High-voltage feedthrough device

Abstract

Device, including: a partition wall; a penetration that passes through the partition wall and is hermetically sealed with the partition wall, wherein the penetration has a main axis; a first wall extending from the partition wall in a first direction along the main axis; and a second wall extending from the partition in a second direction opposite to the first direction along the main axis, the second wall forming a connector interface with the feedthrough; where the ratio of the length of the first wall to the thickness of the first wall is greater than or equal to 3:1.

Description

CROSS-REFERENCE TO RELATED REGISTRATION(S)

[0001] This application claims priority over US patent application No. 18 / 149,107, filed on December 31, 2022, which is hereby incorporated in its entirety and for all purposes by reference into this application. FIELD

[0002] X-ray sources enclose vacuum chambers. Electrical connections to components within the vacuum chamber may include feedthroughs that penetrate the vacuum chamber. To maintain the vacuum within the vacuum chamber, the feedthrough must have a vacuum seal. BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS Fig. Figure 1 is a block diagram of a high-voltage feedthrough device according to some embodiments. Fig. Figure 2 is a block diagram of a high-voltage feedthrough device with a projection according to some embodiments. Fig. Figure 3 is a block diagram of a high-voltage feedthrough device with multiple feedthroughs according to some embodiments. Fig. Figure 4 is a block diagram of a high-voltage feedthrough device having walls of different thicknesses according to some embodiments. Fig. Figure 5 is a block diagram of a high-voltage bushing device with walls having different thicknesses and a projection according to some embodiments. Fig. Figure 6 is a block diagram of a high-voltage feedthrough device that includes a vacuum chamber, according to some embodiments. Fig. Figures 7 to 8 are block diagrams of a high-voltage feedthrough device including a vacuum chamber and various mounting points according to some embodiments. Fig. Figures 9 to 10 are block diagrams of a high-voltage feedthrough device, including a vacuum chamber and wedge structures according to some embodiments. Fig. Figure 11 is a block diagram of a high-voltage feedthrough device which includes a further wedge structure according to some embodiments. Fig. Figure 12 is a block diagram of a high-voltage feedthrough device that includes several wedge structures according to some embodiments. Fig. Figure 13 is a block diagram of an X-ray imaging system according to some embodiments. DETAILED DESCRIPTION

[0003] Embodiments include feedthroughs, and in particular high-voltage feedthroughs for vacuum chambers. Multi-beam X-ray sources include multiple emitters. The multiple emitters utilize multiple electrical connections that are electrically isolated from each other and from the vacuum chamber. Each electrical connection penetrates the vacuum chamber through a feedthrough. Multiple feedthroughs can be combined into a single structure that can be welded to the vacuum chamber. However, welding can introduce temperatures and / or heat transfers that may compromise the integrity of a vacuum seal formed by the feedthroughs, potentially leading to failures and a reduction in the device's service life. As described in more detail below, structures can mitigate the effects of welding, thereby reducing failures and extending the device's service life.

[0004] Fig. Figure 1 is a block diagram of a high-voltage feedthrough device according to some embodiments. In some embodiments, a device 100a includes a membrane or partition 102, a feedthrough 104, a first wall 106, and a second wall 108.

[0005] The partition 102 is a structure configured to accommodate the feedthrough 104. The partition 102 can be made of a vacuum-compatible material such as stainless steel, nickel (Ni), copper (Cu), nickel-iron alloys (Ni-Fe), nickel-cobalt-iron alloys (Ni-Co-Fe), molybdenum (Mo), aluminum (Al), or the like. The partition 102 may have an opening in which the feedthrough 104 is located. The feedthrough 104 penetrates and extends through the partition 102. The feedthrough 104 is hermetically sealed to the partition 102.

[0006] The feedthrough 104 includes an insulator 104a, a conductor 104b, and a solder ring 104c. The insulator 104a can be a vacuum-compatible, electrically insulating material such as ceramic, including machinable ceramic, aluminum oxide (Al₂O₃), steatite (including talc or talc, consisting of hydrated magnesium silicate Mg:Si₄O₂). 10The conductor 104b includes an electrically conductive material such as copper, steel (including stainless steel), aluminum, an iron-nickel-cobalt alloy (e.g., KOVAR), a nickel-iron alloy, or the like. The solder ring 104c is hermetically connected to the insulator 104a. The solder ring 104c may include any solder alloy suitable for joining the partition to the insulator, such as a silver-copper alloy (Ag-Cu) (e.g., CuSil), copper, a silver-copper-indium alloy (Ag-Cu-In) (e.g., InCuSil), or the like. The solder ring 104c is hermetically sealed to the partition 102 and the insulator 104a. For example, the solder ring 104c can be hard-soldered to the partition 102. The bushing 104 has a main axis that runs parallel to the conductor 104b. In this example, the main axis runs parallel to the X-axis. The conductor 104b can be hermetically sealed with the insulator 104a.

