioning steps 124, arranged on both sides of the second liquid cooling plate 12, can be positioned using the elastic mounting bracket 23. The elastic mounting bracket 23 is positioned in the forward-backward direction of movement of the positioning steps 124, thus preventing the second liquid cooling plate 12 from moving forward-backward when the optical module is inserted and removed. As shown in Fig. As shown in Figure 5, the position of the second liquid cooling plate 12 and the light guide column 22 above the optical cage 21 is avoided.

[0051] Additionally, as in Fig. Figure 9 shows that the surface edge of the second liquid cooling plate 12 adjacent to the optical module is provided with a guide ramp 125, and the guide ramp 125 is located on the side of the second liquid cooling plate 12 facing away from the third liquid distributor 15.

[0052] The front end of the base surface of the second liquid cooling plate 12 is provided with an incline to guide the insertion and removal of the optical module.

[0053] In practice, a PI (polyimide) film 126 can be glued onto the contact surface between the second liquid cooling plate 12 and the optical module, effectively reducing the contact thermal resistance between an encapsulation housing of the optical module and the second liquid cooling plate 12.

[0054] In certain embodiments, several first inner channels 111 of the first liquid cooling plate 11 can be provided, one end of the several first inner channels 111 is connected to the first liquid inlet opening 112, while the other end of the several first inner channels 111 is connected to the first liquid outlet opening 113.

[0055] The interior of the first liquid cooling plate 11 is designed with a flow-splitting configuration, forming several first inner channels 111, which reduces flow resistance. The inner flow channels of the first liquid cooling plate 11 can be formed using a milling process.

[0056] As in Fig.As shown in Figure 21, the first liquid cooling plate 11 can comprise a support plate 101, a substrate plate 102 and a cover plate 103, the support plate 101 being provided with a cavity area 1011, wherein the substrate plate 102 is connected to one side of the cavity area 1011 and the cover plate 103 covers the other side of the cavity area, wherein the substrate plate 102 being provided with the first inner channel 111, wherein the first liquid inlet opening 112 and the first liquid outlet opening 113 are arranged on the support plate 101.

[0057] Heat is dissipated from the chip by the first liquid cooling plate 11; unlike conventional split liquid cooling plates, the aluminum alloy support frame is integrated with the cover plate 103 into the first liquid cooling plate 11. This not only simplifies installation and maintenance but also optimizes the structure of the liquid cooling plate and reduces weight. The inlet and outlet of the first liquid cooling plate 11 are located on both sides of the support plate 101, effectively reducing the overall height of the first liquid cooling plate 11, and this design is suitable for switches with a height of 1U (unit, height).

[0058] In practice, the first liquid cooling plate 11 can be manufactured by vacuum brazing the cover plate 103, the barbed connectors 18, the substrate plate 102, and the support plate 101. The cooling plate is made of copper or aluminum with good thermal conductivity, the specific choice being based on compatibility with the liquid cooling medium. The substrate plate 102 features an ultra-thin design, with a thickness ranging from 1.0 mm to 2.0 mm, effectively reducing thermal resistance and increasing the heat exchange performance of the first liquid cooling plate 11.

[0059] The support plate 101 can be provided with reinforcing ribs 104 to ensure the compressive strength of the first liquid cooling plate 11. Main liquid inlet and outlet flow channels are arranged on both sides of the support plate 101 to achieve a uniform temperature distribution of the first liquid cooling plate 11 and simultaneously reduce the flow resistance of the first liquid cooling plate 11.

[0060] Certain embodiments of the present application further provide a communication device comprising a printed circuit board and the aforementioned heat dissipation device. The printed circuit board is provided with a chip and an optical module. The first liquid cooling plate 11 of the heat dissipation device is connected to the printed circuit board and rests against the chip, while the second liquid cooling plate 12 of the heat dissipation device is connected to and rests against the optical module.

[0061] The heat dissipation device enables efficient heat dissipation for the chip and optical module of the communication device, effectively reducing the device temperature, improving the device's operating performance, and ensuring efficient operation.

