computer case

Abstract

Computer housing, characterized in that it comprises: a housing body comprising a first side wall and a second side wall; wherein the first side wall and the second side wall are arranged opposite each other, the first side wall comprising a first heat dissipation position and the second side wall comprising a second heat dissipation position, the ratio of the heat dissipation areas of the ventilation and heat dissipation devices arranged at the first heat dissipation position and the second heat dissipation position is not less than 2:3, or the ratio of the projected areas of the ventilation and heat dissipation devices arranged at the second heat dissipation position and the first heat dissipation position is not less than 2:3; where, if the guiding airflow directions of the ventilation and heat dissipation devices arranged at the first heat dissipation position and the second heat dissipation position are set consistently, an efficient through airflow channel can be formed within the housing body.

Description

[0001] This application claims priority to the Chinese patent application filed by Beijing Jiuzhou Fengshen Technology Co., Ltd. with the Chinese Patent Office on May 13, 2022, under application number 202210520583.5 and invention name "COMPUTER CASE." The entire contents of this application are incorporated herein by reference. Technical area

[0002] The present invention relates to the field of housings for electronic devices and, in particular, to a computer housing. State of the art

[0003] The desktop computer case is primarily responsible for the stable and secure installation of the computer motherboard, switching power supply, mechanical hard drive, and specific peripherals, including core components such as the CPU, memory, graphics card, and solid-state drive. At the same time, it features easy-to-use power buttons, reboot buttons, USB ports, and other control ports on the exterior, so its main function is to house and protect the system.

[0004] With the development of electronic information technology, the computing power of desktop computers is becoming increasingly powerful, accompanied by a continuous increase in the heat generated by the CPU, GPU, and other system modules. Therefore, the cooling performance requirements of desktop computer systems are becoming increasingly stringent. Therefore, the desktop computer case also assumes the function of supporting the heat exchange device, including the system ventilation fan and water cooling system. The system's heat dissipation requirements also place greater demands on the ventilation and heat exchange capabilities of the computer case and the load-bearing capacity of the water cooling system.

[0005] As in Fig. As shown in Figure 1, in the existing technology, taking the currently common chassis with ATX motherboard specifications as an example, the locations and specifications of the main ventilation and heat dissipation devices are as follows: There is a ventilation installation position on the front, and the area is large. Typically, three 120*120mm fans or a water-cooled radiator can be installed with the above three fans. There is a ventilation installation position on the upper part, where, with the above three ventilation fans, up to three 120*120mm fans or water-cooled radiators can be installed, or a maximum of two 140*140mm fans or a water-cooled radiator with the above two ventilation fans can be installed. The rear chassis panel is mainly equipped with motherboard IO ports, power supply heat dissipation ports, expansion card interfaces including graphics cards, etc.Although there is a fan mounting position on the top, there is also a ventilation mounting position where a ventilation fan with a maximum size of 140*140 mm or a water-cooled radiator with one of the ventilation fans mentioned above can be installed.

[0006] The ventilation and heat exchange devices at each of the above-mentioned ventilation positions can provide ventilation and heat exchange via fans. Depending on requirements and design, cooler air can be drawn into the enclosure from the outside and hotter air can be expelled from the inside to the outside.

[0007] However, the ventilation and heat dissipation positions are limited, and the provided and shaped air ducts cannot form efficient cooling air channels to dissipate the heat flow from the computer case to the outside in a timely manner due to the poor coordination of size and specifications.

[0008] The information disclosed in this Background section is intended only to enhance the understanding of the general background of the invention and should not be construed as an admission or in any way implied that the information constitutes prior art already known to one of ordinary skill in the art. Contents of this utility model

[0009] The objective of the present invention is to provide a computer case that can approximately increase the heat dissipation area by changing the structural arrangement of the case, adding multiple heat dissipation positions, and installing ventilation and heat dissipation devices without changing the overall volume of the case. Furthermore, by adding better-matched ventilation and heat dissipation positions, a more efficient through-flow air duct can be formed in the case.

[0010] To achieve the above-mentioned objects, the invention provides a computer case comprising a case body having a first side wall and a second side wall; wherein the first side wall and the second side wall are arranged opposite each other, the first side wall includes a first heat dissipation position and the second side wall includes a second heat dissipation position, the ratio of the heat dissipation areas of the ventilation and heat dissipation devices arranged at the first heat dissipation position and the second heat dissipation position is not less than 2:3, or the ratio of the projected areas of the ventilation and heat dissipation devices arranged at the second heat dissipation position and the first heat dissipation position is not less than 2:3;wherein when the guide air flow directions of the ventilation and heat dissipation devices arranged at the first heat dissipation position and the second heat dissipation position are set consistently, an efficient through-air guide channel can be formed within the housing body;

[0011] In a preferred embodiment, the first side wall and the second side wall comprise a full opening or a plurality of independent ventilation holes, and the edges of the full opening or the independent ventilation holes have mounting liner plates, wherein the mounting liner plate has mounting holes for forming the first heat dissipation position and the second heat dissipation position.