[0007] The first wall 106 extends from the partition wall 102 in a first direction along the main axis or X-axis. In this example, the first wall 106 extends from the partition wall 102 in the negative X-direction.

[0008] The second wall 108 extends from the partition wall 102 in a second direction, opposite to the first direction along the main axis. In this example, the second wall 108 extends from the partition wall 102 in the positive X-direction.

[0009] The first wall 106 and the second wall 108 can be made of the same or similar materials as the partition wall 102. The partition wall 102, the first wall 106, and the second wall 108 can be integrated as a single unit.

[0010] In some embodiments, the second wall 108 and the feedthrough 104 form a connector interface. For example, the conductor 104b and the insulator 104a can extend from the partition wall 102 in the positive X-direction. The conductor 104b can form the pins of a connector. The second wall 108 can form a housing for the connector. The opening between the feedthrough 104 and the second wall 108 can be configured to accommodate a receptacle. While a connector was used as an example of a connector interface formed by the second wall 108 and the feedthrough 104, the connector interface in other embodiments can take different forms. For example, the connector interface can form a receptacle. The conductor 104b can enclose a female contact configured to connect to a male contact of a connector.

[0011] In some embodiments, the ratio of the length 110 of the first wall 106 to the thickness 112 of the first wall 106 is greater than or equal to 3:1 or 5:1. In some embodiments, the thickness 112 is approximately 1 millimeter (mm) to approximately 3 mm. The length 110 can be greater than approximately 5 mm to approximately 10 mm. In some embodiments, the length 110 is the distance from the partition 102 to the end of the first wall 106. However, as described in more detail below in other embodiments, other structures can also be arranged between the first wall 106 and the partition 102. The length 110 can be the distance from this structure to the end of the first wall 106. In some embodiments, the thickness 112 of the first wall 106 can be greater than the thickness 114 of the partition wall 102. In some embodiments, the partition wall 102 has a thickness 114 of about 1 millimeter (mm) to about 3 mm.With a thickness of 114, the partition 102 can be thin enough to be easily soldered to the bushings 104, yet thick enough to withstand a vacuum and prevent leakage through the partition 102. A partition 102 that is too thick can lead to mismatches in the coefficient of thermal expansion (CTE) at the interface between the insulator 104a and the partition 102 via the solder ring 104c, rendering the soldered joint unreliable as a vacuum seal. A partition 102 that is thinner than the first wall 106 or the second wall 108 can deform during welding or due to the pressure difference between the internal vacuum and the external pressure.

[0012] The structure of the first wall 106 can protect the connection between the partition 102 and the feedthrough 104. For example, the feedthrough 104 can be soldered to the partition 102. As described in more detail below, the first wall 106 can be brazed to a housing, such as the vacuum chamber 140, at temperatures of approximately 1500 degrees Celsius (°C) or higher (for typical vacuum chamber and wall materials). Fig. 6 to 8 and 12), are welded. When the weld is formed, heat can be conducted from the weld to the brazed joint between the partition 102 and the bushing 104. This brazed joint may have been formed at a temperature between approximately 600 °C and approximately 900 °C. The heat from the weld can weaken the brazed joint and / or cause deformation of the partition 102. Such stress can cause the hermetic seal at the interface between the bushing 104 and the partition 102 to fail.

[0013] In one particular example, heat transferred to partition 102 can cause it to expand. This expansion can lead to failure of the interface with bushing 104. The additional heat can also weaken or cause failure of a soldered joint between partition 102 and bushing 104. In another example, if heat is applied to vacuum chamber 140 during welding, it can expand. If this expansion is transferred to partition 102, the interface with bushing 104 can also fail. Modifications to the welding process may not reduce these stresses.For example, slower and more controlled welding, welding small sections and allowing these sections to cool, laser welding, heat dissipation with a heat sink, or similar methods may not sufficiently prevent stresses. The interface may still fail, or the failure rate may be too high, especially if multiple bushings 104 are used for a partition 102.