[0062] The average person skilled in this technical field can understand that the foregoing embodiments represent specific embodiments of the present application, and that various modifications regarding the form and details can be made to them in practical application without departing from the spirit and scope of the present application.

Claims

[1] A heat dissipation device for dissipating heat from heat-generating components in a communication device, characterized by that the heat dissipation device includes a first liquid cooling plate designed to be in contact with a chip, the first liquid cooling plate comprising a first inner channel for flow of cooling medium to remove surface heat, and a first liquid inlet opening and a first liquid outlet opening connected to the first inner channel; a second liquid cooling plate designed to be positioned against an optical module, the second liquid cooling plate comprising a second inner channel for flow of the cooling medium to remove surface heat, and a second liquid inlet opening and a second liquid outlet opening, each connected to the second inner channel; a first liquid distributor, one end of which is connected to the first liquid inlet opening and the second liquid inlet opening to supply the first inner channel and the second inner channel with the cooling medium; and a second liquid distributor, one end of which is connected to the first liquid outlet and the second liquid outlet to return the cooling medium from the first inner channel and the second inner channel. [2] The heat dissipation device according to claim 1, characterized by, that it further comprises a third liquid distributor, several second liquid cooling plates are provided, the third liquid distributor is provided with a liquid inlet chamber and a liquid return chamber which are insulated from each other, the liquid inlet chamber connects one end of the first liquid distributor to the second liquid inlet openings of the several second liquid cooling plates, the liquid return chamber connects one end of the second liquid distributor to the second liquid outlet openings of the several second liquid cooling plates. [3] Heat dissipation device according to claim 1, characterized by, that it further comprises a third liquid distributor, several second liquid cooling plates are provided, the second inner channels of the several second liquid cooling plates are connected in series to form a flow channel, the third liquid distributor is provided with a liquid inlet chamber and a liquid return chamber which are isolated from each other, the liquid inlet chamber connecting one end of the first liquid distributor to one end of the flow channel, while the liquid return chamber connecting one end of the second liquid distributor to the other end of the flow channel. [4] Heat dissipation device according to claim 3, characterized by, that several flow channels are provided, one end of each of the several flow channels is connected to the liquid inlet chamber, while the other end of each of the several flow channels is connected to the liquid return chamber. [5] Heat dissipation device according to claim 3 or 4, characterized by , that the third liquid distributor is provided with a liquid inlet port connected to the liquid inlet chamber and a liquid outlet port connected to the liquid return chamber, wherein the liquid inlet port is further connected to an end of the first liquid distributor and the liquid outlet port is further connected to an end of the second liquid distributor, wherein the liquid inlet port and the liquid outlet port are located on the same side of the third liquid distributor. [6] Heat dissipation device according to claim 1, characterized by , that positioning steps are arranged on opposite lateral edges of the second liquid cooling plate. [7] Heat dissipation device according to one of claims 2 to 4, characterized by , that the surface edge of the second liquid cooling plate adjacent to the optical module is provided with a guide ramp located on the side of the second liquid cooling plate facing away from the third liquid distributor. [8] Heat dissipation device according to claim 1, characterized by , that several first inner channels are provided, wherein one end of the several first inner channels is connected to the first liquid inlet opening, while the other end of the several first inner channels is connected to the first liquid outlet opening. [9] Heat dissipation device according to claim 8, characterized by, that the first liquid cooling plate comprises a support plate, a substrate plate and a cover plate, wherein the support plate is provided with a cavity area, wherein the substrate plate is connected to one side of the cavity area and the cover plate covers the other side of the cavity area, wherein the substrate plate is provided with the first inner channel, wherein the first liquid inlet opening and the first liquid outlet opening are arranged on the support plate. [10] A communication device, characterized by , that it includes: a circuit board equipped with a chip and an optical module; the heat dissipation device according to one of claims 1 to 9, wherein the first liquid cooling plate of the heat dissipation device is connected to the circuit board and rests against the chip, and the second liquid cooling plate of the heat dissipation device is connected to the optical module and rests against the optical module.

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