[0012] In a preferred embodiment, the housing body further comprises: an upper wall, a bottom plate, a lower cabin cover, and a main mounting plate; wherein the upper wall is provided on the upper side of the housing body; wherein the bottom plate is provided on the lower side of the housing body, and the bottom plate is detachably provided on a bottom frame; wherein the lower cabin cover is provided between the upper wall and the bottom plate; wherein the main mounting plate is arranged between the lower cabin cover and the upper wall and between the rear edges of the first side wall and the second side wall on the same side.

[0013] In a preferred embodiment, the top wall comprises a full opening or a plurality of independent ventilation holes, and the edge of the full opening or the plurality of independent ventilation holes comprises a mounting liner plate, wherein the mounting liner plate has mounting holes for forming a third heat dissipation position, the third heat dissipation position can be used for installing a ventilation and heat dissipation device.

[0014] In a preferred embodiment, the lower cabin cover comprises: a horizontal partition plate, a vertical plate; wherein the horizontal partition plate is arranged between the upper wall and the bottom plate parallel to the bottom plate, wherein both ends of the horizontal partition wall are in contact with the first side wall and the second side wall, respectively, wherein the horizontal partition wall comprises a rectangular escape opening provided at the contact point between the two ends of the horizontal partition wall and the first side wall and the second side wall, wherein the rectangular escape opening is designed to bypass the ventilation and heat dissipation devices arranged at the first heat dissipation position and the second heat dissipation position; wherein the vertical plate is arranged perpendicular to the horizontal partition wall between the edges of the horizontal partition wall and the bottom plate on the same side;wherein the edge of the horizontal partition facing away from the vertical plate is firmly connected to the lower edge of the main mounting plate;

[0015] In a preferred embodiment, an I / O hole, ventilation and heat dissipation holes, and a plurality of installation mounting positions for PCIE expansion cards and a plurality of removable baffles; wherein the I / O hole is provided on the side of the horizontal partition facing the main mounting plate and is provided corresponding to the I / O part of the computer motherboard; wherein the ventilation and heat dissipation holes are provided on the side of the horizontal partition facing the vertical plate, the edge of the ventilation and heat dissipation holes has a plurality of mounting holes to form a fourth heat dissipation position, and the fourth heat dissipation position can be used to install the ventilation and heat dissipation device;wherein the plurality of PCIE expansion card installation mounting positions and the plurality of removable baffles are arranged at an end of the horizontal partition wall remote from the I / O hole and the ventilation and heat dissipation hole;

[0016] In a preferred embodiment, the base plate comprises an installation position for a power supply fan and a fifth heat dissipation position, wherein the installation position for a power supply fan is provided at an end of the base plate facing the second side wall, and the installation position for the power supply fan is provided with a ventilation hole; wherein the fifth heat dissipation position is provided at an end of the base plate facing the first side wall and is located at the ventilation hole at the vertical projection position of the fourth heat dissipation position, wherein a plurality of mounting holes are provided around the ventilation hole to form the fifth heat dissipation position, and the fifth heat dissipation position can be used for installing the ventilation and heat dissipation device.

[0017] In a preferred embodiment, the housing body further comprises: a front side wall, a rear side wall, a front panel, a rear panel, a first side panel, a second side panel, and a top panel, wherein the front side wall is provided on the side of the housing body facing away from the main mounting panel; wherein the rear side wall is provided on the side of the housing body facing the main mounting panel; wherein the front panel, the rear panel, the first side panel, the second side panel, and the top panel are provided on the front side wall, the rear side wall, the first side wall, the second side wall, and the top wall of the housing body, respectively.

[0018] In a preferred embodiment, the back plate comprises a power supply ventilation escape hole and an I / O adapter plate escape hole, wherein the power supply ventilation escape hole is provided at the lower part of the back plate corresponding to the power supply ventilation and heat dissipation panel of the power supply, wherein the power supply ventilation and heat dissipation panel includes a power cord jack and a switch button; and wherein the I / O adapter plate escape hole is provided at the lower part of the back plate and is located on one side of the power supply ventilation escape hole, and the I / O adapter plate escape hole is formed to expose the I / O adapter board provided on the case body.