[0014] However, a modified structure of the first wall 106 can sufficiently reduce the failure rate. For example, the aspect ratio of the first wall 106 can increase the thermal resistance between the weld and the partition 102. That is, the relatively thinner first wall 106 conducts less heat during welding, thereby reducing failures due to the thermal stress exerted on the partition 102.

[0015] Furthermore, the movement of the vacuum chamber 140 due to expansion during the welding process can be absorbed or contained by the first wall 106. Welding on the first wall 106 can occur at a point along the first wall 106 that is offset from the partition 102, for example, at a distal end 144 of the first wall 106. A significant portion of this offset runs parallel to a plane of the partition 102 and the feedthrough 104. The expansion caused by welding in the YZ plane can lead to deformation of the first wall 106. The partition 102 will be at least partially isolated from the stress. At least part of the expansion is absorbed by the deformation of the first wall 106, so less deformation or stress is transferred to the partition 102. This reduction in stress can significantly reduce or eliminate the failure rate of the device 100a after welding.

[0016] The relatively thin first wall 106 can also simplify manufacturing. For example, the relatively thin first wall 106 would require less power to weld it to a vacuum chamber 140. The reduced power would result in less heat and correspondingly less stress on the partition wall 102.

[0017] In some embodiments, the minimum wall thickness 112 can be large enough that diffusion through the wall does not impair the vacuum throughout the lifetime of the device 100a. The thickness of the first wall 106 can be selected based on a range between a minimum thickness that still prevents sufficient diffusion to maintain a vacuum and a maximum thickness that still adequately limits heat transfer to the partition 102 and the feedthrough 104, which could impair the connection between the partition 102 and the feedthrough 104. The minimum thickness can also depend on the desired structural stiffness, expected shocks, or similar factors. For example, the device 100a may extend outwards from a vacuum chamber 140, where it may be subjected to shocks during normal use.The minimum thickness can be that at which the force of an expected impact does not deform the first wall 106 to such an extent that operation is significantly impaired. In some embodiments, the minimum thickness can be approximately 1 millimeter (mm).

[0018] Although a solder ring 104c was used as an example of a structure with which the insulator 104a is attached to the partition 102, the insulator 104a can be attached to the partition 102 in other embodiments using techniques other than soldering that are vacuum compatible, such as welding, epoxy resin or the like.

[0019] In some embodiments, the insulator 104a of the bushing can extend a length 115 from the partition 102. This allows the conductor 104b and the partition 102 to be separated by a distance to prevent or reduce arcing between the conductor 104b and the partition 102. For example, the distance may be sufficient to reduce the probability of arcing at a voltage difference of 1 kilovolt (kV) to 3 kV or more between adjacent structures.

[0020] In some embodiments, the length of the second wall 108 on the outside 140b (air side or non-vacuum side) exceeds the length of the feedthroughs 104, in particular of the conductor 104b, on the outside 140b in order to protect the feedthroughs 104 from accidental contacts, impacts or the like that could bend the conductor 104b or break the insulator 104a.

[0021] Fig. Figure 2 is a block diagram of a high-voltage bushing device with a projection according to some embodiments. In some embodiments, the device 100b may be similar to the device 100a or the like. However, the device 100b includes a projection 120. The projection 120 is arranged within the first wall 106 and coupled to the first wall 106 and the partition 102. The projection may have a thickness 116 that is at least twice the thickness 112 of the first wall 106.

[0022] The projection 120 can provide additional structural stability to the partition 102. The projection 120 can provide additional stiffness to the partition 102. The projection 120 can be continuous along the first wall 106. In other embodiments, however, the projection 120 can include interrupted structures such as ribs along the first wall 106. As in Fig. As shown in Figure 5, the projection 120 is rectangular. In other embodiments, the projection may have a chamfer, a bevel, a rounding (concave function), a rounding (convex function), or the like.

[0023] In some embodiments, the structural stability provided by the projection 120 may be opposed to the flexibility provided by the first wall 106. While the first wall 106 may be sufficiently thin to allow bending in the YZ plane, this bending at the projection 120 may be significantly reduced or eliminated. Thus, the bending of the first wall 106 may not be transmitted to the partition 102 and the connection between the partition 102 and the feedthrough 104.

