Combined housing device for power semiconductor components and power electronics device

Abstract

A combined housing device for power semiconductor components, characterized in that the housing device comprises: a cover component (1), wherein the cover component (1) encloses and forms power semiconductor component positioning cavities (101) and measuring device positioning cavities (102), wherein the power semiconductor component positioning cavities (101) serve to receive and position power semiconductor components (4) and the measuring device positioning cavities (102) are arranged on the sides of the power semiconductor component positioning cavities (101), and the measuring device positioning cavities (102) serve to receive and position temperature measuring components (2);Temperature measuring components (2), wherein the temperature measuring components (2) are at least partially inserted into the measuring device positioning cavities (102), and the measuring tips of the temperature measuring components (2) are electrically connected to the power semiconductor components (4); and a fastening element (3), wherein the fastening element (3) serves to apply a fastening force to the temperature measuring components (2) in order to bring the measuring tips of the temperature measuring components (2) into contact with the power semiconductor components (4).

Claims

[1] A combined packaging device for power semiconductor devices, characterized by that the housing device comprises: a cover component (1), wherein the cover component (1) encloses and forms power semiconductor component positioning cavities (101) and measuring device positioning cavities (102), wherein the power semiconductor component positioning cavities (101) serve to receive and position power semiconductor components (4) and the measuring device positioning cavities (102) are arranged on the sides of the power semiconductor component positioning cavities (101), and the measuring device positioning cavities (102) serve to receive and position temperature measuring components (2); Temperature measuring components (2), wherein the temperature measuring components (2) are at least partially inserted into the measuring device positioning cavities (102) and the measuring tips of the temperature measuring components (2) are electrically connected to the power semiconductor components (4); and a fastening element (3), wherein the fastening element (3) serves to apply a fastening force to the temperature measuring components (2) in order to bring the measuring tips of the temperature measuring components (2) into contact with the power semiconductor components (4). [2] The combined housing device for power semiconductor components according to claim 1, characterized by that the cover component (1) comprises a first cover (11) and a second cover (12), wherein the second cover (12) is arranged on the side of the first cover (11) facing away from the power semiconductor components (4); wherein the power semiconductor component positioning cavities (101) and first measuring device positioning sections (111) are arranged on the side of the first cover (11) facing the power semiconductor components (4), and the first cover (11) has a first through-opening (112) in the thickness direction; and the second cover (12) has second measuring device positioning sections (121), wherein the first measuring device positioning sections (111) and the second measuring device positioning sections (121) form the measuring device positioning cavities (102), and the second cover (12) has a second through-opening (122) distributed coaxially with the first through-opening (112). [3] The combined housing device for power semiconductor components according to claim 2, characterized bythat first clamp sections (113) are arranged on both sides of the first cover (11) in a first direction, second clamp sections (123) are arranged on both sides of the second cover (12) in the first direction, the second clamp sections (123) have clamp openings (124), and the first clamp sections (113) have clamp heads (114), wherein the clamp heads (114) snap into the clamp openings (124). [4] The combined housing device for power semiconductor components according to claim 2 or 3, characterized by that the orthogonal projection of the first cover (11) onto the power semiconductor components (4) lies at least partially within the orthogonal projection of the second cover (12) onto the power semiconductor components (4). [5] The combined housing device for power semiconductor components according to claim 2 or 3, characterized bythat pressure elements (116) are arranged on both sides of the first cover (11) in a second direction, and the pressure elements (116) have at least one pressure head (117), wherein the pressure heads (117) serve to press the power semiconductor components (4) in the second direction in order to position the power semiconductor components (4). [6] The combined housing device for power semiconductor components according to claim 2, characterized by in that the cover component (1) further comprises a pressure plate (13), on the side of the first cover (11) facing away from the power semiconductor components (4) a pressure plate positioning cavity (115) is arranged, the pressure plate (13) is at least partially inserted into the pressure plate positioning cavity (115), and the pressure plate (13) has a third through-opening (131) which is connected coaxially to the first through-opening (112) and the second through-opening (122). [7] The combined housing device for power semiconductor components according to claim 5, characterized by that the pressure elements (116) are four and are distributed at the corners of the second cover (12). [8] The combined housing device for power semiconductor components according to claim 7, characterized by that a positioning element (127) is arranged on the side of the second cover (12) facing away from the power semiconductor components (4), a locking cavity for placing the fastening element (3) is arranged within the positioning element (127), and a locking pawl (128) is arranged on the outer surface of the positioning element (127). [9] The combined housing device for power semiconductor components according to claim 2, characterized byin that the temperature measuring components (2) comprise temperature sensors (21) and signal lines (22) which are electrically connected to the temperature sensors (21), wherein the signal lines (22) are guided through the temperature sensors (21) in the thickness direction and are connected to a printed circuit board (5). [10] A power electronics device, characterized by that the power electronics device comprises the combined housing device for power semiconductor components according to one of claims 1 to 9.

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