[0019] In a preferred embodiment, the lower part of the main mounting plate is arranged vertically relative to the horizontal partition wall and forms a first facade, the lower edge of the first facade being connected and fixed to the horizontal partition wall; the fourth heat dissipation position is provided on one side of the first facade of the main mounting plate, and the I / O hole is provided on the other side of the first facade, the plurality of installation fixing positions for PCIE expansion cards are respectively arranged in parallel on both sides of the first facade; the upper part of the main mounting plate is inclined to the front side wall to form an inclined plate, the angle between the inclined plate and the first facade is not less than 90 degrees, and the inclined plate is provided with a wire hole;wherein the upper edge of the inclined plate is bent upward to form a second facade, and the second facade is parallel to the first facade, the main mounting plate is connected and fixed to the frame of the housing body by the second facade;

[0020] Compared with existing technology, the computer case of the present invention has the following advantageous effects: First, the existing computer case retains the weak horizontal air ducts, with large ones at the front and small ones at the back, and replaces them with vertical ones. Furthermore, after converting to a vertical arrangement, a ventilated sub-cabin is provided between the horizontal partition wall and the floor panel. Furthermore, the fan water-cooled radiator assembly with a specification of 120*120 mm (or 140*140 mm) is installed in the sub-cabin on the underside of the horizontal partition wall, which cannot be installed together with the adjacent water cooling system with a specification of 360*120 mm in the existing technology.This allows the water cooling device to be installed at the ventilation position and the adjacent 360° water cooling radiator to be installed at a 90-degree angle, operating simultaneously under conditions roughly equivalent to the size of the case itself. The end result is that more water-cooled heat dissipation devices can be installed and used simultaneously, thereby increasing the system's heat dissipation capacity. In addition, since the removable bottom panel of the case is also designed with a corresponding heat dissipation installation position according to the fan or water cooling radiator installation position of the above-mentioned horizontal partition, another corresponding ventilation fan can be installed.The fans installed on the top and bottom of the sub-cabin work together to increase the airflow rate entering or exiting the bottom of the chassis, thereby improving ventilation and heat dissipation. At the same time, the computer chassis of the present invention also provides a complete side-opening ventilation surface compared to conventional technology. Up to three 120*120mm fans (or two 140*140mm fans) or a water-cooled radiator assembly with fans of the above specifications can be installed on the side-opening ventilation surface. Therefore, a horizontal, reinforced through-air duct can be formed, with the ventilation and heat dissipation device installed in the opening position opposite the other side panel of the computer chassis.Since the opening ratios of the left and right side panels of the chassis are largely matched in the horizontal direction, the specifications and quantity of installable ventilation and heat dissipation devices are largely matched, ensuring higher ventilation efficiency. Furthermore, as the demand for water-cooled heat dissipation becomes increasingly high, the computer chassis of the present invention can add a set of water-cooled heat dissipation devices with a maximum specification of 120 x 360 compared to the prior art chassis. This greatly expands the system's cooling capabilities. At the same time, the computer chassis of the present invention changes the front and rear panel arrangement of the conventional chassis.When placed on the desk, the cabinet's longitudinal direction can be aligned with the length of the computer desk, and it can be placed on the left or right side of the user according to the user's habits or needs. This greatly saves users' desktop space and improves the visual effects and user experience. Brief description of the characters Fig. 1 is a schematic diagram illustrating the arrangement of the front, rear, and top heat dissipation positions of a computer case according to an embodiment of the prior art; Fig. 2 is a schematic structural diagram of the top of a computer case according to an embodiment of the prior art; Fig. 3 is a schematic structural diagram of the rear part of a computer case according to an embodiment of the prior art; Fig. 4 is a schematic structural diagram of the front panel of a computer case according to an embodiment of the prior art; Fig. 5 is a schematic exploded perspective view of a computer case according to an embodiment of the present invention; Fig. 6 is a schematic exploded view of a computer case from another perspective according to an embodiment of the present invention; Fig. 7 is a schematic three-dimensional structural diagram of the case body from a perspective according to an embodiment of the present invention; Fig. 8 is a schematic three-dimensional structural diagram of the case body from another perspective according to an embodiment of the present invention; Fig. 9 is a schematic rear view of the structure of the case body according to an embodiment of the present invention; Fig. 10 is a schematic front view of the structure of the case body according to an embodiment of the present invention; Fig. Figure 11 is a partially enlarged structural representation of position I in Fig. 7; Fig. Figure 12 is a partially enlarged schematic structural representation of the II-position in Fig. 8; Fig. 13 is a schematic diagram of the front airflow guide of a computer case according to an embodiment of the present invention; Fig. 14 is a schematic diagram of the airflow path on the rear of the computer case according to an embodiment of the present invention; Fig. 15 is another schematic diagram of the airflow path on the rear of the computer case according to an embodiment of the present invention; Fig. 16 is a schematic diagram (1) of the arrangement of horizontal partition walls according to an embodiment of the present invention; Fig. 17 is a schematic diagram (2) of the arrangement of horizontal partition walls according to an embodiment of the present invention; Fig. 18 is a schematic structural diagram of the rear side of a computer case according to an embodiment of the present invention; Fig. 19 is a schematic diagram showing the layout structure of a removable floor panel according to an embodiment of the present invention; Fig. 20 is a schematic rear view of the main mounting plate according to another embodiment of the present invention; Fig. 21 is a schematic three-dimensional structural front view of another embodiment of the main mounting plate according to an embodiment of the present invention; Fig. 22 is a right side schematic structural diagram of another embodiment of the main mounting plate according to an embodiment of the present invention. List of reference symbols