[0024] In some embodiments, the projection 120 can be arranged on one side of the partition 102 opposite the first wall 106, as illustrated by the projection 120'. In other embodiments, both the projection 120 and the projection 120' can be coupled to the partition 102.

[0025] In some embodiments, the length 110 of the first wall 106 can extend from a projection 120. The aspect ratio of the length 110 from the projection 120 to the thickness 112 of the first wall 106 can be greater than 3:1 or 5:1.

[0026] Fig. Figure 3 is a block diagram of a high-voltage bushing device with multiple bushings according to some embodiments. In some embodiments, the device 100c may be similar to devices 100a-b or the like. However, the device 100c includes multiple bushings 104. Here, two bushings 104-1 and 104-2 are illustrated; however, any number of bushings 104 greater than one may be present. Each of the bushings 104 may be similar to the bushings 104 described above and may be attached to the partition 102 in a similar manner. In some embodiments, the number of bushings 104 may be greater than 5, 10, 15, 20, 50, 100, or more.

[0027] Adding more bushings 104 can make the partition 102 structurally less stable. With a larger number of bushings 104, the partition 102 inevitably has more openings, which may be larger and include multiple rows and / or columns of bushings 104. The bushings 104 may be spaced apart to prevent or reduce the probability of arcing between the bushings 104 and the first wall 106 and / or the second wall 108. For example, the spacing may be sufficient to reduce the probability of arcing at a voltage difference of 1 kV to 3 kV or more between adjacent structures. Furthermore, the presence of multiple bushings 104 increases the number of potential failure points.Accordingly, a device 100c with multiple feedthroughs 104 may have a greater need for the advantages of the first wall 106, the projection 120, the spacings, the thickness, the ratios or the like described herein than a device with only one feedthrough 104.

[0028] Fig. Figure 4 is a block diagram of a high-voltage bushing device having walls of different thicknesses according to some embodiments. In some embodiments, the device 100d may be similar to devices 100a-c or the like. However, the device 100d may include both a first wall 106, in which the ratio of the length 110 of the first wall 106 to the thickness 112 of the first wall 106 is greater than or equal to 3:1 or 5:1, and a second wall 108 with a thickness 122 that is greater than the thickness 112 of the first wall 106. In one particular example, the thickness 112 of the first wall 106 may be about 1 mm and the thickness 122 of the second wall 108 may be about 2 mm or more.

[0029] In some embodiments, as described above, the second wall 108 and the feedthrough 104 can form a connector interface. The thickness, shape, length, or the like of the second wall 108 can be greater in the areas that form the connector interface.

[0030] Fig. Figure 5 is a block diagram of a high-voltage bushing device with walls of different thicknesses and a projection according to some embodiments. In some embodiments, the device 100e may be similar to devices 100a-d or the like. However, device 100e includes a projection 120 similar to that of device 100b. The thickness 116 of the projection 120 may be similar to or different from the thickness 122 of the second wall 108. As illustrated, the thickness 122 is less than the thickness 116; however, in other embodiments, the thickness 122 may be greater.

[0031] Fig. Figure 6 is a block diagram of a high-voltage feedthrough device that includes a vacuum chamber, according to some embodiments. In some embodiments, a device 100f may include structures similar to devices 100a-e or the like. By way of example, structures similar to device 100a are included; however, in other embodiments, other structures may also be included.

[0032] In some embodiments, the device 100f includes a vacuum chamber 140. Only a section of the vacuum chamber 140 is illustrated for clarity. The vacuum chamber 140 separates an inner surface 140a, containing the vacuum, from the outer surface 140b.

[0033] The vacuum chamber 140 closes an opening 140'. The first wall 106 is arranged in the opening 140'. In some embodiments, the first wall 106 is welded to the vacuum chamber 140 at the opening 140'. The first wall 106 can be welded to the vacuum chamber 140 substantially at a distal end 144 of the first wall 106. The first wall 106 can extend through the opening 140' to such an extent that it can be welded to the vacuum chamber 140. Since the weld seam 142 is located at the distal end 144 of the first wall 106, the associated welding process can be offset relative to the partition 102.