[0021] 10-Computer chassis, 101-Chassis body, 1011-First heat dissipation position, 1012-Second heat dissipation position, 1013-Third heat dissipation position, 1014-Main mounting plate, 1015-Bottom cabin cover, 1015-Fourth heat dissipation position, 10152-I / O hole, 10153-PCIE expansion card installation fixing position, 10154-Horizontal partition plate, 10155-Vertical vertical plate, 1016-Power supply component, 1016-Power supply ventilation and heat dissipation panel, 1017-I / O adapter board, 1018-First facade, 1019-Slanted plate, 1020-Second facade, 102- Front panel, 103-Rear panel, 1031-Power supply ventilation escape vent, 1032-I / O adapter plate escape vent, 1033-Graphics card ventilation vent, 104-First side panel, 105-Second side panel, 1061-Bottom panel, 10611-Fifth heat dissipation position, 10612-Power supply fan installation position, 1062-Bottom frame, 107-Top panel 20-Ventilation and heat dissipation device Detailed embodiments

[0022] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but it should be understood that the scope of the present invention is not limited by the specific embodiments.

[0023] Unless expressly stated otherwise, the term "comprises" or its variations such as "comprises" or "consists of", etc., throughout the specification and claims shall be construed to include stated elements or components and not to exclude other elements or other components.

[0024] As we all know, fans in different relative positions in a cooling system can drive the air in the same direction, they can form an improved ventilation duct in a certain direction within the chassis. The hotter air inside the chassis is more efficiently exhausted due to the action of the air duct formed by the fan, and the lower temperature outside air also enters the chassis system more efficiently, ultimately resulting in better air circulation. Under the same internal resistance (the resistance formed by the devices inside the chassis, which affects airflow), the heat transfer efficiency of the ventilation duct depends on the air volume and air pressure of the fan, and also depends on the degree of adjustment of the air inlet and outlet at both ends of the air duct.

[0025] As in the Fig. 2 to 4 and with reference to Fig. As shown in Figure 1, the prior art ATX case uses three 120 x 120 mm fans at the front and one 120 x 120 mm (or 140 x 140 mm) fan at the rear, arranged on the two corresponding sides of the rectangular parallelepiped case. Under the action of co-rotating fans, a reinforced air duct can be formed. This is also the only air duct in the prior art ATX case that can form both air intake and air supply. At the same time, the adaptability of the air duct is very low. The three fans at the front only have one fan position, which corresponds to the rear. Thus, only a weak air duct can be formed, and the exhaust efficiency of the air duct is low, which greatly affects the heat exchange efficiency of the system.

[0026] Regarding the specifications that can be installed with water-cooling radiators, the specifications that can be installed with water-cooling radiators in the existing ATX case are two 360*120mm specifications (or two 140*280mm specifications) and one 120mm specification (or a maximum of 140mm). However, due to the size of the existing conventional ATX case, the 120*120mm or 140*140mm water-cooling radiator at the rear (including the space required for the water chamber and water inlet and outlet pipes) cannot be combined with the 360*120mm or 280mm water-cooling radiator on the top. That is, it can form a heat dissipation combination of a 360*120mm water cooling radiator in the front, a 360*120mm water cooling radiator on the top, and a 120*120mm or 140*140mm fan in the rear at most.From the perspective of the evolution of computer system cooling needs, in addition to current CPU and GPU cards, motherboard power supply components, solid-state drives, and even power supply heating components also require water cooling. The specifications for installing water cooling coolers that can be provided by existing technology are difficult to meet the cooling needs of future computers.

[0027] As in the Fig. 5, Fig. 6, Fig. 12, Fig. 13, Fig. 14 and Fig. As shown in Figure 15, a computer case 10 according to a preferred embodiment of the present invention includes a case body 101 having a first side wall (commonly referred to as a front side wall in the art) and a second side wall (commonly referred to as a rear side wall in the art), the first side wall and the second side wall being arranged opposite each other, the first side wall including a first heat dissipation position 1011, and the second side wall including a second heat dissipation position 1012. The ventilation and heat dissipation device 20 that can be installed at the first heat dissipation position 1011 and the second heat dissipation position 1012.When the guide air flow directions of the ventilation and heat dissipation devices 20 arranged at the first heat dissipation position and the second heat dissipation position are set consistently, an efficient through-air guide channel can be formed within the case body 101.

[0028] As in the Fig. 7 and Fig. 10, in some embodiments, the first sidewall and the second sidewall include a full opening or a plurality of independent ventilation holes, wherein the edges of the full opening or the independent ventilation holes include mounting liner plates, and the mounting liner plate includes mounting holes for forming the first heat dissipation position 1011 and the second heat dissipation position 1012. The first heat dissipation position 1011 and the second heat dissipation position 1012 may be used to install the ventilation and heat dissipation device 20. The ventilation and heat dissipation device 20 may generally include a water-cooled heat dissipation component, a fan component, and the like.

[0029] In some embodiments, after the holes in the first sidewall and the second sidewall are fully opened, the first heat dissipation position 1011 and the second heat dissipation position 1012, which correspond to almost 100% of the area of ​​the first sidewall and the second sidewall, may be formed on the first and second sidewalls. A ventilation and heat dissipation device 20, which occupies 100% of the heat dissipation area, may be installed at the first heat dissipation position 1011 and the second heat dissipation position 1012. The projected heat dissipation area of ​​the ventilation and heat dissipation device 20 may not occupy 100% of the heat dissipation area of ​​the first heat dissipation position 1011 and the second heat dissipation position 1012, for example, but not limited to, 1 / 2 area or 2 / 3 area.However, when an effective horizontal through-air duct is to be formed within the case body 101, the projected heat dissipation area of ​​the ventilation and heat dissipation devices 20 arranged at the first heat dissipation position 1011 and the second heat dissipation position 1012 is not less than half of the total heat dissipation area of ​​the first heat dissipation position 1011 and the second heat dissipation position 1012. Moreover, the ratio of the projected heat dissipation area of ​​the ventilation and heat dissipation device 20 installed at the first heat dissipation position 1011 to the projected heat dissipation area of ​​the ventilation and heat dissipation device 20 installed at the second heat dissipation position 1012 is preferably not less than 2:3.

[0030] With reference to the Fig. 7 and Fig. 10, in some embodiments, the housing body 101 also includes a top wall, a bottom plate 1061, a lower cabin cover 1015, and a main mounting plate 1014. The top wall is provided on the top side of the housing body 101. The bottom plate 1061 is provided on the bottom side of the housing body 101. The lower cabin cover 1015 is provided between the top wall and the bottom 1061. The main mounting plate 1014 is arranged between the lower cabin cover 1015 and the top wall and between the rear edges of the first side wall and the second side wall on the same side.

[0031] With reference to the Fig. 7 and Fig. 10, in some embodiments, the top wall may also have a full opening or multiple independent ventilation holes, and the edge of the full opening or the multiple independent ventilation holes may have a mounting liner plate. The mounting liner plate has mounting holes to form a third heat dissipation position 1013. The third heat dissipation position 1013 may be used to install a ventilation and heat dissipation device 20. The third heat dissipation position 1013 of this embodiment illustrates the ventilation and heat dissipation device 20, but the third heat dissipation position 1013 may decide whether to install the ventilation and heat dissipation device 20 according to actual requirements, and the present invention is not limited thereto.

[0032] As in the Fig. 11 and Fig. 12 and at the same time having regard to the Fig. 7 and Fig. 10, in some embodiments, the lower cabin cover 1015 includes a horizontal partition 10154 and a vertical plate 10155. The horizontal partition 10154 is disposed between the upper wall and the lower plate 1061 parallel to the lower plate 1061, with both ends of the horizontal partition 10154 in contact with the first side wall and the second side wall, respectively.The horizontal partition wall 10154 includes a rectangular escape opening provided at the contact point between the two ends of the horizontal partition wall 10154 and the first side wall and the second side wall, the rectangular escape opening being designed to bypass the ventilation and heat dissipation devices 20 arranged at the first heat dissipation position 1011 and the second heat dissipation position 1012. The vertical plate 10155 is arranged perpendicular to the horizontal partition wall 10154 between the edges of the horizontal partition wall 10154 and the bottom plate 1061 on the same side, and the edge of the horizontal partition wall 10154 facing away from the vertical plate 10155 is fixedly connected to the lower edge of the main mounting plate 1014. The space between the horizontal partition wall 10154 and the bottom plate 1061 forms the lower cabin.