[0034] The weld 142 can be located on the inner side 140a of the vacuum chamber 140. In other embodiments, however, the weld 142 can be located on the outer side 140b of the vacuum chamber 140. The weld 142' indicates the location of this weld on the outer side 140b. The weld 142 or 142' can be located at a point along the first wall 106 that is a length 110' away from the partition 102. The length 110' can be such that the aspect ratio of the length 110' to the thickness 112 of the first wall 106 is greater than 3:1 or 5:1. That is, the first wall 106 can be longer than the length 110' and thus have an even larger aspect ratio. However, the length 110' of the section of the first wall 106 from the weld 142 or 142' to the partition wall still meets a minimum aspect ratio of 3:1 or 5:1.

[0035] In some embodiments, the thermal resistance of the vacuum chamber 140 at the opening 140' can be lower than that of the first wall 106. For example, the thickness 143 of the vacuum chamber 140 at the opening 140' can be greater than the thickness 112 of the first wall 106. As a result, more heat can be dissipated from the weld 142 into the walls of the vacuum chamber 140 than into the first wall 106. This difference in thermal resistance can further reduce the probability of failure, since more heat is dissipated from the weld 142 and from the partition 106.

[0036] While welding was used as an example of a technique for attaching the first wall 106 to the vacuum chamber 140, other techniques can be used in other embodiments. For example, the first wall 106 can be brazed to the vacuum chamber 140. Traditionally, brazing is used earlier in the manufacturing process and heats the entire assembly, whereas welding is used later in the manufacturing process and heats parts of the assembly to join the components together.

[0037] Fig. Figures 7 to 8 are block diagrams of a high-voltage feedthrough device including a vacuum chamber and various mounting points according to some embodiments. Referring to Fig. 7. In some embodiments, the device 100g may be similar to the device 100f or the like and may include structures similar to the devices 100a-e or the like, with the device 100a serving as an example. However, the weld 142, at which the vacuum chamber 140 is welded to the first wall, is offset from the distal end 144 of the first wall 106. The length 110' from the near side of the weld 142 to the partition 102 may be such that the aspect ratio of the length 110' to the thickness 112 of the first wall 106 is greater than 3:1 or 5:1. Similarly, if the projection 120 is present, the length 110' to the projection 120 may be long enough to meet or exceed the aspect ratio.

[0038] Referring to Fig. 8. In some embodiments, the device 100h may be similar to devices 100f-g or the like and may include structures similar to devices 100a-e or the like, using device 100a as an example. However, the second wall 108 is arranged on the inner side 140a of the vacuum chamber 140. The first wall 106 may still be attached to the vacuum chamber 140. The length 110' may extend from the partition 102 to the vacuum chamber 140 if the weld 142 is located on the opposite side of the vacuum chamber 140. The first wall 106 may be of sufficient length so that the length 110' still satisfies a minimum aspect ratio of 3:1 or 5:1, as described above.

[0039] Fig. Figures 9 to 10 are block diagrams of a high-voltage feedthrough device, including a vacuum chamber and wedge structures according to some embodiments. Fig. Figure 9 shows a view of the penetrations 104 and the first wall 106, which show wedge structures. Fig. Figure 10 is a view of vacuum chamber 140 and opening 140', showing the corresponding wedge structures. Referring to the Fig. 9 and Fig. 10. In some embodiments, the device 100i may be similar to devices 100f-g or the like. However, the first wall 106 encloses a wedge structure. In this example, the first wall 106 has a first end 150 with rounded edges. A second end 152 encloses square edges.

[0040] The opening 140' of the vacuum chamber 140 encloses matching wedge structures. The first end 160 of the opening 140' includes rounded edges, and the second end 162 includes angular edges that correspond to the similar features of the first wall 106. The wedge structures of the first wall 106 and the opening 140' are complementary, so the first wall 106 can only be inserted into the opening 140' in one orientation.

[0041] In some embodiments, the only orientation may be related to the side of the vacuum chamber 140 from which the first wall 106 is inserted. For example, the first wall 106 may be designed to be inserted from an outer side 140b of the vacuum chamber 140 in only one orientation. While the first wall 106 can be inserted from the inner side 140a, the first wall 106 can only be inserted from the outer side 140b of the vacuum chamber 140 in one orientation.

[0042] In other embodiments, the wedge structures of the first wall 106 and the opening 140' can prevent insertion in only one orientation, regardless of the insertion direction. For example, the edges 150' and 160' of the first wall 106 and the opening 140', respectively, can ensure that the first wall 106 can only be inserted in one orientation, regardless of which side of the vacuum chamber 140 the insertion is attempted from.