[0033] As in the Fig. 16 and Fig. 17, in some embodiments, the horizontal partition 10154 includes I / O hole 10152, ventilation and heat dissipation holes, a plurality of installation mounting positions for PCIE expansion cards 10153, and a plurality of removable baffles. The I / O hole 10152 is provided on the side of the horizontal partition 10154 facing the main mounting plate 1014 and is provided corresponding to the I / O part of the computer motherboard. The ventilation and heat dissipation holes are provided on the side of the horizontal partition 10154 facing the vertical plate 10155. The edge of the ventilation and heat dissipation holes has a plurality of mounting holes to form a fourth heat dissipation position 10151, and the fourth heat dissipation position 10151 can be used to install the ventilation and heat dissipation device 20.wherein the plurality of PCIE expansion card installation fixing positions 10153 and the plurality of removable baffles are arranged at an end of the horizontal partition wall 10154 remote from the I / O hole 10152 and the ventilation and heat dissipation hole, wherein the plurality of PCIE expansion card installation fixing positions 10153, the fourth heat dissipation position 10151, and the I / O hole 10152 are all arranged on the same side of the main mounting plate 1014 facing the vertical plate 10155;

[0034] As in Fig. As shown in Figure 17, the fourth heat dissipation position 10151 is located on the same side of the main mounting plate 1014 as the vertical plate 10155, and the I / O hole 10152 is located on the other side of the main mounting plate 1014, which faces the vertical plate 10155. PCIE expansion card installation fixing positions are arranged in parallel on both sides of the vertical plate 10155, respectively. Therefore, the PCIE expansion card installation fixing positions 10153 can be distributed and arranged in parallel on both sides of the main mounting plate 1014, with one side being close to the front plate 102 and the other side being close to the rear plate 103.The two separate vertical spaces formed by the front panel 102 and the rear panel 103 and the main mounting plate 1014 can be used to install graphics cards at corresponding fixed positions on both sides, thus creating a dual graphics card installation to meet higher graphics processing requirements.

[0035] With reference to the Fig. 16 and Fig. 17, the arrangement of the horizontal partition walls 10154 in the vertical direction can generally take many forms in some embodiments. This embodiment shows only the two forms of Fig. 16 to Fig. 17, but the invention is not limited thereto. In some embodiments, the PCIE expansion card installation mounting position 10153 and the I / O hole 10152 are arranged parallel to the longitudinal direction.

[0036] As in Fig. 19, in some embodiments, the bottom frame 1062 of the case body 101 is integrally fixed to the case body 101, and the bottom plate 1061 is detachably mounted to the bottom frame 1062. The bottom plate 1061 includes a power supply fan installation position 10612 and a fifth heat dissipation position 10611. The power supply fan installation position 10612 is provided at one end of the bottom plate 1061 near the second side wall, and a ventilation hole is provided at the power supply fan installation position 10612. The fifth heat dissipation position 10611 is provided at the ventilation hole at one end of the bottom plate 1061 near the first side wall and at the vertical projection position of the fourth heat dissipation position 10151. There are several mounting holes around the ventilation hole to form fifth heat dissipation positions 10611.The fifth heat dissipation position 10611 can be used to install the ventilation and heat dissipation device 20. The four bases firmly connected to the base frame 1062 and the base plate 1061 allow the housing body 101 to be lifted away from the desktop as a whole, thus forming a ventilation channel under the base plate 1061 of the housing body 101.

[0037] With reference to the Fig. 5 to 10, in some embodiments, the housing body 101 further comprises a front side wall, a rear side wall, a front plate 102, a rear plate 103, a first side plate 104, a second side plate 105, and a top plate 107, wherein the front side wall is provided on the side of the housing body 101 facing away from the main mounting plate 1014; wherein the rear side wall is provided on the side of the housing body 101 facing the main mounting plate 1014; The front plate 102, the rear plate 103, the first side wall 104, the second side wall 105, and the top plate 107 are provided on the front side wall, the rear side wall, the first side wall, the second side wall, and the top wall of the housing body 101, respectively. Ventilation and heat dissipation holes are generally provided on the front panel 102, the rear panel 103, the first side panel 104, the second side panel 105, and the top panel 107.

[0038] As in Fig. As shown in Figure 18, in some embodiments, the backplate 103 includes a power supply ventilation escape vent 1031 and an I / O adapter plate escape vent 1032. The power supply ventilation escape vent 1031 is provided at the lower part of the backplate 103 corresponding to the power supply ventilation and heat dissipation panel of the power supply, and the power supply ventilation and heat dissipation panel includes a power cord jack and a switch button. The I / O adapter plate escape vent 1032 is provided at the lower part of the backplate 103 and is located on one side of the power supply ventilation escape vent 1031, and the I / O adapter plate escape vent 1032 is configured to expose the I / O adapter board provided on the chassis body 101.In some embodiments, the back plate 103 is provided with a vertically extending graphics card ventilation hole corresponding to the PCIE expansion card installation mounting position 10153 to cooperate with the heat dissipation of the graphics card installed vertically at that position.

[0039] As in the Fig.20 to 22, a case body 101' of another embodiment is shown. In some embodiments, the main mounting plate 1014' is not an integral planar structure. The lower part of the main mounting plate 1014' is vertically arranged with the horizontal partition wall 10154 and forms the first facade 1018. The lower end edge of the first facade 1018 is connected and fixed to the horizontal partition wall 10154. The fourth heat dissipation position 10151 and a plurality of installation fixing positions for PCIE expansion cards 10153 are provided on the same side of the first facade of the main mounting plate 1014, and the I / O holes 10152 are provided on the other side of the first facade 1018. Furthermore, the upper part of the main mounting plate 1014 extends obliquely to the front side wall to form an inclined plate 1019. The angle between the inclined plate 1019 and the first facade 1018 is not less than 90 degrees.The inclined plate 1019 is provided with wire holes. The upper edge of the inclined plate 1019 is bent upward to form a second facade 1020, and the second facade 1020 runs parallel to the first facade 1018. The main mounting plate 1014 is connected and fixed to the frame of the housing body 101' via the second facade 1020.

[0040] In summary, the computer case of the present invention has the following advantages: First, the existing computer case retains the low-efficiency horizontal air ducts, with large ones at the front and small ones at the rear, and replaces them with vertical ones. Furthermore, after converting to a vertical arrangement, a ventilated sub-cabin is provided between the horizontal partition wall and the floor panel. Furthermore, the water-cooled radiator assembly of the fan with a specification of 120*120 mm (or 140*140 mm) is installed in the sub-cabin on the underside of the horizontal partition wall, which cannot be installed together with the adjacent water cooling system with a specification of 360*120 mm in the existing technology.This allows the water cooling unit at the ventilation position and the adjacent 360° water cooling radiator to be installed at a 90-degree angle while operating under conditions roughly equivalent to the size of the case itself. The end result is that more water-cooled heat dissipation devices can be installed and used simultaneously, increasing the system's heat dissipation capacity.

[0041] In addition, since the removable bottom panel of the chassis is also designed with a corresponding heat dissipation installation position according to the fan or water cooling radiator installation position of the above-mentioned horizontal partition, an additional ventilation fan can be installed. The fans installed on the top and bottom of the sub-cabin work together to increase the airflow rate entering or exiting the bottom of the chassis, thereby improving ventilation and heat dissipation.

[0042] At the same time, compared to conventional technology, the computer case of the present invention also provides a complete side-opening ventilation area. Up to three 120 x 120 mm fans (or two 140 x 140 mm fans) or a water-cooled radiator assembly with fans meeting the above specifications can be installed on the side-opening ventilation area. Therefore, a horizontal, reinforced through-air duct can be formed, with the ventilation and heat dissipation device installed in the opening position opposite the other side panel of the computer case.

[0043] Since the horizontal opening ratios of the left and right side panels of the chassis are largely matched, the specifications and quantity of installable ventilation and heat dissipation devices are largely matched, ensuring higher ventilation efficiency. Furthermore, as the demand for water-cooled heat dissipation becomes increasingly high, the computer chassis of the present invention can add a set of water-cooled heat dissipation devices with a maximum specification of 120*360 compared to the prior art chassis. This greatly expands the system's cooling capabilities. At the same time, the computer chassis of the present invention changes the front and rear panel arrangement of the conventional chassis.When placed on the desk, the cabinet's longitudinal direction can be aligned with the length of the computer desk, and it can be placed on the left or right side of the user according to the user's habits or needs. This greatly saves users' desktop space and improves the visual effects and user experience.

[0044] The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and demonstration. These descriptions are not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teachings. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and their practical application, to thereby enable others skilled in the art to make and use various exemplary embodiments of the invention and to select and modify various applications. The scope of the invention is to be defined by the claims and their equivalents. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] CN 202210520583.5

[0001]