[0043] Fig. Figure 11 is a block diagram of a high-voltage feedthrough device that includes a further wedge structure according to some embodiments. In some embodiments, the device 100j may be similar to the device 100a-i or the like. However, the device 100j includes a second wall 108 having a wedge structure. The wedge structure allows the insertion of a connector in only one orientation.

[0044] Fig. Figure 12 is a block diagram of a high-voltage feedthrough device that includes several wedge structures according to some embodiments. In some embodiments, the wedge structure of the second wall 108 of the device 100j can be used with the wedge structures of the first wall 106 and the opening 140' of the device 100i. The combination of the wedge structures results in a predetermined physical location for the feedthroughs 104. In the inner surface 140a, within the vacuum chamber 140, electrical connections are made to various devices. Here, a grid 170 and an emitter 172 are used as examples of such devices. Another such device (not shown) can be a focusing diaphragm. In another embodiment (not shown), the feedthroughs 104 can provide multiple connections to grids, emitters, and / or focusing diaphragms.

[0045] In some embodiments, the grid 170 and the emitter 172 are arranged at predetermined locations within the vacuum chamber 140. The electrical connections 174-1 and 174-2 electrically connect the grid 170 and the emitter 172 to the corresponding feedthroughs 104-1 and 104-2. Due to the wedge structures of the first wall 106 and the opening 140', the physical location of feedthrough 104-1 corresponds to the physical location of the grid 170, and the physical location of feedthrough 104-2 corresponds to the physical location of the emitter 172.

[0046] In other embodiments, the grid 170 and the emitter 172 may not be located at predetermined positions. However, the predetermined positions of the feedthroughs 104 still correspond to the devices. That is, the physical position of feedthrough 104-1 corresponds to the electrical connection 174-1, which is connected to the grid 170, and the physical position of feedthrough 104-2 corresponds to the electrical connection 174-2, which is connected to the emitter 172.

[0047] Due to the wedge structure of the second wall 108, a connector 176 can only be used in one orientation. The connector 176 includes contacts 178-1 and 178-2. Contacts 178-1 and 178-2 will only be in contact with the feedthroughs 104-1 and 104-2, respectively. The wire 180-1 of the cable 182 is electrically connected to the grid 170, and the wire 180-2 of the cable 182 is electrically connected to the emitter 172 in the only orientation permitted by the wedge structures of the first wall 106, the opening 140', and the second wall 108.

[0048] Fig.Figure 13 is a block diagram of an X-ray imaging system according to some embodiments. The X-ray imaging system 1300 includes an X-ray source 1302 and a detector 1310. The X-ray source 1302 may include a device 100 or the like, as described above. The X-ray source 1302 is arranged relative to the detector 1310 such that X-rays 1320 can be generated, which pass through a test object 1322 and are detected by the detector 1310. In some embodiments, the detector 1310 is part of a medical imaging system. In other embodiments, the X-ray imaging system 1300 may include a security or industrial scanning system as part of a baggage scanning system or a parts inspection system. The system 1300 can be any system that can include an X-ray detector.

[0049] Some embodiments include a device 100, 100a-100k comprising: a partition 102; a feedthrough 104 penetrating the partition 102 and hermetically sealed with the partition 102, the feedthrough 104 having a principal axis; a first wall 106 extending from the partition 102 in a first direction along the principal axis; and a second wall 108 extending from the partition 102 in a second direction opposite to the first direction along the principal axis, the second wall 108 forming a connector interface with the feedthrough 104; wherein the ratio of the length of the first wall 106 to the thickness of the first wall 106 is greater than or equal to 3:1.

[0050] In some embodiments, the thickness of the second wall 108 is greater than the thickness of the first wall 106.

[0051] In some embodiments, the device 100, 100a-100k further comprises a projection 120 which is arranged within the first wall 106 and coupled to the first wall 106 and the partition 102.

[0052] In some embodiments, the thickness of the projection 120 is at least twice as large as the thickness of the first wall 106.

[0053] In some embodiments, the device 100, 100a-100k further comprises a vacuum chamber 140 having an opening 140'; wherein the first wall 106 is arranged in the opening 140'.

[0054] In some embodiments, the first wall 106 is welded to the vacuum chamber 140 at a distal end of the first wall 106.