Claims

[1] Computer case, characterized by that comprehensively: a housing body having a first side wall and a second side wall; wherein the first side wall and the second side wall are arranged opposite each other, the first side wall includes a first heat dissipation position and the second side wall includes a second heat dissipation position, the ratio of the heat dissipation areas of the ventilation and heat dissipation devices arranged at the first heat dissipation position and the second heat dissipation position is not less than 2:3, or the ratio of the projected areas of the ventilation and heat dissipation devices arranged at the second heat dissipation position and the first heat dissipation position is not less than 2:3; wherein when the guide air flow directions of the ventilation and heat dissipation devices arranged at the first heat dissipation position and the second heat dissipation position are set consistently, an efficient through-air guide channel can be formed within the case body. [2] Computer housing according to claim 1, characterized by in that the first side wall and the second side wall comprise a full opening or a plurality of independent ventilation holes, and the edges of the full opening or the independent ventilation holes have mounting liner plates, and the mounting liner plate has mounting holes for forming the first heat dissipation position and the second heat dissipation position. [3] Computer housing according to claim 1, characterized by that the housing body also includes: - an upper wall provided on the top of the housing body; - a bottom plate provided on the bottom of the housing body, and the bottom plate is detachably provided on a bottom frame; - a lower cabin cover provided between the upper wall and the floor plate; - a main mounting plate arranged between the lower cabin cover and the upper wall and between the rear edges of the first side wall and the second side wall on the same side. [4] Computer housing according to claim 3, characterized by in that the upper wall has a full opening or a plurality of independent ventilation holes and the edge of the full opening or the plurality of independent ventilation holes has a mounting liner plate, wherein the mounting liner plate has mounting holes for forming a third heat dissipation position, the third heat dissipation position can be used for installing a ventilation and heat dissipation device. [5] Computer housing according to claim 3, characterized by that the lower cabin cover includes: - a horizontal partition plate arranged between the top wall and the bottom plate parallel to the bottom plate, both ends of the horizontal partition wall being in contact with the first side wall and the second side wall, respectively, the horizontal partition wall comprising a rectangular escape opening provided at the contact point between the two ends of the horizontal partition wall and the first side wall and the second side wall, the rectangular escape opening being designed to bypass the ventilation and heat dissipation devices arranged at the first heat dissipation position and the second heat dissipation position; and - a vertical plate arranged perpendicular to the horizontal partition between the edges of the horizontal partition and the floor plate on the same side; - the edge of the horizontal partition facing away from the vertical plate being firmly connected to the lower edge of the main mounting plate. [6] Computer housing according to claim 5, characterized by that the horizontal partition includes: - an I / O hole provided on the side of the horizontal partition facing the main mounting plate and corresponding to the I / O part of the computer motherboard; - ventilation and heat dissipation holes provided on the side of the horizontal partition facing the vertical plate, the edge of the ventilation and heat dissipation holes having a plurality of mounting holes to form a fourth heat dissipation position, and the fourth heat dissipation position can be used for installing the ventilation and heat dissipation device; and - multiple installation mounting positions for PCIE expansion cards and multiple removable baffles located at one end of the horizontal partition wall opposite the I / O hole and the ventilation and heat dissipation hole. [7] Computer housing according to claim 6, characterized by that the multiple PCIE expansion card installation fixing positions, the fourth heat dissipation position, and the I / O hole are all located on the same side of the main mounting plate facing the vertical plate. [8] Computer housing according to claim 3, characterized by that the base plate includes: - an installation position for a power supply fan provided at an end of the base plate facing the second side wall, and the installation position for the power supply fan is provided with a ventilation hole; - a fifth heat dissipation position provided at an end of the bottom plate facing the first side wall and located at the ventilation hole at the vertical projection position of the fourth heat dissipation position, wherein a plurality of mounting holes are provided around the ventilation hole to form the fifth heat dissipation position, and the fifth heat dissipation position can be used for installing the ventilation and heat dissipation device. [9] Computer housing according to claim 7, characterized by that the housing body also comprises: - a front side panel provided on the side of the housing body remote from the main mounting plate; - a rear side wall provided on the side of the housing body facing the main mounting plate; and - a front panel, a rear panel, a first side panel, a second side panel, and a top panel provided on the front side wall, the rear side wall, the first side wall, the second side wall, and the top wall of the case body, respectively. [10] Computer housing according to claim 9, characterized by that the back plate includes: - a power supply ventilation vent provided at the lower part of the rear panel corresponding to the power supply ventilation and heat dissipation panel of the power supply, the power supply ventilation and heat dissipation panel including a power cord socket and a switch button; and - an I / O adapter plate escape hole provided at the bottom of the rear panel and located on one side of the power supply ventilation escape hole, and the I / O adapter plate escape hole is designed to expose the I / O adapter board provided on the chassis body. [11] Computer housing according to claim 6, characterized by that the lower part of the main mounting plate is arranged vertically relative to the horizontal partition wall and forms a first facade, and the lower edge of the first facade is connected and fixed to the horizontal partition wall; - the fourth heat dissipation position is provided on one side of the first facade of the main mounting plate and the I / O hole is provided on the other side of the first facade, the plurality of installation fixing positions for PCIE expansion cards are respectively arranged in parallel on both sides of the first facade; - the upper part of the main mounting plate is inclined to the front side wall to form an inclined plate, the angle between the inclined plate and the first facade is not less than 90 degrees and the inclined plate is provided with a wire hole; - the upper edge of the inclined plate is bent upwards to form a second facade, and the second facade is parallel to the first facade, the main mounting plate is connected and fixed to the frame of the housing body by the second facade.

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