[0055] In some embodiments, the first wall 106 encloses a first wedge structure; the opening 140' encloses a second wedge structure; and the first wedge structure and the second wedge structure are complementary, so that the first wall 106 can only be inserted into the opening 140' in one orientation.

[0056] In some embodiments, the second wall 108 encloses a third wedge structure.

[0057] In some embodiments, the thickness of the first wall 106 is approximately 1 millimeter (mm) to approximately 3 mm.

[0058] In some embodiments, the feedthrough 104 is one of a plurality of feedthroughs 104 that penetrate the partition 102 and are hermetically sealed with the partition 102.

[0059] Some embodiments include a device 100, 100a-100k, comprising: a partition 102; a passage 104 penetrating the partition 102 and hermetically sealed with the partition 102, the passage 104 having a principal axis; a first wall 106 extending from the partition 102 in a first direction along the principal axis; and a second wall 108 extending from the partition 102 in a second direction opposite to the first direction along the principal axis; wherein: the ratio of the length of the first wall 106 to the thickness of the first wall 106 is greater than or equal to 3:1; and the first wall 106 includes a first wedge structure.

[0060] In some embodiments, the second wall 108 forms a connector interface with the feedthrough 104.

[0061] In some embodiments, the device 100, 100a-100k further comprises a projection 120 which is arranged within the first wall 106 and coupled to the first wall 106 and the partition 102.

[0062] In some embodiments, the thickness of the second wall 108 is at least twice as large as the thickness of the first wall 106.

[0063] In some embodiments, the device 100, 100a-100k further comprises a vacuum chamber 140 having an opening 140', wherein the first wall 106 is welded to the vacuum chamber 140 at the opening 140'.

[0064] In some embodiments, the opening 140' encloses a second wedge structure; and the first wedge structure and the second wedge structure are complementary, so that the first wall 106 can only be inserted into the opening 140' in one orientation.

[0065] In some embodiments, the second wall 108 encloses a third wedge structure.

[0066] In some embodiments, the thickness of the first wall 106 is approximately 1 millimeter (mm) to approximately 3 mm.

[0067] Some embodiments include a device comprising: means for maintaining an electrical connection; means for hermetically sealing the electrical connection through the means for maintaining the electrical connection; means for maintaining a vacuum; and means for hermetically connecting the means for maintaining the electrical connection to the means for maintaining the vacuum, including means for limiting the transmission of thermal and mechanical stresses from the means for maintaining the vacuum to the means for maintaining the electrical connection.

[0068] Examples of means for maintaining an electrical connection include the partition 102 or the like.

[0069] Examples of means for hermetically sealing the electrical connection through the means for maintaining the electrical connection include feedthrough 104 or the like.

[0070] Examples of means for maintaining a vacuum include the vacuum chamber 140 or the like.

[0071] Examples of means for hermetically connecting the means for maintaining the electrical connection with the means for maintaining the vacuum include the first wall 106, a weld 142 or the like.

[0072] Examples of means for limiting the transmission of thermal and mechanical stresses from the means of maintaining the vacuum to the means of supporting the electrical connection include the first wall 106 or the like, having an aspect ratio greater than 3:1, as described above. Below this aspect ratio, the transmission of thermal or mechanical stresses may not be sufficient to maintain the vacuum.

[0073] In some embodiments, the device further comprises means for reinforcing a connection between the means for maintaining the electrical connection and the means for hermetically connecting the means for maintaining the electrical connection with the means for maintaining the vacuum.

[0074] Examples of means for strengthening a connection between the means for maintaining the electrical connection and the means for hermetically connecting the means for maintaining the electrical connection with the means for maintaining the vacuum include the projection 120.

[0075] Although the structures, devices, methods, and systems have been described according to specific embodiments, a person skilled in the art will readily recognize that many variations of these embodiments are possible, and therefore all variations should be considered to be within the meaning and scope of the invention disclosed herein. Accordingly, many modifications can be made by a person skilled in the art without departing from the spirit and scope of the appended claims.

[0076] The claims following this written disclosure are hereby expressly incorporated into the present written disclosure, each claim constituting a separate embodiment. This disclosure includes all permutations of the independent claims with their dependent claims. Furthermore, additional embodiments that can be derived from the following independent and dependent claims are also expressly incorporated into the present written description. These additional embodiments are identified by replacing the dependency of a particular dependent claim with the phrase "each of the claims beginning with claim [x] and ending with the claim immediately preceding it," where the expression in parentheses "[x]" is replaced by the number of the last-mentioned independent claim.For example, for the first set of claims, which begins with independent claim 1, claim 4 may depend on either claim 1 or claim 3, with these separate dependencies leading to two different embodiments; claim 5 may depend on any one of claims 1, 3 or 4, with these separate dependencies leading to three different embodiments; claim 6 may depend on any one of claims 1, 3, 4 or 5, with these separate dependencies leading to four different embodiments; and so on.

[0077] The mention of the term "first" with respect to a feature or element in the claims does not necessarily imply the existence of a second or additional such feature or element. Elements expressly specified in the middle-plus-function format are to be interpreted as encompassing the corresponding structures, materials, or actions described herein, as well as their equivalents pursuant to 35 USC § 112(f). Embodiments of the invention for which exclusive ownership or privilege is claimed are defined as follows. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] US 18 / 149,107

[0001]

Claims

[1] Device, comprising: a partition wall; a penetration that passes through the partition wall and is hermetically sealed with the partition wall, wherein the penetration has a main axis; a first wall extending from the partition wall in a first direction along the main axis; and a second wall extending from the partition in a second direction opposite to the first direction along the main axis, the second wall forming a connector interface with the feedthrough; where the ratio of the length of the first wall to the thickness of the first wall is greater than or equal to 3:

1. [2] Device according to claim 1, wherein the thickness of the second wall is greater than the thickness of the first wall. [3] Device according to claim 1, further comprising a projection arranged within the first wall and coupled to the first wall and the partition. [4] Device according to claim 3, wherein the thickness of the projection is at least twice the thickness of the first wall. [5] Device according to claim 1, further comprising a vacuum chamber having an opening; wherein the first wall is arranged in the opening. [6] Device according to claim 5, wherein the first wall is welded to the vacuum chamber at a distal end of the first wall. [7] Device according to claim 5, wherein: the first wall includes a first wedge structure; the opening includes a second wedge structure; and The first wedge structure and the second wedge structure are complementary to each other, so that the first wall can only be inserted into the opening in one orientation. [8] Device according to claim 7, wherein the second wall encloses a third wedge structure. [9] Device according to claim 1, wherein the thickness of the first wall is about 1 millimeter (mm) to about 3 mm. [10] Device according to claim 1, wherein the feedthrough is one of a plurality of feedthroughs which penetrate the partition and are hermetically sealed with the partition. [11] Device, comprising: a partition wall; a penetration that passes through the partition wall and is hermetically sealed with the partition wall, wherein the penetration has a main axis; a first wall extending from the partition wall in a first direction along the main axis; and a second wall extending from the partition wall in a second direction opposite to the first direction along the main axis; where: the ratio of the length of the first wall to the thickness of the first wall is greater than or equal to 3:1; and the first wall includes a first wedge structure. [12] Device according to claim 11, wherein the second wall forms a connector interface with the feedthrough. [13] Device according to claim 11, further comprising a projection arranged within the first wall and coupled to the first wall and the partition. [14] Device according to claim 11, wherein the thickness of the second wall is at least twice as large as the thickness of the first wall. [15] Device according to claim 11, further comprising a vacuum chamber having an opening; wherein the first wall is welded to the vacuum chamber at the opening. [16] Device according to claim 15, wherein: the opening includes a second wedge structure; and The first wedge structure and the second wedge structure are complementary to each other, so that the first wall can only be inserted into the opening in one orientation. [17] Device according to claim 16, wherein the second wall encloses a third wedge structure. [18] Device according to claim 11, wherein the thickness of the first wall is about 1 millimeter (mm) to about 3 mm. [19] Device, comprising: Means for maintaining an electrical connection; Means for hermetically passing the electrical connection through the means for maintaining the electrical connection; Means for maintaining a vacuum; and Means for hermetically connecting the means for maintaining the electrical connection with the means for maintaining the vacuum, including means for limiting the transmission of thermal and mechanical stresses from the means for maintaining the vacuum to the means for maintaining the electrical connection. [20] Device according to claim 19, further comprising means for strengthening a connection between the means for maintaining the electrical connection and the means for hermetically connecting the means for maintaining the electrical connection with the means for maintaining the vacuum.

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